CN113594384B - Display panel, cutting panel and display device - Google Patents

Display panel, cutting panel and display device Download PDF

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Publication number
CN113594384B
CN113594384B CN202110739413.1A CN202110739413A CN113594384B CN 113594384 B CN113594384 B CN 113594384B CN 202110739413 A CN202110739413 A CN 202110739413A CN 113594384 B CN113594384 B CN 113594384B
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inorganic layer
area
display panel
substrate
edge
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CN113594384A (en
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高转
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Wuhan Tianma Microelectronics Co Ltd
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Wuhan Tianma Microelectronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application discloses a display panel, a cutting panel and a display device. The display panel of the embodiment of the application is provided with a display area, a packaging area and a forming area, wherein the packaging area is arranged around the display area, and the forming area is positioned on one side of the packaging area far away from the display area and is arranged around the packaging area. The display panel includes: a first substrate and a second substrate; the cushion metal is positioned in the packaging area and is arranged between the first substrate and the second substrate; the first inorganic layer is arranged between the second substrate and the cushion metal, and comprises a first edge which is positioned in the forming area; and the second inorganic layer is arranged between the second substrate and the first inorganic layer, the second inorganic layer comprises a main body part, a sealing edge part and an extending part which are sequentially arranged in the direction of the display area pointing to the forming area, the main body part covers the first inorganic layer, the sealing edge part is connected with the main body part and the extending part and wraps the first edge, and the extending part is at least positioned in the forming area. The embodiment of the application can improve the packaging performance and reduce the display problem.

Description

Display panel, cutting panel and display device
Technical Field
The application relates to the field of display, in particular to a display panel, a cutting panel and a display device.
Background
With the continuous development of display technology, the requirements of consumers on display panels are continuously improved, various display panels are layered endlessly, and rapid development is achieved, such as Liu Haibing, a notch screen, intelligent wearable equipment and the like.
In a display panel, a display panel packaging area is packaged by using a Frit, and the Frit is subjected to laser melting and solidification to be packaged, so that the Frit Metal (cushion Metal) is arranged in the packaging area for improving the utilization rate of laser and the melting uniformity of the Frit. After the display panel is cut, in order to avoid unfilled corners generated by cutting, edges are broken, grinding is carried out on cutting edges, however, the edge film layer is cracked due to stress generated by grinding, water and oxygen enter the film layer to cause corrosion of cushion metal, package failure is further caused for a long time, and display problems are caused.
Disclosure of Invention
The embodiment of the application provides a display panel, a cutting panel and a display device, which can improve packaging performance and reduce display problems.
In a first aspect, embodiments of the present application provide a display panel having a display area, a packaging area disposed around the display area, and a molding area disposed around the packaging area on a side of the packaging area away from the display area.
The display panel includes:
the first substrate and the second substrate are oppositely arranged;
the cushion metal is positioned in the packaging area and is arranged between the first substrate and the second substrate;
the first inorganic layer is arranged between the second substrate and the cushion metal, and comprises a first edge which is positioned in the forming area; and
the second inorganic layer is arranged between the second substrate and the first inorganic layer, the display area points to the forming area, the second inorganic layer comprises a main body part, a sealing edge part and an extending part which are sequentially arranged, the main body part is covered on the first inorganic layer, the sealing edge part is connected with the main body part and the extending part and wraps the first edge, and the extending part is at least positioned in the forming area.
In a second aspect, embodiments of the present application provide a cut panel comprising the display panel of the first aspect. The cutting panel further comprises a grinding stripping area, and the grinding stripping area is positioned on one side of the forming area far away from the packaging area.
In a third aspect, embodiments of the present application provide a display device, which includes the display panel of the first aspect.
In this application embodiment, the first inorganic layer can protect the cushion metal, and its first edge can block water oxygen, reduces the erosion of water oxygen to the cushion metal. The second inorganic layer covers the first inorganic layer and wraps around the first edge of the first inorganic layer, which is capable of blocking water oxygen from attacking the first inorganic layer and the underlying metal. The first inorganic layer and the second inorganic layer can carry out multilayer protection on the cushion metal, so that the erosion of water oxygen to the cushion metal is effectively reduced, and the packaging performance of the display panel is improved.
In the direction that the display area points to the forming area, the second inorganic layer is provided with an extension part at the outer side of the first inorganic layer, and the extension part is used for spacing a certain distance between the first edge of the first inorganic layer and the second edge, far away from the display area, of the forming area, namely, in the grinding process, the first inorganic layer cannot be directly ground by grinding equipment, so that the stress born by the first inorganic layer in the grinding process can be reduced, and the risk that cracks appear on the first edge of the first inorganic layer is reduced. In addition, the edge sealing part of the second inorganic layer wraps the first edge of the first inorganic layer, so that the second inorganic layer can limit and protect the first edge, and the risk of cracking of the first edge of the first inorganic layer is reduced. The first inorganic layer can block water and oxygen and reduce corrosion of water and oxygen to cushion metal, so that even if the second inorganic layer is cracked, the packaging performance of the display panel can be ensured.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which like or similar reference characters designate the same or similar features, and which are not to scale.
Fig. 1 is a schematic structural diagram of a display panel according to some embodiments of the present disclosure;
FIG. 2 is a schematic view of a portion of the display panel shown in FIG. 1 taken along line L1-L1;
FIG. 3 is a schematic view of a portion of the display panel of FIG. 1 taken along line L2-L2;
FIG. 4 is another partial cross-sectional schematic view of the display panel shown in FIG. 1 taken along line L1-L1;
FIG. 5 is a further schematic partial cross-sectional view of the display panel shown in FIG. 1 taken along line L1-L1;
FIG. 6 is a further schematic partial cross-sectional view of the display panel shown in FIG. 1 taken along line L1-L1;
fig. 7 is an enlarged schematic view of the display panel shown in fig. 1 at the circular frame S;
fig. 8 is another enlarged view of the display panel shown in fig. 1 at the circular frame S;
fig. 9 is a further enlarged schematic view of the display panel shown in fig. 1 at a circular frame S;
fig. 10 is a further enlarged schematic view of the display panel shown in fig. 1 at the circular frame S;
fig. 11 is another enlarged view of the display panel shown in fig. 1 at the circular frame S;
FIG. 12 is a schematic view of a cutting panel according to some embodiments of the present disclosure;
FIG. 13 is a schematic view in partial cross-section of the cutting panel shown in FIG. 12 taken along line L3-L3;
FIG. 14 is another partial cross-sectional schematic view of the cutting panel shown in FIG. 12 taken along line L3-L3;
fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
Features and exemplary embodiments of various aspects of the present application are described in detail below to make the objects, technical solutions and advantages of the present application more apparent, and to further describe the present application in conjunction with the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to explain the present application and are not configured to limit the present application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.
Fig. 1 is a schematic structural diagram of a display panel according to some embodiments of the present disclosure; FIG. 2 is a schematic view of a portion of the display panel shown in FIG. 1 taken along line L1-L1; FIG. 3 is a schematic partial cross-sectional view of the display panel of FIG. 1 taken along line L2-L2.
As shown in fig. 1 to 3, the embodiment of the present application provides a display panel. The display panel according to the embodiment of the present application may be an organic light emitting display panel (not shown in detail), wherein the organic light emitting display panel includes an anode and a cathode, and an organic light emitting layer between the anode and the cathode, and a voltage is applied between the anode and the cathode to excite carrier migration, and act on the light emitting layer, thereby emitting light. In other embodiments of the present application, the display panel may also be other display panels, such as a quantum dot light-emitting panel, a nano-wafer light-emitting display panel, and the like, which are not described herein.
The display panel of the embodiment of the application is provided with a display area AA, a packaging area B and a forming area C, wherein the packaging area B is arranged around the display area AA, and the forming area C is positioned on one side of the packaging area B away from the display area AA and is arranged around the packaging area B. The display area AA is an area of the display panel for displaying an image; the packaging area B is a non-display area of the display panel, surrounds the outer side of the display area AA, and mainly isolates the light-emitting device of the display area AA from the external environment so as to prevent intrusion of moisture, harmful gases (oxygen and the like), dust and rays, reduce external force damage, stabilize various parameters of the device and prolong the service life. The molding region C is a non-display region of the display panel, is disposed around the encapsulation region B, and is a portion remaining outside the encapsulation region B after the display panel is molded.
The display panel of the embodiment of the application comprises: a first substrate 1 and a second substrate 2, the first substrate 1 and the second substrate 2 being disposed opposite to each other; a cushion metal 3 located in the packaging region B and disposed between the first substrate 1 and the second substrate 2; a first inorganic layer 4 disposed between the second substrate 2 and the cushion metal 3, the first inorganic layer 4 including a first edge 41, the first edge 41 being located in the molding region C; and a second inorganic layer 5 disposed between the second substrate 2 and the first inorganic layer 4, wherein the second inorganic layer 5 includes a main body portion 51, a sealing portion 52 and an extension portion 53 sequentially disposed in a direction in which the display area AA points to the molding area C, the main body portion 51 covers the first inorganic layer 4, the sealing portion 52 connects the main body portion 51 and the extension portion 53 and wraps the first edge 41, and the extension portion 53 is at least located in the molding area C.
The first substrate 1 may be an array substrate, the second substrate 2 may be a cover substrate, and the above structures may be all disposed on the first substrate 1, which is not described in detail in this embodiment.
In some embodiments, the display panel further comprises an encapsulation layer 6, the encapsulation layer 6 being disposed between the first substrate 1 and the second substrate 2. The packaging layer 6 is mainly used for blocking water and oxygen in the display area AA, so that abnormal display caused by water and oxygen entering the display area AA is avoided. Illustratively, the encapsulation layer 6 may be a frit composition including a frit and additives for enhancing the sealing properties of the frit. At least part of the encapsulation layer 6 is located in the encapsulation zone B, and the encapsulation layer 6 is located in its entirety in the encapsulation zone B, for example.
Illustratively, the encapsulation layer 6 is located between the cushion metal 3 and the second substrate 2. When the display panel is packaged, the packaging layer 6 is melted by laser irradiation, and secondary irradiation is performed after reflection by the cushion metal 3, so that the melting of the packaging layer 6 is quickened, the packaging layer 6 is melted more fully, and the packaging efficiency and the packaging effect are improved. The pad metal 3 is exemplified as a metal material, may be formed of the same material as the gate electrode of the thin film transistor in the driving element of the display panel, may be formed of the same material as the source and drain electrodes of the thin film transistor, may be formed of a single Mo, ti/Al/Ti three-layer metal composite material, and in other embodiments, the pad metal 3 may be a material that reflects laser light and has a melting point higher than the melting temperature of the encapsulation material.
Optionally, the cushion metal 3 is entirely located in the encapsulation area B. The pad metal 3 may be flush with the boundary of the package region B in the direction in which the display region AA points to the package region B. The orthographic projection of the encapsulation layer 6 on the first substrate 1 is located within the orthographic projection of the cushion metal 3 on the first substrate 1.
The first inorganic layer 4 is an inorganic film layer in the array functional layer. The orthographic projection of the underlayer metal 3 on the first substrate 1 is located within the orthographic projection of the first inorganic layer 4 on the first substrate 1. The first inorganic layer 4 covers at least the blanket metal 3 and extends to the forming zone C. The first edge 41 is an edge of the first inorganic layer 4 in a direction in which the display area AA points to the molding area C.
The second inorganic layer 5 is an inorganic film layer in the array functional layer. Along the direction of the display area AA pointing to the molding area C, the main body portion 51, the edge sealing portion 52 and the extension portion 53 of the second inorganic layer 5 are a continuous whole, and are integrally molded. Wherein the main body portion 51 covers the first inorganic layer 4, the edge sealing portion 52 covers and wraps the first edge 41 of the first inorganic layer 4, and the extension portion 53 contacts the edge sealing portion 52 and extends to the molding area C. It will be appreciated that the front projection of the first inorganic layer 4 onto the first substrate 1 is located within the front projection of the second inorganic layer 5 onto the first substrate 1. The extension 53 is located outside the first inorganic layer 4 in a direction in which the display area AA points to the molding area C.
The molding zone C has a second edge C3 at the end remote from the encapsulation zone B.
In this embodiment, the first inorganic layer 4 covers the cushion metal 3 and wraps the edge of the cushion metal 3, so that the cushion metal 3 can be protected, and meanwhile, the first inorganic layer 4 extends to the first edge 41 of the forming area C to block water and oxygen, so that erosion of the water and oxygen to the cushion metal 3 is reduced. The second inorganic layer 5 covers the first inorganic layer 4 and wraps around the first edge 41 of the first inorganic layer 4, which is capable of blocking water oxygen from attacking the first inorganic layer 4 and the underlying metal 3. The first inorganic layer 4 and the second inorganic layer 5 can carry out multilayer protection on the cushion metal 3, so that the erosion of water oxygen to the cushion metal 3 is effectively reduced, and the packaging performance of the display panel is improved.
The display panel is typically made from a display panel master. The display panel mother board is provided with a plurality of display panels which are arranged in a matrix, and after the corresponding manufacturing process is finished, the display panel mother board is cut to obtain the required display panel with small size. In order to reduce unfilled corners and broken edges caused by cutting, grinding is carried out on the cutting edges; however, during the polishing process, the inorganic layer in the display panel may be subjected to lateral stress of a polishing apparatus (e.g., a polishing wheel), which may cause a risk of cracking of the inorganic layer.
In this embodiment of the present application, in the direction in which the display area AA points to the molding area C, the extension portion 53 is disposed on the outer side of the first inorganic layer 4, and the first edge 41 of the first inorganic layer 4 is spaced from the second edge C3 of the molding area C by a certain distance, that is, in the polishing process, the first inorganic layer 4 is not directly polished by the polishing apparatus, so that the stress suffered by the first inorganic layer 4 in the polishing process can be reduced, and the risk of cracking on the first edge 41 of the first inorganic layer 4 is reduced. In addition, since the edge sealing portion 52 of the second inorganic layer 5 wraps the first edge 41 of the first inorganic layer 4, the second inorganic layer 5 can restrict and protect the first edge 41, and reduce the risk of cracking of the first edge 41 of the first inorganic layer 4. The first inorganic layer 4 can block water oxygen and reduce corrosion of the cushion metal 3 by water oxygen, and thus, even if the second inorganic layer 5 is cracked, the packaging performance of the display panel can be ensured.
In some embodiments, the second inorganic layer 5 comprises a passivation layer.
In some embodiments, the display panel further includes a third inorganic layer 7, the third inorganic layer 7 is disposed between the first substrate 1 and the underlying metal 3, the extension 53 is located on a side of the third inorganic layer 7 away from the first substrate 1, and the extension 53 is in contact with at least a portion of the third inorganic layer 7.
The third inorganic layer 7 is an inorganic film layer in the array functional layer, and includes at least one of a buffer layer, a gate insulating layer, and an interlayer insulating layer. The buffer layer can enable the display panel to have certain toughness, and the shock resistance of the display panel is improved.
The third inorganic layer 7 is continuously provided on the first substrate 1. The orthographic projection of the underlayer metal 3 on the first substrate 1 is located within the orthographic projection of the third inorganic layer 7 on the first substrate 1. The extension 53 is formed at a portion of the third inorganic layer 7 located at the molding region C, that is, the extension 53 and the third inorganic layer 7 located at the molding region C are in contact with each other.
The third inorganic layer 7 and the second inorganic layer 5 are coated with the blanket metal 3 and the first inorganic layer 4 from both upper and lower sides, and at least portions of the extension 53 and the third inorganic layer 7 are contacted and bonded to seal the contact interface of the extension 53 and the third inorganic layer 7, thereby blocking water oxygen from corroding the blanket metal 3 and the first inorganic layer 4.
In some embodiments, the material of the second inorganic layer 5 is the same as the material of the third inorganic layer 7. Illustratively, the second inorganic layer 5 and the third inorganic layer 7 each comprise a silicon oxygen compound.
The material of the second inorganic layer 5 is the same as that of the third inorganic layer 7, and the bonding force between the two materials is large, so that the second inorganic layer 5 and the third inorganic layer 7 are not easy to peel off when being subjected to lateral stress of grinding equipment, thereby improving the packaging performance of the display panel.
The first inorganic layer 4 includes a first sub inorganic layer 42 and a second sub inorganic layer 43 disposed adjacently, and the material of the first sub inorganic layer 42 and the material of the second sub inorganic layer 43 are different. Illustratively, the first sub-inorganic layer 42 is an interlayer dielectric layer, the material of which includes silicon nitride, and the insulating interlayer includes silicon oxide and silicon nitride.
The bonding force between the first sub inorganic layer 42 and the second sub inorganic layer 43 is small, and if the first sub inorganic layer 42 or the second sub inorganic layer 43 is directly ground by the grinding apparatus, the first sub inorganic layer 42 and the second sub inorganic layer 43 are easily peeled off. In the embodiment of the application, the first sub-inorganic layer 42 and the second sub-inorganic layer 43 are spaced from the second edge C3 of the forming area C by a certain distance, so that the first sub-inorganic layer 42 and the second sub-inorganic layer 43 cannot be directly ground by the grinding device, and thus, the stress applied to the first sub-inorganic layer 42 and the second sub-inorganic layer 43 can be reduced, and the risk of peeling the first sub-inorganic layer 42 and the second sub-inorganic layer 43 is reduced. The second inorganic layer 5 can limit and protect the first and second sub inorganic layers 42 and 43, and block the first and second sub inorganic layers 42 and 43 from being peeled off, thereby improving the packaging performance of the display panel.
In some embodiments, the display panel further comprises a fourth inorganic layer 8, the fourth inorganic layer 8 being disposed between the third inorganic layer 7 and the spacer metal 3.
Referring to fig. 3, in some embodiments, the display panel further includes an active layer 9, a gate metal layer M1, an intermediate metal layer Mc, and a source drain metal layer M2. The first sub-inorganic layer 42 is an interlayer dielectric layer, the second sub-inorganic layer 43 is an insulating interlayer, the second inorganic layer 5 is a passivation layer, the third inorganic layer 7 is a buffer layer, and the fourth inorganic layer 8 is a gate insulating layer. In the display area AA, the third inorganic layer 7, the active layer 9, the fourth inorganic layer 8, the gate metal layer M1, the first sub-inorganic layer 42, the intermediate metal layer Mc, the second sub-inorganic layer 43, the source drain metal layer M2, and the second inorganic layer 5 are sequentially disposed in a direction away from the first substrate 1.
In some embodiments, the encapsulation region B includes a first flat region B1 and a first corner region B2 connected to the first flat region B1. The molding region C includes a second flat region C1 and a second corner region C2 connected to the second flat region C1. The second flat region C1 is located at a side of the first flat region B1 remote from the display region AA and is connected to the first flat region B1. The second corner region C2 is located at a side of the first corner region B2 remote from the display region AA and is connected to the first corner region B2.
Alternatively, the first corner region B2 and the second corner region C2 are each arc-shaped. At present, the rounding is a great trend of the display panel, meets aesthetic requirements of current and future masses, and meanwhile, the rounding design is also helpful for reducing stress of the packaging area B, and of course, the corner area of the packaging area B can also be in other shapes such as a polygon formed by surrounding a straight edge and an adjacent straight edge together, so that the display panel is not limited further.
In some embodiments, at least a portion of the first edge 41 is located at the second corner region C2.
The second corner region C2 may be manufactured by a grinding process. During the molding process, the grinding apparatus makes a plurality of reciprocations along the corners of the display panel to grind the second corner areas C2. That is, the second corner region C2 is subjected to a larger stress during the polishing process than the second straight region C1. In the embodiment of the present application, at least part of the first edge 41 is located in the second corner area C2, and the first edge 41 is spaced from the edge of the second corner area C2 away from the display area by a certain distance, so as to avoid that the grinding device directly grinds the first inorganic layer 4 in the process of grinding the second corner area C2.
Fig. 4 is another partial cross-sectional view of the display panel shown in fig. 1 taken along line L1-L1.
As shown in fig. 1 and 4, in some embodiments, the molding zone C has a second edge C3 at an end remote from the encapsulation zone B. The extending portion 53 and the second edge C3 have a first predetermined distance K1 in the direction in which the display area AA points to the molding area C.
The second edge C3 of the molding area C is formed after the display panel is subjected to a process such as cutting or grinding. Illustratively, the second edge C3 of the forming zone C is formed at least partially after grinding by the grinding apparatus.
In this embodiment, the extending portion 53 is spaced from the second edge C3 by a first preset distance K1, where the first preset distance K1 is a safe distance for grinding, that is, a distance from the grinding device to the second edge C3 during the grinding process of the second edge C3, and specific values are determined according to different devices, which is not limited herein. This can prevent the extension portion 53 from being directly ground by the grinding device, reduce the force applied to the extension portion 53, reduce the risk of cracking of the extension portion 53, and provide packaging performance
Fig. 5 is a further schematic partial cross-sectional view of the display panel shown in fig. 1 taken along line L1-L1.
As shown in fig. 1 and 5, in some embodiments, the extension 53 has a thinned portion 531 at least at an end remote from the main body portion 51, the thinned portion 531 having a thickness less than the thickness of the main body portion 51.
The grinding apparatus may grind the extension 53 during the molding process, subject to the accuracy of the apparatus. The polishing difficulty can be reduced and the stress acting on the second inorganic layer 5 can be reduced by providing the thinned portion 531.
Illustratively, the edge of the thinned portion 531 remote from the main body portion 51 is flush with the second edge C3.
The present application may partially thin the second inorganic layer 5 by an etching process to form the thinned portion 531.
In some embodiments, the extension 53 is entirely thinned 531, that is, the extension 53 is entirely thinner than the main body 51.
FIG. 6 is a further schematic partial cross-sectional view of the display panel shown in FIG. 1 taken along line L1-L1;
fig. 7 is an enlarged schematic view of the display panel shown in fig. 1 at the circular frame S; fig. 8 is another enlarged view of the display panel shown in fig. 1 at the circular frame S. Fig. 7 and 8 show only the extension 53 of the second inorganic layer 5, and the main body 51 and the edge seal 52 of the second inorganic layer 5 are omitted.
Referring to fig. 1, 6-8, in some embodiments, the extension 53 includes a plurality of spaced apart sub-extensions 532.
It will be appreciated that the plurality of sub-extensions 532 are not disposed in series. During the polishing process, the polishing apparatus may press the first substrate 1 and the second substrate 2 to some extent, resulting in a slight deformation of the edges of the first substrate 1 and the second substrate 2. If the extension 53 is continuously provided, stress is accumulated on the extension 53, causing a risk of cracking of the extension 53. By arranging the extension portion 53 as a plurality of spaced sub-extension portions 532, the transmission and accumulation of stress on the plurality of sub-extension portions 532 are reduced, thereby achieving the effect of releasing stress and reducing the risk of cracks extending to the edge sealing portion 52 and the main body portion 51.
The present embodiment may open the grooves 533 on the extension 53 through an etching process to form a plurality of sub-extensions 532 at intervals.
As shown in fig. 6 and 7, in some embodiments, the plurality of sub-extension portions 532 are sequentially arranged along the direction of the display area AA pointing to the molding area C, so that the transmission of stress to the encapsulation area B can be better blocked, the stress to the edge sealing portion 52 and the main body portion 51 of the second inorganic layer 5 and the first inorganic layer 4 can be reduced, and the risk of cracking can be reduced. Illustratively, each sub-extension 532 is strip-shaped and extends in the circumferential direction of the forming zone C.
In other embodiments, as shown in fig. 8, a plurality of sub-extensions 532 are arranged in sequence along the circumferential direction of the molding zone C, which may reduce the accumulation of stress in the circumferential direction of the molding zone C, reducing the risk of cracking.
Fig. 9 is a further enlarged schematic view of the display panel shown in fig. 1 at a circular frame S; fig. 10 is a further enlarged schematic view of the display panel shown in fig. 1 at the circular frame S; fig. 11 is another enlarged view of the display panel shown in fig. 1 at the circular frame S. Fig. 9, 10 and 11 are for illustrating the cushion metal 3 and the first inorganic layer 4, and other structures of the display panel are omitted.
Referring to fig. 1, 9 to 11, the encapsulation region B includes a first flat region B1 and a first corner region B2 connected to the first flat region B1. The pad metal 3 includes a first pad metal 31 and a second pad metal 32 disposed at intervals, the first pad metal 31 being located at the first corner region B2, and the second pad metal 32 being located at the first flat region B1. The first inorganic layer 4 fills the gap between the first pad metal 31 and the second pad metal 32.
According to the embodiment of the application, the first cushion metal 31 and the second cushion metal 32 are separated, so that even if the first cushion metal 31 is corroded by water and oxygen due to cracks caused by grinding, the first inorganic layer 4 filled between the first cushion metal 31 and the second cushion metal 32 can block the water and oxygen, and the water and oxygen are prevented from spreading to the second cushion metal 32, so that the packaging performance of the display panel is guaranteed.
In some embodiments, first blanket metal 31 comprises a plurality of separately disposed first subpad layer metals 311. Because the plurality of first subpad layer metals 311 are not disposed in series, when one of the first subpad layer metals 311 corrodes, only the first subpad layer metal 311 in question is affected and does not propagate to the adjacent other first subpad layer metals 311, further slowing the corrosion rate.
In some embodiments, as shown in fig. 10, a plurality of first subpad layer metals 311 are arranged along the radial direction of first corner region B2. That is, the plurality of first subpad layers are sequentially arranged along the direction of the display area AA toward the molding area C. The embodiment can better prevent corrosion from spreading to the inside of the display area AA, and further delay the corrosion rate.
In other embodiments, as shown in FIG. 11, a plurality of first subpad layer metals 311 are arranged along the circumference of first corner region B2. When one of the first subpad layer metals 311 corrodes, only the first subpad layer metal 311 in question is affected and does not propagate to the adjacent other first subpad layer metals 311, further slowing the corrosion rate.
FIG. 12 is a schematic view of a cutting panel according to some embodiments of the present disclosure; FIG. 13 is a schematic view in partial cross-section of the cutting panel shown in FIG. 12 taken along line L3-L3.
As shown in fig. 12 and 13, the embodiment of the present application also provides a cutting panel. The cut panel includes the display panel of any of the foregoing embodiments, which is used to manufacture the display panel.
The cut panel further includes a lapping peeling region D located at a side of the molding region C remote from the encapsulation region B.
The cut panel is a small-sized panel obtained by cutting the display panel master, and the abrasive peeling area D is an area that exists when the cut panel has not been abraded yet. After the grinding peeling region D of the cut panel is removed by the grinding process, the display panel can be manufactured.
During the grinding process, the first inorganic layer 4 is not directly ground by the grinding device, so that the stress to which the first inorganic layer 4 is subjected during the grinding process can be reduced, and the risk of cracking of the first edge 41 of the first inorganic layer 4 is reduced. In addition, since the edge sealing portion 52 of the second inorganic layer 5 wraps the first edge 41 of the first inorganic layer 4, the second inorganic layer 5 can restrict and protect the first edge 41, and reduce the risk of cracking of the first edge 41 of the first inorganic layer 4. The first inorganic layer 4 can block water oxygen and reduce corrosion of the cushion metal 3 by water oxygen, and thus, even if the second inorganic layer 5 is cracked, the packaging performance of the display panel can be ensured.
In some embodiments, the shaped region C includes a second flat region C1 and a second corner region C2 connected to the second flat region C1. The lapping peeling region D is located on the side of the second corner region C2 remote from the encapsulation region B. The present application removes the abrasive peeling region D by grinding so that the molding region C forms the second corner region C2.
At present, the rounding is a big trend of display panels, and the grinding stripping area D is removed by grinding, so that the rounding is formed at the corner of the display panel.
In some embodiments, at least a portion of extension 53 is located in abrasive stripping zone D. A portion of extension 53 is removed during grinding.
FIG. 14 is another partial cross-sectional schematic view of the cutting panel shown in FIG. 12 taken along line L3-L3.
Referring to fig. 12 and 14, in some embodiments, the abrasive stripping zone D has a third edge D1 on a side remote from the forming zone C. The third edge D1 is located at a side of the extension 53 away from the display area AA.
The extending portion 53 and the third edge D1 have a second predetermined distance K2 therebetween in the direction in which the display area AA points to the polishing-peeling area D. The second preset distance K2 is a safe distance for grinding, that is, a distance that the grinding device will not grind the extension 53 during the grinding process of the third edge D1, and specific values are determined according to different devices, which is not limited herein. Therefore, when the lapping peeling region D is lapped, the cutting stress applied to the extension 53 is small, and the cracking phenomenon is less likely to occur.
The third edge D1 is a cutting position of the display panel master. In the embodiment of the application, the third edge D1 is disposed on the side, away from the display area AA, of the extension portion 53, so that the extension portion 53 is spaced from the third edge D1, and therefore, when the display panel mother board is cut, the extension portion 53 does not need to be cut, cutting stress is reduced, and the risk of cracking of the film layer is reduced.
Fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present application.
As shown in fig. 15, the present application further provides a display device 100, which includes the display panel of any one of the foregoing embodiments. The display device 100 may be: smart wearable devices (e.g., smart wristwatches and VR devices), cell phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigator, and any other products or components with display functions. The implementation of the display device can be referred to the embodiment of the display panel, and the repetition is not repeated.
These embodiments are not all details described in detail in accordance with the embodiments described hereinabove, nor are they intended to limit the application to the specific embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various modifications as are suited to the particular use contemplated. This application is to be limited only by the claims and the full scope and equivalents thereof.

Claims (16)

1. A display panel having a display area, a packaging area and a molding area, the packaging area being disposed around the display area, the molding area being located on a side of the packaging area remote from the display area and disposed around the packaging area, the display panel comprising:
the device comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are oppositely arranged;
the cushion metal is positioned in the packaging area and is arranged between the first substrate and the second substrate;
the first inorganic layer is arranged between the second substrate and the cushion metal, and comprises a first edge, and the first edge is positioned in the forming area; and
the second inorganic layer is arranged between the second substrate and the first inorganic layer, the display area points to the forming area, the second inorganic layer comprises a main body part, an edge sealing part and an extending part which are sequentially arranged, the main body part is covered on the first inorganic layer, the edge sealing part is connected with the main body part and the extending part and wraps the first edge, and the extending part is at least positioned in the forming area.
2. The display panel of claim 1, wherein the molding region has a second edge at an end remote from the encapsulation region; the extending part and the second edge have a first preset distance in the direction that the display area points to the forming area.
3. The display panel according to claim 1, wherein the extension portion has a thinned portion at least at an end portion remote from the main body portion, the thinned portion having a thickness smaller than a thickness of the main body portion.
4. The display panel of claim 1, wherein the extension comprises a plurality of spaced apart sub-extensions.
5. The display panel according to claim 4, wherein a plurality of the sub-extensions are sequentially arranged along a direction in which the display area points to the molding area; or,
the plurality of sub-extensions are sequentially arranged along the circumferential direction of the molding zone.
6. The display panel of claim 1, further comprising a third inorganic layer disposed between the first substrate and the spacer metal, the extension being located on a side of the third inorganic layer away from the first substrate, the extension being in contact with at least a portion of the third inorganic layer.
7. The display panel according to claim 6, wherein a material of the second inorganic layer and a material of the third inorganic layer are the same.
8. The display panel according to claim 1, wherein the first inorganic layer includes a first sub inorganic layer and a second sub inorganic layer disposed adjacently, and a material of the first sub inorganic layer and a material of the second sub inorganic layer are different.
9. The display panel of claim 1, wherein the encapsulation region comprises a first flat region and a first corner region connected to the first flat region;
the pad metal comprises a first pad metal and a second pad metal which are arranged at intervals, the first pad metal is positioned in the first corner area, and the second pad metal is positioned in the first straight area;
the first inorganic layer fills a gap between the first pad layer metal and the second pad layer metal.
10. The display panel of claim 9, wherein the first spacer metal comprises a plurality of separately disposed first subpad layer metals;
a plurality of said first subpad layer metals being radially aligned along said first corner region; alternatively, a plurality of the first subpad layer metals are aligned circumferentially along the first corner region.
11. The display panel of claim 1, wherein the contoured region comprises a second flat region and a second corner region connected to the second flat region, at least a portion of the first edge being located in the second corner region.
12. A cut panel comprising the display panel of any one of claims 1-10;
the cutting panel further comprises a grinding stripping area, wherein the grinding stripping area is positioned on one side of the forming area, which is far away from the packaging area.
13. The cutting panel of claim 12, wherein the contoured region comprises a second flat region and a second corner region connected to the second flat region;
the lapping peeling region is located at a side of the second corner region remote from the encapsulation region.
14. The cutting panel of claim 12 or 13, wherein at least a portion of the extension is located in the abrasive stripping zone.
15. The cut panel of claim 14, wherein the abrasive stripping zone has a third edge on a side remote from the forming zone; the third edge is located at one side of the extension portion away from the display area.
16. A display device comprising the display panel of any one of claims 1-11.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108091675A (en) * 2017-12-13 2018-05-29 京东方科技集团股份有限公司 Display base plate and preparation method thereof
CN108649133A (en) * 2018-03-30 2018-10-12 上海天马微电子有限公司 Organic light emitting display panel, preparation method and organic light-emitting display device
CN109300913A (en) * 2018-09-27 2019-02-01 厦门天马微电子有限公司 Array substrate and display panel
CN109411623A (en) * 2018-09-30 2019-03-01 云谷（固安）科技有限公司 A kind of display panel
CN109671865A (en) * 2018-12-21 2019-04-23 厦门天马微电子有限公司 Display panel and display device
CN112467055A (en) * 2014-08-29 2021-03-09 三星显示有限公司 Display device and method for manufacturing the same
CN112614958A (en) * 2020-12-15 2021-04-06 厦门天马微电子有限公司 Display panel, cutting panel and display device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101907593B1 (en) * 2013-08-13 2018-10-15 삼성디스플레이 주식회사 Flexible display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112467055A (en) * 2014-08-29 2021-03-09 三星显示有限公司 Display device and method for manufacturing the same
CN108091675A (en) * 2017-12-13 2018-05-29 京东方科技集团股份有限公司 Display base plate and preparation method thereof
CN108649133A (en) * 2018-03-30 2018-10-12 上海天马微电子有限公司 Organic light emitting display panel, preparation method and organic light-emitting display device
CN109300913A (en) * 2018-09-27 2019-02-01 厦门天马微电子有限公司 Array substrate and display panel
CN109411623A (en) * 2018-09-30 2019-03-01 云谷（固安）科技有限公司 A kind of display panel
CN109671865A (en) * 2018-12-21 2019-04-23 厦门天马微电子有限公司 Display panel and display device
CN112614958A (en) * 2020-12-15 2021-04-06 厦门天马微电子有限公司 Display panel, cutting panel and display device

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