CN114178431A - Method for forming mos tube by using adjustable clamp - Google Patents
Method for forming mos tube by using adjustable clamp Download PDFInfo
- Publication number
- CN114178431A CN114178431A CN202111679027.4A CN202111679027A CN114178431A CN 114178431 A CN114178431 A CN 114178431A CN 202111679027 A CN202111679027 A CN 202111679027A CN 114178431 A CN114178431 A CN 114178431A
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- Prior art keywords
- forming
- mos tube
- bending
- length
- sliding module
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000005452 bending Methods 0.000 claims abstract description 47
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention relates to a method for forming a mos tube by using an adjustable clamp, which comprises the following steps: clamping a device to be formed on a forming clamp; adjusting the relative position of a forming clamp according to the size of the mos tube body, and fixing a device to be formed; determining the bending direction and the bending position of the pin according to the length of the pin of the device to be formed and the size of a printed board bonding pad, and adjusting the bending angle and the length of a bending point; rotating the forming handle to bend and form the device to be formed; checking the surface burrs and the surface precision of the finished device obtained in the step S4; and then checking the dimensional accuracy of the finished device. The invention can realize the purpose of forming mos tubes with different sizes, is convenient for forming at an expected position, improves the forming efficiency of products, and ensures the consistency of the forming size and the yield.
Description
Technical Field
The invention relates to the technical field, in particular to a method for forming a mos tube by using an adjustable clamp.
Background
The MOS transistor has a tendency to gradually replace a triode in an integrated circuit by virtue of advantages of low power consumption, stable performance, strong radiation resistance, and the like.
Along with the function of electronic products is more and more complicated, the application of MOS pipe product is gradually increased, and in the trade, traditional shaping mode is to use no tooth sharp-nosed pliers to take shape the device, and is fast, and the quality is difficult for the management and control, is difficult to satisfy large batch device and takes shape the requirement.
Disclosure of Invention
The applicant aims at the defects in the prior art and provides a method for forming a mos tube by using an adjustable clamp, which is reasonable in structure, and the bending position of the mos tube is adjusted by using a clamp with adjustable size, so that the quality control is improved, and the method is suitable for large-batch device production.
The technical scheme adopted by the invention is as follows:
a method of forming a mos tube using an adjustable clamp, comprising the steps of:
s1: clamping a device to be formed on a forming clamp;
s2: adjusting the relative position of a forming clamp according to the size of the mos tube body, and fixing a device to be formed;
s3: determining the bending direction and the bending position of the pin according to the length of the pin of the device to be formed and the size of a printed board bonding pad, and adjusting the bending angle and the length of a bending point;
s4: rotating the forming handle to bend and form the device to be formed;
s5: checking the surface burrs and the surface precision of the finished device obtained in the step S4; and then checking the dimensional accuracy of the finished device.
In S3, two pins at two sides of the mos tube respectively have at least two bending points, and the bending directions of adjacent bending points are opposite.
The pins with the two bending points are equally divided into three sections by the two bending points, wherein the bending angle of the bending point close to the mos tube main body is smaller than or equal to the bending angle of the other bending point.
The round angle transition setting of the bending point on one side of the pin, which deviates from the mos tube main body.
In S5, the specific steps of checking the dimensional accuracy are: and inserting the finished device into the corresponding hole of the printed board, and if the finished device can be matched with the hole of the printed board, meeting the precision requirement.
The forming jig in S1 includes: the device comprises a width sliding module which relatively moves in the horizontal direction, a length sliding module which moves perpendicular to the width sliding module, and a length fixing module which is arranged in the length sliding module in a penetrating mode, wherein an area for placing a device to be formed is arranged between the length fixing module and the length sliding module.
The width sliding modules are symmetrically arranged on two sides of the length sliding module.
The length sliding module is wedge-shaped, and the small end of the length sliding module faces to the position between the two width sliding modules.
One side of the length fixing module, which is far away from the length sliding module, is provided with a baffle perpendicular to the self sliding direction.
The invention has the following beneficial effects:
the invention has compact and reasonable structure and convenient operation, can realize the purpose of forming mos tubes with different sizes by designing a special fixture tool, is convenient to form at an expected position, improves the forming efficiency of products, and ensures the consistency of the forming size and the yield.
The invention replaces the forming method of the toothless sharp-nose pliers commonly used in the original industry, has small local damage to the device to be formed and improves the surface precision of the formed device.
Drawings
Fig. 1 shows a jig used in the present invention.
Wherein: 1. a width slippage module; 2. a length slippage module; 3. a length fixing module;
301. and a baffle plate.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
The method of forming a mos tube using an adjustable clamp of this embodiment includes the steps of:
s1: clamping a device to be formed on a forming clamp;
s2: adjusting the relative position of a forming clamp according to the size of the mos tube body, and fixing a device to be formed;
s3: determining the bending direction and the bending position of the pin according to the length of the pin of the device to be formed and the size of a printed board bonding pad, and adjusting the bending angle and the length of a bending point;
s4: rotating the forming handle to bend and form the device to be formed;
s5: checking the surface burrs and the surface precision of the finished device obtained in the step S4; and then checking the dimensional accuracy of the finished device.
In S3, two pins at two sides of the mos tube respectively have at least two bending points, and the bending directions of adjacent bending points are opposite.
The pins with the two bending points are equally divided into three sections by the two bending points, wherein the bending angle of the bending point close to the mos tube main body is smaller than or equal to the bending angle of the other bending point.
The round angle transition setting of the bending point on one side of the pin, which deviates from the mos tube main body.
In S5, the specific steps of checking the dimensional accuracy are: and inserting the finished device into the corresponding hole of the printed board, and if the finished device can be matched with the hole of the printed board, meeting the precision requirement.
As shown in fig. 1, the forming jig in S1 includes: the device comprises a width sliding module 1 which relatively moves in the horizontal direction, a length sliding module 2 which moves perpendicular to the width sliding module 1, and a length fixing module 3 which is arranged in the length sliding module 2 in a penetrating mode, wherein an area for placing a device to be formed is arranged between the length fixing module 3 and the length sliding module 2.
The width sliding module 1 is symmetrically arranged at two sides of the length sliding module 2.
The length sliding module 2 is wedge-shaped, and the small end of the length sliding module faces to the position between the two width sliding modules 1.
One side of the length fixing module 3 departing from the length sliding module 2 is provided with a baffle 301 vertical to the self sliding direction.
The specific structure and working process of the embodiment are as follows:
as shown in fig. 1, the forming jig used in the present invention includes a width sliding module 1 for the left and right blocks, a length sliding module 2 for the upper wedge, and the width sliding module 1 and the length sliding module 2 move to clamp the middle mold and perform the functions of limiting and pressurizing the mold. After the relative positions of the width sliding module 1 and the length sliding module 2 are determined, the length fixing module 3 is matched, when the length fixing module 3 and the length sliding module 2 move relatively, the distance between the baffle 101 and the length sliding module 2 is increased or decreased, and when the distance is decreased to the state that the forming die is completely pressed and matched, the product is punched and shaped.
Before stamping, parameters of all the clamps of the batch are determined, and the parameters are determined according to the sizes of the devices to be formed and the printed board pads.
The forming handle mentioned in this embodiment is for clamping and pressing the stamping die, and the stamping die in the market is provided with a pressing handle, which is not described herein again.
The invention aims to improve the yield of products, and when the products are produced in large scale, the consistency of the products is high, thereby reducing the production cost.
The above description is intended to be illustrative and not restrictive, and the scope of the invention is defined by the appended claims, which may be modified in any manner within the scope of the invention.
Claims (9)
1. A method of forming a mos tube using an adjustable clamp, comprising the steps of:
s1: clamping a device to be formed on a forming clamp;
s2: adjusting the relative position of a forming clamp according to the size of the mos tube body, and fixing a device to be formed;
s3: determining the bending direction and the bending position of the pin according to the length of the pin of the device to be formed and the size of a printed board bonding pad, and adjusting the bending angle and the length of a bending point;
s4: rotating the forming handle to bend and form the device to be formed;
s5: checking the surface burrs and the surface precision of the finished device obtained in the step S4; and then checking the dimensional accuracy of the finished device.
2. The method of forming a mos tube using the adjustable clamp of claim 1, wherein: in S3, two pins at two sides of the mos tube respectively have at least two bending points, and the bending directions of adjacent bending points are opposite.
3. The method of forming a mos tube using the adjustable clamp of claim 2, wherein: the pins with the two bending points are equally divided into three sections by the two bending points, wherein the bending angle of the bending point close to the mos tube main body is smaller than or equal to the bending angle of the other bending point.
4. A method of forming a mos tube using the adjustable clamp of claim 3, wherein: the round angle transition setting of the bending point on one side of the pin, which deviates from the mos tube main body.
5. The method of forming a mos tube using the adjustable clamp of claim 1, wherein: in S5, the specific steps of checking the dimensional accuracy are: and inserting the finished device into the corresponding hole of the printed board, and if the finished device can be matched with the hole of the printed board, meeting the precision requirement.
6. The method of forming a mos tube using the adjustable clamp of claim 1, wherein: the forming jig in S1 includes: the device comprises a width sliding module (1) which relatively moves in the horizontal direction, a length sliding module (2) which moves perpendicular to the width sliding module (1), and a length fixing module (3) which is arranged in the length sliding module (2) in a penetrating mode, wherein an area for placing a device to be formed is arranged between the length fixing module (3) and the length sliding module (2).
7. The method of forming a mos tube using the adjustable clamp of claim 7, wherein: the width sliding module (1) is symmetrically arranged on two sides of the length sliding module (2).
8. The method of forming a mos tube using the adjustable clamp of claim 7, wherein: the length sliding module (2) is wedge-shaped, and the small end of the length sliding module faces to the position between the two width sliding modules (1).
9. The method of forming a mos tube using the adjustable clamp of claim 8, wherein: one side of the length fixing module (3) departing from the length sliding module (2) is provided with a baffle (301) perpendicular to the self sliding direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111679027.4A CN114178431A (en) | 2021-12-31 | 2021-12-31 | Method for forming mos tube by using adjustable clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111679027.4A CN114178431A (en) | 2021-12-31 | 2021-12-31 | Method for forming mos tube by using adjustable clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114178431A true CN114178431A (en) | 2022-03-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111679027.4A Pending CN114178431A (en) | 2021-12-31 | 2021-12-31 | Method for forming mos tube by using adjustable clamp |
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| Country | Link |
|---|---|
| CN (1) | CN114178431A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204075019U (en) * | 2014-08-26 | 2015-01-07 | 广运科技（苏州）有限公司 | A kind of electronic devices and components cut pin tool |
| CN106449429A (en) * | 2016-10-26 | 2017-02-22 | 北京北广科技股份有限公司 | A MOS pin shaping apparatus |
| CN207592676U (en) * | 2017-12-23 | 2018-07-10 | 石家庄迪龙科技有限公司 | A kind of metal-oxide-semiconductor foot device |
| CN208906278U (en) * | 2018-09-21 | 2019-05-28 | 重庆三安自动化设备有限公司 | One kind being used for the molding mold of metal-oxide-semiconductor |
| CN208960851U (en) * | 2018-09-29 | 2019-06-11 | 武汉力行远方电源科技有限公司 | A kind of metal-oxide-semiconductor pin apparatus for bending |
| CN210450714U (en) * | 2019-08-20 | 2020-05-05 | 西安天宇卓越电子科技有限公司 | Electronic components pin crib crimper |
| CN211027853U (en) * | 2019-09-09 | 2020-07-17 | 贵州航天电子科技有限公司 | Pin bending clamp for axial insertion component |
| CN211789085U (en) * | 2020-05-18 | 2020-10-27 | 深圳南丰电子股份有限公司 | Diode fixing device for LED lamp |
| CN113020479A (en) * | 2021-02-08 | 2021-06-25 | 张香爱 | Resistor pin bending device with adjusting function |
| CN213530565U (en) * | 2020-11-04 | 2021-06-25 | 南昌明泰电子科技有限公司 | Automatic bending machine for MOS (metal oxide semiconductor) tube of motor controller of electric vehicle |
| CN214814379U (en) * | 2021-06-29 | 2021-11-23 | 广东科信电子有限公司 | Forming device of field effect transistor pin |
-
2021
- 2021-12-31 CN CN202111679027.4A patent/CN114178431A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204075019U (en) * | 2014-08-26 | 2015-01-07 | 广运科技（苏州）有限公司 | A kind of electronic devices and components cut pin tool |
| CN106449429A (en) * | 2016-10-26 | 2017-02-22 | 北京北广科技股份有限公司 | A MOS pin shaping apparatus |
| CN207592676U (en) * | 2017-12-23 | 2018-07-10 | 石家庄迪龙科技有限公司 | A kind of metal-oxide-semiconductor foot device |
| CN208906278U (en) * | 2018-09-21 | 2019-05-28 | 重庆三安自动化设备有限公司 | One kind being used for the molding mold of metal-oxide-semiconductor |
| CN208960851U (en) * | 2018-09-29 | 2019-06-11 | 武汉力行远方电源科技有限公司 | A kind of metal-oxide-semiconductor pin apparatus for bending |
| CN210450714U (en) * | 2019-08-20 | 2020-05-05 | 西安天宇卓越电子科技有限公司 | Electronic components pin crib crimper |
| CN211027853U (en) * | 2019-09-09 | 2020-07-17 | 贵州航天电子科技有限公司 | Pin bending clamp for axial insertion component |
| CN211789085U (en) * | 2020-05-18 | 2020-10-27 | 深圳南丰电子股份有限公司 | Diode fixing device for LED lamp |
| CN213530565U (en) * | 2020-11-04 | 2021-06-25 | 南昌明泰电子科技有限公司 | Automatic bending machine for MOS (metal oxide semiconductor) tube of motor controller of electric vehicle |
| CN113020479A (en) * | 2021-02-08 | 2021-06-25 | 张香爱 | Resistor pin bending device with adjusting function |
| CN214814379U (en) * | 2021-06-29 | 2021-11-23 | 广东科信电子有限公司 | Forming device of field effect transistor pin |
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