CN218927393U

CN218927393U - Wafer polishing machine and wafer production system

Info

Publication number: CN218927393U
Application number: CN202122970562.7U
Authority: CN
Inventors: 肖宏海; 李小平
Original assignee: Shanghai Senyong Engineering Equipment Co ltd
Current assignee: Shanghai Senyong Engineering Equipment Co ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2023-04-28
Anticipated expiration: 2031-11-30

Abstract

The utility model discloses a wafer polishing machine and a wafer production system, and belongs to the technical field of wafer polishing. The wafer polishing machine comprises a telescopic cylinder, a bearing mounting seat is arranged at the telescopic end of the telescopic cylinder, and the wafer polishing machine further comprises: the spline shaft is rotationally arranged on the bearing mounting seat through a bearing so as to move along the axis of the spline shaft; the rotation driving mechanism comprises a transmission gear, and the transmission gear is arranged on the spline shaft and is used for driving the spline shaft to rotate; the elastic buffer component is movably sleeved on the spline shaft and is positioned between the bearing mounting seat and the transmission gear; when the telescoping cylinder reaches the stroke apex, the bearing mount is configured to abut the elastic buffer assembly. The direct hard contact between the bearing mounting seat on the telescopic cylinder and the transmission gear is avoided, the service life of the wafer polishing machine is prolonged, and the mass production of wafers is facilitated.

Description

Wafer polishing machine and wafer production system

Technical Field

The utility model relates to the technical field of wafer polishing, in particular to a wafer polishing machine and a wafer production system.

Background

The wafer polisher typically processes the workpiece surface by grinding to improve the finish of the wafer surface.

However, when the cylinder of the existing wafer polishing machine is completely pressed down and reaches the stroke top point (namely, the lower top point), the cylinder can directly press the bearing seat onto the transmission gear. The hard contact can damage the upper bearing and the transmission gear of the spline shaft, shortens the service life of the wafer polishing machine, and is not beneficial to mass production of wafers.

Therefore, it is desirable to provide a wafer polisher and a wafer production system for solving the above problems.

Disclosure of Invention

The utility model aims to provide a wafer polishing machine and a wafer production system, which avoid direct hard contact between an upper bearing of a cylinder and a transmission gear, prolong the service life of the wafer polishing machine and are beneficial to mass production of wafers.

In order to achieve the above object, the following technical scheme is provided:

the utility model provides a wafer burnishing machine, includes flexible cylinder, flexible end of flexible cylinder is provided with the bearing mount pad, still includes:

the spline shaft is rotationally arranged on the bearing mounting seat through a bearing so as to move along the axis of the spline shaft;

the rotation driving mechanism comprises a transmission gear, and the transmission gear is arranged on the spline shaft and is used for driving the spline shaft to rotate;

the elastic buffer component is movably sleeved on the spline shaft and is positioned between the bearing mounting seat and the transmission gear;

when the telescoping cylinder reaches the stroke apex, the bearing mount is configured to abut the elastic buffer assembly.

As the alternative scheme of wafer burnishing machine, elasticity buffer unit includes synchronizing block and elastic component, the synchronizing block with the elastic component is all movable sleeve locates the integral key shaft, just the elastic component set up in the synchronizing block is close to one side of bearing mount pad.

As an alternative scheme of the wafer polishing machine, the elastic piece is made of rubber materials.

As an alternative scheme of the wafer polishing machine, an avoidance groove is formed in one side, close to the transmission gear, of the synchronous block, and a fastening screw on the transmission gear is located in the avoidance groove.

As an alternative scheme of the wafer polishing machine, a plurality of fastening screws are arranged on the transmission gear, a plurality of avoidance grooves are formed in the synchronizing block at intervals around the periphery of the axis of the synchronizing block, and the plurality of avoidance grooves are arranged in one-to-one correspondence with the plurality of fastening screws.

As an alternative scheme of the wafer polishing machine, the synchronous block is provided with a first connecting hole, the elastic piece is provided with a second connecting hole, the first connecting holes are arranged in one-to-one correspondence with the second connecting holes, and the elastic piece passes through the second connecting holes through a fastener to be connected with the first connecting holes.

As the alternative scheme of wafer burnishing machine, still include the installation bed frame, the installation bed frame includes bracing piece, first mounting panel and second mounting panel, first mounting panel with the parallel interval of second mounting panel set up in the both ends of bracing piece, flexible end rigid coupling of flexible cylinder in first mounting panel is kept away from one side of second mounting panel, the bearing mount pad is inlayed and is located on the second mounting panel.

As an alternative scheme of the wafer polishing machine, a plurality of supporting rods are arranged between the first mounting plate and the second mounting plate at intervals.

As the alternative scheme of wafer burnishing machine, still include the abrasive disc subassembly, the abrasive disc subassembly set up in the spline shaft is kept away from the one end of bearing mount pad.

The wafer production system comprises a mechanical arm and any wafer polishing machine technical scheme, wherein the mechanical arm conveys wafers to a polishing disc of the wafer polishing machine.

Compared with the prior art, the utility model has the beneficial effects that:

according to the wafer polishing machine provided by the utility model, the spline shaft is rotatably arranged on the bearing mounting seat through the bearing, the telescopic cylinder can drive the spline shaft to move up and down, the transmission gear is arranged on the spline shaft, the elastic buffer component is arranged on the spline shaft and is positioned between the bearing mounting seat and the transmission gear, when the telescopic cylinder drives the spline shaft to reach the stroke top point, the bearing mounting seat is configured to be in butt joint with the elastic buffer component, so that the bearing mounting seat on the telescopic cylinder is prevented from being in direct hard contact with the transmission gear, the service life of the wafer polishing machine is prolonged, and the wafer polishing machine is beneficial to mass production of wafers.

According to the wafer production system provided by the utility model, the wafer is conveyed to the processing workbench of the wafer polishing machine through the manipulator, and the elastic buffer component is arranged between the bearing mounting seat and the transmission gear, so that the bearing mounting seat of the telescopic cylinder is prevented from being in direct hard contact with the transmission gear, the service life of the wafer polishing machine is prolonged, and the batch production of the wafer is facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following description will briefly explain the drawings needed in the description of the embodiments of the present utility model, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the contents of the embodiments of the present utility model and these drawings without inventive effort for those skilled in the art.

FIG. 1 is an assembly schematic of a wafer polisher according to an embodiment of the present utility model;

FIG. 2 is an exploded view of an elastic buffer assembly according to an embodiment of the present utility model;

fig. 3 is a schematic structural view of a mounting base frame according to an embodiment of the present utility model.

Reference numerals:

1. a telescopic cylinder; 2. a spline shaft; 3. a rotation driving mechanism; 4. an elastic buffer assembly; 5. installing a base frame; 6. a grinding disc assembly;

11. a bearing mounting seat;

21. a bearing; 22. a guide groove;

31. a transmission gear; 32. a fastening screw;

41. a synchronization block; 42. an elastic member; 43. an avoidance groove; 44. a first connection hole; 45. a second connection hole;

51. a first mounting plate; 52. a second mounting plate; 53. and (5) supporting the rod.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In order to avoid direct hard contact between the upper bearing of the cylinder and the transmission gear, and prolong the service life of the wafer polishing machine, the embodiment is beneficial to mass production of wafers, and the embodiment provides a wafer polishing machine, and details of the embodiment are described in detail below with reference to fig. 1 to 3.

As shown in fig. 1, the wafer polisher includes a telescopic cylinder 1, a spline shaft 2, a rotation driving mechanism 3, an elastic buffer assembly 4, a mounting pedestal 5, and a grinding disk assembly 6.

Wherein, the flexible end of flexible cylinder 1 is provided with bearing mount pad 11. The spline shaft 2 is rotatably provided to the bearing mount 11 via a bearing 21 so that the spline shaft 2 moves along its own axis. The rotation driving mechanism 3 includes a transmission gear 31, and the transmission gear 31 is disposed on the spline shaft 2 for driving the spline shaft 2 to rotate. The elastic buffer component 4 is movably sleeved on the spline shaft 2 and is positioned between the bearing mounting seat 11 and the transmission gear 31. When the telescopic cylinder 1 reaches the stroke apex, the bearing mount 11 is configured to abut against the elastic cushion assembly 4.

In short, the spline shaft 2 is rotatably arranged on the bearing mounting seat 11 through the bearing 21, the telescopic cylinder 1 can drive the spline shaft 2 to move up and down, the transmission gear 31 is arranged on the spline shaft 2, the elastic buffer component 4 is arranged on the spline shaft 2 and is positioned between the bearing mounting seat 11 and the transmission gear 31, when the telescopic cylinder 1 drives the spline shaft 2 to reach the stroke top point, the bearing mounting seat 11 is configured to be abutted with the elastic buffer component 4, the bearing mounting seat 11 on the telescopic cylinder 1 is prevented from being in direct hard contact with the transmission gear 31, the service life of the wafer polishing machine is prolonged, and the batch production of wafers is facilitated.

Further, the elastic buffer assembly 4 comprises a synchronizing block 41 and an elastic piece 42, the synchronizing block 41 and the elastic piece 42 are movably sleeved on the spline shaft 2, the elastic piece 42 is arranged on one side, close to the bearing mounting seat 11, of the synchronizing block 41, and the elastic piece 42 is made of rubber materials. By adding the elastic member 42, the bearing mount 11 is made to be in non-hard contact with the transmission gear 31, and the impact force of the bearing mount 11 on the transmission gear 31 is buffered.

Further, a relief groove 43 is formed in one side of the synchronizing block 41, which is close to the transmission gear 31, and the fastening screw 32 on the transmission gear 31 is located in the relief groove 43. The fastening screw 32 is positioned in the escape groove 43, avoiding direct contact of the fastening screw 32 with the elastic member 42.

Further, a plurality of fastening screws 32 are arranged on the transmission gear 31, a plurality of avoidance grooves 43 are circumferentially arranged on the synchronizing block 41 around the axis of the synchronizing block at intervals, and the plurality of avoidance grooves 43 are arranged in one-to-one correspondence with the plurality of fastening screws 32. The transmission gear 31 can also drive the synchronous block 41 to rotate during the rotation process.

Further, the synchronization block 41 is provided with a first connecting hole 44, the elastic member 42 is provided with a second connecting hole 45, the first connecting hole 44 and the second connecting hole 45 are arranged oppositely one by one, and the elastic member 42 passes through the second connecting hole 45 to be connected with the first connecting hole 44 through a fastener. By adding the first connection hole 44 and the second connection hole 45, the synchronization block 41 and the elastic member 42 can be firmly connected to each other.

Further, the wafer polishing machine further comprises a mounting base frame 5, the mounting base frame 5 comprises a supporting rod 53, a first mounting plate 51 and a second mounting plate 52, the first mounting plate 51 and the second mounting plate 52 are arranged at two ends of the supporting rod 53 at intervals in parallel, the telescopic end of the telescopic cylinder 1 is fixedly connected to one side, away from the second mounting plate 52, of the first mounting plate 51, and the bearing mounting seat 11 is embedded on the second mounting plate 52. Specifically, a plurality of support rods 53 are provided at intervals between the first mounting plate 51 and the second mounting plate 52. By adding the mounting base frame 5, the spline shaft 2 can be connected to the telescopic end of the telescopic cylinder 1.

Further, the wafer polisher further comprises a grinding disc assembly 6, wherein the grinding disc assembly 6 is arranged at one end of the spline shaft 2 away from the bearing mounting seat 11. The telescopic cylinder 1 moves downwards to drive the grinding disc assembly 6 to press down the wafer on the polishing disc.

Further, a guiding groove 22 is arranged on the outer peripheral surface of the spline shaft 2, and the guiding groove 22 extends along the axial direction of the spline shaft 2, so that the spline shaft 2 is ensured to always move along the axial direction of the spline shaft.

The present embodiment also provides a wafer production system including the above-mentioned wafer polisher and a robot that transfers a wafer to a polishing platen of the wafer polisher.

Note that the above is only a preferred embodiment of the present utility model and the technical principle applied. It will be understood by those skilled in the art that the present utility model is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the utility model. Therefore, while the utility model has been described in connection with the above embodiments, the utility model is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the utility model, which is set forth in the following claims.

Claims

1. The utility model provides a wafer burnishing machine, includes flexible cylinder (1), the flexible end of flexible cylinder (1) is provided with bearing mount pad (11), its characterized in that still includes:

the spline shaft (2) is rotatably arranged on the bearing mounting seat (11) through a bearing (21) so as to enable the spline shaft (2) to move along the axis of the spline shaft;

the rotation driving mechanism (3) comprises a transmission gear (31), wherein the transmission gear (31) is arranged on the spline shaft (2) and is used for driving the spline shaft (2) to rotate;

the elastic buffer component (4) is movably sleeved on the spline shaft (2) and is positioned between the bearing mounting seat (11) and the transmission gear (31);

when the telescopic cylinder (1) reaches the stroke vertex, the bearing mounting seat (11) is configured to abut against the elastic buffer assembly (4).

2. The wafer polishing machine according to claim 1, wherein the elastic buffer assembly (4) comprises a synchronizing block (41) and an elastic piece (42), the synchronizing block (41) and the elastic piece (42) are movably sleeved on the spline shaft (2), and the elastic piece (42) is arranged on one side, close to the bearing mounting seat (11), of the synchronizing block (41).

3. The wafer polisher according to claim 2, wherein the resilient member (42) is made of a rubber material.

4. Wafer polisher according to claim 2, characterized in that the side of the synchronizing block (41) close to the transmission gear (31) is provided with a avoidance groove (43), and the fastening screw (32) on the transmission gear (31) is located in the avoidance groove (43).

5. The wafer polishing machine according to claim 4, wherein a plurality of fastening screws (32) are arranged on the transmission gear (31), a plurality of avoiding grooves (43) are circumferentially arranged on the synchronizing block (41) at intervals around the axis of the synchronizing block, and the plurality of avoiding grooves (43) are arranged in one-to-one correspondence with the plurality of fastening screws (32).

6. The wafer polishing machine according to claim 2, wherein a first connecting hole (44) is formed in the synchronization block (41), a second connecting hole (45) is formed in the elastic member (42), the first connecting hole (44) and the second connecting hole (45) are arranged in a one-to-one correspondence manner, and the elastic member (42) is connected with the first connecting hole (44) by penetrating through the second connecting hole (45) through a fastener.

7. The wafer polishing machine according to claim 1, further comprising a mounting base frame (5), wherein the mounting base frame (5) comprises a supporting rod (53), a first mounting plate (51) and a second mounting plate (52), the first mounting plate (51) and the second mounting plate (52) are arranged at two ends of the supporting rod (53) at parallel intervals, the telescopic end of the telescopic cylinder (1) is fixedly connected to one side, far away from the second mounting plate (52), of the first mounting plate (51), and the bearing mounting seat (11) is embedded on the second mounting plate (52).

8. The wafer polisher according to claim 7, wherein a plurality of the support bars (53) are provided between the first mounting plate (51) and the second mounting plate (52) at intervals.

9. The wafer polisher according to claim 1, further comprising a grinding disc assembly (6), the grinding disc assembly (6) being disposed at an end of the spline shaft (2) remote from the bearing mount (11).

10. A wafer production system comprising a robot and a wafer polisher according to any one of claims 1-9, the robot delivering wafers to a polishing platen of the wafer polisher.