CN106449429A - A MOS pin shaping apparatus - Google Patents
A MOS pin shaping apparatus Download PDFInfo
- Publication number
- CN106449429A CN106449429A CN201610942431.9A CN201610942431A CN106449429A CN 106449429 A CN106449429 A CN 106449429A CN 201610942431 A CN201610942431 A CN 201610942431A CN 106449429 A CN106449429 A CN 106449429A
- Authority
- CN
- China
- Prior art keywords
- mos
- driving
- block
- oxide
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007493 shaping process Methods 0.000 title abstract description 3
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000000465 moulding Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract description 4
- 210000001364 upper extremity Anatomy 0.000 description 4
- 210000002683 foot Anatomy 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
Abstract
The invention discloses a MOS pin shaping apparatus comprising a base plate. A driving mechanism and an actuating mechanism are arranged on the base plate. The actuating mechanism comprises guiding shafts. The both ends of each guiding shaft are respectively provided with a guiding shaft base and a fixing clamp block fixed on the base plate; the guiding shaft is also provided with a movable clamping block which can slide along the guiding shaft, and the lower edge of the fixing clamp block and the movable clamp block are engaged with each other; the movable clamping block is provided with telescopic rods; and the tail ends of the telescopic rods are provided with a pressing block. The driving mechanism comprises a driving shaft base, a driving shaft, a handle and a driving cam in cooperation with the handle. According to the invention, the MOS pin can be rapidly shaped, and meanwhile the MOS pin has characteristics of flexible adjusting and adjustable pressures. Precision molding of a MOS can be ensured, and the MOS is prevented from being crushed. In usage, molding of MOS component pins with different bending angles, different bending heights and different thicknesses can be realized through rapid adjusting of a driving cam or replacing of the fixing clamp block and the movable clamp block according to actual usage conditions.
Description
Technical field
The present invention relates to field of electrical components, more particularly to a kind of metal-oxide-semiconductor pin forming device.
Background technology
When the components and parts such as metal-oxide-semiconductor are installed, due to the difference of installation site, the component's feets such as metal-oxide-semiconductor need to be processed into not
Same angle of bend, differently curved height and differently curved thickness are meeting installation requirement.During traditional small lot batch manufacture product,
Generally using the method for artificial molding, the method for artificial molded lead is less efficient, it is impossible to carry out large batch of forming operation, and
It is difficult to ensure that during offhand that angle is consistent, after easily causing metal-oxide-semiconductor installation, height is inconsistent, contact surface is bad to cause radiating not
Good, have a strong impact on quality and stability, the concordance of product.
Content of the invention
It is an object of the invention to provide a kind of metal-oxide-semiconductor pin forming device carries out different height to component's feets such as metal-oxide-semiconductors
The processing and forming of degree, different angles and different-thickness, it can be ensured that metal-oxide-semiconductor pin forming is accurate, and the bending height after molding, angle
Degree, consistency of thickness.
For achieving the above object, the technical scheme is that：A kind of metal-oxide-semiconductor pin forming device, including seat board,
The seat board is provided with drive mechanism and actuator；
The actuator includes at least two axis of guides, and the axis of guide is respectively arranged at two ends with and is fixed on leading on the seat board
To axle bed and fixing clip, the movable clip block that can slide, the fixing clip lower edge on the axis of guide, is additionally provided with along the axis of guide
Engage each other with the movable clip block, the movable clip block is provided with least two expansion links, the expansion link end is provided with pressure
Tight block；
The drive mechanism includes the driving axle bed being fixed on seat board, and the driving axle bed is provided with the driving perpendicular to seat board
Axle, the drive shaft is provided with handle and the driving cam with handle linkage.
Further, the movable clip block is provided with elastic device.
Further, the expansion link is provided with elastic device.
The know-why of the present invention：Required from conjunction according to differently curved angle, differently curved height and different-thickness
The fixing clip and movable clip block of suitable angle of bend and height, and according to the swing position of driving cam is regulated, by metal-oxide-semiconductor etc.
Components and parts are inserted vertically between the fixing clip of metal-oxide-semiconductor pin forming device and movable clip block, and are close to fixing clip upper limb, are passed through
Handle is pulled, drives driving cam to rotate, driving cam Compressive activities fixture block, make movable clip block slide to fixing clip, compact heap
Metal-oxide-semiconductor is pressed on by fixing clip upper limb by elastic device, meanwhile, movable clip block is engaged with fixing clip, bends metal-oxide-semiconductor
Molding.
The invention has the beneficial effects as follows：
1st, the shaped device can the bending of rapid shaping metal-oxide-semiconductor pin.According to the different angles for using and requirement for height, by profiled member
After installing, quickly the metal-oxide-semiconductor pin brake forming of molding can will be needed, convenient and swift, simple and practical；
2nd, adjust flexible.According to actually used situation, can be met by quick-replaceable driving cam or profiled member differently curved
The molding of the metal-oxide-semiconductor component's feet of angle, differently curved height and different-thickness；
3rd, pressure adjustable section.By changing different elastic devices to adjust briquetting pressure, reach protect metal-oxide-semiconductor components and parts not by
Damage by pressure.
Description of the drawings
Fig. 1 is the structural representation of the present invention.
Specific embodiment
Below in conjunction with accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.
As shown in figure 1, a kind of metal-oxide-semiconductor pin forming device, including seat board 10, the seat board 10 is provided with drive mechanism 30
With actuator 20；
The actuator 20 includes at least two axis of guides 21, and the axis of guide 21 is respectively arranged at two ends with and is fixed on the seat board
Guiding axle bed 22 and fixing clip 23 on 10, is additionally provided with the movable clip block that can slide along the axis of guide 21 on the axis of guide 21
24, the movable clip block 24 is provided with elastic device, and 24 lower edge of the fixing clip and the movable clip block 23 are engaged each other, institute
State movable clip block 23 and at least two expansion links 25 are provided with, the expansion link is provided with elastic device, and the expansion link end sets
There is compact heap 26；
The drive mechanism 30 includes the driving axle bed 31 being fixed on seat board 10, and the driving axle bed 31 is provided with perpendicular to seat
The drive shaft 32 of plate 10, the drive shaft 32 is provided with handle 34 and the driving cam 33 for linking with handle 34.
During use, first require to select suitable angle of bend according to differently curved angle, differently curved height and different-thickness
The fixing clip 23 and movable clip block 24 of degree and height, and according to the swing position of driving cam 33 is regulated, metal-oxide-semiconductor is vertical
Between the fixing clip 23 of insertion metal-oxide-semiconductor pin forming device and movable clip block 24, and it is close to 23 upper limb of fixing clip, by pulling
Handle 34, drives driving cam 33 to rotate, and 33 Compressive activities fixture block 24 of driving cam makes movable clip block 24 slide to fixing clip
23, metal-oxide-semiconductor is pressed on 23 upper limb of fixing clip by elastic device by compact heap 26, meanwhile, movable clip block 24 and fixing clip
23 engagements, make metal-oxide-semiconductor brake forming.
Described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment obtained under the premise of creative work is not made by those of ordinary skill in the art, all
Belong to the scope of the present invention.
Claims (3)
1. a kind of metal-oxide-semiconductor pin forming device, it is characterised in that including seat board, the seat board is provided with drive mechanism and execution
Mechanism；
The actuator includes at least two axis of guides, and the axis of guide is respectively arranged at two ends with and is fixed on leading on the seat board
To axle bed and fixing clip, the movable clip block that can slide, the fixing clip lower edge on the axis of guide, is additionally provided with along the axis of guide
Engage each other with the movable clip block, the movable clip block is provided with least two expansion links, the expansion link end is provided with pressure
Tight block；
The drive mechanism includes the driving axle bed being fixed on seat board, and the driving axle bed is provided with the driving perpendicular to seat board
Axle, the drive shaft is provided with handle and the driving cam with handle linkage.
2. a kind of metal-oxide-semiconductor pin forming device according to claim 1, it is characterised in that the movable clip block is provided with
Elastic device.
3. a kind of metal-oxide-semiconductor pin forming device according to claim 1, it is characterised in that the expansion link is provided with bullet
Property device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610942431.9A CN106449429B (en) | 2016-10-26 | 2016-10-26 | Metal-oxide-semiconductor pin building mortion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610942431.9A CN106449429B (en) | 2016-10-26 | 2016-10-26 | Metal-oxide-semiconductor pin building mortion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106449429A true CN106449429A (en) | 2017-02-22 |
| CN106449429B CN106449429B (en) | 2018-10-09 |
Family
ID=58178192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610942431.9A Active CN106449429B (en) | 2016-10-26 | 2016-10-26 | Metal-oxide-semiconductor pin building mortion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449429B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178431A (en) * | 2021-12-31 | 2022-03-15 | 无锡市同步电子制造有限公司 | Method for forming mos tube by using adjustable clamp |
| CN116913805A (en) * | 2023-05-16 | 2023-10-20 | 中山益能达精密电子有限公司 | Production equipment and method for metal pins of semiconductor chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443549A (en) * | 1993-06-15 | 1995-08-22 | Yazaki Corporation | Terminal crimping machine |
| CN200954528Y (en) * | 2006-07-04 | 2007-10-03 | 无锡市中兴光电子技术有限公司 | Photoelectric diode leg forming die |
| CN102522225A (en) * | 2011-12-27 | 2012-06-27 | 福建火炬电子科技股份有限公司 | Ceramic capacitor pin moulding equipment and moulding method |
| CN203955962U (en) * | 2014-07-14 | 2014-11-26 | 广州金升阳科技有限公司 | A kind of electronic devices and components pin apparatus for bending |
| US20170002271A1 (en) * | 2005-07-06 | 2017-01-05 | Inentec Inc | Renewable electricity conversion of liquid fuels from hydrocarbon feedstocks |
-
2016
- 2016-10-26 CN CN201610942431.9A patent/CN106449429B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443549A (en) * | 1993-06-15 | 1995-08-22 | Yazaki Corporation | Terminal crimping machine |
| US20170002271A1 (en) * | 2005-07-06 | 2017-01-05 | Inentec Inc | Renewable electricity conversion of liquid fuels from hydrocarbon feedstocks |
| CN200954528Y (en) * | 2006-07-04 | 2007-10-03 | 无锡市中兴光电子技术有限公司 | Photoelectric diode leg forming die |
| CN102522225A (en) * | 2011-12-27 | 2012-06-27 | 福建火炬电子科技股份有限公司 | Ceramic capacitor pin moulding equipment and moulding method |
| CN203955962U (en) * | 2014-07-14 | 2014-11-26 | 广州金升阳科技有限公司 | A kind of electronic devices and components pin apparatus for bending |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178431A (en) * | 2021-12-31 | 2022-03-15 | 无锡市同步电子制造有限公司 | Method for forming mos tube by using adjustable clamp |
| CN116913805A (en) * | 2023-05-16 | 2023-10-20 | 中山益能达精密电子有限公司 | Production equipment and method for metal pins of semiconductor chip |
| CN116913805B (en) * | 2023-05-16 | 2024-01-12 | 中山益能达精密电子有限公司 | Production equipment and method for metal pins of semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106449429B (en) | 2018-10-09 |
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