CN114214009A - High-temperature-resistant antistatic pressure-sensitive adhesive and application thereof - Google Patents
High-temperature-resistant antistatic pressure-sensitive adhesive and application thereof Download PDFInfo
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- CN114214009A CN114214009A CN202111647279.9A CN202111647279A CN114214009A CN 114214009 A CN114214009 A CN 114214009A CN 202111647279 A CN202111647279 A CN 202111647279A CN 114214009 A CN114214009 A CN 114214009A
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- Prior art keywords
- sensitive adhesive
- temperature
- pressure
- parts
- resistant antistatic
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 56
- 239000000178 monomer Substances 0.000 claims abstract description 51
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 239000002216 antistatic agent Substances 0.000 claims abstract description 17
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 16
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 239000003999 initiator Substances 0.000 claims abstract description 16
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 5
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims abstract description 5
- 239000011976 maleic acid Substances 0.000 claims abstract description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 5
- IOHPVZBSOKLVMN-UHFFFAOYSA-N 2-(2-phenylethyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1CCC1=CC=CC=C1 IOHPVZBSOKLVMN-UHFFFAOYSA-N 0.000 claims abstract description 4
- AEIGUJIDYBREEB-UHFFFAOYSA-N 2-hydroxy-2-(2-methylphenyl)-2-phenylacetic acid Chemical compound CC1=CC=CC=C1C(O)(C(O)=O)C1=CC=CC=C1 AEIGUJIDYBREEB-UHFFFAOYSA-N 0.000 claims abstract description 3
- MFEILWXBDBCWKF-UHFFFAOYSA-N 3-phenylpropanoyl chloride Chemical compound ClC(=O)CCC1=CC=CC=C1 MFEILWXBDBCWKF-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 8
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 8
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims description 6
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 4
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 claims description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 4
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- 229910002651 NO3 Inorganic materials 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 claims description 3
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 3
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 claims description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N anhydrous trimethylamine Natural products CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 2
- -1 lauramidopropyl trimethyl amine Chemical compound 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- LJFIHTFNTGQZJL-UHFFFAOYSA-N methyl 2-hydroxy-2,2-diphenylacetate Chemical compound C=1C=CC=CC=1C(O)(C(=O)OC)C1=CC=CC=C1 LJFIHTFNTGQZJL-UHFFFAOYSA-N 0.000 description 4
- WOGITNXCNOTRLK-VOTSOKGWSA-N (e)-3-phenylprop-2-enoyl chloride Chemical compound ClC(=O)\C=C\C1=CC=CC=C1 WOGITNXCNOTRLK-VOTSOKGWSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ZDSJVEWVYWNEKT-UHFFFAOYSA-N 4-(2-phenylethyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CCC1=CC=CC=C1 ZDSJVEWVYWNEKT-UHFFFAOYSA-N 0.000 description 1
- OQJHUYFFCZAGSP-UHFFFAOYSA-N N-[4-(dimethylamino)butyl]dodecanamide Chemical group CCCCCCCCCCCC(=O)NCCCCN(C)C OQJHUYFFCZAGSP-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/017—Additives being an antistatic agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a high-temperature-resistant antistatic pressure-sensitive adhesive and application thereof, wherein the high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following raw materials in parts by mass: 70-90 parts of soft monomer, 8-20 parts of hard monomer, 1-10 parts of functional monomer, 0.2-1 part of antistatic agent, 0.1-0.5 part of curing agent, 0.1-0.5 part of initiator, 0.1-0.3 part of antioxidant and 100-150 parts of solvent; the functional monomer is selected from one or more of p-tolueneethyl acetate, 3-phenylpropionyl chloride, 2-phenethylbenzoic acid, maleic acid and methyl benzilic acid. The high temperature resistance of the PET protective film prepared by the pressure-sensitive adhesive can reach 300 ℃, and the technical problems that the protective film cannot resist high temperature and adhesive residue exists in the high-temperature reflow soldering process are effectively solved.
Description
Technical Field
The invention relates to the technical field of pressure-sensitive adhesives, in particular to a high-temperature-resistant antistatic pressure-sensitive adhesive and application thereof.
Background
The integrated circuit protection board plays an important role in electronic products, and the requirements of the production process are extremely strict. With the development of the times, conditions of the numerical control machine tool in the preparation process of the integrated circuit protection board are gradually increased, and particularly, the product is required to be prevented from being damaged in the reflow soldering process of the printed circuit board, and static electricity is not generated to damage an internal integrated circuit. Therefore, a high-temperature resistant antistatic protective film needs to be used for keeping viscosity in the high-temperature process of reflow soldering tin, no residual glue is generated after the protective film is torn, the printed circuit board is protected from being damaged in the processing process, and no static electricity is generated to cause fatal damage to the product.
The existing acrylate adhesive has the advantages of good optical property, aging resistance, low price, convenient coating and the like, and is the most widely used adhesive in the market, but when the acrylate pressure-sensitive adhesive is applied to reflow soldering tin, the high temperature resistance is poor, and the technical problem of residual adhesive after tearing is solved. Therefore, there is a need to develop a high temperature resistant pressure sensitive adhesive that can protect printed circuit boards from damage during reflow soldering.
Disclosure of Invention
In view of the above, the invention provides a high temperature resistant and antistatic pressure sensitive adhesive capable of ensuring that a product is not damaged in a reflow soldering process of a printed circuit board and an application thereof.
The technical scheme of the invention is realized as follows: on one hand, the invention provides a high-temperature-resistant antistatic pressure-sensitive adhesive which comprises the following raw materials in parts by mass: 70-90 parts of soft monomer, 8-20 parts of hard monomer, 1-10 parts of functional monomer, 0.2-1 part of antistatic agent, 0.1-0.5 part of curing agent, 0.1-0.5 part of initiator, 0.1-0.3 part of antioxidant and 100-150 parts of solvent; the functional monomer is selected from one or more of p-tolueneethyl acetate, 3-phenylpropionyl chloride, 2-phenethylbenzoic acid, maleic acid and methyl benzilic acid.
On the basis of the above technical scheme, preferably, the soft monomer is selected from one or more of ethyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate and dodecyl methacrylate.
On the basis of the above technical scheme, preferably, the hard monomer is selected from one or more of methyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, vinyl acetate and styrene.
On the basis of the technical scheme, preferably, the antistatic agent is selected from one or more combinations of lauramidopropyl trimethyl amine, polyether ester amide and octadecyl dimethyl hydroxyethyl quaternary ammonium nitrate.
On the basis of the above technical solution, preferably, the curing agent is selected from one of cyclohexyl isocyanate, phenyl isocyanate and phenyl isocyanate.
On the basis of the above technical scheme, preferably, the initiator is selected from one of benzoyl peroxide, tert-butyl peroxybenzoate, dicumyl peroxide and methyl ethyl ketone peroxide.
On the basis of the above technical scheme, preferably, the antioxidant is selected from antioxidant 1010.
On the basis of the above technical scheme, preferably, the solvent is selected from one or more of ethyl acetate, toluene and acetone.
On the other hand, the invention also provides a PET protective film prepared from the high-temperature-resistant antistatic pressure-sensitive adhesive, wherein the PET protective film consists of a base film, a pressure-sensitive adhesive coating and a release film, the base film is a PET film with the thickness of 25-75 micrometers, the release film is a PET film with the thickness of 40-60 micrometers, and the pressure-sensitive adhesive coating thickness is 10-40 micrometers.
On the basis of the technical scheme, preferably, the preparation method of the PET protective film prepared from the high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following steps:
s1, uniformly mixing the soft monomer, the hard monomer, the initiator and the solvent, pouring the mixture into a three-necked bottle, and introducing nitrogen into the three-necked bottle to remove oxygen for 1 min;
s2, heating the temperature of the reaction solution in the step S1 to 60 ℃ and keeping the temperature for 10 min; then adding the functional monomer, the antistatic agent and the antioxidant into a three-necked bottle at the temperature of 60 ℃ and reacting for 4 hours;
s3, after the reaction in the step S2 is finished, the temperature of the reaction solution is increased to 70 ℃ for reaction for 20min, and the high-temperature-resistant antistatic pressure-sensitive adhesive can be obtained after discharging;
s4, adding a curing agent into the pressure-sensitive adhesive prepared in the step S3, then coating the pressure-sensitive adhesive on a PET base film, and drying the pressure-sensitive adhesive at 90-100 ℃ after the coating is finished to form dry adhesive; and covering the release film on the surface of the dry glue, and curing to obtain the high-temperature-resistant antistatic PET protective film.
Compared with the prior art, the high-temperature-resistant antistatic pressure-sensitive adhesive and the application thereof have the following beneficial effects:
(1) the invention improves the high temperature resistance of the pressure-sensitive adhesive and the PET protective film by primer phenyl in the functional monomer, improves the high temperature resistance of the printed circuit board when being applied to the high temperature reflow soldering process of the printed circuit board, ensures that the PET protective film maintains good stripping force no matter cold tearing or hot tearing is carried out in the high temperature cutting process, has no residual adhesive and no mottled shadow after tearing, and effectively protects the printed circuit board.
(2) The PET protective film prepared by the high-temperature-resistant antistatic pressure-sensitive adhesive has the high-temperature resistance of 300 ℃ and the 180-degree peel strength of 110-117g/25mm, can meet the high-temperature requirement of a printed circuit board in the high-temperature reflow soldering process, and greatly improves the qualification rate of products.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the high temperature resistant antistatic PET protective film of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example one
The high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following raw materials in parts by mass: 70 parts of soft monomer, 8 parts of hard monomer, 1 part of functional monomer, 0.2 part of antistatic agent, 0.1 part of curing agent, 0.1 part of initiator, 0.1 part of antioxidant and 100 parts of solvent.
Specifically, the method comprises the following steps: the soft monomer is a mixture of ethyl acrylate and isooctyl acrylate, wherein the ethyl acrylate accounts for 40 parts, and the isooctyl acrylate accounts for 30 parts; the hard monomer is a mixture of methyl acrylate and styrene, wherein 6 parts of methyl acrylate and 2 parts of styrene are used; the functional monomer is a mixture of p-tolueneethyl acetate and 3-phenyl acryloyl chloride, wherein the p-tolueneethyl acetate accounts for 0.5 part, and the 3-phenyl acryloyl chloride accounts for 0.5 part; the antistatic agent is lauramidopropyl trimethylamine; the curing agent is cyclohexyl isocyanate; the initiator is benzoyl peroxide; the antioxidant is antioxidant 1010; the solvent was ethyl acetate.
The preparation method for preparing the PET protective film by using the high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following steps:
s1, uniformly mixing the soft monomer, the hard monomer, the initiator and the solvent, pouring the mixture into a three-necked bottle, and introducing nitrogen into the three-necked bottle to remove oxygen for 1 min;
s2, heating the temperature of the reaction solution in the step S1 to 60 ℃ and keeping the temperature for 10 min; then adding the functional monomer, the antistatic agent and the antioxidant into a three-necked bottle at the temperature of 60 ℃ and reacting for 4 hours;
s3, after the reaction in the step S2 is finished, the temperature of the reaction solution is increased to 70 ℃ for reaction for 20min, and the high-temperature-resistant antistatic pressure-sensitive adhesive can be obtained after discharging;
s4, adding a curing agent into the pressure-sensitive adhesive prepared in the step S3, then coating the pressure-sensitive adhesive on a PET base film with the thickness of 25 micrometers, wherein the coating thickness is 10 micrometers, after drying at 90 ℃, coating a release film with the thickness of 40 micrometers on the surface of the dry adhesive, and curing at 50 ℃ for 3 days to obtain the high-temperature-resistant antistatic PET protective film.
Example two
The high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following raw materials in parts by mass: 90 parts of soft monomer, 20 parts of hard monomer, 10 parts of functional monomer, 1 part of antistatic agent, 0.5 part of curing agent, 0.5 part of initiator, 0.3 part of antioxidant and 150 parts of solvent.
Specifically, the method comprises the following steps: the soft monomer is a mixture of butyl acrylate and dodecyl methacrylate, wherein the butyl acrylate accounts for 50 parts, and the dodecyl methacrylate accounts for 40 parts; the hard monomer is a mixture of ethyl methacrylate and styrene, wherein 15 parts of ethyl methacrylate and 5 parts of styrene are used; the functional monomer is a mixture of p-2-phenethylbenzoic acid and methyl benzilate, wherein 5 parts of 2-phenethylbenzoic acid and 5 parts of methyl benzilate; the antistatic agent is polyether ester amide; the curing agent is phenyl isocyanate; the initiator is tert-butyl peroxybenzoate; the antioxidant is antioxidant 1010; the solvent is toluene.
The preparation method for preparing the PET protective film by using the high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following steps:
s1, uniformly mixing the soft monomer, the hard monomer, the initiator and the solvent, pouring the mixture into a three-necked bottle, and introducing nitrogen into the three-necked bottle to remove oxygen for 1 min;
s2, heating the temperature of the reaction solution in the step S1 to 60 ℃ and keeping the temperature for 10 min; then adding the functional monomer, the antistatic agent and the antioxidant into a three-necked bottle at the temperature of 60 ℃ and reacting for 4 hours;
s3, after the reaction in the step S2 is finished, the temperature of the reaction solution is increased to 70 ℃ for reaction for 20min, and the high-temperature-resistant antistatic pressure-sensitive adhesive can be obtained after discharging;
s4, adding a curing agent into the pressure-sensitive adhesive prepared in the step S3, then coating the pressure-sensitive adhesive on a PET base film, and drying the pressure-sensitive adhesive at 90-100 ℃ after the coating is finished to form dry adhesive; and covering the release film on the surface of the dry glue, and curing to obtain the high-temperature-resistant antistatic PET protective film.
EXAMPLE III
The high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following raw materials in parts by mass: 80 parts of soft monomer, 15 parts of hard monomer, 2 parts of functional monomer, 0.2 part of antistatic agent, 0.4 part of curing agent, 0.3 part of initiator, 0.2 part of antioxidant and 110 parts of solvent.
Specifically, the method comprises the following steps: the soft monomer is a mixture of n-octyl acrylate and dodecyl methacrylate, wherein 50 parts of n-octyl acrylate and 30 parts of dodecyl methacrylate; the hard monomer is a mixture of n-butyl methacrylate and vinyl acetate, wherein the n-butyl methacrylate accounts for 12 parts, and the vinyl acetate accounts for 3 parts; the functional monomer is a mixture of maleic acid and methyl benzilate, wherein 1 part of maleic acid and 1 part of methyl benzilate; the antistatic agent is octadecyl dimethyl hydroxyethyl quaternary ammonium nitrate; the curing agent is phenyl isocyanate; the initiator is dicumyl peroxide; the antioxidant is antioxidant 1010; the solvent is acetone.
The preparation method for preparing the PET protective film by using the high-temperature-resistant antistatic pressure-sensitive adhesive comprises the following steps:
s1, uniformly mixing the soft monomer, the hard monomer, the initiator and the solvent, pouring the mixture into a three-necked bottle, and introducing nitrogen into the three-necked bottle to remove oxygen for 1 min;
s2, heating the temperature of the reaction solution in the step S1 to 60 ℃ and keeping the temperature for 10 min; then adding the functional monomer, the antistatic agent and the antioxidant into a three-necked bottle at the temperature of 60 ℃ and reacting for 4 hours;
s3, after the reaction in the step S2 is finished, the temperature of the reaction solution is increased to 70 ℃ for reaction for 20min, and the high-temperature-resistant antistatic pressure-sensitive adhesive can be obtained after discharging;
s4, adding a curing agent into the pressure-sensitive adhesive prepared in the step S3, then coating the pressure-sensitive adhesive on a PET base film with the thickness of 50 microns, wherein the coating thickness is 20 microns, after drying at 95 ℃, coating a release film with the thickness of 50 microns on the surface of the dry adhesive, and curing at 55 ℃ for 4 days to obtain the high-temperature-resistant antistatic PET protective film.
Comparative example
Comparative example 1, hydroxyethyl acrylate was used as the functional monomer, polyetheresteramide was used as the antistatic agent, and reagents and parts of other components were unchanged.
The relevant performance tests were performed on examples one to three and comparative example.
The above examples and comparative examples were tested according to the national standard for high temperature resistance (GB/T2792-1998) with the test results shown in Table 1, the national standard for peel strength (GB/T2792-1998) with the test results shown in Table 1, the national standard for antistatic resistance (GBT 15662-1995) with the test results shown in Table 2.
Table 1 peel force and peel strength test results
TABLE 2 antistatic resistance test results
| Item | Example 1 | Example 2 | Example 3 | Comparative example |
| Resistance test of rubber surface/omega | 1.3e9 | 3.7e11 | 8.9e9 | 9.6e10 |
The experimental data shown in the table 1-2 show that the high-temperature-resistant antistatic pressure-sensitive adhesive and the high-temperature-resistant antistatic PET protective film have excellent high-temperature-resistant antistatic performance, the 180-degree peel strength of the PET protective film is between 110 and 117g/25mm, no residual adhesive exists in hot tearing and cold tearing after high-temperature baking at 280 ℃ and 300 ℃, and no specks exist.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The high-temperature-resistant antistatic pressure-sensitive adhesive is characterized in that: the composite material comprises the following raw materials in parts by mass: 70-90 parts of soft monomer, 8-20 parts of hard monomer, 1-10 parts of functional monomer, 0.2-1 part of antistatic agent, 0.1-0.5 part of curing agent, 0.1-0.5 part of initiator, 0.1-0.3 part of antioxidant and 100-150 parts of solvent; the functional monomer is selected from one or more of p-tolueneethyl acetate, 3-phenylpropionyl chloride, 2-phenethylbenzoic acid, maleic acid and methyl benzilic acid.
2. The high temperature resistant antistatic pressure sensitive adhesive as claimed in claim 1, wherein: the antistatic agent is selected from one or more of lauramidopropyl trimethyl amine, polyether ester amide and octadecyl dimethyl hydroxyethyl quaternary ammonium nitrate.
3. The high temperature resistant antistatic pressure sensitive adhesive as claimed in claim 1, wherein: the soft monomer is selected from one or more of ethyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate and dodecyl methacrylate.
4. The high temperature resistant antistatic pressure sensitive adhesive as claimed in claim 1, wherein: the hard monomer is selected from one or more of methyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, vinyl acetate and styrene.
5. The high temperature resistant antistatic pressure sensitive adhesive as claimed in claim 1, wherein: the curing agent is selected from one of cyclohexyl isocyanate, phenyl isocyanate and phenyl isocyanate.
6. The high temperature resistant antistatic pressure sensitive adhesive as claimed in claim 1, wherein: the initiator is selected from one of benzoyl peroxide, tert-butyl peroxybenzoate, dicumyl peroxide and methyl ethyl ketone peroxide.
7. The high temperature resistant antistatic pressure sensitive adhesive as claimed in claim 1, wherein: the antioxidant is selected from antioxidant 1010.
8. The high temperature resistant antistatic pressure sensitive adhesive as claimed in claim 1, wherein: the solvent is selected from one or more of ethyl acetate, toluene and acetone.
9. The PET protective film prepared from the high-temperature-resistant antistatic pressure-sensitive adhesive according to claim 1, wherein: the PET protective film consists of a base film, a pressure-sensitive adhesive coating and a release film, wherein the pressure-sensitive adhesive coating is positioned between the base film and the release film; the base film is a PET film with the thickness of 25-75 mu m, the release film is a PET film with the thickness of 40-60 mu m, and the pressure-sensitive adhesive coating thickness is 10-40 mu m.
10. The PET protective film prepared from the high-temperature-resistant antistatic pressure-sensitive adhesive according to claim 9, wherein: the preparation method comprises the following steps:
s1, uniformly mixing the soft monomer, the hard monomer, the initiator and the solvent, pouring the mixture into a three-necked bottle, and introducing nitrogen into the three-necked bottle to remove oxygen for 1 min;
s2, heating the temperature of the reaction solution in the step S1 to 60 ℃ and keeping the temperature for 10 min; then adding the functional monomer, the antistatic agent and the antioxidant into a three-necked bottle at the temperature of 60 ℃ and reacting for 4 hours;
s3, after the reaction in the step S2 is finished, the temperature of the reaction solution is increased to 70 ℃ for reaction for 20min, and the high-temperature-resistant antistatic pressure-sensitive adhesive can be obtained after discharging;
s4, adding a curing agent into the pressure-sensitive adhesive prepared in the step S3, then coating the pressure-sensitive adhesive on a PET base film, and drying the pressure-sensitive adhesive at 90-100 ℃ after the coating is finished to form dry adhesive; and covering the release film on the surface of the dry glue, and curing to obtain the high-temperature-resistant antistatic PET protective film.
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