CN114193925B - Automatic copying and embossing integrated equipment and application method thereof - Google Patents
Automatic copying and embossing integrated equipment and application method thereof Download PDFInfo
- Publication number
- CN114193925B CN114193925B CN202111506755.5A CN202111506755A CN114193925B CN 114193925 B CN114193925 B CN 114193925B CN 202111506755 A CN202111506755 A CN 202111506755A CN 114193925 B CN114193925 B CN 114193925B
- Authority
- CN
- China
- Prior art keywords
- soft film
- substrate
- cavity
- glue
- vacuum chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004049 embossing Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000003292 glue Substances 0.000 claims abstract description 43
- 238000003860 storage Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 9
- 238000001723 curing Methods 0.000 claims description 18
- 238000003848 UV Light-Curing Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000010076 replication Effects 0.000 claims description 7
- 238000001029 thermal curing Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 8
- 238000009776 industrial production Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
- B41F19/08—Simultaneous moulding and printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2217/00—Printing machines of special types or for particular purposes
- B41P2217/50—Printing presses for particular purposes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses an automatic copying and embossing integrated device and a use method thereof, wherein a wafer boat box is arranged on the left side outside a cavity, the wafer boat box is fastened and fixed by a slide rail, the wafer boat box can be changed in size, the left side is used for placing a substrate and a die, and the right side is used for automatically taking and placing the inside of the device; a lifting manipulator is arranged at the left side of the cavity near the wafer cassette and used for transferring a required die or substrate; a soft film storage device and a soft film conveying device are arranged at the left upper part inside the cavity, a liftable vacuum chuck is arranged at the bottom of the cavity for transferring a required die or a substrate and is used for adsorbing the substrate, and an annular vacuum groove is formed at the bottom of the pressing plate and is used for adsorbing the soft film; the right side of the cavity is provided with an automatic glue dispensing device, which comprises a glue storage barrel, a glue pipe and a glue dispensing box, and can simultaneously accommodate various glue solutions, thereby realizing automatic glue selection and automatic glue dispensing. The integrated copying and embossing is realized, the automation is realized, the manual intervention is not needed in the whole process, the manpower and material resources are saved, the working efficiency is improved, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of automation, in particular to an automatic copying and embossing integrated device and a using method thereof.
Background
Nanoimprint technology has been proposed from 1995 to fifteen years now. As a technology for reproducing a high resolution, high yield and low cost nanostructure pattern, great importance has been attached to various technologies and industrially developed countries in the world, and they have expected that this technology will bring great economic benefits, invest a great deal of manpower and financial resources for intensive research, and have a great deal of technological papers issued each year. All micro-nano processing technology international conferences have the theme of nano imprinting technology, and the first international conference taking nano imprinting technology as the theme has been held. The development of the technology has achieved great results and is going forward towards the direction of industrial production. To bring the nanoimprint process closer to the actual industrial production requirements, the equipment needs to complete a semi-automated to automated transition.
Disclosure of Invention
The invention aims to provide automatic copying and embossing integrated equipment and a use method thereof, so that copying and embossing integrated equipment is realized, automation is realized, manual intervention is not needed in the whole process, manpower and material resources are saved, the working efficiency is improved, and the cost is reduced.
In order to achieve the above purpose, the present invention provides the following technical solutions: an automatic copying and embossing integrated device comprises a cavity, wherein a wafer cassette is arranged on the left side outside the cavity;
a flexible film storage device and a flexible film conveying device are arranged at the left upper part in the cavity, and a lifting manipulator for transferring the substrate is arranged at the left side of the cavity and close to the wafer cassette;
the bottom of the cavity is provided with a liftable vacuum chuck for adsorbing a required die or substrate, and the bottom of the vacuum chuck is provided with a heating device;
the top end of the cavity is provided with a UV lamp, the top end of the cavity is also provided with two brackets, the UV lamp is positioned in the middle of the two brackets, the bottom ends of the two brackets are provided with a pressing plate, the bottom of the pressing plate is provided with an annular vacuum groove, and a soft film is adsorbed in the vacuum groove;
the right side of the cavity is provided with an automatic glue dispensing device, the automatic glue dispensing device comprises a glue storage barrel, a glue pipe and a glue dispensing box, and the glue storage barrel is communicated with the glue dispensing box through the glue pipe;
an operation screen is arranged on the outer side of the right upper part of the cavity.
Preferably, a perspective window is arranged in the middle of the pressing plate.
A method for using an automated replication and imprinting integrated device, comprising the steps of:
step 1, putting a required die and a substrate into the wafer cassette through an opening at the outer side of the wafer cassette;
step 2, setting copying and imprinting parameters through an operation screen;
step 3, automatically dropping a blank soft film by the soft film storage device, placing the blank soft film on the soft film conveying device, conveying the blank soft film to the position right below the pressing plate, adsorbing the soft film on the pressing plate, and returning the soft film conveying device to the original point;
step 4, clamping the die required by the specification by a manipulator, placing the die on a vacuum chuck, and lifting the whole vacuum chuck to a dispensing position after the die is adsorbed;
step 5, the glue dispensing device selects proper photoresist according to program setting, and a proper amount of glue is dispensed on the die; the vacuum chuck continues to rise until the mold is completely attached to the soft film, and the replication process is completed;
step 6, selecting a designated curing mode to perform primary curing;
step 7, demolding for the first time, slowly descending a vacuum chuck, separating the mold from the soft film, and leaving the adhesive on the soft film;
step 8, the mechanical arm takes down the mould and puts the mould into the wafer cassette;
step 9, placing the substrate taken by the manipulator on a vacuum chuck, and lifting the whole vacuum chuck to a dispensing position after adsorption;
step 10, the glue dispensing device selects proper photoresist according to program setting, and a proper amount of glue is dispensed on the substrate;
step 11, the vacuum chuck continues to ascend until the substrate is completely attached to the soft film, and the imprinting process is completed;
step 12, selecting a designated curing mode to carry out secondary curing;
step 13, demolding for the second time, slowly descending a vacuum chuck, separating the substrate from the soft film, and keeping the adhesive on the substrate;
step 14, the substrate is taken down by a manipulator and put into a wafer cassette;
step 15, the manipulator takes off one substrate and places the substrate on the vacuum chuck, and all the steps from the step 15 to the step are repeated until all the substrates are completely stamped;
and step 16, after the substrates are completely stamped, the wafer cassette is taken down, and the next batch of required dies and substrates 6 are replaced.
Preferably, the curing method in the step 6 is either UV curing or thermal curing.
Preferably, the curing method in step 12 is either UV curing or thermal curing.
Compared with the prior art, the invention has the beneficial effects that: automatic copying and embossing integrated equipment and application method thereof are used for realizing copying and embossing integration, automation is realized, manpower and material resources are saved, working efficiency is improved, and cost is reduced.
Drawings
Fig. 1 is a schematic structural view of the present invention.
In the figure: 1. the device comprises a cavity, 2, a wafer boat box, 3, a soft film storage device, 4, a soft film conveying device, 5, a liftable manipulator, 6, a substrate, 7, a vacuum chuck, 8, a heating device, 9, a UV lamp, 10, a bracket, 11, a pressing plate, 12, a soft film, 13, a glue storage barrel, 14, a rubber tube, 15, a glue dispensing box, 16 and an operation screen.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to the attached figure 1 in the specification, a technical scheme is provided for the invention: an automatic copying and embossing integrated device comprises a cavity body 1, wherein a wafer cassette 2 is arranged on the left side outside the cavity body 1;
the wafer cassette 2 is fixed on the cavity 1 by a slide rail buckle, the size can be changed, two sides are opened, the left side is used for placing the substrate 6 and the die, and the right side is used for automatically taking and placing the inside of the equipment;
the upper left side of the inside of the cavity 1 is provided with a soft film storage device 3 and a soft film conveying device 4, and the soft film conveying device 4 adopts a conveying mode of an electric sliding rail;
a liftable manipulator 5 is arranged at the left side of the cavity 1 and close to the wafer cassette 2, and the liftable manipulator 5 is an existing electric control liftable manipulator for transferring the substrates 6;
the bottom of the cavity 1 is provided with a liftable vacuum sucker 7 (with a PIN needle) for adsorbing a required mould or substrate 6, and the bottom of the vacuum sucker 7 is provided with a heating device 8;
the heating device 8 adopts a heating mode of an electric heater;
the top end of the cavity 1 is provided with a UV lamp 9, the top end of the cavity 1 is also provided with two brackets 10, the UV lamp 9 is positioned in the middle of the two brackets 10, the bottom ends of the two brackets 10 are provided with a pressing plate 11, the bottom of the pressing plate 11 is provided with an annular vacuum groove, and a soft film 12 is adsorbed in the vacuum groove;
an automatic dispensing device is arranged on the right side of the cavity 1, the automatic dispensing device comprises a glue storage barrel 13, a glue pipe 14 and a dispensing box 15, and the glue storage barrel 13 is communicated with the dispensing box 15 through the glue pipe 14;
the rubber tube 14 is a rubber hose or a plastic hose;
the glue storage barrel 13 and the glue dispensing box 15 are arranged on the side wall of the cavity;
referring to the figure 1 of the specification, at least three groups of glue storage barrels 13 and glue pipes 14 are provided, and different glue solutions are placed in each group;
multiple glue solutions can be simultaneously contained, so that automatic glue selection and automatic glue dripping are realized;
an operation screen 16 is arranged on the outer side of the right upper part of the cavity 1 to control the operation of the equipment, and the copying and embossing parameters can be set at one time through the existing control system, and the operation progress is observed in real time.
A perspective window is arranged in the middle of the pressing plate 11.
The operation screen 16 is a touch screen, is connected to the controller through an electric connection or a wireless connection mode, and the controller is connected to and controls the electric devices in the equipment;
the electric devices are powered by external power or by self-contained batteries.
A method for using an automated replication and imprinting integrated device, comprising the steps of:
step 1, putting a required die and a substrate 6 into the wafer cassette 2 through an opening at the outer side of the wafer cassette;
step 2, setting copying and imprinting parameters through an operation screen 16;
step 3, automatically dropping a blank soft film 12 from the soft film storage device 3, placing the blank soft film 12 on the soft film conveying device 4, conveying the blank soft film to the position right below the pressing plate 11, adsorbing the soft film 12 on the pressing plate 11, and returning the soft film conveying device 4 to the original point;
step 4, the mechanical arm 5 clamps a mould required by the specification, the mould is placed on the vacuum chuck 7, and after the mould is adsorbed, the whole vacuum chuck 7 is lifted to a dispensing position;
step 5, the glue dispensing device selects proper photoresist according to program setting, and a proper amount of glue is dispensed on the die; the vacuum chuck continues to rise until the mold is completely attached to the soft film 12, and the replication process is completed;
step 6, selecting a designated curing mode to perform primary curing;
step 7, demolding for the first time, slowly descending the vacuum chuck 7, separating the mold from the soft film 12, and leaving the adhesive on the soft film 12;
step 8, the mechanical arm 5 takes down the mould and puts the mould into the original position of the wafer cassette 2;
step 9, the manipulator 5 takes the substrate 6 and places the substrate on the vacuum chuck 7, and after the substrate is adsorbed, the whole vacuum chuck rises to a dispensing position;
step 10, the glue dispensing device selects proper photoresist according to program setting, and a proper amount of glue is dispensed on the substrate 6;
step 11, the vacuum chuck 7 continues to ascend until the substrate 6 is completely attached to the soft film 12, and the imprinting process is completed;
step 12, selecting a designated curing mode to carry out secondary curing;
step 13, demolding for the second time, slowly descending the vacuum chuck 7, separating the substrate 6 from the soft film 12, and keeping the adhesive on the substrate 6;
step 14, the substrate 6 is taken down by the mechanical arm 5 and put into the original position of the wafer cassette 2;
step 15, the manipulator 5 takes off one substrate and places the substrate on the vacuum chuck 7, and all the steps from the step 1 to the step 14 are repeated until all the substrates 6 are completely stamped;
and step 16, after the substrates are completely stamped, the wafer cassette 2 is taken down, and the next batch of required dies and substrates 6 are replaced.
The curing method in the step 6 adopts any one of UV curing or thermal curing.
The curing method in the 12 th step adopts any one of UV curing or thermal curing.
UV curing is provided by UV lamps 9 and thermal curing is provided by heating means 8.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. A method of using an automated replication and imprinting integrated apparatus, the apparatus comprising:
cavity (1), cavity (1)
The left side of the outside is provided with a wafer cassette (2);
a soft film storage device (3) and a soft film conveying device (4) are arranged at the left upper part inside the cavity (1), and a lifting manipulator (5) is arranged at the left side of the cavity (1) close to the wafer cassette (2) and used for transferring the substrates (6);
the bottom of the cavity (1) is provided with a liftable vacuum sucker (7) for adsorbing a required mould or substrate (6), and the bottom of the vacuum sucker (7) is provided with a heating device (8);
the top end of the cavity (1) is provided with a UV lamp (9), the top end of the cavity (1) is also provided with two brackets (10), the UV lamp (9) is positioned in the middle of the two brackets (10), the bottom ends of the two brackets (10) are provided with a pressing plate (11), the bottom of the pressing plate (11) is provided with an annular vacuum groove, and a soft film (12) is adsorbed in the vacuum groove;
an automatic dispensing device is arranged on the right side of the cavity (1), the automatic dispensing device comprises a glue storage barrel (13), a rubber pipe (14) and a dispensing box (15), and the glue storage barrel (13) is communicated with the dispensing box (15) through the rubber pipe (14);
an operation screen (16) is arranged on the outer side of the right upper part of the cavity (1);
a perspective window is arranged in the middle of the pressing plate (11);
the method also comprises the following using steps:
step 1, putting a required die and a substrate (6) into the wafer cassette (2) through an opening at the outer side;
step 2, setting copying and imprinting parameters through an operation screen (16);
step 3, automatically dropping a blank soft film (12) by the soft film storage device (3), placing the blank soft film on the soft film conveying device (4), conveying the blank soft film to the position right below the pressing plate (11), adsorbing the soft film (12) on the pressing plate (11), and returning the soft film conveying device (4) to the original point;
step 4, clamping the die required by the specification by the mechanical arm (5), placing the die on the vacuum chuck (7), and lifting the whole vacuum chuck (7) to a dispensing position after the die is adsorbed;
step 5, the glue dispensing device selects proper photoresist according to program setting, and a proper amount of glue is dispensed on the die; the vacuum sucker (7) continues to ascend until the die is completely attached to the soft film (12), and the copying process is completed;
step 6, selecting a designated curing mode to perform primary curing;
step 7, demolding for the first time, slowly descending the vacuum chuck (7), separating the mold from the soft film (12), and leaving the adhesive on the soft film (12);
step 8, the mechanical arm (5) takes down the mould and puts the mould into the wafer cassette (2);
step 9, the manipulator (5) takes the substrate (6) and places the substrate on the vacuum chuck, and after the substrate is adsorbed, the whole vacuum chuck (7) rises to a dispensing position;
step 10, the glue dispensing device selects proper photoresist according to program setting, and a proper amount of glue is dispensed on the substrate (6);
step 11, the vacuum chuck (7) continues to ascend until the substrate (6) is completely attached to the soft film (12), and the imprinting process is completed;
step 12, selecting a designated curing mode to carry out secondary curing;
step 13, demolding for the second time, slowly descending the vacuum chuck (7), separating the substrate (6) from the soft film (12), and keeping the adhesive on the substrate (6);
step 14, the substrate (6) is taken down by the mechanical arm (5) and put into the wafer cassette (2);
step 15, the manipulator (5) takes off one substrate and places the substrate on the vacuum chuck (7), and all the steps from the step 1 to the step 14 are repeated until all the substrates (6) are completely stamped;
and step 16, after the substrates are completely stamped, the wafer cassette (2) is taken down, and the next batch of required dies and substrates (6) are replaced.
2. A method of using an automated replication and imprinting integrated apparatus according to claim 1, wherein: the curing mode in the step 6 adopts any one of UV curing or thermal curing.
3. A method of using an automated replication and imprinting integrated apparatus according to claim 1, wherein: the curing mode in the step 12 adopts any one of UV curing or thermal curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111506755.5A CN114193925B (en) | 2021-12-10 | 2021-12-10 | Automatic copying and embossing integrated equipment and application method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111506755.5A CN114193925B (en) | 2021-12-10 | 2021-12-10 | Automatic copying and embossing integrated equipment and application method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114193925A CN114193925A (en) | 2022-03-18 |
| CN114193925B true CN114193925B (en) | 2024-01-09 |
Family
ID=80652218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111506755.5A Active CN114193925B (en) | 2021-12-10 | 2021-12-10 | Automatic copying and embossing integrated equipment and application method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114193925B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070061061A (en) * | 2005-12-09 | 2007-06-13 | 오브듀캇 아베 | Apparatus for pattern replication with intermediate stamp |
| CN108845479A (en) * | 2018-05-28 | 2018-11-20 | 苏州光舵微纳科技股份有限公司 | A kind of replacement of mantle and nano impression integrated equipment |
| JP2019117844A (en) * | 2017-12-26 | 2019-07-18 | キヤノン株式会社 | Mold, replica mold, imprint apparatus, and article manufacturing method |
| CN110820023A (en) * | 2019-10-29 | 2020-02-21 | 苏州胜利精密制造科技股份有限公司 | Method for preparing ultra-precise microstructure radiating fin |
| CN211236560U (en) * | 2020-03-18 | 2020-08-11 | 青岛天仁微纳科技有限责任公司 | Nano-imprinting equipment with accurate positioning function |
| CN211528907U (en) * | 2020-03-19 | 2020-09-18 | 青岛天仁微纳科技有限责任公司 | Automatic glue dripping nano-imprinting equipment |
-
2021
- 2021-12-10 CN CN202111506755.5A patent/CN114193925B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070061061A (en) * | 2005-12-09 | 2007-06-13 | 오브듀캇 아베 | Apparatus for pattern replication with intermediate stamp |
| JP2019117844A (en) * | 2017-12-26 | 2019-07-18 | キヤノン株式会社 | Mold, replica mold, imprint apparatus, and article manufacturing method |
| CN108845479A (en) * | 2018-05-28 | 2018-11-20 | 苏州光舵微纳科技股份有限公司 | A kind of replacement of mantle and nano impression integrated equipment |
| CN110820023A (en) * | 2019-10-29 | 2020-02-21 | 苏州胜利精密制造科技股份有限公司 | Method for preparing ultra-precise microstructure radiating fin |
| CN211236560U (en) * | 2020-03-18 | 2020-08-11 | 青岛天仁微纳科技有限责任公司 | Nano-imprinting equipment with accurate positioning function |
| CN211528907U (en) * | 2020-03-19 | 2020-09-18 | 青岛天仁微纳科技有限责任公司 | Automatic glue dripping nano-imprinting equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114193925A (en) | 2022-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206914742U (en) | A kind of lithium battery PACK lines sorting section upper casing feeder | |
| CN113097369B (en) | Automatic film pressing equipment suitable for glue thermosetting packaging LED chip | |
| CN102672019A (en) | Method and device for producing corrugated plate of container | |
| CN109202403B (en) | Automatic screen assembly equipment | |
| CN109764040A (en) | A kind of LOCA make-up machine | |
| CN114193925B (en) | Automatic copying and embossing integrated equipment and application method thereof | |
| CN207344717U (en) | A kind of intelligence molding production equipment | |
| CN207997082U (en) | Battery strings typesetting Duan Han integral types robot | |
| CN214956938U (en) | Automatic film pressing equipment suitable for glue thermosetting packaging LED chip | |
| CN215624825U (en) | Motorcycle tyre inner support placing device | |
| CN110492166A (en) | A kind of battery core feeding cache mechanism | |
| CN111890018A (en) | Full-automatic assembly equipment of high leakproofness washing-free reagent bottle manufacturing | |
| CN205488058U (en) | Chip module seals glues conveyor | |
| TWM624929U (en) | Curved surface gluing device | |
| CN110965396A (en) | Turnover type paper support production system | |
| CN209357848U (en) | A kind of secondary localization machine of battery core based on CCD | |
| CN113369665A (en) | Automatic forming equipment for stainless steel composite board | |
| CN219786154U (en) | Full-automatic elbow processing equipment | |
| CN205507171U (en) | Collect hanging wall, point is glued and wear equipment of optic fibre in automatic assembly of an organic whole pottery caudal peduncle and optic fibre | |
| CN211446395U (en) | Turnover type paper support production system | |
| CN105964780B (en) | Fire extinguisher tank drawing process and its equipment | |
| CN214266416U (en) | Fixing device with adjusting function for manufacturing injection mold | |
| CN220419792U (en) | Nanometer imprint manufacturing equipment and AR lens manufacturing equipment | |
| CN213500815U (en) | Compression molding machine is used in processing of ya keli board | |
| CN220053195U (en) | Clamping device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |