CN114222213A - Micro electro mechanical system and electro-acoustic conversion device with same - Google Patents
Micro electro mechanical system and electro-acoustic conversion device with same Download PDFInfo
- Publication number
- CN114222213A CN114222213A CN202111647718.6A CN202111647718A CN114222213A CN 114222213 A CN114222213 A CN 114222213A CN 202111647718 A CN202111647718 A CN 202111647718A CN 114222213 A CN114222213 A CN 114222213A
- Authority
- CN
- China
- Prior art keywords
- membrane
- diaphragm
- chamber
- grooves
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The application discloses a micro electro mechanical system and an electro-acoustic conversion device having the same, the micro electro mechanical system includes: a first diaphragm; the second diaphragm is arranged opposite to the first diaphragm; the supporting piece comprises a plurality of supporting walls, the two opposite ends of each supporting wall are respectively connected with the first membrane and the second membrane, and the first membrane and the second membrane and two adjacent supporting walls in the same supporting piece surround to form a first chamber; and the communication groove is arranged on the first membrane or on the first membrane and the second membrane simultaneously and is used for communicating the first chamber with the outside. Through the support body formed by the support walls and the communication grooves formed in the first membrane or the first membrane and the second membrane, the flexibility of the first membrane or the second membrane is improved, and the inter-plate capacitance between the first membrane and the second membrane is reduced.
Description
Technical Field
The present invention relates to the field of electro-acoustic conversion devices, and more particularly, to a micro electro-mechanical system and an electro-acoustic conversion device having the same.
Background
In the existing mems having a dual membrane structure, including an upper membrane, a lower membrane, and several supports for connecting the upper and lower membranes, the supports allow the upper and lower membranes to be connected at their closest point.
In some designs, it is desirable to adjust the mechanical compliance of the dual-membrane structure, which deforms when subjected to pressure, resulting in bending strains across the support cross-section. The stiffer this region is subjected to bending, the less compliant the overall bilayer membrane structure. The stronger the flexibility of the area to bending, the higher the flexibility of the whole double-layer membrane structure, and the higher the microphone sensitivity.
The present application relates to supports and changes to their compliancy, primarily to increase their compliancy, so that dual membrane structures can have higher compliancy without changing other design or material parameters.
Disclosure of Invention
In view of the above problems, the present application provides a mems and an electroacoustic conversion device having the mems to solve the technical problems in the prior art, which can improve the flexibility of the dual-film structure.
In a first aspect, the present application provides a microelectromechanical system, comprising:
a first diaphragm;
a second diaphragm disposed opposite the first diaphragm;
the supporting pieces are arranged between the first membrane and the second membrane and comprise a plurality of supporting walls, two opposite ends of each supporting wall are respectively connected with the first membrane and the second membrane, and the first membrane and the second membrane and two adjacent supporting walls in the same supporting piece surround to form a first chamber;
and the communication groove is arranged on the first membrane or on the first membrane and the second membrane simultaneously and is used for communicating the first chamber with the outside.
In the technical scheme of this application embodiment, through set up by a plurality of support walls constitute the supporter and in on the first diaphragm or simultaneously in first diaphragm with set up the intercommunication groove on the second diaphragm to the compliance of first diaphragm or second diaphragm has been increased, the interplate electric capacity between first diaphragm and the second diaphragm has been reduced simultaneously.
In some embodiments, the communication groove comprises a slit groove structure, a circular groove structure, a kidney groove structure, an angular groove structure, or an S-shaped groove structure.
In some embodiments, each of the supporting members is provided with a plurality of the communication grooves, and the plurality of the communication grooves are arranged at intervals along the first direction.
In some embodiments, the communication groove penetrates through the first membrane, and a partial area in the first cavity is provided with a filling material.
In some embodiments, the support member includes a plurality of first chambers, and in two adjacent first chambers, one of the first chambers has the communicating groove opened on the first membrane, and the other first chamber has the communicating groove opened on the second membrane.
In some embodiments, the first membrane includes a plurality of first peaks and first grooves alternately arranged in the second direction, the second membrane includes a plurality of second peaks and second grooves alternately arranged in the second direction, the first peaks are opposite to the second grooves, the first grooves are opposite to the second peaks, the opposite first peaks and second grooves surround two adjacent support walls to form a second chamber, and a counter electrode is disposed in the second chamber.
In some embodiments, the support member is sandwiched between the first and second opposing troughs and peaks.
In some embodiments, the filler material is silicon oxide.
In some embodiments, the support wall is made of polysilicon or silicon nitride.
In a second aspect, the present application further provides an electroacoustic conversion device, comprising the aforementioned mems and a circuit device electrically connected to the mems.
The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.
Drawings
Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Moreover, like reference numerals are used to refer to like elements throughout. In the drawings:
FIG. 1 is a schematic structural view of a first communicating channel structure;
FIG. 2 is a schematic structural view of a first communication groove structure in a state filled with a filler material;
FIG. 3 is a schematic structural view of a first communicating channel structure in a state where a counter electrode is included;
FIG. 4 is a structural view of a second communicating channel structure;
FIG. 5 is a schematic structural view of a third communicating groove structure;
FIG. 6 is a schematic structural view of a fourth communication groove structure;
FIG. 7 is a schematic structural view of a fifth communicating channel structure;
FIG. 8 is a structural diagram of a sixth communicating channel structure;
FIG. 9 is a schematic structural view of a seventh communicating channel structure;
FIG. 10 is a schematic structural view of a first support structure;
FIG. 11 is a schematic structural view of a second support structure;
FIG. 12 is a top view of the first diaphragm;
fig. 13 is a schematic structural view of the electroacoustic conversion device.
In the drawings, the drawings are not necessarily drawn to scale.
The reference numbers in the detailed description are as follows:
10-first membrane, 11-first peak, 12-first trough;
20-a second membrane, 21-a second peak, 22-a second trough;
30-support, 31-support wall, 32-first chamber, 33-second chamber;
40-a communicating groove;
50-a filler material;
60-counter electrode, 61-conductive element;
70-spokes;
100-an electroacoustic conversion device;
200-a micro-electromechanical system;
300-circuit means.
Detailed Description
The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
Referring to fig. 1, the present application provides a mems 200, including a first membrane 10, a second membrane 20, a support 30, and a communication groove 40:
the first diaphragm 10 and the second diaphragm 20 are disposed opposite to each other, and the first diaphragm 10 is located above the second diaphragm 20.
The first diaphragm 10 and the second diaphragm 20 form a cavity therebetween, in which the later-mentioned support 30 and the counter electrode 60 are located, and the first diaphragm 10 and the second diaphragm 20 may be made of a conductive material or include an insulating film on which a conductive element is disposed.
And a support 30 disposed in the cavity between the first diaphragm 10 and the second diaphragm 20, wherein the support 30 may be provided in plurality, the plurality of supports 30 are spaced apart along the second direction, the support 30 includes a plurality of support walls 31, the support walls 31 extend along the first direction, opposite ends of the support walls 31 are respectively connected to the first diaphragm 10 and the second diaphragm 20 to mechanically couple the first diaphragm 10 and the second diaphragm 20, and the support walls 31 are preferably made of silicon nitride.
The first diaphragm 10 and the second diaphragm 20 surround two adjacent support walls 31 in the same support 30 to form a first chamber 32, the first chamber 3 may be filled with a filling material 50, and the filling material 50 may be an oxide, such as silicon oxide. Alternatively, the first chamber 32 may be empty.
The communication groove 40 penetrates the first membrane sheet 10 and/or the second membrane sheet 20 corresponding to the support 30 to communicate the first chamber 32 with the outside, and the communication groove 40 may be provided only on the first membrane sheet 10 or may be provided on both the first membrane sheet 10 and the second membrane sheet 20. By providing the communication groove 40, air or an etching solution from the external environment is allowed to enter the first chamber 32 to release the filling material 50, thereby increasing the compliance of the first membrane sheet 10 or the second membrane sheet 20, and simultaneously reducing the inter-plate capacitance between the first membrane sheet 10 and the second membrane sheet 20.
With continued reference to fig. 1, fig. 1 is a structural schematic diagram of a first communication groove structure, which shows a situation that only the communication groove 40 is arranged on the first membrane sheet 10, the communication groove 40 is not arranged on the second membrane sheet 20, and the compliance of the first membrane sheet 10 is increased by an amount depending on the size and shape of the communication groove 40. The larger the communication groove 40, the more the compliance of the first membrane sheet 10 increases, allowing the width of the support member 30 to stretch after the filler material 50 is released, thereby decreasing the spacing between two adjacent support members 30 in the second direction to relieve the inherent stress in the first membrane sheet 10 to increase the compliance of the entire dual-membrane structure.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a second communication groove structure, which illustrates a situation that the communication grooves 40 are simultaneously arranged on the first membrane sheet 10 and the second membrane sheet 20, and the oppositely arranged communication grooves 40 completely release the filling material 50 filled in the first cavity 32, which is equivalent to creating a vent penetrating up and down between the first membrane sheet 10 and the second membrane sheet 20, so that the flexibility of the membrane in the area where the communication grooves 40 are arranged to bend can be significantly increased. The communication grooves 40 of the first membrane 10 and the second membrane 20 may have the same size and shape, or may be different, and are not limited herein. In some embodiments, the communication channel 40 on the first membrane 10 is large, almost to the edge of the support wall 31, while the communication channel 40 on the second membrane 20 is much smaller. In some embodiments, the communication channel 40 on the second membrane 20 is very large, while the communication channel 40 on the first membrane 10 is small.
As shown in fig. 5 through 9 in turn, in some embodiments, the communication groove 40 includes a slit-shaped groove body structure, a circular groove body structure, a kidney-shaped groove body structure, an angular groove body structure, or an S-shaped groove body structure. The communication channel 40 may be made large enough to allow sufficient release of the filler material 50 while increasing compliance, the size and shape of the communication channel 40 being selected to balance between increasing compliance of the support 30 and reducing mechanical stress on the first or second membrane sheet 10, 20. Those skilled in the art will appreciate that the structure of the communication groove 40 may be implemented in many different ways, and may be a regular pattern or an irregular pattern, which is not limited herein.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a third communication groove structure, in which the communication groove 40 is a slit-shaped groove structure, and the slit-shaped groove structure penetrates through the first membrane 10 corresponding to the supporting member 30 and extends along the first direction.
In one embodiment, the slit-shaped groove structure corresponding to each supporting member 30 may be provided in a plurality, the slit-shaped grooves are spaced along the first direction, and the first membrane 10 is partially connected in the region corresponding to the supporting member 30.
In another embodiment, only one slit-shaped groove structure is provided for each supporting member 30, and as shown in fig. 5, the slit-shaped groove structure penetrates through the first membrane 10 and extends along the circumferential direction of the first membrane 10, so that the mechanical connection of the area of the first membrane 10 corresponding to the supporting member 30 is completely broken, and the highest compliance is obtained.
Referring to fig. 6 to 9, fig. 6 is a schematic structural view of a fourth communication groove structure; FIG. 7 is a schematic structural view of a fifth communicating channel structure; FIG. 8 is a structural diagram of a sixth communicating channel structure; FIG. 9 is a schematic structural view of a seventh communicating channel structure; the communication grooves 40 of the above four configurations penetrate the first membrane 10, a plurality of communication grooves 40 are provided for each support 30, the plurality of communication grooves 40 are provided at intervals along the first direction, and preferably, the plurality of communication grooves 40 are distributed at equal intervals. So that the compliance of the first membrane 10 is further improved, the amount of lifting being dependent on the number and size of the communication grooves 40.
Referring to fig. 2, fig. 2 is a schematic structural view of a first communication groove structure in a state of being filled with a filling material; the communication groove 40 extends through the first membrane 10, a part of the area in the first chamber 32 is provided with the filling material 50, the part of the area is close to the second membrane 20, the size of the communication groove 40 is small, and the filling material 50 in the first chamber 32 is only partially released, so that on one hand, the flexibility of the first membrane 10 can be increased, and on the other hand, the stress concentration on the second membrane 20 or the interface between the support wall 31 and the second membrane 20 can be limited.
The support wall 31 is preferably made of silicon nitride and the partially filled filler material 50 in the first chamber 32 is preferably silicon oxide having a dielectric constant less than that of silicon nitride, the inter-plate capacitance between the first diaphragm 10 and the first diaphragm 10 being significantly reduced.
Preferably, the supporting member 30 includes a plurality of supporting walls 31 to form a plurality of first chambers 32, and of the adjacent two first chambers 32, one first chamber 32 has a communicating groove 40 opened on the first membrane sheet 10, and the other first chamber 32 has a communicating groove 40 opened on the second membrane sheet 20.
As shown in fig. 10, fig. 10 is a structural schematic diagram of a first support structure, in which the communication grooves 40 on the first membrane sheet 10 are alternately arranged at intervals with the communication grooves 40 on the second membrane sheet 20, each communication groove 40 corresponds to one first chamber 32, the areas of the first membrane sheet 10 and the second membrane sheet 20 corresponding to the support 30 form a corrugated structure, and the filling material 50 in the first chambers 32 is released, so that the flexibility of the double-membrane structure is further improved.
Referring to fig. 11, which is a schematic structural view of a second support structure, the corrugated structure formed by the supports 30 extends to the entire film, so that there is no sealed space between the first membrane sheet 10 and the second membrane sheet 20, and the corrugated structure is more compliant than a conventional film formed by a conventional single layer of deposition material.
Referring to fig. 3 and 12, fig. 3 is a schematic structural view of a first communication groove structure in a state including a counter electrode, and fig. 12 is a plan view of a first membrane sheet 10 including a plurality of first peaks 11 and first grooves 12 alternately arranged in a second direction. The second membrane sheet 20 includes a plurality of second peaks 21 and second grooves 22 alternately arranged in the second direction. The first peak 11 is opposite to the second groove 22, and the first groove 12 is opposite to the second peak 21.
A second chamber 33 is formed between the first diaphragm 10 and the second diaphragm 20, wherein the second chamber 33 is hermetically sealed, in some embodiments, has an internal pressure less than the external atmosphere, wherein the internal pressure of the second chamber 33 is less than 0.2atm, preferably, the pressure within the second chamber 33 is equal to 0.1atm, in some embodiments, the second chamber 33 is vacuum.
With continued reference to fig. 3 and 12, a counter electrode 60 is disposed within the second chamber 33, and in some embodiments, the counter electrode 60 is suspended within the second chamber 33 by spokes 70 without mechanical coupling between the counter electrode 60 and the support 30.
The conductive elements 61 are disposed on opposite upper and lower surfaces of the counter electrode 60, respectively, and the first peak 11 is spaced apart from the conductive elements 61 of the counter electrode 60 such that a first capacitance is formed therebetween. The second slot 22 is spaced from the conductive element 61 of the corresponding counter electrode 60 such that a second capacitance is formed therebetween. In response to the pressure applied on the first peaks 11 and the second grooves 22, the first peaks 11 and the second grooves 22 are movable relative to the corresponding counter electrodes 60, thereby changing the distance between the first peaks 11 and the second grooves 22 and the corresponding counter electrodes 60 of the support 30, which results in a change in capacitance and accordingly outputs an electrical signal.
Alternatively, the counter electrode 60 comprises a single conductor, such that a first capacitance is formed between the first diaphragm 10 and the single conductor and a second capacitance is formed between the second diaphragm 20 and the single conductor.
With continued reference to fig. 3, a plurality of support walls 31 are sandwiched between the opposing first troughs 12 and second peaks 21, respectively, with the first troughs 12 and second peaks 21 being connected together by respective support walls 31 of the support 30. The support wall 31 may be integrally formed with one of the first and second diaphragms 10 and 20. Alternatively, the support wall 31 is formed between the first groove 12 and the second peak 21 after the first diaphragm 10 and the second diaphragm 20 are assembled together.
The present invention further provides an electroacoustic conversion device 100, which is shown in fig. 13 and includes the aforementioned micro-electromechanical system 200 and a circuit device 300(ASIC) electrically connected to the micro-electromechanical system 200, wherein the electroacoustic conversion device 100 may be a microphone or a speaker.
The construction, features and functions of the present invention have been described in detail for the purpose of illustration and description, but the invention is not limited to the details of construction and operation, and is capable of other embodiments without departing from the spirit and scope of the invention.
Claims (10)
1. A microelectromechanical system, comprising:
a first diaphragm;
a second diaphragm disposed opposite the first diaphragm;
the supporting pieces are arranged between the first membrane and the second membrane and comprise a plurality of supporting walls, two opposite ends of each supporting wall are respectively connected with the first membrane and the second membrane, and the first membrane and the second membrane and two adjacent supporting walls in the same supporting piece surround to form a first chamber;
and the communication groove is arranged on the first membrane or on the first membrane and the second membrane simultaneously and is used for communicating the first chamber with the outside.
2. The microelectromechanical system of claim 1, characterized in that: the communicating groove comprises a slit groove body structure, a circular groove body structure, a waist groove body structure, an angular groove body structure or an S-shaped groove body structure.
3. The microelectromechanical system of claim 1, characterized in that: each support piece is correspondingly provided with a plurality of communication grooves which are arranged at intervals along a first direction.
4. The microelectromechanical system of claim 1, characterized in that: the communication groove penetrates through the first membrane, and a partial area in the first cavity is provided with a filling material.
5. The microelectromechanical system of claim 1, characterized in that: the support member includes a plurality of first chambers, and in two adjacent first chambers, the communication groove provided in one of the first chambers is opened in the first film, and the communication groove provided in the other first chamber is opened in the second film.
6. The microelectromechanical system of claim 1, characterized in that: the first diaphragm comprises a plurality of first peaks and first grooves which are alternately arranged in a second direction, the second diaphragm comprises a plurality of second peaks and second grooves which are alternately arranged in the second direction, the first peaks are opposite to the second grooves, the first grooves are opposite to the second peaks, the opposite first peaks and second grooves and two adjacent support walls form a second chamber in a surrounding mode, and a counter electrode is arranged in the second chamber.
7. The microelectromechanical system of claim 6, characterized in that: the support member is sandwiched between the opposing first trough and the second peak.
8. The micro-electro-mechanical system of claim 4, wherein: the filling material is silicon oxide.
9. The microelectromechanical system of claim 1, characterized in that: the support wall is made of polysilicon or silicon nitride.
10. An electro-acoustic conversion device comprising the micro-electro-mechanical system of any one of claims 1-9 and a circuit device electrically connected to the micro-electro-mechanical system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111647718.6A CN114222213A (en) | 2021-12-30 | 2021-12-30 | Micro electro mechanical system and electro-acoustic conversion device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111647718.6A CN114222213A (en) | 2021-12-30 | 2021-12-30 | Micro electro mechanical system and electro-acoustic conversion device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114222213A true CN114222213A (en) | 2022-03-22 |
Family
ID=80706925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111647718.6A Withdrawn CN114222213A (en) | 2021-12-30 | 2021-12-30 | Micro electro mechanical system and electro-acoustic conversion device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114222213A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7373642B1 (en) | 2022-05-27 | 2023-11-02 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS elements and electroacoustic transducers |
| JP7391176B1 (en) | 2022-05-27 | 2023-12-04 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS sensor |
| JP7432698B2 (en) | 2022-05-27 | 2024-02-16 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS element |
| JP7467586B2 (en) | 2022-05-27 | 2024-04-15 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS Sensor |
-
2021
- 2021-12-30 CN CN202111647718.6A patent/CN114222213A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7373642B1 (en) | 2022-05-27 | 2023-11-02 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS elements and electroacoustic transducers |
| JP7391176B1 (en) | 2022-05-27 | 2023-12-04 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS sensor |
| JP7432698B2 (en) | 2022-05-27 | 2024-02-16 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS element |
| JP7467586B2 (en) | 2022-05-27 | 2024-04-15 | エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド | MEMS Sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114222213A (en) | Micro electro mechanical system and electro-acoustic conversion device with same | |
| KR101570931B1 (en) | Mems microphone with low pressure region between diaphragm and counter electrode | |
| KR101578542B1 (en) | Method of Manufacturing Microphone | |
| KR101829793B1 (en) | System and method for a perpendicular electrode transducer | |
| US20150078590A1 (en) | Membrane Arrangement for a MicroElectromechanical Measuring Transducer and Method for Producing a Membrane Arrangement | |
| WO2002017677A2 (en) | Electrostatic electroacoustical transducer | |
| KR101781904B1 (en) | MEMS acoustic sensor | |
| CN112970272B (en) | Force feedback compensated absolute pressure sensor | |
| CN114866934A (en) | Micro electro mechanical system and electro-acoustic conversion device with same | |
| CN111918189A (en) | MEMS loudspeaker | |
| CN214570727U (en) | MEMS sensor and MEMS structure thereof | |
| KR100941893B1 (en) | Silicon MEMS microphone of capacitor type | |
| WO2011021341A1 (en) | Electromechanical converter, microphone, and method for manufacturing electromechanical converter | |
| CN214851819U (en) | Micro-electromechanical structure, microphone and terminal | |
| CN215403076U (en) | Micro-electromechanical structure, microphone and terminal | |
| US11405731B1 (en) | Microelectromechanical system | |
| CN114644319A (en) | Micro-electro-mechanical system and manufacturing process thereof | |
| WO2018199554A1 (en) | Microphone having rigid backplate structure and method for manufacturing same | |
| US20230331543A1 (en) | Mems device and electro-acoustic transducer | |
| CN215924389U (en) | MEMS sensor and terminal | |
| CN214281654U (en) | MEMS microphone and MEMS structure thereof | |
| CN115334431B (en) | Microphone assembly, packaging structure and electronic equipment | |
| CN117376759B (en) | Microphone assembly and microphone | |
| CN217693710U (en) | MEMS element and electroacoustic conversion device | |
| CN215935065U (en) | Micro-electromechanical structure, microphone and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220322 |
|
| WW01 | Invention patent application withdrawn after publication |