CN114205990B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN114205990B CN114205990B CN202010982599.9A CN202010982599A CN114205990B CN 114205990 B CN114205990 B CN 114205990B CN 202010982599 A CN202010982599 A CN 202010982599A CN 114205990 B CN114205990 B CN 114205990B
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- circuit board
- groove
- layer
- cutting
- filling block
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 116
- 238000005520 cutting process Methods 0.000 claims abstract description 71
- 230000005540 biological transmission Effects 0.000 claims abstract description 65
- 239000011344 liquid material Substances 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 136
- 238000000227 grinding Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 230000007704 transition Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 11
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- HYXGAEYDKFCVMU-UHFFFAOYSA-N scandium oxide Chemical compound O=[Sc]O[Sc]=O HYXGAEYDKFCVMU-UHFFFAOYSA-N 0.000 description 1
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical compound [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The application discloses circuit board and preparation method thereof, this circuit board includes: a circuit board main body provided with a groove; the filling block is arranged in the groove, and is provided with a cutting surface, and is obtained by solidifying and cutting liquid materials filled in the groove; a reflective layer covering at least a portion of the cut surface of the filler; the circuit board is further provided with an optical transmission medium and/or an optical transceiver chip, and the circuit board realizes transmission of optical signals between the optical transmission medium and/or the optical transceiver chip through the reflecting layer.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board and a preparation method thereof.
Background
While the conventional electrical interconnection faces the problems of signal delay, signal crosstalk, power consumption surge and the like at high frequency and high speed, the optical interconnection can realize the data transmission with low power consumption, high speed and complete signal in a board or a board by using the unique advantages thereof, so that the optical interconnection technology has been paid more attention in recent years and a certain research result is obtained.
The inventors of the present application have found in long-term studies that no ideal structure capable of achieving optical signal steering in a small range has yet emerged in the optical interconnect wiring board.
Disclosure of Invention
The technical problem that this application mainly solves is to provide a circuit board and preparation method thereof, not only can change the transmission direction of its internal optical signal, can also form the reflecting surface of communication level.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: provided is a wiring board including: a circuit board main body provided with a groove; the filling block is arranged in the groove, the filling block is provided with a cutting surface, and the filling block is obtained by solidifying and cutting liquid materials filled in the groove; a reflective layer covering at least a portion of the cut surface of the filler; the circuit board is also provided with an optical transmission medium and/or an optical transceiver chip, and the circuit board realizes the transmission of optical signals between the optical transmission medium and/or the optical transceiver chip by the reflecting layer.
In order to solve the technical problems, another technical scheme adopted by the application is as follows: the preparation method of the circuit board comprises the following steps: providing a circuit board main body and forming a groove on the circuit board main body; filling liquid material in the groove, curing and cutting to form a filling block which is arranged in the groove and provided with a cutting surface; forming a reflective layer covering at least a portion of the cut surface of the filler block; and arranging an optical transmission medium and/or an optical transceiver chip on the circuit board main body to form a circuit board, and further realizing transmission of optical signals between the optical transmission medium and/or the optical transceiver chip by the circuit board through the reflecting layer.
The beneficial effects of this application are: the reflection layer for changing the transmission direction of the optical signal is arranged on the cutting surface of the filling block, the filling block is obtained by curing treatment and cutting treatment of liquid materials filled in the groove in the circuit board main body, so that the circuit board main body is not cut in the preparation process, the formed cutting surface can be prevented from being rough, a flatter cutting surface can be obtained, and the reflection surface of a communication grade can be formed after the reflection layer is formed later.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic cross-sectional view of an embodiment of a circuit board of the present application;
fig. 2 is a schematic top view of the circuit board of fig. 1 in an application scenario;
fig. 3 is a schematic top view of the circuit board of fig. 1 in another application scenario;
FIG. 4 is a schematic cross-sectional view of the circuit board of FIG. 1 in yet another application scenario;
FIG. 5 is a schematic view of the structure of a bevel grinding wheel;
FIG. 6 is a schematic view of the structure of a curved grinding wheel;
FIG. 7 is a schematic diagram of a partial cross-sectional structure of the circuit board of FIG. 1 in yet another application scenario;
FIG. 8 is a schematic flow chart of an embodiment of a method for manufacturing a circuit board according to the present application;
FIG. 9 is a diagram of a corresponding preparation process of the preparation method of FIG. 8 in an application scenario;
fig. 10 is a diagram of a corresponding preparation process of the preparation method of fig. 8 in another application scenario.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of an embodiment of a circuit board of the present application. The wiring board 1000 includes: the circuit board body 1100, the filler 1200, the reflective layer 1300, the optical transmission medium 1400, and the optical transceiver chip 1500.
The circuit board body 1100 is provided with a groove 1110, and the circuit board body 1100 is a body structure of the circuit board 1000, wherein the circuit board body 1100 may be prepared using a mixture of glass fiber and resin.
The filling block 1200 is disposed in the recess 1110 and has a cut surface 1210, wherein the filling block 1200 is obtained by subjecting a liquid material filled in the recess 1110 to a curing process and a cutting process. Specifically, in the preparation, a liquid material is filled in the groove 1110 on the circuit board body 1100, then the liquid material is solidified to form a block of material filled in the groove 1110, and the solidified block of material is cut to obtain the filling block 1200 having the cut surface 1210.
The reflective layer 1300 covers at least a portion of the cut surface 1210 of the filling block 1200 for changing the transmission direction of the received optical signal, wherein the reflective layer 1300 may cover the entire cut surface 1210 or only a portion of the cut surface 1210.
The optical transmission medium 1400 is used for transmitting optical signals, wherein the optical transmission medium 1400 may be an optical fiber or an optical waveguide.
The optical transceiver chip 1500 is used for receiving optical signals, or for emitting optical signals, or for both receiving optical signals and emitting optical signals.
In this embodiment, the circuit board 1000 realizes transmission of an optical signal between the optical transmission medium 1400 and the optical transceiver chip 1500 by the reflective layer 1300, for example, the optical signal transmitted by the optical transmission medium 1400 is transmitted to the optical transceiver chip 1500 after being reflected by the reflective layer 1300 (in this case, the transmission path of the optical signal is shown by an arrow in fig. 1), and for example, the optical signal transmitted by the optical transceiver chip 1500 is transmitted to the optical transmission medium 1400 after being reflected by the reflective layer 1300.
In the prior art, when the transmission direction of the optical signal in the circuit board is to be changed, the circuit board must be cut to form a cut surface, and then a reflective layer for changing the transmission direction of the optical signal is disposed on the cut surface.
In the present embodiment, the reflective layer 1300 for changing the transmission direction of the optical signal is disposed on the cut surface 1210 of the filling block 1200, so that the cutting surface 1210 is not required to be rough, and a smooth cut surface 1210 can be obtained, so that the reflective surface of the communication level can be formed after the reflective layer 1300 is formed later.
As can be seen from the above, the circuit board 1000 in the present embodiment can not only change the transmission direction of the optical signal therein, but also form a reflecting surface of the communication stage.
The reflective layer 1300 in this embodiment may not only realize the transmission of the optical signal between the optical transmission medium 1400 and the optical transceiver chip 1500, but also realize the transmission of the optical signal between the optical transmission medium 1400 (as shown in fig. 2) or the transmission of the optical signal between the optical transceiver chips 1500 (as shown in fig. 3), where the two optical transceiver chips 1500 implement the optical interconnection in free space through the reflective layer 1300. In summary, the wiring board 1000 is capable of changing the transmission direction of the optical signal transmitted therein by the reflective layer 1300.
Meanwhile, in the present embodiment, the material of the filler 1200 is in a liquid state under certain conditions, and can be changed into a solid state after being cured, and the material of the filler 1200 is stable in properties, resistant to temperature, insulating, and can be changed into a solid state after being cured. In one application scenario, the material of the filling block 1200 is resin, and in other application scenarios, the material of the filling block 1200 is plastic, glue or other high polymer. The material of the filling block 1200 is not limited in this application, as long as it can form a flat cut surface 1210 after being cured and cut.
Meanwhile, in the present embodiment, in order to ensure that the flatness of the cut surface 1210 formed after the dicing process can be achieved, the cut surface 1210 is formed by dicing using a high-precision dicing apparatus (e.g., a wafer dicing machine) during the dicing process.
In an application scenario, the cutting tool used in the cutting process is a grinding wheel, and the grinding wheel not only can cut in the cutting process, but also can polish the cutting surface, so that the roughness of the cutting surface 1210 is further reduced.
In another application scenario, in the process of performing cutting processing, the cutting processing is performed twice by adopting a grinding wheel: the first cutting process uses a low-mesh grinding wheel to perform pre-cutting to form a middle cutting surface, and the second cutting process uses a high-mesh grinding wheel to perform secondary cutting on the middle cutting surface, specifically, the middle cutting surface is polished to form a cutting surface 1210, so that the flatness of the finally formed cutting surface 1210 can meet the flatness requirement.
In the present embodiment, the cut surface 1210 of the filler block 1200 may be planar or curved.
As shown in fig. 1, when the cut surface 1210 is planar, the surface of the reflective layer 1300 is also planar, and the reflective layer 1300 is only capable of changing the transmission direction of the optical signal; as shown in fig. 4, when the cut surface 1210 is curved, the surface of the reflective layer 1300 is also curved, and at this time, the reflective layer 1300 not only can change the transmission direction of the optical signal, but also can converge the divergent light beam or diverge the convergent light beam.
Wherein, when the cutting surface 1210 of the filling block 1200 is planar, a bevel grinding wheel (as shown in fig. 5) may be used for cutting during the cutting process; when the cut surface 1210 of the filler 1200 is curved, a curved grinding wheel may be used for cutting during the cutting process (as shown in fig. 6).
Also in the present embodiment, the reflective layer 1300 may be disposed at an arbitrary position with respect to the circuit board body 1100.
With continued reference to fig. 1, in an application scenario, the heights of the transmitting end and the receiving end of the optical signal are different relative to the reflecting layer 1300, in a specific application scenario, as shown in fig. 1, the reflecting layer 1300 is inclined at an angle of 45 ° relative to a portion of the surface of the circuit board main body 1100, and the optical transmission medium 1400 is disposed on the portion of the surface, at this time, the optical signal transmitted by the optical transmission medium 1400 is directed to the reflecting layer 1300 in a direction of 45 ° relative to the reflecting layer 1300, and then the optical signal transmitted by the optical transmission medium 1400 is reflected by the reflecting layer 1300 and is directed to the optical transceiver chip 1500 along a direction perpendicular to the original transmission path.
Referring to fig. 2 and fig. 3, in another application scenario, a receiving space 1111 is formed between the reflective layer 1300 and a wall of the recess 1110, and the heights of the transmitting end and the receiving end of the optical signal are the same with respect to the reflective layer 1300. For example, in the application scenario of fig. 2, both optical transmission media 1400 are disposed within the same layer of the circuit board body 1100, such that an optical signal transmitted by one optical transmission medium 1400 returns to the other optical transmission medium 1400 after being reflected by the reflective layer 1300, and similarly, in the application scenario of fig. 3, both optical transceiver chips 1500 are also disposed within the same layer of the circuit board body 1100.
Optionally, in the application scenario of fig. 2 and fig. 3, the accommodating space 1111 is further filled with a light-transmitting block (not shown) made of a light-transmitting material, and the light-transmitting block does not affect the propagation direction of the optical signal, which can be used to increase the overall strength of the circuit board 1000.
In the application scenario of fig. 2 and fig. 3, when the accommodating space 1111 is formed between the reflective layer 1300 and the wall of the recess 1110, the emitting end and the receiving end of the optical signal may also be different from the reflective layer 1300 in height, which is not limited herein.
In summary, the relative positions of the reflective layer 1300, the optical transmission medium 1400, and/or the optical transceiver chip 1500 may be set according to the application scenario and the application requirement.
Meanwhile, in the present embodiment, the reflective layer 1300 includes at least one of a dielectric reflective sub-layer and a metal reflective sub-layer, that is, in an application scenario, the reflective layer 1300 includes only the dielectric reflective sub-layer, in another application scenario, the reflective layer 1300 includes only the metal reflective sub-layer, and in yet another application scenario, the reflective layer 1300 includes both the dielectric reflective sub-layer and the metal reflective sub-layer, where the stacking order of the dielectric reflective sub-layer and the metal reflective sub-layer may be that the dielectric reflective sub-layer is disposed between the filler block 1200 and the metal reflective sub-layer, or that the metal reflective sub-layer is disposed between the filler block 1200 and the dielectric reflective sub-layer, which is not limited herein. The dielectric reflecting sub-layer/metal reflecting sub-layer may have a single-layer structure or a multi-layer structure.
The material of the dielectric reflecting sub-layer includes at least one of silicon nitride, silicon dioxide, aluminum oxide, zirconium oxide, silicon monoxide, silicon fluoride, and titanium dioxide, and the material of the metal reflecting sub-layer includes at least one of gold, silver, copper, aluminum, chromium, nickel, niobium, palladium, rhodium, and titanium.
Referring to fig. 7, in an application scenario of the present embodiment, the circuit board 1000 further includes: a transition layer 1600, a protective layer 1700, and an anti-reflection layer 1800.
The transition layer 1600 is disposed between the filling block 1200 and the reflective layer 1300, the protective layer 1700 is disposed on a side of the reflective layer 1300 away from the transition layer 1600, and the anti-reflection layer 1800 is disposed on a side of the protective layer 1700 away from the reflective layer 1300, that is, the transition layer 1600, the reflective layer 1300, the protective layer 1700 and the anti-reflection layer 1800 are sequentially stacked on the filling block 1200. Wherein, the transition layer 1600 is used for increasing the binding force between the reflective layer 1300 and the filling block 1200, and the material of the transition layer 1600 includes at least one of nickel, chromium and titanium; the protective layer 1700 is used for protecting the reflective layer 1300 from aging and other accidents of the reflective layer 1300 due to long-term use, wherein the material of the protective layer 1700 comprises at least one of silicon dioxide, titanium dioxide and aluminum oxide; the anti-reflection layer 1800 is used for increasing the reflectivity of the optical signal, wherein the material of the anti-reflection layer 1800 comprises at least one of magnesium fluoride, titanium oxide, lead sulfide, lead selenide, zinc sulfide, yttrium oxide, scandium oxide. In the preparation process, the transition layer 1600, the reflective layer 1300, the protective layer 1700, and the anti-reflection layer 1800 are prepared by chemical plating, electroplating, vacuum evaporation, sputtering, ion plating, molecular beam epitaxy, and the like.
In other application scenarios of the present embodiment, the circuit board 1000 may not include the transition layer 1600, the protection layer 1700, and the anti-reflection layer 1800 at the same time, but includes only one or two of the transition layer 1600, the protection layer 1700, and the anti-reflection layer 1800, which is not limited herein. Of course, in an application scenario, the circuit board 1000 may not include the transition layer 1600, the protection layer 1700, and the anti-reflection layer 1800, which is not limited herein.
In addition, in other embodiments, in addition to the transition layer 1600 being disposed between the filling block 1200 and the reflective layer 1300, the transition layer 1600 may be disposed between the reflective layer 1300 and the protective layer 1700, so as to increase the bonding force between the reflective layer 1300 and the protective layer 1700, where the stacking sequence is as follows: transition layer 1600, reflective layer 1300, transition layer 1600, protective layer 1700, and anti-reflection layer 1800.
Also in the present embodiment, the filling block 1200 may have more than one cut surface 1210, so that the transmission directions of the multiple optical signals may be simultaneously changed by the reflective layers 1300 disposed on the different cut surfaces 1210.
Meanwhile, in this embodiment, the positions of the optical transmission medium 1400 and/or the optical transceiver chip 1500 are not limited, and the positions of the optical transmission medium 1400 and/or the optical transceiver chip 1500 relative to the reflective layer 1300 may be set according to different application scenarios, so that the transmission of the optical signal between the optical transmission medium 1400 and/or the optical transceiver chip 1500 is realized through the reflective layer 1300.
Referring to fig. 8, fig. 8 is a schematic flow chart of an embodiment of a method for manufacturing a circuit board according to the present application. With reference to fig. 9 (wherein the structural diagram is a schematic sectional structure) and fig. 10 (wherein the structural diagram is a schematic plan structure), the preparation method includes:
s110: a wiring board body 2100 is provided, and a groove 2110 is formed on the wiring board body 2100.
Wherein grooves 2110 may be formed on the wiring board body 2100 by mechanical cutting, laser cutting, or the like.
S120: filling with liquid material and curing and cutting processes are performed in groove 2110 to form filling block 2200 provided in groove 2110 and having cut surface 2210.
Specifically, the intermediate filling block 2300 is obtained by filling the groove 2110 with a liquid material and curing the liquid material, and then the intermediate filling block 2300 is cut to obtain a filling block 2200 having a cut surface 2210.
The curing treatment may be at least one of photo-curing, thermal curing, and natural air curing.
In an application scenario, if the surface of the intermediate filling block 2300 obtained after the solidification of the liquid material is uneven, the intermediate filling block 2300 may be polished and then secondarily filled and solidified in the groove 2110 until the surface of the finally filled region reaches the flatness requirement.
In an application scenario, in order to form the low-roughness cut surface 2210, dicing is performed using a high-precision dicing apparatus (e.g., a wafer dicing machine) during the dicing process.
In an application scenario, the cutting tool adopted in the cutting process is a grinding wheel, and the grinding wheel not only can cut in the cutting process, but also can polish the cutting surface, so that the roughness of the cutting surface 2210 is further reduced.
In an application scenario, in order to ensure that the cut surface 2210 formed after the cutting process has a low roughness, two cuts are made during the cutting process: the intermediate filling block 2300 is cut with a first grinding wheel to form an intermediate cut surface, and the intermediate cut surface is cut with a second grinding wheel to form a filling block 2200 having a cut surface 2210, wherein the number of the first grinding wheel is lower than the number of the second grinding wheel. That is, the intermediate cut surface is formed by precutting with the first grinding wheel, and then the intermediate cut surface is ground with the second grinding wheel to form the low-roughness cut surface 2210. Of course, in other application scenarios, the grinding wheel may be used to cut only once, which is not limited herein.
In an application scenario, after the cutting treatment, in order to facilitate the preparation of the subsequent process, the cutting treatment also needs to be subjected to the processes of cleaning, deburring, chipping and the like.
In one application scenario, a bevel grinding wheel (as shown in fig. 5) is used for cutting to form a planar cut surface 2210, and in another application scenario, a curved grinding wheel (as shown in fig. 6) is used for cutting to form a curved cut surface 2210.
In an application scenario, as shown in fig. 9, step S120 specifically includes: filling the groove 2110 with a liquid material and curing the liquid material to form an intermediate filling block 2300; the circuit board body 2100 and the intermediate filling block 2300 are cut to form a filling block 2200 having a cut surface 2210.
In another application scenario, as shown in fig. 10, step S120 specifically includes: filling the groove 2110 with a liquid material and curing the liquid material to form an intermediate filling block 2300; the side of intermediate filling piece 2300 adjacent to the groove wall of groove 2110 is cut to form filling piece 2200 with cut surface 2210.
Wherein a plurality of cuts may be made during the cutting process to obtain the desired cut surface 2210.
S130: a reflective layer 2400 is formed covering at least a portion of the cut surface 2210 of the filler block 2200.
Among these, the reflective layer 2400 is formed by electroless plating, electroplating, vacuum evaporation, sputter plating, ion plating, molecular beam epitaxy, or the like.
The reflective layer 2400 includes at least one of a dielectric reflective sub-layer and a metal reflective sub-layer, and the dielectric reflective sub-layer/metal reflective sub-layer may have a single-layer structure or a multi-layer structure. Meanwhile, the material of the dielectric reflecting sub-layer includes at least one of silicon nitride, silicon dioxide, aluminum oxide, zirconium oxide, silicon monoxide, silicon fluoride, and titanium dioxide, and the metal reflecting sub-layer includes at least one of gold, silver, copper, aluminum, chromium, nickel, niobium, palladium, rhodium, and titanium, which are not limited herein.
In the application scenario of fig. 9, since the cut surface 2210 is inclined with respect to a partial surface of the cut wiring board body 2100, the formed reflective layer 2400 is also inclined with respect to a partial surface of the cut wiring board body 2100.
In the application scenario of fig. 10, step S130 specifically includes: a reflective layer 2400 is formed so as to cover at least part of the cut surface 2210 of the filler 2200, and a receiving space 2111 is formed between the reflective layer 2400 and the wall of the groove 2110. At this time, when the optical signal emitted from the emitting end is emitted from the groove wall of the groove 2110 toward the reflecting layer 2400 and reflected by the reflecting layer 2400, it can be received by the receiving end in the same plane as the emitting end.
In the application scenario of fig. 10, a light-transmitting block made of a light-transmitting material may be filled in the accommodating space 2111, and the light-transmitting block does not affect the transmission of the optical signal, and the specific preparation process may be: the light-transmitting block is formed by filling a light-transmitting material into the accommodation space 2111 and curing, or is prepared in advance and then is set in the accommodation space 2111.
S140: the optical transmission medium 2500 and/or the optical transceiver chip 2600 are provided to form the circuit board 2000, and the circuit board 2000 realizes transmission of optical signals between the optical transmission medium 2500 and/or the optical transceiver chip 2600 by the reflective layer 2400.
In setting the optical transmission medium 2500, a slot for placing the optical transmission medium 2500 may be milled into the circuit board body 2100, and then the optical transmission medium 2500 is placed in the slot.
When the optical transceiver chip 2600 is provided, the optical transceiver chip 2600 may be provided on the circuit board main body 2100 by soldering, adhesion, or the like.
In other embodiments, the optical transmission medium 2500 and/or the optical transceiver chip 2600 may be provided before the filling block 2200 is formed, which is not limited herein.
Meanwhile, in different application scenarios, the positions of the optical transmission medium 2500 and/or the optical transceiver chip 2600 relative to the reflective layer 2400 may be set according to different requirements, that is, the positions of the optical transmission medium 2500 and/or the optical transceiver chip 2600 are not limited in the present application.
The circuit board 2000 prepared by adopting the present embodiment has the same or similar structure as the circuit board 1000 in the above embodiment, and the specific structure thereof may be referred to the above embodiment and will not be described herein.
In summary, the reflecting layer for changing the transmission direction of the optical signal is arranged on the cutting surface of the filling block, and the filling block is obtained by curing and cutting liquid materials filled in the groove in the circuit board main body, so that the circuit board main body is not cut in the preparation process, the formed cutting surface can be prevented from being rough, a flatter cutting surface can be obtained, and the communication-level reflecting surface can be formed after the reflecting layer is formed later.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.
Claims (14)
1. A wiring board, comprising:
a circuit board main body provided with a groove;
the filling block is arranged in the groove, the filling block is provided with a cutting surface, and the filling block is obtained by solidifying and cutting liquid materials filled in the groove;
a reflective layer covering at least a portion of the cut surface of the filler;
the circuit board is also provided with an optical transmission medium and/or an optical transceiver chip, and the circuit board realizes the transmission of optical signals between the optical transmission medium and/or the optical transceiver chip by the reflecting layer.
2. The circuit board of claim 1, wherein the filler block is of a resin.
3. The circuit board of claim 1, wherein the cut surface is planar or curved.
4. The circuit board of claim 1, wherein a receiving space is formed between the reflective layer and a wall of the recess.
5. The circuit board of claim 4, further comprising:
the light transmission block is arranged in the accommodating space.
6. The circuit board of claim 1, wherein the reflective layer comprises at least one of a dielectric reflective sub-layer and a metallic reflective sub-layer.
7. The circuit board of claim 6, wherein,
the material of the dielectric reflecting sub-layer comprises at least one of silicon nitride, silicon dioxide, aluminum oxide, zirconium oxide, silicon monoxide, silicon fluoride and titanium dioxide;
the material of the metal reflecting sublayer comprises at least one of gold, silver, copper, aluminum, chromium, nickel, niobium, palladium, rhodium and titanium.
8. The circuit board of claim 1, further comprising:
the transition layer is arranged between the filling block and the reflecting layer;
the protective layer is arranged on one side of the reflecting layer, which is far away from the transition layer;
the anti-reflection layer is arranged on one side of the protective layer away from the reflecting layer.
9. The circuit board of claim 1, wherein the optical transmission medium is an optical fiber or an optical waveguide.
10. The preparation method of the circuit board is characterized by comprising the following steps:
providing a circuit board main body and forming a groove on the circuit board main body;
filling liquid material in the groove, curing and cutting to form a filling block which is arranged in the groove and provided with a cutting surface;
forming a reflective layer covering at least a portion of the cut surface of the filler block;
and arranging an optical transmission medium and/or an optical transceiver chip on the circuit board main body to form a circuit board, and further realizing transmission of optical signals between the optical transmission medium and/or the optical transceiver chip by the circuit board through the reflecting layer.
11. The method of manufacturing according to claim 10, wherein the step of filling the groove with a liquid material and performing a curing process and a cutting process to form a filling block having a cutting surface provided in the groove comprises:
filling liquid material in the groove and curing to form an intermediate filling block;
cutting the middle filling block by using a first grinding wheel to form a middle cutting surface;
and cutting the middle cutting surface by using a second grinding wheel to form the filling block with the cutting surface, wherein the mesh number of the first grinding wheel is lower than that of the second grinding wheel.
12. The method of manufacturing according to claim 10, wherein the step of filling the groove with a liquid material and performing a curing process and a cutting process to form a filling block having a cutting surface provided in the groove comprises:
filling liquid material in the groove and curing to form an intermediate filling block;
and cutting the circuit board main body and the middle filling block to form the filling block with the cutting surface.
13. The method according to claim 10, wherein,
the step of filling the groove with liquid material, curing and cutting to form a filling block with a cutting surface, wherein the filling block is arranged in the groove and comprises the following steps:
filling liquid material in the groove and curing to form an intermediate filling block;
cutting one side of the middle filling block adjacent to the groove wall of the groove to form the filling block with the cutting surface;
the step of forming a reflective layer covering at least a portion of the cut surface of the filler block includes:
forming a reflecting layer covering at least part of the cutting surface of the filling block, and forming a containing space between the reflecting layer and the wall of the groove.
14. The method of manufacturing according to claim 13, further comprising:
and a light-transmitting block is arranged in the accommodating space.
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