CN114199782A - A circularly polarized photocurrent regulation method for Sb2Te3 topological surface states - Google Patents

A circularly polarized photocurrent regulation method for Sb2Te3 topological surface states Download PDF

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CN114199782A
CN114199782A CN202111553539.6A CN202111553539A CN114199782A CN 114199782 A CN114199782 A CN 114199782A CN 202111553539 A CN202111553539 A CN 202111553539A CN 114199782 A CN114199782 A CN 114199782A
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俞金玲
武文逸
程树英
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Abstract

The invention relates to Sb2Te3The circularly polarized light current regulation and control method of the topological surface state comprises the following steps: step S1: growth of Sb on InP substrate by molecular beam epitaxy equipment2Te3And preparing a pair of dot electrodes on the surface of the sample, and step S2: constructing a stress device, and fixing the sample on the stress device by using epoxy resin; step S3: irradiating the geometric center of the sample, namely the center of the connecting line of the two electrodes, by using the emitted light of the laser, measuring and extracting circularly polarized light current; step S4: changing the stress application size through a stress device, and analyzing the change trend of the circularly polarized light current along with the stress; step S5: measurement of Sb2Te3XPS spectrum of sample, analysis, calculation of substrate and Sb2Te3The energy band distribution of the interface, if the band order is less than zero, the possibility of spin injection exists; comparison of Sb without substrate spin injection2Te3The CPGE current of the sample is regulated and controlled by stress, and the Sb is regulated and controlled by the synergistic effect of stress and substrate injection2Te3The regulation and control effect of the medium circular polarized photocurrent method. The invention regulates and controls Sb2Te3The circularly polarized light current effect of the topological surface state is obvious, and continuous regulation and control can be realized.

Description

一种Sb2Te3拓扑表面态的圆偏振光电流调控方法A circularly polarized photocurrent regulation method for Sb2Te3 topological surface states

技术领域technical field

本发明涉及自旋电子学领域,具体涉及一种Sb2Te3拓扑表面态的圆偏振光电流调控方法。The invention relates to the field of spintronics, in particular to a circularly polarized photocurrent regulation method of Sb 2 Te 3 topological surface state.

背景技术Background technique

自旋电子器件具有能耗低、处理速度快、高集成度高等优点,是当前的研究热点之一。由于三维拓扑绝缘体(Topological insulators,TIs)具有受时间反演对称性保护和自旋动量锁定的拓扑表面态,是实现自旋电子学和量子计算研究的理想的平台。圆偏振光电流效应(Circular photogalvanic effect,CPGE)是研究拓扑表面态中电子自旋特性的有力工具,因为它可以排除TIs中属于D3d对称性的体态的贡献,且在室温下就可观测到自旋光电流。对TIs中的CPGE的调控对设计自旋光电器件具有重要意义。Spintronic devices have the advantages of low energy consumption, fast processing speed, and high integration, and are one of the current research hotspots. Because 3D topological insulators (TIs) possess topological surface states protected by time-reversal symmetry and locked by spin-momentum, they are ideal platforms for realizing spintronics and quantum computing research. The circularly polarized photogalvanic effect (CPGE) is a powerful tool to study the spin properties of electrons in topological surface states because it can exclude the contribution of bulk states belonging to D 3d symmetry in TIs and can be observed at room temperature Spin photocurrent. The regulation of CPGE in TIs is of great significance for designing spin optoelectronic devices.

发明内容SUMMARY OF THE INVENTION

有鉴于此,本发明的目的在于提供一种Sb2Te3拓扑表面态的圆偏振光电流调控方法,,能够简便且有效的实现调控TIs中的CPGE。In view of this, the purpose of the present invention is to provide a circularly polarized photocurrent regulation method of Sb 2 Te 3 topological surface state, which can easily and effectively realize regulation of CPGE in TIs.

为实现上述目的,本发明采用如下技术方案:To achieve the above object, the present invention adopts the following technical solutions:

一种Sb2Te3拓扑表面态的圆偏振光电流调控方法,包括以下步骤:A method for regulating circularly polarized photocurrent of Sb 2 Te 3 topological surface state, comprising the following steps:

步骤S1:用分子束外延设备在磷化铟衬底上生长Sb2Te3样品,并在样品表面通过机械压铟方法制作一对点状电极;Step S1: growing a Sb 2 Te 3 sample on an indium phosphide substrate with molecular beam epitaxy equipment, and fabricating a pair of point electrodes on the surface of the sample by mechanically pressing indium;

步骤S2:构建应力装置,将环氧树脂将样品固定在应力装置上;Step S2: constructing a stress device, and fixing the sample on the stress device with epoxy resin;

步骤S3:通过激光器发出激光依次通过斩波器、起偏器以及四分之一波片,照射在样品的几何中心,即两电极连线的中心,测得并提取圆偏振光电流;Step S3: emit laser light through the chopper, polarizer and quarter-wave plate in sequence, and irradiate the geometric center of the sample, that is, the center of the line connecting the two electrodes, to measure and extract the circularly polarized photocurrent;

步骤S4:通过应力装置改变应力施加大小,并分析圆偏振光电流随应力的变化趋势;Step S4: changing the magnitude of the stress applied by the stress device, and analyzing the variation trend of the circularly polarized photocurrent with the stress;

步骤S5:测量Sb2Te3样品XPS光谱并分析,计算衬底与Sb2Te3界面的能带分布,若带阶小于零,则存在自旋注入的可能;比较没有衬底自旋注入的Sb2Te3样品的CPGE电流受应力调控情况,验证应力和衬底注入协同作用调控Sb2Te3中圆偏振光电流方法的调控效果。Step S5: measure and analyze the XPS spectrum of the Sb 2 Te 3 sample, calculate the energy band distribution of the interface between the substrate and Sb 2 Te 3 , if the band order is less than zero, there is the possibility of spin injection; The CPGE current of the Sb 2 Te 3 sample is regulated by stress, which verifies the regulation effect of the method of controlling the circularly polarized photocurrent in Sb 2 Te 3 by the synergistic effect of stress and substrate injection.

进一步的,所述应力装置包括矩形聚碳酸酯塑料条、钢制应力台、应力顶针和微分套筒;使用环氧树脂将样品固定在矩形聚碳酸酯塑料条中心,安装在钢制应力台上,通过旋转微分套筒通过应力顶针对样品施加单轴应力,测量聚碳酸酯塑料条从钢制应力台左边缘到右边缘的距离,记为2a,测量聚碳酸酯塑料条的厚度,记为h。Further, the stress device includes a rectangular polycarbonate plastic strip, a steel stress table, a stress thimble and a differential sleeve; the sample is fixed in the center of the rectangular polycarbonate plastic strip using epoxy resin, and is mounted on the steel stress table , apply uniaxial stress to the sample through the stress top by rotating the differential sleeve, measure the distance of the polycarbonate plastic strip from the left edge to the right edge of the steel stress table, denoted as 2a, measure the thickness of the polycarbonate plastic strip, denoted as h.

进一步的,所述步骤S4,具体为:Further, the step S4 is specifically:

步骤S41:旋转应力装置的微分套筒,将样品顶弯,从而给样品施加应力。从微分套筒上读出应力顶针向前移动的距离,记为Jz,通过公式ex=3hJz/2a2来计算出施加的应力的大小;Step S41: Rotate the differential sleeve of the stress device to bend the sample to apply stress to the sample. Read the distance that the stress thimble moves forward from the differential sleeve, denoted as J z , and calculate the magnitude of the applied stress by the formula ex = 3hJ z / 2a 2 ;

步骤S42:通过步进电机转动四分之一波片,通过电极采集光电流,采集的光电流依次输入前置放大器和锁相放大器,锁相放大器输出的信号通过数据采集卡输入计算机;四分之一波片转动的角度为从0度转到360度,步长为5度,即每隔5度采集一个光电流的数据J;Step S42: rotate the quarter-wave plate by the stepping motor, collect the photocurrent through the electrodes, the collected photocurrent is sequentially input to the preamplifier and the lock-in amplifier, and the signal output by the lock-in amplifier is input to the computer through the data acquisition card; The rotation angle of one wave plate is from 0 degrees to 360 degrees, and the step size is 5 degrees, that is, a photocurrent data J is collected every 5 degrees;

步骤S43:将测得的不同四分之一波片转角下的光电流J用如下公式进行拟合:Step S43: Fit the measured photocurrent J under different quarter-wave plate rotation angles with the following formula:

Figure BDA0003418455460000031
Figure BDA0003418455460000031

其中,JC是圆偏振光电流,L1和L2是线偏振光引起的光电流,J0是由光伏效应、热电效应、丹培效应引起的光电流,简称为背景电流;通过拟合,得到圆偏振光电流JCAmong them, J C is the circularly polarized photocurrent, L1 and L2 are the photocurrents caused by linearly polarized light, and J0 is the photocurrent caused by the photovoltaic effect, the thermoelectric effect, and the Danpe effect, referred to as the background current for short; , obtain the circularly polarized photocurrent J C ;

步骤S44:重复步骤S41至S43,测得Sb2Te3薄膜在不同应力下的圆偏振光电流JCStep S44: Repeat steps S41 to S43, and measure the circularly polarized photocurrent J C of the Sb 2 Te 3 film under different stresses.

进一步的,所述步骤S5具体为:Further, the step S5 is specifically:

步骤S51:通过X射线光电子能谱测量InP/Sb2Te3界面处能带带阶,测得的导带阶ΔEc小于零,表明电子可以从InP注入到Sb2Te3层中;Step S51: measuring the energy band order at the InP/Sb 2 Te 3 interface by X-ray photoelectron spectroscopy, and the measured conduction band order ΔE c is less than zero, indicating that electrons can be injected from InP into the Sb 2 Te 3 layer;

步骤S52:将InP衬底用环氧树脂将样品固定在矩形聚碳酸酯塑料条中心,安装在自制的钢制应力台上,通过旋转微分套筒对样品施加单轴应力;重复步骤S3至S4,测得InP衬底在不同应力下的圆偏振光电流Jc0;测得的InP衬底的圆偏振光电流随应力的变化趋势与Sb2Te3薄膜的随应力的变化趋势相同,表明Sb2Te3薄膜的圆偏振光电流受到InP衬底自旋注入的影响。Step S52: Fix the InP substrate with epoxy resin to fix the sample in the center of the rectangular polycarbonate plastic strip, install it on the self-made steel stress stage, and apply uniaxial stress to the sample by rotating the differential sleeve; Repeat steps S3 to S4 , the circularly polarized photocurrent J c0 of the InP substrate under different stresses was measured; the variation trend of the measured circularly polarized photocurrent with the stress of the InP substrate was the same as that of the Sb 2 Te 3 film, indicating that the Sb The circularly polarized photocurrent of the 2Te3 film is influenced by the spin injection into the InP substrate.

进一步的,所述Sb2Te3样品为矩形的单晶结构,样品短边≥3mm,长边≥5mm,厚度为7-30nm;所述点状电极为一对点状铟电极,通过细针压于矩形两长边内侧的中线上,直径约为0.25mm的近似圆形,电极间距约为2mm。Further, the Sb 2 Te 3 sample has a rectangular single crystal structure, the short side of the sample is ≥3mm, the long side is ≥5mm, and the thickness is 7-30nm; Pressed on the midline of the inside of the two long sides of the rectangle, the diameter is about 0.25mm, and the electrode spacing is about 2mm.

进一步的,所述激光器的功率在30-200mW之间,激光的入射面与两电极的连线垂直;激光束与样品表面法线夹角为10度到45度之间。Further, the power of the laser is between 30-200 mW, the incident surface of the laser is perpendicular to the line connecting the two electrodes; the angle between the laser beam and the normal line of the sample surface is between 10 degrees and 45 degrees.

本发明与现有技术相比具有以下有益效果:Compared with the prior art, the present invention has the following beneficial effects:

1、本发明通过应变与衬底注入协同作用调控Sb2Te3中CPGE电流的方法十分简单易行,成本低廉,不涉及材料生长过程中的能带工程与器件制备中外加栅极的制备,有利于日后推广应用;1. The method of controlling the CPGE current in Sb 2 Te 3 through the synergistic effect of strain and substrate injection in the present invention is very simple and easy to implement, with low cost, and does not involve the energy band engineering in the material growth process and the preparation of the external gate in the device preparation, It is beneficial to promote the application in the future;

2、本发明调控效果明显,调控范围较大,并且容易实现连续调控。2. The control effect of the present invention is obvious, the control range is large, and it is easy to realize continuous control.

附图说明Description of drawings

图1是本发明一实施例中自制应力装置的结构示意图。FIG. 1 is a schematic structural diagram of a self-stressing device in an embodiment of the present invention.

图2为本发明的实施例中测量CPGE的测试系统和光路分布示意图。FIG. 2 is a schematic diagram of a test system and optical path distribution for measuring CPGE in an embodiment of the present invention.

图3为本发明的实施例中测得的InP衬底上生长的30nm Sb2Te3样品的CPGE电流随应力变化的曲线图。其中黑色矩形为实验数据,实线为线性拟合结果。3 is a graph of CPGE current as a function of stress measured for a 30 nm Sb 2 Te 3 sample grown on an InP substrate in an embodiment of the present invention. The black rectangle is the experimental data, and the solid line is the linear fitting result.

图4为本发明的实施例中测得的(a)钛酸锶(STO)衬底上生长的12nm Sb2Te3样品和(b)InP衬底上生长的30nm Sb2Te3样品的电阻随应力变化的曲线图。其中黑色矩形为实验数据,实线为线性拟合结果。FIG. 4 is the measured resistance of (a) a 12 nm Sb 2 Te 3 sample grown on a strontium titanate (STO) substrate and (b) a 30 nm Sb 2 Te 3 sample grown on an InP substrate, measured in embodiments of the present invention Graph of stress as a function of stress. The black rectangle is the experimental data, and the solid line is the linear fitting result.

图5为本发明的实施例中测得的XPS谱图,分别为InP衬底In元素特征峰核心能级In3d与价带顶(VBM);7nm Sb2Te3/InP样品Te元素特征峰核心能级Te3d与In元素特征峰核心能级In3d;30nm Sb2Te3/InP样品Te元素特征峰核心能级Te3d与价带顶(VBM);7nm Sb2Te3/InP样品Te元素特征峰核心能级Te3d与In元素特征峰核心能级In3d。Fig. 5 is the XPS spectrum measured in the embodiment of the present invention, it is InP substrate In element characteristic peak core energy level In3d and valence band top (VBM) respectively; 7nm Sb 2 Te 3 /InP sample Te element characteristic peak core Energy level Te3d and In element characteristic peak core energy level In3d; 30nm Sb 2 Te 3 /InP sample Te element characteristic peak core energy level Te3d and valence band top (VBM); 7nm Sb 2 Te 3 /InP sample Te element characteristic peak core Energy level Te3d and In element characteristic peak core energy level In3d.

图6为本发明的实施例中测得的InP/Sb2Te3界面能带分布。FIG. 6 is the energy band distribution of the InP/Sb 2 Te 3 interface measured in the embodiment of the present invention.

图7为本发明的实施例中测量InP衬底中CPGE电流随应力变化的曲线。其中黑色矩形为实验数据,实线为线性拟合结果。FIG. 7 is a curve of measuring CPGE current in InP substrate as a function of stress in an embodiment of the present invention. The black rectangle is the experimental data, and the solid line is the linear fitting result.

图8为本发明的实施例中的InP/Sb2Te3界面自旋注入模型的示意图。FIG. 8 is a schematic diagram of an InP/Sb 2 Te 3 interface spin injection model in an embodiment of the present invention.

图9为本发明的实施例中测量的18nm Sb2Te3/STO样本中偏振光正入射和背入射条件下的CPGE电流随入射角变化曲线。其中黑色矩形为实验数据,实线为线性拟合结果。插图为背入射光路设置示意图。FIG. 9 is the variation curve of the CPGE current with the incident angle in the 18 nm Sb 2 Te 3 /STO sample under normal incidence and back incidence conditions of polarized light measured in the embodiment of the present invention. The black rectangle is the experimental data, and the solid line is the linear fitting result. The inset is a schematic diagram of the back-incidence light path setup.

图10为本发明的实施例中对比样品钛酸锶衬底上生长的Sb2Te3样品的CPGE电流随应力变化的曲线。其中黑色矩形为实验数据,实线为线性拟合结果。FIG. 10 is a curve of CPGE current as a function of stress of the Sb 2 Te 3 sample grown on the strontium titanate substrate of the comparative sample in the embodiment of the present invention. The black rectangle is the experimental data, and the solid line is the linear fitting result.

具体实施方式Detailed ways

下面结合附图及实施例对本发明做进一步说明。The present invention will be further described below with reference to the accompanying drawings and embodiments.

请参照图1,本发明提供一种Sb2Te3拓扑表面态的圆偏振光电流调控方法,包括以下步骤:Please refer to FIG. 1 , the present invention provides a circularly polarized photocurrent regulation method of Sb 2 Te 3 topological surface state, comprising the following steps:

步骤S1:用分子束外延设备在磷化铟(InP)衬底上生长Sb2Te3样品,在样品表面通过机械压铟方法制作一对点状电极。Step S1 : growing a Sb 2 Te 3 sample on an indium phosphide (InP) substrate with molecular beam epitaxy equipment, and fabricating a pair of point electrodes on the surface of the sample by a mechanical indium pressing method.

在本发明较佳实施例中,所述Sb2Te3样品为矩形的单晶结构,样品短边≥3mm,长边≥5mm,厚度为7-30nm(包含7nm和30nm)。所述一对点状铟电极通过细针压于矩形两长边内侧的中线上,为直径0.25mm的近似圆形,两电极内侧的间距≥2nm。再用铟将铂丝压在铟电极上,此铂丝为电极引线。In a preferred embodiment of the present invention, the Sb 2 Te 3 sample has a rectangular single crystal structure, the short side of the sample is ≥ 3 mm, the long side is ≥ 5 mm, and the thickness is 7-30 nm (including 7 nm and 30 nm). The pair of point-shaped indium electrodes are pressed on the midline of the inner sides of the two long sides of the rectangle by thin needles, and are approximately circular with a diameter of 0.25 mm, and the distance between the inner sides of the two electrodes is greater than or equal to 2 nm. Then, the platinum wire is pressed on the indium electrode with indium, and the platinum wire is the electrode lead.

步骤S2:使用环氧树脂将样品固定在矩形聚碳酸酯塑料条中心,安装在自制的钢制应力台上,通过旋转微分套筒对样品施加单轴应力,应力装置如图1所示。测量聚碳酸酯塑料条从钢制应力台左边缘到右边缘的距离,记为2a,如图1所示。测量聚碳酸酯塑料条的厚度,记为h。Step S2: Use epoxy resin to fix the sample in the center of the rectangular polycarbonate plastic strip, install it on a self-made steel stress stage, and apply uniaxial stress to the sample by rotating the differential sleeve. The stress device is shown in Figure 1. Measure the distance of the polycarbonate plastic strip from the left edge to the right edge of the steel stress table, denoted as 2a, as shown in Figure 1. Measure the thickness of the polycarbonate plastic strip and denote it as h.

所用聚碳酸酯塑料条长度为38mm,宽度为5mm,厚度为2mm。应力台施加应力的有效宽度2a=20mm.本实施例中,环氧树脂固化过程为在真空环境下60℃退火2小时。The polycarbonate plastic strip used is 38mm in length, 5mm in width and 2mm in thickness. The effective width 2a of the stress table applied to the stress is 20 mm. In this embodiment, the curing process of the epoxy resin is annealing at 60° C. for 2 hours in a vacuum environment.

步骤S3:通过激光器发出激光依次通过斩波器、起偏器以及四分之一波片,照射在样品的几何中心,即两电极连线的中心。Step S3: the laser is emitted by the laser to pass through the chopper, the polarizer and the quarter-wave plate in sequence, and is irradiated on the geometric center of the sample, that is, the center of the connection line between the two electrodes.

优选的,在本实施例中,所采用的激光器的功率在30-200mW之间,所采用的激光能够激发InP衬底带边激发或者能够激发InP内部缺陷产生圆偏振光电流,打在样品上的光斑的直径小于两个点状铟电极的间距。激光的入射面与两电极的连线垂直;激光束与样品表面法线夹角为10度到45度之间。Preferably, in this embodiment, the power of the used laser is between 30-200 mW, and the used laser can excite the band-edge excitation of the InP substrate or can excite the internal defects of the InP to generate a circularly polarized photocurrent, which is then hit on the sample. The diameter of the spot is smaller than the distance between the two point-like indium electrodes. The incident surface of the laser is perpendicular to the line connecting the two electrodes; the angle between the laser beam and the normal to the surface of the sample is between 10 degrees and 45 degrees.

优选的,在本实施例中,采用的激光器的功率是100mW,激光器的光斑直径为1mm,激光器的波长为1064nm。激光束与样品表面法线夹角为30度。Preferably, in this embodiment, the power of the used laser is 100 mW, the spot diameter of the laser is 1 mm, and the wavelength of the laser is 1064 nm. The angle between the laser beam and the normal to the sample surface is 30 degrees.

步骤S4:旋转应力装置的微分套筒,将样品顶弯,从而给样品施加应力。从微分套筒上读出应力顶针向前移动的距离,记为Jz。通过公式ex=3hJz/2a2来计算出施加的应力的大小。样本受到的纵向压缩应变可由公式:ez=-(C12/C13)ex计算得出,其中C12、C13为Sb2Te3样品的弹性系数。本实施例中,令步长Jz0=0.01mm,计算得出e0=3×10-4,以ex/e0描述应力施加大小。Step S4: Rotate the differential sleeve of the stress device to bend the sample to apply stress to the sample. The distance the stress thimble moved forward was read from the differential sleeve and recorded as J z . The magnitude of the applied stress is calculated by the formula ex = 3hJ z / 2a 2 . The longitudinal compressive strain of the sample can be calculated by the formula: ez = -(C 12 /C 13 ) ex , where C 12 and C 13 are the elastic coefficients of the Sb 2 Te 3 sample. In this embodiment, let the step length J z0 =0.01mm, e 0 =3 × 10 -4 is calculated, and the stress applied magnitude is described by ex /e 0 .

通过步进电机转动四分之一波片,通过电极采集光电流,采集的光电流依次输入前置放大器和锁相放大器,锁相放大器输出的信号通过数据采集卡输入计算机。四分之一波片转动的角度为从0度转到360度,步长为5度,即每隔5度采集一个光电流的数据J。The quarter-wave plate is rotated by the stepping motor, and the photocurrent is collected through the electrodes. The collected photocurrent is input to the preamplifier and the lock-in amplifier in turn, and the output signal of the lock-in amplifier is input to the computer through the data acquisition card. The rotation angle of the quarter-wave plate is from 0 degrees to 360 degrees, and the step size is 5 degrees, that is, a photocurrent data J is collected every 5 degrees.

将测得的不同四分之一波片转角下的光电流J用如下公式进行拟合:Fit the measured photocurrent J at different quarter-wave plate rotation angles with the following formula:

Figure BDA0003418455460000071
Figure BDA0003418455460000071

公式(1)Formula 1)

其中,JC是圆偏振光电流,L1和L2是线偏振光引起的光电流,J0是由光伏效应、热电效应、丹培效应引起的光电流,简称为背景电流;通过拟合,得到圆偏振光电流JCAmong them, J C is the circularly polarized photocurrent, L1 and L2 are the photocurrents caused by linearly polarized light, and J0 is the photocurrent caused by the photovoltaic effect, the thermoelectric effect, and the Danpe effect, referred to as the background current for short; , the circularly polarized photocurrent J C is obtained.

重复步骤S41至S43,测得Sb2Te3薄膜在不同应力下的圆偏振光电流JC。其测量结果如图3所示,其中黑色矩形为实验数据,实线为线性拟合的结果。可见,随施加应变的增大,Sb2Te3薄膜样品中的CPGE电流呈现线性单调下降的趋势。Repeat steps S41 to S43 to measure the circularly polarized photocurrent J C of the Sb 2 Te 3 film under different stresses. The measurement results are shown in Figure 3, where the black rectangle is the experimental data, and the solid line is the result of linear fitting. It can be seen that with the increase of the applied strain, the CPGE current in the Sb 2 Te 3 thin film sample exhibits a linear monotonically decreasing trend.

在本实施例中,测量了不同衬底上Sb2Te3薄膜的电阻随应力的变化,如图4所示。可见,随着应力的增大,Sb2Te3薄膜的电阻也增大,这是因为拓扑表面态中的费米能级随应变增大向带隙中移动,同时导致狄拉克点向带隙中间移动,从而导致电阻的增加。费米能级向带隙中移动,可以减小体态载流子的浓度,从而减小体态载流子对自旋极化光生载流子的散射,提高CPGE电流。但是,电阻随应变的变化非常小,表明费米能级的移动很小,而且,实验观测到CPGE电流随应变的增大而减小,因此费米能级的移动不是引起CPGE变化的原因。In this example, the resistance of Sb 2 Te 3 films on different substrates was measured as a function of stress, as shown in FIG. 4 . It can be seen that with the increase of stress, the resistance of Sb 2 Te 3 film also increases, which is because the Fermi level in the topological surface state moves into the band gap with the increase of strain, and at the same time causes the Dirac point to move towards the middle of the band gap. move, resulting in an increase in resistance. The shift of the Fermi level to the band gap can reduce the concentration of bulk carriers, thereby reducing the scattering of spin-polarized photogenerated carriers by bulk carriers and increasing the CPGE current. However, the change of resistance with strain is very small, indicating that the shift of the Fermi level is small, and the CPGE current is experimentally observed to decrease with increasing strain, so the shift of the Fermi level is not the cause of the CPGE change.

通过文献调研,发现随施加应变的增大,Sb2Te3拓扑表面态的自旋轨道耦合强度下降,而CPGE的大小与自旋轨道耦合强度成正相比,从而导致CPGE电流随之下降。因此,CPGE电流随应力减小是由于Sb2Te3拓扑表面态的自旋轨道耦合随应力减小引起的。Through literature investigation, it is found that with the increase of applied strain, the spin-orbit coupling strength of Sb 2 Te 3 topological surface states decreases, while the size of CPGE is proportional to the spin-orbit coupling strength, resulting in a decrease in CPGE current. Therefore, the decrease of CPGE current with stress is due to the decrease of the spin - orbit coupling of the topological surface states of Sb2Te3 with stress.

步骤S5:通过X射线光电子能谱测量InP/Sb2Te3界面处能带带阶,测得的导带阶ΔEc小于零,表明电子可以从InP注入到Sb2Te3层中Step S5: measure the energy band order at the InP/Sb 2 Te 3 interface by X-ray photoelectron spectroscopy, the measured conduction band order ΔE c is less than zero, indicating that electrons can be injected from InP into the Sb 2 Te 3 layer

在本实施例中,用分子束外延设备分别在InP衬底上生长了7nm Sb2Te3薄膜、30nm的Sb2Te3薄膜,然后,对InP衬底上生长的7nm Sb2Te3薄膜和30nm的Sb2Te3薄膜以及InP衬底进行X射线光电子能谱(XPS)测量,记得到的XPS光谱分别为XPS1、XPS2,XPS3光谱,测量结果如图5所示。记所测XPS1中Te元素特征峰核心能级Te3d与In元素特征峰核心能级In3d分别为

Figure BDA0003418455460000091
记XPS2中Te元素特征峰核心能级Te3d与价带顶分别为
Figure BDA0003418455460000092
记XPS3中In元素特征峰核心能级In3d与价带顶分别为
Figure BDA0003418455460000093
In this embodiment, a 7nm Sb 2 Te 3 film and a 30nm Sb 2 Te 3 film were grown on the InP substrate by molecular beam epitaxy equipment. Then, the 7 nm Sb 2 Te 3 film and The 30nm Sb 2 Te 3 film and the InP substrate were measured by X-ray photoelectron spectroscopy (XPS). The XPS spectra I remember are XPS1, XPS2, and XPS3 spectra, respectively. The measurement results are shown in Figure 5. The core energy level Te3d of the characteristic peak of Te element and the core energy level In3d of the characteristic peak of In element in the measured XPS1 are recorded as
Figure BDA0003418455460000091
The core energy level Te3d and the top of the valence band of the characteristic peak of Te element in XPS2 are written as
Figure BDA0003418455460000092
The core energy level In3d and valence band top of the characteristic peak of In element in XPS3 are written as
Figure BDA0003418455460000093

在本实施例中,所测得的

Figure BDA0003418455460000094
分别为572.65±0.05eV和444.75±0.05eV,所测得的
Figure BDA0003418455460000095
分别为572.65±0.05eV和-0.38±0.1eV,所测得的
Figure BDA0003418455460000096
分别为444.1±0.05eV和0.34±0.1eV。通过如下的公式(2)计算InP衬底与Sb2Te3的价带顶带阶ΔEv,得ΔEv=-1.37±0.1eV。In this example, the measured
Figure BDA0003418455460000094
572.65±0.05eV and 444.75±0.05eV, respectively, the measured
Figure BDA0003418455460000095
572.65±0.05eV and -0.38±0.1eV, respectively, the measured
Figure BDA0003418455460000096
are 444.1 ± 0.05 eV and 0.34 ± 0.1 eV, respectively. The valence top band order ΔE v of the InP substrate and Sb 2 Te 3 is calculated by the following formula (2), and ΔE v =−1.37±0.1 eV is obtained.

Figure BDA0003418455460000097
Figure BDA0003418455460000097

通过公式

Figure BDA0003418455460000098
可以得出InP衬底与Sb2Te3的导带底差值ΔEc。其中,
Figure BDA0003418455460000099
Figure BDA00034184554600000910
分别为InP衬底和Sb2Te3薄膜的带隙,大小分别为1.34eV和0.23eV。计算得出:ΔEc=-2.48±0.1eV。从而得到InP衬底与Sb2Te3异质结的能带分布,如图6所示。可以看出,Sb2Te3/InP异质结构的能带取向属于III型,由于不存在势垒,InP导带中的电子可以转移注入到Sb2Te3薄膜中。因此,Sb2Te3/InP异质结构的能带分布使得自旋极化载流子可以从衬底注入到Sb2Te3薄膜中。by formula
Figure BDA0003418455460000098
The conduction band bottom difference ΔEc between InP substrate and Sb 2 Te 3 can be obtained. in,
Figure BDA0003418455460000099
and
Figure BDA00034184554600000910
are the band gaps of the InP substrate and the Sb 2 Te 3 film, which are 1.34 eV and 0.23 eV, respectively. Calculated: ΔEc=-2.48±0.1eV. Thus, the energy band distribution of the InP substrate and the Sb 2 Te 3 heterojunction is obtained, as shown in FIG. 6 . It can be seen that the energy band orientation of the Sb 2 Te 3 /InP heterostructure belongs to type III, and electrons in the conduction band of InP can be transferred and injected into the Sb 2 Te 3 film due to the absence of potential barriers. Therefore, the energy band distribution of the Sb 2 Te 3 /InP heterostructure enables the injection of spin-polarized carriers from the substrate into the Sb 2 Te 3 thin film.

步骤S6:将InP衬底用环氧树脂将样品固定在矩形聚碳酸酯塑料条中心,安装在自制的钢制应力台上,通过旋转微分套筒对样品施加单轴应力。重复步骤S3至S4,测得InP衬底在不同应力下的圆偏振光电流Jc0,如图7所示。测得的InP衬底的圆偏振光电流随应力的变化趋势与Sb2Te3薄膜的随应力的变化趋势相同,表明Sb2Te3薄膜的圆偏振光电流受到InP衬底自旋注入的影响。Step S6: Fix the InP substrate with epoxy resin to fix the sample in the center of a rectangular polycarbonate plastic strip, mount it on a self-made steel stress stage, and apply uniaxial stress to the sample by rotating the differential sleeve. Steps S3 to S4 are repeated, and the circularly polarized photocurrent J c0 of the InP substrate under different stresses is measured, as shown in FIG. 7 . The variation trend of the measured circularly polarized photocurrent of the InP substrate with stress is the same as that of the Sb2Te3 film, indicating that the circularly polarized photocurrent of the Sb2Te3 film is affected by the spin injection of the InP substrate .

衬底注入自旋极化载流子模型的示意图如图8所示。尽管InP的带隙(1.35eV)大于1064nm光的光子能量,但InP衬底中存在一些缺陷,在带隙中引入一些缺陷能级。因此,在1064nm光的激发下,缺陷能级中的电子将吸收光并跃迁进入导带,产生自旋极化载流子。自旋极化的电子将从衬底注入Sb2Te3薄膜,并与Sb2Te3下表面的自旋极化载流子复合,从而降低下表面态的CPGE电流。由于Sb2Te3的自旋扩散长度较短,自旋注入电子将主要影响样品下表面。由于上表面态和下表面态的自旋轨道耦合系数的符号相反,因此,它们产生的CPGE电流将相反。若我们的样品是上表面态对CPGE电流的贡献占主导,那么下表面态信号的减小将使总的CPGE电流增强。接下来,我们通过激光正面入射和背面入射的CPGE测量,来分析一下我们的样品是否是上表面态对CPGE电流的贡献占主导。A schematic diagram of the substrate injection model of spin-polarized carriers is shown in Figure 8. Although the band gap (1.35 eV) of InP is larger than the photon energy of 1064 nm light, there are some defects in the InP substrate, which introduce some defect energy levels in the band gap. Therefore, under the excitation of 1064 nm light, the electrons in the defect level will absorb the light and transition into the conduction band, generating spin-polarized carriers. The spin - polarized electrons will be injected into the Sb2Te3 film from the substrate and recombine with the spin - polarized carriers on the lower surface of Sb2Te3, thereby reducing the CPGE current in the lower surface state. Due to the short spin diffusion length of Sb 2 Te 3 , the spin-injected electrons will mainly affect the lower surface of the sample. Since the spin-orbit coupling coefficients of the upper and lower surface states have opposite signs, the CPGE currents they generate will be opposite. If our sample is dominated by the contribution of the upper surface states to the CPGE current, then the decrease in the signal of the lower surface state will enhance the overall CPGE current. Next, we analyze whether the contribution of the top surface state to the CPGE current is dominant in our sample by the CPGE measurements at the front and back side of the laser.

对18nm厚度的Sb2Te3/STO样品进行圆偏振光正面入射和背面入射条件下的变入射角CPGE测量。因为STO不会吸收1064nm的光,因此可以进行激光背入射下的CPGE电流测量。实验结果如图9所示,数据通过如下的公式(3)进行拟合。The variable incident angle CPGE measurements were performed on the Sb 2 Te 3 /STO samples with a thickness of 18 nm under the conditions of front and rear incidence of circularly polarized light. Because STO does not absorb light at 1064 nm, CPGE current measurements under laser back-incidence can be performed. The experimental results are shown in Figure 9, and the data are fitted by the following formula (3).

Figure BDA0003418455460000111
Figure BDA0003418455460000111

这里,n是Sb2Te3薄膜的折射率,ACPGE是与样品的自旋轨道耦合强度相关的常数。CPGE电流与入射角的依赖关系可以通过唯象公式(3)很好地拟合。可以看出,对于18nmSb2Te3/STO样品,正、背入射的CPGE电流呈现相同的符号,且正入射下的CPGE幅值大于背入射的CPGE。这一现象表明,在圆偏振光正、背入射两种情况下,上表面态将起主导作用。原因如下:Sb2Te3的表面态属于C3v点群,CPGE可以用唯象公式表示为

Figure BDA0003418455460000112
这里,JCPGEy是沿y方向的CPGE电流,γ是二阶赝张量,与材料的自旋轨道耦合成正比。
Figure BDA0003418455460000113
是指向光传播方向的单位矢量。在我们所采用的光路中,对于某一个入射角,
Figure BDA0003418455460000114
在正入射和背入射下将保持不变,这可从对比图3和图9插图中入射角的方向得到。因此,如果CPGE电流的符号在正、背入射两种情况下保持相同,则CPGE的主要贡献必然来自相同的拓扑表面态。考虑到在圆偏振光正面入射下,上表面吸收的光强度大于当光从背面入射时上表面态吸收的光强度,导致在正入射下上表面产生更大的CPGE电流。因此,可以推断上表面态在此18nm的Sb2Te3/STO的样品中起主导作用。由于其他样品在某一给定入射角下显示出与18nmSb2Te3/STO样品相同的符号,因此可以推断,在这些样品中上表面态对CPGE电流的贡献占主导。Here, n is the refractive index of the Sb2Te3 film, and ACPGE is a constant related to the spin-orbit coupling strength of the sample. The dependence of the CPGE current on the incident angle can be well fitted by the phenomenological formula (3). It can be seen that for the 18nmSb 2 Te 3 /STO sample, the CPGE currents of the forward and back incidents show the same sign, and the CPGE amplitude under the normal incidence is larger than that of the back incident CPGE. This phenomenon indicates that the upper surface state will play a dominant role in both cases of circularly polarized light with forward and backward incidence. The reasons are as follows: the surface state of Sb 2 Te 3 belongs to the C 3v point group, and CPGE can be expressed by the phenomenological formula as
Figure BDA0003418455460000112
Here, J CPGEy is the CPGE current along the y direction, and γ is the second-order pseudotensor proportional to the spin-orbit coupling of the material.
Figure BDA0003418455460000113
is the unit vector pointing in the direction of light propagation. In the light path we adopted, for a certain incident angle,
Figure BDA0003418455460000114
It will remain the same under normal and back incidence, which can be obtained by comparing the orientation of the incidence angles in the insets of Figures 3 and 9. Therefore, if the sign of the CPGE current remains the same for both forward and backward incidence, the main contribution of CPGE must come from the same topological surface states. Considering that under the frontal incidence of circularly polarized light, the light intensity absorbed by the upper surface is greater than that absorbed by the upper surface state when the light is incident from the backside, resulting in a larger CPGE current on the upper surface under normal incidence. Therefore, it can be inferred that the upper surface state plays a dominant role in this 18 nm sample of Sb 2 Te 3 /STO. Since the other samples show the same sign as the 18 nmSb 2 Te 3 /STO sample at a given incident angle, it can be inferred that the contribution of the upper surface states to the CPGE current dominates in these samples.

由于Sb2Te3上、下表面自旋轨道耦合的系数相反,因此将产生方向相反的CPGE电流,而总CPGE电流主要由上表面态主导,因此下表面态的贡献降低将增强净CPGE电流。因此,InP衬底的自旋注入将提高总CPGE电流,但InP衬底在应力的作用下CPGE也会下降甚至反号,如图8所示,证明其向Sb2Te3薄膜中注入的自旋电子将随应力增加而减少;进一步导致Sb2Te3薄膜中的CPGE降低。综上,在InP衬底上生长的Sb2Te3在自旋注入的协同作用下没有自旋注入情况下被应力调控的幅度更大,即在相同应力大小的情况下,若有衬底注入的协同作用,CPGE电流改变的幅度越大,调控效果越明显。Since the coefficients of the spin-orbit coupling between the upper and lower surfaces of Sb 2 Te 3 are opposite, CPGE currents in opposite directions will be generated, while the total CPGE current is dominated by the upper surface states, so the reduced contribution of the lower surface states will enhance the net CPGE current. Therefore, the spin implantation of the InP substrate will increase the total CPGE current, but the CPGE of the InP substrate will also decrease or even reverse the sign under the action of stress, as shown in Fig. The spintronics will decrease with increasing stress; further resulting in a decrease in CPGE in the Sb2Te3 film. In summary, the Sb 2 Te 3 grown on the InP substrate is more regulated by the stress under the synergistic effect of spin implantation without spin implantation, that is, under the same stress, if there is substrate implantation The greater the amplitude of CPGE current change, the more obvious the regulation effect.

为了验证衬底注入的调控作用,我们测量了没有衬底注入效果的Sb2Te3样品的CPGE电流随应力的变化曲线,即我们测量了钛酸锶衬底上生长的厚度为12纳米的Sb2Te3样品CPGE电流随应力的变化曲线,测量结果如图10所示。钛酸锶衬底的带隙为1.9eV,远大于1064nm激光器的光子能量,且我们在实验上没有测得钛酸锶衬底在1064nm激光激发下存在CPGE电流,表明其不存在缺陷态的圆偏振光电流。因此,在钛酸锶衬底上生长的Sb2Te3样品的CPGE电流中不存在衬底自旋注入的电流贡献。比较STO衬底上生长12nm Sb2Te3和InP衬底上生长30nm Sb2Te3,可以看出,随着单轴应变的增加,CPGE电流的大小均减小。具体而言,与未受应力样品相比,在单轴应变ex为0.0066的情况下,12nm Sb2Te3/STO样品的CPGE下降为原有的44%。但是,30nm Sb2Te3/InP样品中的CPGE的大小可以通过0.0033的单轴应变调谐到零,即调控范围高达100%。可见,InP衬底上生长的Sb2Te3样品的CPGE调控效果较好,这是由于应力和InP衬底的自旋注入协同作用的结果引起的。In order to verify the regulation effect of substrate implantation, we measured the CPGE current versus stress curve of the Sb 2 Te 3 sample without substrate implant effect, that is, we measured the Sb 12 nm thick grown on the strontium titanate substrate The variation curve of CPGE current with stress of 2 Te 3 sample is shown in Fig. 10. The band gap of the strontium titanate substrate is 1.9eV, which is much larger than the photon energy of the 1064nm laser, and we have not measured the CPGE current of the strontium titanate substrate under the excitation of the 1064nm laser, indicating that there is no circular defect state. Polarized photocurrent. Therefore, there is no current contribution from substrate spin injection in the CPGE current of Sb2Te3 samples grown on strontium titanate substrates. Comparing the growth of 12 nm Sb 2 Te 3 on the STO substrate and the growth of 30 nm Sb 2 Te 3 on the InP substrate, it can be seen that the magnitude of the CPGE current decreases with the increase of the uniaxial strain. Specifically, when the uniaxial strain ex is 0.0066, the CPGE of the 12 nm Sb 2 Te 3 /STO sample drops to 44% compared to the unstressed sample. However, the size of the CPGE in the 30 nm Sb 2 Te 3 /InP sample can be tuned to zero by a uniaxial strain of 0.0033, i.e., the tuning range is up to 100%. It can be seen that the Sb 2 Te 3 samples grown on the InP substrate have better CPGE regulation effect, which is caused by the synergistic effect of the stress and the spin injection of the InP substrate.

综上所述,本发明利用单轴应力以及衬底注入效应的协同作用来实现对Sb2Te3中CPGE电流调控的目的。因为随施加应变的增大,Sb2Te3拓扑表面态的自旋轨道耦合强度下降,而CPGE的大小与自旋轨道耦合强度成正相关,导致CPGE电流随之下降;此外,InP衬底的自旋注入将提高总CPGE电流,但InP衬底在应力的作用下向Sb2Te3薄膜中注入的自旋电子随应力增加而减少,所以在InP衬底上生长的Sb2Te3在自旋注入的协同作用下比STO衬底上的CPGE电流受应力调控的效果更显著。因此,利用单轴应力以及衬底注入效应的协同作用可以较好实现对Sb2Te3中CPGE电流调控的目的,本发明提供的方法实现方便,成本低,调控效果好,并且容易实现连续调控。To sum up, the present invention utilizes the synergistic effect of uniaxial stress and substrate injection effect to achieve the purpose of regulating the current of CPGE in Sb 2 Te 3 . Because the spin-orbit coupling strength of the Sb 2 Te 3 topological surface state decreases with the increase of applied strain, and the size of CPGE is positively correlated with the spin-orbit coupling strength, resulting in a decrease in CPGE current; Spin injection will increase the total CPGE current, but the spin electrons injected into the Sb 2 Te 3 film by the InP substrate under the action of stress decrease with the increase of the stress, so the Sb 2 Te 3 grown on the InP substrate is in the spin Under the synergistic effect of implantation, the effect of stress regulation of CPGE current is more significant than that on STO substrates. Therefore, the purpose of regulating the CPGE current in Sb 2 Te 3 can be better achieved by using the synergistic effect of uniaxial stress and substrate injection effect. The method provided by the invention is convenient to implement, low in cost, good in regulation effect, and easy to realize continuous regulation. .

以上所述仅为本发明的较佳实施例,凡依本发明申请专利范围所做的均等变化与修饰,皆应属本发明的涵盖范围。The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

Claims (6)

1. Sb2Te3The circularly polarized light current regulation and control method of the topological surface state is characterized by comprising the following steps of:
step S1: growth of Sb on InP substrate by molecular beam epitaxy equipment2Te3Preparing a pair of point electrodes on the surface of a sample by a mechanical indium pressing method;
step S2: constructing a stress device, and fixing the sample on the stress device by using epoxy resin;
step S3: laser emitted by a laser sequentially passes through a chopper, a polarizer and a quarter-wave plate and irradiates the geometric center of a sample, namely the center of a connecting line of two electrodes, and circular polarized light current is measured and extracted;
step S4: changing the stress application size through a stress device, and analyzing the change trend of the circularly polarized light current along with the stress;
step S5: measurement of Sb2Te3XPS spectrum of sample, analysis, calculation of substrate and Sb2Te3The energy band distribution of the interface, if the band order is less than zero, the possibility of spin injection exists; comparison of Sb without substrate spin injection2Te3The CPGE current of the sample is regulated and controlled by stress, and the Sb is regulated and controlled by the synergistic effect of stress and substrate injection2Te3The regulation and control effect of the medium circular polarized photocurrent method.
2. Sb according to claim 12Te3The method for regulating and controlling circularly polarized light current in a topological surface state is characterized in that the stress device comprises a rectangular polycarbonate plastic strip, a steel stress table, a stress thimble and a differential sleeve; fixing a sample in the center of a rectangular polycarbonate plastic strip by using epoxy resin, installing the sample on a steel stress table, applying uniaxial stress to the sample by rotating a differential sleeve through a stress thimble, measuring the distance from the left edge to the right edge of the steel stress table of the polycarbonate plastic strip as 2a, and measuring the thickness of the polycarbonate plastic strip as h.
3. Sb according to claim 12Te3The method for regulating circularly polarized light current in a topological surface state is characterized in that, in the step S4, the method specifically comprises the following steps:
and step S41, rotating the differential sleeve of the stress device to bend the sample, thereby applying stress to the sample. Reading the forward moving distance of the stress thimble from the differential sleeve and recording the forward moving distance as JzBy the formula ex=3hJz/2a2Calculating the magnitude of the applied stress;
step S42, rotating the quarter-wave plate by the stepping motor, collecting the photocurrent by the electrode, inputting the collected photocurrent to the preamplifier and the lock-in amplifier in turn, inputting the signal output by the lock-in amplifier to the computer by the data acquisition card; the rotation angle of the quarter-wave plate is changed from 0 degree to 360 degrees, the step length is 5 degrees, namely data J of one photocurrent is collected every 5 degrees;
and step S43, fitting the measured photocurrents J under different quarter-wave plate rotation angles by using the following formula:
Figure FDA0003418455450000021
wherein, JCIs circularly polarized light current, L1And L2Is photocurrent due to linearly polarized light, J0Is photocurrent caused by photovoltaic effect, thermoelectric effect and Danpei effect, which is simply referred to as background current; obtaining circularly polarized light current J by fittingC
Step S44 repeating steps S41 to S43 to measure Sb2Te3Circular polarized light current J of film under different stressC
4. Sb according to claim 12Te3The method for regulating and controlling circularly polarized light current in a topological surface state is characterized in that the step S5 specifically comprises the following steps:
step S51 measuring InP/Sb by X-ray photoelectron spectroscopy2Te3Band step at the interface, measured conduction band step Δ EcLess than zero, indicating that electrons can be injected from InP into Sb2Te3In the layer;
step S52, fixing the InP substrate at the center of a rectangular polycarbonate plastic strip by using epoxy resin, installing the sample on a self-made steel stress table, and applying uniaxial stress to the sample by rotating a differential sleeve; repeating the steps S3 to S4 to measure circularly polarized light current J of the InP substrate under different stressesc0(ii) a Measured change trend of the circularly polarized light current of the InP substrate along with stress and Sb2Te3The film has the same change trend with stress, which shows that Sb2Te3The circularly polarized light current of the film is affected by the spin injection of the InP substrate.
5. Sb according to claim 12Te3The method for regulating and controlling circularly polarized light current of topological surface state is characterized in that Sb2Te3The sample is in a rectangular single crystal structure, the short side of the sample is more than or equal to 3mm, the long side of the sample is more than or equal to 5mm, and the thickness of the sample is 7-30 nm; the point-like electrodes are a pair of point-like indium electrodesThe electrodes are pressed on the midline of the inner sides of two long sides of the rectangle through fine needles, the diameter of each electrode is approximately 0.25mm, and the electrode spacing is approximately 2 mm.
6. Sb according to claim 12Te3The circularly polarized light current regulation and control method of the topological surface state is characterized in that the power of the laser is between 30 and 200mW, and the incidence plane of the laser is vertical to the connecting line of the two electrodes; the laser beam is at an angle of between 10 and 45 degrees to the normal to the sample surface.
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