CN112063318A - Acid-alkali-resistant antistatic high-temperature adhesive tape and preparation method thereof - Google Patents
Acid-alkali-resistant antistatic high-temperature adhesive tape and preparation method thereof Download PDFInfo
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- CN112063318A CN112063318A CN202010896414.2A CN202010896414A CN112063318A CN 112063318 A CN112063318 A CN 112063318A CN 202010896414 A CN202010896414 A CN 202010896414A CN 112063318 A CN112063318 A CN 112063318A
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- antistatic
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- adhesive tape
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 101
- 239000003513 alkali Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000010410 layer Substances 0.000 claims abstract description 159
- 239000000853 adhesive Substances 0.000 claims abstract description 89
- 230000001070 adhesive effect Effects 0.000 claims abstract description 89
- 239000000203 mixture Substances 0.000 claims abstract description 70
- 229920002799 BoPET Polymers 0.000 claims abstract description 65
- 239000004593 Epoxy Substances 0.000 claims abstract description 55
- 238000003851 corona treatment Methods 0.000 claims abstract description 45
- 239000002585 base Substances 0.000 claims abstract description 41
- 238000000576 coating method Methods 0.000 claims abstract description 40
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- 239000012790 adhesive layer Substances 0.000 claims abstract description 38
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims abstract description 37
- 239000002253 acid Substances 0.000 claims abstract description 36
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims abstract description 33
- 150000003863 ammonium salts Chemical group 0.000 claims abstract description 31
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 26
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 26
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 229920002050 silicone resin Polymers 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 24
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 19
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 19
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims abstract description 17
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 claims abstract description 17
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 claims abstract description 17
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 17
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 16
- 238000001035 drying Methods 0.000 claims abstract description 11
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 51
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 48
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 48
- 239000002216 antistatic agent Substances 0.000 claims description 35
- 239000002904 solvent Substances 0.000 claims description 33
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 27
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 21
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 15
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 11
- 238000009835 boiling Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 11
- 230000035515 penetration Effects 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 9
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 9
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 9
- 229920003986 novolac Polymers 0.000 claims description 8
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 claims description 7
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 7
- 239000000113 methacrylic resin Substances 0.000 claims description 7
- 229920006223 adhesive resin Polymers 0.000 claims description 6
- 239000013464 silicone adhesive Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 26
- 230000003068 static effect Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 description 18
- 239000000047 product Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 241000857908 Chimonanthus nitens Species 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003348 petrochemical agent Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
- C09J2471/003—Presence of polyether in the primer coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Abstract
The invention discloses an acid and alkali resistant antistatic high-temperature adhesive tape and a preparation method thereof, and the adhesive tape is characterized in that: the acid-base-resistant antistatic high-temperature adhesive tape consists of a PET (polyethylene terephthalate) film layer subjected to corona treatment, antistatic layers coated on two sides of the PET film layer subjected to corona treatment and an adhesive layer coated on the antistatic layer on one side of the PET film layer subjected to corona treatment; after coating the adhesive, drying at the temperature of 40-130 ℃ to obtain the acid and alkali resistant antistatic high-temperature adhesive tape; the raw material composition of the adhesive comprises: silicone resin, epoxy modified acrylic resin, one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, and an epoxy curing agent. The invention has the performances of acid and alkali resistance, static resistance, high temperature resistance and the like, and is suitable for protection in the manufacturing of electronic products.
Description
Technical Field
The invention belongs to an adhesive tape and preparation thereof, and relates to an acid-alkali-resistant antistatic high-temperature adhesive tape and a preparation method thereof. The acid-alkali-resistant antistatic high-temperature adhesive tape is suitable for the manufacturing and cleaning processes of electronic product circuit boards, plays a role in protection, and is particularly suitable for the field of cleaning aluminum plates or copper plates under the conditions of strong acid and alkali.
Background
With the continuous development of economy and the continuous improvement of the requirements of people on living level, the information technology has a rapid development. The adhesive tape technology has also penetrated into various industries, and in the fields of 5G electronics and panels, cleaning of electronic product circuit boards, protection and fixation in the manufacturing process of parts, and shielding processes of printed circuit boards and high-temperature treatment, surface parts of a large number of glass plates, aluminum plates, copper plates and other plates need to be protected and sealed, some plates need to be produced under harsh conditions (130 ℃ high temperature and boiling acid and alkali solution), and the adhesive tape used after the manufacturing process is finished can be easily torn off and cannot generate electrostatic action, so that the adhesive tape used is not influenced by temperature, acid and alkali solution and static electricity. The base material and the adhesive selected by the prior adhesive tape have many problems, and in the prior art, the commonly used protective adhesive tape is a polyvinyl chloride (PVC) electrical insulating adhesive tape, which is also called as a PVC electrical adhesive tape. Although the PVC film has good toughness, ductility and the like, the PVC adhesive tape has some defects, contains harmful substances such as halogen and the like, can cause certain harm to the environment and people, is easy to deform when heated, and has limited production process; when organic silicon is used in the adhesive, the heat resistance is good, but the silicon loss phenomenon is often accompanied, but the heat resistance of the acrylate is generally poor, the thermo-oxidative aging resistance is poor, the adhesive force gradually increases along with the temperature increase, the final stripping difficulty is large, and particularly in a boiling acid-base solution, the edge penetration is easily caused. Therefore, the protection of the metal plate materials such as aluminum plate, copper plate, etc. is adversely affected.
The prior literature reports that: the Jiangsu Asialong digital science and technology limited company develops a composite resin-based acid and alkali resistant adhesive tape and a preparation method thereof, has better acid and alkali resistance, and can replace polyvinyl chloride (PVC for short) electric insulating adhesive tapes; however, the halogen contained in the product has certain harm to the environment and human body, and has poor acid and alkali resistance and poor practicability.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an acid-base-resistant antistatic high-temperature adhesive tape and a preparation method thereof. Therefore, the acid and alkali resistant antistatic high-temperature adhesive tape and the preparation method thereof are provided, wherein the acid and alkali resistant antistatic high-temperature adhesive tape has good performances of acid and alkali resistance, antistatic effect, high temperature resistance and the like, and can be used for circuit boards or aluminum plates and other base materials in the electronic field of 5G and the like under harsh preparation conditions.
The content of the invention is as follows: an acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that: the antistatic PET film is characterized by consisting of a PET film layer (1) subjected to corona treatment, an antistatic layer (4) and an antistatic layer (5) coated on the two sides of the PET film layer (1) subjected to corona treatment, and an adhesive layer (6) coated on the antistatic layer (5) coated on one side of the PET film layer (1) subjected to corona treatment;
the PET film layer (1) is a polyethylene terephthalate film layer for short;
the antistatic layer (4) and the antistatic layer (5) are both composed of antistatic agents, and the antistatic agents are composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt; the antistatic agent production and supply enterprises are as follows: chu-man chemical industry Co., Ltd, Guangzhou city, and the like;
the adhesive layer (6) is composed of an adhesive, and the adhesive comprises the following raw material components in percentage by mass:
20 to 40 parts by mass of an organic silicone resin (provided for production, the enterprises include Dow Corning, blue Star (group) of China, Sanmu group of Jiangsu, and the like, the same shall apply later),
10 to 40 parts by mass of a silicone resin (provided for production, i.e., Boridada (Dongguan) New Material Co., Ltd., Guangzhou Si scribble source chemical Co., Ltd., Guangzhou Batai chemical Co., Ltd., the same applies later),
10 to 40 parts by mass of an epoxy-modified acrylic resin,
5 to 15 parts by mass of one or a mixture of two or more of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate (production and supply enterprises include Yongxing chemical, Chimonanthus nitens chemical, Ningbo good endurance new material science and technology Co., Ltd., the same applies hereinafter),
5-15 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt,
and 1-5 parts by mass of an epoxy curing agent.
The invention comprises the following steps: the epoxy modified acrylic resin is one or a mixture of more than two of epoxy methacrylic resin, epoxy acrylate and novolac epoxy acrylate, and the product production providing enterprises are as follows: guangdong Yue beautification chemical Co., Ltd, Guangzhou Kanyu chemical Co., Ltd, Guangzhou Kangda chemical Co., Ltd, and the like.
The invention comprises the following steps: the epoxy curing agent is one or a mixture of more than two of Diamino Diphenyl Sulfone (DDS), Diamino Diphenyl Methane (DDM), aluminum acetylacetonate and imidazole, and the product production and provision enterprises are as follows: changxing Chemicals, Guangdong Shunhuan New Material Co., Ltd, Yuanbang polymer materials Co., Ltd, guan city, and the like.
The invention comprises the following steps: the adhesive also comprises 10-40 parts by mass of a solvent, wherein the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene, and product production providing enterprises comprise: china petrochemicals, etc.
The invention comprises the following steps: the thickness of antistatic layer (4), antistatic layer (5) is 0.5 ~ 2 mu m, the thickness of adhesive layer (6) is 5 ~ 50 mu m.
Another aspect of the invention is: the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape is characterized by comprising the following steps of:
a. preparing an adhesive:
taking raw materials of 20-40 parts by mass of organic silicone adhesive resin, 10-40 parts by mass of silicone resin, 10-40 parts by mass of epoxy modified acrylic resin, 5-15 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 5-15 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, 1-5 parts by mass of epoxy curing agent and 10-40 parts by mass of solvent, and uniformly mixing (forming a uniform solution), thus obtaining the adhesive;
the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene, and the product production providing enterprises comprise: china petrochemical industry, etc.;
the viscosity of the prepared adhesive is 200-8000 cps at 25 ℃;
b. preparing acid-base-resistant antistatic high-temperature adhesive tape:
taking a PET film, carrying out corona treatment by a corona treatment machine (provided by Shanghai Kejia electronics Co., Ltd., Shenzhen, Yue Feng electronics Co., Ltd., or Luoyang Bangtong electronics Co., Ltd., the voltage range of the corona treatment machine is between 10000-; further, the prepared acid-base-resistant antistatic high-temperature adhesive tape can be rolled, cut, packaged and put in storage and the like;
the PET film layer (1) is a polyethylene terephthalate film layer for short;
the antistatic agent is composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt; the production and supply enterprises of the antistatic agent are as follows: chu-humanization chemical Co., Ltd, Guangzhou City, etc.
In another aspect of the invention: in the step a, the epoxy modified acrylic resin is one or a mixture of more than two of epoxy methacrylic resin, epoxy acrylate and novolac epoxy acrylate, and product production providing enterprises include: guangdong beautifying chemical company, Guangzhou Jiayun chemical company, Guangzhou Huada chemical company, etc.
In another aspect of the invention: in the step a, the epoxy curing agent is one or a mixture of more than two of Diamino Diphenyl Sulfone (DDS), Diamino Diphenyl Methane (DDM), aluminum acetylacetonate and imidazole, and the product production and provision enterprises include: changxing chemical, Guangdong Shunhuan new materials Co., Ltd, Yuanbang high molecular materials Co., Ltd, Dongguan city, and the like.
In another aspect of the invention: in the step b, the thickness of the antistatic layer (4) and the thickness of the antistatic layer (5) are both 0.5-2 μm, and the thickness of the adhesive layer (6) is 5-50 μm.
In another aspect of the invention: the acid-base-resistant antistatic high-temperature adhesive tape prepared in the step b has the adhesive force (at 25 ℃) of 3-10N/25 mm, and is soaked in 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution for 30 minutes, wherein the edge penetration is 0.03-0.09 mm; the film tearing voltage is 200-500V when the adhesive tape is peeled; the covering plate does not come unstuck within 600 hours; the adhesive force is 2-8N/25 mm under the conditions of 85 ℃ of temperature and 85 ℃ of humidity for 500 hours.
Compared with the prior art, the invention has the following characteristics and beneficial effects:
(1) according to the invention, one or more different resins (organic silicone resin, epoxy modified acrylic resin, methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate) are mixed, then antistatic agents (polyethylene oxide, polyether ester amide and polyquaternary ammonium salt), curing agents (epoxy) and solvents (ethyl acetate, methyl ethyl ketone and toluene) are added to prepare an acid-base-resistant antistatic temperature-resistant adhesive, then the adhesive is uniformly coated on the surface of polyethylene terephthalate (PET for short) by a coating process, and the adhesive can be completely cured and reacted after being dried for 1-10 minutes at the temperature of 40-130 ℃, so that a compact adhesive layer is formed, and the acid-base-resistant antistatic high-temperature adhesive tape with good acid-base-resistant antistatic temperature-resistant effects is obtained;
(2) the antistatic agent is added into the adhesive in an internal adding mode, and one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt is used as the antistatic agent, so that the antistatic adhesive has good compatibility with resin, stable and durable antistatic effect, strong motion capability of molecular chains in the resin, easy movement of protons among molecules and capability of effectively conducting and releasing generated static charges, and has good antistatic effect on the adhesive; after the antistatic agent is added, the electrostatic acting force is reduced to be less than or equal to 500V from more than 2000V, after the circuit board is manufactured and cleaned, the damage of static electricity to the circuit board is reduced when the adhesive tape is removed, and the burning or board burning phenomenon of static electricity to the circuit board is reduced;
(3) by adopting the invention, the adhesive has good curing shrinkage rate of 0.05-0.2%, the prepared acid-base-resistant antistatic high-temperature adhesive tape has good acid-base resistance (0.15mol/L of hydrogen chloride or sodium hydroxide boiling solution is soaked for 30 minutes, the edge penetration is 0.03-0.09 mm), good antistatic performance (the voltage of a film tearing film when the adhesive tape is peeled off is 200-500V), good adhesive force and cohesive force (the covering plate does not come unstuck after 600 hours), stable bonding force (the bonding force is 2-8N/25 mm after 500 hours under the conditions of 85 ℃ and 85 ℃ of humidity) under the high-temperature and high-humidity condition, excellent protective performance, weather resistance and stability on the plate surface, and is suitable for the manufacturing process of electronic product circuit boards and panels;
(4) the acid-base-resistant antistatic high-temperature adhesive tape prepared by the invention has the advantages that the adhesive does not fall off within 1 hour at the temperature of 160 ℃, the bonding force is 3-10N/25 mm, and the variation range is +/-0.5N; soaking in 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution for 30 minutes until the edge penetration is less than or equal to 0.1 mm; the film tearing voltage is less than or equal to 500V when the adhesive tape is peeled; the covering plate does not come unstuck for a long time (600 hours); aging resistance and good temperature and humidity resistance; in addition, after the manufacturing process of the panel or the circuit board is finished, one side protected by the adhesive tape can be peeled off, the adhesive does not fall off during peeling, and the performance and the using effect are good;
(5) the product of the invention has simple preparation process, simple and convenient working procedure, easy operation and strong practicability.
Drawings
FIG. 1 is a schematic structural diagram of an acid and alkali resistant antistatic high temperature adhesive tape in an embodiment of the invention.
In the figure: 1-polyethylene terephthalate film layer (PET film layer), 2, 3-corona layer, 4, 5-antistatic layer, 6-adhesive layer.
Detailed Description
The following examples are intended to further illustrate the present invention and should not be construed as limiting the scope of the invention, which is intended to be covered by the claims appended hereto.
Example 1:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape comprises the following steps:
a. preparing an adhesive: at room temperature, the following were charged into a container: 20 parts by mass of organic silicone resin, 30 parts by mass of epoxy modified acrylic resin (epoxy methacrylic resin), 10 parts by mass of methacrylic acid, 8 parts by mass of polyethylene oxide, 2 parts by mass of epoxy curing agent (diamino diphenyl sulfone), and 25 parts by mass of ethyl acetate as a solvent, and fully mixing to obtain an adhesive A; the viscosity of the adhesive A is 3900 to 4200cps at 25 ℃.
b. Preparing acid-base-resistant antistatic high-temperature adhesive tape: taking a PET film (namely a polyethylene glycol terephthalate film, and then carrying out corona treatment on the PET film), coating polyethylene oxide on two surfaces of the PET film after corona treatment, wherein the coating thickness is 1 mu m, and an antistatic layer 4 and an antistatic layer 5 with the thickness of 1 mu m are formed, then coating (namely coating) the adhesive A prepared in the step a on the antistatic layer 5 at the temperature of 23 ℃, and then drying for 5 minutes at the temperature of 90 ℃, thus obtaining the acid-base-resistant antistatic high-temperature adhesive tape A.
Through detection: the adhesive force (25 ℃) of the acid-base-resistant antistatic high-temperature adhesive tape A is 6.6N/25mm, the adhesive force is soaked in 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution for 30 minutes, and the edge penetration is 0.07 mm; the tearing voltage when the adhesive tape is peeled is 366V; the covering plate does not come unstuck within 600 hours; the adhesive force is 5.8N/25mm under the conditions of 85 ℃ of temperature and 85 ℃ of humidity for 500 hours.
Example 2:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape comprises the following steps:
a. preparing an adhesive: at room temperature, the following were charged into a container: 40 parts by mass of organic silicone resin, 20 parts by mass of silicone resin, 25 parts by mass of epoxy modified acrylic resin (epoxy acrylate), 7 parts by mass of hydroxyethyl acrylate, 6 parts by mass of polyether ester amide, 2 parts by mass of epoxy curing agent (diaminodiphenylmethane), and 20 parts by mass of solvent methyl ethyl ketone, and fully mixing to obtain an adhesive B; the viscosity of the adhesive B is 3100 to 3900cps at 25 ℃.
b. Preparing acid-base-resistant antistatic high-temperature adhesive tape: taking a PET film (namely a polyethylene glycol terephthalate film, and then carrying out corona treatment on the PET film, coating polyether ester amide on two surfaces of the corona-treated PET film, wherein the coating thickness is 1 mu m, and forming an antistatic layer 4 and an antistatic layer 5 with the thickness of 1 mu m, then coating (namely coating) the adhesive A prepared in the step a on the antistatic layer 5 at the temperature of 23 ℃, and then drying for 5 minutes at the temperature of 90 ℃, thus obtaining the acid-base-resistant antistatic high-temperature adhesive tape B.
Through detection: the adhesive force (25 ℃) of the prepared acid-base-resistant antistatic high-temperature adhesive tape B is 6.2N/25mm, the adhesive force is soaked in 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution for 30 minutes, and the edge penetration is 0.07 mm; the tearing voltage when the adhesive tape is peeled is 416V; the covering plate does not come unstuck within 600 hours; the adhesive force is 5.4N/25mm under the conditions of 85 ℃ of temperature and 85 ℃ of humidity for 500 hours.
Example 3:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape comprises the following steps:
a. preparing an adhesive: at room temperature, the following were charged into a container: 20 parts by mass of organic silicone resin, 40 parts by mass of silicone resin, 21 parts by mass of epoxy modified acrylic resin (novolac epoxy acrylate), 9 parts by mass of hydroxypropyl acrylate, 5 parts by mass of polyethylene oxide, 5 parts by mass of epoxy curing agent (aluminum acetylacetonate), and 15 parts by mass of solvent toluene, and fully mixing to obtain an adhesive C; the viscosity of the adhesive C is up to 2100 to 2200cps at 25 ℃.
b. Preparing acid-base-resistant antistatic high-temperature adhesive tape: taking a PET film (namely a polyethylene glycol terephthalate film, and then carrying out corona treatment on the PET film), coating polyethylene oxide on two surfaces of the PET film after corona treatment, wherein the coating thickness is 1 mu m, and an antistatic layer 4 and an antistatic layer 5 with the thickness of 1 mu m are formed, then coating (namely coating) the adhesive A prepared in the step a on the antistatic layer 5 at the temperature of 23 ℃, and then drying for 6 minutes at the temperature of 85 ℃, thus obtaining the acid-base-resistant antistatic high-temperature adhesive tape C.
Through detection: the adhesive force (25 ℃) of the prepared acid-base-resistant antistatic high-temperature adhesive tape C is 4.1N/25mm, the adhesive force is soaked in 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution for 30 minutes, and the edge penetration is 0.06 mm; the tearing voltage when the adhesive tape is peeled off is 432V; the covering plate does not come unstuck within 600 hours; the adhesive force is 3.3N/25mm under the conditions of 85 ℃ of temperature and 85 ℃ of humidity for 500 hours.
Example 4:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape comprises the following steps:
a. preparing an adhesive: at room temperature, the following were charged into a container: fully mixing 35 parts by mass of organic silicone resin, 10 parts by mass of silicone resin, 35 parts by mass of epoxy modified acrylic resin (novolac epoxy acrylate), 5 parts by mass of hydroxypropyl methacrylate, 12 parts by mass of polyethylene oxide, 3 parts by mass of epoxy curing agent (imidazole) and 35 parts by mass of ethyl acetate serving as a solvent to obtain an adhesive D; the viscosity of the adhesive D is 5300-5700 cps (25 ℃).
b. Preparing acid-base-resistant antistatic high-temperature adhesive tape: taking a PET film (namely a polyethylene glycol terephthalate film, and then carrying out corona treatment on the PET film, coating polyethylene oxide on two surfaces of the corona-treated PET film, wherein the coating thickness is 1.5 mu m, and forming an antistatic layer 4 and an antistatic layer 5 with the thickness of 1.5 mu m, then coating (namely coating) the adhesive A prepared in the step a on the antistatic layer 5 at the temperature of 23 ℃, and then drying for 7 minutes at the temperature of 80 ℃ to obtain the acid-base-resistant antistatic high-temperature adhesive tape D.
Through detection: the adhesive force (25 ℃) of the prepared acid-base-resistant antistatic high-temperature adhesive tape D is 7.4N/25mm, the adhesive force is soaked in 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution for 30 minutes, and the edge penetration is 0.04 mm; the film tearing voltage when the adhesive tape is peeled is 237V; the covering plate does not come unstuck within 600 hours; the adhesive force is 6.9N/25mm under the conditions of 85 ℃ of temperature and 85 ℃ of humidity for 500 hours.
Example 5:
an acid and alkali resistant antistatic high-temperature adhesive tape comprises a PET film layer 1 subjected to corona treatment, an antistatic layer 4 and an antistatic layer 5 coated on the two sides of the PET film layer 1 subjected to corona treatment, and an adhesive layer 6 coated on the antistatic layer 5 on one side of the PET film layer 1 subjected to corona treatment;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic layer 4 and the antistatic layer 5 are both composed of antistatic agents, and the antistatic agents are composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt; the antistatic agent is a commercial product, and production supply enterprises comprise: chu-man chemical industry Co., Ltd, Guangzhou city, and the like;
the adhesive layer 6 is composed of an adhesive, and the raw material components and the mass ratio of the adhesive comprise: 20 parts by mass of silicone resin (provided enterprises include Dow Corning, China Lanxing group Co., Ltd., Jiangsu Sanmu group Co., Ltd., the same applies hereinafter), 10 parts by mass of silicone resin (provided enterprises include Boridada (Dongguan) New Material Co., Ltd., Guangzhou Si scribble Source chemical Co., Ltd., Guangzhou Batai chemical Co., Ltd., the same applies hereinafter), 10 parts by mass of epoxy-modified acrylic resin, 5 parts by mass of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, one or more than two of hydroxypropyl methacrylate (production and supply enterprises include Changxing chemistry, Chimonanthus nitens chemistry, Ningbo good endurance new materials science and technology Co., Ltd., the same shall apply later), 5 parts by mass of one or more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, and 1 part by mass of epoxy curing agent.
Example 6:
an acid and alkali resistant antistatic high-temperature adhesive tape comprises a PET film layer 1 subjected to corona treatment, an antistatic layer 4 and an antistatic layer 5 coated on the two sides of the PET film layer 1 subjected to corona treatment, and an adhesive layer 6 coated on the antistatic layer 5 on one side of the PET film layer 1 subjected to corona treatment;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic layer 4 and the antistatic layer 5 are both composed of antistatic agents, and the antistatic agents are composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt;
the adhesive layer 6 is composed of an adhesive, and the raw material components and the mass ratio of the adhesive comprise: 40 parts by mass of silicone adhesive resin, 40 parts by mass of silicone resin, 40 parts by mass of epoxy modified acrylic resin, 15 parts by mass of one or a mixture of two or more of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 15 parts by mass of one or a mixture of two or more of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, and 5 parts by mass of epoxy curing agent.
Example 7:
an acid and alkali resistant antistatic high-temperature adhesive tape comprises a PET film layer 1 subjected to corona treatment, an antistatic layer 4 and an antistatic layer 5 coated on the two sides of the PET film layer 1 subjected to corona treatment, and an adhesive layer 6 coated on the antistatic layer 5 on one side of the PET film layer 1 subjected to corona treatment;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic layer 4 and the antistatic layer 5 are both composed of antistatic agents, and the antistatic agents are composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt;
the adhesive layer 6 is composed of an adhesive, and the raw material components and the mass ratio of the adhesive comprise: 25 parts by mass of a silicone adhesive resin, 18 parts by mass of a silicone resin, 18 parts by mass of an epoxy modified acrylic resin, 8 parts by mass of one or a mixture of two or more of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 8 parts by mass of one or a mixture of two or more of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, and 2 parts by mass of an epoxy curing agent.
Example 8:
an acid and alkali resistant antistatic high-temperature adhesive tape comprises a PET film layer 1 subjected to corona treatment, an antistatic layer 4 and an antistatic layer 5 coated on the two sides of the PET film layer 1 subjected to corona treatment, and an adhesive layer 6 coated on the antistatic layer 5 on one side of the PET film layer 1 subjected to corona treatment;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic layer 4 and the antistatic layer 5 are both composed of antistatic agents, and the antistatic agents are composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt;
the adhesive layer 6 is composed of an adhesive, and the raw material components and the mass ratio of the adhesive comprise: 30 parts by mass of a silicone adhesive resin, 25 parts by mass of a silicone resin, 25 parts by mass of an epoxy-modified acrylic resin, 10 parts by mass of one or a mixture of two or more of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 10 parts by mass of one or a mixture of two or more of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, and 3 parts by mass of an epoxy curing agent.
Example 9:
an acid and alkali resistant antistatic high-temperature adhesive tape comprises a PET film layer 1 subjected to corona treatment, an antistatic layer 4 and an antistatic layer 5 coated on the two sides of the PET film layer 1 subjected to corona treatment, and an adhesive layer 6 coated on the antistatic layer 5 on one side of the PET film layer 1 subjected to corona treatment;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic layer 4 and the antistatic layer 5 are both composed of antistatic agents, and the antistatic agents are composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt;
the adhesive layer 6 is composed of an adhesive, and the raw material components and the mass ratio of the adhesive comprise: 35 parts by mass of a silicone adhesive resin, 33 parts by mass of a silicone resin, 33 parts by mass of an epoxy-modified acrylic resin, 13 parts by mass of one or a mixture of two or more of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 13 parts by mass of one or a mixture of two or more of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, and 4 parts by mass of an epoxy curing agent.
Example 10:
the acid and alkali resistant antistatic high-temperature adhesive tape comprises 25 parts by mass of a solvent, wherein the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene, and a product production provider comprises: china petrochemical, etc., the same as the latter. Otherwise, the same as in any of examples 5 to 9 was omitted.
Example 11:
the raw material components of the adhesive also comprise 10 parts by mass of a solvent, wherein the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene, and the rest is the same as any one of the embodiments 5 to 9 and is omitted.
Example 12:
the raw material components of the adhesive also comprise 40 parts by mass of a solvent, wherein the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene, and the rest is the same as any one of the adhesive in the embodiments 5 to 9 and is omitted.
Example 13:
the acid-base-resistant antistatic high-temperature adhesive tape comprises the raw material components of 10-40 parts by mass of a solvent, wherein the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene, and the rest of the components are the same as those in any one of embodiments 5-9 and are omitted.
Example 14:
the acid-base-resistant antistatic high-temperature adhesive tape comprises the raw material components of 10-40 parts by mass of a solvent, wherein the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene, and the rest of the components are the same as those in any one of embodiments 5-9 and are omitted.
Example 15:
the acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that the thickness of each of the antistatic layer 4 and the antistatic layer 5 is 0.5 mu m, the thickness of the adhesive layer 6 is 5 mu m, and the rest parts are omitted as in any one of the embodiments 5-14.
Example 16:
the acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that the thickness of each of the antistatic layer 4 and the antistatic layer 5 is 2 micrometers, the thickness of the adhesive layer 6 is 50 micrometers, and the rest parts are omitted as in any one of the embodiments 5-14.
Example 17:
the acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that the thickness of each of the antistatic layer 4 and the antistatic layer 5 is 1.2 mu m, the thickness of the adhesive layer 6 is 28 mu m, and the rest parts are omitted as in any one of the embodiments 5 to 14.
Example 18:
the acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that the thickness of each of the antistatic layer 4 and the antistatic layer 5 is 1 micrometer, the thickness of the adhesive layer 6 is 15 micrometers, and the other parts are omitted as in any one of the embodiments 5-14.
Example 19:
the acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that the thickness of each of the antistatic layer 4 and the antistatic layer 5 is 1.5 mu m, the thickness of the adhesive layer 6 is 35 mu m, and the rest parts are omitted as in any one of the embodiments 5 to 14.
Example 20:
the acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that the thickness of each of the antistatic layer 4 and the antistatic layer 5 is 1.8 mu m, the thickness of the adhesive layer 6 is 43 mu m, and the rest parts are omitted as in any one of the embodiments 5-14.
In examples 5-20 above:
the epoxy modified acrylic resin is one or a mixture of more than two of epoxy methacrylic resin, epoxy acrylate and novolac epoxy acrylate, and the product production providing enterprises are as follows: guangdong beautifying chemical company, Guangzhou Jiayun chemical company, Guangzhou Huada chemical company, and the like;
the epoxy curing agent is one or a mixture of more than two of Diamino Diphenyl Sulfone (DDS), Diamino Diphenyl Methane (DDM), aluminum acetylacetonate and imidazole, and the product production and provision enterprises are as follows: changxing Chemicals, Guangdong Shunhuan New materials Co., Ltd, Yuanbang high molecular materials Co., Ltd, guan city, and the like;
example 21:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape is characterized by comprising the following steps of:
a. preparing an adhesive:
taking raw materials of 20 parts by mass of organic silicone resin, 10 parts by mass of epoxy modified acrylic resin, 5 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 5 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, 1 part by mass of epoxy curing agent and 10 parts by mass of solvent, and uniformly mixing (forming a uniform solution), thus obtaining the adhesive;
the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene;
b. preparing acid-base-resistant antistatic high-temperature adhesive tape:
taking a PET film, carrying out corona treatment, coating (or called coating) antistatic agents on two sides of the PET film layer 1 subjected to corona treatment to form an antistatic layer 4 and an antistatic layer 5, coating (or called coating) the adhesive prepared in the step a on the antistatic layer 5 at the temperature of 20 ℃, and then drying at the temperature of 40 ℃ for 10 minutes to form an adhesive layer 6, namely the acid-base-resistant antistatic high-temperature adhesive tape is prepared;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic agent is composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt.
Example 22:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape is characterized by comprising the following steps of:
a. preparing an adhesive:
taking raw materials of 40 parts by mass of organic silicone resin, 40 parts by mass of epoxy modified acrylic resin, 15 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 15 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, 5 parts by mass of epoxy curing agent and 40 parts by mass of solvent, and uniformly mixing the raw materials (forming a uniform solution), thus obtaining the adhesive; the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene;
b. preparing acid-base-resistant antistatic high-temperature adhesive tape:
taking a PET film, carrying out corona treatment, coating (or called coating) antistatic agents on two sides of the PET film layer 1 subjected to corona treatment to form an antistatic layer 4 and an antistatic layer 5, coating (or called coating) the adhesive prepared in the step a on the antistatic layer 5 at the temperature of 25 ℃, and then drying at the temperature of 130 ℃ for 1 minute to form an adhesive layer 6, namely the acid-base-resistant antistatic high-temperature adhesive tape is prepared;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic agent is composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt.
Example 23:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape is characterized by comprising the following steps of:
a. preparing an adhesive:
taking raw materials of 30 parts by mass of organic silicone resin, 25 parts by mass of epoxy modified acrylic resin, 10 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 10 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, 3 parts by mass of epoxy curing agent and 25 parts by mass of solvent, and uniformly mixing the raw materials (forming a uniform solution), thus obtaining the adhesive;
the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene;
b. preparing acid-base-resistant antistatic high-temperature adhesive tape:
taking a PET film, carrying out corona treatment, coating (or called coating) antistatic agents on two sides of the PET film layer 1 subjected to corona treatment to form an antistatic layer 4 and an antistatic layer 5, coating (or called coating) the adhesive prepared in the step a on the antistatic layer 5 at the temperature of 23 ℃, and then drying at the temperature of 85 ℃ for 6 minutes to form an adhesive layer 6, namely the acid-base-resistant antistatic high-temperature adhesive tape is prepared;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic agent is composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt.
Example 24:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape is characterized by comprising the following steps of:
a. preparing an adhesive:
taking raw materials of 25 parts by mass of organic silicone resin, 16 parts by mass of epoxy modified acrylic resin, 8 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 7 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, 2 parts by mass of epoxy curing agent and 19 parts by mass of solvent, and uniformly mixing the raw materials (forming a uniform solution), thus obtaining the adhesive;
the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene;
b. preparing acid-base-resistant antistatic high-temperature adhesive tape:
taking a PET film, carrying out corona treatment, coating (or called coating) antistatic agents on two sides of the PET film layer 1 subjected to corona treatment to form an antistatic layer 4 and an antistatic layer 5, coating (or called coating) the adhesive prepared in the step a on the antistatic layer 5 at the temperature of 22 ℃, and then drying at the temperature of 60 ℃ for 9 minutes to form an adhesive layer 6, namely the acid-base-resistant antistatic high-temperature adhesive tape is prepared;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic agent is composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt; the production and supply enterprises of the antistatic agent are as follows: chu-humanization chemical Co., Ltd, Guangzhou City, etc.
Example 25:
the preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape is characterized by comprising the following steps of:
a. preparing an adhesive:
taking raw materials of 33 parts by mass of organic silicone resin, 30 parts by mass of epoxy modified acrylic resin, 11 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 12 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, 4 parts by mass of epoxy curing agent and 36 parts by mass of solvent, and uniformly mixing (forming a uniform solution), thus obtaining the adhesive;
the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene;
b. preparing acid-base-resistant antistatic high-temperature adhesive tape:
taking a PET film, carrying out corona treatment, coating (or called coating) antistatic agents on two sides of the PET film layer 1 subjected to corona treatment to form an antistatic layer 4 and an antistatic layer 5, coating (or called coating) the adhesive prepared in the step a on the antistatic layer 5 at the temperature of 24 ℃, and then drying at the temperature of 110 ℃ for 5 minutes to form an adhesive layer 6, namely the acid-base-resistant antistatic high-temperature adhesive tape is prepared;
the PET film layer 1 is a polyethylene terephthalate film layer for short;
the antistatic agent is composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt.
Example 26:
in the step b, the thicknesses of the antistatic layer 4 and the antistatic layer 5 are both 0.5 mu m, the thickness of the adhesive layer 6 is 5 mu m, and the process is similar to that in any one of the embodiments 21 to 25 and is omitted.
Example 27:
in the step b, the thicknesses of the antistatic layer 4 and the antistatic layer 5 are both 2 micrometers, the thickness of the adhesive layer 6 is 50 micrometers, and the rest is the same as any one of the embodiments 21-25 and is omitted.
Example 28:
in the step b, the thicknesses of the antistatic layer 4 and the antistatic layer 5 are both 1.3 mu m, the thickness of the adhesive layer 6 is 27 mu m, and the process is similar to that in any one of the embodiments 21 to 25 and is omitted.
Example 29:
in the step b, the thicknesses of the antistatic layer 4 and the antistatic layer 5 are both 0.9 mu m, the thickness of the adhesive layer 6 is 15 mu m, and the process is similar to that in any one of the embodiments 21 to 25 and is omitted.
Example 30:
in the step b, the thicknesses of the antistatic layer 4 and the antistatic layer 5 are both 1.7 mu m, the thickness of the adhesive layer 6 is 40 mu m, and the process is similar to that in any one of the embodiments 21 to 25 and is omitted.
In the above examples 21-30: in the step a, the epoxy modified acrylic resin is one or a mixture of more than two of epoxy methacrylic resin, epoxy acrylate and novolac epoxy acrylate, and product production providing enterprises include: guangdong beautifying chemical company, Guangzhou pickaxe rhyme chemical company, Guangzhou Congdong chemical company and the like;
in the above examples 21-30: in the step a, the epoxy curing agent is one or a mixture of more than two of Diamino Diphenyl Sulfone (DDS), Diamino Diphenyl Methane (DDM), aluminum acetylacetonate and imidazole, and the product production and provision enterprises include: changxing chemical, Guangdong Shunhuan new materials Co., Ltd, Yuanbang high molecular materials Co., Ltd, Dongguan city, and the like.
In the above examples 21-30: the viscosity of the adhesive prepared in the step a is within the range of 200-8000 cps at 25 ℃;
in the above examples 21-30: the acid and alkali resistant antistatic high-temperature adhesive tape prepared in the step b has the following parameter ranges: the bonding force (25 ℃) is 3-10N/25 mm, 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution is soaked for 30 minutes, and the edge penetration is 0.03-0.09 mm; the film tearing voltage is 200-500V when the adhesive tape is peeled; the covering plate does not come unstuck within 600 hours; the adhesive force is 2-8N/25 mm under the conditions of 85 ℃ of temperature and 85 ℃ of humidity for 500 hours.
In the above embodiment: the percentages used, not specifically indicated, are percentages by weight or known to those skilled in the art; the proportions used, not specifically noted, are mass (weight) proportions; the parts by mass (by weight) may all be grams or kilograms.
In the above embodiment: the process parameters (temperature, time, etc.) and the numerical values of the components in each step are in the range, and any point can be applicable.
The present invention and the technical contents not specifically described in the above examples are the same as those of the prior art, and the raw materials are all commercially available products.
The present invention is not limited to the above-described embodiments, and the present invention can be implemented with the above-described advantageous effects.
Claims (10)
1. An acid and alkali resistant antistatic high-temperature adhesive tape is characterized in that: the antistatic PET film is characterized by consisting of a PET film layer (1) subjected to corona treatment, an antistatic layer (4) and an antistatic layer (5) coated on the two sides of the PET film layer (1) subjected to corona treatment, and an adhesive layer (6) coated on the antistatic layer (5) coated on one side of the PET film layer (1) subjected to corona treatment;
the PET film layer (1) is a polyethylene terephthalate film layer for short;
the antistatic layer (4) and the antistatic layer (5) are both composed of antistatic agents, and the antistatic agents are composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt;
the adhesive layer (6) is composed of an adhesive, and the adhesive comprises the following raw material components in percentage by mass: 20-40 parts by mass of organic silicone resin, 10-40 parts by mass of epoxy modified acrylic resin, 5-15 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 5-15 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, and 1-5 parts by mass of epoxy curing agent.
2. The acid and alkali resistant antistatic high temperature adhesive tape of claim 1, which is characterized in that: the epoxy modified acrylic resin is one or a mixture of more than two of epoxy methacrylic resin, epoxy acrylate and novolac epoxy acrylate.
3. The acid and alkali resistant antistatic high temperature adhesive tape according to claim 1 or 2, characterized in that: the epoxy curing agent is one or a mixture of more than two of diamino diphenyl sulfone, diamino diphenyl methane, aluminum acetylacetonate and imidazole.
4. The acid and alkali resistant antistatic high temperature adhesive tape according to claim 1 or 2, characterized in that: the adhesive also comprises 10-40 parts by mass of a solvent, wherein the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene.
5. The acid and alkali resistant antistatic high temperature adhesive tape according to claim 1 or 2, characterized in that: the thickness of antistatic layer (4), antistatic layer (5) is 0.5 ~ 2 mu m, the thickness of adhesive layer (6) is 5 ~ 50 mu m.
6. The preparation method of the acid-alkali-resistant antistatic high-temperature adhesive tape is characterized by comprising the following steps of:
a. preparing an adhesive:
taking raw materials of 20-40 parts by mass of organic silicone adhesive resin, 10-40 parts by mass of silicone resin, 10-40 parts by mass of epoxy modified acrylic resin, 5-15 parts by mass of one or a mixture of more than two of methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, 5-15 parts by mass of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt, 1-5 parts by mass of epoxy curing agent and 10-40 parts by mass of solvent, and uniformly mixing the raw materials to obtain the adhesive;
the solvent is one or a mixture of more than two of ethyl acetate, methyl ethyl ketone and toluene;
b. preparing acid-base-resistant antistatic high-temperature adhesive tape: (ii) a
Taking a PET film, carrying out corona treatment, coating antistatic agents on two sides of the PET film layer (1) subjected to corona treatment to form an antistatic layer (4) and an antistatic layer (5), coating the adhesive prepared in the step a on the antistatic layer (5) at the temperature of 20-25 ℃, and then drying at the temperature of 40-130 ℃ for 1-10 minutes to form an adhesive layer (6) to obtain the acid-base-resistant antistatic high-temperature adhesive tape;
the PET film layer (1) is a polyethylene terephthalate film layer for short;
the antistatic agent is composed of one or a mixture of more than two of polyethylene oxide, polyether ester amide and polyquaternary ammonium salt.
7. The preparation method of the acid and alkali resistant antistatic high temperature adhesive tape according to claim 6, which is characterized in that: in the step a, the epoxy modified acrylic resin is one or a mixture of more than two of epoxy methacrylic resin, epoxy acrylate and novolac epoxy acrylate.
8. The preparation method of the acid and alkali resistant antistatic high temperature adhesive tape according to claim 6 or 7, which is characterized in that: in the step a, the epoxy curing agent is one or a mixture of more than two of diamino diphenyl sulfone, diamino diphenyl methane, aluminum acetylacetonate and imidazole.
9. The preparation method of the acid and alkali resistant antistatic high temperature adhesive tape according to claim 6 or 7, which is characterized in that: in the step b, the thickness of the antistatic layer (4) and the thickness of the antistatic layer (5) are both 0.5-2 μm, and the thickness of the adhesive layer (6) is 5-50 μm.
10. The preparation method of the acid and alkali resistant antistatic high temperature adhesive tape according to claim 6 or 7, which is characterized in that: the acid-base-resistant antistatic high-temperature adhesive tape prepared in the step b has the adhesive force (at 25 ℃) of 3-10N/25 mm, and is soaked in 0.15mol/L hydrogen chloride or sodium hydroxide boiling solution for 30 minutes, wherein the edge penetration is 0.03-0.09 mm; the film tearing voltage is 200-500V when the adhesive tape is peeled; the covering plate does not come unstuck within 600 hours; the adhesive force is 2-8N/25 mm under the conditions of 85 ℃ of temperature and 85 ℃ of humidity for 500 hours.
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