CN214041795U - Circuit board - Google Patents

Abstract

The application discloses circuit board, this circuit board includes: the circuit board main body is provided with a groove; a coupling element disposed in the recess, wherein the coupling element has a reflective surface; the bonding layer is arranged between the circuit board main body and the coupling element and is used for bonding the circuit board main body and the coupling element; the circuit board is further provided with an optical transmission medium and/or an optical transceiver chip, the circuit board realizes transmission of optical signals between the optical transmission medium and/or the optical transceiver chip through the reflecting surface of the coupling element, and the circuit board provided by the application not only can change the transmission direction of the optical signals in the circuit board, but also can form a communication-level reflecting surface.

Description

Circuit board

Technical Field

The application relates to the technical field of circuit boards, in particular to a circuit board.

Background

The traditional electrical interconnection faces the problems of signal delay, signal crosstalk, power consumption surge and the like under high frequency and high speed, and the optical interconnection can realize data transmission with low power consumption, high speed and complete signals between boards by using the unique advantages of the optical interconnection, so that the optical interconnection technology is paid more and more attention in recent years and certain research results are obtained.

The inventors of the present application have found in long-term studies that an ideal structure capable of achieving optical signal turning in a small range has not yet appeared in the optical interconnection board at present.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides a circuit board, not only can change its interior optical signal's transmission direction, can also form the plane of reflection of communication level.

In order to solve the technical problem, the application adopts a technical scheme that: provided is a wiring board including: the circuit board main body is provided with a groove; a coupling element disposed in the recess, wherein the coupling element has a reflective surface; the bonding layer is arranged between the circuit board main body and the coupling element and is used for bonding the circuit board main body and the coupling element; the circuit board is further provided with an optical transmission medium and/or an optical transceiver chip, and the circuit board realizes transmission of optical signals between the optical transmission medium and/or the optical transceiver chip by the aid of the reflecting surface of the coupling element.

The beneficial effect of this application is: the circuit board in this application utilizes coupling element's plane of reflection to change optical signal's transmission direction, and at the in-process of preparation, can directly process coupling element and need not to cut the circuit board main part again, can guarantee on the one hand that the plane of reflection that forms is level, reaches communication level's requirement, and on the other hand is owing to can process coupling element alone, therefore processing convenience, precision are higher, and can process different structures, realizes structure diversification, customization.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic cross-sectional view of one embodiment of a circuit board of the present application;

FIG. 2 is a schematic diagram of a top view of the circuit board of FIG. 1 in an application scenario;

FIG. 3 is a schematic diagram of a top view of the circuit board of FIG. 1 in another application scenario;

FIG. 4 is a schematic cross-sectional view of the circuit board of FIG. 1 in another application scenario;

FIG. 5 is a schematic cross-sectional view of the circuit board of FIG. 1 in another application scenario;

FIG. 6 is a schematic cross-sectional view of the circuit board of FIG. 1 in another application scenario;

FIG. 7 is a schematic perspective view of the circuit board of FIG. 1 in another application scenario;

FIG. 8 is a schematic cross-sectional view of the circuit board of FIG. 1 in another application scenario;

FIG. 9 is a schematic diagram of a partial structure of the circuit board of FIG. 1 in another application scenario;

FIG. 10 is a schematic flow chart diagram of one embodiment of a method for manufacturing a circuit board according to the present application;

fig. 11 is a diagram of a manufacturing process corresponding to the manufacturing method of fig. 10.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of an embodiment of the circuit board of the present application. This wiring board 1000 includes: a circuit board body 1100, a coupling element 1200, an optical transmission medium 1300, and an optical transceiver chip 1400.

The circuit board body 1100 is provided with a groove 1110, and the circuit board body 1100 is a main body structure of the circuit board 1000, wherein the circuit board body 1100 may be prepared using a mixture of glass fiber and resin.

The coupling element 1200 is disposed in the groove 1110, and the coupling element 1200 has a reflecting surface 1210 for changing a transmission direction of the received optical signal.

The optical transmission medium 1300 is used to transmit an optical signal, wherein the optical transmission medium 1300 may be an optical fiber or an optical waveguide.

The optical transceiver chip 1400 is used for receiving an optical signal, or sending an optical signal, or both receiving an optical signal and sending an optical signal.

In this embodiment, the circuit board 1000 transmits the optical signal between the optical transmission medium 1300 and/or the optical transceiver chip 1400 through the reflection surface 1210 of the coupling element 1200, for example, the optical signal transmitted by the optical transmission medium 1300 is reflected by the reflection surface 1210 and then sent to the optical transceiver chip 1400 (at this time, the transmission path of the optical signal is shown by an arrow in fig. 1), and for example, the optical signal emitted by the optical transceiver chip 1400 is reflected by the reflection surface 1210 and then sent to the optical transmission medium 1300.

In the prior art, if the transmission direction of an optical signal in a circuit board is required to be changed, the circuit board is cut to form a cut surface, and then a reflecting surface is formed, and because the components of the circuit board usually contain glass fibers, the cut surface formed by directly cutting the circuit board is very rough and difficult to process, and a communication-grade reflecting surface cannot be formed.

In the embodiment, the reflecting surface 1210 for changing the transmission direction of the optical signal is disposed on the coupling element 1200, and in the process of preparation, the coupling element 1200 can be directly processed without cutting the circuit board body 1100, so that on one hand, the formed reflecting surface 1210 can be ensured to be flat and meet the requirement of the communication level, and on the other hand, the coupling element 1200 can be processed independently, so that the processing is convenient, the precision is higher, different structures can be processed, and the diversification and customization of the structure are realized.

Here, the reflective surface 1210 in this embodiment may implement transmission of an optical signal between the optical transmission medium 1300 and the optical transceiver chip 1400, as well as transmission of an optical signal between the optical transmission medium 1300 (as shown in fig. 2), or transmission of an optical signal between the optical transceiver chips 1400 (as shown in fig. 3), and at this time, the two optical transceiver chips 1400 implement free-space optical interconnection through the reflective surface 1210. In summary, the circuit board 1000 can change the transmission direction of the optical signal transmitted therein through the reflection surface 1210.

With continued reference to fig. 1, in the present embodiment, the circuit board 1000 further includes: and an adhesive layer 1500.

The adhesive layer 1500 is disposed between the circuit board body 1100 and the coupling element 1200, and is used for adhering the circuit board body 1100 and the coupling element 1200, wherein the material of the adhesive layer 1500 may be a material having adhesiveness, such as prepreg, glue, and the like. In preparation, the adhesive layer 1500 is first provided in the recess 1110, and then the coupling element 1200 is provided in the recess 1110 and laminated, so that the wiring board body 1100 and the coupling element 1200 become a fixed structure.

However, in other embodiments, the adhesive layer 1500 may not be provided, and for example, the coupling element 1200 may be connected to the circuit board body 1100 by interference fit, so that the two become a fixed structure after lamination.

Meanwhile, in the present embodiment, the reflecting surface 1210 of the coupling element 1200 may be a plane or a curved surface: when planar (as shown in fig. 1), the reflective surface 1210 is only used to change the transmission direction of the optical signal, and when curved (as shown in fig. 4), the reflective surface 1210 is used not only to change the transmission direction of the optical signal, but also to converge a diverging beam or diverge a converging beam.

With reference to fig. 1, in an application scenario, the heights of the transmitting end and the receiving end of the optical signal are different from each other with respect to the reflecting surface 1210, for example, in a specific application scenario, the reflecting surface 1210 of the coupling device 1200 is inclined at an angle of 45 ° with respect to a portion of the surface of the circuit board body 1100 on which the optical transmission medium 1300 is disposed, the optical signal transmitted by the optical transmission medium 1300 is emitted to the reflecting surface 1210 at an angle of 45 ° with respect to the reflecting surface 1210, and then the optical signal transmitted by the optical transmission medium 1300 is emitted to the optical transceiver chip 1400 along a direction perpendicular to the original transmission path after being reflected by the reflecting surface 1210.

Referring to fig. 2 and 3, in another application scenario, an accommodating space 1111 is formed between the reflective surface 1210 of the coupling element 1200 and the groove wall of the groove 1110, and the heights of the transmitting end and the receiving end of the optical signal relative to the reflective surface 1210 are the same. For example, in the application scenario of fig. 2, two optical transmission media 1300 are disposed in the same layer of the circuit board body 1100, so that the optical signal transmitted by one optical transmission medium 1300 can return to the other optical transmission medium 1300 after being reflected by the reflecting surface 1210 of the coupling element 1200, and similarly, in the application scenario of fig. 3, two optical transceiver chips 1400 are also disposed in the same layer of the circuit board body 1100.

Optionally, in the application scenarios of fig. 2 and fig. 3, the accommodating space 1111 is further filled with a light-transmitting block (not shown) made of a light-transmitting material, and the light-transmitting block does not affect the propagation direction of the optical signal and can be used to increase the overall strength of the circuit board 1000.

In the application scenarios of fig. 2 and 3, when the accommodating space 1111 is formed between the reflective surface 1210 of the coupling element 1200 and the groove wall of the groove 1110, the heights of the transmitting end and the receiving end of the optical signal relative to the reflective surface 1210 may also be different, which is not limited herein.

In summary, the present application can set the relative positions between the optical transmission medium 1300 and/or the optical transceiver chip 1400 and the coupling element 1200 according to different application scenarios and application requirements.

Meanwhile, in the present embodiment, the number of the reflecting surfaces 1210 of the coupling element 1200 is one (as shown in fig. 1, 2, and 3) or at least two.

Referring to fig. 5, in an application scenario, when the number of the reflecting surfaces 1210 is at least two, the coupling element 1200 may change the transmission direction of the multiple optical signals simultaneously.

Referring to fig. 6, in another application scenario, when the number of the reflection surfaces 1210 is at least two, the same optical signal may be reflected by the plurality of reflection surfaces 1210 in sequence, for example, the same optical signal is reflected by two reflection surfaces 1210 to complete 180 ° turn.

Referring to fig. 7, in another application scenario, when the number of the reflecting surfaces 1210 is at least two, the coupling element 1200 can simultaneously achieve optical signal transmission in different planes and optical signal transmission in the same plane through at least two reflecting surfaces 1210.

In summary, the present application does not limit the number of the reflecting surfaces 1210 of the coupling element 1200, how to arrange the reflecting surfaces 1210 on the coupling element 1200, and the position of the optical transmission medium 1300 and/or the optical transceiver chip 1400 relative to the reflecting surfaces 1210, as long as the circuit board 1000 can realize the transmission of the optical signal between the optical transmission medium 1300 and/or the optical transceiver chip 1400 by the reflecting surfaces 1210 of the coupling element 1200.

In an application scenario of the present embodiment, the coupling element 1200 includes a metal block having a reflective surface 1210, that is, the material of the coupling element 1200 is metal, and the transmission direction of the optical signal is changed by using the surface of the metal block.

In another application scenario of the present embodiment, as shown in fig. 8, the coupling element 1200 includes a dielectric block 1220 and a reflective layer 1230 disposed on a surface of the dielectric block 1220, wherein the surface of the reflective layer 1230 serves as a reflective surface 1210. Unlike the metal block, the dielectric block 1220 itself cannot reflect the optical signal, and thus the optical signal is reflected by the reflective layer 1230 provided on the surface of the dielectric block 1220.

The reflective layer 1230 includes at least one of a dielectric reflective sublayer and a metal reflective sublayer, that is, in an application scenario, the reflective layer 1230 includes only the dielectric reflective sublayer, in another application scenario, the reflective layer 1230 includes only the metal reflective sublayer, and in yet another application scenario, the reflective layer 1230 includes both the dielectric reflective sublayer and the metal reflective sublayer, in which case the stacking order of the dielectric reflective sublayer and the metal reflective sublayer may be that the dielectric reflective sublayer is disposed between the dielectric block 1220 and the metal reflective sublayer, or that the metal reflective sublayer is disposed between the dielectric block 1220 and the dielectric reflective sublayer, which is not limited herein. The dielectric reflective sublayer/the metal reflective sublayer may have a single-layer structure or a multi-layer structure.

The material of the dielectric reflective sub-layer includes at least one of silicon nitride, silicon dioxide, aluminum oxide, zirconium oxide, silicon monoxide, silicon fluoride, and titanium dioxide, and the material of the metal reflective sub-layer includes at least one of gold, silver, copper, aluminum, chromium, nickel, niobium, palladium, rhodium, and titanium, although in other embodiments, the materials of the dielectric reflective sub-layer and the metal reflective sub-layer may also be other materials, which is not limited herein.

Wherein the dielectric block 1220 is one of a plastic block, a silicon block, and a prism, for example, in the application scenario of fig. 8, the dielectric block 1220 is a prism, and the optical signal is incident from one side of the dielectric block 1220 and reflected by the reflective layer 1230. Of course, in other embodiments, the material of the dielectric block 1220 may be other, and is not limited herein.

In this application scenario, in order to increase the bonding force between the reflective layer 1230 and the dielectric block 1220, protect the reflective layer 1230, and increase the reflectivity of the optical signal, as shown in fig. 9, the coupling element 1200 further includes a transition layer 1240, a protective layer 1250, and an anti-reflection layer 1260.

Transition layer 1240 is disposed between dielectric block 1220 and reflective layer 1230, protective layer 1250 is disposed on the side of reflective layer 1230 away from transition layer 1240, and anti-reflective layer 1260 is disposed on the side of protective layer 1250 away from reflective layer 1230, i.e., when transition layer 1240, reflective layer 1230, protective layer 1250, and anti-reflective layer 1260 are sequentially stacked on dielectric block 1220.

Wherein, the transition layer 1240 is used to increase the bonding force between the reflective layer 1230 and the dielectric block 1220, and the material of the transition layer 1240 includes at least one of nickel, chromium, and titanium; the protective layer 1250 is used for protecting the reflective layer 1230 and preventing the reflective layer 1230 from aging and other accidents caused by long-term use, wherein the material of the protective layer 1250 comprises at least one of silicon dioxide, titanium dioxide and aluminum oxide; the anti-reflection layer 1260 is used for increasing the reflectivity of an optical signal, wherein the material of the anti-reflection layer 1260 includes at least one of magnesium fluoride, titanium oxide, lead sulfide, lead selenide, zinc sulfide, yttrium oxide, and scandium oxide. In the preparation process, the transition layer 1240, the reflective layer 1230, the protective layer 1250 and the anti-reflection layer 1260 are prepared by chemical plating, electroplating, vacuum evaporation, sputtering, ion plating, molecular beam epitaxy and other methods.

In other application scenarios, coupling element 1200 may not include transition layer 1240, protective layer 1250, and anti-reflection layer 1260 simultaneously, but only include one or two of transition layer 1240, protective layer 1250, and anti-reflection layer 1260, which is not limited herein. Of course, in an application scenario, coupling element 1200 may not include transition layer 1240, protective layer 1250, and anti-reflection layer 1260, as well.

In addition, in other embodiments, in addition to providing the transition layer 1240 between the dielectric block 1220 and the reflective layer 1230, the transition layer 1240 may also be provided between the reflective layer 1230 and the protective layer 1250 to increase the bonding force between the reflective layer 1230 and the protective layer 1250, when the stacking order is: transition layer 1240, reflective layer 1230, transition layer 1240, protective layer 1250, and antireflective layer 1260.

In an application scenario, when the coupling element 1200 includes a metal block, the coupling element 1200 may also include a reflective layer 1230 disposed on a surface of the metal block, although the metal block itself may reflect light signals, the reflective layer 1230 may be disposed to increase reflectivity, at this time, the reflective layer 1230 disposed on the surface of the metal block has the same structure as the reflective layer 1230 disposed on the surface of the dielectric block 1220, and at this time, the coupling element 1200 may also include a transition layer 1240, a protection layer 1250, and an anti-reflection layer 1260 besides the metal block and the reflective layer 1230, and specific structures thereof may be referred to the foregoing description, and will not be described herein again.

Referring to fig. 10, fig. 10 is a schematic flow chart of an embodiment of a method for manufacturing a circuit board according to the present application. With reference to fig. 11, the preparation method includes:

s110: a circuit board body 2100 is provided and grooves 2110 are provided on the circuit board body 2100.

In which the groove 2110 may be formed on the circuit board main body 2100 by mechanical cutting, laser cutting, or the like.

S120: a coupling member 2200 having a reflective surface 2210 is provided and the coupling member 2200 is disposed in the groove 2110.

Specifically, the coupling element 2200 is pre-machined (e.g., cut, ground, etc.) to form the reflective surface 2210. In one application scenario, the metal block is cut and polished to form the reflective surface 2210, and in another application scenario, a reflective layer is formed after the metal block is cut and polished, and then the surface of the reflective layer is used as the reflective surface 2210, wherein the reflective layer may be formed by chemical plating, electroplating, vacuum evaporation, sputtering, ion plating, molecular beam epitaxy, or the like.

In an application scenario, before the coupling element 2200 is disposed in the groove 2110, an adhesive layer (not shown) is formed in the groove 2110, and then the coupling element 2200 is disposed in the groove 2110 and laminated, so that the circuit board body 2100 and the coupling element 2200 are fixed. Of course, in other application scenarios, the coupling element 2200 may be laminated without an adhesive layer, by being disposed directly in the groove 2110.

S130: the optical transmission medium 2300 and/or the optical transceiver chip 2400 is disposed on the wiring board body 2100 to form the wiring board 2000, and the optical signal is transmitted between the optical transmission medium 2300 and/or the optical transceiver chip 2400 by the wiring board 2000 via the reflection surface 2210 of the coupling element 2200.

When the optical transmission medium 2300 is disposed, a groove for placing the optical transmission medium 2300 may be milled in the wiring board body 2100, and then the optical transmission medium 2300 may be placed in the groove.

When the optical transceiver chip 2400 is provided, the optical transceiver chip 2400 may be provided on the wiring board main body 2100 by soldering, bonding, or the like.

In other embodiments, the optical transmission medium 2300 and/or the optical transceiver chip 2400 may be disposed before the coupling element 2200 is formed, which is not limited herein.

Meanwhile, the manufacturing method of the circuit board in this embodiment is compatible with the manufacturing process of the circuit board main body 2100, that is, the manufacturing of the circuit board main body 2100 is not affected, and the manufacturing of other components in the circuit board 2000 is not affected.

The structure of the circuit board 2000 manufactured by the present embodiment is the same as or similar to the structure of the circuit board 1000 in the above embodiments, and specific structures thereof can be referred to the above embodiments, and are not described herein again.

In summary, the circuit board in the present application utilizes the reflection surface of the coupling element to change the transmission direction of the optical signal, and during the preparation process, the coupling element can be directly processed without cutting the circuit board main body, so that on one hand, the formed reflection surface can be ensured to be flat and reach the requirement of the communication level, and on the other hand, the coupling element can be processed independently, so that the processing is convenient, the precision is higher, different structures can be processed, and the structure diversification and customization are realized.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. A circuit board, comprising:

the circuit board main body is provided with a groove;

a coupling element disposed in the recess, wherein the coupling element has a reflective surface;

the bonding layer is arranged between the circuit board main body and the coupling element and is used for bonding the circuit board main body and the coupling element;

the circuit board is further provided with an optical transmission medium and/or an optical transceiver chip, and the circuit board realizes transmission of optical signals between the optical transmission medium and/or the optical transceiver chip by the aid of the reflecting surface of the coupling element.

2. The circuit board of claim 1, wherein the reflective surface is planar or curved.

3. The wiring board of claim 1, wherein the coupling element comprises a metal block having the reflective surface, or a metal block and a reflective layer disposed on a surface of the metal block, wherein a surface of the reflective layer serves as the reflective surface.

4. The wiring board of claim 1, wherein the coupling element comprises a dielectric block and a reflective layer disposed on a surface of the dielectric block, wherein a surface of the reflective layer serves as the reflective surface.

5. The wiring board of claim 4,

the dielectric block is one of a plastic block, a silicon wafer block, and a prism.

6. The wiring board of claim 4, wherein the reflective layer comprises at least one of a dielectric reflective sublayer and a metallic reflective sublayer.

7. The wiring board of claim 4, wherein the coupling element further comprises:

a transition layer disposed between the dielectric block and the reflective layer;

the protective layer is arranged on one side, far away from the transition layer, of the reflecting layer;

and the antireflection layer is arranged on one side of the protective layer, which is far away from the reflecting layer.

8. The wiring board of claim 1, wherein the number of the reflecting surfaces is one or more than two.

9. The wiring board of claim 1,

an accommodating space is formed between the reflecting surface of the coupling element and the groove wall of the groove.

10. The wiring board of claim 9, further comprising:

and the light transmitting block is arranged in the accommodating space.

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