CN114203729B - Semi-finished OLED display panel and OLED display panel manufacturing method - Google Patents
Semi-finished OLED display panel and OLED display panel manufacturing method Download PDFInfo
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- CN114203729B CN114203729B CN202111476924.5A CN202111476924A CN114203729B CN 114203729 B CN114203729 B CN 114203729B CN 202111476924 A CN202111476924 A CN 202111476924A CN 114203729 B CN114203729 B CN 114203729B
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000010410 layer Substances 0.000 claims abstract description 199
- 239000000758 substrate Substances 0.000 claims abstract description 185
- 230000008093 supporting effect Effects 0.000 claims abstract description 69
- 238000002360 preparation method Methods 0.000 claims abstract description 34
- 239000002346 layers by function Substances 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000010408 film Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The embodiment of the application discloses a semi-finished OLED display panel and a preparation method of the OLED display panel, wherein a rigid substrate with a second thickness is prepared on a supporting layer with a first thickness, the first thickness is larger than the second thickness, the supporting layer is used for supporting in an auxiliary mode to finish preparation of an array layer, a luminous functional layer and a packaging layer, after preparation of each film layer of the OLED display panel is finished, the supporting layer is removed, and the OLED display panel only comprising the rigid substrate with the second thickness is obtained, so that cost is reduced, and yield is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a semi-finished OLED display panel and a preparation method of the OLED display panel.
Background
The manufacturing method of the flexible AMOLED television commonly used in the industry at present comprises the following steps: coating a layer of polyimide material on a 0.5cm rigid substrate to prepare a flexible substrate, then preparing an array layer, a light-emitting layer and a packaging layer, and finally carrying out glass thinning process on the 0.5cm rigid substrate through hydrofluoric acid after packaging of the OLED display panel is completed to form the 0.1cm rigid substrate, so as to prepare the OLED display panel; the glass thinning process is complicated, the production cost is high, the Bao Hualiang rate of the large-size rigid substrate is about 30%, and the preparation cost of the OLED display panel is greatly increased.
Therefore, the existing preparation method of the OLED display panel has the technical problems of low Bao Hualiang rate of the rigid substrate and high preparation cost.
Disclosure of Invention
The embodiment of the application provides a semi-finished OLED display panel and a preparation method of the OLED display panel, which can solve the technical problems of low Bao Hualiang rate and high preparation cost of a rigid substrate in the conventional preparation method of the OLED display panel.
The embodiment of the application provides a semi-finished OLED display panel, which comprises:
a substrate base;
the array layer is arranged on the substrate base plate;
a light emitting functional layer disposed over the array layer;
the packaging layer is arranged on the light-emitting functional layer;
the substrate comprises a supporting layer, a stripping layer, a rigid substrate and a flexible substrate which are sequentially stacked, wherein the thickness of the supporting layer is a first thickness, the thickness of the rigid substrate is a second thickness, and the first thickness is larger than the second thickness.
Alternatively, in some embodiments of the application, the first thickness ranges from 0.5cm to 0.7cm and the second thickness ranges from 0.1cm to 0.14cm.
Alternatively, in some embodiments of the present application, the support layer is made of the same material as the rigid substrate and the release layer is made of the same material as the flexible substrate.
Alternatively, in some embodiments of the application, the release layer and the flexible substrate are both polyimide.
Optionally, in some embodiments of the present application, the release layer is made of a material that is a reduced-viscosity adhesive, and the reduced-viscosity adhesive is reduced in viscosity under ultraviolet light.
The embodiment of the application provides a preparation method of an OLED display panel, which comprises the following steps:
providing a supporting layer;
sequentially preparing a stripping layer, a rigid substrate and a flexible substrate on the supporting layer to obtain a substrate base plate, wherein the thickness of the supporting layer is larger than that of the rigid substrate;
sequentially preparing an array layer, a luminous functional layer and a packaging layer on the flexible substrate to obtain a semi-finished OLED display panel;
and stripping the supporting layer and the stripping layer from the rigid substrate to obtain the OLED display panel.
Optionally, in some embodiments of the present application, in the step of obtaining the substrate base plate, the method further includes: providing a supporting layer with the thickness of 0.5cm, and preparing the rigid substrate with the thickness of 0.1cm above the supporting layer.
Optionally, in some embodiments of the present application, in the step of obtaining the substrate base plate, the method further includes: and respectively preparing the stripping layer and the flexible substrate by adopting polyimide materials.
Optionally, in some embodiments of the present application, in the step of obtaining the OLED display panel, the method further includes: the release layer is peeled from the rigid substrate using a laser lift-off technique.
Optionally, in some embodiments of the present application, in the step of peeling the support layer and the peeling layer from the rigid substrate, further comprising: the preparation material of the stripping layer is viscosity reducing adhesive, and the contact surface between the stripping layer and the rigid substrate is irradiated by ultraviolet light, so that the viscosity of the contact surface is reduced, and the stripping layer is stripped from the rigid substrate.
The beneficial effects are that: according to the application, the rigid substrate with the second thickness is arranged above the supporting layer with the first thickness, the first thickness is larger than the second thickness, the supporting layer is used for supporting in an auxiliary mode to finish the preparation of each film layer of the OLED display panel, after the preparation of each film layer of the OLED display panel is finished, the supporting layer is removed, the rigid substrate is reserved, the rigid substrate with the second thickness can be obtained without glass thinning, and therefore, the cost is reduced, and the yield is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIGS. 1A to 1C are schematic cross-sectional views of a conventional OLED display panel manufacturing method;
FIG. 2 is a schematic cross-sectional view of a semi-finished OLED display panel provided by the present application;
fig. 3A to 3C are schematic cross-sectional views of the method for manufacturing an OLED display panel according to the present application;
fig. 4 is a schematic flow chart of a method for manufacturing an OLED display panel according to the present application.
Reference numerals illustrate:
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
Referring to fig. 1A to 1C, in the conventional method for manufacturing an OLED display panel, a rigid substrate 103 having a thickness ranging from 0.5cm to 0.7cm is provided, and an array layer, a light emitting functional layer, and a packaging layer are formed thereon, and after the preparation of the above film layer is completed, the thickness of the rigid substrate 103 is reduced to 0.1cm to 0.14cm by a glass thinning process, so as to realize flexible display of the OLED display panel.
The rigid substrate 103 may be thinned by hydrofluoric acid, etc. to obtain the rigid substrate 103 with a thickness ranging from 0.1cm to 0.14cm, so as to meet the requirement of the OLED display panel, but the yield of glass thinning is low, generally only 30%, and the manufacturing cost is increased.
Referring to fig. 1A, a rigid substrate 103 with a thickness ranging from 0.5cm to 0.7cm and a flexible substrate 104 disposed thereon are provided;
referring to fig. 1B, on the basis of fig. 1A, an array layer 20, a light-emitting functional layer 30, and a packaging layer 40 are prepared;
referring to fig. 1C, on the basis of fig. 1B, the thickness of the rigid substrate 103 is thinned from 0.5cm to 0.7cm to 0.1cm to 0.14cm by a glass thinning process, so as to achieve the effects of flexible display and light and thin display of the OLED display panel.
Referring to fig. 2, the present application provides a semi-finished OLED display panel 1, where the semi-finished OLED display panel 1 includes a substrate 10, an array layer 20, a light-emitting functional layer 30, and an encapsulation layer 40, the array layer 20 is disposed on the substrate 10, the light-emitting functional layer 30 is disposed above the array layer 20, and the encapsulation layer 40 is disposed on the light-emitting functional layer 30, and the substrate 10 includes a supporting layer 101, a peeling layer 102, a rigid substrate 103, and a flexible substrate 104, which are sequentially stacked, where the thickness of the supporting layer 101 is greater than that of the rigid substrate 103.
Wherein, the thickness of the supporting layer 101 may be in the range of 0.5cm to 0.7cm, and the thickness of the rigid substrate 103 may be in the range of 0.1cm to 0.14cm.
In this embodiment, the supporting layer 101 plays a role of supporting assistance, and after the preparation of each film layer of the OLED display panel is completed, the peeling layer 102 and the supporting layer 101 are removed, so as to obtain an OLED display panel only including the substrate 103 with the required second thickness D2; compared with the prior art, the method does not need to obtain the rigid substrate 103 with the second thickness D2 by a glass thinning technology, so that the yield can be remarkably improved, and the cost can be reduced.
Referring to fig. 3A to 3C, the present application further provides a method for manufacturing an OLED display panel, by removing the supporting layer 101 and the peeling layer 102 of the semi-finished OLED display panel 1, an OLED display panel with the rigid substrate 103 having the second thickness D2 is obtained, which alleviates the technical problems of low Bao Hualiang rate and high manufacturing cost of the rigid substrate 103 in the existing method for manufacturing an OLED display panel.
Referring to fig. 3A, a substrate is provided, wherein the substrate includes a supporting layer 101, a peeling layer 102, a rigid substrate 103, and a flexible substrate 104, the supporting layer has a thickness ranging from 0.5cm to 0.7cm, and the rigid substrate has a thickness ranging from 0.1cm to 0.14cm;
referring to fig. 3B, the array layer 20, the light-emitting functional layer 30, and the encapsulation layer 40 are prepared on the substrate, and the supporting layer 101 plays a role of supporting in an auxiliary manner, so that the flatness of the preparation of the film is ensured, and the semi-finished OLED display panel 1 is obtained;
referring to fig. 3B, the support layer 101 is peeled from the semi-finished OLED display panel 1 by the peeling layer 102, so as to obtain an OLED display panel including only the rigid substrate 103, where the OLED display panel includes the rigid substrate 103 with a thickness ranging from 0.1cm to 0.14cm, so that flexible display can be realized.
The technical scheme of the present application will now be described with reference to specific embodiments.
Referring to fig. 2, the semi-finished OLED display panel 1 provided by the present application includes a substrate 10, where the substrate 10 includes a supporting layer 101, a peeling layer 102, a rigid substrate 103, and a flexible substrate 104, which are sequentially stacked, the supporting layer 101 has a first thickness D1, the rigid substrate 103 has a second thickness D2, and the first thickness D1 is greater than the second thickness D2.
In this embodiment, the rigid substrate 103 is a part of an OLED display panel, and the supporting layer 101 is removed after the semi-finished OLED display panel 1 is manufactured, and the supporting layer 101 plays a role of supporting in an auxiliary manner during the process of manufacturing the OLED display panel, so that the array layer 20, the light-emitting functional layer 30 and the packaging layer 40 can be manufactured on the substrate 10, and the flatness of the array layer 20, the light-emitting functional layer 30 and the packaging layer 40 is improved.
Wherein the first thickness ranges from 0.5cm to 0.7cm and the second thickness ranges from 0.1cm to 0.14cm.
The second thickness D2 is the thickness of the rigid substrate 103 required for realizing flexible display of the OLED display panel, and preferably, the thickness may be 0.1cm.
The supporting layer 101 mainly plays a role of auxiliary support when preparing the film layer above the substrate 10, and is part of the semi-finished OLED display panel 1, but not part of the OLED display panel, and the supporting layer 101 is removed after completing the preparation process of each film layer of the OLED display panel.
It can be appreciated that when the thickness of the rigid substrate 103 ranges from 0.1cm to 0.14cm, the requirements of light and thin, flexible display of the OLED display panel are satisfied, and the overall stiffness of the OLED display panel can be improved.
It can be understood that when the thickness of the supporting layer 101 is 0.5cm to 0.7cm, in the process of preparing the array layer 20, the light-emitting functional layer 30 and the encapsulation layer 40, the supporting layer 101 can have a good supporting effect, and the yield of each film layer in the preparation process is improved.
The OLED display panel may be an AMOLED display panel.
In one embodiment, the thickness of the support layer 101 is 0.5cm and the thickness of the rigid substrate 103 is 0.1cm.
In one embodiment, the support layer 101 is made of the same material as the rigid substrate 103.
Wherein, the supporting layer 101 and the rigid substrate 103 may be glass.
It is understood that when the supporting layer 101 and the rigid substrate 103 are made of the same material, the same equipment is used to form the supporting layer 101 and the rigid substrate 103 having different thicknesses when the supporting layer 101 and the rigid substrate 103 are respectively made of the same material, so that the production cost can be reduced.
Note that, in the process of preparing the support layer 101 to the process of preparing the rigid substrate 103, the preparation material does not need to be replaced again, and the preparation efficiency is also improved.
In one embodiment, the release layer 102 and the flexible substrate 104 may be made of different materials.
The preparation material of the flexible substrate 104 may be polyimide, and the peeling layer 102 may be removed by chemical etching, so that the peeling layer 102 and the supporting layer 101 are peeled from the semi-finished OLED display panel 1, unlike the preparation material of the flexible substrate 104.
In the present embodiment, the variety of the peeling modes of the peeling layer 102 together with the supporting layer 101 is increased by providing the peeling layer 102 with a variety of preparation materials.
In one embodiment, the release layer 102 is made of a material that reduces the tackiness of the adhesive under ultraviolet light.
After the preparation of the array layer 20, the light-emitting functional layer 30, and the encapsulation layer 40 is completed, the semi-finished OLED display panel 1 is obtained, and then the contact surface between the adhesion-reducing agent and the rigid substrate 103 is irradiated by ultraviolet light, so that the adhesion between the adhesion-reducing agent and the rigid substrate 103 is reduced, and the adhesion-reducing agent and the support layer 101 are peeled off from the semi-finished OLED display panel 1.
In this embodiment, by setting the peeling layer 102 to be a subtractive adhesive, the peeling layer 102 is reduced in adhesiveness in a portion irradiated with ultraviolet light after being irradiated with ultraviolet light, so that the peeling layer 102 together with the supporting layer 101 can be peeled off from the semi-finished OLED display panel 1 more easily.
In one embodiment, the release layer 102 is the same material from which the flexible substrate 104 is made.
Wherein, the preparation materials of the release layer 102 and the flexible substrate 104 are polyimide.
Wherein, the preparation material of the rigid substrate 103 may be glass.
In this embodiment, a contact surface exists between the rigid substrate 103 and the peeling layer 102, and the peeling layer 102 is peeled from the rigid substrate 103 by irradiating the contact surface with laser light.
It will be appreciated that the support layer 101 is disposed on a surface of the release layer 102 remote from the contact surface, and therefore, when the release layer 102 is peeled from the rigid substrate 103, the support layer 101 is also peeled from the rigid substrate 103, resulting in a rigid substrate 103 of a desired thickness.
It should be noted that the thickness of the rigid substrate 103 is a second thickness D2, and the thickness of the supporting layer 101 is a first thickness D1, and the first thickness D1 is greater than the second thickness D2.
It is noted that the laser light can be irradiated to the contact surface at a fixed point without irradiating the position where the rigid substrate 103 is in contact with the flexible substrate 104, and thus the laser light does not cause peeling of the rigid substrate 103 from the flexible substrate 104.
The embodiment of the present application further provides a substrate 10, where the substrate 10 includes a supporting layer 101 with a first thickness D1, a peeling layer 102, a rigid substrate 103 with a second thickness D2, and a flexible substrate 104, where the supporting layer 101 is used to perform an auxiliary supporting function, so that a preparation process above the substrate 10 can be performed normally, and after the preparation process is completed, the supporting layer 101 is peeled from the rigid substrate 103 by using the peeling layer 102.
In one embodiment, a concave-convex structure is formed between the rigid substrate 103 and the flexible substrate 104.
Wherein, the concave-convex structure comprises grooves and protrusions.
Wherein, the side surface of the rigid substrate 103 facing the flexible substrate 104 is provided with a protrusion, the side surface of the flexible substrate 104 facing the rigid substrate 103 is provided with a groove, the groove and the protrusion are arranged in a counterpoint manner, and the protrusion and the groove are mutually clamped.
Wherein, a protrusion may be disposed on a side of the rigid substrate 103 facing the flexible substrate 104, and the protrusion is independently disposed and is adhered and fixed to the rigid substrate by an adhesive.
It will be appreciated that, on the side of the rigid substrate 103 facing the flexible substrate 104, a protrusion/recess is provided, and in the process of preparing the flexible substrate 104 on the rigid substrate 103, the whole surface of the flexible substrate 104 is coated on the rigid substrate 103, and on the side of the flexible substrate 104 facing the rigid substrate 103, a recess/protrusion matching the protrusion/recess is formed.
In the present embodiment, by forming the concave-convex structure between the rigid substrate 103 and the flexible substrate 104, the contact area between the rigid substrate 103 and the flexible substrate 104 is increased, and the binding force between the rigid substrate 103 and the flexible substrate 104 is increased; avoiding peeling of the rigid substrate 103 and the flexible substrate 104 when peeling the peeling layer 102 and the supporting layer 101.
Referring to fig. 3A to 3B and fig. 4, an embodiment of the present application provides a method for manufacturing an OLED display panel, including:
s1: providing a supporting layer 101;
s2: sequentially preparing a stripping layer 102, a rigid substrate 103 and a flexible substrate 104 on the supporting layer 101 to obtain a substrate base plate 10, wherein the thickness of the supporting layer 101 is larger than that of the rigid substrate 103;
s3: sequentially preparing an array layer 20, a light-emitting function layer 30 and a packaging layer 40 on the flexible substrate 104 to obtain a semi-finished OLED display panel 1;
s4: and peeling the supporting layer 101 and the peeling layer 102 from the rigid substrate 103 to obtain the OLED display panel.
When the thickness of the rigid substrate 103 is 0.1cm to 0.14cm, the rigid substrate can meet the requirement of light and thin OLED display panel, and can also play a certain supporting role on the upper film layer; when the thickness of the supporting layer 101 is 0.5cm to 0.7cm, in the process of preparing the array layer 20, the light-emitting functional layer 30 and the packaging layer 40, the supporting layer 101 can have a good supporting effect, and the yield of the preparation process of each film layer of the OLED display panel is improved.
In one embodiment, in the step of obtaining the substrate base plate 10, further includes: providing a supporting layer 101 with a thickness of 0.5cm, and preparing a rigid substrate 103 with a thickness of 0.1cm above the supporting layer 101.
In one embodiment, in the step of obtaining the substrate base plate 10, further includes: the release layer 102 and the flexible substrate 104 are each fabricated from a polyimide material.
In one embodiment, in the step of obtaining the substrate base plate 10, further includes: the release layer 102 is prepared on the support layer 101 to a first thickness, and the flexible substrate 104 is prepared above the release layer 102 to a second thickness, wherein the first thickness is greater than the second thickness.
In one embodiment, in the step of obtaining the OLED display panel, the method further includes: the release layer 102 is peeled from the rigid substrate 103 using a laser peeling technique.
Wherein the laser lift-off technique is capable of irradiating a region of the lift-off layer 102 within a specific thickness range in a localized manner such that the lift-off layer 102 in that region can be removed or etched, thereby allowing the lift-off layer 102 to be lifted off from the rigid substrate 103.
Wherein, since the laser reaches only the position where the peeling layer 102 contacts the rigid substrate 103, and does not irradiate the flexible substrate 104 and the rigid substrate 103, the technical problem of peeling the flexible substrate 104 and the rigid substrate 103 from each other by the laser peeling technique can be also alleviated.
In one embodiment, in the step of peeling the support layer 101 and the peeling layer 102 from the rigid substrate 103, further comprising: the material for preparing the peeling layer 102 is a viscosity reducing adhesive, and the peeling layer 102 is peeled off from the rigid substrate 103 by irradiating the contact surface between the peeling layer 102 and the rigid substrate 103 with ultraviolet light to reduce the viscosity of the contact surface.
In this embodiment, by setting the peeling layer 102 to be a subtractive adhesive, the contact surface between the peeling layer 102 and the rigid substrate 103 is reduced in the tackiness of the portion irradiated with ultraviolet light after the irradiation with ultraviolet light, so that the peeling layer 102 together with the supporting layer 101 can be peeled off from the semi-finished OLED display panel 1 more easily.
The application also provides an OLED display panel, a display module and a display device, wherein the OLED display panel is prepared by the semi-finished OLED display panel in any embodiment, and the display module comprises the OLED display panel, a back plate, a rubber frame, an optical film, a light guide plate/diffusion plate and the like, wherein the back plate, the rubber frame, the optical film and the light guide plate/diffusion plate are arranged on one side of the OLED display panel. The display device also includes the OLED display panel, which is not described herein.
The preparation method of the OLED display panel provided by the embodiment comprises the following steps: firstly preparing a support layer with a first thickness, preparing a stripping layer, a rigid substrate with a second thickness and a flexible substrate on the support layer, wherein the first thickness is larger than the second thickness, then preparing an array layer, a luminous functional layer and a packaging layer to obtain a semi-finished OLED display panel, and finally stripping the stripping layer and the support layer from the semi-finished OLED display panel to obtain the OLED display panel; the support layer with the preset thickness is firstly prepared on one side of the bottom of the rigid substrate, the thickness of the support layer is larger than that of the rigid substrate, the support layer is removed after the preparation of each OLED film layer is finished, and the rigid substrate with the second thickness is reserved, so that an OLED display panel with the rigid substrate is obtained without glass thinning technology, the cost is reduced, and the yield is improved.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The above description is made in detail of a semi-finished OLED display panel and a method for manufacturing an OLED display panel provided by the embodiments of the present application, and specific examples are applied to illustrate the principles and embodiments of the present application, where the above description of the embodiments is only for helping to understand the method and core ideas of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (10)
1. A semi-finished OLED display panel comprising:
a substrate base;
the array layer is arranged on the substrate base plate;
a light emitting functional layer disposed over the array layer;
the packaging layer is arranged on the light-emitting functional layer;
the substrate comprises a supporting layer, a stripping layer, a rigid substrate and a flexible substrate which are sequentially stacked, wherein the thickness of the supporting layer is a first thickness, the thickness of the rigid substrate is a second thickness, the first thickness is larger than the second thickness, and a concave-convex structure is formed between the rigid substrate and the flexible substrate.
2. The semi-finished OLED display panel of claim 1, wherein the first thickness ranges from 0.5cm to 0.7cm and the second thickness ranges from 0.1cm to 0.14cm.
3. The semi-finished OLED display panel of claim 2, wherein the support layer is made of the same material as the rigid substrate and the release layer is made of the same material as the flexible substrate.
4. The semi-finished OLED display panel claimed in claim 3 wherein said release layer and said flexible substrate are both polyimide.
5. The semi-finished OLED display panel of claim 2, wherein the release layer is made of a material that reduces tackiness upon exposure to ultraviolet light.
6. The preparation method of the OLED display panel is characterized by comprising the following steps of:
providing a supporting layer;
sequentially preparing a stripping layer, a rigid substrate and a flexible substrate on the supporting layer to obtain a substrate base plate, wherein the thickness of the supporting layer is larger than that of the rigid substrate, and a concave-convex structure is formed between the rigid substrate and the flexible substrate;
sequentially preparing an array layer, a luminous functional layer and a packaging layer on the flexible substrate to obtain a semi-finished OLED display panel;
and stripping the supporting layer and the stripping layer from the rigid substrate to obtain the OLED display panel.
7. The method of manufacturing an OLED display panel as claimed in claim 6, wherein in the step of obtaining the base substrate, further comprising: providing a supporting layer with the thickness of 0.5cm, and preparing the rigid substrate with the thickness of 0.1cm above the supporting layer.
8. The method of manufacturing an OLED display panel as claimed in claim 6, wherein in the step of obtaining the base substrate, further comprising: and respectively preparing the stripping layer and the flexible substrate by adopting polyimide materials.
9. The method of manufacturing an OLED display panel as claimed in claim 6, wherein in the step of obtaining the OLED display panel, further comprising: the release layer is peeled from the rigid substrate using a laser lift-off technique.
10. The method of manufacturing an OLED display panel according to claim 6, wherein in the step of peeling the support layer and the peeling layer from the rigid substrate, further comprising: the preparation material of the stripping layer is viscosity reducing adhesive, and the contact surface between the stripping layer and the rigid substrate is irradiated by ultraviolet light, so that the viscosity of the contact surface is reduced, and the stripping layer is stripped from the rigid substrate.
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