CN114227027A - Glass laser cutting process - Google Patents
Glass laser cutting process Download PDFInfo
- Publication number
- CN114227027A CN114227027A CN202111557839.1A CN202111557839A CN114227027A CN 114227027 A CN114227027 A CN 114227027A CN 202111557839 A CN202111557839 A CN 202111557839A CN 114227027 A CN114227027 A CN 114227027A
- Authority
- CN
- China
- Prior art keywords
- glass
- air bubble
- water drop
- small air
- bubble holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000003698 laser cutting Methods 0.000 title claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 206010041662 Splinter Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a glass laser cutting process, which utilizes local fixed-point high temperature irradiated by a laser to process a plurality of small air bubble holes (2) in a water drop shape in a glass (1), wherein the shape and the structure of the small air bubble holes (2) in the water drop shape are similar to 'Lubert tears', the small air bubble holes (2) in the water drop shape are regularly arranged in the glass (1) to form an array, and then the tail sharp points of the small air bubble holes (2) in the water drop shape form local temperature difference stress points to generate small cracks by heating the glass, and the cracks of the small air bubble holes (2) in the water drop shape are connected together along with the expansion of the cracks, so that the whole glass (1) is broken along the array direction of the small air bubble holes (2), and the cutting of the glass (1) is completed; the process has the characteristics of simple operation, capability of cutting glass with large thickness and small cutting edge breakage, and can be used for cutting and processing various light-transmitting glasses.
Description
Technical Field
The invention belongs to the field of glass processing, and particularly relates to a process for cutting and separating a piece of glass into two pieces of glass by utilizing laser.
Background
With the development of laser technology, laser processing of glass is replacing traditional machining of saw blades and water jet machining. However, in the current splintering process after a small round hole is punched by using ultrafast laser, the processing thickness is thinner, only glass with the thickness of below 6mm can be processed, but glass with the thickness of 6mm-30mm cannot be processed, and after the hole is punched, a high-power CO2 laser beam needs to be adopted to carry out local high-temperature heating along a cutting track to splinter the glass; therefore, how to increase the thickness of the laser cutting glass and conveniently complete the splitting becomes an urgent problem to be solved.
Disclosure of Invention
The invention aims to provide a laser cutting glass process, which can realize laser cutting of glass with the thickness of 6mm-30mm and is more convenient in a splitting process.
The invention adopts the following technical scheme to solve the technical problems.
Processing a plurality of small air bubble holes in a water drop shape in glass by using local fixed point high temperature irradiated by a laser, wherein the shape structure of the small air bubble holes in the water drop shape is similar to 'Lubert tears', the small air bubble holes in the water drop shape are arranged in the glass in a regular direction to form an array, and then heating the glass to enable tail sharp points of the small air bubble holes in the water drop shape to form local temperature difference stress points to generate small cracks, so that the cracks of the small air bubble holes in the water drop shape can be connected together along with crack expansion, and the whole glass is cracked and broken along the array direction of the small air bubble holes to finish glass cutting; because the laser has good light transmission in the glass, water drop-shaped small bubble holes can be irradiated layer by layer from bottom to top in the glass with the thickness of 30mm, and simultaneously, because the stress of the tail sharp point of the water drop-shaped small bubble hole is extremely large, even if the thickness of the glass reaches 30mm, cracks can be smoothly generated to expand to finish cutting and splitting, and the splitting process only needs common heating, so that the method is convenient.
Drawings
The invention will now be further described with reference to the accompanying drawings, by way of example.
FIG. 1 is a schematic illustration of a laser cutting glass process.
Detailed Description
Local fixed point high temperature that utilizes the laser instrument to shine produces little bubble hole (2) of a plurality of water droplet shapes at glass inside processing, little bubble hole (2) shape structure of water droplet shape "lubert tear" of similar, "little bubble hole (2) of water droplet shape arrange into the array at glass (1) inside at regular direction, follow-up through heating glass (1) for the tip of water droplet shape little bubble hole (2) afterbody forms local difference in temperature stress point and produces the crackle, can link together the crackle of the little bubble hole (2) of a plurality of water droplet shapes along with the crack extension, thereby split monoblock glass (1) along little bubble hole (2) array direction, accomplish the glass cutting.
Claims (1)
1. A glass laser cutting process is characterized in that a plurality of small bubble holes (2) in a water drop shape are processed in glass (1) by utilizing local fixed-point high temperature irradiated by a laser, and the small bubble holes (2) in the water drop shape are regularly arranged in the glass (1) in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111557839.1A CN114227027A (en) | 2021-12-20 | 2021-12-20 | Glass laser cutting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111557839.1A CN114227027A (en) | 2021-12-20 | 2021-12-20 | Glass laser cutting process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114227027A true CN114227027A (en) | 2022-03-25 |
Family
ID=80758891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111557839.1A Pending CN114227027A (en) | 2021-12-20 | 2021-12-20 | Glass laser cutting process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114227027A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647577A (en) * | 2022-12-28 | 2023-01-31 | 歌尔股份有限公司 | Laser processing method |
-
2021
- 2021-12-20 CN CN202111557839.1A patent/CN114227027A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647577A (en) * | 2022-12-28 | 2023-01-31 | 歌尔股份有限公司 | Laser processing method |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |