CN207592676U - A kind of metal-oxide-semiconductor foot device - Google Patents
A kind of metal-oxide-semiconductor foot device Download PDFInfo
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- CN207592676U CN207592676U CN201721821505.XU CN201721821505U CN207592676U CN 207592676 U CN207592676 U CN 207592676U CN 201721821505 U CN201721821505 U CN 201721821505U CN 207592676 U CN207592676 U CN 207592676U
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Abstract
The utility model is related to a kind of metal-oxide-semiconductor foot device, including：Trough, lower platen cylinder, pushes module, pushes module fixed plate and pushes module cylinder lower platen；The trough is used to place metal-oxide-semiconductor tube body, and metal-oxide-semiconductor stitch is stretched out from trough side, the lower platen is set to the top of trough, the lower platen cylinder is connect with lower platen, for lower platen to be driven to compress the metal-oxide-semiconductor in trough, the pushing module is set to the side of trough, and the pushing module cylinder is connect by pushing module fixed plate with pushing module, for driving bending after pushing module extruding metal-oxide-semiconductor stitch at a right angle.Above device has filled up the vacancy of this product in the market；Equipment cost is low；Production efficiency is improved, without manual processing, improves produced metal-oxide-semiconductor stitch uniformity；Overall volume is small, easy to remove；It is applicable in the molding of all kinds of stitch；There is no damage and cut to workpiece.
Description
Technical field
The utility model is related to metal-oxide-semiconductor preparing technical field, more particularly to a kind of metal-oxide-semiconductor foot device.
Background technology
Metal-oxide-semiconductor is essential electronic component in my company's production, and because that cannot produce, metal-oxide-semiconductor is all purchased, so
Existing metal-oxide-semiconductor can only be the unified pattern for purchasing manufacturer.The metal-oxide-semiconductor provided at present from metal-oxide-semiconductor manufacturer is all fixed
In line pattern, because of my Products structure and the demand of processing technology, the metal-oxide-semiconductor of straight-line is in my company only primary product
（As shown in Figure 1）, it is impossible to meet the production requirement of our company.Our company worker will carry out processing early period to metal-oxide-semiconductor stitch at present（By hand
Stitch is become shaped like bending）, it is converted into the pattern of production requirement（As shown in Figure 2）Because artificial treatment does not have unified standard, each
Also because of human factors such as the differences of proficiency and feel, the stitch of metal-oxide-semiconductor is irregular after having rolled over to unify people, each size ginseng
Number cannot reach the requirement of production, and low production efficiency occasionally has stitch to be broken off and scrap, and qualification rate is low serious to influence my company
Production and product qualification rate.
Utility model content
The purpose of this utility model is that for manual mode is used to carry out metal-oxide-semiconductor presser feet operation institute band in the prior art
The technical issues of product qualification rate come is relatively low, provides a kind of metal-oxide-semiconductor foot device.Presser feet operation, nothing are carried out using the device
It need to handle by hand, improve production efficiency, the metal-oxide-semiconductor stitch uniformity produced is high.
To achieve the above object, a kind of metal-oxide-semiconductor foot device provided by the utility model, including：Trough, lower platen,
Lower platen cylinder pushes module, pushes module fixed plate and pushes module cylinder；The trough is used to place metal-oxide-semiconductor pipe
Body, and metal-oxide-semiconductor stitch is stretched out from trough side, the lower platen is set to the top of trough, the pushing
Plate cylinder is connect with lower platen, and for lower platen to be driven to compress the metal-oxide-semiconductor in trough, the pushing module is set to blowing
The side of slot, the pushing module cylinder are connect by pushing module fixed plate with pushing module, and module is pushed for driving
It is bent at a right angle after squeezing metal-oxide-semiconductor stitch.
As a further improvement of the above technical scheme, R feet forming module and R foot module cylinders are further included；The R
Foot forming module is set to the side for bending metal-oxide-semiconductor stitch at a right angle, and the R foot module cylinders connect with R feet forming module
It connects, for R feet forming module to be driven to squeeze the right angle position of metal-oxide-semiconductor stitch, forms R feet.
As a further improvement of the above technical scheme, the face that the lower platen is in contact with metal-oxide-semiconductor stitch uses rubber
Material is made.
A kind of metal-oxide-semiconductor foot device advantage of the utility model is：
The device of the utility model has filled up the vacancy of this product in the market；Equipment cost is low；Improve production efficiency, nothing
It need to handle by hand, improve produced metal-oxide-semiconductor stitch uniformity；Overall volume is small, easy to remove；Be applicable in all kinds of stitch into
Type；There is no damage and cut to workpiece.
Description of the drawings
Fig. 1 is the structure diagram before metal-oxide-semiconductor presser feet；
Fig. 2 is that the metal-oxide-semiconductor structure diagram after presser feet operation is realized using the device of the utility model；
Fig. 3 is that module mode of operation figure is pushed in the utility model embodiment；
Fig. 4 is R foot module mode of operation figures in the utility model embodiment.
Reference numeral
1st, metal-oxide-semiconductor tube body 2, metal-oxide-semiconductor stitch 3, lower platen
4th, trough 5, lower platen cylinder 6, pushing module
7th, it pushes module fixed plate 8, push module cylinder 9, R foot forming modules
10th, R feet module cylinder
Specific embodiment
Technical solution provided by the utility model is further illustrated with reference to embodiments.
As shown in figure 3, a kind of metal-oxide-semiconductor foot device provided by the utility model, including：Trough 4, pushes lower platen 3
Plate cylinder 5 pushes module 6, pushes module fixed plate 7 and pushes module cylinder 8；The trough 4 is used to place metal-oxide-semiconductor pipe
Body 1, and metal-oxide-semiconductor stitch 2 is stretched out from trough side, the lower platen 3 is set to the top of trough 4, described
Lower platen cylinder 5 is connect with lower platen 3, for lower platen 3 to be driven to compress the metal-oxide-semiconductor in trough 4, the pushing module 6
The side of trough 4 is set to, the pushing module cylinder 8 is connect by pushing module fixed plate 7 with pushing module 6, is used
It pushes after module 6 squeezes metal-oxide-semiconductor stitch 2 and is bent at a right angle in driving.
Device based on above structure, as shown in figure 4, in the present embodiment, the metal-oxide-semiconductor foot device further includes R
Foot forming module 9 and R foot modules cylinder 10；The R feet forming module 9, which is set to, bends the one of metal-oxide-semiconductor stitch at a right angle
Side, the R foot modules cylinder 10 are connect with R feet forming module 9, for R feet forming module 9 to be driven to squeeze metal-oxide-semiconductor stitch
Right angle position forms R feet.The metal-oxide-semiconductor foot device of the utility model is to be modified to principle with punching press.By controlling cylinder toward instead
Movement complete punch forming, and ensure the reliable normal operation of whole equipment.
The physical characteristic of workpiece:The stitch of the metal-oxide-semiconductor of buying is copper material, and electroplating surfaces with tin is handled.Overall material is brass,
Quality hardness is soft, and when easy bending generates cut；Yield strength it is small can not bending repeatedly, frangibility stitch；Metal-oxide-semiconductor tube body is non-
Metal material, not pressure-resistant cracky feature.The product researched and developed is fractureed with avoiding stitch of the workpiece repeatedly caused by bending, workpiece
The damage of outer surface and the cut on bending part copper material surface.
In the present embodiment, the last forming requirements of workpiece：Horizontal stitch will roll over 90o, and have R feet as vibration in bending part
When buffering, and require error very little.
The work step of presser feet equipment：Workpiece is put into trough and trough is put into device-opened automatic mold
Formula-lower platen workpiece pressing-pushing module pushes stitch into opening in 90o-pushing module, and lower platen also keeps compressing shape
State-R feet forming module, which pushes 90o pin portions, makes clubfoot part become R feet pattern-R feet forming module retrogressing, and lower platen is received
It returns to cancel compression-taking-up trough and take out workpiece-whole flow process and complete, carry out next compacting flow.
The specification of trough：Metal-oxide-semiconductor will easily can be put into trough, and has reliable left and right positioning, blowing
The inner left wall of slot has down foot, is such as positioned in inner left wall, and side wall will be higher by down the most flash of foot and be less than the highest of tube body
Face；Right side inner wall has stitch at intermediate position, and side wall cannot be higher by stitch, so regioselective block height and phase below stitch
It is flat.Trough not only has positioning action, while the lower die for also taking into account 90 o and R foot forming modules acts on.
By the compression of lower platen cylinder come workpiece pressing, the size of power can be determined lower platen by the size of air pressure, by
This can ensure that workpiece will not be damaged because of impact and noticeable effort, be effectively protected the integrality of workpiece.Lower platen is put down
Face contacts with each other with metal-oxide-semiconductor tube body so that the forced area of the two is big.And also to have the precompressed of lower platen at metal-oxide-semiconductor stitch, it examines
Consider metal covering and be in contact and have damage and cut, nonmetallic materials are selected at metal-oxide-semiconductor stitch, at using rubber as stitch
Contact material.
Since metal-oxide-semiconductor stitch material is brass, when pushing, cannot directly push bending, have certain transition just can be
There is no cut on stitch；And to reach 90o when bending is completed.It is to generate thrust by pushing module cylinder to push module, is pushed
Module cylinder ejector so that push module workpiece pressing, the bending of driving stitch is in 90 °；Module cylinder compression is pushed later, simultaneously
Lower platen cylinder ejector, the pressing force acted on workpiece are constant；Instantly die block cylinder compression on earth when, lower platen gas
Cylinder is ejected to range.The pressing force of workpiece is constant, this running is completed.
After the completion of a upper running, workpiece is in impaction state, by R foot module cylinders to R feet forming module one to the left
Thrust push workpiece to, since squeezing action power is more than the yield force of stitch material, workpiece presses die block and R feet after being squeezed
Gap between forming module forms R feet.
It after R feet are formed, is retreated by R foot modules cylinder driving R feet forming module, is retracted to start position no longer to squeeze
Press workpiece；Lower platen also begins to shrink, until no longer workpiece pressing.Finally, it takes out trough and takes out workpiece.
It should be noted last that above example is merely intended for describing the technical solutions of the present application, but not for limiting the present application.To the greatest extent
Pipe is described in detail the utility model with reference to embodiment, it will be understood by those of ordinary skill in the art that, to this practicality
Novel technical solution is modified or replaced equivalently, without departure from the spirit and scope of technical solutions of the utility model,
It should all cover in the right of the utility model.
Claims (3)
1. a kind of metal-oxide-semiconductor foot device, which is characterized in that including：Trough, lower platen, lower platen cylinder, push module, under
Die block fixed plate and pushing module cylinder；The trough causes metal-oxide-semiconductor stitch from putting for placing metal-oxide-semiconductor tube body
Hopper side is stretched out, and the lower platen is set to the top of trough, and the lower platen cylinder connect with lower platen, is used for
Lower platen is driven to compress the metal-oxide-semiconductor in trough, the pushing module is set to the side of trough, the pushing module
Cylinder is connect by pushing module fixed plate with pushing module, is bent into directly for driving to push after module squeezes metal-oxide-semiconductor stitch
Angle.
2. metal-oxide-semiconductor foot device according to claim 1, which is characterized in that further include R feet forming module and R foot modules
Cylinder；The R foot forming modules are set to the side for bending metal-oxide-semiconductor stitch at a right angle, the R foot module cylinders and R
Foot forming module connects, and for R feet forming module to be driven to squeeze the right angle position of metal-oxide-semiconductor stitch, forms R feet.
3. metal-oxide-semiconductor foot device according to claim 1, which is characterized in that the lower platen is in contact with metal-oxide-semiconductor stitch
Face be made of rubber material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721821505.XU CN207592676U (en) | 2017-12-23 | 2017-12-23 | A kind of metal-oxide-semiconductor foot device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721821505.XU CN207592676U (en) | 2017-12-23 | 2017-12-23 | A kind of metal-oxide-semiconductor foot device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207592676U true CN207592676U (en) | 2018-07-10 |
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ID=62767672
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721821505.XU Active CN207592676U (en) | 2017-12-23 | 2017-12-23 | A kind of metal-oxide-semiconductor foot device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110064714A (en) * | 2019-05-24 | 2019-07-30 | 车敏 | A kind of optical assembly pin bending and molding device |
| CN114178431A (en) * | 2021-12-31 | 2022-03-15 | 无锡市同步电子制造有限公司 | Method for forming mos tube by using adjustable clamp |
-
2017
- 2017-12-23 CN CN201721821505.XU patent/CN207592676U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110064714A (en) * | 2019-05-24 | 2019-07-30 | 车敏 | A kind of optical assembly pin bending and molding device |
| CN110064714B (en) * | 2019-05-24 | 2021-04-06 | 宣城慧哲生产力促进中心有限公司 | Optical assembly pin bending and forming device |
| CN114178431A (en) * | 2021-12-31 | 2022-03-15 | 无锡市同步电子制造有限公司 | Method for forming mos tube by using adjustable clamp |
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