CN114227501B

CN114227501B - Polishing apparatus and polishing method

Info

Publication number: CN114227501B
Application number: CN202111348574.4A
Authority: CN
Inventors: 赵志刚; 许兴智; 刘斌; 王崇振; 丁朗; 张兴隆; 孟召恒; 彭智
Original assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Current assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2024-05-24
Anticipated expiration: 2041-11-15
Also published as: CN114227501A

Abstract

The application discloses polishing equipment. The polishing device comprises a polishing device, a fixing device and a controller. The fixing device comprises a rotating mechanism, an inductor, a movement compensation component, a first movement component and a second movement component. The controller is coupled with the polishing device and the fixing device respectively. Above-mentioned polishing equipment polishes the work piece through the polishing subassembly motion among the burnishing device, and the effort that receives when the work piece was polished is responded to the inductor in the fixing device, and the motion compensation subassembly drives rotary mechanism according to the effort that the inductor was responded to and removes in order to compensate the removal to the work piece for the effort between polishing subassembly and the work piece can carry out automatic compensation regulation, makes polishing subassembly even to the polishing volume of work piece, is favorable to promoting the polishing quality and the production efficiency of work piece. The application also discloses a polishing method.

Description

Polishing apparatus and polishing method

Technical Field

The application relates to the technical field of workpiece polishing equipment, in particular to polishing equipment and a polishing method.

Background

With the rapid development of the 3C product industry, the appearance requirements of people on workpieces are also higher and higher. After the existing workpiece is machined, polishing operation is needed to be carried out on the workpiece, so that the appearance of the workpiece achieves a mirror effect. In the current equipment, the polishing mode of the workpiece is approximately as follows: the workpiece is moved relative to the polishing head or the polishing member by movement (e.g., rotation, vibration, etc.) of the polishing head or the polishing member to perform a polishing operation on the workpiece. However, in this method, when the work is polished, the force between the polishing head or the polishing member and the work cannot be adjusted adaptively in time, resulting in uneven polishing amount of the work by the polishing head or the polishing member, and reduced polishing quality and productivity of the work.

Disclosure of Invention

In view of the foregoing, it is necessary to provide a polishing apparatus and a polishing method, so that the acting force between the polishing head or the polishing member and the workpiece can be automatically adjusted, and further the polishing head or the polishing member uniformly polishes the workpiece, thereby improving the polishing quality and the production efficiency of the workpiece.

The present application provides a polishing apparatus comprising:

A polishing apparatus including a polishing assembly for polishing a workpiece in motion;

A fixture, comprising:

The rotating mechanism is used for fixing and driving the workpiece to rotate;

the sensor is connected with the rotating mechanism and is used for sensing acting force applied to the workpiece during polishing;

The movement compensation component is connected with the rotating mechanism and is used for driving the rotating mechanism to move so as to make the workpiece carry out compensation movement;

the first moving assembly is connected with the moving compensation assembly and is used for driving the moving compensation assembly and the rotating mechanism to move along a first direction;

the second moving assembly is connected with the first moving assembly and is used for driving the first moving assembly to move along a second direction different from the first direction; and

And the controller is respectively coupled with the polishing device and the fixing device and is used for controlling the polishing assembly to rotate so as to adjust the polishing angle of the polishing assembly relative to the workpiece and controlling the fixing device to drive the workpiece to rotate, move along the first direction, move along the second direction and compensate movement so as to enable the workpiece to move relative to the polishing assembly to polish.

According to the polishing equipment provided by the application, the workpiece is polished through the movement of the polishing component in the polishing device, the sensor in the fixing device senses the acting force applied to the workpiece during polishing, and the movement compensation component drives the rotating mechanism to move according to the acting force sensed by the sensor so as to compensate and move the workpiece, so that the acting force between the polishing component and the workpiece can be automatically compensated and adjusted, the polishing quantity of the polishing component on the workpiece is uniform, and the polishing quality and the production efficiency of the workpiece are improved.

In some embodiments, the sensor comprises a sensing shell, and a sensing piece, a signal transmission piece and a sealing piece which are arranged on the sensing shell;

The sealing element is arranged around the induction element and is arranged on the induction shell,

The signal transmission piece is connected with the induction piece and protrudes out of the induction shell to be coupled with the controller;

The induction shell is positioned between the rotating mechanism and the movement compensation component and is respectively connected with the rotating mechanism and the movement compensation component, wherein,

The sensing piece is abutted with the rotating mechanism.

In some embodiments, the fixation device further comprises:

The connecting plate is positioned between the rotating mechanism and the induction shell and is respectively connected with the rotating mechanism and the induction shell;

The sensing piece protrudes out of the sealing piece towards the direction facing the connecting plate;

one side of the connecting plate facing the induction shell is provided with a convex abutting part, and the abutting part abuts against the induction piece.

In some embodiments, the motion compensation assembly comprises:

a movable housing connected to the first movable assembly;

the movable guide rail is arranged on the movable shell and extends along the direction of compensation movement;

the movable transmission piece is arranged on the movable shell and extends along the direction of compensating movement;

One end of the movable sliding table is connected with the movable transmission piece and is in sliding connection with the movable guide rail, and the other end of the movable sliding table is connected with the rotating mechanism; and

And the movable driving piece is coupled with the controller, arranged on the movable shell and connected with the movable transmission piece and used for driving the movable transmission piece to rotate so as to enable the movable sliding table to move along the movable guide rail.

In some embodiments, the polishing apparatus further comprises:

the driving assembly is coupled with the controller and connected with the polishing assembly and is used for driving the polishing assembly to rotate along an axial direction so as to adjust the polishing angle of the polishing assembly relative to the workpiece;

And the third moving assembly is coupled with the controller and connected with the driving assembly and is used for driving the driving assembly and the polishing assembly to move along a third direction different from the first direction and the second direction so as to enable the polishing assembly to be close to or far away from the workpiece.

In some embodiments, the rotation mechanism comprises:

A fixing assembly for fixing the workpiece;

And the rotating assembly is coupled with the controller, is positioned between the fixed assembly and the movement compensation assembly, is respectively connected with the fixed assembly and the movement compensation assembly and is used for driving the fixed assembly and the workpiece to rotate.

In some embodiments, the sensor is located between the stationary component and the rotating component and is connected to the stationary component and the rotating component, respectively.

In some embodiments, the rotating assembly comprises:

one end of the rotating shaft is connected with the fixed component;

the coupling piece is connected with the other end of the rotating shaft;

And the rotary driving piece is coupled with the controller and is in transmission connection with the coupling piece and used for driving the coupling piece to drive the rotary shaft to rotate.

The application also provides a polishing method for controlling a polishing device to polish a workpiece, comprising the following steps:

at least one of the workpiece is controlled to rotate, move in a first direction, move in a second direction, and compensate for movement to cause the workpiece to move relative to a polishing assembly in the polishing apparatus for polishing.

According to the polishing method provided by the application, the workpiece is polished by controlling at least one of rotation, movement along the first direction, movement along the second direction and compensation movement of the workpiece, so that acting force between the polishing assembly and the workpiece can be automatically compensated and adjusted, the polishing quantity of the polishing assembly to the workpiece is uniform, and the polishing quality and production efficiency of the workpiece are improved.

In some embodiments, the polishing method further comprises:

Controlling the workpiece to move to an initial position corresponding to the polishing assembly, and enabling the workpiece to abut against the polishing assembly;

And controlling the rotation of the polishing assembly to adjust the polishing angle of the polishing assembly to the workpiece.

In some embodiments, the polishing method further comprises:

acquiring acting force born by the workpiece when the workpiece abuts against the polishing assembly;

and controlling the workpiece to carry out compensation movement so as to enable the acting force to be within a preset range.

In some embodiments, the polishing method further comprises:

And controlling the polishing component to move along a third direction different from the first direction and the second direction so as to enable the acting force to be within a preset range.

In some embodiments, wherein the controlling at least one of the workpiece to rotate, move in a first direction, move in a second direction, and compensate for movement to polish the workpiece relative to movement of a polishing assembly in the polishing apparatus comprises:

Controlling the workpiece to move a first preset distance along the first direction so as to enable the workpiece to move relative to the polishing assembly along the first direction for polishing;

Controlling the workpiece to rotate by a first preset angle and move along at least one of the first direction and the second direction, wherein the second direction is non-same with the first direction, so that the workpiece moves relative to the polishing assembly to polish when rotating;

controlling the workpiece to move a second preset distance along the first direction so as to enable the workpiece to move relative to the polishing assembly along the first direction for polishing;

controlling the workpiece to rotate by a second preset angle and move along at least one of the first direction and the second direction so as to enable the workpiece to move relative to the polishing assembly to polish when rotating and return to the initial position;

And controlling the workpiece to move along the compensation movement direction by a compensation preset distance so that the acting force born by the workpiece when the workpiece is abutted against the workpiece is within a preset range.

In some embodiments, wherein the direction of the compensating movement comprises the first direction and the second direction.

Drawings

Fig. 1 is a schematic perspective view of a polishing apparatus according to some embodiments of the present application.

Fig. 2 is an exploded view of the fastening device shown in fig. 1.

Fig. 3 is a schematic view of a polishing apparatus according to some embodiments polishing a 3D surface of a workpiece.

Fig. 4 is a schematic view showing a state in which a polishing apparatus provided in some embodiments polishes a side surface of a workpiece.

Fig. 5 is a schematic view of a polishing arrangement provided in some embodiments for polishing a top surface of a workpiece.

Fig. 6 is a schematic view of the structure of the inductor and the connection plate shown in fig. 2.

FIG. 7 is an exploded view of the motion compensation assembly of FIG. 2.

Fig. 8 is an exploded view of the first and second moving assemblies shown in fig. 2.

Fig. 9 is an exploded view of the polishing apparatus shown in fig. 1.

Fig. 10 is a flow chart of a polishing method according to some embodiments of the present application.

Fig. 11 is a specific flowchart of S10 shown in fig. 10.

Description of the main reference signs

Polishing apparatus 100

Polishing apparatus 10

Polishing assembly 11

Drive assembly 12

Third moving assembly 13

Third housing 131

Third guide rail 132

Third transmission member 133

Third slipway 134

Third drive member 135

Third slider 136

Third sliding seat 137

Third cushioning member 138

Carrier 14

Bracket 15

Fastening device 20

Rotation mechanism 21

Fixing assembly 211

Rotating assembly 212

Rotation shaft 2121

Coupling 2122

Rotational drive 2123

Rotating base 2124

Inductor 22

Induction housing 221

Sensing element 222

Signal transmission member 223

Seal 224

Motion compensation assembly 23

Moving housing 231

Moving guide 232

Moving transmission piece 233

Movable sliding table 234

Moving driver 235

Moving slider 236

Movable sliding seat 237

First moving assembly 24

First case 241

First guide rail 242

First transmission member 243

First sliding table 244

First driving member 245

First slider 246

First sliding seat 247

First cushioning member 248

Second moving assembly 25

Second housing 251

Second guide rail 252

Second transmission piece 253

Second sliding table 254

Second driving member 255

Second slider 256

Second sliding seat 257

Second cushioning member 258

Connecting plate 26

Abutment 261

Workpiece 200

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, it is to be noted that the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the two components can be connected in a mechanical mode, can be electrically connected or can be communicated with each other, can be directly connected, can be indirectly connected through an intermediate medium, and can be communicated with each other inside the two components or can be in interaction relation with each other. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless explicitly specified and limited otherwise, a first feature "above" or "below" a second feature may include both the first feature and the second feature being in direct contact, and may also include both the first feature and the second feature not being in direct contact but being in contact with each other by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature has a higher horizontal thickness than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply means that the first feature has a smaller horizontal thickness than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

An embodiment of the present application provides a polishing apparatus including: a polishing apparatus including a polishing assembly for polishing a workpiece in motion; a fixture, comprising: the rotating mechanism is used for fixing and driving the workpiece to rotate; the sensor is connected with the rotating mechanism and is used for sensing acting force applied to the workpiece during polishing; the movement compensation component is connected with the rotating mechanism and is used for driving the rotating mechanism to move so as to make the workpiece carry out compensation movement; the first moving assembly is connected with the moving compensation assembly and is used for driving the moving compensation assembly and the rotating mechanism to move along a first direction; the second moving assembly is connected with the first moving assembly and is used for driving the first moving assembly to move along a second direction different from the first direction; and the controller is respectively coupled with the polishing device and the fixing device, and is used for controlling the polishing assembly to rotate so as to adjust the polishing angle of the polishing assembly relative to the workpiece, and controlling the fixing device to drive the workpiece to rotate, move along the first direction, move along the second direction and compensate movement so as to enable the workpiece to move relative to the polishing assembly for polishing.

Above-mentioned polishing equipment polishes the work piece through the polishing subassembly motion among the burnishing device, and the effort that receives when the work piece was polished is responded to the inductor in the fixing device, and the motion compensation subassembly drives rotary mechanism according to the effort that the inductor was responded to and removes in order to compensate the removal to the work piece for the effort between polishing subassembly and the work piece can carry out automatic compensation regulation, makes polishing subassembly even to the polishing volume of work piece, is favorable to promoting the polishing quality and the production efficiency of work piece.

The embodiment of the application also provides a polishing method for controlling polishing equipment to polish a workpiece, which comprises the following steps: at least one of the workpiece is controlled to rotate, move in a first direction, move in a second direction, and compensate for movement to cause the workpiece to move relative to a polishing assembly in the polishing apparatus for polishing.

According to the polishing method, the workpiece is controlled to rotate, move along the first direction, move along the second direction and move in a compensation mode, so that the workpiece is polished relative to the polishing component in the polishing equipment, acting force between the polishing component and the workpiece can be automatically compensated and adjusted, the polishing quantity of the polishing component to the workpiece is uniform, and the polishing quality and the production efficiency of the workpiece are improved.

Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 illustrates a polishing apparatus provided in some embodiments of the application. The polishing apparatus 100 is used for polishing a workpiece 200, and the workpiece 200 may be a conventional material such as a mobile phone frame, a back shell, or a material with a contoured surface, but is not limited thereto. The polishing apparatus 100 includes a polishing device 10, a fixture 20, and a controller (not shown).

The polishing apparatus 10 includes a polishing assembly 11 that moves to polish the workpiece 200, it being understood that the polishing assembly 11 is dynamically positioned.

Referring also to fig. 2, the fixture 20 may include a rotation mechanism 21, an inductor 22, a motion compensation assembly 23, a first motion assembly 24, and a second motion assembly 25.

The rotation mechanism 21 is used to fix and rotate the workpiece 200 so that the workpiece 200 can move relative to the polishing assembly 11 to be polished by the polishing assembly 11. The sensor 22 is connected to the rotation mechanism 21, and the sensor 22 is used for sensing a force applied to the workpiece 200 during polishing, where the force can be understood as an interaction force generated between the polishing assembly 11 and the workpiece 200 when the polishing assembly 11 polishes the workpiece 200, and if the force is larger, the polishing amount of the polishing assembly 11 on the workpiece 200 is larger; conversely, if the force is small, the polishing amount of the workpiece 200 by the polishing member 11 is small. Both of the above conditions affect the polishing yield of the workpiece 200. The motion compensation component 23 is connected with the rotating mechanism 21, and the motion compensation component 23 is used for driving the rotating mechanism 21 to move so as to make the workpiece 200 perform compensation movement, so that the acting force between the polishing component 11 and the workpiece 200 is within a preset range. The first moving component 24 is connected to the motion compensation component 23, and is used for driving the motion compensation component 23 and the rotating mechanism 21 to move along a first direction. The second moving component 25 is connected to the first moving component 24, and is configured to drive the first moving component 24 to move along a second direction different from the first direction. The direction of the compensation movement may be one of the first direction and the second direction, or other directions combined by the first direction and the second direction, but is not limited thereto.

For convenience of explanation, in the present application, the first direction is defined as an X-axis direction as shown in fig. 1, and the second direction is defined as a Y-axis direction as shown in fig. 1. In this embodiment, the first direction is perpendicular to the second direction.

It will be appreciated that in other embodiments, the first direction and the second direction may not be perpendicular, and the included angle between the first direction and the second direction may be 30 °, 45 °, 60 °, 75 °, etc.

The controller is coupled to the polishing apparatus 10 and the fixing apparatus 20, respectively, and it is also understood that the controller may be further coupled to the rotation mechanism 21, the sensor 22, the motion compensation assembly 23, the first motion assembly 24, and the second motion assembly 25, and the controller is configured to control the carrier 14 to rotate along the central axis to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200. The controller is further configured to control the fixing device 20 to drive the workpiece 200 to rotate, move in the first direction, move in the second direction, and move in the compensation direction, so that the workpiece 200 moves relative to the polishing component 11 for polishing, which is also understood that the controller is further configured to control the rotating mechanism 21 to drive the workpiece 200 to rotate, the first moving component 24 indirectly drives the workpiece 200 to move in the first direction, the second moving component 25 indirectly drives the workpiece 200 to move in the second direction, and the movement compensation component 23 drives the workpiece 200 to move in the compensation direction. It will be appreciated that the polishing assembly 11 itself is rotatable about its own axis for polishing the workpiece 200, but that movement of the polishing assembly 11 and adjustment of the rotation of the polishing angle of the workpiece 200 is driven by the carrier 14.

Some embodiments provide polishing apparatus 100 that may be implemented generally as: first, the workpiece 200 to be polished is fixed to the rotation mechanism 21; then, the controller controls the first moving assembly 24 and the second moving assembly 25 to drive the workpiece 200 to perform profiling motion similar to the shape of the workpiece, so that the workpiece 200 is abutted against the polishing assembly 11 for polishing; then, the controller controls the polishing assembly 11 to rotate to a preset angle so that the polishing assembly 11 polishes the workpiece 200 at an appropriate polishing angle; next, the controller controls the first moving assembly 24, the second moving assembly 25 and the rotating mechanism 21 to cooperate with each other to cause the workpiece 200 to perform a profiling motion relative to the polishing assembly 11 to perform polishing until the polishing of the workpiece 200 is completed. During the polishing process of the workpiece 200 moving relative to the polishing assembly 11, the sensor 22 senses the acting force applied by the workpiece 200 during polishing in real time and transmits the acting force to the controller in the form of a data signal, and the controller determines whether the acting force is larger or smaller according to the data signal. When the controller determines that the acting force is larger or smaller, the controller also controls the movement compensation assembly 23 to drive the rotation mechanism 21 to move, so as to make the workpiece 200 perform compensation movement, and further make the acting force between the workpiece 200 and the polishing assembly 11 belong to a preset range. For example, when the controller determines that the acting force is larger, the controller indicates that the acting force between the workpiece 200 and the polishing assembly 11 is too tight, and the controller controls the motion compensation assembly 23 to drive the workpiece 200 to move away from the polishing assembly 11, so that the acting force between the workpiece 200 and the polishing assembly 11 is within a preset range.

Referring to fig. 3, some embodiments provide a polishing apparatus 100 for polishing a 3D surface of a workpiece 200, and the 3D surface of the workpiece 200 may also be understood as an arcuate surface of the workpiece 200. The polishing assembly 11 of the polishing apparatus 100 rotates to a preset angle α to polish the 3D surface of the workpiece 200. When the polishing assembly 11 polishes the workpiece 200, the sensor 22 senses that the force applied to the workpiece 200 is F, and the force F may be combined by a horizontal force Fx and a vertical force Fz, where fx= Fcos α, and fz=fsin α, and may be understood that the horizontal force applied to the workpiece 200 is Fx and the vertical force is Fz. Illustratively, when the horizontal force range between the workpiece 200 and the polishing assembly 11 is Fx 'and the vertical force range is Fz', it means that the force between the workpiece 200 and the polishing assembly 11 falls within the preset range. However, when Fx is greater or less than Fx ', fz is greater or less than Fz', both indicate that the force between the workpiece 200 and the polishing assembly 11 does not fall within the preset range, and the polishing apparatus 100 needs to compensate. For example, when Fx > Fx ', indicating that the force in the horizontal direction between the workpiece 200 and the polishing member 11 is large, the controller controls the movement compensation member 23 to drive the workpiece 200 away from the polishing member 11 in the horizontal direction, so that fx=fx'. When Fx < Fx ', indicating that the horizontal force between the workpiece 200 and the polishing member 11 is smaller, the controller controls the motion compensation member 23 to drive the workpiece 200 to approach the polishing member 11 in the horizontal direction, so that fx=fx'. When Fz > Fz ', which means that the force in the vertical direction between the workpiece 200 and the polishing member 11 is larger, the controller controls the movement compensation member 23 to move the workpiece 200 away from the polishing member 11 in the horizontal direction, and in other embodiments, the controller controls the polishing apparatus 10 to move the polishing member 11 away from the workpiece 200 in the vertical direction, so that fz=fz'. When Fz < Fz ', which means that the force in the vertical direction between the workpiece 200 and the polishing member 11 is small, the controller controls the motion compensation member 23 to drive the workpiece 200 to approach the polishing member 11 in the horizontal direction, and in other embodiments, the controller controls the polishing apparatus 10 to approach the polishing member 11 to the workpiece 200 in the vertical direction, so that fz=fz'. In this way, the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, so that the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform.

Referring to fig. 4, some embodiments provide a polishing apparatus 100 for polishing a side surface of a workpiece 200. The polishing member 11 of the polishing apparatus 100 is perpendicular to the side of the workpiece 200 to polish the side of the workpiece 200. When the polishing assembly 11 polishes the workpiece 200, the sensor 22 senses that the force applied to the workpiece 200 is F, which can be understood as being composed of only the horizontal force Fx, and the workpiece 200 does not generate a force between the vertical direction and the polishing assembly 11. Illustratively, when the range of the horizontal force between the workpiece 200 and the polishing assembly 11 is Fx', it means that the force between the workpiece 200 and the polishing assembly 11 falls within the preset range. However, when Fx is greater or less than Fx', both indicate that the force between the workpiece 200 and the polishing assembly 11 does not fall within the preset range, the polishing apparatus 100 needs to compensate. For example, when Fx > Fx ', indicating that the force in the horizontal direction between the workpiece 200 and the polishing member 11 is large, the controller controls the movement compensation member 23 to drive the workpiece 200 away from the polishing member 11 in the horizontal direction, so that fx=fx'. When Fx < Fx ', indicating that the horizontal force between the workpiece 200 and the polishing member 11 is smaller, the controller controls the motion compensation member 23 to drive the workpiece 200 to approach the polishing member 11 in the horizontal direction, so that fx=fx'. In this way, the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, so that the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform.

Referring to fig. 5, some embodiments provide a polishing apparatus 100 for polishing a top surface of a workpiece 200. The polishing member 11 of the polishing apparatus 100 is perpendicular to the top surface of the workpiece 200 to polish the top surface of the workpiece 200. When the polishing assembly 11 polishes the workpiece 200, the sensor 22 senses that the force applied to the workpiece 200 is F, which can be understood as being composed of only the force Fz in the vertical direction, and the workpiece 200 does not generate a force between the horizontal direction and the polishing assembly 11. Illustratively, when the range of the force in the vertical direction between the workpiece 200 and the polishing assembly 11 is Fz', it means that the force between the workpiece 200 and the polishing assembly 11 falls within the preset range. However, when Fz is greater or less than Fz', it means that the force between the workpiece 200 and the polishing assembly 11 does not fall within the preset range, and the polishing apparatus 100 needs to compensate. For example, when Fz > Fz ', which indicates that the force in the vertical direction between the workpiece 200 and the polishing member 11 is large, the controller controls the movement compensation member 23 to drive the workpiece 200 away from the polishing member 11 in the vertical direction, or the controller controls the polishing apparatus 10 to drive the polishing member 11 away from the workpiece 200 in the vertical direction, so that fz=fz'. When Fz < Fz ', which means that the force in the vertical direction between the workpiece 200 and the polishing member 11 is small, the controller controls the movement compensation member 23 to bring the workpiece 200 closer to the polishing member 11 in the vertical direction, or the controller controls the polishing apparatus 10 to bring the polishing member 11 closer to the workpiece 200 in the vertical direction, so that fz=fz'. In this way, the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, so that the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform.

In some embodiments, the polishing apparatus 100 is further provided, the polishing assembly 11 in the polishing device 10 is used for polishing the workpiece 200, the sensor 22 in the fixing device 20 senses the acting force applied to the workpiece 200 during polishing, and the controller controls the movement compensation assembly 23 to drive the rotation mechanism 21 to move according to the acting force so as to compensate the workpiece 200, so that the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, the acting force between the polishing assembly 11 and the workpiece 200 is in a preset range, the polishing amount of the polishing assembly 11 to the workpiece 200 is uniform, and the polishing quality and the production efficiency of the workpiece 200 are improved.

In some embodiments, the controller may be a touch operation component, where the touch operation component may include a processor (not shown), a memory (not shown), a display screen (not shown), and the like, where the processor is configured to receive data, process the data, and send the data, and the memory is configured to store the data and instructions, where the data and instructions are readable and executable by the processor, and the display screen is configured to display information, receive a touch instruction, and send the touch instruction to the processor.

It will be appreciated that in other embodiments, the controller may also be a computer device, a central processing unit (CPU, central Processing Unit), a general purpose Processor, a digital signal Processor (DSP, digital Signal Processor), an Application SPECIFIC INTEGRATED Circuit (ASIC), a Field-Programmable gate array (FPGA) or other Programmable logic device, a discrete gate or transistor logic device, discrete hardware components, or the like. The controller is a control center of the polishing apparatus 100 described above, and connects various parts of the entire polishing apparatus 100 using various interfaces and lines.

In some embodiments, the rotation mechanism 21 may include a stationary assembly 211 and a rotating assembly 212.

The fixing assembly 211 is used to fix the workpiece 200. The rotating assembly 212 is coupled to the controller, the rotating assembly 212 is located between the fixing assembly 211 and the motion compensation assembly 23, and is respectively connected to the fixing assembly 211 and the motion compensation assembly 23, and the rotating assembly 212 is used for driving the fixing assembly 211 and the workpiece 200 to rotate.

Illustratively, the fixing assembly 211 is used to fix one end of the workpiece 200 to the workpiece 200, and may be used to brace the workpiece 200 or to carry the workpiece 200. The rotational assembly 212 includes a rotational shaft 2121, a shaft coupling 2122, and a rotational drive 2123. One end of the rotational shaft 2121 is connected to the fixing member 211 such that the fixing member 211 can rotate together with the rotational shaft 2121; the shaft coupling 2122 is connected to the other end of the rotation shaft 2121; the rotation driving member 2123 is coupled to the controller and is in transmission connection with the coupling member 2122, and the rotation driving member 2123 is configured to drive the coupling member 2122 to rotate the rotation shaft 2121. Wherein the rotational driving member 2123 may be a servo motor, the coupling member 2122 enables transmission of driving force of the rotational driving member 2123 in different directions. In this way, the rotation mechanism 21 is compact, rational and stable.

In some embodiments, the rotation mechanism 21 may also include a rotation base 2124. The rotational base 2124 has a substantially short cylindrical shape, the diameter of the rotational base 2124 is larger than the diameter of the rotational shaft 2121, one end of the rotational base 2124 is connected to the fixing member 211, and the other end of the rotational base 2124 is connected to the rotational shaft 2121. In this way, the connection between the fixed component 211 and the rotating component 212 is simple and stable. Obviously, swivel base 2124 may also be omitted.

It will be appreciated that in other embodiments, the rotational drive 2123 may also be coupled directly to the rotational shaft 2121. In this manner, the shaft coupling 2122 can also be omitted.

It should be appreciated that, in other embodiments, the end of the fixing component 211 for fixing the workpiece 200 may be a suction cup or a vacuum nozzle, and the suction cup or the vacuum nozzle sucks the workpiece 200 through vacuum negative pressure, so as to avoid the workpiece 200 from being bumped, scratched or crushed when the fixing component 211 fixes the workpiece 200.

Referring to fig. 6, in some embodiments, the sensor 22 may include a sensor housing 221, and a sensor 222, a signal transmission member 223, and a sealing member 224 disposed on the sensor housing 221. The induction housing 221 has a substantially circular plate shape. The sensing element 222 is used for sensing the acting force applied by the workpiece 200 during polishing, and the sensing element 222 is located approximately in the middle of the sensing housing 221. The sealing member 224 is disposed around the sensing member 222 and around the sensing housing 221, the sealing member 224 may be a sealing rubber ring or a sealing silica gel ring, and the sealing member 224 is used for sealing the sensing member 222, so as to prevent the sensing member 222 from being damaged or disturbed due to contamination of polishing solution and dust. The signal transmission member 223 is connected with the sensing member 222 and protrudes out of the sensing housing 221 to be coupled with the controller, and the signal transmission member 223 is used for transmitting the data signal sensed by the sensing member 222.

The induction housing 221 is located between the rotation mechanism 21 and the motion compensation assembly 23, and is connected to the rotation mechanism 21 and the motion compensation assembly 23, respectively. The sensing element 222 is in contact with the rotation mechanism 21, and is used for sensing the acting force conducted by the rotation mechanism 21.

It will be appreciated that in other embodiments, the sensing housing 221 of the sensor 22 may be located between the fixed component 211 and the rotating component 212, and connected to the fixed component 211 and the rotating component 212 respectively, and the sensing element 222 abuts against the fixed component 211. Correspondingly, the motion compensation assembly 23 is connected to the rotation assembly 212.

In some embodiments, the fixture 20 may also include a connection plate 26. The connection plate 26 is substantially plate-shaped, and the connection plate 26 is located between the rotation mechanism 21 and the induction housing 221 and is connected to the rotation mechanism 21 and the induction housing 221, respectively. In this way, the rotary mechanism 21 is carried by the connecting plate 26, which is favorable for stress conduction, improves the sensing precision of the sensor 22 and reduces errors.

It will be appreciated that in other embodiments, when the induction housing 221 of the inductor 22 is located between the fixed component 211 and the rotating component 212, the connection plate 26 should be located between the fixed component 211 and the induction housing 221 and connected to the fixed component 211 and the induction housing 221 respectively.

In some embodiments, the sensing element 222 protrudes from the sealing element 224 in a direction facing the connection plate 26, which may be understood as the sensing element 222 is higher than the sealing element 224 in the Z-axis direction as shown in fig. 6, such that the sensing element 222 is generally a convex structure. The side of the connection plate 26 facing the sensing housing 221 has a protruding abutment 261, and when the connection plate 26 is connected to the sensing housing 221, the abutment 261 abuts against the sensing element 222. In this way, the protruding abutting portion 261 abuts against the sensing piece 222, so that the connecting plate 26 is tightly connected with the sensing piece 222 in an interference manner, the acting force borne by the connecting plate 26 is conducted to the sensing piece 222, the sensing precision of the sensing piece 222 is improved, and errors are reduced.

It will be appreciated that in other embodiments, the sensing element 222 may also protrude from the side of the sensing housing 221 facing the connection plate 26. In this way, the sensing piece 222 is tightly connected with the connecting plate 26 in an interference manner, so that the sensing precision of the sensing piece 222 is improved, and the error is reduced.

Referring to fig. 7, in some embodiments, the motion compensation assembly 23 may include a motion housing 231, a motion guide 232, a motion transmission member 233, a motion sliding table 234, and a motion driving member 235.

The moving housing 231 is used for accommodating and carrying the moving guide rail 232, the moving transmission member 233, the moving sliding table 234 and the moving driving member 235, and the moving housing 231 is connected with the first moving assembly 24. The number of the moving rails 232 is two, and the two moving rails 232 are disposed in the moving housing 231 oppositely and extend along the direction of the movement compensation, in this embodiment, the direction of the movement compensation is the first direction, that is, the direction along the X axis is close to or far from the polishing assembly 11, so as to control the acting force between the polishing assembly 11 and the workpiece 200 within the preset range, but the direction of the movement compensation is not limited thereto. The moving transmission member 233 is rotatably disposed in the moving housing 231 and between the two moving rails 232, and the moving transmission member 233 extends in a direction of movement compensation. The movable slide 234 is substantially plate-shaped, one side of the movable slide 234 is slidably connected to the movable transmission member 233 and the movable rail 232, and the other side of the movable slide 234 is connected to the rotation mechanism 21 or the induction housing 221. The moving driving member 235 is coupled to the controller, the moving driving member 235 is disposed on the moving housing 231 and connected to the moving driving member 233, and the moving driving member 235 is used for driving the moving driving member 233 to rotate so as to move the moving sliding table 234 along the extending direction of the moving guide rail 232.

In some embodiments, the motion compensation assembly 23 may also include a motion slide 236 and a motion slide mount 237. The number of the moving slide blocks 236 is four, and the moving slide blocks are arranged on the moving guide rail 232 two by two; the movable sliding seat 237 is slidably disposed on the movable transmission member 233, and the movable sliding seat 237 moves relative to the movable transmission member 233 when the movable transmission member 233 rotates. Accordingly, one side of the moving slide 234 is connected to the moving slide 236 and the moving slide 237, and moves along the extending direction of the moving rail 232 following the moving slide 237.

The moving transmission member 233 and the moving slide 237 may be generally in a ball screw structure. The moving driver 235 may be a servo motor, and the moving driver 233 is rotatably coupled to the moving housing 231 through a bearing. It will be appreciated that the number of moving sliders 236 may also be two, three, five, six or more.

It will be appreciated that in other embodiments, the motion compensation assembly 23 may also be a linear cylinder mechanism, with the rotary mechanism 21 or the sensing housing 221 being connected to the output of the linear cylinder mechanism. In this manner, the motion compensation assembly 23 is still capable of compensating motion of the workpiece 200.

Referring to fig. 8, in some embodiments, the first moving assembly 24 may include a first housing 241, a first rail 242, a first transmission member 243, a first sliding table 244, a first driving member 245, a first sliding block 246, a first sliding seat 247, and a first buffer member 248.

The first housing 241 is configured to accommodate and bear the first guide rail 242, the first transmission member 243, the first sliding table 244, the first driving member 245, the first sliding block 246, the first sliding seat 247, and the first buffer member 248, and the first housing 241 is connected to the second moving assembly 25. The number of the first guide rails 242 is two, the two first guide rails 242 are oppositely arranged in the first shell 241 and extend along the first direction, and the number of the first sliding blocks 246 is four, and the two first sliding blocks are arranged on one first guide rail 242. The first driving member 243 is disposed in the first housing 241 and between the two first rails 242, and the first driving member 243 extends along a first direction. The first sliding seat 247 is slidably disposed on the first driving member 243. The first driving member 245 is connected to one end of the first driving member 243, and the first driving member 245 is used to drive the first driving member 243 to rotate, so that the first sliding seat 247 moves along the first driving member 243, i.e. the first sliding seat 247 moves along the first direction. The first sliding table 244 is substantially plate-shaped, one side of the first sliding table 244 is connected to the first sliding seat 247 and the first sliding block 246, and the first sliding table 244 moves along the first direction under the driving of the first sliding seat 247. The other side of the first sliding table 244 is connected to the moving housing 231 of the movement compensation assembly 23, so that the movement compensation assembly 23 moves along the first direction under the driving of the first sliding table 244. The number of the first buffer members 248 is two, and the first buffer members 248 are respectively arranged on two sides of the first sliding table 244 along the first direction, and have elasticity, so that buffer force is provided for the first sliding table 244 when the first sliding table 244 excessively moves along the first direction.

It will be appreciated that in other embodiments, the first slide table 244 and the first buffer 248 may be omitted, and thus the first slide seat 247 is directly connected to the moving housing 231.

The first driving member 243 and the first sliding seat 247 may be generally ball screw structures, the first driving member 245 may be a servo motor, the first driving member 243 may be rotatably connected to the first housing 241 through a bearing structure, and the first buffer member 248 may be an elastic member made of a rubber material. It is understood that the first buffer 248 may also be a resilient member such as a spring, and the number of the first sliders 246 may also be two, three, five, six or more.

It will be appreciated that in other embodiments, the first moving assembly 24 may also be a linear cylinder mechanism, with the moving housing 231 being connected to the output of the first moving assembly 24. In this way, the first movement assembly 24 is still able to effect movement of the movement compensation assembly 23 in the first direction.

In some embodiments, the second moving assembly 25 may include a second housing 251, a second guide rail 252, a second transmission member 253, a second sliding table 254, a second driving member 255, a second slider 256, a second sliding seat 257, and a second buffer member 258.

The second housing 251 is configured to house a second guide rail 252, a second transmission member 253, a second sliding table 254, a second driving member 255, a second sliding block 256, a second sliding seat 257, and a second buffer member 258, and the second housing 251 may serve as a supporting structure of the fixing device 20. The number of the second guide rails 252 is two, the two second guide rails 252 are oppositely arranged in the second shell 251 and extend along the second direction, and the number of the second sliding blocks 256 is four, and the two second sliding blocks are arranged on one second guide rail 252. The second transmission member 253 is disposed in the second housing 251 and located between the two second guide rails 252, and the second transmission member 253 extends along the second direction. The second sliding seat 257 is slidably disposed on the second transmission member 253. The second driving member 255 is connected to one end of the second transmission member 253, and the second driving member 255 is configured to drive the second transmission member 253 to rotate, thereby moving the second sliding seat 257 along the second transmission member 253, i.e., moving the second sliding seat 257 in the second direction. The second sliding table 254 is substantially plate-shaped, one side of the second sliding table 254 is connected to the second sliding seat 257 and the second sliding block 256, and the second sliding table 254 moves in the second direction under the driving of the second sliding seat 257. The other side of the second sliding table 254 is connected to the first housing 241, so that the first moving assembly 24 moves along the second direction under the driving of the second sliding table 254. The number of the second buffering members 258 is two, and the second buffering members 258 are respectively arranged on two sides of the second sliding table 254 along the second direction, and have elasticity, so that buffering force is provided for the second sliding table 254 when the second sliding table 254 excessively moves along the second direction.

It will be appreciated that in other embodiments, the second slide table 254 and the second cushioning member 258 may be omitted such that the second slide mount 257 is directly coupled to the first housing 241.

The second transmission member 253 and the second sliding seat 257 may be generally ball screw structures, the second driving member 255 may be a servo motor, the second transmission member 253 may be rotatably connected to the second housing 251 through a bearing structure, and the second buffer member 258 may be an elastic member made of a rubber material. It is understood that the second cushioning member 258 may also be a resilient member such as a spring, and the number of the second slider 256 may also be two, three, five, six or more.

It will be appreciated that in other embodiments, the second moving assembly 25 may also be a linear cylinder mechanism, with the first housing 241 being connected to the output of the second moving assembly 25. In this way, the second movement assembly 25 is still able to effect movement of the first movement assembly 24 in the second direction.

Referring to fig. 9, in some embodiments, the polishing apparatus 10 may further include a driving assembly 12 and a third moving assembly 13.

The driving component 12 is coupled to the controller and connected to the polishing component 11, and the driving component 12 is used for driving the polishing component 11 to rotate along an axial direction so as to adjust the polishing angle of the polishing component 11 relative to the workpiece 200. The third moving assembly 13 is coupled to the controller and connected to the driving assembly 12, and the third moving assembly 13 is configured to drive the driving assembly 12 and the polishing assembly 11 to move in a third direction different from the first direction and the second direction, so as to move the polishing assembly 11 toward or away from the workpiece 200. The third direction is the Z-axis direction as shown in fig. 9, and the third direction is perpendicular to the first direction and the second direction.

In some embodiments, polishing apparatus 10 may further comprise carrier 14 and support 15.

The polishing assembly 11 is disposed on the carrier 14, and the dynamic arrangement of the polishing assembly 11 is understood to mean that the polishing assembly 11 is movable relative to the carrier 14 to polish the workpiece 200. The bearing member 14 is rotatably arranged on the bracket 15 and is in transmission connection with the driving assembly 12, the driving assembly 12 is connected with the bracket 15 and can drive the bearing member 14 to rotate along an axial direction, so that the polishing assembly 11 rotates along an axial direction, namely, the controller controls the driving assembly 12 to drive the bearing member 14 to rotate, and the polishing assembly 11 is driven to rotate. The support 15 is connected with the third moving component 13, and the support 15 drives the driving component 12, the bearing component 14 and the polishing component 11 to move along the third direction under the driving of the third moving component 13. The axial direction is understood to mean the axis of the carrier 14.

It will be appreciated that in other embodiments, the number of polishing assemblies 11 may be two, three or more, and that two, three or more polishing assemblies 11 may be disposed on different surfaces of the carrier 14 to achieve polishing of the workpiece 200 by the polishing assemblies 11 on different surfaces, thereby reducing wear of a single polishing assembly 11 and facilitating an increase in the service life of the polishing apparatus 100.

In some embodiments, the third moving assembly 13 may include a third housing 131, a third guide rail 132, a third transmission member 133, a third sliding table 134, a third driving member 135, a third sliding block 136, a third sliding seat 137, and a third buffer member 138.

The third housing 131 is configured to house a third guide rail 132, a third transmission member 133, a third sliding table 134, a third driving member 135, a third sliding block 136, a third sliding seat 137, and a third buffer member 138, and the third housing 131 may serve as a supporting structure of the polishing apparatus 10. The number of the third guide rails 132 is two, the two third guide rails 132 are oppositely arranged in the third shell 131 and extend along the third direction, and the number of the third sliding blocks 136 is four, and the two third sliding blocks are arranged on one third guide rail 132. The third transmission member 133 is disposed in the third housing 131 and between the two third guide rails 132, and the third transmission member 133 extends along a third direction. The third sliding seat 137 is slidably disposed on the third transmission member 133. The third driving member 135 is connected to one end of the third driving member 133, and the third driving member 135 is used to drive the third driving member 133 to rotate, so that the third sliding seat 137 moves along the third driving member 133, i.e., the third sliding seat 137 moves along the third direction. The third sliding table 134 is substantially plate-shaped, one side of the third sliding table 134 is connected to the third sliding seat 137 and the third sliding block 136, and the third sliding table 134 moves along the third direction under the driving of the third sliding seat 137. The other side of the third sliding table 134 is connected to the support 15, so that the support 15 moves along the third direction under the driving of the third sliding table 134. The number of the third buffer members 138 is two, and the third buffer members 138 are respectively arranged on two sides of the third sliding table 134 along the third direction, and have elasticity, so that buffer force is provided for the third sliding table 134 when the third sliding table 134 moves excessively along the third direction.

It will be appreciated that in other embodiments, the third slide table 134 and the third buffer 138 may be omitted, and thus the third slide seat 137 is directly connected to the bracket 15.

The third transmission member 133 and the third sliding seat 137 may be generally ball screw structures, the third driving member 135 may be a servo motor, the third transmission member 133 may be rotatably connected to the third housing 131 through a bearing structure, and the third buffer member 138 may be an elastic member made of a rubber material. It will be appreciated that the third buffer member 138 may also be a resilient member such as a spring, and the number of the third slider 136 may also be two, three, five, six or more.

It will be appreciated that in other embodiments, the third moving assembly 13 may also be a linear cylinder mechanism, with the support 15 being connected to the output of the third moving assembly 13. In this manner, the third movement assembly 13 is still able to effect movement of the carriage 15 in the third direction.

According to the polishing device 100 provided by some embodiments, through the mutual cooperation among the rotating mechanism 21, the sensor 22, the movement compensation component 23, the first movement component 24, the second movement component 25, the controller, the driving component 12 and the third movement component 13, the acting force between the polishing component 11 and the workpiece 200 can be automatically compensated and adjusted, the acting force between the polishing component 11 and the workpiece 200 is within a preset range, the polishing quantity of the polishing component 11 to the workpiece 200 is uniform, the polishing quality of the workpiece 200 can be ensured, and the production efficiency of the workpiece 200 is further improved.

Referring to fig. 10, some embodiments of the present application further provide a polishing method for controlling a polishing apparatus 100 to polish a workpiece 200. The polishing apparatus 100 is exemplified by, but not limited to, the polishing apparatus 100 provided in the above-described embodiments. Taking the workpiece 200 as a mobile phone frame for illustration, the mobile phone frame comprises a long side, a short side and an arc angle connecting the long side and the short side, and when polishing the mobile phone frame, the long side, the short side and the arc angle of the mobile phone frame are required to be polished. The order of the steps in the flow chart may be changed and some steps may be omitted according to different needs. For ease of illustration, only portions relevant to some embodiments of the application are shown. The polishing method comprises the following steps.

And S10, controlling at least one of rotation, movement in a first direction, movement in a second direction and compensation movement of the workpiece 200 to move the workpiece 200 relative to the polishing assembly 11 in the polishing apparatus 100 for polishing.

Illustratively, the controller controls the rotating mechanism 21 to drive the workpiece 200 to rotate, the first moving assembly 24 to drive the workpiece 200 to move along the first direction, the second moving assembly 25 to drive the workpiece 200 to move along the second direction, and the movement compensation assembly 23 to drive the rotating mechanism 21 to compensate at least one of movement, so that the long side, the short side and the circular arc angle of the workpiece 200 move relative to the polishing assembly 11 to rub for polishing, and meanwhile, the acting force between the workpiece 200 and the polishing assembly 11 can be automatically compensated and adjusted, so that the polishing quality of the workpiece 200 is ensured. The polishing assembly 11 is dynamically configured, and the direction of motion compensation includes a first direction and a second direction, and may also include a direction combined by the first direction and the second direction, but is not limited thereto.

It will be appreciated that in other embodiments, the polishing assembly 11 may be a static arrangement.

In some embodiments, step S10 may be preceded by steps S2-S4.

S2, controlling the workpiece 200 to move to an initial position corresponding to the polishing assembly 11, and enabling the workpiece 200 to abut against the polishing assembly 11.

Illustratively, the controller controls at least one of the rotating mechanism 21, the first moving assembly 24 and the second moving assembly 25 of the fixing device 20 to move so that the long side of the mobile phone frame is abutted against the polishing assembly 11, and the position where the long side is abutted against the polishing assembly 11 is near one end of the corresponding arc angle. It should be noted that, the initial position is a space position where one end of the long side of the mobile phone frame, which is close to the corresponding arc angle, is abutted against the polishing component 11.

It will be appreciated that, in other embodiments, the initial position may be a spatial position where one end of the short side of the mobile phone frame near the corresponding arc angle collides with the polishing assembly 11.

And S4, controlling the polishing assembly 11 to rotate so as to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200.

Illustratively, the controller controls the driving assembly 12 to drive the polishing assembly 11 to rotate along an axial direction to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200, so that the polishing assembly 11 conforms to the surface of the workpiece 200.

It will be appreciated that in other embodiments, step S4 may be omitted, and step S4 may also be located after step S10.

In some embodiments, step S10 may be followed by step S20-step S30.

S20, the acting force applied when the workpiece 200 abuts against the polishing assembly 11 is acquired.

Illustratively, the controller controls the sensor 22 to capture the force applied by the workpiece 200 against the polishing assembly 11, and the sensor 22 transmits a sensed force signal to the controller. The controller judges whether the acting force belongs to a preset range. The sensor 22 senses that the force applied to the workpiece 200 is F, and the force F may be combined by a horizontal force Fx and a vertical force Fz, where fx= Fcos α, and fz=fsinα, and it may be understood that the horizontal force applied to the workpiece 200 is Fx, the vertical force is Fz, and α is a preset angle of the polishing assembly 11 with respect to the workpiece 200, and ranges from 0 ° to 90 °. Illustratively, when the horizontal force range between the workpiece 200 and the polishing assembly 11 is Fx 'and the vertical force range is Fz', it means that the force between the workpiece 200 and the polishing assembly 11 falls within the preset range. However, when Fx is greater or less than Fx ', fz is greater or less than Fz', both indicate that the force between the workpiece 200 and the polishing assembly 11 does not fall within the preset range, and the polishing apparatus 100 needs to compensate.

If yes, it indicates that the applied force is within the preset range, and the polishing amount of the workpiece 200 by the polishing assembly 11 meets the requirement, and then step S10 is continued.

If not, it is indicated that the acting force does not belong to the preset range, and step S30 is performed.

S30, controlling the workpiece 200 to perform compensation movement so that the acting force is within a preset range.

Illustratively, the controller controls the motion compensation assembly 23 to move the workpiece 200 for compensation movement. When the acting force is larger, the controller controls the movement compensation assembly 23 to drive the workpiece 200 to move away from the polishing assembly 11, so that the acting force is reduced to be within a preset range; conversely, when the applied force is smaller, the controller controls the motion compensation assembly 23 to drive the workpiece 200 to move towards the polishing assembly 11, so as to increase the applied force to be within a preset range.

In some embodiments, if not, step S40 may also be performed.

S40, the polishing member 11 is controlled to move in a third direction different from the first direction and the second direction so that the applied force falls within a preset range.

Illustratively, the controller controls the third moving assembly 13 to move the polishing assembly 11 along the third direction, so that the polishing assembly 11 approaches or moves away from the workpiece 200, and the acting force falls within a preset range.

It will be appreciated that step S30 and step S40 may also be performed simultaneously, and by performing step S30 and step S40, the force between the workpiece 200 and the polishing assembly 11 can be automatically compensated in any direction, which is beneficial to improving the applicability of the polishing apparatus 100.

Referring to fig. 11, in some embodiments, step S10 may specifically include the following steps S102-S110.

S102, controlling the workpiece 200 to move along the first direction by a first preset distance so as to enable the workpiece 200 to move along the first direction relative to the polishing assembly 11 for polishing.

Illustratively, the controller controls the first moving assembly 24 to move the workpiece 200 a first predetermined distance in the first direction, such that the long side of the workpiece 200 moves with respect to the polishing assembly 11 to polish, thereby polishing the long side of the workpiece 200. The first preset distance may be the length of the long side.

And S104, controlling the workpiece 200 to rotate by a first preset angle and move along at least one of a first direction and a second direction which is not in the same direction as the first direction, so that the workpiece 200 rotates to move relative to the polishing assembly 11 for polishing.

Illustratively, the controller controls the rotation mechanism 21 to rotate the workpiece 200 by a first preset angle, controls the first moving assembly 24 to move the workpiece 200 along at least one of the first direction and controls the second moving assembly 25 to move the workpiece 200 along the second direction, so that the arc angle of the workpiece 200 moves and rubs against the polishing assembly 11 to polish while the workpiece 200 rotates. Wherein the first preset angle may be 90 °. It can be appreciated that, after the rotation mechanism 21 drives the workpiece 200 to rotate by the first preset angle, one end of the short side of the workpiece 200, which is close to the polished arc angle, is abutted against the polishing assembly 11.

S106, controlling the workpiece 200 to move along the first direction by a second preset distance so as to enable the workpiece 200 to move along the first direction relative to the polishing assembly 11 for polishing.

Illustratively, the controller controls the first moving assembly 24 to move the workpiece 200 along the first direction by a second preset distance, so that the short side of the workpiece 200 moves with respect to the polishing assembly 11 to polish, thereby polishing the short side of the workpiece 200. The second preset distance may be a length of the short side.

S108, controlling the workpiece 200 to rotate by a second preset angle and move in at least one of the first direction and the second direction, so that the workpiece 200 rotates to polish with respect to the movement of the polishing assembly 11 and returns to the initial position.

Illustratively, the controller controls the rotation mechanism 21 to rotate the workpiece 200 by a second preset angle, and controls the first moving assembly 24 to drive the workpiece 200 to move along at least one of the first direction and the second moving assembly 25 to drive the workpiece 200 to move along the second direction, so that the other arc angle of the workpiece 200 moves and rubs against the polishing assembly 11 to polish while the workpiece 200 rotates. Wherein the second preset angle may be 90 °. It can be understood that, after the rotation mechanism 21 drives the workpiece 200 to rotate by the second preset angle, one end of the long side of the workpiece 200, which is close to the polished arc angle, collides with the polishing assembly 11, which can be understood as that the workpiece 200 returns to the initial position.

S110, controlling the workpiece 200 to move along the compensation movement direction by a compensation preset distance, so that the acting force applied when the workpiece 200 abuts against the workpiece 200 is within a preset range.

For example, when the force sensed by the sensor 22 exceeds the preset range, the controller controls the motion compensation assembly 23 to move the workpiece 200 along the direction of the compensation motion to compensate for the preset distance, so that the workpiece 200 and the polishing assembly 11 are close to or far away from each other, and the force applied when the workpiece 200 abuts against the workpiece 200 is within the preset range.

It will be appreciated that, since the sensor 22 senses the force between the workpiece 200 and the polishing assembly 11 in real time, the steps S110 and S102, the steps S104, the steps S106, and the steps S108 may be performed simultaneously, or may be performed between any two steps.

Some embodiments provide a polishing method for polishing by controlling at least one of rotation, movement in a first direction, movement in a second direction, and compensation movement of the workpiece 200 to move the workpiece 200 relative to the polishing assembly 11 in the polishing apparatus 100; the acting force applied when the workpiece 200 is abutted against the polishing component 11 is obtained, so that the acting force between the polishing component 11 and the workpiece 200 can be automatically compensated and adjusted, the polishing quantity of the polishing component 11 to the workpiece 200 is uniform, and the polishing quality and the production efficiency of the workpiece 200 are improved; the polishing operation on the contoured surface of the workpiece 200 is facilitated by controlling the rotation of the polishing assembly 11 to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200.

It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Finally, it should be noted that the above-mentioned embodiments only illustrate the technical solution of the present application, and not limit the technical solution, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present application without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A polishing apparatus comprising:

A fixture, comprising:

The rotating mechanism is used for fixing and driving the workpiece to rotate;

The controller is respectively coupled with the polishing device and the fixing device and is used for controlling the polishing assembly to rotate so as to adjust the polishing angle of the polishing assembly relative to the workpiece and controlling the fixing device to drive the workpiece to rotate, move along the first direction, move along the second direction and compensate at least one of the movements to do profiling motion similar to the self shape of the workpiece so as to enable the workpiece to move relative to the polishing assembly to polish;

the motion compensation assembly includes:

a movable housing connected to the first movable assembly;

one end of the movable sliding table is in sliding connection with the movable guide rail, and the other end of the movable sliding table is connected with the rotating mechanism;

The movable driving piece is coupled with the controller, arranged on the movable shell, connected with the movable transmission piece and used for driving the movable transmission piece to rotate;

The movable sliding seat is arranged on the movable transmission part in a sliding manner, and moves relative to the movable transmission part when the movable transmission part rotates, and one end of the movable sliding table is connected with the movable sliding seat and moves along the extending direction of the movable guide rail along with the movable sliding seat;

The sensor comprises a sensing shell, and a sensing piece, a signal transmission piece and a sealing piece which are arranged on the sensing shell;

The induction piece is abutted with the rotating mechanism;

the polishing apparatus further includes:

the third moving assembly is coupled with the controller and connected with the driving assembly and is used for driving the driving assembly and the polishing assembly to move along a third direction different from the first direction and the second direction so as to enable the polishing assembly to be close to or far away from the workpiece;

The fixing device further comprises a connecting plate, wherein the connecting plate is positioned between the rotating mechanism and the induction shell and is respectively connected with the rotating mechanism and the induction shell;

the induction piece protrudes out of the sealing piece towards the direction of the connecting plate, one side of the connecting plate, which faces the induction shell, is provided with a protruding abutting part, and the abutting part abuts against the induction piece, so that the connecting plate is in interference connection with the induction piece.

2. The polishing apparatus of claim 1, the rotation mechanism comprising:

A fixing assembly for fixing the workpiece;

3. The polishing apparatus according to claim 2,

The rotating assembly includes:

one end of the rotating shaft is connected with the fixed component;

the coupling piece is connected with the other end of the rotating shaft;

4. A polishing method for controlling a polishing apparatus according to any one of claims 1 to 3 to polish a workpiece, comprising:

5. The polishing method as recited in claim 4, further comprising:

6. The polishing method as recited in claim 5, further comprising:

7. The polishing method as recited in claim 6, further comprising:

8. The polishing method of claim 5, wherein the controlling at least one of rotation of the workpiece, movement in a first direction, movement in a second direction, and compensation movement to polish the workpiece relative to movement of a polishing assembly in the polishing apparatus comprises:

9. The polishing method of claim 8, wherein the direction of the compensating movement comprises the first direction and the second direction.