CN114227501A

CN114227501A - Polishing apparatus and polishing method

Info

Publication number: CN114227501A
Application number: CN202111348574.4A
Authority: CN
Inventors: 赵志刚; 许兴智; 刘斌; 王崇振; 丁朗; 张兴隆; 孟召恒; 彭智
Original assignee: Shenzhenshi Yuzhan Precision Technology Co Ltd
Current assignee: Shenzhenshi Yuzhan Precision Technology Co Ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2022-03-25
Anticipated expiration: 2041-11-15
Also published as: CN114227501B

Abstract

The application discloses a polishing apparatus. The polishing device comprises a polishing device, a fixing device and a controller. The fixing device comprises a rotating mechanism, an inductor, a movement compensation assembly, a first moving assembly and a second moving assembly. The controller is coupled with the polishing device and the fixing device respectively. Above-mentioned polishing equipment, through the polishing subassembly motion among the burnishing device polish the work piece, the effort that receives when the inductor response work piece among the fixing device polishes, the motion compensation subassembly drives rotary mechanism according to the effort that the inductor responded to and removes in order to carry out compensation to the work piece for the effort between polishing subassembly and the work piece can carry out automatic compensation and adjust, makes the polishing subassembly even to the polishing volume of work piece, is favorable to promoting the polishing quality and the production efficiency of work piece. The application also discloses a polishing method.

Description

Polishing apparatus and polishing method

Technical Field

The application relates to the technical field of workpiece polishing equipment, in particular to polishing equipment and a polishing method.

Background

With the rapid development of the 3C product industry, people have higher and higher requirements on the appearance of workpieces. After the existing workpiece is machined, the workpiece needs to be polished, so that the appearance of the workpiece achieves a mirror surface effect. In the existing equipment, the polishing mode of the workpiece is roughly as follows: by movement (e.g., rotation, vibration, etc.) of the polishing head or member, the workpiece is moved relative to the polishing head or member to perform a polishing operation on the workpiece. However, in this method, when the workpiece is polished, the acting force between the polishing head or the polishing member and the workpiece cannot be adaptively adjusted in time, so that the polishing amount of the workpiece by the polishing head or the polishing member is not uniform, and the polishing quality and the production efficiency of the workpiece are reduced.

Disclosure of Invention

In view of the above, it is necessary to provide a polishing apparatus and a polishing method, so that the acting force between the polishing head or the polishing member and the workpiece can be automatically adjusted, and the polishing head or the polishing member can polish the workpiece uniformly, thereby improving the polishing quality and the production efficiency of the workpiece.

The present application provides a polishing apparatus comprising:

a polishing apparatus including a moving polishing assembly for polishing a workpiece;

a fixture, comprising:

the rotating mechanism is used for fixing and driving the workpiece to rotate;

the inductor is connected with the rotating mechanism and used for inducing acting force applied to the workpiece during polishing;

the movement compensation assembly is connected with the rotating mechanism and is used for driving the rotating mechanism to move so as to enable the workpiece to perform compensation movement;

the first moving assembly is connected with the movement compensation assembly and is used for driving the movement compensation assembly and the rotating mechanism to move along a first direction;

the second moving assembly is connected with the first moving assembly and used for driving the first moving assembly to move along a second direction different from the first direction; and

and the controller is respectively coupled with the polishing device and the fixing device, and is used for controlling the polishing assembly to rotate so as to adjust the polishing angle of the polishing assembly relative to the workpiece, and also used for controlling the fixing device to drive the workpiece to rotate, move along the first direction, move along the second direction and compensate for movement, so that the workpiece moves relative to the polishing assembly for polishing.

The application provides a polishing equipment, through polishing the work piece of the polishing subassembly motion among the burnishing device, the effort that receives when the inductor response work piece among the fixing device polishes, the effort that the removal compensation subassembly drove rotary mechanism and removes in order to carry out the compensation to the work piece according to the effort that the inductor responded to for effort between polishing subassembly and the work piece can carry out the automatic compensation and adjust, it is even to the polishing volume of work piece to make the polishing subassembly, be favorable to promoting the polishing quality and the production efficiency of work piece.

In some embodiments, the inductor comprises an induction shell, and an induction piece, a signal transmission piece and a sealing piece which are arranged on the induction shell;

the sealing element is arranged on the induction shell around the induction element,

the signal transmission piece is connected with the induction piece and protrudes out of the induction shell to be coupled with the controller;

the induction shell is positioned between the rotating mechanism and the motion compensation component and is respectively connected with the rotating mechanism and the motion compensation component, wherein,

the induction piece is abutted against the rotating mechanism.

In some embodiments, the fixture further comprises:

the connecting plate is positioned between the rotating mechanism and the induction shell and is respectively connected with the rotating mechanism and the induction shell;

the sensing piece protrudes out of the sealing piece towards the direction facing the connecting plate;

one side of the connecting plate facing the induction shell is provided with a protruding abutting part, and the abutting part abuts against the induction piece.

In some embodiments, the motion compensation component comprises:

a movable housing connected with the first movable assembly;

the moving guide rail is arranged on the moving shell and extends along the direction of compensating movement;

the movable transmission part is arranged on the movable shell and extends along the direction of compensation movement;

one end of the movable sliding table is connected with the movable transmission part and is in sliding connection with the movable guide rail, and the other end of the movable sliding table is connected with the rotating mechanism; and

and the movable driving piece is coupled with the controller, arranged on the movable shell and connected with the movable driving piece and used for driving the movable driving piece to rotate so as to enable the movable sliding table to move along the movable guide rail.

In some embodiments, the polishing apparatus further comprises:

the driving component is coupled with the controller and is connected with the polishing component and used for driving the polishing component to rotate along an axial direction so as to adjust the polishing angle of the polishing component relative to the workpiece;

and the third moving assembly is coupled with the controller and connected with the driving assembly and is used for driving the driving assembly and the polishing assembly to move along a third direction different from the first direction and the second direction so as to enable the polishing assembly to be close to or far away from the workpiece.

In some embodiments, the rotation mechanism comprises:

a fixing assembly for fixing the workpiece;

and the rotating assembly is coupled with the controller, is positioned between the fixed assembly and the movement compensation assembly, is respectively connected with the fixed assembly and the movement compensation assembly, and is used for driving the fixed assembly and the workpiece to rotate.

In some embodiments, the inductor is located between the fixed component and the rotating component and is connected to the fixed component and the rotating component respectively.

In some embodiments, the rotating assembly comprises:

one end of the rotating shaft is connected with the fixing component;

a coupling member connected to the other end of the rotating shaft;

and the rotary driving part is coupled with the controller, is in transmission connection with the coupling part and is used for driving the coupling part to drive the rotating shaft to rotate.

The present application also provides a polishing method for controlling a polishing apparatus to polish a workpiece, comprising:

and controlling at least one of the workpiece to rotate, move along the first direction, move along the second direction and compensate and move so that the workpiece moves relative to a polishing component in the polishing device to polish.

The polishing method provided by the application can enable the workpiece to move relative to the polishing component in the polishing equipment for polishing by controlling at least one of the rotation of the workpiece, the movement along the first direction, the movement along the second direction and the compensation movement, so that the acting force between the polishing component and the workpiece can be automatically compensated and adjusted, the polishing quantity of the polishing component to the workpiece is uniform, and the polishing quality and the production efficiency of the workpiece are favorably improved.

In some embodiments, the polishing method further comprises:

controlling the workpiece to move to an initial position corresponding to the polishing assembly, and enabling the workpiece to abut against the polishing assembly;

and controlling the polishing assembly to rotate so as to adjust the polishing angle of the polishing assembly to the workpiece.

In some embodiments, the polishing method further comprises:

acquiring acting force applied when the workpiece props against the polishing component;

and controlling the workpiece to perform compensation movement so that the acting force is within a preset range.

In some embodiments, the polishing method further comprises:

controlling the polishing assembly to move in a third direction different from the first direction and the second direction so that the acting force falls within a preset range.

In some embodiments, wherein the controlling the workpiece to rotate, move in the first direction, move in the second direction, and move in the compensation direction to move the workpiece relative to a polishing assembly in the polishing apparatus for polishing comprises:

controlling the workpiece to move a first preset distance along the first direction so that the workpiece moves relative to the polishing component along the first direction for polishing;

controlling the workpiece to rotate by a first preset angle and move along at least one of the first direction and the second direction, wherein the second direction is not the same as the first direction, so that the workpiece moves relative to the polishing assembly to perform polishing when rotating;

controlling the workpiece to move a second preset distance along the first direction so that the workpiece moves relative to the polishing assembly along the first direction for polishing;

controlling the workpiece to rotate by a second preset angle and move along at least one of the first direction and the second direction, so that the workpiece moves relative to the polishing component to be polished when rotating, and returns to the initial position;

and controlling the workpiece to move along the direction of compensation movement for a compensation preset distance so that the acting force applied when the workpiece is abutted against the workpiece belongs to a preset range.

In some embodiments, wherein the direction of the compensating movement comprises the first direction and the second direction.

Drawings

Fig. 1 is a schematic perspective view of a polishing apparatus according to some embodiments of the present disclosure.

Fig. 2 is an exploded view of the fixing device shown in fig. 1.

Fig. 3 is a schematic view of a state in which a polishing apparatus according to some embodiments polishes a 3D surface of a workpiece.

Fig. 4 is a schematic view of a state in which a polishing apparatus according to some embodiments polishes a side surface of a workpiece.

FIG. 5 is a schematic diagram of a polishing arrangement polishing a top surface of a workpiece according to some embodiments.

Fig. 6 is a schematic view of the inductor and the connection board shown in fig. 2.

Fig. 7 is an exploded view of the motion compensation module shown in fig. 2.

Fig. 8 is an exploded view of the first and second moving assemblies shown in fig. 2.

Fig. 9 is an exploded view of the polishing apparatus shown in fig. 1.

FIG. 10 is a schematic flow chart of a polishing method provided in some embodiments of the present application.

Fig. 11 is a detailed flowchart of S10 shown in fig. 10.

Description of the main elements

Polishing apparatus 100

Polishing device 10

Polishing assembly 11

Drive assembly 12

Third moving assembly 13

Third casing 131

Third guide rail 132

Third transmission member 133

Third slide table 134

Third driving member 135

Third slider 136

Third sliding seat 137

The third cushion member 138

Carrier 14

Support 15

Fastening device 20

Rotating mechanism 21

Fixing component 211

Rotating assembly 212

Rotating shaft 2121

Coupling member 2122

Rotary drive 2123

Rotating base 2124

Inductor 22

Induction housing 221

Sensing member 222

Signal transmission member 223

Seal 224

Motion compensation assembly 23

Movable casing 231

Moving guide 232

Movable transmission member 233

Movable sliding table 234

Movable driving piece 235

Movable slide block 236

Movable sliding seat 237

First moving assembly 24

First case 241

First guide rail 242

First transmission member 243

First sliding table 244

First driving member 245

First slider 246

First sliding seat 247

First cushion 248

Second moving assembly 25

Second housing 251

Second guide rail 252

Second transmission part 253

Second slide table 254

Second driving member 255

Second slider 256

Second sliding seat 257

Second dampener 258

Connecting plate 26

Abutting part 261

Workpiece 200

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, it is to be noted that the meaning of "a plurality" is two or more unless specifically defined otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be mechanically coupled, electrically coupled, or in communication with each other, directly coupled, or indirectly coupled through intervening media, in which case they may be interconnected, or in which case they may be in an interconnecting relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise direct contact between the first and second features through another feature in between. Also, the first feature "on," "above" and "over" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal thickness of the first feature is higher than that of the second feature. A first feature "under," "below," and "beneath" a second feature includes a first feature that is directly under and obliquely below the second feature, or simply means that the first feature is less horizontally thick than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

An embodiment of the present application provides a polishing apparatus, including: a polishing apparatus including a moving polishing assembly for polishing a workpiece; a fixture, comprising: the rotating mechanism is used for fixing and driving the workpiece to rotate; the sensor is connected with the rotating mechanism and used for sensing the acting force applied to the workpiece during polishing; the movement compensation assembly is connected with the rotating mechanism and is used for driving the rotating mechanism to move so as to enable the workpiece to perform compensation movement; the first moving assembly is connected with the movement compensation assembly and is used for driving the movement compensation assembly and the rotating mechanism to move along a first direction; the second moving assembly is connected with the first moving assembly and used for driving the first moving assembly to move along a second direction different from the first direction; and the controller is respectively coupled with the polishing device and the fixing device and is used for controlling the polishing assembly to rotate so as to adjust the polishing angle of the polishing assembly relative to the workpiece and also used for controlling the fixing device to drive the workpiece to rotate, move along the first direction, move along the second direction and compensate at least one of movement, so that the workpiece moves relative to the polishing assembly to polish.

Above-mentioned polishing equipment, through the polishing subassembly motion among the burnishing device polish the work piece, the effort that receives when the inductor response work piece among the fixing device polishes, the motion compensation subassembly drives rotary mechanism according to the effort that the inductor responded to and removes in order to carry out compensation to the work piece for the effort between polishing subassembly and the work piece can carry out automatic compensation and adjust, makes the polishing subassembly even to the polishing volume of work piece, is favorable to promoting the polishing quality and the production efficiency of work piece.

The embodiment of the present application also provides a polishing method, for controlling a polishing apparatus to polish a workpiece, including: and controlling at least one of the workpiece to rotate, move in the first direction, move in the second direction and compensate for movement so that the workpiece moves relative to a polishing assembly in the polishing apparatus for polishing.

According to the polishing method, the workpiece is moved relative to the polishing component in the polishing equipment for polishing by controlling at least one of the rotation of the workpiece, the movement along the first direction, the movement along the second direction and the compensation movement, so that the acting force between the polishing component and the workpiece can be automatically compensated and adjusted, the polishing amount of the workpiece by the polishing component is uniform, and the polishing quality and the production efficiency of the workpiece are favorably improved.

Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 illustrates a polishing apparatus according to some embodiments of the present application. The polishing apparatus 100 is used for polishing a workpiece 200, and the workpiece 200 may be a conventional material such as a mobile phone frame, a back shell, etc., or a material with a contoured surface, but is not limited thereto. The polishing apparatus 100 includes a polishing device 10, a holding device 20, and a controller (not shown).

The polishing apparatus 10 includes a polishing assembly 11 that is in motion for polishing the workpiece 200, it being understood that the polishing assembly 11 is in a dynamic arrangement.

Referring also to fig. 2, the fixing device 20 may include a rotation mechanism 21, a sensor 22, a motion compensation assembly 23, a first moving assembly 24, and a second moving assembly 25.

The rotating mechanism 21 is used for fixing and rotating the workpiece 200 so that the workpiece 200 can move relative to the polishing assembly 11 to be polished by the polishing assembly 11. The sensor 22 is connected with the rotating mechanism 21, the sensor 22 is used for sensing an acting force applied to the workpiece 200 during polishing, the acting force can be understood as an interaction force generated between the polishing assembly 11 and the workpiece 200 during polishing of the workpiece 200 by the polishing assembly 11, and if the acting force is larger, the polishing amount of the workpiece 200 by the polishing assembly 11 is larger; conversely, if the force is smaller, the polishing amount of the workpiece 200 by the polishing assembly 11 is smaller. Both of these conditions can affect the polishing yield of the workpiece 200. The motion compensation assembly 23 is connected to the rotating mechanism 21, and the motion compensation assembly 23 is configured to drive the rotating mechanism 21 to move so as to compensate the movement of the workpiece 200, so that the acting force between the polishing assembly 11 and the workpiece 200 falls within a predetermined range. The first moving assembly 24 is connected to the movement compensation assembly 23 for moving the movement compensation assembly 23 and the rotating mechanism 21 along the first direction. The second moving assembly 25 is connected to the first moving assembly 24 for driving the first moving assembly 24 to move along a second direction different from the first direction. The direction of the compensation movement may be one of the first direction, the second direction, or another direction synthesized by the first direction and the second direction, but is not limited thereto.

For convenience of explanation, in the present application, the first direction is defined as an X-axis direction as shown in fig. 1, and the second direction is defined as a Y-axis direction as shown in fig. 1. In this embodiment, the first direction is perpendicular to the second direction.

It is understood that in other embodiments, the first direction and the second direction may not be perpendicular, and the included angle between the first direction and the second direction may be 30 °, 45 °, 60 °, 75 °, and the like.

The controller is coupled to the polishing apparatus 10 and the fixing apparatus 20, respectively, and it is also understood that the controller can also be coupled to the rotating mechanism 21, the sensor 22, the motion compensation assembly 23, the first moving assembly 24, and the second moving assembly 25, and the controller is configured to control the carrier 14 to rotate along the central axis to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200, in this embodiment, the central axis of the carrier 14 is perpendicular to the rotation axis of the polishing assembly 11. The controller is further configured to control the fixing device 20 to drive at least one of the workpiece 200 to rotate, move in the first direction, move in the second direction, and perform the compensation movement, so as to enable the workpiece 200 to move relative to the polishing assembly 11 for polishing, and it is also understood that the controller is further configured to control at least one of the rotating mechanism 21 to drive the workpiece 200 to rotate, the first moving assembly 24 to indirectly drive the workpiece 200 to move in the first direction, the second moving assembly 25 to indirectly drive the workpiece 200 to move in the second direction, and the movement compensation assembly 23 to drive the workpiece 200 to perform the compensation movement. It will be appreciated that the polishing assembly 11 itself is rotatable, i.e., about its own axis, for the purpose of polishing the workpiece 200, but that movement of the polishing assembly 11 and rotation to adjust the angle of polishing of the workpiece 200 is carried by the carrier 14.

Some embodiments provide a polishing apparatus 100 that performs substantially as follows: first, a workpiece 200 to be polished is fixed to the rotating mechanism 21; then, the controller controls the first moving assembly 24 and the second moving assembly 25 to drive the workpiece 200 to make a profiling motion similar to the shape of the workpiece itself, so that the workpiece 200 is in contact with the polishing assembly 11 for polishing; then, the controller controls the polishing assembly 11 to rotate to a preset angle, so that the polishing assembly 11 polishes the workpiece 200 at a proper polishing angle; then, the controller controls the first moving assembly 24, the second moving assembly 25 and the rotating mechanism 21 to cooperate with each other to make the workpiece 200 perform a profiling motion with respect to the polishing assembly 11 to perform polishing until the polishing of the workpiece 200 is completed. During the polishing process of the workpiece 200 moving relative to the polishing assembly 11, the sensor 22 senses the acting force applied to the workpiece 200 during the polishing process in real time and transmits the acting force to the controller in the form of a data signal, and the controller determines whether the acting force is larger or smaller according to the data signal. When the controller determines that the acting force is larger or smaller, the controller further controls the movement compensation assembly 23 to drive the rotation mechanism 21 to move, so that the workpiece 200 performs compensation movement, and the acting force between the workpiece 200 and the polishing assembly 11 falls within a preset range. For example, when the controller determines that the acting force is too large, which indicates that the workpiece 200 and the polishing assembly 11 are too tightly abutted, the controller controls the movement compensation assembly 23 to drive the workpiece 200 to move in a direction away from the polishing assembly 11, so that the interference between the workpiece 200 and the polishing assembly 11 is moderate, and the acting force between the workpiece 200 and the polishing assembly 11 falls within a preset range.

Referring to fig. 3, some embodiments provide a polishing apparatus 100 for polishing a 3D surface of a workpiece 200, where the 3D surface of the workpiece 200 can also be understood as an arc surface of the workpiece 200. The polishing assembly 11 of the polishing apparatus 100 rotates to a predetermined angle α to polish the 3D surface of the workpiece 200. When the polishing assembly 11 polishes the workpiece 200, the sensor 22 senses that the workpiece 200 is subjected to a force F, which may be a combination of a horizontal force Fx and a vertical force Fz, where Fx is Fcos α and Fz is Fsin α, and it is also understood that the horizontal force Fx and the vertical force Fz are applied to the workpiece 200. Illustratively, the range of the horizontal force between the workpiece 200 and the polishing assembly 11 is Fx ', and the range of the vertical force is Fz', which indicates that the force between the workpiece 200 and the polishing assembly 11 falls within a predetermined range. However, when Fx is greater than or less than Fx 'and Fz is greater than or less than Fz', both of them indicate that the force between the workpiece 200 and the polishing assembly 11 does not fall within a predetermined range, and the polishing apparatus 100 needs to compensate. For example, when Fx > Fx ', indicating that the horizontal force between the workpiece 200 and the polishing assembly 11 is large, the controller controls the motion compensation assembly 23 to move the workpiece 200 away from the polishing assembly 11 in the horizontal direction, such that Fx ═ Fx'. When Fx < Fx ', which indicates that the horizontal force between the workpiece 200 and the polishing assembly 11 is small, the controller controls the motion compensation assembly 23 to move the workpiece 200 close to the polishing assembly 11 in the horizontal direction, so that Fx is Fx'. When Fz > Fz ', indicating that the vertical force between the workpiece 200 and the polishing assembly 11 is larger, the controller controls the motion compensation assembly 23 to move the workpiece 200 away from the polishing assembly 11 in the horizontal direction, and in other embodiments, the controller may also control the polishing apparatus 10 to move the polishing assembly 11 away from the workpiece 200 in the vertical direction, so that Fz is equal to Fz'. When Fz < Fz ', indicating that the vertical force between the workpiece 200 and the polishing assembly 11 is small, the controller controls the motion compensation assembly 23 to move the workpiece 200 to approach the polishing assembly 11 in the horizontal direction, and in other embodiments, the controller may also control the polishing apparatus 10 to move the polishing assembly 11 to approach the workpiece 200 in the vertical direction, so that Fz is equal to Fz'. In this way, the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, so that the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform.

Referring to fig. 4, some embodiments provide a polishing apparatus 100 that polishes the side of a workpiece 200. The polishing assembly 11 of the polishing apparatus 100 is perpendicular to the side of the workpiece 200 to polish the side of the workpiece 200. When the polishing assembly 11 polishes the workpiece 200, the sensor 22 senses that the force F applied to the workpiece 200 is a combination of the forces Fx only in the horizontal direction, and no force is generated between the workpiece 200 and the polishing assembly 11 in the vertical direction. Illustratively, when the range of the horizontal direction force between the workpiece 200 and the polishing assembly 11 is Fx', it means that the force between the workpiece 200 and the polishing assembly 11 falls within a preset range. However, when Fx is greater or less than Fx', both indicating that the force between the workpiece 200 and the polishing assembly 11 does not fall within the predetermined range, the polishing apparatus 100 needs to compensate. For example, when Fx > Fx ', indicating that the horizontal force between the workpiece 200 and the polishing assembly 11 is large, the controller controls the motion compensation assembly 23 to move the workpiece 200 away from the polishing assembly 11 in the horizontal direction, such that Fx ═ Fx'. When Fx < Fx ', which indicates that the horizontal force between the workpiece 200 and the polishing assembly 11 is small, the controller controls the motion compensation assembly 23 to move the workpiece 200 close to the polishing assembly 11 in the horizontal direction, so that Fx is Fx'. In this way, the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, so that the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform.

Referring to fig. 5, some embodiments provide a polishing apparatus 100 for polishing a top surface of a workpiece 200. The polishing assembly 11 of the polishing apparatus 100 is perpendicular to the top surface of the workpiece 200 to polish the top surface of the workpiece 200. When the polishing assembly 11 polishes the workpiece 200, the sensor 22 senses that the force F applied to the workpiece 200 is a combined force Fz in the vertical direction, and the workpiece 200 is not applied to the polishing assembly 11 in the horizontal direction. Illustratively, when the range of the vertical force between the workpiece 200 and the polishing assembly 11 is Fz', it means that the force between the workpiece 200 and the polishing assembly 11 falls within a predetermined range. However, when Fz is greater or less than Fz', both indicating that the force between the workpiece 200 and the polishing assembly 11 does not fall within the predetermined range, the polishing apparatus 100 needs to compensate. For example, when Fz > Fz ', which indicates that the vertical force between the workpiece 200 and the polishing assembly 11 is larger, the controller controls the motion compensation assembly 23 to move the workpiece 200 away from the polishing assembly 11 in the vertical direction, or controls the polishing apparatus 10 to move the polishing assembly 11 away from the workpiece 200 in the vertical direction, so that Fz is equal to Fz'. When Fz < Fz ', which indicates that the vertical force between the workpiece 200 and the polishing assembly 11 is small, the controller controls the motion compensation assembly 23 to move the workpiece 200 to approach the polishing assembly 11 in the vertical direction, or controls the polishing apparatus 10 to move the polishing assembly 11 to approach the workpiece 200 in the vertical direction, so that Fz is equal to Fz'. In this way, the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, so that the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform.

In some embodiments, a polishing apparatus 100 is further provided, the workpiece 200 is polished by the movement of the polishing component 11 in the polishing device 10, the sensor 22 in the fixing device 20 senses an acting force applied when the workpiece 200 is polished, and the controller controls the movement compensation component 23 to drive the rotation mechanism 21 to move according to the acting force so as to compensate and move the workpiece 200, so that the acting force between the polishing component 11 and the workpiece 200 can be automatically compensated and adjusted, the acting force between the polishing component 11 and the workpiece 200 is within a preset range, and the polishing amount of the workpiece 200 by the polishing component 11 is uniform, which is beneficial to improving the polishing quality and the production efficiency of the workpiece 200.

In some embodiments, the controller may be a touch-operated device, and the touch-operated device may include a processor (not shown) for receiving data, processing data, and sending data, a memory (not shown) for storing data and instructions, which can be read and executed by the processor, and a display (not shown) for displaying information, receiving touch instructions, and sending the touch instructions to the processor.

It is understood that in other embodiments, the controller may be a computer device, a Central Processing Unit (CPU), a general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, a discrete hardware component, or the like. The controller is a control center of the above-described polishing apparatus 100, and connects the respective parts of the entire polishing apparatus 100 with various interfaces and lines.

In some embodiments, rotation mechanism 21 may include a stationary assembly 211 and a rotating assembly 212.

The fixing member 211 is used to fix the workpiece 200. The rotating assembly 212 is coupled to the controller, the rotating assembly 212 is located between the fixing assembly 211 and the motion compensation assembly 23, and is connected to the fixing assembly 211 and the motion compensation assembly 23, respectively, and the rotating assembly 212 is configured to drive the fixing assembly 211 and the workpiece 200 to rotate.

Illustratively, the fixing component 211 is adapted to fix one end of the workpiece 200 and can be used to support the workpiece 200 or to support the workpiece 200. The rotational assembly 212 includes a rotational shaft 2121, a coupling 2122, and a rotational drive 2123. One end of the rotational shaft 2121 is connected to the fixed member 211 such that the fixed member 211 can rotate along with the rotational shaft 2121; a coupling member 2122 is connected to the other end of the rotary shaft 2121; the rotational driving member 2123 is coupled to the controller and is in transmission connection with the coupling member 2122, and the rotational driving member 2123 is used for driving the coupling member 2122 to rotate the rotational shaft 2121. The rotary driver 2123 may be a servo motor, and the coupling member 2122 allows the driving force of the rotary driver 2123 to be transmitted in different directions. Thus, the rotating mechanism 21 is compact, reasonable and stable in structure.

In some embodiments, the rotation mechanism 21 may also include a rotational mount 2124. The rotating base 2124 has a substantially short cylindrical shape, the diameter of the rotating base 2124 is larger than that of the rotating shaft 2121, one end of the rotating base 2124 is connected to the fixed member 211, and the other end of the rotating base 2124 is connected to the rotating shaft 2121. In this way, the connection between the fixed component 211 and the rotating component 212 is simple and stable. Obviously, the rotational mount 2124 may also be omitted.

It will be appreciated that in other embodiments, the rotational drive 2123 may also be directly connected to the rotational shaft 2121. Thus, the coupling 2122 may be omitted.

It is understood that, in other embodiments, the end of the fixing component 211 for fixing the workpiece 200 may also be a suction cup or a vacuum nozzle, which sucks the workpiece 200 by vacuum negative pressure to avoid the workpiece 200 from being hit, scraped or crushed by the fixing component 211 when fixing the workpiece 200.

Referring to fig. 6, in some embodiments, the inductor 22 may include an induction housing 221, and an induction member 222, a signal transmission member 223 and a sealing member 224 disposed on the induction housing 221. The induction housing 221 has a substantially circular plate shape. The sensing member 222 is used for sensing the force applied to the workpiece 200 during polishing, and the sensing member 222 is located approximately at the middle of the sensing housing 221. The sealing member 224 is disposed around the sensing member 222 in the sensing housing 221, the sealing member 224 may be a sealing rubber ring or a sealing silicone ring, and the sealing member 224 is used to seal the sensing member 222, so as to prevent the sensing member 222 from being damaged or interfered due to contamination of polishing solution and dust. The signal transmission member 223 is connected to the sensing member 222 and protrudes from the sensing housing 221 to be coupled to the controller, and the signal transmission member 223 is used for transmitting a data signal sensed by the sensing member 222.

The induction housing 221 is located between the rotating mechanism 21 and the motion compensation assembly 23, and is connected to the rotating mechanism 21 and the motion compensation assembly 23, respectively. The sensing member 222 is abutted against the rotating mechanism 21 for sensing the acting force transmitted by the rotating mechanism 21.

It is understood that in other embodiments, the sensing housing 221 of the sensor 22 may be located between the fixed component 211 and the rotating component 212 and connected to the fixed component 211 and the rotating component 212, respectively, and the sensing element 222 abuts against the fixed component 211. Accordingly, the motion compensation assembly 23 is coupled to the rotation assembly 212.

In some embodiments, the fixture 20 may further include a connecting plate 26. The connection plate 26 is substantially plate-shaped, and the connection plate 26 is located between the rotation mechanism 21 and the induction housing 221, and is connected to the rotation mechanism 21 and the induction housing 221, respectively. Therefore, the rotating mechanism 21 is supported by the connecting plate 26, so that the force transmission is facilitated, the induction precision of the inductor 22 is improved, and the error is reduced.

It is understood that in other embodiments, when the sensing housing 221 of the sensor 22 is located between the fixed component 211 and the rotating component 212, the connection plate 26 is located between the fixed component 211 and the sensing housing 221 and connected to the fixed component 211 and the sensing housing 221, respectively.

In some embodiments, the sensing element 222 protrudes from the sealing element 224 in a direction facing the connection plate 26, which can be understood as the sensing element 222 is higher than the sealing element 224 along the Z-axis as shown in fig. 6, so that the sensing element 222 is substantially a convex structure. The side of the connecting plate 26 facing the sensing casing 221 has a protruding abutting portion 261, and when the connecting plate 26 is connected to the sensing casing 221, the abutting portion 261 abuts against the sensing piece 222. So, butt through bellied butt portion 261 and response 222 for be interference zonulae occludens between connecting plate 26 and the response 222, be favorable to conducting the effort that receives the connecting plate 26 to response 222, improve the response precision of response 222, reduce the error.

It is understood that in other embodiments, the sensing member 222 may protrude from the side of the sensing shell 221 facing the connection board 26. Therefore, the sensing part 222 is tightly connected with the connecting plate 26 in an interference manner, so that the sensing precision of the sensing part 222 is improved, and the error is reduced.

Referring to fig. 7, in some embodiments, the motion compensation assembly 23 may include a moving housing 231, a moving guide 232, a moving transmission member 233, a moving slide 234, and a moving driving member 235.

The movable housing 231 is used for accommodating and carrying the movable guide rail 232, the movable transmission member 233, the movable sliding table 234 and the movable driving member 235, and the movable housing 231 is connected with the first movable assembly 24. The number of the moving rails 232 is two, and the two moving rails 232 are disposed in the moving housing 231 and both extend along the movement compensation direction, in this embodiment, the movement compensation direction is a first direction, i.e., the direction is close to or away from the polishing assembly 11 along the X-axis direction, so as to control the acting force between the polishing assembly 11 and the workpiece 200 within a preset range, but the movement compensation direction is not limited thereto. The moving transmission member 233 is rotatably disposed on the moving housing 231 and located between the two moving guide rails 232, and the moving transmission member 233 extends along the movement compensation direction. The movable sliding table 234 is substantially plate-shaped, one side of the movable sliding table 234 is slidably connected to the movable transmission member 233 and the movable guide rail 232, and the other side of the movable sliding table 234 is connected to the rotating mechanism 21 or the sensing housing 221. The movable driving member 235 is coupled to the controller, the movable driving member 235 is disposed on the movable housing 231 and connected to the movable transmission member 233, and the movable driving member 235 is used for driving the movable transmission member 233 to rotate so as to move the movable sliding table 234 along the extending direction of the movable guide rail 232.

In some embodiments, motion compensation assembly 23 may further include a moving slide 236 and a moving slide mount 237. The number of the movable sliding blocks 236 is four, and every two movable sliding blocks are arranged on one movable guide rail 232; the movable sliding seat 237 is slidably disposed on the movable transmission member 233, and the movable sliding seat 237 moves relative to the movable transmission member 233 when the movable transmission member 233 rotates. Accordingly, one side of the moving slide table 234 is connected to the moving slider 236 and the moving slide block 237, and moves along the extending direction of the moving rail 232 following the moving slide block 237.

The moving transmission member 233 and the moving slide seat 237 may be substantially of a ball screw structure. The moving driving member 235 may be a servo motor, and the moving transmission member 233 is rotatably connected to the moving housing 231 through a bearing. It is understood that the number of the moving blocks 236 may also be two, three, five, six or more.

It is understood that in other embodiments, the motion compensation assembly 23 may also be a linear air cylinder mechanism, and the rotating mechanism 21 or the sensing housing 221 is connected to the output end of the linear air cylinder mechanism. In this manner, the motion compensation assembly 23 is still capable of achieving compensated motion of the workpiece 200.

Referring to fig. 8, in some embodiments, the first moving assembly 24 may include a first housing 241, a first guide rail 242, a first transmission member 243, a first sliding table 244, a first driving member 245, a first sliding block 246, a first sliding seat 247, and a first buffering member 248.

The first housing 241 is used for accommodating and carrying the first guide rail 242, the first transmission member 243, the first sliding table 244, the first driving member 245, the first sliding block 246, the first sliding seat 247 and the first buffer member 248, and the first housing 241 is connected with the second moving assembly 25. The number of the first guide rails 242 is two, the two first guide rails 242 are oppositely disposed in the first housing 241 and extend along the first direction, and the number of the first sliders 246 is four, and two first guide rails 242 are disposed on each first guide rail. The first transmission member 243 is disposed in the first casing 241 and located between the two first guide rails 242, and the first transmission member 243 extends along the first direction. The first sliding seat 247 is slidably disposed on the first transmission member 243. The first driving member 245 is connected to one end of the first transmission member 243, and the first driving member 245 is configured to drive the first transmission member 243 to rotate, so that the first sliding seat 247 moves along the first transmission member 243, that is, the first sliding seat 247 moves along the first direction. The first sliding table 244 is substantially plate-shaped, one side of the first sliding table 244 is connected to the first sliding seat 247 and the first sliding block 246, and the first sliding table 244 moves along the first direction under the driving of the first sliding seat 247. The other side of the first sliding table 244 is connected to the movable housing 231 of the motion compensation assembly 23, so that the motion compensation assembly 23 is driven by the first sliding table 244 to move along the first direction. The number of the first buffering members 248 is two, and the two first buffering members 248 are respectively disposed on two sides of the first sliding table 244 along the first direction, and the first buffering members 248 have elasticity and provide buffering force when the first sliding table 244 moves excessively along the first direction.

It is understood that in other embodiments, the first sliding table 244 and the first buffering member 248 may be omitted, and thus the first sliding seat 247 is directly connected to the moving housing 231.

The first transmission member 243 and the first sliding seat 247 may be substantially of a ball screw structure, the first driving member 245 may be a servo motor, the first transmission member 243 may be rotatably connected with the first housing 241 through a bearing structure, and the first buffering member 248 may be an elastic member made of a rubber material. It is to be understood that the first damper 248 may be a spring or the like having elasticity, and the number of the first slider 246 may be two, three, five, six or more.

It is understood that in other embodiments, the first moving assembly 24 may also be a linear cylinder mechanism, and the moving housing 231 is connected to the output end of the first moving assembly 24. In this manner, the first movement assembly 24 is still able to effect movement of the movement compensation assembly 23 in the first direction.

In some embodiments, the second moving assembly 25 may include a second housing 251, a second guide rail 252, a second transmission 253, a second sliding table 254, a second driving element 255, a second sliding block 256, a second sliding seat 257 and a second buffer 258.

The second housing 251 is used for accommodating and carrying the second guide rail 252, the second transmission piece 253, the second sliding table 254, the second driving piece 255, the second sliding block 256, the second sliding seat 257 and the second buffer piece 258, and the second housing 251 can be used as a supporting structure of the fixing device 20. The number of the second guide rails 252 is two, the two second guide rails 252 are oppositely disposed in the second housing 251 and extend along the second direction, and the number of the second sliders 256 is four, and two second sliders 252 are disposed on one second guide rail. The second transmission piece 253 is disposed in the second housing 251 and located between the two second guide rails 252, and the second transmission piece 253 extends along the second direction. The second sliding seat 257 is slidably disposed on the second transmission member 253. The second driving member 255 is connected to one end of the second transmission member 253, and the second driving member 255 is used for driving the second transmission member 253 to rotate, so that the second sliding seat 257 moves along the second transmission member 253, that is, the second sliding seat 257 moves in the second direction. The second sliding table 254 is substantially plate-shaped, one side of the second sliding table 254 is connected to the second sliding seat 257 and the second sliding block 256, and the second sliding table 254 is driven by the second sliding seat 257 to move along the second direction. The other side of the second sliding table 254 is connected to the first casing 241, so that the first moving assembly 24 is driven by the second sliding table 254 to move along the second direction. The number of the second buffering members 258 is two, the two second buffering members 258 are respectively arranged on two sides of the second sliding table 254 along the second direction, and the second buffering members 258 have elasticity and provide buffering force for the second sliding table 254 when moving excessively along the second direction.

It is understood that in other embodiments, the second sliding table 254 and the second buffer 258 may be omitted, and thus the second sliding seat 257 is directly connected to the first housing 241.

The second transmission member 253 and the second sliding seat 257 may be substantially of a ball screw structure, the second driving member 255 may be a servo motor, the second transmission member 253 is rotatably connected with the second housing 251 through a bearing structure, and the second buffering member 258 may be an elastic member made of a rubber material. It is to be understood that the second buffer 258 may be a spring or the like having elasticity, and the number of the second slider 256 may be two, three, five, six or more.

It is understood that in other embodiments, the second moving assembly 25 may also be a linear cylinder mechanism, and the first housing 241 is connected to the output end of the second moving assembly 25. In this manner, the second moving assembly 25 is still able to effect movement of the first moving assembly 24 in the second direction.

Referring to fig. 9, in some embodiments, the polishing apparatus 10 may further include a driving assembly 12 and a third moving assembly 13.

The driving assembly 12 is coupled to the controller and connected to the polishing assembly 11, and the driving assembly 12 is used for driving the polishing assembly 11 to rotate along an axial direction so as to adjust a polishing angle of the polishing assembly 11 relative to the workpiece 200. The third moving assembly 13 is coupled to the controller and connected to the driving assembly 12, and the third moving assembly 13 is used for moving the driving assembly 12 and the polishing assembly 11 in a third direction different from the first direction and the second direction, so as to move the polishing assembly 11 close to or away from the workpiece 200. Wherein the third direction is a Z-axis direction as shown in fig. 9, and the third direction is perpendicular to the first direction and the second direction.

In some embodiments, the polishing apparatus 10 can further include a carrier 14 and a carrier 15.

The polishing assembly 11 is disposed on the carrier 14, and the dynamic arrangement of the polishing assembly 11 is understood to mean that the polishing assembly 11 is movable relative to the carrier 14 to polish the workpiece 200. The carrier 14 is rotatably disposed on the bracket 15 and is in transmission connection with the driving assembly 12, and the driving assembly 12 is connected with the bracket 15 and can drive the carrier 14 to rotate along an axial direction, so that the polishing assembly 11 rotates along an axial direction, that is, the controller controls the driving assembly 12 to drive the carrier 14 to rotate, so as to drive the polishing assembly 11 to rotate. The support 15 is connected to the third moving assembly 13, and the support 15 drives the driving assembly 12, the carrier 14 and the polishing assembly 11 to move along the third direction under the driving of the third moving assembly 13. Axial direction is understood to mean the axis of the carrier 14.

It is understood that in other embodiments, the number of the polishing assemblies 11 may be two, three or more, and two, three or more polishing assemblies 11 are disposed on different surfaces of the carrier 14, so that the polishing assemblies 11 with different surfaces polish the workpiece 200, thereby reducing the wear of a single polishing assembly 11 and improving the service life of the polishing apparatus 100.

In some embodiments, the third moving assembly 13 may include a third housing 131, a third guide rail 132, a third transmission 133, a third sliding table 134, a third driving element 135, a third sliding block 136, a third sliding seat 137, and a third buffer 138.

The third housing 131 is used for accommodating and carrying a third guide rail 132, a third transmission piece 133, a third sliding table 134, a third driving piece 135, a third sliding block 136, a third sliding seat 137 and a third buffer piece 138, and the third housing 131 can be used as a supporting structure of the polishing device 10. The number of the third guide rails 132 is two, the two third guide rails 132 are oppositely disposed in the third housing 131 and extend along the third direction, the number of the third sliders 136 is four, and two third guide rails 132 are disposed on each other. The third transmission piece 133 is disposed in the third housing 131 and located between the two third guide rails 132, and the third transmission piece 133 extends along a third direction. The third sliding seat 137 is slidably disposed on the third transmission member 133. The third driving member 135 is connected to one end of the third transmission member 133, and the third driving member 135 is used for driving the third transmission member 133 to rotate, so that the third sliding seat 137 moves along the third transmission member 133, i.e. the third sliding seat 137 moves along the third direction. The third sliding table 134 is substantially plate-shaped, one side of the third sliding table 134 is connected to the third sliding seat 137 and the third sliding block 136, and the third sliding table 134 is driven by the third sliding seat 137 to move along the third direction. The other side of the third sliding table 134 is connected with the bracket 15, so that the bracket 15 is driven by the third sliding table 134 to move along the third direction. The number of the third cushion members 138 is two, and the third cushion members 138 are respectively disposed on two sides of the third sliding table 134 along the third direction, and the third cushion members 138 have elasticity and provide a cushion force when the third sliding table 134 moves excessively along the third direction.

It is understood that in other embodiments, the third sliding table 134 and the third buffer member 138 may be omitted, and thus the third sliding seat 137 is directly connected to the bracket 15.

The third transmission member 133 and the third sliding seat 137 may be substantially of a ball screw structure, the third driving member 135 may be a servo motor, the third transmission member 133 may be rotatably connected to the third housing 131 through a bearing structure, and the third buffer member 138 may be an elastic member made of a rubber material. It is to be understood that the third buffer 138 may also be a spring or the like having elasticity, and the number of the third slider 136 may also be two, three, five, six or more.

It is understood that in other embodiments, the third moving assembly 13 may also be a linear cylinder mechanism, and the support 15 is connected to the output end of the third moving assembly 13. In this manner, the third moving assembly 13 can still achieve movement of the support 15 in the third direction.

According to the polishing apparatus 100 provided by some embodiments, the rotating mechanism 21, the sensor 22, the motion compensation assembly 23, the first moving assembly 24, the second moving assembly 25, the controller, the driving assembly 12, and the third moving assembly 13 are mutually matched, so that the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, the acting force between the polishing assembly 11 and the workpiece 200 is within a preset range, the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform, the polishing quality of the workpiece 200 can be ensured, and the production efficiency of the workpiece 200 is further improved.

Referring to fig. 10, some embodiments of the present application further provide a polishing method for controlling a polishing apparatus 100 to polish a workpiece 200. The polishing apparatus 100 is exemplarily the polishing apparatus 100 provided in the above-described embodiment, but is not limited thereto. Taking the workpiece 200 as a mobile phone frame as an example for explanation, the mobile phone frame includes a long side, a short side, and an arc angle connecting the long side and the short side, and when the mobile phone frame is polished, the long side, the short side, and the arc angle of the mobile phone frame need to be polished. The order of the steps in the flow chart may be changed and some steps may be omitted according to different needs. For ease of illustration, only those portions of the present application that are relevant to some embodiments are shown. The polishing method includes the following steps.

S10, controlling at least one of the rotation, the movement in the first direction, the movement in the second direction and the compensation movement of the workpiece 200 to move the workpiece 200 relative to the polishing assembly 11 in the polishing apparatus 100 for polishing.

Illustratively, the controller controls the rotating mechanism 21 to drive the workpiece 200 to rotate, the first moving component 24 to drive the workpiece 200 to move along the first direction, the second moving component 25 to drive the workpiece 200 to move along the second direction, and the movement compensation component 23 to drive the rotating mechanism 21 to perform compensation movement, so that the long side, the short side and the arc angle of the workpiece 200 move and rub relative to the polishing component 11 to perform polishing, and meanwhile, the controller can automatically compensate and adjust the acting force between the workpiece 200 and the polishing component 11, thereby ensuring the polishing quality of the workpiece 200. Wherein the polishing assembly 11 is dynamically configured, the direction of motion compensation includes a first direction and a second direction, and may also include a direction synthesized by the first direction and the second direction, but is not limited thereto.

It is understood that in other embodiments, the polishing assembly 11 may be statically configured.

In some embodiments, step S10 may be preceded by step S2-step S4.

S2, the workpiece 200 is controlled to move to the initial position corresponding to the polishing assembly 11 and the workpiece 200 is caused to abut against the polishing assembly 11.

Illustratively, the controller controls at least one of the rotating mechanism 21, the first moving assembly 24 and the second moving assembly 25 of the fixing device 20 to move, so that the long edge of the mobile phone frame is abutted against the polishing assembly 11, and the position where the long edge is abutted against the polishing assembly 11 is one end close to the corresponding arc angle. It should be noted that the initial position is a spatial position where one end of the long side of the mobile phone frame close to the corresponding arc angle abuts against the polishing component 11.

It is understood that in other embodiments, the initial position may also be a spatial position where one end of the short side of the handset bezel near the corresponding arc angle abuts against the polishing assembly 11.

S4, controlling the polishing assembly 11 to rotate to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200.

Illustratively, the controller controls the driving assembly 12 to drive the polishing assembly 11 to rotate in an axial direction, so as to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200, so that the polishing assembly 11 better conforms to the surface of the workpiece 200.

It is understood that in other embodiments, step S4 may be omitted, and step S4 may be located after step S10.

In some embodiments, step S10 may be followed by steps S20-S30.

S20, the force to which the workpiece 200 is subjected when it abuts against the polishing assembly 11 is obtained.

Illustratively, the controller controls the sensor 22 to acquire the force experienced by the workpiece 200 as it impacts the polishing assembly 11, and the sensor 22 transmits a sensed force signal to the controller. The controller judges whether the acting force belongs to a preset range. The sensor 22 senses the workpiece 200 to be subjected to a force F, which may be a combination of a horizontal force Fx and a vertical force Fz, where Fx is Fcos α and Fz is Fsin α, and it is also understood that the workpiece 200 is subjected to a horizontal force Fx and a vertical force Fz is a predetermined angle of the polishing assembly 11 relative to the workpiece 200, and the range is 0 ° to 90 °. Illustratively, the range of the horizontal force between the workpiece 200 and the polishing assembly 11 is Fx ', and the range of the vertical force is Fz', which indicates that the force between the workpiece 200 and the polishing assembly 11 falls within a predetermined range. However, when Fx is greater than or less than Fx 'and Fz is greater than or less than Fz', both of them indicate that the force between the workpiece 200 and the polishing assembly 11 does not fall within a predetermined range, and the polishing apparatus 100 needs to compensate.

If yes, it indicates that the acting force is within the preset range, and the polishing amount of the workpiece 200 by the polishing assembly 11 is satisfactory, the process proceeds to step S10.

If not, the action force is not within the preset range, and step S30 is executed.

S30, the workpiece 200 is controlled to perform the compensation movement so that the acting force falls within the preset range.

Illustratively, the controller controls the motion compensation assembly 23 to move the workpiece 200 for compensating motion. When the acting force is larger, the controller controls the motion compensation assembly 23 to drive the workpiece 200 to move towards the direction far away from the polishing assembly 11, so that the acting force is reduced to be within a preset range; on the contrary, when the acting force is smaller, the controller controls the motion compensation assembly 23 to drive the workpiece 200 to move towards the direction close to the polishing assembly 11, so that the acting force is increased to be within the preset range.

In some embodiments, if no, step S40 may also be performed.

And S40, controlling the polishing assembly 11 to move in a third direction different from the first direction and the second direction so that the acting force falls within a preset range.

Illustratively, the controller controls the third moving assembly 13 to move the polishing assembly 11 in the third direction, so as to move the polishing assembly 11 closer to or away from the workpiece 200, so that the acting force falls within the predetermined range.

It is understood that steps S30 and S40 can be performed simultaneously, and the steps S30 and S40 can be performed to automatically compensate the acting force between the workpiece 200 and the polishing assembly 11 in any direction, which is beneficial to improving the applicability of the polishing apparatus 100.

Referring to fig. 11, in some embodiments, step S10 may specifically include the following steps S102 to S110.

S102, controlling the workpiece 200 to move a first preset distance along the first direction, so that the workpiece 200 moves relative to the polishing assembly 11 along the first direction for polishing.

Illustratively, the controller controls the first moving assembly 24 to move the workpiece 200 by a first preset distance in a first direction, so that the long edge of the workpiece 200 moves and rubs relative to the polishing assembly 11 to polish the long edge of the workpiece 200. The first preset distance may be a length of the long side.

And S104, controlling the workpiece 200 to rotate by a first preset angle and move along at least one of a first direction and a second direction, wherein the second direction is not the same as the first direction, so that the workpiece 200 moves relative to the polishing assembly 11 to polish when rotating.

Illustratively, the controller controls the rotating mechanism 21 to rotate the workpiece 200 by a first predetermined angle, and controls the first moving component 24 to rotate the workpiece 200 in at least one of the first direction and the second moving component 25 to move the workpiece 200 in the second direction, so that the arc angle of the workpiece 200 moves and rubs against the polishing component 11 to perform polishing while the workpiece 200 rotates. Wherein, the first preset angle may be 90 °. It can be understood that, after the rotating mechanism 21 drives the workpiece 200 to rotate by the first preset angle, one end of the short side of the workpiece 200 close to the polished arc angle abuts against the polishing assembly 11.

S106, controlling the workpiece 200 to move a second preset distance along the first direction, so that the workpiece 200 moves relative to the polishing assembly 11 along the first direction for polishing.

Illustratively, the controller controls the first moving assembly 24 to move the workpiece 200 by a second preset distance along the first direction, so that the short side of the workpiece 200 moves and rubs against the polishing assembly 11 to polish, thereby polishing the short side of the workpiece 200. Wherein the second preset distance may be a length of the short side.

And S108, controlling the workpiece 200 to rotate by a second preset angle and move along at least one of the first direction and the second direction, so that the workpiece 200 moves relative to the polishing assembly 11 to polish when rotating, and returns to the initial position.

Illustratively, the controller controls the rotating mechanism 21 to rotate the workpiece 200 by a second predetermined angle, and controls the first moving component 24 to drive the workpiece 200 to move in at least one of the first direction and the second moving component 25 to drive the workpiece 200 to move in the second direction, so that the workpiece 200 rotates while the other arc angle of the workpiece 200 moves and rubs against the polishing component 11 to perform polishing. Wherein the second preset angle may be 90 °. It can be understood that, after the rotating mechanism 21 drives the workpiece 200 to rotate by the second preset angle, one end of the long edge of the workpiece 200 close to the polished arc angle is abutted against the polishing assembly 11, which means that the workpiece 200 returns to the initial position.

S110, controlling the workpiece 200 to move along the compensation moving direction for a compensation preset distance, so that the acting force applied when the workpiece 200 collides with the workpiece 200 falls within a preset range.

For example, when the acting force sensed by the sensor 22 exceeds a predetermined range, the controller controls the motion compensation assembly 23 to drive the workpiece 200 to move in the direction of the compensation motion for a compensation predetermined distance, so that the workpiece 200 and the polishing assembly 11 are close to or away from each other, and the acting force applied when the workpiece 200 abuts against the workpiece 200 falls within the predetermined range.

It is to be understood that since the sensor 22 senses the force between the workpiece 200 and the polishing assembly 11 in real time, the steps S110, S102, S104, S106, and S108 can be performed simultaneously or between any two steps.

Some embodiments provide a polishing method by controlling at least one of rotation, movement in a first direction, movement in a second direction, and compensation movement of the workpiece 200 to move the workpiece 200 relative to the polishing assembly 11 in the polishing apparatus 100 for polishing; by acquiring the acting force applied when the workpiece 200 abuts against the polishing assembly 11, the acting force between the polishing assembly 11 and the workpiece 200 can be automatically compensated and adjusted, so that the polishing amount of the workpiece 200 by the polishing assembly 11 is uniform, and the polishing quality and the production efficiency of the workpiece 200 are improved; by controlling the rotation of the polishing assembly 11 to adjust the polishing angle of the polishing assembly 11 relative to the workpiece 200, it is advantageous to perform a polishing operation on the contoured surface of the workpiece 200.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A polishing apparatus comprising:

a fixture, comprising:

the rotating mechanism is used for fixing and driving the workpiece to rotate;

2. The polishing apparatus according to claim 1, wherein the polishing apparatus,

the inductor comprises an induction shell, and an induction piece, a signal transmission piece and a sealing piece which are arranged on the induction shell;

the induction piece is abutted against the rotating mechanism.

3. The polishing apparatus of claim 2, the holding device further comprising:

4. The polishing apparatus according to claim 1, wherein the polishing apparatus,

the motion compensation component comprises:

a movable housing connected with the first movable assembly;

5. The polishing apparatus according to claim 1, wherein the polishing apparatus,

the polishing apparatus further includes:

6. The polishing apparatus according to claim 1, the rotating mechanism comprising:

a fixing assembly for fixing the workpiece;

7. The polishing apparatus according to claim 6, wherein the polishing apparatus,

the inductor is positioned between the fixed component and the rotating component and is respectively connected with the fixed component and the rotating component.

8. The polishing apparatus according to claim 6, wherein the polishing apparatus,

the rotating assembly includes:

one end of the rotating shaft is connected with the fixing component;

a coupling member connected to the other end of the rotating shaft;

9. A polishing method for controlling a polishing apparatus to polish a workpiece, comprising:

10. The polishing method of claim 9, further comprising:

11. The polishing method of claim 10, further comprising:

12. The polishing method of claim 11, further comprising:

13. The polishing method of claim 10, wherein the controlling at least one of the workpiece to rotate, move in a first direction, move in a second direction, and compensate for movement to move the workpiece relative to a polishing assembly in the polishing apparatus for polishing comprises:

14. The polishing method of claim 13, wherein the direction of the compensation movement comprises the first direction and the second direction.