CN114207850B - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
CN114207850B
CN114207850B CN202080056696.3A CN202080056696A CN114207850B CN 114207850 B CN114207850 B CN 114207850B CN 202080056696 A CN202080056696 A CN 202080056696A CN 114207850 B CN114207850 B CN 114207850B
Authority
CN
China
Prior art keywords
insulating layer
display device
metal layer
emitting element
organic insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080056696.3A
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English (en)
Chinese (zh)
Other versions
CN114207850A (zh
Inventor
金谷康弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Publication of CN114207850A publication Critical patent/CN114207850A/zh
Application granted granted Critical
Publication of CN114207850B publication Critical patent/CN114207850B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/034—Manufacture or treatment of coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
CN202080056696.3A 2019-08-29 2020-07-28 显示装置 Active CN114207850B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019156648A JP7311362B2 (ja) 2019-08-29 2019-08-29 表示装置
JP2019-156648 2019-08-29
PCT/JP2020/028898 WO2021039250A1 (ja) 2019-08-29 2020-07-28 表示装置

Publications (2)

Publication Number Publication Date
CN114207850A CN114207850A (zh) 2022-03-18
CN114207850B true CN114207850B (zh) 2024-06-04

Family

ID=74677360

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080056696.3A Active CN114207850B (zh) 2019-08-29 2020-07-28 显示装置

Country Status (5)

Country Link
US (1) US12261154B2 (https=)
JP (1) JP7311362B2 (https=)
CN (1) CN114207850B (https=)
DE (1) DE112020003308B4 (https=)
WO (1) WO2021039250A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022009803A1 (https=) * 2020-07-10 2022-01-13

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016512347A (ja) * 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
CN109037297A (zh) * 2018-08-09 2018-12-18 京东方科技集团股份有限公司 一种有机发光显示基板及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5214121B2 (ja) * 2006-08-07 2013-06-19 新光電気工業株式会社 発光装置
JP2012252836A (ja) * 2011-06-01 2012-12-20 Canon Inc 表示装置
US9252375B2 (en) 2013-03-15 2016-02-02 LuxVue Technology Corporation Method of fabricating a light emitting diode display with integrated defect detection test
US8791474B1 (en) 2013-03-15 2014-07-29 LuxVue Technology Corporation Light emitting diode display with redundancy scheme
KR102465382B1 (ko) * 2015-08-31 2022-11-10 삼성디스플레이 주식회사 표시장치 및 표시장치의 제조방법
TWI657563B (zh) * 2015-12-15 2019-04-21 優顯科技股份有限公司 光電裝置及其製造方法
KR102608421B1 (ko) * 2016-02-23 2023-12-01 삼성디스플레이 주식회사 표시 장치
KR102537440B1 (ko) * 2016-03-18 2023-05-30 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
JP2019511838A (ja) 2016-04-04 2019-04-25 グロ アーベーＧｌｏ Ａｂ ダイ移送用のバックプレーン通過レーザ照射
US10217678B2 (en) * 2016-06-14 2019-02-26 Innolux Corporation Display device and method of manufacturing the display device
KR20180020091A (ko) * 2016-08-17 2018-02-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR102605174B1 (ko) * 2016-12-19 2023-11-22 엘지디스플레이 주식회사 발광 다이오드 디스플레이 장치
US10021762B1 (en) * 2017-06-30 2018-07-10 Innolux Corporation Display device
WO2020250667A1 (ja) * 2019-06-11 2020-12-17 京セラ株式会社 発光素子基板および表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016512347A (ja) * 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
CN109037297A (zh) * 2018-08-09 2018-12-18 京东方科技集团股份有限公司 一种有机发光显示基板及其制作方法

Also Published As

Publication number Publication date
US20220158065A1 (en) 2022-05-19
WO2021039250A1 (ja) 2021-03-04
JP7311362B2 (ja) 2023-07-19
DE112020003308T5 (de) 2022-04-07
DE112020003308B4 (de) 2026-01-29
US12261154B2 (en) 2025-03-25
CN114207850A (zh) 2022-03-18
JP2021033209A (ja) 2021-03-01

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