CN114178949A - Grinding robot device - Google Patents
Grinding robot device Download PDFInfo
- Publication number
- CN114178949A CN114178949A CN202110743545.1A CN202110743545A CN114178949A CN 114178949 A CN114178949 A CN 114178949A CN 202110743545 A CN202110743545 A CN 202110743545A CN 114178949 A CN114178949 A CN 114178949A
- Authority
- CN
- China
- Prior art keywords
- polishing
- workpiece
- holding
- tape
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims abstract description 169
- 230000007246 mechanism Effects 0.000 claims abstract description 87
- 238000003825 pressing Methods 0.000 claims abstract description 13
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 230000010485 coping Effects 0.000 abstract description 3
- 239000012636 effector Substances 0.000 abstract description 3
- 239000006061 abrasive grain Substances 0.000 description 15
- 238000007517 polishing process Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000003466 welding Methods 0.000 description 8
- 238000004804 winding Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 239000000314 lubricant Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- 210000000707 wrist Anatomy 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/005—Manipulators for mechanical processing tasks
- B25J11/0065—Polishing or grinding
Abstract
The present invention relates to a grinding robot apparatus. The end effector of the articulated robot is configured to employ a polishing unit, which is capable of coping with a plurality of types of objects, has higher versatility than a dedicated machine, and can ensure flexibility and expansion of use. The disclosed device is provided with: an articulated robot; a polishing unit which is attached to the distal end of the articulated robot and polishes a surface to be polished of a workpiece; and a synchronization control unit that synchronously controls the articulated robot and the polishing unit, wherein the polishing unit includes: a polishing tape for polishing a surface to be polished of the workpiece; a belt conveying mechanism that continuously or intermittently conveys the abrasive belt; and a pressing mechanism for pressing the polishing surface of the polishing tape against the polished surface of the workpiece.
Description
Technical Field
The present invention relates to a polishing robot device used for polishing the surface of a plate-like member such as a liquid crystal panel, a glass plate, a lens, a semiconductor wafer, a copper plate, a printed circuit board, a filter, or a stainless steel plate, or chamfering corner edges.
Background
Conventionally, as an apparatus for polishing a workpiece such as a glass plate or a semiconductor wafer, for example, a special machine having the following structure is known: a polishing tape is used in which fixed abrasive grains of a predetermined particle size such as alumina are bonded to a base material such as a polyester film.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 6673965
Patent document 2: japanese laid-open patent publication No. 11-99458
Patent document 3: japanese laid-open patent publication No. 11-99459
Disclosure of Invention
Technical problem to be solved by the invention
However, in the case of the above-described conventional structure, for example, there are the following disadvantages: it is not possible to flexibly cope with the kinds and specifications of various objects to be processed such as semiconductor wafers, liquid crystal panels, glass plates, lenses, copper plates, printed circuit boards, optical filters, and stainless steel plates, and thus flexibility and expansion of applications cannot be secured.
Means for solving the technical problem
The present invention is directed to overcome the above-described drawbacks, and an invention according to a first aspect of the present invention includes: an articulated robot; a polishing unit which is attached to the distal end of the articulated robot and polishes a surface to be polished of a workpiece; and a synchronization control unit that synchronously controls the articulated robot and the polishing unit, wherein the polishing unit includes: a polishing tape for polishing a surface to be polished of the workpiece; a belt conveying mechanism that continuously or intermittently conveys the abrasive belt; and a pressing mechanism for pressing the polishing surface of the polishing tape against the polished surface of the workpiece.
In addition, the invention according to a second aspect is characterized in that the articulated robot is a vertical articulated robot, in that the invention according to a third aspect is characterized in that the invention according to the fourth aspect is provided with a swing mechanism that swings the polishing tape in a tape width direction orthogonal to a tape transport direction, in that the pressure bonding mechanism is provided with a pressure bonding member capable of guiding the turning back of the polishing tape, and in that the invention according to the fifth aspect is characterized in that the polishing structure of the polishing unit is a dry structure or a wet structure.
A sixth aspect of the present invention is characterized by including: a holding section capable of holding and releasing the workpiece; and a synchronization control unit that performs synchronization control of the articulated robot, the polishing unit, and the holding unit.
In addition, according to a seventh aspect of the present invention, the holding portion includes: a holding member capable of holding the workpiece; and a holding mechanism capable of holding and releasing the workpiece, and the invention according to an eighth aspect is characterized in that a negative pressure suction mechanism is used as the holding mechanism, and the invention according to a ninth aspect is characterized in that the holding member is provided horizontally rotatably, a placement surface on which the workpiece can be placed is provided on an upper surface of the holding member, and a horizontal rotation mechanism for continuously or intermittently rotating the holding member is provided in the invention.
Effects of the invention
As described above, according to the present invention, in the first aspect of the present invention, a polishing unit that polishes a surface to be polished of a workpiece is attached to a distal end of an articulated robot, and the articulated robot and the polishing unit can be synchronously controlled by a synchronous control unit, and the surface to be polished of the workpiece can be polished by the polishing unit, the polishing unit including: a polishing tape for polishing a surface to be polished of the workpiece; a belt conveying mechanism that continuously or intermittently conveys the abrasive belt; and a pressure bonding structure for pressure bonding the polishing surface of the polishing tape to the surface to be polished of the workpiece, so that the workpiece can be polished by controlling the posture and position of the polishing unit at the tip of the articulated robot, conveying the polishing tape by the tape conveying mechanism, and pressure bonding the polishing surface of the polishing tape to the surface to be polished of the workpiece by the pressure bonding mechanism, and therefore, by adopting a structure in which the polishing unit is used as an end effector of the articulated robot, the polishing device can flexibly cope with various types or specifications of the workpiece, can cope with various types and has higher versatility than a dedicated machine, and can ensure flexibility and expansion of use, and further, the polishing unit includes the tape conveying mechanism and the pressure bonding mechanism, so that the workpiece can be polished by pressure bonding the polishing surface of the polishing tape to the surface to be polished of the workpiece, therefore, the grinding precision and the surface roughness of the grinding surface can be improved through the interaction between the transmission of the grinding belt and the pressure welding of the grinding belt, and good grinding processing can be carried out.
Further, in the invention according to the second aspect, since the articulated robot is a vertical articulated robot, the workability and flexibility of the polishing process can be improved by having a plurality of joints (axes) and connecting the joints and the links vertically in series, and moving the tip of the robot over a wide range in the vertical plane, and further, in the invention according to the third aspect, since the swing mechanism for swinging the polishing tape in the tape width direction orthogonal to the tape conveying direction is provided, the polishing tape can be swung in the tape width direction, and therefore, the polishing accuracy and the surface roughness of the polishing surface can be further improved by the interaction between the conveyance of the polishing tape, the pressure-bonding of the polishing tape, and the swing operation, and a good polishing process can be performed, in the invention according to the fourth aspect, since the pressure bonding means includes the pressure bonding member capable of guiding the abrasive tape to be folded back, the abrasive surface of the abrasive tape can be reliably pressed against the surface to be polished of the workpiece, and smooth and satisfactory polishing can be performed, and in the invention according to the fifth aspect, since the polishing structure of the polishing unit is a dry structure or a wet structure, a dry polishing structure in which a lubricant is not used and an abrasive tape having a structure in which abrasive grains are fixed to a base material can be selected depending on the material or specification of the workpiece, a wet polishing structure in which a lubricant is supplied and the abrasive grains are fixed to a base material and the polishing is performed using an abrasive tape having a structure in which abrasive grains are fixed to a base material, or a woven fabric, a nonwoven fabric, a foam film, a nonwoven fabric, or the like in which abrasive grains are not fixed to a base material, The flocked fabric is a wet polishing structure which is a polishing tape and supplies a polishing agent containing free abrasive grains, so that flexibility of polishing can be improved, and accordingly, good polishing can be performed.
In addition, in the invention according to the sixth aspect, the present invention includes: a holding section capable of holding and releasing the workpiece; and a synchronization control unit that performs synchronization control of the articulated robot, the polishing unit, and the holding unit, so that the workpiece can be reliably held and released by the holding unit, and the articulated robot, the polishing unit, and the holding unit can be synchronously controlled by the synchronization control unit, thereby performing a good polishing process.
In the seventh aspect of the present invention, the holding portion includes: a holding member capable of holding the workpiece; and a holding mechanism capable of holding and releasing the workpiece, whereby the workpiece can be held reliably by the holding member, and the workpiece can be held reliably and released reliably by the holding mechanism, whereby good grinding processing can be performed, and in the invention according to the eighth aspect, since the negative pressure suction mechanism is used as the holding mechanism, the workpiece can be held reliably on the holding member, and the structure of the holding mechanism can be simplified, and in the invention according to the ninth aspect, the holding member is provided horizontally rotatably, a placement surface on which the workpiece can be placed is provided on the upper surface of the holding member, and a horizontal rotation mechanism for rotating the holding member continuously or intermittently is provided in the invention, whereby in addition to various operations of the articulated robot, the flexibility of the polishing of the workpiece can be improved by the continuous or intermittent rotating operation of the holding member formed by the horizontal rotating mechanism, so that the polishing machine can flexibly cope with various types or specifications of the workpiece, can cope with various types of workpieces, has higher flexibility than a dedicated machine, and can ensure flexibility and expansion of applications.
Drawings
Fig. 1 is an exploded perspective view of an embodiment of the present invention.
Fig. 2 is a partial side sectional view of an embodiment of the present invention.
Fig. 3 is a partial front sectional view of an embodiment of the present invention.
Fig. 4 is a partial side sectional view of an embodiment of the present invention.
Fig. 5 is a partial side sectional view of an embodiment of the present invention.
Fig. 6 is a partial front sectional view of an embodiment of the present invention.
Fig. 7 is a partial top cross-sectional view of an embodiment of the invention.
Fig. 8 is a partial top cross-sectional view of an embodiment of the invention.
Fig. 9 is a partial perspective view of an embodiment of the present invention.
Fig. 10 is a side sectional view of a processed state of an embodiment of the present invention.
Fig. 11 is a side sectional view of a processed state of an embodiment of the present invention.
Fig. 12 is a side sectional view of a processed state of an embodiment of the present invention.
Fig. 13 is a front sectional view of a machined state of an embodiment of the present invention.
Fig. 14 is a front sectional view of a machined state of an embodiment of the present invention.
Fig. 15 is a front sectional view of a machined state of an embodiment of the present invention.
Fig. 16 is a front sectional view of a machined state of an embodiment of the present invention.
Description of the reference numerals
W … workpiece; w1… ground side; t … abrasive tape; t is1… grinding surface; t is2… belt conveying; a … articulated robot; b … grinding unit; b is1… a belt transport mechanism; b is2… crimping mechanism; b is3… crimping members; a C … holding part; a D … synchronization control unit; e … swing mechanism; f … crimping; h … swing action; 32 … holding member; 32a … carrying surface; 33 … holding mechanism; 33a … negative pressure adsorption mechanism; 34 … horizontal slewing mechanism.
Detailed Description
Fig. 1 to 16 show an embodiment of the present invention, and in this case, as shown in fig. 1 and 10, the present invention is roughly constituted by an articulated robot a and a surface to be polished W which is attached to the tip of the articulated robot a and polishes a workpiece W1The polishing unit B of (1) further includes a holding unit C capable of holding and releasing the workpiece W, and a synchronization control unit D for performing synchronization control of the articulated robot a, the polishing unit B, and the holding unit C. In this case, the articulated robot a and the holding part C are arranged to face the machine base 1.
In this case, as shown in fig. 2, 4, 9 and 10, the polishing unit B includes: a polishing tape T for polishing the polished surface W of the workpiece W1(ii) a Belt conveying mechanism B1A belt conveyor that continuously or intermittently conveys the abrasive belt T; and a pressure bonding mechanism B2Which makes the grinding surface T of the grinding belt T1Pressing F on the polished surface W of the workpiece W1The above.
In this case, the polishing tape T is a member obtained by coating or bonding fixed abrasive grains of a predetermined particle size such as alumina, chromium oxide, silicon carbide, and diamond on a base material such as a polyester film, a metal, a woven fabric, a foam film, and a flocked fabric. Further, it is possible to employ: the polishing tape T includes a polishing tape having a structure in which fixed abrasive grains are fixed to a base and a dry polishing structure using no lubricant, a wet polishing structure having a structure in which a polishing tape having a structure in which fixed abrasive grains are fixed to a base and polishing is performed while supplying a lubricant, or a wet polishing structure having a structure in which a polishing tape having no fixed abrasive grains is fixed to a base and a polishing agent containing free abrasive grains is supplied.
In this case, the articulated robot a is a vertical articulated robot. That is, as shown in fig. 1, the turning unit 2 turns around an axis J1 with respect to the main body 3, the lower arm 4 turns around an axis J2, the upper arm 5 turns around an axis J3 with respect to the lower arm 4, and the wrist 6 turns around an axis J4, an axis J5, and an axis J6 with respect to the upper arm 5, and the turning of the turning unit 2 and the turning of the lower arm 4, the upper arm 5, and the wrist 6 are performed by a plurality of servo motors, not shown, to form a so-called 6-axis vertical multi-joint robot.
In this case, as shown in fig. 3, 4, 6 and 7, the above-mentioned lapping tape T is wound around and conveyed to the belt T2A swing mechanism E for swinging the tape in a width direction perpendicular to the tape width direction, and a pressure bonding mechanism B for pressing the tape in the width direction of the tape as shown in FIGS. 3 and 42A pressure contact member B capable of guiding the turning back of the polishing tape T3Thereby forming the structure.
In this case, the belt transport mechanism B is provided1As shown in fig. 3, 4 and 5, the attachment member 7 of the polishing unit B is attached to the wrist portion 6 of the articulated robot a, the unwinding reel 8 and the winding reel 9 are rotatably disposed on the attachment member 7, the full reel 10 is attached to the unwinding reel 8, the empty reel 11 is attached to the winding reel 9, the polishing tape T drawn from the full reel 10 is wound onto the empty reel 11, as shown in fig. 3 and 5, the attachment member 7 is provided with an attachment plate 7a, the winding reel 9 and the empty reel 11 are wound and rotated by a winding motor 12 attached to the attachment plate 7a via a gear mechanism 13, the attachment member 7 is provided with a cover 13a of the gear mechanism 13, and the gear mechanism 13 is engaged with each other by the gear mechanism 13A combined gear 13b and a gear 13c, and as shown in fig. 8, the unwinding shaft 8 and the full reel 10 are unwound and rotated via the polishing tape T by the winding and rotation of the winding shaft 9 and the empty reel 11, and the polishing tape T is transported from the full reel 10 to the empty reel 11 toward the tape transport T in the arrow direction in fig. 3 by the rotation of the winding motor 122The direction is continuously or intermittently transferred, and the unwinding shaft 8 is applied with rotational resistance by the idle rotation preventing mechanism 14, in this case, the idle rotation preventing mechanism 14 is configured to: a friction member 15 is attached to the unwinding shaft 8, a tubular member 16 is attached to the attachment member 7, a spherical friction member 17, a spring 18 and a stopper screw 19 are incorporated in the tubular member 16, the friction member 17 is urged by the spring 18 against the surface of the friction member 15 to apply a rotational resistance to the friction member 15, so that a loosening phenomenon due to an accidental unwinding rotation of the polishing tape T is prevented, and a moderate tension is applied to the polishing tape T to improve the transfer T of the polishing tape T2Smoothing and transfer of T2Stability of (2).
In this case, as shown in fig. 3, 4, 6, and 7, the swing mechanism E is configured as follows: a holding and mounting member 20 is mounted on the mounting member 7, and a swinging member 21 is provided on the holding and mounting member 20 by a slide carriage 22 and a guide 23 so as to be conveyed T around the belt2The swing motion H is freely performed in the belt width direction orthogonal to the direction, a swing motor 24 is attached to the upper portion of the holding and attaching member 20, a drive shaft 25 is rotatably provided, the main shaft of the swing motor 24 and the drive shaft 25 are connected by a joint 26, an eccentric wheel mechanism 27 is interposed between the drive shaft 25 and the swing member 21, in this case, an eccentric shaft portion 25a is formed in the drive shaft 25, and the eccentric shaft portion 25a has a rotation axis O having an eccentric amount epsilon with respect to the rotation axis O of the drive shaft 251An eccentric 28 is rotatably provided on the eccentric shaft portion 25a, an engaging recess 21a is formed in the swinging member 21, a pair of mutually opposed contact surfaces 21b/21b which are brought into contact with the outer peripheral surface of the eccentric 28 are formed in the engaging recess 21a, and the swinging member 21 is caused to rotate about the belt width by the eccentric rotation of the eccentric 28 by the swinging motor 24The direction performs a swinging motion H.
In this case, the pressure bonding mechanism B is used as the pressure bonding mechanism B2As shown in fig. 3, 4 and 10, the following structure is provided: two cylinder portions 29/29 are arranged in parallel with the swing member 21, an advancing/retreating member 30 is bridged between the lower ends of the two plungers 29a/29a of the cylinder portion 29/29, and a pressure contact member B is provided on the advancing/retreating member 303The pressure-bonding member B3A pair of front and rear belt guides 31/31 for guiding both end surfaces of the polishing belt T are attached to the left and right of the advancing and retreating member 30, and the plungers 29a and 29a of the cylinder part 29/29 sandwich the pressure contact member B3Make the grinding surface T of the grinding belt T1Pressed against the polished surface W of the workpiece W1The above.
In this case, as shown in fig. 1 and 2, the holding portion C includes a holding member 32 capable of holding the workpiece W and a holding mechanism 33 capable of holding and releasing the workpiece W, and in this case, a negative pressure suction mechanism 33a is used as the holding mechanism 33, and in this case, the holding member 32 is provided to be horizontally rotatable, a placement surface 32a on which the workpiece W can be placed is provided on an upper surface of the holding member 32, and a horizontal rotation mechanism 34 for continuously or intermittently rotating the holding member 32 is provided.
That is, in this case, as shown in fig. 1 and 2, the horizontal turning mechanism 34 is configured as follows: a holding and mounting table 35 is attached to the machine base 1, a rotating shaft 36 is rotatably provided on the holding and mounting table 35 via a bearing 37, a driven pulley 38 is provided below the rotating shaft 36, a turning motor 39 is attached to the holding and mounting table 35, a driving pulley, not shown, is attached to a main shaft of the turning motor 39, a driving belt 40 is wound between the driving pulley and the driven pulley 38, the holding member 32 is attached to the rotating shaft 36, the holding member 32 is continuously or intermittently turned by the turning motor 39 via the driving belt 40, and the negative pressure suction mechanism 33a is configured as follows: an annular member 41 is fitted to the outer peripheral surface of the holding member 32, the annular member 41 is provided with a suction port portion 41a connected to a negative pressure source, not shown, and a suction passage 32b communicating the suction port portion 41a forming the annular member 41 and the holding member 32 is provided so as to be capable of holding and releasing the workpiece W placed on the placement surface 32a of the holding member 32 by suction or negative pressure release. In the above embodiment, the holding mechanism 33 is a negative pressure suction mechanism 33a using a negative pressure, but instead, a so-called mechanical and mechanical holding mechanism such as a clamping mechanism or a pressing mechanism may be used.
In this case, as shown in fig. 1, the synchronization control unit D is configured to perform synchronization control of the articulated robot a, the polishing unit B, and the holding unit C. The synchronization control is configured, for example, as follows: the present invention is characterized by comprising a control circuit for synchronizing operation control or feedback control of the articulated robot a, the polishing unit B, and the holding unit C, and for example, comprising a CPU, a ROM, a RAM, an HDD, and a computer or various circuits having an input/output port, and processing a program for setting an operation path such as the posture and position of a TCP (tool center point) of the articulated robot a to control the time of continuous or intermittent conveyance of the polishing tape T by the polishing unit B and the conveyance speed of the polishing tape T, and controlling the movement time, the movement speed, the interval time of intermittent rotation between rotation and stop of the rotation of the workpiece W, and the rotation speed of the workpiece W of the holding unit C by synchronizing the program.
Since the present embodiment has the above-described configuration, the surface W to be polished of the workpiece W is attached to the distal end of the articulated robot a as shown in fig. 1, 2, and 31The polishing unit B for polishing manually or automatically transfers the workpiece W to the holding part C, and the synchronous control part D synchronously controls the articulated robot A, the polishing unit B and the holding part C, so that the polishing unit B polishes the polished surface W of the workpiece W1The polishing unit B has a surface W to be polished for polishing the workpiece W1Continuously or intermittently, with a grinding belt TBelt conveying mechanism B for ground conveying grinding belt T1And a polishing surface T of the polishing tape T1Pressed against the polished surface W of the workpiece W1Upper pressure welding mechanism B2Therefore, the belt transport mechanism B can be controlled by controlling the posture and position of the polishing unit B at the tip of the articulated robot A1Conveying T of opposite grinding belt T2And a pressure-bonding mechanism B2The grinding surface T of the formed grinding belt T1A surface W to be polished of a workpiece W1The pressure contact F of (a) can be used to polish the workpiece W, and for example, as shown in fig. 10, the pressure contact mechanism B can be used to polish the surface of the workpiece W2Grinding surface T of grinding belt T1Pressing F on the polished surface W of the workpiece W1Up, by conveying T of the abrasive tape T2The composite operation of the pressure welding F of the polishing tape T and the moving operation of the front end of the articulated robot A utilizes the polishing surface T of the polishing tape T1To the polished surface W of the workpiece W1The polishing process is performed, and as shown in fig. 11, the chamfering polishing of the C-face of the corner edge of the workpiece W can be performed by the pressure bonding mechanism B2Grinding surface T of grinding belt T1Pressing F against the polished surface W of the workpiece W in an inclined state of substantially 45 DEG1Up, by conveying T of the abrasive tape T2The composite operation of the pressure welding F of the polishing tape T and the moving operation of the front end of the articulated robot A utilizes the polishing surface T of the polishing tape T1To the polished surface W of the workpiece W1The polishing process is performed, and as shown in fig. 12, in the chamfering polishing of the R-face of the corner edge of the workpiece W, the pressing mechanism B can be used2Grinding surface T of grinding belt T1Pressing F against the polished surface W of the workpiece W in an inclined state of substantially 45 DEG1In the above, the tip of the articulated robot A is made to perform a swing motion Y and conveyed by the polishing tape T2The pressure welding F of the polishing tape T and the combined action of the swing and movement actions of the front end of the articulated robot A utilize the polishing surface T of the polishing tape T1To the polished surface W of the workpiece W1Polishing is performed, and as shown in fig. 13, in polishing the end face of the workpiece W,can pass through the pressure-bonding mechanism B2Grinding surface T of grinding belt T1Pressing F on the polished surface W of the workpiece W1Up, by conveying T of the abrasive tape T2The composite operation of the pressure welding F of the polishing tape T and the moving operation of the front end of the articulated robot A utilizes the polishing surface T of the polishing tape T1To the polished surface W of the workpiece W1The polishing process is performed, and as shown in fig. 14, the chamfering polishing of the C-face of the corner edge of the workpiece W can be performed by the pressure bonding mechanism B2Grinding surface T of grinding belt T1Pressing F against the polished surface W of the workpiece W in an inclined state of substantially 45 DEG1Up, by conveying T of the abrasive tape T2The composite operation of the pressing contact F of the polishing tape T and the moving operation of the articulated robot A utilizes the polishing surface T of the polishing tape T1To the polished surface W of the workpiece W1The polishing process is performed, and as shown in fig. 15, in the chamfering polishing of the R-face of the corner edge of the workpiece W, the pressing mechanism B can be used2Grinding surface T of grinding belt T1Pressing F on the polished surface W of the workpiece W1Up, by conveying T of the abrasive tape T2The pressure welding F of the polishing tape T and the combined action of the swing action Y and the moving action of the front end of the articulated robot A utilize the polishing surface T of the polishing tape T1To the polished surface W of the workpiece W1The polishing process is performed, and as shown in fig. 16, the pressing mechanism B can be used to perform chamfering polishing of the end face and the R-face of both corner edges of the workpiece W2Grinding surface T of grinding belt T1Pressing F on the polished surface W of the workpiece W1Up, by conveying T of the abrasive tape T2The pressure welding F of the polishing tape T and the combined action of the swing action Y and the moving action of the front end of the articulated robot A utilize the polishing surface T of the polishing tape T1To the polished surface W of the workpiece W1In addition to the polishing process, since various polishing specifications can be selected, the end effector of the articulated robot a is configured to adopt the polishing unit B, so that it is possible to flexibly cope with various types or various specifications of the workpiece W, and it is possible to cope with various types and exclusive use of machinesThe polishing unit B has higher versatility, can ensure flexibility and expansion of application, and is provided with a belt conveying mechanism B1And a pressure bonding mechanism B2And thus can pass through the abrasive surface T of the abrasive tape T1A surface W to be polished of a workpiece W1The pressure contact F of (4) can be used to polish the workpiece W by conveying the polishing tape T2And the mutual action between the compression joints F of the grinding belt T, the grinding precision and the grinding surface T are improved1The surface roughness of the polishing pad enables a good polishing process.
In this case, since the articulated robot a is a vertical articulated robot as shown in fig. 1, the front end of the robot can be moved in a wide range in a vertical plane by a structure having a plurality of joints (axes) and connecting the joints and links vertically connected in series, and the workability and flexibility of the polishing process can be improved2Since the swing mechanism E performs the swing action H in the belt width direction orthogonal to the direction, the grinding belt T can be swung around the belt width direction H in addition to the processing state shown in fig. 10 to 16, and the grinding belt T can be conveyed T2The mutual action between the pressing F of the grinding belt T and the swinging action H further improves the grinding precision and the grinding surface T1Can be polished well, and in this case, as shown in fig. 3, the pressure contact mechanism B is provided with2A pressure contact member B capable of guiding the turning back of the polishing tape T3Thus enabling the polishing surface T of the polishing tape T1Reliably press-contacting F on the polished surface W of the workpiece W1In this case, since the polishing structure of the polishing unit B is a dry structure or a wet structure, a dry polishing structure using a polishing tape T having a structure in which the abrasive grains are fixed to the base material without using a lubricant, or a polishing tape T having a structure in which the abrasive grains are fixed to the base material can be selected according to the material of the workpiece W or the specification of the polishing processIn the wet polishing structure in which the polishing is performed while supplying the lubricant, or in which the polishing tape T is made of a woven fabric, a nonwoven fabric, a foam film, or a flocked fabric to which fixed abrasive grains are not fixed, and the polishing agent containing free abrasive grains is supplied, flexibility of polishing can be improved, and accordingly, good polishing can be performed.
In this case, as shown in fig. 1 and 2, since the holding unit C capable of holding and releasing the workpiece W and the synchronization control unit D that performs synchronization control of the articulated robot a, the polishing unit B, and the holding unit C are provided, the workpiece W can be held and released reliably by the holding unit C, and the articulated robot a, the polishing unit B, and the holding unit C can be controlled in synchronization by the synchronization control unit D, thereby performing good polishing.
In this case, as shown in fig. 1 and 2, since the holding portion C includes a holding member 32 capable of holding the workpiece W and a holding mechanism 33 capable of holding and releasing the workpiece W, the workpiece W can be reliably held by the holding member 32, and the workpiece W can be reliably held and released by the holding mechanism 33 on the holding member 32, so that good polishing processing can be performed, and in this case, since the negative pressure suction mechanism 33a is used as the holding mechanism 33 as shown in fig. 2, the workpiece W can be reliably held on the holding member 32, and the structure of the holding mechanism 33 can be simplified, and in this case, since the holding member 32 is horizontally rotatably provided as shown in fig. 2, a placement surface 32a on which the workpiece W can be placed is provided on the upper surface of the holding member 32, further, since the horizontal turning mechanism 34 for continuously or intermittently turning the holding member 32 is provided, the flexibility of the polishing process of the workpiece W can be improved by the continuous or intermittent turning operation of the holding member 32 by the horizontal turning mechanism 34 in addition to the various operations of the articulated robot a, and the flexibility and the expansion of the application can be secured by coping with various types or specifications of the workpiece W, coping with various types and having higher versatility than a dedicated machine.
The present invention is not limited to the above-described embodiments, but includes an articulated robot a, a polishing unit B, and a belt transport mechanism B1And a pressure bonding mechanism B2Pressure-bonding member B3The holding unit C, the synchronization control unit D, the swing mechanism E, the holding member 32, the placement surface 32a, the holding mechanism 33, the negative pressure suction mechanism 33a, the horizontal turning mechanism 34, and the like can be designed by appropriately changing the material, structure, and the like of the polishing tape T.
In view of the above, the intended object can be fully achieved.
Claims (9)
1. A polishing robot device is characterized by comprising:
an articulated robot;
a polishing unit attached to a distal end of the articulated robot and configured to polish a surface to be polished of a workpiece; and
a synchronous control unit for synchronously controlling the articulated robot and the polishing unit,
the polishing unit includes:
a polishing tape configured to polish a polished surface of the workpiece;
a belt conveying mechanism that continuously or intermittently conveys the abrasive belt; and
and a pressing mechanism for pressing the polishing surface of the polishing tape against the surface to be polished of the workpiece.
2. The grinding robot device according to claim 1,
the articulated robot is a vertical articulated robot.
3. The grinding robot device according to claim 1,
the polishing robot device includes a swing mechanism that swings the polishing tape in a tape width direction orthogonal to a tape conveying direction.
4. The grinding robot device according to claim 1,
the pressure bonding mechanism is provided with a pressure bonding member capable of guiding the turning back of the polishing tape.
5. The grinding robot device according to claim 1,
the grinding structure of the grinding unit is a dry structure or a wet structure.
6. The polishing robot apparatus according to claim 1, characterized in that the polishing robot apparatus comprises:
a holding section capable of holding and releasing the workpiece; and
and a synchronization control unit that performs synchronization control of the articulated robot, the polishing unit, and the holding unit.
7. The grinding robot device according to claim 6,
the holding portion includes:
a holding member capable of holding the workpiece; and
and a holding mechanism capable of holding and releasing the workpiece.
8. The grinding robot device according to claim 7,
a negative pressure adsorption mechanism is used as the holding mechanism.
9. The grinding robot device according to claim 7,
the holding member is provided to be horizontally rotatable, a mounting surface on which a workpiece can be mounted is provided on an upper surface of the holding member, and the polishing robot device is provided with a horizontal rotation mechanism that continuously or intermittently rotates the holding member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-140736 | 2020-08-24 | ||
| JP2020140736A JP7111778B2 (en) | 2020-08-24 | 2020-08-24 | Polishing robot device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114178949A true CN114178949A (en) | 2022-03-15 |
| CN114178949B CN114178949B (en) | 2024-02-06 |
Family
ID=80493509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110743545.1A Active CN114178949B (en) | 2020-08-24 | 2021-06-30 | Grinding robot device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7111778B2 (en) |
| CN (1) | CN114178949B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114670110A (en) * | 2022-04-13 | 2022-06-28 | 蓝思智能机器人(长沙)有限公司 | Polishing wheel assembly and polishing machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09248752A (en) * | 1996-03-11 | 1997-09-22 | Sanshin:Kk | Polishing method for flattening device wafer surface, and device therefor |
| JP2004314200A (en) * | 2003-04-11 | 2004-11-11 | Yaskawa Electric Corp | Automated polishing apparatus |
| JP2017124484A (en) * | 2016-01-12 | 2017-07-20 | 中村留精密工業株式会社 | Grinding-polishing composite processing device, and polishing device |
| WO2018211736A1 (en) * | 2017-05-15 | 2018-11-22 | 株式会社 荏原製作所 | Polishing apparatus and polishing method |
| CN110091237A (en) * | 2018-01-31 | 2019-08-06 | 株式会社三信 | Worm screw grinding method and worm screw grinding device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196962A (en) * | 1982-05-11 | 1983-11-16 | Matsushita Electric Ind Co Ltd | Device for grinding the surface of thin plate |
| JP6914078B2 (en) * | 2017-03-31 | 2021-08-04 | 株式会社荏原製作所 | Vacuum suction pad and substrate holding device |
| JP2019000913A (en) * | 2017-06-12 | 2019-01-10 | 日本省力機械株式会社 | Grinding device |
-
2020
- 2020-08-24 JP JP2020140736A patent/JP7111778B2/en active Active
-
2021
- 2021-06-30 CN CN202110743545.1A patent/CN114178949B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09248752A (en) * | 1996-03-11 | 1997-09-22 | Sanshin:Kk | Polishing method for flattening device wafer surface, and device therefor |
| JP2004314200A (en) * | 2003-04-11 | 2004-11-11 | Yaskawa Electric Corp | Automated polishing apparatus |
| JP2017124484A (en) * | 2016-01-12 | 2017-07-20 | 中村留精密工業株式会社 | Grinding-polishing composite processing device, and polishing device |
| WO2018211736A1 (en) * | 2017-05-15 | 2018-11-22 | 株式会社 荏原製作所 | Polishing apparatus and polishing method |
| CN110091237A (en) * | 2018-01-31 | 2019-08-06 | 株式会社三信 | Worm screw grinding method and worm screw grinding device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114670110A (en) * | 2022-04-13 | 2022-06-28 | 蓝思智能机器人(长沙)有限公司 | Polishing wheel assembly and polishing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022036498A (en) | 2022-03-08 |
| CN114178949B (en) | 2024-02-06 |
| JP7111778B2 (en) | 2022-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114178949A (en) | Grinding robot device | |
| JP6851068B2 (en) | Grinding / polishing combined processing equipment and polishing equipment | |
| JP7284852B2 (en) | polishing unit | |
| JPH081494A (en) | Wafer material edge end part polishing device | |
| JP7466029B2 (en) | Plate-shaped member polishing method and device | |
| JPH1199458A (en) | Plate-like member corner edge chamfering device | |
| JP7066805B1 (en) | Polishing unit | |
| JP6518206B2 (en) | Inner surface polishing machine | |
| TW493228B (en) | Polishing pad component exchange device and polishing pad component exchange method | |
| JPH02131857A (en) | Automatic polishing device | |
| JP2857817B2 (en) | Glass substrate square edge polishing machine | |
| JP2002126981A (en) | Disc member peripheral portion grinding device | |
| JP2021077763A (en) | Processing device and carry-in/out method of plate-like work-piece | |
| JP2002066895A (en) | Polishing machine | |
| JP4687285B2 (en) | Polishing processing method and polishing processing apparatus | |
| JP2001259995A (en) | Buffing device, buffing system and buffing method | |
| CN218801336U (en) | Polishing system | |
| JP5532464B2 (en) | Polishing equipment | |
| JPH1199459A (en) | Plate-like member corner edge chamfering device | |
| JP2666447B2 (en) | Polishing equipment | |
| TWM586653U (en) | Chamfering and grinding device | |
| JPS62255059A (en) | Back damage device | |
| JPH06226602A (en) | Polishing method | |
| JP2005305609A (en) | Lapping machine | |
| JPH06304855A (en) | Glass plate corner edge chamfering device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |