CN106449429B - Metal-oxide-semiconductor pin building mortion - Google Patents
Metal-oxide-semiconductor pin building mortion Download PDFInfo
- Publication number
- CN106449429B CN106449429B CN201610942431.9A CN201610942431A CN106449429B CN 106449429 B CN106449429 B CN 106449429B CN 201610942431 A CN201610942431 A CN 201610942431A CN 106449429 B CN106449429 B CN 106449429B
- Authority
- CN
- China
- Prior art keywords
- oxide
- metal
- seat board
- semiconductor
- guiding axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000000465 moulding Methods 0.000 abstract description 7
- 238000007493 shaping process Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 description 6
- 210000001364 upper extremity Anatomy 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 210000002683 foot Anatomy 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
Abstract
The invention discloses a kind of metal-oxide-semiconductor pin building mortion, including seat board, seat board is equipped with driving mechanism and executing agency；Executing agency includes guiding axis, guiding axis both ends are respectively equipped with the guiding axle bed being fixed on seat board and fixing clip, the movable clip block that can be slided along guiding axis is additionally provided on guiding axis, fixing clip lower edge and movable clip block intermeshing, movable clip block is equipped with telescopic rod, and telescopic rod end is equipped with compact heap；Driving mechanism includes driving axle bed, drive shaft, handle and the driving cam to link with handle.The present invention can rapid shaping metal-oxide-semiconductor pin, while have the characteristics that adjustment flexibly, pressure adjustable section, not only can guarantee metal-oxide-semiconductor accurate forming, but also can ensure that metal-oxide-semiconductor is not subject to crushing.In use, according to actual use situation, the molding of the metal-oxide-semiconductor component's feet of differently curved angle, differently curved height and different-thickness can be met by quickly adjusting driving cam or replacing fixing clip and movable clip block.
Description
Technical field
The present invention relates to field of electrical components more particularly to a kind of metal-oxide-semiconductor pin building mortions.
Background technology
When the components such as metal-oxide-semiconductor are installed, due to the difference of installation site, the component's feets such as metal-oxide-semiconductor need to be processed into not
Same bending angle, differently curved height and differently curved thickness meet installation requirement.When traditional small lot produces product,
The artificial molding method of generally use, the method for artificial molded lead is less efficient, can not carry out large batch of forming operation, and
It is difficult to ensure that angle is consistent when offhand, height is inconsistent after be easy to causeing metal-oxide-semiconductor installation, and contact surface is bad to lead to heat dissipation not
It is good, seriously affect the quality and stability, consistency of product.
Invention content
The object of the present invention is to provide a kind of metal-oxide-semiconductor pin building mortions to carry out different height to component's feets such as metal-oxide-semiconductors
The processing and forming of degree, different angle and different-thickness, it can be ensured that metal-oxide-semiconductor pin forming is accurate, and bending height after molding, angle
Degree, consistency of thickness.
For achieving the above object, the technical scheme is that：A kind of metal-oxide-semiconductor pin building mortion, including seat board,
The seat board is equipped with driving mechanism and executing agency；
The executing agency includes at least two guiding axis, and the guiding axis both ends, which are respectively equipped with, to be fixed on the seat board
Guiding axle bed and fixing clip, be additionally provided with the movable clip block that can be slided along guiding axis, the movable clip block on the guiding axis
It is equipped with elastic device, the fixing clip lower edge and movable clip block intermeshing, the movable clip block are equipped at least
Two telescopic rods, the telescopic rod are equipped with elastic device, and the telescopic rod end is equipped with compact heap；
The driving mechanism includes the driving axle bed being fixed on seat board, and the driving axle bed is equipped with perpendicular to seat board
Drive shaft, the drive shaft are equipped with handle and the driving cam with handle linkage.
The technical principle of the present invention：It requires to select according to differently curved angle, differently curved height and different-thickness and close
The fixing clip and movable clip block of suitable bending angle and height, and according to the swing position for regulating driving cam, by metal-oxide-semiconductor etc.
Component is inserted vertically between the fixing clip and movable clip block of metal-oxide-semiconductor pin building mortion, and is close to fixing clip upper limb, is passed through
Handle is pulled, drives driving cam rotation, driving cam Compressive activities fixture block that movable clip block is made to slide to fixing clip, compact heap
Metal-oxide-semiconductor is pressed on fixing clip upper limb by elastic device, meanwhile, movable clip block is engaged with fixing clip, and metal-oxide-semiconductor is made to be bent
Molding.
The beneficial effects of the invention are as follows：
1, the molding machine can the bending of rapid shaping metal-oxide-semiconductor pin.It, will be at according to the different angle and requirement for height used
After type part installs, molding metal-oxide-semiconductor pin brake forming will can be quickly needed, it is convenient and efficient, it is simple and practical；
2, adjustment is flexible.According to actual use situation, difference can be met by quick-replaceable driving cam or molded part
The molding of the metal-oxide-semiconductor component's feet of bending angle, differently curved height and different-thickness；
3, pressure adjustable section.Briquetting pressure is adjusted by replacing different elastic devices, reaches protection metal-oxide-semiconductor component
It is not subject to crushing.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Specific implementation mode
Below in conjunction with attached drawing, technical scheme in the embodiment of the invention is clearly and completely described.
As shown in Figure 1, a kind of metal-oxide-semiconductor pin building mortion, including seat board 10, the seat board 10 are equipped with driving mechanism 30
With executing agency 20；
The executing agency 20 includes at least two guiding axis 21,21 both ends of the guiding axis be respectively equipped be fixed on it is described
Guiding axle bed 22 on seat board 10 and fixing clip 23 are additionally provided with the activity folder that can be slided along guiding axis 21 on the guiding axis 21
Block 24, the movable clip block 24 are equipped with elastic device, and 24 lower edge of the fixing clip and the movable clip block 23 are intermeshed,
The movable clip block 23 is equipped at least two telescopic rods 25, and the telescopic rod is equipped with elastic device, the telescopic rod end
Equipped with compact heap 26；
The driving mechanism 30 includes the driving axle bed 31 being fixed on seat board 10, and the driving axle bed 31 is equipped with vertical
In the driving cam 33 that the drive shaft 32 of seat board 10, the drive shaft 32 are equipped with handle 34 and link with handle 34.
In use, first being required to select suitable bending angle according to differently curved angle, differently curved height and different-thickness
The fixing clip 23 and movable clip block 24 of degree and height, and according to the swing position for regulating driving cam 33, metal-oxide-semiconductor is vertical
It is inserted between the fixing clip 23 and movable clip block 24 of metal-oxide-semiconductor pin building mortion, and is close to 23 upper limb of fixing clip, by pulling
Handle 34, drives driving cam 33 to rotate, and 33 Compressive activities fixture block 24 of driving cam makes movable clip block 24 slide to fixing clip
23, metal-oxide-semiconductor is pressed on 23 upper limb of fixing clip by compact heap 26 by elastic device, meanwhile, movable clip block 24 and fixing clip
23 engagements, make metal-oxide-semiconductor brake forming.
Described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, belongs to the scope of the present invention.
Claims (1)
1. a kind of metal-oxide-semiconductor pin building mortion, which is characterized in that including seat board, the seat board is equipped with driving mechanism and execution
Mechanism；
The executing agency includes at least two guiding axis, and the guiding axis both ends, which are respectively equipped with, is fixed on leading on the seat board
To axle bed and fixing clip, it is additionally provided with the movable clip block that can be slided along guiding axis on the guiding axis, is set on the movable clip block
Flexible device, the fixing clip lower edge and movable clip block intermeshing, the movable clip block are equipped at least two
Telescopic rod, the telescopic rod are equipped with elastic device, and the telescopic rod end is equipped with compact heap；
The driving mechanism includes the driving axle bed being fixed on seat board, and the driving axle bed is equipped with the driving perpendicular to seat board
Axis, the drive shaft are equipped with handle and the driving cam with handle linkage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610942431.9A CN106449429B (en) | 2016-10-26 | 2016-10-26 | Metal-oxide-semiconductor pin building mortion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610942431.9A CN106449429B (en) | 2016-10-26 | 2016-10-26 | Metal-oxide-semiconductor pin building mortion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106449429A CN106449429A (en) | 2017-02-22 |
| CN106449429B true CN106449429B (en) | 2018-10-09 |
Family
ID=58178192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610942431.9A Active CN106449429B (en) | 2016-10-26 | 2016-10-26 | Metal-oxide-semiconductor pin building mortion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449429B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178431A (en) * | 2021-12-31 | 2022-03-15 | 无锡市同步电子制造有限公司 | Method for forming mos tube by using adjustable clamp |
| CN116913805B (en) * | 2023-05-16 | 2024-01-12 | 中山益能达精密电子有限公司 | Production equipment and method for metal pins of semiconductor chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443549A (en) * | 1993-06-15 | 1995-08-22 | Yazaki Corporation | Terminal crimping machine |
| CN200954528Y (en) * | 2006-07-04 | 2007-10-03 | 无锡市中兴光电子技术有限公司 | Photoelectric diode leg forming die |
| CN102522225A (en) * | 2011-12-27 | 2012-06-27 | 福建火炬电子科技股份有限公司 | Ceramic capacitor pin moulding equipment and moulding method |
| CN203955962U (en) * | 2014-07-14 | 2014-11-26 | 广州金升阳科技有限公司 | A kind of electronic devices and components pin apparatus for bending |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8614364B2 (en) * | 2005-07-06 | 2013-12-24 | Inentec Inc. | Renewable electricity conversion of liquid fuels from hydrocarbon feedstocks |
-
2016
- 2016-10-26 CN CN201610942431.9A patent/CN106449429B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443549A (en) * | 1993-06-15 | 1995-08-22 | Yazaki Corporation | Terminal crimping machine |
| CN200954528Y (en) * | 2006-07-04 | 2007-10-03 | 无锡市中兴光电子技术有限公司 | Photoelectric diode leg forming die |
| CN102522225A (en) * | 2011-12-27 | 2012-06-27 | 福建火炬电子科技股份有限公司 | Ceramic capacitor pin moulding equipment and moulding method |
| CN203955962U (en) * | 2014-07-14 | 2014-11-26 | 广州金升阳科技有限公司 | A kind of electronic devices and components pin apparatus for bending |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106449429A (en) | 2017-02-22 |
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