CN114231259A - Immersed single-phase liquid cooling agent, application thereof, liquid cooling method and immersed single-phase liquid cooling system - Google Patents
Immersed single-phase liquid cooling agent, application thereof, liquid cooling method and immersed single-phase liquid cooling system Download PDFInfo
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- CN114231259A CN114231259A CN202111565786.8A CN202111565786A CN114231259A CN 114231259 A CN114231259 A CN 114231259A CN 202111565786 A CN202111565786 A CN 202111565786A CN 114231259 A CN114231259 A CN 114231259A
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
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Abstract
The application discloses an immersed single-phase liquid cooling agent, application thereof, a liquid cooling method and an immersed single-phase liquid cooling system, and belongs to the technical field of liquid cooling. The main components of the liquid refrigerant contain one, two, three or four of tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer, and the liquid refrigerant has a good heat dissipation effect and good material compatibility and chemical stability.
Description
Technical Field
The application relates to the technical field of liquid cooling, in particular to an immersed single-phase liquid cooling agent, application thereof, a liquid cooling method and an immersed single-phase liquid cooling system.
Background
The immersion liquid cooling is to immerse the heating element in the cooling liquid directly, and take away the heat generated by the operation of the heating element by means of the flowing circulation of the liquid. Immersion liquid cooling is typically direct contact type liquid cooling. Because the heating element directly contacts with the cooling liquid, the radiating efficiency is higher, and the noise is lower. The immersion liquid cooling is divided into two-phase liquid cooling and single-phase liquid cooling, and the heat dissipation mode can adopt the forms of a dry cooler, a cooling tower and the like. Data center immersion cooling helps improve ITs heat dissipation design by directly immersing IT hardware in a liquid. Heat generated by the electronic components is efficiently transferred directly into the liquid, thereby reducing the need for actively cooled components such as thermally conductive interface materials, heat sinks, and fans. These improvements increase energy efficiency while allowing higher packing densities to be employed. Reducing the energy consumption of server cooling, helping to create a more environmentally friendly data center, reducing the number of moving parts that need to be repaired and replaced, because of the efficient heat transfer characteristics of the liquid, potentially increasing hardware design density, allowing higher processor utilization electronics to remain clean and dry by effectively maintaining the temperature below the heat limit, facilitating maintenance, and significantly reducing the noise of the server room helps to protect IT equipment from environmental contaminants (e.g., dust and sulfides).
Immersion liquid cooling has been in operation for a decade in the international market, and 3M products are dominated by two-phase coolants (primary fluoride-reducing liquid) among manufacturers in the field of immersion cooling in data centers. Although the fluorinated liquid has a good cooling effect, the fluorinated liquid has certain toxicity and needs to be boiled during working, so that the noise is high, the heat dissipation effect is unstable, and the volume is relatively large. In addition, the fluorinated liquid has poor material compatibility and compatibility, and rubber and other materials in a computer host can generate swelling phenomena in the long-term use process, and even can cause damage to hardware.
Disclosure of Invention
In view of the above problems in the conventional liquid cooling technology, embodiments of the present application provide an immersion type single-phase liquid refrigerant, and applications thereof, a liquid cooling method and an immersion type single-phase liquid cooling system.
In order to achieve the above purpose, the present application mainly provides the following technical solutions:
the embodiment of the application provides a submerged single-phase liquid refrigerant, and the main components of the liquid refrigerant contain one, two, three or four of tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer.
Preferably, the components of the liquid refrigerant comprise at least 50% by weight of tetrafluoroethylene pentamer.
Preferably, the components of the liquid refrigerant comprise tetrafluoroethylene pentamer with the content of 50-85% by weight.
Preferably, the main components of the liquid refrigerant comprise tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer.
Preferably, the weight ratio of the tetrafluoroethylene pentamer in the total amount of all tetrafluoroethylene oligomers in the components of the liquid refrigerant is more than 50%.
Preferably, the main components of the liquid refrigerant comprise the following components in parts by weight: 10-30 parts of tetrafluoroethylene tetramer, 60-85 parts of tetrafluoroethylene pentamer, 2-10 parts of tetrafluoroethylene hexamer and 2-10 parts of tetrafluoroethylene heptamer.
The embodiment of the application also provides application of the liquid refrigerant in an immersed single-phase liquid cooling system.
The embodiment of the application also provides a liquid cooling method, which comprises the steps of partially or completely immersing the main body to be cooled in the immersed single-phase liquid refrigerant, and then carrying out heat exchange between the immersed single-phase liquid refrigerant and other heat exchange devices.
Preferably, the body to be cooled is an electronic device.
The embodiment of the application also provides an immersed single-phase liquid cooling system containing the immersed single-phase liquid refrigerant.
Embodiments of the present application may be used alone or in combination with one another, and different embodiments may be combined and form a part of the present application.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
one or more of tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer are used as main components of the immersed single-phase liquid refrigerant, on one hand, the compound components have high boiling points and more branched chains, the chemical stability is good, the compound components cannot generate component change due to long-time use, swelling corrosion cannot be caused to chips and lines in electronic devices, short circuit damage cannot be caused to electronic equipment, and therefore the liquid refrigerant has good material compatibility of the electronic equipment; on the other hand, compared with fluorinated liquid such as FC-40, the compound components have more excellent heat conduction performance and better heat dissipation effect. Meanwhile, the immersed single-phase liquid coolant is non-toxic, non-flammable and excellent in electrical insulation performance, and meets the basic index requirements of the immersed liquid coolant for electronic devices.
Drawings
FIG. 1 is a diagram of an electronic device sample 1 for compatibility testing according to an embodiment of the present disclosure;
FIG. 2 is a comparison of the physical state of part 1-1 of sample 1 of the electronic device before and after immersion in a liquid coolant in the examples of the present application, wherein (a) is before immersion and (b) is after immersion;
FIG. 3 is a comparison of the physical state of parts 1-2 of sample 1 of an electronic device before and after immersion in a liquid coolant in accordance with an embodiment of the present application, wherein (a) is before immersion and (b) is after immersion;
FIG. 4 is a comparison of the physical properties of parts 1-3 of sample electronic device 1 before and after immersion in a liquid refrigerant in the examples of the present application, wherein (a) is before immersion and (b) is after immersion;
FIG. 5 is a comparison of the physical state of components 1-4 of sample electronic device 1 before and after immersion in a liquid coolant in accordance with an embodiment of the present application, wherein (a) is before immersion and (b) is after immersion;
FIG. 6 is a diagram of an electronic device sample 2 for compatibility testing according to an embodiment of the present disclosure;
FIG. 7 is a comparison of the physical state of part 2-1 of sample 2 of the electronic device before and after immersion in a liquid coolant in the present example, wherein (a) is before immersion and (b) is after immersion;
FIG. 8 is a comparison of the physical state of part 2-2 of sample 2 of the electronic device before and after immersion in a liquid coolant in an embodiment of the present application, wherein (a) is before immersion and (b) is after immersion;
FIG. 9 is a comparison of the physical properties of parts 2-3 of sample 2 of an electronic device before and after immersion in a liquid refrigerant in the examples of the present application, wherein (a) is before immersion and (b) is after immersion;
fig. 10 is a comparison of components 2-4 of sample 2 of an electronic device before and after immersion in a liquid coolant in accordance with an embodiment of the present disclosure, where (a) is before immersion and (b) is after immersion.
Detailed Description
In order to facilitate the understanding of the scheme of the present application by those skilled in the art, the following further description is provided in conjunction with the specific examples, which should be understood as being illustrative of the scheme of the present application and not as limiting the scope of the present application.
In this application, the terms "comprises," "comprising," "includes," "including," "has," "having" or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The embodiment of the application solves the problems of material compatibility and chemical stability of the liquid refrigerant of the electronic device by providing a novel immersed single-phase liquid refrigerant. Specifically, the embodiments of the present application provide a liquid coolant with tetrafluoroethylene oligomer as a main component, which has a good heat dissipation effect, and also has good material compatibility and chemical stability. The application also provides a liquid cooling method using the liquid refrigerant and application of the liquid refrigerant in a submerged single-phase liquid cooling system.
In order to solve the above problems, the technical solution in the embodiment of the present application has the following general idea:
the embodiment of the application provides an immersed single-phase liquid refrigerant, and the main components of the liquid refrigerant contain one, two, three or four of tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer.
Specifically, the tetrafluoroethylene tetramer is a mixture of cis-trans isomers having the following structure:
the tetrafluoroethylene pentamer is a mixture of cis-trans isomers having the following structure:
the tetrafluoroethylene hexamer has the following structure:
tetrafluoroethylene heptamers are mixtures of cis and trans isomers having the following structure:
specifically, the components of the above-mentioned liquid refrigerant may be all one, two, three or four of tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer, and other components other than tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer may be contained.
Specifically, the main component of the liquid refrigerant contains one, two, three or four of tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer, and the total weight of the tetrafluoroethylene tetramer, the tetrafluoroethylene pentamer, the tetrafluoroethylene hexamer and the tetrafluoroethylene heptamer in the liquid refrigerant accounts for at least 50%.
In some preferred embodiments of the present application, the above-mentioned components of the liquid refrigerant comprise tetrafluoroethylene pentamer in an amount of at least 50% by weight. Specifically, the above-mentioned liquid refrigerant may contain tetrafluoroethylene pentamer in an amount of at least 50% by weight, at least 55% by weight, at least 60% by weight, at least 70% by weight, at least 80% by weight, or at least 85% by weight in its components.
In some preferred embodiments of the present application, the above-mentioned components of the refrigerant include tetrafluoroethylene pentamer in an amount of 50-85% by weight, and the remaining 15-50% by weight of the components in the refrigerant may be one, two or three of tetrafluoroethylene tetramer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer, and may be other components.
In some preferred embodiments of the present application, the main components of the above-mentioned liquid refrigerant simultaneously contain tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer. More preferably, the weight ratio of the tetrafluoroethylene pentamer in the total amount of all tetrafluoroethylene oligomers in the components of the liquid coolant is more than 50%, that is, the tetrafluoroethylene pentamer is mainly contained in the main component of the liquid coolant, and the content of the tetrafluoroethylene pentamer exceeds the sum of the contents of the tetrafluoroethylene tetramer, the tetrafluoroethylene hexamer and the tetrafluoroethylene heptamer. More preferably, the main components of the liquid refrigerant comprise the following components in parts by weight: 10-30 parts of tetrafluoroethylene tetramer, 60-85 parts of tetrafluoroethylene pentamer, 2-10 parts of tetrafluoroethylene hexamer and 2-10 parts of tetrafluoroethylene heptamer.
The liquid coolant provided by the embodiment of the present application may further include one or more of the following compounds: ethers, alkanes, perfluoroolefins, alkenes, halogenated alkenes, perfluorocarbons, perfluorinated tertiary amines, perfluorinated ethers, cycloalkanes, esters, perfluorinated ketones, ethylene oxide, aromatics, siloxanes, hydrochlorocarbons, hydrochlorofluorocarbons, hydrofluorocarbons, hydrofluoroolefins, hydrochloroolefins, hydrochlorofluoroolefins, hydrofluoroethers, or mixtures thereof. These components are added to the above-mentioned liquid refrigerant to change or enhance the characteristics for the above-mentioned liquid refrigerant.
The structural formulas of the tetrafluoroethylene tetramer, the tetrafluoroethylene pentamer, the tetrafluoroethylene hexamer and the tetrafluoroethylene heptamer show that the compounds have more branched chains, compared with other perfluoroolefin oligomers such as hexafluoropropylene dimer, hexafluoropropylene trimer, tetrafluoroethylene dimer, tetrafluoroethylene trimer and the like and conventional fluorinated liquid, the compounds are less prone to nucleophilic reaction and have better chemical stability, cannot generate component change due to long-term use, cannot cause swelling corrosion to chips and lines in electronic devices, cannot cause short circuit damage to electronic equipment, and have better material compatibility of the electronic equipment.
The tetrafluoroethylene tetramer, the tetrafluoroethylene pentamer, the tetrafluoroethylene hexamer and the tetrafluoroethylene heptamer in the liquid refrigerant provided by the embodiment of the application have the characteristics of no toxicity and incombustibility, the dielectric constants of the tetrafluoroethylene tetramer, the tetrafluoroethylene pentamer, the tetrafluoroethylene hexamer and the tetrafluoroethylene heptamer are all larger than 2 under 1G-30GHz, the liquid refrigerant has good electrical insulation property, is high in boiling point, large in specific heat capacity and high in heat conductivity coefficient, and meets the design requirements of a single-phase immersed liquid refrigerant. The liquid refrigerant with large specific heat capacity can absorb more heat, thereby reducing the using amount of the liquid refrigerant and reducing the volume of a liquid cooling system; the liquid refrigerant has high boiling point, can be used as a single-phase liquid refrigerant, does not need boiling during working, has low noise and wide selectable range of working temperature; the liquid refrigerant has high heat conductivity coefficient, and can improve heat transfer efficiency, thereby reducing energy consumption.
The tetrafluoroethylene tetramer, the tetrafluoroethylene pentamer, the tetrafluoroethylene hexamer and the tetrafluoroethylene heptamer in the above-mentioned liquid refrigerant provided in the examples of the present application are commercially available, and can also be obtained by oligomerizing tetrafluoroethylene under the conditions of a fluoride salt and a phase transfer catalyst.
The embodiment of the application also provides application of the liquid refrigerant in an immersed single-phase liquid cooling system.
The embodiment of the application also provides a liquid cooling method, which comprises the steps of partially or completely immersing the main body to be cooled in the immersed single-phase liquid refrigerant, and then carrying out heat exchange between the immersed single-phase liquid refrigerant and other heat exchange devices.
In some preferred embodiments of the present application, the body to be cooled is an electronic device. The electronic device may include a computer server; data centers may also be included, particularly data centers operating at frequencies greater than 3 GHz. Among other things, a data center may include centrally managed computing resources and associated equipment or portions of a data center that support the system, as well as module components that provide the data center with other modules. The electronic device further comprises one or more of a microprocessor, a semiconductor wafer used to manufacture the semiconductor device, a power control semiconductor, an electrochemical cell, a power distribution switching gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, or a laser.
The embodiment of the application also provides an immersed single-phase liquid cooling system containing the immersed single-phase liquid refrigerant, and particularly provides an immersed single-phase liquid cooling system for IT equipment.
For better understanding of the above technical solutions, the following detailed descriptions will be provided with reference to the drawings and specific embodiments of the specification, but the present invention is not limited thereto.
Examples
The tetrafluoroethylene oligomer liquid refrigerants are prepared by physically mixing the components in the ratio of the components in the table 1 in a liquid phase state, and the physical and chemical properties of the liquid refrigerants are tested to obtain the test results shown in the table 2.
TABLE 1 ingredient ratio (parts by weight) of tetrafluoroethylene oligomer liquid refrigerant
| Example 1 | Example 2 | Example 3 | Example 4 | |
| Tetrafluoroethylene tetramer | 25 | 10 | 30 | 10 |
| Tetrafluoroethylene pentamer | 60 | 70 | 66 | 85 |
| Tetrafluoroethylene hexamer | 5 | 10 | 2 | 3 |
| Tetrafluoroethylene heptamer | 10 | 10 | 2 | 5 |
TABLE 2 physical Properties of tetrafluoroethylene oligomer liquid refrigerant
The liquid coolant provided by the embodiment of the application is nontoxic and nonflammable, has a high boiling point, can be used as a single-phase liquid coolant, does not need boiling during working, has low noise and wide selectable range of working temperature. Compared with FC-40 and Novec series fluorinated liquid, the liquid coolant provided by the embodiment of the application has higher specific heat capacity and thermal conductivity which is more than 4-5 times that of FC-40 and Novec series. On one hand, the heat capacity is large, and more heat can be absorbed, so that the using amount of liquid refrigerant can be reduced, and the volume of a liquid cooling system is reduced; on the other hand, the large specific heat capacity and the high heat conductivity coefficient indicate that the heat transfer efficiency is higher, so that the heat dissipation effect is better, and the energy consumption can be reduced.
And (3) compatibility testing:
the compatibility of the liquid refrigerant provided by the embodiment of the present application and an electronic device is detected, the adopted electronic device detection samples are shown in table 3, and the adopted detection method is as follows:
weighing 5g of material sample in a 50mL beaker, adding 50g of liquid refrigerant, placing the material sample in an oven for soaking at 80 ℃ for 96h, taking out the material sample, collecting the liquid refrigerant, cleaning the sample by using the unused liquid refrigerant, then sucking the residual liquid refrigerant on the sample by using filter paper, standing the sample for 30min at room temperature, changing the weight, the volume and the hardness, and respectively observing the sample and the appearance of the liquid refrigerant before and after soaking.
Weight change: the mass of the specimen in the air before and after immersion was measured according to the specification of GB/T1690, and the mass change percentage (. DELTA.W) was calculated:
in the formula: Δ W-percent change in weight of material sample,%;
W1-weight in air, g, of the material sample before soaking;
W3weight in air, g, of the soaked material sample.
Volume change: the mass of the test specimen in air and in distilled water before and after immersion was measured according to the specification of GB/T1690, respectively, and the volume change percentage (. DELTA.V) was calculated:
in the formula: Δ V — percent change in sample volume,%;
W1-weight in air, g, of the sample before soaking;
W2-weight of sample in water before soaking, g;
W3-weight in air, g, of the soaked sample;
W4-weight of soaked sample in water, g;
TABLE 3 compatibility test results of liquid refrigerant and electronic appliances
As can be seen from the detection data in the table above, after the sample of the electronic device is soaked in the liquid refrigerant provided in the embodiment of the present application, the change in volume and mass is very small, and from the physical diagrams before and after soaking (fig. 2-5, fig. 7-10), the liquid refrigerant is still in a clear state, and the electronic device is not subjected to swelling corrosion, thereby illustrating that the liquid refrigerant provided in the present application has good compatibility with the material of the electronic device.
Heat exchange Performance test
The computer host is placed in the liquid cooling device, the liquid cooling agent provided by the embodiment of the application is filled in the liquid cooling device, so that the computer host is completely immersed in the liquid cooling agent, and the computer host is externally connected with the display. The liquid cooling device is connected with the pump, when the pump runs, the liquid cooling agent circulates through the pump and exchanges heat with a heat exchanger outside the liquid cooling device, under the condition that the CPU runs at full load, the computer runs stably for 48 hours, the temperature of the CPU is detected through a CPU-Z program, and the temperature of the liquid cooling agent is displayed by the display thermometer of the body.
For comparison, the computer mainframe only uses a common fan to exchange heat with the CPU, runs for 48 hours under the condition that the CPU runs at full load, and detects the temperature of the CPU through a CPU-Z program.
The test data is shown in table 4 below, and it can be seen from the table that the cooling effect of the CPU is much higher than that of the conventional fan heat exchange by using the liquid refrigerant provided by the embodiment of the present application as the cooling medium.
TABLE 4 computer host CPU temperature test data
Finally, the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application, and all the technical solutions of the present application should be covered by the claims of the present application.
Claims (10)
1. The immersed single-phase liquid refrigerant is characterized in that the main components of the liquid refrigerant contain one, two, three or four of tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer.
2. The liquid coolant of claim 1 wherein the components of the liquid coolant comprise at least 50% by weight tetrafluoroethylene pentamer.
3. The liquid coolant of claim 2 wherein the components of the liquid coolant comprise from 50% to 85% by weight tetrafluoroethylene pentamer.
4. The liquid coolant as set forth in claim 1 wherein the main component of the coolant comprises tetrafluoroethylene tetramer, tetrafluoroethylene pentamer, tetrafluoroethylene hexamer and tetrafluoroethylene heptamer.
5. The liquid refrigerant according to claim 4, wherein the composition of the liquid refrigerant contains more than 50% by weight of tetrafluoroethylene pentamer in the total amount of all tetrafluoroethylene oligomers.
6. The liquid refrigerant according to claim 4, wherein the main components of the liquid refrigerant comprise the following components in parts by weight: 10-30 parts of tetrafluoroethylene tetramer, 60-85 parts of tetrafluoroethylene pentamer, 2-10 parts of tetrafluoroethylene hexamer and 2-10 parts of tetrafluoroethylene heptamer.
7. Use of a liquid coolant as claimed in any one of claims 1 to 6 in an immersed single phase liquid cooling system.
8. A liquid cooling method comprising partially or wholly immersing a body to be cooled in an immersed single-phase liquid cryogen as claimed in any one of claims 1 to 6, the immersed single-phase liquid cryogen then exchanging heat with other heat exchange means.
9. The liquid cooling method of claim 8, wherein the body to be cooled is an electronic device.
10. A submerged single-phase liquid cooling system comprising the submerged single-phase liquid refrigerant of any one of claims 1 to 6.
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