CN108753196A - A kind of Antistatic type high temperature resistant acrylate pressure-sensitive adhesive, preparation method and application - Google Patents
A kind of Antistatic type high temperature resistant acrylate pressure-sensitive adhesive, preparation method and application Download PDFInfo
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- CN108753196A CN108753196A CN201810319737.8A CN201810319737A CN108753196A CN 108753196 A CN108753196 A CN 108753196A CN 201810319737 A CN201810319737 A CN 201810319737A CN 108753196 A CN108753196 A CN 108753196A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
- C08G18/6225—Polymers of esters of acrylic or methacrylic acid
- C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2475/00—Presence of polyurethane
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2483/00—Presence of polysiloxane
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Abstract
The invention discloses a kind of Antistatic type high temperature resistant acrylate pressure-sensitive adhesive, preparation method and applications, Antistatic type high temperature resistant acrylate pressure-sensitive adhesive of the present invention, including (A) component and (B) component, (A) component is made by the raw material of following weight percent：Hard monomer 4-8%, soft monomer 18-28%, function monomer 2-8%, heat-resistant monomer 1-3%, solvent 65%；And account for the initiator of the 0.1-0.5% of the total weight of the hard monomer, soft monomer, function monomer, heat-resistant monomer；(B) component includes one or more of curing agent, auxiliary agent and electrostatic agent；The curing agent, auxiliary agent and electrostatic agent account for 2-5%, 0.1-1%, 0.1-1% of described (A) component weight respectively；The present invention electrostatic high temperature resistant acrylate pressure-sensitive adhesive, heat resistance and antistatic property are good, and will not soften at high temperature, non yellowing, without residue glue.
Description
Technical field
The present invention relates to pressure sensitive adhesive fields, and in particular to a kind of Antistatic type high temperature resistant acrylate pressure-sensitive adhesive, its preparation
Method and application.
Background technology
The full name of pressure sensitive adhesive is pressure-sensitive adhesive, is also commonly called as adhesive sticker, its bonding process is very convenient, only
Slightly pressure or to be gently pressed with finger and can be carried out bonding, and do not need in this course prodigious pressure plus
The effect of heat or solvent.Therefore pressure sensitive adhesive is known as a kind of substance from gluing, it is with material to be bonded surface mainly by model
De Huali is bonded, and without any physical and chemical changes in bonding process.Mainly there are four features for pressure sensitive adhesive：1. bonding
Journey is easy to carry out；2. being easier to peel；3. when pressure sensitive adhesive is stripped down from bonding surface, gluing of surfaces is not destroyed
Structure；4. glue-line is highly stable, tack time is longer, and will not fail during the bonding process because of dry solidification.Ordinary circumstance
Under, pressure sensitive adhesive is not directly used for the bonding of adherend, but glue is coated on various base materials, pressure sensitive adhesive product is made, then again
It is bonded.
Pressure sensitive adhesive was used in some specialty tapes, such as electric insulation adhesive tape, automotive lacquer masking tape, aluminum foil and adhesive tape
Cheng Zhong requires that pressure sensitive adhesive tape is resistant to higher temperature, has preferable high temperature resistance.This requires pressure sensitive adhesives in high temperature
Under to have good adhesive effect.But since the structure of simple solvent-type acrylic ester pressure-sensitive determines its heat resistance
It is poor, it can soften at high temperature, be unable to normal use, and solvent-type acrylic ester pressure-sensitive antistatic property is poor, therefore for
The research of high temperature resistant acrylate pressure-sensitive adhesive just has larger application value and market value.
Invention content
In order to overcome the disadvantage that solvent-type acrylic ester pressure-sensitive heat resistance is poor, antistatic property is poor, the present invention to provide
A kind of Antistatic type high temperature resistant acrylate pressure-sensitive adhesive, preparation method and application.
The present invention Antistatic type high temperature resistant acrylate pressure-sensitive adhesive, will not soften at high temperature, non yellowing, without residue glue.
The Antistatic type high temperature resistant acrylate pressure-sensitive adhesive of the present invention, including (A) component and (B) component,
(A) component is made by the raw material of following weight percent：Hard monomer 4-8%, soft monomer 18-28%, function
Monomer 2-8%, heat-resistant monomer 1-3%, solvent 65%；And further include accounting for the hard monomer, soft monomer, function monomer, heat-resisting
The initiator of the 0.1-0.5% of the total weight of monomer；
(B) component includes one or more of curing agent, auxiliary agent and electrostatic agent；
The curing agent, auxiliary agent and electrostatic agent account for 2-5%, 0.1-1%, 0.1- of described (A) component weight respectively
1%；
Wherein, the heat-resistant monomer is piperidinyl ethyl alcohol ester, ring trimethylolpropane contracting dimethoxym ethane acrylic acid
One or both of ester, benzene oxygen Bian acrylate, acrylamide, N- hydroxyacrylamides, N-phenylmaleimide.
In addition, the hard monomer be tert-butyl acrylate, hexyl methacrylate, acetoacetoxy ethyl methacrylate,
It is one or more in trans--talan；
In addition, the soft monomer is butyl acrylate, Isooctyl acrylate monomer, one kind in ethoxyethyl acrylate or more
Kind；
In addition, the function monomer is itaconic acid, acrylic acid, methacrylic acid, glycidyl methacrylate, propylene
In sour hydroxyl ethyl ester, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxy propyl methacrylate, acrylic acid -4- hydroxybutyls
It is one or more.
In addition, the solvent is ethyl acetate and/or methanol.
In addition, the initiator is azodiisobutyronitrile, bis- (2- amidine propanes) dihydrochlorides of 2,2- azos and/or mistake
Aoxidize dibenzoyl.
In addition, the curing agent is aluminium acetylacetonate, acetylacetone,2,4-pentanedione zirconium, equal anhydride diisocyanate, toluene diisocynate
It is one or more in ester, hexamethylene diisocyanate, m-xylene diamine type epoxy resin；
In addition, the auxiliary agent is phenyl silane oligomer, phenyl silane oligomer, acryloxy silane oligomer, third
It is one or two kinds of in alkene acyloxy silane oligomer, vinyl silanes oligomer, vinyl silanes oligomer；
In addition, the antistatic agent is one or two kinds of in chemistat 3500, LS-970.
The present invention also provides a kind of preferred pressure sensitive adhesive, (A) component includes each ingredient of following weight percentage：
Tert-butyl acrylate 4%, acetoacetoxy ethyl methacrylate 0.5%, butyl acrylate 24.5%, acrylic acid
1%, acrylic acid -4- hydroxybutyls 1%, glycidyl methacrylate 2%, piperidinyl ethyl alcohol ester 1.5%, N-
Phenyl maleimide 0.5%, ethyl acetate 60%, methanol 5%, and all the components other than the ethyl acetate, methanol
Total amount 0.3% azodiisobutyronitrile.
The present invention also provides a kind of preparation methods of pressure surface glue as described above comprising following step：
(1) monomer mixture is obtained after mixing hard monomer, soft monomer, function monomer and heat-resistant monomer, and above-mentioned monomer is mixed
It is added in reaction vessel after closing the 60~100% of object, 45~65% mixing of solvent total amount, initiator total amount is added after heating
30~40%, carry out insulation reaction；
It (2) will be after 20~35% mixing of remaining monomer mixture, the 15~25% of solvent total amount and initiator total amount
It drops evenly in the mixture that step (1) obtains, carries out insulation reaction；
(3) remaining initiator and residual solvent are added in the mixture for carrying out being obtained after step (2), it is anti-after heating
It answers；
(4) the mixture cooling discharge for obtaining step (3).
Wherein, in the step (1), initiator is added after being heated to 66~76 DEG C, reaction is always maintained at low early period
Temperature reaction, the reaction vessel carry condenser pipe, and the insulation reaction time carries out 0.5h from condenser pipe generates reflux；
In the step (2), time for adding is 1.5~3h, and the insulation reaction time is 2h；
In the step (3), 3h is reacted after being warming up to 80 DEG C.
The present invention also provides a kind of applications of pressure surface glue as described above, which is characterized in that (A) component is added in (B) component,
It is coated on basilar memebrane, cures after mixing.
Invention introduces the higher special hard monomer of Tg values, it is also easy to produce crosslinked function monomer and the heat-resisting list of functional form
Body.The heat-resistant monomer for introducing band rigidity phenyl ring, can increase the inward turning resistance of strand, be not susceptible under 180 DEG C of high temperature point
The disconnection of subchain, and the heat-resistant monomer with amides with polar group amino can contain epoxy group because of its own with other
Ring-opening reaction occurs for monomer, generates chemical crosslinking point, improves polymer molecular weight and increases cohesive strength between strand, to
Improve the heat resistance of pressure sensitive adhesive.After curing agent is added, more chemical crosslinking points can be generated, the netted knot of " anchoring " is formed
Structure not only has very strong high temperature resistance, and peeling force very little.
Advantageous effect
Antistatic type high temperature resistant acrylate pressure-sensitive adhesive provided by the invention has excellent antistatic property, when stripping not
Will produce a large amount of electrostatic charges causes to adsorb dust and causes security risk and with stronger heat resistance and smaller stripping
Power, cold after 180 DEG C of high-temperature bakings to tear no residue glue, non yellowing is easily peelable, and wet-hot aging performance is good, has well solved current each row
The problem of industry uses under the high temperature conditions, in addition, the present invention is also the viscous of the fields such as electronics technology, medical treatment, military affairs, aerospace
Knot technology provides practical solution.
Specific implementation mode
Hereinafter, preferred embodiments of the present invention will be described, it should be understood that preferred embodiment described herein is only used
In the description and interpretation present invention, it is not intended to limit the present invention.
The raw material of the present invention, which is market, can obtain product.
Embodiment 1
Raw material：Tert-butyl acrylate 4g, acetoacetoxy ethyl methacrylate 0.5g, butyl acrylate 27g, acrylic acid
0.5g, acrylic acid -4- hydroxybutyls 0.5g, glycidyl methacrylate 1g, piperidinyl ethyl alcohol ester 1g, N- benzene
Base maleimide 0.5g, initiator (AIBN) 0.105g, ethyl acetate 60g and methanol 5g.
Preparation method：
1) by tert-butyl acrylate, acetoacetoxy ethyl methacrylate, butyl acrylate, acrylic acid, acrylic acid -4- hydroxyls
Base butyl ester, glycidyl methacrylate, piperidinyl ethyl alcohol ester, N-phenylmaleimide mixing, obtain monomer
Ethyl acetate and methanol are mixed to obtain mixed solvent by mixture.Above-mentioned monomer mixture 21g and mixed solvent 29.3g is taken, is poured into
With mechanical agitation, thermometer, condenser pipe four-hole boiling flask in be heated to 66 DEG C after, 0.032g initiator As IBN is poured into reaction
In flask, start timing, insulation reaction 0.5h after generating reflux in condenser pipe.
2) after reacting, permanent liquid leakage is added in residual monomer mixture, mixed solvent 9.8g and initiator A IBN 0.021g
It in bucket, is dropped evenly into reaction system in 3h, then insulation reaction 2h.
3) after reacting, remaining initiator A IBN and mixed solvent are poured into reaction bulb, temperature increases 80 DEG C of holding 3h.
4) after reacting, cooling discharge.
5) it weighs part glue and auxiliary agent phenyl silane oligomer is added, addition is the 1% of glue weight, is added anti-quiet
Electric agent chemistat 3500, dosage are the 0.1% of glue weight, the equal anhydride diisocyanate of curing agent are added, dosage is glue
The 2% of liquid weight, is sufficiently stirred, on a pet film by the coating of gained glue, first normal temperature cure 5min, then 80 DEG C of solidification 5min, finally
Cure 5min at 120 DEG C, the thickness control after solidification is at 10 μm, in case test.
Embodiment 2
Raw material：Tert-butyl acrylate 4g, acetoacetoxy ethyl methacrylate 0.5g, butyl acrylate 24.5g, acrylic acid
1g, acrylic acid -4- hydroxybutyls 1g, glycidyl methacrylate 2g, piperidinyl ethyl alcohol ester 1.5g, N- phenyl
Maleimide 0.5g, initiator (AIBN) 0.105g, ethyl acetate 60g and methanol 5g.
Preparation method：
1) by tert-butyl acrylate, acetoacetoxy ethyl methacrylate, butyl acrylate, acrylic acid, acrylic acid -4- hydroxyls
Base butyl ester, glycidyl methacrylate, piperidinyl ethyl alcohol ester, N-phenylmaleimide mixing, obtain monomer
Ethyl acetate and methanol are mixed to obtain mixed solvent by mixture.Above-mentioned monomer mixture 21g and mixed solvent 29.3g is taken, is poured into
With mechanical agitation, thermometer, condenser pipe four-hole boiling flask in be heated to 66 DEG C after, initiator A IBN 0.032g are poured into instead
It answers in flask, starts timing, insulation reaction 0.5h after generating reflux in condenser pipe.
2) after reacting, permanent liquid leakage is added in residual monomer mixture, mixed solvent 9.8g and initiator A IBN 0.021g
It in bucket, is dropped evenly into reaction system in 3h, then insulation reaction 2h.
3) after reacting, remaining initiator A IBN and mixed solvent are poured into reaction bulb, temperature increases 80 DEG C of holding 3h.
4) after reacting, cooling discharge.
5) it weighs part glue and auxiliary agent phenyl silane oligomer is added, addition is the 1% of glue weight, is added anti-quiet
Electric agent chemistat 3500, dosage are the 0.1% of glue weight, and the equal anhydride diisocyanate (self-control) of curing agent is added, uses
Amount is the 2% of glue weight, is sufficiently stirred, on a pet film by the coating of gained glue, first normal temperature cure 5min, then 80 DEG C of solidifications
5min finally cures 5min at 120 DEG C, and the thickness control after solidification is at 10 μm, in case test.
Embodiment 3
Raw material：Tert-butyl acrylate 6g, acetoacetoxy ethyl methacrylate 0.5g, butyl acrylate 18.5g, acrylic acid
2g, acrylic acid -4- hydroxybutyls 2g, glycidyl methacrylate 4g, piperidinyl ethyl alcohol ester 1.5g, N- phenyl
Maleimide 0.5g, initiator (AIBN) 0.105g, ethyl acetate 60g and methanol 5g.
Preparation method：
1) by tert-butyl acrylate, acetoacetoxy ethyl methacrylate, butyl acrylate, acrylic acid, acrylic acid -4- hydroxyls
Base butyl ester, glycidyl methacrylate, piperidinyl ethyl alcohol ester, N-phenylmaleimide mixing, obtain monomer
Ethyl acetate and methanol are mixed to obtain mixed solvent by mixture.Above-mentioned monomer mixture 21g and mixed solvent 29.3g is taken, is poured into
With mechanical agitation, thermometer, condenser pipe four-hole boiling flask in be heated to 66 DEG C after, 0.032g initiator As IBN is poured into reaction
In flask, start timing, insulation reaction 0.5h after generating reflux in condenser pipe.
2) after reacting, permanent liquid leakage is added in residual monomer mixture, mixed solvent 9.8g and initiator A IBN 0.021g
It in bucket, is dropped evenly into reaction system in 3h, then insulation reaction 2h.
3) after reacting, remaining initiator A IBN and mixed solvent are poured into reaction bulb, temperature increases 80 DEG C of holding 3h.
4) after reacting, cooling discharge.
5) it weighs part glue and auxiliary agent phenyl silane oligomer is added, addition is the 1% of glue weight, is added anti-quiet
Electric agent chemistat 3500, dosage are the 0.1% of glue weight, and the equal anhydride diisocyanate (self-control) of curing agent is added, uses
Amount is the 2% of glue weight, is sufficiently stirred, on a pet film by the coating of gained glue, first normal temperature cure 5min, then 80 DEG C of solidifications
5min finally cures 5min at 120 DEG C, and the thickness control after solidification is at 10 μm, in case test.
Embodiment 4
Raw material：Tert-butyl acrylate 4g, acetoacetoxy ethyl methacrylate 0.5g, butyl acrylate 24.5g, acrylic acid
1g, acrylic acid -4- hydroxybutyls 1g, glycidyl methacrylate 2g, piperidinyl ethyl alcohol ester 1.5g, N- phenyl
Maleimide 0.5g, initiator (AIBN) 0.105g, ethyl acetate 60g and methanol 5g.
Preparation method：
1) by tert-butyl acrylate, acetoacetoxy ethyl methacrylate, butyl acrylate, acrylic acid, acrylic acid -4- hydroxyls
Base butyl ester, glycidyl methacrylate, piperidinyl ethyl alcohol ester, N-phenylmaleimide mixing, obtain monomer
Ethyl acetate and methanol are mixed to obtain mixed solvent by mixture.Above-mentioned monomer mixture 28g and mixed solvent 35.8g is taken, is poured into
With mechanical agitation, thermometer, condenser pipe four-hole boiling flask in be heated to 66 DEG C after, 0.032g initiator As IBN is poured into reaction
In flask, start timing, insulation reaction 0.5h after generating reflux in condenser pipe.
2) after reacting, permanent liquid leakage is added in residual monomer mixture, mixed solvent 9.8g and initiator A IBN 0.021g
It in bucket, is dropped evenly into reaction system in 3h, then insulation reaction 2h.
3) after reacting, remaining initiator A IBN and mixed solvent are poured into reaction bulb, temperature increases 80 DEG C of holding 3h.
4) after reacting, cooling discharge.
5) it weighs part glue and auxiliary agent phenyl silane oligomer is added, addition is the 1% of glue weight, is added anti-quiet
Electric agent chemistat 3500, dosage are the 0.1% of glue weight, and the equal anhydride diisocyanate (self-control) of curing agent is added, uses
Amount is the 2% of glue weight, is sufficiently stirred, on a pet film by the coating of gained glue, first normal temperature cure 5min, then 80 DEG C of solidifications
5min finally cures 5min at 120 DEG C, and the thickness control after solidification is at 10 μm, in case test.
Embodiment 5
Raw material：Tert-butyl acrylate 4g, acetoacetoxy ethyl methacrylate 0.5g, butyl acrylate 24.5g, acrylic acid
1g, acrylic acid -4- hydroxybutyls 1g, glycidyl methacrylate 2g, piperidinyl ethyl alcohol ester 1.5g, N- phenyl
Maleimide 0.5g, initiator (AIBN) 0.105g, ethyl acetate 60g and methanol 5g.
Preparation method：
1) by tert-butyl acrylate, acetoacetoxy ethyl methacrylate, butyl acrylate, acrylic acid, acrylic acid -4- hydroxyls
Base butyl ester, glycidyl methacrylate, piperidinyl ethyl alcohol ester, N-phenylmaleimide mixing, obtain monomer
Ethyl acetate and methanol are mixed to obtain mixed solvent by mixture.Above-mentioned whole monomer mixtures and mixed solvent 29.3g are taken,
Enter with mechanical agitation, thermometer, condenser pipe four-hole boiling flask in be heated to 66 DEG C after, 0.032g initiator As IBN is poured into instead
It answers in flask, starts timing, insulation reaction 0.5h after generating reflux in condenser pipe.
2) after reacting, mixed solvent 9.8g and initiator A IBN 0.021g are added in permanent liquid funnel, in 3h uniformly
It is added dropwise into reaction system, then insulation reaction 2h.
3) after reacting, remaining initiator A IBN and mixed solvent are poured into reaction bulb, temperature increases 80 DEG C of holding 3h.
4) after reacting, cooling discharge.
5) it weighs part glue and auxiliary agent phenyl silane oligomer is added, addition is the 1% of glue weight, is added anti-quiet
Electric agent chemistat 3500, dosage are the 0.1% of glue weight, and the equal anhydride diisocyanate (self-control) of curing agent is added, uses
Amount is the 2% of glue weight, is sufficiently stirred, on a pet film by the coating of gained glue, first normal temperature cure 5min, then 80 DEG C of solidifications
5min finally cures 5min at 120 DEG C, and the thickness control after solidification is at 10 μm, in case test.
Comparative example 1
Raw material：Tert-butyl acrylate 4g, butyl acrylate 27g, acrylic acid 1g, acrylic acid -4- hydroxybutyls 1g, methyl-prop
Olefin(e) acid ethylene oxidic ester 2g, initiator A IBN：0.105g (accounts for tert-butyl acrylate, butyl acrylate, acrylic acid, acrylic acid -4-
The 0.3% of hydroxybutyl, glycidyl methacrylate gross weight), ethyl acetate 60g and methanol 5g.
Preparation method：
1) tert-butyl acrylate, butyl acrylate, acrylic acid, acrylic acid -4- hydroxybutyls, Glycidyl methacrylate is sweet
Grease mixes, and obtains monomer mixture, ethyl acetate and methanol are mixed to obtain mixed solvent.It takes above-mentioned monomer mixture 28g and mixes
Bonding solvent 35.8g, pour into mechanical agitation, thermometer, condenser pipe four-hole boiling flask in be heated to 66 DEG C after, 0.032g is drawn
Hair agent AIBN is poured into reaction flask, starts timing, insulation reaction 0.5h after generating reflux in condenser pipe.
2) after reacting, permanent liquid leakage is added in residual monomer mixture, mixed solvent 9.8g and initiator A IBN 0.021g
It in bucket, is dropped evenly into reaction system in 3h, then insulation reaction 2h.
3) after reacting, remaining initiator A IBN and mixed solvent are poured into reaction bulb, temperature increases 80 DEG C of holding 3h.
4) after reacting, cooling discharge.
5) it weighs part glue and auxiliary agent phenyl silane oligomer is added, addition is the 1% of glue weight, is added anti-quiet
Electric agent chemistat 3500, dosage are the 0.1% of glue weight, and the equal anhydride diisocyanate (self-control) of curing agent is added, uses
Amount is the 2% of glue weight, is sufficiently stirred, on a pet film by the coating of gained glue, first normal temperature cure 5min, then 80 DEG C of solidifications
5min finally cures 5min at 120 DEG C, and the thickness control after solidification is at 10 μm, in case test.
Comparative example 2
Raw material：Tert-butyl acrylate 4g, acetoacetoxy ethyl methacrylate 0.5g, butyl acrylate 26.5g, acrylic acid
1g, acrylic acid -4- hydroxybutyls 1g, piperidinyl ethyl alcohol ester 1.5g, N-phenylmaleimide 0.5g, initiator
AIBN：0.105g (accounts for tert-butyl acrylate, acetoacetoxy ethyl methacrylate, butyl acrylate, acrylic acid, acrylic acid -4-
The 0.3% of hydroxybutyl, piperidinyl ethyl alcohol ester, N-phenylmaleimide gross weight), ethyl acetate 60g and methanol
5g。
Preparation method：
1) by tert-butyl acrylate, acetoacetoxy ethyl methacrylate, butyl acrylate, acrylic acid, acrylic acid -4- hydroxyls
Base butyl ester, piperidinyl ethyl alcohol ester, N-phenylmaleimide mixing, obtain monomer mixture, by ethyl acetate and first
Alcohol mixes to obtain mixed solvent.Take above-mentioned monomer mixture 28g and mixed solvent 35.8g, pour into mechanical agitation, thermometer,
After being heated to 66 DEG C in the four-hole boiling flask of condenser pipe, 0.032g initiator As IBN is poured into reaction flask, when being produced in condenser pipe
Start timing, insulation reaction 0.5h after raw reflux.
2) after reacting, permanent liquid leakage is added in residual monomer mixture, mixed solvent 9.8g and initiator A IBN 0.021g
It in bucket, is dropped evenly into reaction system in 3h, then insulation reaction 2h.
3) after reacting, remaining initiator A IBN and mixed solvent are poured into reaction bulb, temperature increases 80 DEG C of holding 3h.
4) after reacting, cooling discharge.
5) it weighs part glue and auxiliary agent phenyl silane oligomer is added, addition is the 1% of glue weight, is added anti-quiet
Electric agent chemistat 3500, dosage are the 0.1% of glue weight, and the equal anhydride diisocyanate (self-control) of curing agent is added, uses
Amount is the 2% of glue weight, is sufficiently stirred, on a pet film by the coating of gained glue, first normal temperature cure 5min, then 80 DEG C of solidifications
5min finally cures 5min at 120 DEG C, and the thickness control after solidification is at 10 μm, in case test.
Performance test：
180 ° of peeling strength test method GB/T2792-1998 of pressure-sensitive tape.
The resistance to heat testing method of pressure sensitive adhesive：180 ° of peeling strength test method GB/T2792 of method for making sample and pressure-sensitive tape-
1998 is identical, is then placed in 180 DEG C of baking ovens, after a period of time take out wait for temperature be cooled to room temperature slowly by batten never
It is stripped down on rust steel plate, records residue glue situation on stainless steel plate.It is tested under the conditions of 25 DEG C of room temperature.Embodiment and compare
The performance characterization of example see the table below shown in 1.
Table 1
Can be seen that from the result of embodiment and comparative example does not have 180 ° of peeling force height of heat-resistant monomer in pressure sensitive adhesive, resistance to
Hot difference, residue glue are serious；180 ° of peeling forces that heat-resistant monomer is added in pressure sensitive adhesive raw material are relatively low, heat-resist, embodiment 1-5's
Resistance to Thermal test be added without residue glue, wherein in embodiment 4 tert-butyl acrylate 4g, acetoacetoxy ethyl methacrylate 0.5g,
Butyl acrylate 24.5g, acrylic acid 1g, acrylic acid -4- hydroxybutyls 1g, glycidyl methacrylate 2g, metering system
Sour piperidinyl-acetate 1.5g, N-phenylmaleimide 0.5g and first monomer total amount 80% is put into when feeding intake, solvent is total
The comprehensive performance of the 55% of amount, the glue made according to such technique is most prominent, is cooled to after handling 2h under the conditions of 180 DEG C
Room temperature does not have residue glue phenomenon, peeling force can be down to 8g/25mm.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although with reference to aforementioned reality
Applying example, invention is explained in detail, for those skilled in the art, still can be to aforementioned each implementation
Technical solution recorded in example is modified or equivalent replacement of some of the technical features.All essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (9)
1. a kind of Antistatic type high temperature resistant acrylate pressure-sensitive adhesive, which is characterized in that including (A) component and (B) component,
(A) component is made by the raw material of following weight percent：Hard monomer 4-8%, soft monomer 18-28%, function monomer
2-8%, heat-resistant monomer 1-3%, solvent 65%；And account for the gross weight of the hard monomer, soft monomer, function monomer, heat-resistant monomer
The initiator of the 0.1-0.5% of amount；
(B) component includes one or more of curing agent, auxiliary agent and electrostatic agent；The curing agent, auxiliary agent and electrostatic agent
2-5%, 0.1-1%, 0.1-1% of described (A) component weight are accounted for respectively；
Wherein, the heat-resistant monomer is piperidinyl ethyl alcohol ester, ring trimethylolpropane contracting dimethoxym ethane acrylate, benzene
One or both of oxygen Bian acrylate, acrylamide, N- hydroxyacrylamides, N-phenylmaleimide.
2. pressure sensitive adhesive according to claim 1, which is characterized in that the hard monomer is tert-butyl acrylate, metering system
It is one or more in the own ester of acid, acetoacetoxy ethyl methacrylate, trans--talan；
The soft monomer is one or more in butyl acrylate, Isooctyl acrylate monomer, ethoxyethyl acrylate；
The function monomer be itaconic acid, acrylic acid, methacrylic acid, glycidyl methacrylate, hydroxy-ethyl acrylate,
One kind or more in hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxy propyl methacrylate, acrylic acid -4- hydroxybutyls
Kind.
3. pressure sensitive adhesive according to claim 1, which is characterized in that the solvent is ethyl acetate and/or methanol.
4. pressure sensitive adhesive according to claim 1, which is characterized in that the initiator is azodiisobutyronitrile, 2,2- azos
Bis- (2- amidine propanes) dihydrochlorides and/or dibenzoyl peroxide.
5. pressure sensitive adhesive according to claim 1, which is characterized in that
The curing agent is aluminium acetylacetonate, acetylacetone,2,4-pentanedione zirconium, equal anhydride diisocyanate, toluene di-isocyanate(TDI), six methylenes
It is one or more in group diisocyanate, m-xylene diamine type epoxy resin；
The auxiliary agent is phenyl silane oligomer, phenyl silane oligomer, acryloxy silane oligomer, acryloxy silicon
It is one or two kinds of in alkane oligomer, vinyl silanes oligomer, vinyl silanes oligomer；
The antistatic agent is one or two kinds of in chemistat 3500, LS-970.
6. one kind pressure sensitive adhesive as described in any one of claim 1-5, which is characterized in that (A) component includes following heavy
Measure each ingredient of percentage：
Tert-butyl acrylate 4%, acetoacetoxy ethyl methacrylate 0.5%, butyl acrylate 24.5%, acrylic acid 1%, third
Olefin(e) acid -4- hydroxybutyls 1%, glycidyl methacrylate 2%, piperidinyl ethyl alcohol ester 1.5%, N- phenyl horses
Come acid imide 0.5%, ethyl acetate 60%, methanol 5%, and other than the ethyl acetate, methanol all the components total amount
0.3% azodiisobutyronitrile.
7. a kind of preparation method of the pressure surface glue as described in any one of claim 1-5, which is characterized in that including following steps
Suddenly：
(1) monomer mixture is obtained after mixing hard monomer, soft monomer, function monomer and heat-resistant monomer, by above-mentioned monomer mixture
60~100%, solvent total amount 45~65% mixing after be added reaction vessel in, after heating be added initiator total amount 30~
40%, carry out insulation reaction；
It (2) will be uniform after 20~35% mixing of remaining monomer mixture, the 15~25% of solvent total amount and initiator total amount
It is added drop-wise in the mixture that step (1) obtains, carries out insulation reaction；
(3) remaining initiator and residual solvent are added in the mixture for carrying out being obtained after step (2), are reacted after heating；
(4) the mixture cooling discharge for obtaining step (3).
8. preparation method according to claim 7, which is characterized in that
In the step (1), initiator is added after being heated to 66~76 DEG C, reaction is always maintained at low-temp reaction early period, institute
It states reaction vessel and carries condenser pipe, the insulation reaction time carries out 0.5h from condenser pipe generates reflux；
In the step (2), time for adding is 1.5~3h, and the insulation reaction time is 2h；
In the step (3), 3h is reacted after being warming up to 80 DEG C.
9. a kind of application of the pressure surface glue as described in any one of claim 1-5, which is characterized in that (A) is added in (B) component
Component is coated on basilar memebrane after mixing, solidification.
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Application publication date: 20181106 |