CN114188285A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
- Publication number
- CN114188285A CN114188285A CN202111368842.9A CN202111368842A CN114188285A CN 114188285 A CN114188285 A CN 114188285A CN 202111368842 A CN202111368842 A CN 202111368842A CN 114188285 A CN114188285 A CN 114188285A
- Authority
- CN
- China
- Prior art keywords
- display panel
- stress
- substrate
- barrier layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application discloses a display panel and a manufacturing method of the display panel, wherein stress barrier layers are correspondingly arranged at corner regions of a substrate. Wherein, when carrying out the chamfer to display panel, there is the stress stack between base plate and the apron, the conduction of direction about stress can carry out with the form of ripples, and because the existence of stress barrier layer, stress can carry out separation and release in stress barrier layer department, prevent that stress from continuing to draw close to display panel is inside, thereby can effectively reduce the microcrack that break bar and display panel interact produced and expand along the direction of grinding, reach the effect of avoiding display panel to appear fracture phenomenon, the production of fracture has been avoided, and then display panel's yield has been improved.
Description
Technical Field
The application relates to the field of display, in particular to a display panel and a manufacturing method of the display panel.
Background
Currently, as display technologies mature day by day, organic light emitting displays are becoming more and more popular in daily life.
After the organic light emitting display panel is manufactured, the organic light emitting display panel is sent to be cut, and edge chamfering is carried out after cutting. When chamfering, a certain pressure needs to be applied to the cutter wheel, so that the cutter wheel is ground at the section of the organic light-emitting display panel under the guidance of the cutter seat; the cutter wheel has extrusion effect on glass, and can damage a certain area in the advancing direction of the cutter wheel to form microcracks. The end part of the micro-crack is a stress concentration place, so that the micro-crack generated by the interaction of the cutter wheel and the organic light-emitting display panel can expand along the grinding direction; when the cracks reach a certain degree, the organic light emitting display panel is broken, and cracks are generated.
Therefore, how to prevent the organic light emitting display panel from generating cracks during chamfering is a difficult problem for panel manufacturers.
Disclosure of Invention
The embodiment of the application provides a display panel and a manufacturing method of the display panel, and aims to solve the technical problem that cracks are easy to generate when an organic light-emitting display panel is chamfered in the prior art.
The embodiment of the application provides a driving method of a display device, which comprises a substrate, a driving circuit and a driving circuit, wherein the substrate is provided with a corner area;
a cover plate disposed opposite to the base plate,
an adhesive layer disposed between the substrate and the cover plate;
the stress barrier layer is arranged between the substrate and the cover plate and correspondingly arranged in the corner area.
Optionally, in some embodiments of the present application, the stress barrier layer is correspondingly disposed in one of the corner regions.
Optionally, in some embodiments of the present application, the stress blocking layer is disposed in two diagonally disposed corner regions.
Optionally, in some embodiments of the present application, the stress blocking layer is correspondingly disposed in four corner regions.
Optionally, in some embodiments of the present application, the stress barrier layer is spaced apart from the adhesive layer by a distance of 0 mm to 2 mm.
Optionally, in some embodiments of the present application, the stress blocking points are shaped as dots or drops.
Optionally, in some embodiments of the present application, the material of the stress barrier is an organic material.
Optionally, in some embodiments of the present application, a material of the stress barrier is identical to a material of the array layer.
Optionally, in some embodiments of the present application, the display panel further includes an array layer disposed between the adhesive layer and the substrate, and the material of the stress barrier point is the same as the material of the array layer.
Correspondingly, an embodiment of the present application further provides a manufacturing method of a display panel, where the manufacturing method includes:
providing a substrate and a cover plate, wherein the substrate is provided with an edge area;
forming an adhesive layer and a stress barrier layer on the substrate, wherein the stress barrier layer is correspondingly arranged in the corner area;
and pressing the substrate and the cover plate to form the display panel, wherein the substrate and the cover plate are arranged oppositely.
The embodiment of the application adopts a display panel and a manufacturing method of the display panel, and the stress barrier layers are correspondingly arranged at the corner areas of the substrate. Wherein, when carrying out the chamfer to display panel, there is the stress stack between base plate and the apron, the conduction of direction about stress can carry out with the form of ripples, and because the existence of stress barrier layer, stress can carry out separation and release in stress barrier layer department, prevent that stress from continuing to draw close to display panel is inside, thereby can effectively reduce the microcrack that break bar and display panel interact produced and expand along the direction of grinding, reach the effect of avoiding display panel to appear fracture phenomenon, the production of fracture has been avoided, and then display panel's yield has been improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of a first structure of a display panel according to an embodiment of the present disclosure.
Fig. 2 is a second structural schematic diagram of a display panel according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a third structure of a display panel according to an embodiment of the present application.
Fig. 4 is a fourth structural schematic diagram of a display panel provided in the embodiment of the present application.
Fig. 5 is a fifth structural schematic diagram of a display panel according to an embodiment of the present application.
Fig. 6 is a sixth structural schematic diagram of a display panel according to an embodiment of the present application.
Fig. 7 is a seventh structural schematic diagram of a display panel according to an embodiment of the present application.
Fig. 8 is a schematic flowchart of a manufacturing method of a display panel according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "length," "width," "thickness," "upper," "lower," and the like, as used herein, refer to an orientation or positional relationship as shown in the drawings, which is used for convenience in describing the present application and to simplify the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present application. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second", etc. may explicitly or implicitly include one or more of the described features and are therefore not to be construed as limiting the application.
The embodiment of the application provides a display panel and a manufacturing method of the display panel. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1 and fig. 2, fig. 1 is a first structural schematic diagram of a display panel provided in the embodiment of the present application, and fig. 2 is a second structural schematic diagram of the display panel provided in the embodiment of the present application. As shown in fig. 1 and fig. 2, a display panel 10 provided in the embodiment of the present application includes a substrate 101, an adhesive layer 102, a stress barrier layer 103, and a cover plate 104. The substrate 101 has a corner region 101 a. The adhesive layer 102 is disposed between the substrate 101 and the cover plate 104. The stress barrier layer 103 is disposed between the substrate 101 and the cover plate 104, and is correspondingly disposed at the corner region 101 a. The cover plate 104 is disposed opposite to the base plate 101.
In the prior art, when the display panel is chamfered, the cutter wheel and the glass are pressed to break a certain area in the advancing direction of the cutter wheel, thereby forming microcracks. The end part of the micro-crack is a stress concentration place, so that the micro-crack generated by the interaction of the cutter wheel and the display panel can expand along the grinding direction; when the cracks reach a certain degree, the display panel is broken, and cracks are generated.
In the embodiment of the present invention, the stress barrier layer 103 is disposed at the corner region 101a of the substrate 101. Wherein, when carrying out the chamfer to display panel 10, there is the stress stack between base plate 101 and the apron 104, the conduction of direction about stress can carry out with the form of ripples, and because the existence of stress barrier layer 103, stress can be in stress barrier layer 103 department separation and release, prevent that stress from continuing to draw close to display panel 10 is inside, thereby can effectively reduce the microcrack that break bar and display panel 10 interact produced and expand along the direction of lapping, reach the effect of avoiding display panel 10 to appear cracked phenomenon, the production of fracture has been avoided, and then display panel 10's yield has been improved.
The distance L1 between the stress barrier layer 103 and the adhesive layer 102 is 0 mm to 2 mm. Specifically, the stress barrier layer 103 is spaced apart from the adhesive layer 102 by a distance L1 of 0 mm, 0.2 mm, 0.4 mm, 0.7 mm, 1 mm, 1.5 mm, or 2 mm. The specific separation distance L1 between the stress barrier layer 103 and the adhesive layer 102 is determined by the specific requirements of the display panel 10.
It should be noted that, by providing the stress barrier layer 103 corresponding to the corner region 101a of the substrate 101, the effect of preventing the stress from continuing to approach the inside of the display panel 10 and reducing the expansion of the micro-crack generated by the interaction between the cutter wheel and the display panel 10 along the polishing direction can be achieved, so that the distance L1 between the stress barrier layer 103 and the adhesive layer 102 can be set sufficiently small.
The smaller the distance L1 between the stress barrier layer 103 and the adhesive layer 102, the narrower the frame of the display panel 10. Therefore, by limiting the distance L1 between the stress barrier layer 103 and the adhesive layer 102 to 0 mm to 2 mm, a narrow bezel of the display panel 10 can be realized while avoiding the display panel 10 from breaking.
Wherein, the distance L2 between the stress barrier layer 103 and the corresponding grinding boundary is 1 mm to 2 mm. Specifically, the distance L2 between the stress barrier layer 103 and the corresponding grinding boundary is 1 mm, 1.1 mm, 1.2 mm, 1.4 mm, 1.6 mm or 2 mm. The specific spacing L2 of the stress barrier layer 103 from the corresponding polishing boundary is determined by the specific frame requirements of the display panel 10.
Note that, in order to facilitate the stress barrier layer 103 to counteract the stress diffusion, the distance L2 between the stress barrier layer 103 and the polishing boundary provided correspondingly thereto needs to be 1 mm or more. In order to realize a narrow bezel of the display panel 10, the distance L2 between the stress barrier layer 103 and the polishing boundary provided corresponding thereto needs to be 2 mm or less.
Therefore, by limiting the distance L2 between the stress barrier layer 103 and the grinding boundary disposed corresponding thereto to 1 mm to 2 mm, a narrow bezel of the display panel 10 can be realized while avoiding the fracture phenomenon of the display panel 10.
Wherein the stress barrier layer 103 comprises a first side and a second side which are oppositely arranged. The first side is in contact with the adhesive layer 102 and the second side is in contact with the cover sheet 104.
Note that, when the display panel 10 is chamfered, stress is superimposed between the substrate 101 and the cover plate 104, and the stress is transmitted in the vertical direction in the form of waves. Therefore, only when one surface of the stress blocking layer 103 contacts the substrate 101 and the other surface contacts the cover plate 104, the stress is blocked and released at the stress blocking point 103a, and the stress is prevented from continuously drawing close to the inside of the display panel 10, so that the effect of avoiding the display panel 10 from breaking is achieved, the generation of cracks is avoided, and the yield of the display panel 10 is improved.
In the packaging process of the display panel 10, the substrate 101 and the cover plate 104 are pressed to complete the packaging. When the stress barrier layer 103 is just formed, the stress barrier layer 103 is not in contact with the cover plate 104, or the stress barrier layer 103 is not in contact with the substrate 101, and only after the substrate 101 and the cover plate 104 are laminated, the stress barrier layer 103 is in contact with not only the substrate 101 but also the cover plate 104, so that the defect of the lamination process caused by the excessively high height of the stress barrier layer 103 in the lamination process is prevented.
In the process of packaging the display panel 10, the cover plate 104 and the substrate 101 need to be pressed together. By arranging the bonding layer 102, the bonding force between the cover plate 104 and other film layers can be improved, and the phenomenon that the film layers fall off is avoided, so that the packaging effect of the display panel is improved.
Please refer to fig. 3, fig. 3 is a schematic diagram of a third structure of a display panel according to an embodiment of the present disclosure. As shown in fig. 6, the display panel shown in fig. 3 is different from the display panel shown in fig. 1 in that: the display panel 10 further includes an array layer 105. Array layer 105 includes a light-shielding layer 1051, a buffer layer 1052, a thin-film transistor layer 1053, and a planarization layer 1054. The light-shielding layer 1051 is provided on the substrate 101. The buffer layer 1052 is provided on a surface of the light-shielding layer 1051 remote from the substrate 101. The thin-film transistor layer 1053 is provided on a surface of the buffer layer 1052 remote from the light-shielding layer 1051. Planarization layer 1054 is disposed on a side of thin-film-transistor layer 1053 away from buffer layer 1052.
The light-shielding layer 1051 is made of a metal or a metal alloy. Specifically, the material of the light-shielding layer 1051 is tantalum (Ta), tungsten (W), molybdenum (Mo), aluminum (Al), titanium (Ti), a copper niobium (CuNb) alloy, or the like, and may be, for example, a stack of copper (Cu) and molybdenum (Mo), a stack of copper (Cu) and molybdenum titanium (MoTi), a stack of copper (Cu) and titanium (Ti), a stack of aluminum (Al) and molybdenum (Mo), a stack of molybdenum (Mo) and tantalum (Ta), a stack of molybdenum (Mo) and tungsten (W), a stack of molybdenum (Mo) -aluminum (Al) -molybdenum (Mo), or the like.
The material of the buffer layer 1052 and the planarization layer 1054 may be selected from silicon dioxide, silicon oxynitride, and a stack thereof.
The thin film transistor layer 1053 includes an active layer, a source/drain layer, a gate layer, and a gate insulating layer. The array layer 105 may also include other film layers.
The material of the active layer may be low temperature polysilicon. Specifically, the material of the active layer is Indium Gallium Zinc Oxide (IGZO), Indium Gallium Zinc Tin Oxide (IGZTO), Indium Zinc Oxide (IZO), gallium indium oxide (IGO), Indium Gallium Tin Oxide (IGTO), Indium Zinc Tin Oxide (IZTO), Indium Tin Oxide (ITO), or the like.
The gate layer and the source drain layer are made of metal or metal alloy. Specifically, the material of the gate layer and the source/drain layer is tantalum (Ta), tungsten (W), molybdenum (Mo), aluminum (Al), titanium (Ti), copper niobium (CuNb) alloy, or the like, and may be, for example, a stack of copper (Cu) and molybdenum (Mo), a stack of copper (Cu) and molybdenum titanium (MoTi), a stack of copper (Cu) and titanium (Ti), a stack of aluminum (Al) and molybdenum (Mo), a stack of molybdenum (Mo) and tantalum (Ta), a stack of molybdenum (Mo) and tungsten (W), a stack of molybdenum (Mo) -aluminum (Al) -molybdenum (Mo), or the like.
Wherein, the material of the gate insulating layer can be selected from silicon dioxide, silicon oxynitride and a lamination layer thereof.
Referring to fig. 4, fig. 4 is a fourth structural schematic diagram of a display panel according to an embodiment of the present disclosure. As shown in fig. 4, the stress barrier layer 103 provided in the embodiment of the present application includes a plurality of stress barrier points 103a disposed at intervals.
Wherein, the shape of the stress blocking point 103a is a point or a drop. It should be noted that the stress blocking point 103a is provided in a dot shape or a droplet shape, which helps to improve the effect of blocking and releasing the stress of the stress blocking point 103 a.
In the same stress barrier layer 103, the distances between two adjacent stress barrier points 103a are equal. It should be noted that the stress barrier points 103a are formed by an exposure and development process, an inkjet printing process or a nozzle spraying process, so that when the distance between two adjacent stress barrier points 103a is equal, the difficulty of the process for forming the stress barrier points 103a by using the above process can be reduced, thereby achieving the effects of improving the production efficiency and reducing the cost.
In the same stress barrier layer 103, the distance between two adjacent stress barrier points 103a may also be different.
The number and size of the stress blocking points 103a may be the same or different.
Wherein the material of the stress-blocking point 103a is identical to the material of the array layer 105. It should be noted that the stress barrier layer 103 and the array layer 105 are disposed in the same layer. Therefore, when the material of the stress barrier 103a is the same as the material of the array layer 105, the stress barrier 103a can be formed along with the fabrication of the array layer 105, thereby achieving the effects of improving the production efficiency and reducing the cost. In addition, when the material of the stress blocking point 103a is identical to the material of the array layer 105, the stress blocking layer 103 may be formed through an exposure development process.
The material of the stress barrier 103a may also be an organic material. When the material of the stress barrier point 103a is an organic material, the stress barrier layer 103 cannot be formed by an exposure development process, and the stress barrier layer 103 can be formed only by an inkjet printing process or a nozzle spray process.
Referring to fig. 5, fig. 5 is a fifth structural schematic diagram of a display panel according to an embodiment of the present disclosure. As shown in fig. 5, the stress barrier layer 103 provided in the embodiment of the present application is correspondingly disposed in one of the corner regions 101 a.
The substrate 101 includes four corner regions 101 a. It should be noted that the effect of avoiding the display panel 10 from breaking can be achieved only by disposing the stress blocking layer 103 in one of the corner regions 101 a.
Referring to fig. 6, fig. 6 is a sixth structural schematic diagram of a display panel according to an embodiment of the present disclosure. The display panel shown in fig. 6 is different from the display panel shown in fig. 5 in that: the stress barrier layer 103 is disposed correspondingly to the two diagonally disposed corner regions 101 a.
It should be noted that, the stress blocking layer 103 is correspondingly disposed in the two diagonally disposed corner regions 101a, so that the display panel 10 is ensured not to be broken in the diagonal region where the two diagonally disposed corner regions 101a are located, thereby achieving the effects of preventing the display panel 10 from cracking and improving the yield of the display panel 10.
Referring to fig. 7, fig. 7 is a seventh structural schematic diagram of a display panel according to an embodiment of the present disclosure. The display panel shown in fig. 7 is different from the display panel shown in fig. 5 in that: the stress barrier layers 103 are correspondingly arranged in the four corner regions 101 a.
It should be noted that chamfering is required at all the four corners of the display panel 10, and there is a possibility that cracks may occur in the regions where the four corners of the display panel 10 are located. Therefore, the stress barrier layers 103 are disposed on the four corner regions 101a of the substrate 101, so as to better prevent the display panel 10 from cracking and improve the yield of the display panel 10.
In the display panel provided by the embodiment of the application, the stress barrier layer is correspondingly arranged at the corner area of the substrate. Wherein, when carrying out the chamfer to display panel, there is the stress stack between base plate and the apron, the conduction of direction about stress can carry out with the form of ripples, and because the existence of stress barrier layer, stress can carry out separation and release in stress barrier layer department, prevent that stress from continuing to draw close to display panel is inside, thereby can effectively reduce the microcrack that break bar and display panel interact produced and expand along the direction of grinding, reach the effect of avoiding display panel to appear fracture phenomenon, the production of fracture has been avoided, and then display panel's yield has been improved.
The embodiment of the application also provides a manufacturing method of the display panel. Referring to fig. 8, fig. 8 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure. As shown in fig. 8, a method for manufacturing a display panel provided in the embodiment of the present application includes:
And 102, forming an adhesive layer and a stress barrier layer on the substrate, wherein the stress barrier layer is correspondingly arranged in the corner area.
In the packaging process of the display panel, the substrate and the cover plate need to be pressed together. Therefore, the stress barrier layer can be arranged on the substrate and also on the cover plate, and the stress barrier layer is in contact with the cover plate and the substrate only after being pressed.
Wherein, when the stress barrier layer is disposed on the cover plate, the stress barrier layer can be formed only by an exposure development process. When the stress barrier layer is disposed on the substrate, the stress barrier layer may be formed through an exposure development process, an inkjet printing process, and a nozzle spraying process.
The display panel has been described in detail in the above embodiments, and therefore, in the embodiments of the present application, the display panel is not described in detail.
In the method for manufacturing the display panel, the stress barrier layer is correspondingly arranged at the corner area of the substrate. Wherein, when carrying out the chamfer to display panel, there is the stress stack between base plate and the apron, the conduction of direction about stress can carry out with the form of ripples, and because the existence of stress barrier layer, stress can carry out separation and release in stress barrier layer department, prevent that stress from continuing to draw close to display panel is inside, thereby can effectively reduce the microcrack that break bar and display panel interact produced and expand along the direction of grinding, reach the effect of avoiding display panel to appear fracture phenomenon, the production of fracture has been avoided, and then display panel's yield has been improved.
The display panel and the manufacturing method of the display panel provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display panel, comprising:
a substrate having a corner region;
a cover plate disposed opposite to the base plate,
an adhesive layer disposed between the substrate and the cover plate;
the stress barrier layer is arranged between the substrate and the cover plate and correspondingly arranged in the corner area.
2. The display panel according to claim 1, wherein the stress barrier layer is correspondingly disposed in one of the corner regions.
3. The display panel according to claim 1, wherein the stress barrier layer is disposed in two diagonally disposed corner regions.
4. The display panel according to claim 1, wherein the stress barrier layers are correspondingly disposed at four corner regions.
5. The display panel of claim 1, wherein the stress barrier layer is spaced from the adhesive layer by a distance of 0 mm to 2 mm.
6. The display panel according to claim 1, wherein the stress barrier layer comprises a plurality of stress barrier points arranged at intervals, and the distance between two adjacent stress barrier points is equal.
7. The display panel according to claim 1, wherein the stress blocking point is shaped as a dot or a drop.
8. The display panel according to claim 1, wherein the material of the stress blocking point is an organic material.
9. The display panel according to claim 1, further comprising an array layer disposed between the adhesive layer and the substrate, wherein the stress barrier point is made of a material identical to that of the array layer.
10. A manufacturing method of a display panel is characterized by comprising the following steps:
providing a substrate and a cover plate, wherein the substrate is provided with an edge area;
forming an adhesive layer and a stress barrier layer on the substrate, wherein the stress barrier layer is correspondingly arranged in the corner area;
and pressing the substrate and the cover plate to form the display panel, wherein the substrate and the cover plate are arranged oppositely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111368842.9A CN114188285A (en) | 2021-11-18 | 2021-11-18 | Display panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111368842.9A CN114188285A (en) | 2021-11-18 | 2021-11-18 | Display panel and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114188285A true CN114188285A (en) | 2022-03-15 |
Family
ID=80540955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111368842.9A Pending CN114188285A (en) | 2021-11-18 | 2021-11-18 | Display panel and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114188285A (en) |
-
2021
- 2021-11-18 CN CN202111368842.9A patent/CN114188285A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1528594B1 (en) | Method for manufacturing semiconductor device | |
| KR100597928B1 (en) | Active matrix type display device and method of manufacturing the same | |
| CN103474583A (en) | Flexible display substrate, manufacturing method thereof and flexible display device | |
| US11139459B2 (en) | Display panel motherboard and method of manufacturing display panel motherboard | |
| CN104216153A (en) | Display panel and mother board thereof | |
| CN203503661U (en) | Flexible display substrate and flexible display device | |
| WO2015120655A1 (en) | Flexible display substrate and manufacturing method therefor | |
| CN111584516B (en) | Array substrate, preparation method thereof and display panel | |
| US20200006714A1 (en) | Display panel motherboards, display panels, and methods for manufacturing display panel | |
| CN111261643A (en) | Flexible display panel and preparation method | |
| KR20150065606A (en) | Manufacturing method of electronic device | |
| US20210175313A1 (en) | Organic light-emitting diode display panel | |
| JP4809600B2 (en) | Method for manufacturing semiconductor device | |
| JP4918985B2 (en) | Thin film device manufacturing method | |
| JP4097521B2 (en) | Method for manufacturing semiconductor device | |
| CN114188285A (en) | Display panel and manufacturing method thereof | |
| US20180190795A1 (en) | Array Substrate, Manufacturing Method Thereof, and Display Device | |
| JP5444648B2 (en) | Manufacturing method of semiconductor device | |
| EP3288079B1 (en) | Array substrate and preparation method therefor, display panel, and display device | |
| CN103681869A (en) | Thin film transistor substrate, manufacturing method for thin film transistor substrate, and display | |
| JP5172250B2 (en) | Semiconductor device, display device and manufacturing method thereof | |
| JP2002072905A (en) | Producing method of thin film laminated device and producing method of liquid crystal display element | |
| US20110309467A1 (en) | Semiconductor device and manufacturing method thereof | |
| CN113594384B (en) | Display panel, cutting panel and display device | |
| CN116940157A (en) | Display panel, manufacturing method thereof and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |