CN110767592A - Flexible display substrate, preparation method thereof and stripping device - Google Patents
Flexible display substrate, preparation method thereof and stripping device Download PDFInfo
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- CN110767592A CN110767592A CN201910874058.1A CN201910874058A CN110767592A CN 110767592 A CN110767592 A CN 110767592A CN 201910874058 A CN201910874058 A CN 201910874058A CN 110767592 A CN110767592 A CN 110767592A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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Abstract
The invention relates to a flexible display substrate, a preparation method thereof and a stripping device. When the stripping device works, the preset flexible display substrate adhered with the support plate can be placed in the sealed cavity, the support plate is connected with the first adsorption screen plate, and the preset flexible display substrate is connected with the second adsorption screen plate. In the inflation process, the edge of the support plate is firstly pulled by the first adsorption screen plate, and the center of the support plate is pulled by the first adsorption screen plate. Therefore, when the peeling device is used for peeling the supporting plate, the supporting plate can be gradually peeled from the closed edge of the preset flexible display substrate, so that the force required for peeling the supporting plate is reduced, and the possibility that the protective film falls off under the action of external force is reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible display substrate, a preparation method thereof and a stripping device.
Background
The flexible display device is a display device prepared and formed on the basis of a flexible display substrate. Flexible display devices are increasingly used because they have the characteristics of being rollable, wide viewing angle, and portable.
In the conventional technology, a flexible display substrate is usually formed on a support plate in a preparation process, a protective film is attached to an encapsulation layer of the flexible display substrate, and then the support plate and the protective film are peeled off sequentially.
The applicant found in the course of implementing the conventional technique that: in the conventional preparation method of the flexible display substrate, the protective film is easy to fall off from the packaging layer when the supporting plate is peeled off.
Disclosure of Invention
In view of the above, it is necessary to provide a flexible display substrate, a method for manufacturing the same, and a peeling apparatus for solving the problem in the conventional technology that a protective film is easily peeled off from an encapsulation layer during the manufacturing process of the flexible display substrate.
A peeling apparatus for peeling a supporting plate in a process of manufacturing a flexible display substrate, comprising:
a first adsorption screen plate;
the second adsorption screen plate is arranged opposite to the first adsorption screen plate;
and the sealing structure is arranged between the first adsorption screen plate and the second adsorption screen plate so as to enable the first adsorption screen plate, the second adsorption screen plate and the sealing structure to enclose to form a sealed cavity, and the sealing structure is also provided with an air inlet for introducing air into the sealed cavity.
The stripping device can be used for stripping the supporting plate in the preparation process of the flexible display substrate. When the stripping device works, the preset flexible display substrate adhered with the support plate can be placed in the sealed cavity, the support plate is connected with the first adsorption screen plate, and the preset flexible display substrate is connected with the second adsorption screen plate. At the moment, gas is introduced into the sealed cavity, so that the first adsorption screen printing plate and the second adsorption screen printing plate are deformed to be away from each other, and the support plate is driven to be separated from the flexible display substrate. Meanwhile, in the inflation process, the edge of the support plate is firstly pulled by the first adsorption screen plate, and the center of the support plate is pulled by the first adsorption screen plate. Therefore, when the peeling device is used for peeling the supporting plate, the supporting plate can be gradually peeled from the peripheral edge of the preset flexible display substrate, so that the force required for peeling the supporting plate is reduced, and the possibility that the protective film falls off under the action of external force is reduced.
A method for preparing a flexible display substrate comprises the following steps:
forming a preset flexible display substrate on a support plate;
attaching a protective layer to the preset flexible display substrate, wherein the preset flexible display substrate is arranged between the protective layer and the supporting plate to form a first substrate;
providing the stripping device, placing the first substrate in the sealed cavity, connecting the support plate with the first wall surface, and connecting the protective layer with the second wall surface;
introducing gas into the sealed cavity, so that the first adsorption screen plate and the second adsorption screen plate expand in opposite directions, and the support plate begins to be peeled off from the periphery of the contact surface of the support plate and the preset flexible display substrate towards the center;
and stripping the protective layer to form the flexible display substrate.
According to the preparation method of the flexible display substrate, the preset flexible display substrate is formed on the supporting plate, and after the protective layer is attached to the preset flexible display substrate, the supporting plate and the protective layer are sequentially peeled off. Wherein, with the peeling device in the above embodiment, the support plate is peeled from the periphery of the contact surface of the support plate and the preset flexible display substrate simultaneously toward the center. According to the preparation method of the flexible display substrate, the support plate is gradually stripped from the periphery of the preset flexible display substrate to the center, the force required for stripping the support plate can be reduced, and therefore the possibility that the protective film falls off under the action of external force is reduced.
A flexible display substrate is prepared by the preparation method of the flexible display substrate.
Drawings
FIG. 1 is a schematic cross-sectional view of a peeling apparatus according to an embodiment of the present application.
FIG. 2 is a schematic cross-sectional view illustrating an operation state of a peeling apparatus according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional view illustrating a supporting plate and a pre-flexible display substrate according to an embodiment of the present disclosure.
FIG. 4 is a schematic cross-sectional view showing the operation state of a peeling apparatus according to another embodiment of the present application.
Fig. 5 is a schematic view of a surface structure of a first adsorption screen in an embodiment of the present application.
Fig. 6 is a schematic view of a surface structure of a second adsorption screen according to an embodiment of the present application.
Fig. 7 is a schematic view of a surface structure of a first adsorption screen in another embodiment of the present application.
Fig. 8 is a schematic flow chart illustrating a method for manufacturing a flexible display substrate according to an embodiment of the present disclosure.
Fig. 9 is a schematic top view of a support plate and a pre-positioned flexible display substrate according to an embodiment of the present application.
Fig. 10 is a partial schematic flow chart of a method for manufacturing a flexible display substrate according to an embodiment of the present disclosure.
Fig. 11 is a partial schematic flow chart of a method for manufacturing a flexible display substrate according to another embodiment of the present disclosure.
Fig. 12 is a partial operation schematic diagram of a manufacturing method of a flexible display substrate according to an embodiment of the present application.
Fig. 13 is a partial schematic flow chart of a method for manufacturing a flexible display substrate according to another embodiment of the present application.
Fig. 14 is a schematic cross-sectional view illustrating a flexible display substrate according to an embodiment of the present disclosure.
Wherein, the meanings represented by the reference numerals of the figures are respectively as follows:
10. a peeling device;
102. an air inlet;
104. sealing the cavity;
110. a first adsorption screen plate;
112. a first wall surface;
114. a first adsorption mesh;
120. a second adsorption screen;
122. a second wall surface;
124. a second adsorption mesh;
130. a packaging structure;
20. a first substrate;
200. a support plate;
210. a separation layer;
300. presetting a flexible display substrate;
302. closing the edge;
310. a flexible substrate;
320. a thin film transistor layer;
330. a light emitting layer;
340. a packaging layer;
400. a protective layer;
410. reducing the adhesive by ultraviolet light;
30. a flexible display substrate.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
The application provides a flexible display substrate, a preparation method thereof and a stripping device, aiming at the problem that a protective film is easy to fall off from an encapsulation layer when a support plate is mechanically stripped in the manufacturing process of the flexible display substrate in the traditional technology.
A peeling apparatus 10 is used for peeling a support plate 200 in a process of manufacturing a flexible display substrate 30, as shown in FIG. 1, and includes a first suction screen 110, a second suction screen 120 and a package structure 130.
Specifically, the first suction screen 110 and the second suction screen 120 may be air-impermeable flexible screens. As shown in fig. 2, the first suction screen 110 is configured to be connected to the support plate 200 during a peeling process, and the second suction screen 120 is configured to be connected to the pre-set flexible display substrate 300 during a peeling process, so that when the first suction screen 110 and the second suction screen 120 are deformed away from each other, the support plate 200 is peeled off. As shown in fig. 3, the difference between the pre-flexible display substrate 300 and the flexible display substrate 30 is that the flexible display substrate 30 is a final product of the manufacturing method of the flexible display substrate 30 of the present application, and the pre-flexible display substrate 300 is a general term for a film layer including the flexible substrate 310, the thin-film transistor layer 320, the light-emitting layer 330, and the encapsulation layer 340 during the manufacturing process (before the supporting plate 200 is peeled off). In other words, the flexible display substrate 300 is a film layer that is not peeled off from the supporting plate 200, and the flexible display substrate 30 is obtained after the flexible display substrate 300 is peeled off from the supporting plate 200.
The encapsulation structure 130 is used to constitute the peeling apparatus 10. The edge of the first adsorption screen 110 and the edge of the second adsorption screen 120 which are oppositely arranged are encapsulated by using the encapsulation structure 130, so that the stripping device 10 with the sealed cavity 104 can be obtained. Here, the package structure 130 may be a soft plastic such as rubber, or may be a metal material. When the first and second screens are packaged by using the package structure 130, the gas inlet 102 for introducing gas should be left on the package structure 130. The gas inlet 102 is used for introducing gas into the sealed cavity 104, so that the first screen plate and the second screen plate are deformed away from each other.
The peeling apparatus 10 can be used for peeling the support plate 200 in the process of preparing the flexible display substrate 30. When the peeling device 10 works, the edge of the supporting plate 200 is firstly pulled by the first adsorption screen 110 during the inflation process, and the center of the supporting plate 200 is secondly pulled by the first adsorption screen 110. Therefore, when the peeling apparatus 10 is used to peel the support plate 200, the support plate 200 can be gradually peeled from the closed edge 302 where the support plate 200 and the pre-set flexible display substrate 300 are in contact (the edge of the interface where the support plate 200 and the pre-set flexible display substrate 300 are in contact forms the closed edge 302) at the same time, thereby reducing the force required to peel the support plate 200 and reducing the possibility that the protective film is peeled off by an external force.
It should be noted that, in the process of peeling the supporting plate 200, in order to avoid the peeling process from damaging the preset flexible display substrate 300, a protective layer 400 may be attached on a surface of the preset flexible display substrate 300 away from the supporting plate 200 for protecting the preset flexible display substrate 300. When the protective layer 400 is attached to the surface of the preset flexible display substrate 300 away from the supporting plate 200, during the peeling process, the first suction screen 110 of the peeling apparatus 10 may be connected to the supporting plate 200, and the second suction screen 120 may be connected to the protective layer 400, as shown in fig. 4.
In one embodiment, as shown in fig. 5 to 7, the first wall surface 112 has first adsorption holes 114 to adsorb the support plate 200; the second wall 122 has a second adsorption mesh 124 to adsorb the protection layer 400.
Specifically, the first wall surface 112 refers to a surface of the first adsorption screen 110 close to the second adsorption screen 120; the second wall 122 refers to the surface of the second suction screen 120 close to the first suction screen 110. The first wall surface 112 has a first adsorption mesh 114 for vacuum adsorption to be connected with the support plate 200. The second wall 122 also has a second adsorption mesh 124 for vacuum adsorption, thereby adsorbing the protective layer 400. The separation and connection of the support plate 200 from the first wall surface 112 can be facilitated by vacuum-sucking the support plate 200 using the first sucking mesh 114. Similarly, the second adsorption mesh 124 is used to adsorb the protection layer 400, thereby facilitating the separation and connection of the protection layer 400 from the second wall 122.
In general, the first wall surface 112 may have the first adsorption mesh 114 only at a connection portion with the support plate 200. The second wall 122 may have the second adsorption mesh 124 only at a portion connected to the protective layer 400.
Further, as shown in fig. 5 and 6, the density of the first suction screen 114 decreases from the edge to the center region of the first suction screen 110. The second suction screen openings 124 are equally spaced from the edge to the center of the second suction screen 120.
Specifically, the edges are opposite the center, and the edges surround the center area. Along the edge to the central area, i.e. in the direction pointing from the periphery towards the centre. For the coverage of the pre-positioned flexible display substrate 300 on the support plate 200, in order to peel off the support plate 200 from the closed edge 302, the distribution of the first adsorption mesh 114 on the first wall surface 112 may be designed as shown in fig. 5. At this time, the density of the first adsorption holes 114 is gradually decreased along the edge to the center region within the coverage of the support plate 200, and the adsorption force between the support plate 200 and the first wall surface 112 is also gradually decreased. Thus, when the first wall surface 112 deforms away from the second wall surface 122, the bonding force between the edge of the support plate 200 and the first wall surface 112 is large, and the bonding force between the central region of the support plate 200 and the first wall surface 112 is small, so that the support plate 200 can be peeled off from the closed edge 302.
Meanwhile, in order to prevent the protective layer 400 from being unintentionally peeled off during the peeling of the supporting plate 200, the distribution of the second adsorption mesh 124 on the second wall surface 122 may be designed as shown in fig. 6. At this time, within the coverage of the protection layer 400, the second adsorption mesh openings 124 are distributed at equal intervals, and the adsorption force between the protection layer 400 and the second wall surface 122 is distributed uniformly. Therefore, when the first wall surface 112 deforms away from the second wall surface 122, the bonding force between the protection layer 400 and the second wall surface 122 is relatively uniform, i.e., the wall surface protection layer 400 and the second wall surface 122 can be peeled off accidentally.
Further, the distribution density of the second adsorption mesh 124 is not less than the maximum distribution density of the first adsorption mesh 114.
Specifically, within the coverage of the protective layer 400, the second adsorption mesh openings 124 are uniformly distributed. The density of the first adsorption mesh 114 is gradually decreased along the edge to the central region within the coverage of the support plate 200. Therefore, the maximum distribution density of the first adsorption mesh 114 refers to the distribution density of the first adsorption mesh 114 at the edge within the coverage of the support plate 200. The distribution density of the second adsorption net holes 124 should be not less than that of the first adsorption net holes 114 at the inner edge of the coverage of the support plate 200.
It should be noted that in the above embodiment, the purpose of the decrease in the density of the first adsorption apertures 114 along the edge to center area within the coverage area of the support plate 200 is to gradually decrease the bonding force between the first wall surface 112 and the support plate 200, thereby better achieving the peeling of the support plate 200 from the closed edge 302. Therefore, in addition to designing the density of the first adsorption cells 114 to decrease from edge to center, embodiments that use other means to gradually decrease the bonding force between the first wall 112 and the support plate 200 from edge to center should be understood to be within the scope of the present application. For example, in one embodiment, as shown in fig. 7, the diameter of the first adsorption mesh 114 decreases from edge to center area within the footprint of the support plate 200. The diameters of the second adsorption mesh openings 124 are equal within the coverage of the protective layer 400.
A method for manufacturing a flexible display substrate 30, as shown in fig. 8 and 9, includes the following steps:
s100, a pre-set flexible display substrate 30 is formed on the support plate 200.
Specifically, the supporting plate 200 is a rigid substrate for supporting other film layers in the manufacturing process of the flexible display substrate 30. The supporting plate 200 may be a rigid substrate made of glass, or may be a rigid substrate made of other materials, which is not limited herein.
The pre-flexible display substrate 30 is formed on one surface of the support plate 200. The coverage of the flexible display substrate 30 on the supporting plate 200 refers to the coverage of the flexible display substrate 30 on the supporting plate 200. The coverage area has a closed edge 302. In general, in view of the stacked formation of the flexible substrate 310, the thin-film transistor layer 320, the light emitting layer 330 and the encapsulation layer 340, a coverage of the flexible display substrate 30 on the support board 200, that is, a coverage of the flexible substrate 310 on the support board 200, is preset. The cover has a closed edge 302, shown in fig. 9, which is a top view of the support plate 200 and the pre-flexible display substrate 30.
S200, attaching the protection layer 400 to the pre-arranged flexible display substrate 30, wherein the pre-arranged flexible display substrate 30 is disposed between the protection layer 400 and the supporting plate 200 to form the first substrate 20.
The protective layer 400 is attached on the encapsulation layer 340 to protect the encapsulation layer 340 from being damaged during the process of peeling the support plate 200. In general, the protection layer 400 may be an inorganic layer, and the inorganic material used may be at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, and the like.
In the embodiments of the present application, for convenience of description, the film layer structure formed by the support plate 200, the pre-flexible display substrate 30 formed on the support plate 200, and the protective layer 400 is referred to as a first substrate 20. The first substrate 20 is used only for distinguishing the flexible display substrate 30 and the pre-flexible display substrate 30, and does not have other meanings.
S300, providing the peeling apparatus 10 as described in the above embodiments, placing the first substrate 20 in the sealed cavity 104, and connecting the supporting plate 200 to the first wall 112 and the protecting layer 400 to the second wall 122.
S400, gas is introduced into the sealed cavity 104, so that the supporting plate 200 starts to be peeled off from the periphery of the contact surface of the supporting plate (200) and the preset flexible display substrate (300) towards the center.
After the protective layer 400 is attached to form the first substrate 20, the supporting board 200 is peeled off. In the present application, when peeling the support plate 200, the peeling of the support plate 200 may be started from the periphery of the contact surface of the support plate (200) and the pre-set flexible display substrate (300) toward the center at the same time, that is, the peeling of the support plate 200 may be started from the closed edge 302 toward the center at the same time. Here, peeling the support plate 200 from the sealed edge 302 means peeling the support plate 200 in a direction from the sealed edge to the center for the coverage of the above-mentioned pre-set flexible display substrate 30 on the support plate 200.
And S500, stripping the protective layer 400 to form the flexible display substrate 30.
After the peeling of the support plate 200 is completed, the protective layer 400 attached to the encapsulation layer 340 may be peeled off, thereby obtaining the flexible display substrate 30. The resulting flexible display substrate 30 includes a flexible substrate 310 and a thin-film-transistor layer 320, a light-emitting layer 330, and an encapsulation layer 340 on the flexible substrate 310.
According to the preparation method of the flexible display substrate 30, the supporting plate 200 is gradually peeled from the closed edge 302 of the preset flexible display substrate 30, so that the pulling force required when the supporting plate 200 is peeled can be reduced, the separation pulling force between the protective layer 400 and the preset flexible display substrate 30 when the supporting plate 200 is peeled is reduced, and the possibility that the protective film falls off under the action of external force is reduced.
In an embodiment, as shown in fig. 10, before the step S100, the method further includes:
s002, the separation layer 210 is formed on the support plate 200.
A separation layer 210 is formed on the support plate 200, and the separation layer 210 may be generally made of an inorganic material, such as silicon carbide or gallium nitride. As known from the above description, the first pre-substrate includes a flexible substrate 310, and a thin-film transistor layer 320, a light-emitting layer 330 and an encapsulation layer 340 formed on the flexible substrate 310. Thus, the separation layer 210 is formed between the support plate 200 and the flexible substrate 310. Generally, the adhesive force between the separation layer 210 and the flexible substrate 310 is small, and when the separation layer 210 is formed between the flexible substrate 310 and the support plate 200, the flexible substrate 310 and the support plate 200 can be peeled by peeling the flexible substrate 310 and the separation layer 210, thereby facilitating the peeling of the flexible substrate 310 and the support plate 200.
Further, as shown in fig. 10, step S100 includes:
s110, a flexible substrate 310 covering the separation layer 210 is formed on the support plate 200 and on the separation layer 210.
Specifically, the flexible substrate 310 is formed on the support plate 200 and on the separation layer 210. The flexible substrate 310 should completely cover the separation layer 210 and be in contact with the support plate 200. The flexible substrate 310 covers the separation layer 210 and contacts the support plate 200, which may increase the adhesion between the support plate 200 and the edge of the flexible substrate 310, and prevent the edge of the flexible substrate 310 from curling during the manufacturing process of the flexible display substrate 30.
S120, a thin-film transistor layer 320, a light-emitting layer 330, and an encapsulation layer 340 are sequentially formed on the flexible substrate 310.
Forming a thin film transistor layer 320 on the flexible substrate 310 by evaporation or other methods, forming a light emitting layer 330 on the thin film transistor layer 320 by evaporation, and finally forming an encapsulation layer 340 to complete the encapsulation of the light emitting layer 330. This is well known in the art and will not be described in further detail.
In an embodiment, the attaching the protection layer 400 on the preset flexible display substrate 30 in the step S200 specifically includes:
s210, attaching the protection layer 400 on the preset flexible display substrate 30 by the ultraviolet light adhesive reducing layer 410.
Specifically, the ultraviolet light-reduced adhesive 410 is an adhesive whose viscosity is reduced or disappears after being irradiated by ultraviolet light. In step S, the protective layer 400 is attached to the pre-set flexible display substrate 30, which may be by an ultraviolet light-reduced adhesive 410, so that the protective layer 400 is peeled off in the edge step S. When the ultraviolet light adhesive reducing agent 410 is attached to the protection layer 400, the ultraviolet light adhesive reducing agent 410 may be coated on the encapsulation layer 340 of the preset flexible display substrate 30, and then the protection layer 400 is attached; or the ultraviolet light adhesive reducing agent 410 may be coated on one surface of the protection layer 400, and then the protection layer 400 is bonded to the preset flexible display substrate 30.
Further, as shown in fig. 11, the step S210 may include:
s211, forming an ultraviolet light adhesive reducing layer 410 on the surface of the preset flexible display substrate 30 away from the supporting plate 200.
Specifically, the ultraviolet light adhesive reducing layer 410 is formed on the surface of the pre-positioned flexible display substrate 30 away from the support plate 200, i.e., on the surface of the encapsulation layer 340 away from the support plate 200. The process of forming the uv-light adhesive 410 may be coating or printing, etc.
S212, the protective layer 400 is attached to the surface of the preset flexible display substrate 30 on which the ultraviolet light-reduced adhesive 410 is formed.
Further, when the protective layer 400 is attached by the uv-light-reduced adhesive 410 as described in the step S210, after the step S300 and before the step S400, the method may further include:
s600, irradiating the covered area of the ultraviolet light-reduced adhesive 410310 with ultraviolet light.
The ultraviolet light adhesive reducing layer 410 is used to irradiate the coverage area of the ultraviolet light adhesive reducing layer 410, so as to reduce the viscosity of the ultraviolet light adhesive reducing layer 410, thereby facilitating the peeling of the protection layer 400 from the pre-set flexible display substrate 30. Generally, the uv-light adhesive reducing layer 410 may be irradiated with uv light on the side of the pre-set flexible display substrate 30, as shown in fig. 12.
Since the viscosity of the ultraviolet light adhesive reducing layer 410 is reduced after the ultraviolet light adhesive reducing layer 410 is irradiated by the ultraviolet light, the step S600 should be located after the step S400, so as to avoid the protection layer 400 from being accidentally peeled off due to the reduced viscosity of the ultraviolet light adhesive reducing layer 410 when the supporting plate 200 is peeled off from the preset flexible display substrate 30. The step S600 should be performed before the step S500, so as to facilitate the peeling of the protection layer 400 from the pre-set flexible display substrate 30 and avoid the tearing of the encapsulation layer 340 during the peeling.
The following description focuses on the steps S300 and S400 to explain the method for manufacturing the flexible display substrate 30 of the present application.
In one embodiment, step S300 includes:
s310, a peeling apparatus 10 having a sealed cavity 104 is provided, the peeling apparatus 10 having a first wall 112 and a second wall 122 opposite to each other.
When the first substrate 20 is peeled off from the support plate 200, the support plate 200 can be peeled off by the peeling apparatus 10. Specifically, the peeling apparatus 10 may have a sealed cavity 104, and the sealed cavity 104 is used for accommodating the first substrate 20. The peeling apparatus 10 has a first wall surface 112 and a second wall surface 122, and the first wall surface 112 and the second wall surface 122 are opposed. The first wall surface 112 and the second wall surface 122 are both referred to as inner wall surfaces of the peeling apparatus 10. Alternatively, the sealed cavity 104 of the peeling apparatus 10 may be said to have opposing first and second walls 112, 122. The peeling apparatus 10 also has gas inlets 102 for introducing gas, and the number of the gas inlets 102 is not limited. The air inlet 102 may be located on a sidewall of the stripping apparatus 10. The sidewall herein refers to the other wall of the peeling apparatus 10 except the wall where the first wall 112 and the second wall 122 are located.
In general, the peeling apparatus 10 may be placed in a nitrogen atmosphere so that the peeling of the support plate 200 is performed in the nitrogen atmosphere.
S320, the first substrate 20 is disposed in the sealed cavity 104, the supporting plate 200 is connected to the first wall 112, and the protection layer 400 is connected to the second wall 122.
The first substrate 20 formed of the support plate 200, the pre-set flexible display substrate 30 and the protective layer 400 is placed in the sealed cavity 104. At this time, the relationship between the first substrate 20 and the peeling apparatus 10 may be: the supporting plate 200 is connected to the first wall 112, and the protection layer 400 is connected to the second wall 122. The connection between the first wall 112 and the support plate 200 may be a fixed connection, such as by a bolt or screw; or can be movably connected, such as through a buckle connection; but may also be an adsorption linkage. The connection between the second wall 122 and the protection layer 400 may be at least one of a fixed connection, a movable connection, or an absorption connection.
S410, gas is introduced into the sealed cavity 104 to deform the first wall surface 112 so as to peel off the support plate 200.
The gas, which may be nitrogen or the like, is continuously introduced into the sealed cavity 104. After the gas is introduced, the pressure of the gas in the sealed cavity 104 of the peeling apparatus 10 increases. The first wall 112 is deformed away from the second wall 122 by the gas pressure. At this time, since the support plate 200 is connected to the first wall surface 112 and the protection layer 400 is connected to the second wall surface 122, a separation force is generated inside the first substrate 20 by the pulling force of the first wall surface 112 and the second wall surface 122, thereby peeling off the support plate 200.
In the process, since the supporting plate 200 is connected to the first wall surface 112, when the first wall surface 112 is deformed away from the second wall surface 122, the edge of the supporting plate 200 is firstly pulled by the first wall surface 112, and the center of the supporting plate 200 is secondly pulled by the second wall surface 122. Therefore, for the coverage of the pre-positioned flexible display substrate 30 on the support plate 200, the closed edge 302 is pulled to peel the support plate 200 from the pre-positioned flexible display substrate 30, so as to peel the support plate 200 from the closed edge 302.
Further, to better achieve the gradual peeling of the support plate 200 from the closed edge 302 toward the center, the first substrate 20 may be placed at the center of the sealed cavity 104, so that the edge of the support plate 200 is uniformly stressed when the gas is introduced into the sealed cavity 104.
Meanwhile, in order to better realize the gradual peeling of the support plate 200 from the closed edge 302, an even number of air inlets 102 may be provided in the peeling apparatus 10, and the positions of the air inlets 102 correspond to each other, so that the edge of the support plate 200 is uniformly stressed when the air is introduced into the sealed cavity 104.
In this embodiment, the support plate 200 is peeled off from the closed edge 302 by introducing gas into the sealed cavity 104, so that the process of peeling off the support plate 200 is slow and gentle, and the flexible substrate 310 is prevented from being damaged during peeling off the support plate 200.
Further, in the method for manufacturing the flexible display substrate 30 of the present application, a bonding force between the protection layer 400 and the pre-set flexible display substrate 30 is greater than a bonding force between the support plate 200 and the pre-set flexible display substrate 30.
Specifically, when the supporting plate 200 is peeled off using the peeling apparatus 10, the first wall surface 112 is connected to the supporting plate 200, the second wall surface 122 is connected to the protective layer 400, and the first wall surface 112 and the second wall surface 122 are away from each other. At this time, if the bonding force of the protective layer 400 to the pre-flexible display substrate 30 is small, the protective layer 400 may be peeled off before the supporting plate 200 is peeled off with respect to the first substrate 20. Accordingly, the bonding force of the protective layer 400 to the pre-flexible display substrate 30 may be made greater than the bonding force of the support plate 200 to the pre-flexible display substrate 30, thereby ensuring that the peeling performed in the sealed cavity 104 of the peeling apparatus 10 is the peeling of the support plate 200.
Generally, in order to make the bonding force between the protection layer 400 and the pre-set flexible display substrate 30 greater than the bonding force between the support plate 200 and the pre-set flexible display substrate 30, a glue with higher viscosity may be used to adhere the protection layer 400 and the pre-set flexible display substrate 30, such as the ultraviolet light-reduced glue 410 without being irradiated by ultraviolet light.
Further, in the method for manufacturing the flexible display substrate 30 of the present application, the internal bonding force of the flexible display substrate 300 should be greater than the bonding force of the supporting plate 200 and the flexible display substrate 30.
Specifically, pre-flexible display substrate 300 generally includes a flexible substrate 310, a thin-film-transistor layer 320, a light-emitting layer 330, and an encapsulation layer 340, which are stacked. Accordingly, the internal bonding force of the pre-set flexible display substrate 300 includes the bonding force of the flexible substrate 310 and the thin-film transistor layer 320, the bonding force of the thin-film transistor layer 320 and the light-emitting layer 330, and the bonding force of the light-emitting layer 330 and the encapsulation layer 340. When the supporting plate 200 is peeled off using the peeling apparatus 10, the first wall surface 112 is connected to the supporting plate 200, the second wall surface 122 is connected to the protective layer 400, and the first wall surface 112 and the second wall surface 122 are away from each other. For the pre-arranged flexible display substrate 300, if the internal bonding force of the pre-arranged flexible display substrate 300 is small, the film layers of the flexible substrate 310, the thin-film transistor layer 320, the light-emitting layer 330 and the encapsulation layer 340 are easily separated from each other. Therefore, the internal bonding force of the preset flexible display substrate 300 is greater than the bonding force of the support plate 200 and the flexible display substrate 30, so that the phenomenon of fault separation of the preset flexible display substrate 300 during the peeling of the support plate 200 is avoided.
In one embodiment, the stripping apparatus 10 includes a first suction screen 110 and a second suction screen 120 disposed opposite to each other. The first suction screen 110 and the second suction screen 120 are encapsulated by an encapsulation structure 130 to form a sealed cavity 104.
Specifically, as shown in fig. 13, the peeling apparatus 10 can be prepared by:
s311, providing the first substrate 20 and the first adsorption screen 110, and making the first adsorption screen 110 adsorb on the surface of the support plate 200 away from the preset flexible display substrate 30.
The first suction screen 110 is used to constitute the stripping apparatus 10. The first suction screen 110 is connected to the supporting plate 200 and is located at a side of the supporting plate 200 away from the preset flexible display substrate 30. At this time, the surface of the first suction screen 110 close to the support plate 200 is the first wall surface 112. The first suction screen 110 and the support plate 200 may be connected by suction, which may be vacuum suction.
S312, providing the second adsorbing screen 120, so that the second adsorbing screen 120 is adsorbed on the surface of the protection layer 400 away from the preset flexible display substrate 30.
The second suction screen 120 is used to constitute the peeling apparatus 10. The second adsorption screen 120 is connected to the protection layer 400 and is located on a side of the protection layer 400 away from the preset flexible display substrate 30. At this time, the surface of the second suction screen 120 close to the protection layer 400 is the second wall surface 122. The second suction screen 120 and the protection layer 400 may be connected by suction, where the suction may be vacuum suction.
S313, the first and second screens are encapsulated by the encapsulation structure 130 to form the sealed cavity 104.
The encapsulation structure 130 is used to constitute the peeling apparatus 10. After the first adsorption screen 110 is adsorbed on the support plate 200 and the second adsorption screen 120 is adsorbed on the protection layer 400, the edges of the first adsorption screen 110 and the second adsorption screen 120 are encapsulated, so as to obtain the stripping device 10 with the sealed cavity 104. Here, the package structure 130 may be a soft plastic such as rubber, or may be a metal material. When the first and second screens are packaged by using the package structure 130, the gas inlet 102 for introducing gas should be left on the package structure 130.
More specifically, the stripping apparatus 10 includes a first suction screen 110, a second suction screen 120, and a packaging structure 130 for surrounding and packaging the first suction screen 110 and the second suction screen 120. After the first adsorption screen 110 and the second adsorption screen 120 are encapsulated by the encapsulation structure 130, a sealed cavity 104 is formed in the first adsorption screen 110, the second adsorption screen 120 and the encapsulation structure 130. At this time, the surface of the first suction screen 110 close to the support plate 200 is the first wall surface 112; the surface of the second suction screen 120 close to the protection layer 400 is the second wall 122.
After the peeling apparatus 10 is formed according to the above steps S311 to S313, the first substrate 20 is placed in the sealed cavity 104 of the peeling apparatus 10, the supporting plate 200 is connected to the first wall surface 112, and the protective layer 400 is connected to the second wall surface 122. At this time, the step S330 is performed directly to peel off the supporting plate 200.
In one embodiment, as shown in fig. 14, the first wall surface 112 has a first adsorption mesh 114 to adsorb the support plate 200, and the second wall surface 122 has a second adsorption mesh 124 to adsorb the protection layer 400.
Specifically, the first wall surface 112 has a first adsorption mesh 114 for vacuum adsorption, thereby being connected to the support plate 200. The second wall 122 also has a second adsorption mesh 124 for vacuum adsorption, thereby adsorbing the protective layer 400. The separation and connection of the support plate 200 from the first wall surface 112 can be facilitated by vacuum-sucking the support plate 200 using the first sucking mesh 114. Similarly, the second adsorption mesh 124 is used to adsorb the protection layer 400, thereby facilitating the separation and connection of the protection layer 400 from the second wall 122.
Further, as shown in fig. 5 to 7, the density of the first adsorption mesh 114 is decreased along the edge to the center region within the coverage of the support plate 200. Within the coverage of the protective layer 400, the second adsorption mesh openings 124 are equally spaced. In particular, it is not described in detail herein,
in one embodiment, the present application further provides a flexible display substrate 30, and the flexible display substrate 30 is formed by the method for manufacturing the flexible display substrate 30 in any one of the above embodiments.
The flexible display substrate 30 includes a flexible substrate 310, a thin-film transistor layer 320, a light-emitting layer 330, and an encapsulation layer 340.
In particular, flexible substrate 310 may be a polyimide film in general, and is used to carry thin-film-transistor layer 320, light-emitting layer 330, and encapsulation layer 340.
Thin-film-transistor layer 320 is a driver circuit layer. Thin-film-transistor layer 320 is typically comprised of thin-film transistors and capacitors. A plurality of thin film transistors and capacitors may constitute a driving circuit for outputting an electrical signal according to an input signal to drive a light emitting sub-pixel to emit light.
The light-emitting layer 330 generally includes a plurality of light-emitting sub-pixels distributed in an array.
The encapsulation layer 340 is used to encapsulate the light emitting layer 330, thereby reducing the contact between the light emitting layer 330 and the water and oxygen in the air and preventing the light emitting layer 330 from being damaged by the water and oxygen.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A peeling apparatus for peeling a support plate (200) during the preparation of a flexible display substrate (30), comprising:
a first adsorption screen (110) for connecting the support plate (200);
a second adsorption screen plate (120) arranged opposite to the first adsorption screen plate (110);
the sealing structure (130) is arranged between the first adsorption screen plate (110) and the second adsorption screen plate (120) so that the first adsorption screen plate (110), the second adsorption screen plate (120) and the sealing structure (130) are enclosed to form a sealing cavity (104), and the sealing structure (130) is further provided with an air inlet (102) for introducing air into the sealing cavity (104).
2. The stripping apparatus as claimed in claim 1, characterized in that the first suction screen (110) has a first suction mesh (114) adjacent to the first wall (112) of the second suction screen (120);
the second suction screen (120) has a second suction mesh (124) on a second wall surface (122) adjacent to the first suction screen (110).
3. The peeling apparatus as claimed in claim 2, wherein a density of the first adsorption mesh openings (114) decreases along an edge to center area of the first adsorption mesh plate (110).
4. The stripping apparatus as claimed in claim 3, characterized in that the second suction screens (124) of the second suction screen (120) are equally spaced.
5. The peeling apparatus of a flexible display substrate according to claim 4, wherein a distribution density of the second adsorption mesh (124) is not less than a maximum distribution density of the first adsorption mesh (114).
6. The peeling apparatus of a flexible display substrate according to claim 2, wherein a diameter of the first adsorption mesh (114) is reduced along an edge to a center area of the first adsorption mesh (110).
7. A method for preparing a flexible display substrate is characterized by comprising the following steps:
forming a pre-set flexible display substrate (300) on a support plate (200);
attaching a protective layer (400) on the pre-arranged flexible display substrate (300), wherein the pre-arranged flexible display substrate (300) is arranged between the protective layer (400) and the support plate (200) to form a first substrate (20);
-providing a peeling apparatus (10) according to any one of claims 1 to 6, placing the first substrate in the sealed cavity (104) with the support plate (200) attached to the first wall (112) and the protective layer (400) attached to the second wall (122);
introducing gas into the sealed cavity (104) to expand the first adsorption screen plate (110) and the second adsorption screen plate (120) in opposite directions so as to start to peel off the support plate (200) from the periphery of the contact surface of the support plate (200) and the preset flexible display substrate (300) to the center at the same time;
and stripping the protective layer (400) to form the flexible display substrate (30).
8. The method of claim 7, wherein the bonding force between the protective layer (400) and the pre-arranged flexible display substrate (300) is greater than the bonding force between the support plate (200) and the pre-arranged flexible display substrate (300).
9. The method of claim 7 or 8, wherein an internal bonding force of the pre-positioned flexible display substrate (300) is greater than a bonding force of the support plate (200) and the pre-positioned flexible display substrate (300).
10. A flexible display substrate, characterized by being prepared by the method of preparing a flexible display substrate (30) according to any one of claims 7 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910874058.1A CN110767592A (en) | 2019-09-17 | 2019-09-17 | Flexible display substrate, preparation method thereof and stripping device |
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| CN201910874058.1A CN110767592A (en) | 2019-09-17 | 2019-09-17 | Flexible display substrate, preparation method thereof and stripping device |
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| CN110767592A true CN110767592A (en) | 2020-02-07 |
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Application publication date: 20200207 |