CN114158783A - MEMS silicon-based cavity atomizing core and manufacturing method thereof - Google Patents
MEMS silicon-based cavity atomizing core and manufacturing method thereof Download PDFInfo
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- CN114158783A CN114158783A CN202210019347.5A CN202210019347A CN114158783A CN 114158783 A CN114158783 A CN 114158783A CN 202210019347 A CN202210019347 A CN 202210019347A CN 114158783 A CN114158783 A CN 114158783A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 60
- 239000010703 silicon Substances 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000011049 filling Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000889 atomisation Methods 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000003860 storage Methods 0.000 claims description 13
- 238000001312 dry etching Methods 0.000 claims description 12
- 238000001039 wet etching Methods 0.000 claims description 12
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 239000002210 silicon-based material Substances 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000011550 stock solution Substances 0.000 abstract description 14
- 238000002360 preparation method Methods 0.000 abstract description 6
- 239000003921 oil Substances 0.000 abstract description 4
- 230000006378 damage Effects 0.000 abstract description 2
- 239000011162 core material Substances 0.000 description 39
- 239000000919 ceramic Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 8
- 229920000742 Cotton Polymers 0.000 description 5
- 239000000443 aerosol Substances 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 238000009688 liquid atomisation Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/10—Devices using liquid inhalable precursors
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/42—Cartridges or containers for inhalable precursors
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/70—Manufacture
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- Micromachines (AREA)
Abstract
The invention discloses an MEMS silicon-based cavity atomizing core, which comprises: silicon substrate, filling layer and heater strip, silicon substrate side surface is provided with a plurality of micropore, relative opposite side surface is provided with at least one feed liquor hole, the micropore includes atomizing hole and release hole, the inside stock solution chamber that is provided with of silicon substrate, the release hole communicates to the stock solution chamber, the atomizing hole communicates to the stock solution chamber, the feed liquor hole communicates to the stock solution chamber, the filling layer preparation is at silicon substrate micropore side surface, the filling layer seals the release hole top, the heater strip preparation is on the filling layer surface, the tip of heater strip is provided with contact electrode. The invention also discloses a manufacturing method of the MEMS silicon-based cavity atomization core. Compared with the prior art, the atomizing core has the advantages of good oil locking performance, high processing yield, large atomizing heating area, high temperature uniformity during heating and no harm to human bodies due to materials.
Description
Technical Field
The invention belongs to the field of heating atomization cores, and particularly relates to an MEMS silicon-based cavity atomization core and a manufacturing method thereof.
Background
The heating atomization core is used as a core component of a liquid atomization product, liquid is heated to be changed into a foggy aerosol form to be emitted, and when the atomization element heats the atomized liquid, the generation of harmful substances is rapidly, uniformly, consistently and finely reduced as much as possible.
The existing liquid heating atomization cores mainly have the following two types: a cotton-coated atomizing core and a porous ceramic atomizing core. The metal heating wire in the cotton-coated atomizing core is in direct contact with the cotton core, and at high temperature, metal components in the heating wire and scraps of the cotton core material can be carried by aerosol formed by atomization and inhaled by a user, so that potential health hazards are caused. Meanwhile, the cotton core is in non-uniform contact with the metal heating wire, heating is not uniform, and high-temperature carbonization can also cause resistance change of the heating wire, so that temperature change of the heating wire is caused, and atomization uniformity, stability and consistency are poor. The porous ceramic atomizing core consists of two parts, namely porous ceramic and a heating electrode. Porous ceramic is made into a bowl-shaped structure through high-temperature sintering, the heating film is designed into a specific shape and is attached to the surface of the ceramic, and in the working process, the heating film uniformly heats liquid to form mist which is emitted by ceramic micropores. Due to the existence of the micron-sized honeycomb holes, the atomized aerosol is finer and smoother. And through adjusting micropore size, porosity, can control the lock liquid of ceramic core, stock solution ability, can also adjust the humidity of atomizing aerosol. .
The existing ceramic atomizing core is prepared by adopting a porous ceramic sintering technology, and in order to have certain liquid absorption and liquid storage capacities, the fired microporous ceramic needs to keep certain micropore size and porosity, so that the following four problems are brought:
firstly, due to the existence of the porous structure, the liquid locking capacity of the ceramic core is reduced, and liquid leakage is easy to occur. At present, the liquid-locking capacity is improved by reducing the porosity and the number of pores, but the liquid-absorbing capacity and the liquid-storing capacity are reduced at the same time.
Secondly, because the texture is loose not hard enough, the metal heating wire is difficult for the high yield and the ceramic core is integrated together to need extra thickening metal heating wire to avoid external conductive post to lead to the fact the destruction to the ceramic core.
And thirdly, the thermal conductivity of the ceramic core is low and uneven, the metal heating wire cannot cover the whole atomization surface, so that the atomization amount is difficult to increase, and the local temperature is easily overhigh to cause dry burning.
And fourthly, the ceramic sintering process inevitably introduces harmful substances and harms the health of users.
Disclosure of Invention
The invention aims to: the MEMS silicon-based hole cavity atomizing core and the manufacturing method thereof are provided, the atomizing core is good in oil locking performance, high in processing yield, large in atomizing heating area, high in temperature uniformity during heating, and harmless to human bodies.
In order to achieve the above object, in one aspect, the present invention provides a MEMS silicon-based cavity atomizing core, comprising: silicon substrate, filling layer and heater strip, silicon substrate side surface is provided with a plurality of micropore, relative opposite side surface is provided with at least one feed liquor hole, the micropore includes atomizing hole and release hole, the inside stock solution chamber that is provided with of silicon substrate, the release hole communicates to the stock solution chamber, the atomizing hole communicates to the stock solution chamber, the feed liquor hole communicates to the stock solution chamber, the filling layer preparation is at silicon substrate micropore side surface, the filling layer seals the release hole top, the heater strip preparation is on the filling layer surface, the tip of heater strip is provided with contact electrode.
As a further description of the above technical solution:
the aperture of the atomization hole is larger than that of the release hole.
As a further description of the above technical solution:
the aperture of the atomization hole is smaller than that of the liquid inlet hole.
In another aspect, the present invention provides a method for manufacturing an MEMS silicon-based cavity atomizing core, comprising the steps of:
s1, preparing a silicon substrate;
s2, processing atomization holes and release holes on the silicon substrate by using a dry etching process or a wet etching process;
s3, etching the silicon materials at the bottoms of the atomization hole and the release hole by using a dry etching process or a wet etching process to form a cavity inside the silicon substrate as a liquid storage cavity;
s4, depositing a filling layer on the surface of the silicon substrate, wherein the filling layer seals the top of the release hole;
s5, depositing a metal heating wire on the surface of the filling layer, and making a specific pattern by a dry etching process or a wet etching process;
and S6, etching a liquid inlet hole on the back of the silicon substrate by dry etching or wet etching to finish the atomization core processing.
As a further description of the above technical solution:
in step S4, the filling layer includes one or more of silicon oxide, silicon nitride, and polysilicon.
As a further description of the above technical solution:
in step S5, the heater wire is made of Al, Ti/Au, Ti/Pt, Ti/TiN/Au, Ti/TiN/Pt, Ta/Au, Ta/Pt, Ta/TaN/Au, and Ta/TaN/Pt.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. in the invention, the atomization hole on the silicon substrate can be as small as several microns, the liquid inlet hole is not directly communicated with the atomization hole, and the release hole on the silicon substrate is sealed by the filling layer, so that the specific distributed microporous structure on the silicon substrate can effectively lock the atomized liquid, and the atomization core has good oil locking performance.
2. In the invention, the atomizing core adopts a mature semiconductor processing technology, and the metal heating wire is directly processed on the silicon-based substrate, so that the yield is improved.
3. According to the invention, the filling layer on the atomizing core has a heat conduction function, the silicon material has good heat conductivity, and heat generated by the metal heating wires is uniformly distributed on the silicon hole structure on the liquid storage cavity, so that the atomizing area is increased, the fogging amount is increased, and the dry burning phenomenon is avoided.
4. In the invention, the silicon substrate, the heating wire and the filling layer adopted by the atomizing core are harmless to human bodies in the aspects of materials and processing technology.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of an MEMS silicon-based cavity atomizing core.
FIG. 2 is a schematic view of the processing of the atomizing hole and the releasing hole in the manufacturing method of the MEMS silicon-based cavity atomizing core.
FIG. 3 is a schematic view of the processing of a liquid storage chamber in the manufacturing method of the MEMS silicon-based cavity atomizing core.
FIG. 4 is a schematic view of the processing of the filling layer in the manufacturing method of the MEMS silicon-based cavity atomizing core.
Fig. 5 is a schematic view of the processing of a heating wire in the manufacturing method of the MEMS silicon-based cavity atomizing core.
Illustration of the drawings:
1. a silicon substrate; 11. a liquid inlet hole; 12. an atomization orifice; 13. a release aperture; 14. a liquid storage cavity; 2. a filling layer; 3. heating wires; 31. contacting the electrode.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", and the like refer to orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally arranged when the products of the present invention are used, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, in one aspect, the present invention provides a MEMS silicon-based cavity atomizing core, comprising: silicon substrate 1, filling layer 2 and heater strip 3, 1 side surface of silicon substrate is provided with a plurality of micropore, relative opposite side surface is provided with at least one feed liquor hole 11, the micropore includes atomizing hole 12 and release hole 13, 1 inside stock solution chamber 14 that is provided with of silicon substrate, release hole 13 communicates to stock solution chamber 14, atomizing hole 12 communicates to stock solution chamber 14, feed liquor hole 11 communicates to stock solution chamber 14, the preparation of filling layer 2 is micropore side surface on silicon substrate 1, 2 closed release hole 13 tops of filling layer, heater strip 3 preparation is on 2 surfaces of filling layer, the tip of heater strip 3 is provided with contact electrode 31. When the heating wire 3 is specifically manufactured, the heating wire is manufactured at the release hole 13 blocked by the filling layer 2 (the atomization hole 12 cannot be blocked), and the heating atomization effect is good.
The diameter of the atomization holes 12 is larger than that of the release holes 13, preventing the atomization holes 12 from being closed by the filling layer 2.
The aperture of the atomization hole 12 is smaller than that of the liquid inlet hole 11, so that the oil locking performance is ensured.
In another aspect, the present invention provides a method for manufacturing an MEMS silicon-based cavity atomizing core, comprising the steps of:
s1, preparing a silicon substrate 1;
s2, processing atomization holes 12 and release holes 13 on the silicon substrate 1 by using a dry etching process or a wet etching process, wherein the pore size is from several micrometers to tens of micrometers, and the depth of the holes is from several micrometers to hundreds of micrometers;
s3, etching silicon materials at the bottoms of the atomization holes 12 and the release holes 13 by using a dry etching process or a wet etching process to form a cavity as a liquid storage cavity 14 in the silicon substrate 1, wherein the height of the liquid storage cavity is several micrometers to hundreds of micrometers;
s4, depositing a filling layer 2 on the surface of the silicon substrate 1, wherein the filling layer 2 seals the top of the release hole 13, the thickness of the filling layer is determined according to the aperture size of the release hole, and the filling layer is made of silicon oxide, silicon nitride, polysilicon or the combination thereof;
s5, depositing a metal material (metal material harmless to human body) heating wire 3 and a metal electrode (contact electrode 31) on the surface of the filling layer 2, and making a specific pattern by a dry etching process or a wet etching process;
s6, etching a liquid inlet hole 11 on the back of the silicon substrate 1 by dry etching or wet etching, wherein the aperture of the liquid inlet hole is dozens of to hundreds of micrometers, and the depth is hundreds of micrometers, thus finishing the processing of the atomizing core.
In step S5, the material of the heating wire 3 includes, but is not limited to, Al, Ti/Au, Ti/Pt, Ti/TiN/Au, Ti/TiN/Pt, Ta/Au, Ta/Pt, Ta/TaN/Au, Ta/TaN/Pt, etc.
The working principle is as follows: the substrate of the atomizing core adopts a silicon structure, the processing is easy, and the atomizing hole/the releasing hole and the liquid storage cavity can be completed in the same process step. The atomization hole can be as small as several microns, and the liquid inlet hole and the atomization hole are not directly communicated, so that the liquid locking function is good. The filling layer is positioned between the metal heating wire and the release hole, and seals the surface of the release hole. Because the pore size of the atomization holes is larger than that of the release holes, the relatively thin packing layer can seal the release holes but not the atomization holes. The filling layer is relatively thin, has certain heat conduction function, and the silicon material has good heat conductivity for the heat evenly distributed that the metal heater strip produced has increased atomizing area on the silicon pore structure above the stock solution chamber, and can not have the dry combustion method phenomenon. The atomization core is processed by a semiconductor micro-nano processing technology, so that the atomization core has the advantages of high yield and low cost, and the material used by the atomization core is harmless to human bodies.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A MEMS silicon-based cavity atomizing core, comprising: a silicon substrate (1), a filling layer (2) and a heating wire (3), wherein one side surface of the silicon substrate (1) is provided with a plurality of micropores, the opposite other side surface is provided with at least one liquid inlet hole (11), the micropores comprise atomizing holes (12) and releasing holes (13), a liquid storage cavity (14) is arranged in the silicon substrate (1), the release hole (13) is communicated to the liquid storage cavity (14), the atomization hole (12) is communicated to the liquid storage cavity (14), the liquid inlet hole (11) is communicated to the liquid storage cavity (14), the filling layer (2) is manufactured on one side surface of the micropore on the silicon substrate (1), the filling layer (2) closes the tops of the release holes (13), the heating wires (3) are manufactured on the surface of the filling layer (2), and contact electrodes (31) are arranged at the ends of the heating wires (3).
2. A MEMS silicon-based cavity atomizing core according to claim 1, characterized in that the aperture of the atomizing hole (12) is larger than the aperture of the release hole (13).
3. A MEMS silicon-based cavity atomizing core according to claim 1 or 2, characterized in that the diameter of the atomizing hole (12) is smaller than the diameter of the liquid inlet hole (11).
4. A manufacturing method of an MEMS silicon-based cavity atomization core is characterized by comprising the following steps:
s1, preparing a silicon substrate (1);
s2, processing an atomizing hole (12) and a releasing hole (13) on the silicon substrate (1) by using a dry etching process or a wet etching process;
s3, etching silicon materials at the bottoms of the atomization holes (12) and the release holes (13) by using a dry or wet etching process, and forming a cavity as a liquid storage cavity (14) inside the silicon substrate (1);
s4, depositing a filling layer (2) on the surface of the silicon substrate (1), wherein the filling layer (2) seals the top of the release hole (13);
s5, depositing a metal heating wire (3) on the surface of the filling layer (2), and making a specific pattern through a dry etching process or a wet etching process;
s6, etching a liquid inlet hole (11) on the back of the silicon substrate (1) through dry etching or wet etching to finish the atomization core processing.
5. The method for manufacturing the MEMS silicon-based cavity atomizing core according to claim 4, wherein in the step S4, the filling layer (2) comprises one or more of silicon oxide, silicon nitride and polysilicon.
6. A manufacturing method of MEMS silicon-based cavity atomizing core according to claim 4, characterized in that in the step S5, the material of the heating wire (3) comprises Al, Ti/Au, Ti/Pt, Ti/TiN/Au, Ti/TiN/Pt, Ta/Au, Ta/Pt, Ta/TaN/Au, Ta/TaN/Pt.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210019347.5A CN114158783A (en) | 2022-01-04 | 2022-01-04 | MEMS silicon-based cavity atomizing core and manufacturing method thereof |
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| CN202210019347.5A CN114158783A (en) | 2022-01-04 | 2022-01-04 | MEMS silicon-based cavity atomizing core and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115191673A (en) * | 2022-08-09 | 2022-10-18 | 美满芯盛(杭州)微电子有限公司 | Manufacturing process of silicon-based atomizing core with synchronously processed atomizing hole and liquid storage cavity |
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