CN114158181B

CN114158181B - Circuit board assembly and terminal

Info

Publication number: CN114158181B
Application number: CN202111305945.0A
Authority: CN
Inventors: 朱福建; 丁海幸; 乔吉涛
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-01-31
Filing date: 2019-01-31
Publication date: 2026-01-23
Anticipated expiration: 2039-01-31
Also published as: CN114158181A; CN111511108B; CN111511108A

Abstract

This application discloses a circuit board assembly and a terminal, relating to the field of electronic device technology, to solve the problem that multiple electronic components cannot be simultaneously integrated onto a circuit board when the planar area occupied by the circuit board in an electronic product is limited. The circuit board assembly includes at least two circuit boards and at least one first adapter board. Each circuit board has an upper surface and a lower surface disposed opposite to each other. The upper and lower surfaces of the circuit boards are used to integrate electronic components. Furthermore, the first adapter board is disposed on at least one side of the at least two circuit boards and is electrically connected to the at least two circuit boards.

Description

Circuit board assembly and terminal

Technical Field

The present application relates to the field of electronic devices, and in particular, to a circuit board assembly and a terminal.

Background

At least one layer of circuit board is typically disposed within consumer electronics. The circuit board has integrated thereon a plurality of electronic components, such as a memory, a processor, etc.

However, as the functions of electronic products are increasing, for example, in order to realize functions of audio-visual, entertainment, etc., the interior of the electronic products needs to provide enough space for a display component, a camera component, etc. In addition, in order to improve the cruising ability of the electronic product, a battery with larger capacity and volume is also required to be arranged in the electronic product so as to realize long-time standby. In addition, with the development of wireless communication, more different kinds of antennas are disposed inside the electronic product to realize wireless communication connection such as 4G, wireless-fidelity (Wi-Fi), global positioning system (global positioning system, GPS) or bluetooth. Sufficient space needs to be provided between different antennas to avoid mutual interference between antennas.

In this case, the smaller the planar area occupied by the circuit board in the whole electronic product, the more area the circuit board cannot provide for integrating electronic components. In addition, as the functions of electronic products are more diversified, the number of electronic components integrated on the circuit board is gradually increased, so that the requirement that various electronic components occupy a larger space cannot be met.

Disclosure of Invention

The application provides a circuit board assembly and a terminal, which are used for solving the problem that various electronic components cannot be integrated on a circuit board at the same time under the condition that the occupied plane area of the circuit board in the whole electronic product is limited.

In order to achieve the above purpose, the application adopts the following technical scheme:

In a first aspect, a circuit board assembly is provided. The circuit board assembly includes at least two layers of circuit boards and at least one first adapter board. Wherein, the circuit board has upper surface and lower surface that relative setting. The upper surface and the lower surface of the circuit board are used for integrating electronic components. In addition, the first adapter plate is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards. In the circuit board assembly provided by the embodiment of the application, the PCBA formed by each layer of circuit board and the electronic components integrated on the circuit board can be used as a unit module capable of independently realizing at least one function. In this case, the circuit module occupying a large area of the PCB may be divided into a plurality of the above-described unit modules having a small area. Based on this, in the above circuit board assembly, each layer of circuit board and a plurality of electronic components integrated on the circuit board can be used as the unit module. In addition, the circuit board assembly further comprises a first adapter plate. The first adapter plate can enable circuit boards of different layers to be electrically connected, and further enable a plurality of unit modules to achieve signal transmission. And the plurality of unit modules perform signal transmission in the working process, so that the function of the circuit module occupying a larger PCB area can be realized. Because the planar area of the circuit board is smaller, the circuit boards with multiple layers for bearing electronic components are stacked, so that the component space of the circuit board assembly occupying the terminal in the plane can be reduced, and more space is saved for arranging other devices or batteries with larger capacity. In addition, as the terminal is capable of realizing more functions, the number of electronic components that need to be provided in the terminal is increased. Under the condition, the electronic components can be provided with enough distributing space along the height direction of the circuit board assembly by increasing the number of the circuit boards in the circuit board assembly, so that the aim of integrating more electronic components is fulfilled. In this case, the circuit board assembly increases in height, and the area of the circuit board assembly in the plane can be kept unchanged. Therefore, the integration level of the terminal can be improved on the premise of not influencing the space for distributing the pieces in the plane of the terminal.

In a first possible implementation manner of the first aspect, the first adapter board is electrically connected to a surface of the at least two layers of circuit boards. Therefore, when the circuit board assembly is returned to the factory for maintenance, the first adapter plate is more easily peeled off from the surface of the circuit board, so that the maintenance cost is reduced.

With reference to the first possible implementation manner of the first aspect, a first adapter board is electrically connected to a side surface of at least two layers of circuit boards located on the same side. Therefore, the first adapter plate does not occupy the area of the upper surface and the lower surface of the circuit board, so that the upper surface and the lower surface of the circuit board can be provided with more electronic components.

With reference to the first possible implementation manner of the first aspect, a first adapter board is electrically connected to an upper surface or a lower surface of one of the at least two layers of circuit boards, and is electrically connected to a side surface of the remaining at least one layer of circuit boards. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and the description thereof is omitted.

With reference to the first possible implementation manner of the first aspect, one end of a first adapter board is electrically connected to an upper surface of one of the at least two layers of circuit boards, and the other end is electrically connected to a lower surface of the remaining one layer of circuit boards.

With reference to the first possible implementation manner of the first aspect, the circuit board assembly includes at least three layers of circuit boards. One end of a first adapter plate is electrically connected with the upper surface of the upper circuit board in at least three layers of circuit boards, and the other end of the first adapter plate is electrically connected with the lower surface of the lower circuit board. The first adapter plate is also electrically connected with the side surface of at least one layer of circuit board between the upper layer of circuit board and the lower layer of circuit board. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and the description thereof is omitted.

With reference to the first possible implementation manner of the first aspect, the first adapter board is a printed circuit board or a flexible circuit board, one first adapter board is disposed on each side of at least two layers of circuit boards, and the structural stability of the multi-layer circuit board in the circuit board assembly is improved through a plurality of first adapter boards disposed around at least two layers of circuit boards.

With reference to the first possible implementation manner of the first aspect, the first adapter board is a flexible circuit board, each side of the at least two layers of circuit boards is wrapped by a first adapter board, and the structural stability of the multi-layer circuit board in the circuit board assembly is improved through the flexible first adapter board which is arranged around the periphery of the at least two layers of circuit boards.

With reference to the first possible implementation manner of the first aspect, a side surface of the circuit board has a plurality of first electrical connectors disposed at intervals. The first electrical connector is electrically connected to a metal wiring inside the circuit board. The first adapter plate is provided with a plurality of second electric connectors which are arranged at intervals. The second electrical connector is electrically connected with the metal wiring inside the first adapter plate. A first electrical connector is electrically connected to a second electrical connector. The first electrical connector and the second electrical connector may be pads.

With reference to the first possible implementation manner of the first aspect, an upper surface of the circuit board has a plurality of third electrical connectors disposed at intervals. The third electrical connector is electrically connected to the metal wiring inside the circuit board. The first adapter plate is provided with a plurality of second electric connecting pieces which are arranged at intervals, and the second electric connecting pieces are electrically connected with metal wiring inside the first adapter plate. A second electrical connector is electrically connected to a third electrical connector. The third electrical connector may be a pad.

In a second possible implementation manner of the first aspect, the circuit board assembly further includes at least one second interposer, where the second interposer and the first interposer are disposed on different sides of the at least two layers of circuit boards, and the second interposer is a flexible circuit board. One end of the second adapter plate is embedded into one layer of circuit board in the at least two layers of circuit boards, the second adapter plate is electrically connected with the circuit board through metallized holes arranged on the second adapter plate and the circuit board, and the other end of the second adapter plate is electrically connected with the rest of at least one layer of circuit board in the at least two layers of circuit boards. One end of the second adapter plate is embedded into a layer of circuit board, so that the area of the upper surface and the lower surface of the circuit board is not occupied.

In a third possible implementation manner of the first aspect, the circuit board assembly further includes at least one insulating support pillar disposed between two adjacent layers of circuit boards for supporting the two adjacent layers of circuit boards. In this way, in the use process of the circuit board assembly, the structural stability and reliability of the circuit board assembly can be improved through the insulating support columns, so that the distance between two adjacent layers of circuit boards is kept unchanged.

With reference to the third possible implementation manner of the first aspect, the insulating support column is in contact with a portion of the upper surface or the lower surface of the circuit board where no electronic component is disposed. In this way, the insulating support column is prevented from contacting with the electronic component, so that the terminal is prevented from applying the received force to the electronic component in the use process, and the electronic component is prevented from being damaged.

In a second aspect, a terminal is provided that includes a circuit board assembly. The circuit board assembly comprises at least two layers of circuit boards and at least one first adapter board. The circuit board has an upper surface and a lower surface disposed opposite to each other. The first adapter plate is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards. The terminal also includes a plurality of electronic components, one electronic component being disposed on an upper surface, or lower surface, of a circuit board in the circuit board assembly. The above terminal has the same technical effects as the circuit board assembly provided in the foregoing embodiment, and will not be described herein.

In a first possible implementation manner of the second aspect, the first adapter board is electrically connected to a surface of at least two layers of circuit boards. Therefore, when the circuit board assembly is returned to the factory for maintenance, the first adapter plate is more easily peeled off from the surface of the circuit board, so that the maintenance cost is reduced.

With reference to the first possible implementation manner of the second aspect, a first adapter board is electrically connected to a side surface of at least two layers of circuit boards located on the same side. Therefore, the first adapter plate does not occupy the area of the upper surface and the lower surface of the circuit board, so that the upper surface and the lower surface of the circuit board can be provided with more electronic components.

With reference to the first possible implementation manner of the second aspect, a first adapter board is electrically connected to an upper surface or a lower surface of one of the at least two layers of circuit boards, and is electrically connected to a side surface of the remaining at least one layer of circuit boards. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and the description thereof is omitted.

With reference to the first possible implementation manner of the second aspect, one end of a first adapter board is electrically connected to an upper surface of one of the at least two layers of circuit boards, and the other end is electrically connected to a lower surface of the remaining one layer of circuit boards.

With reference to the first possible implementation manner of the second aspect, the circuit board assembly includes at least three layers of circuit boards. One end of a first adapter plate is electrically connected with the upper surface of the upper circuit board in at least three layers of circuit boards, and the other end of the first adapter plate is electrically connected with the lower surface of the lower circuit board. The first adapter plate is also electrically connected with the side surface of at least one layer of circuit board between the upper layer of circuit board and the lower layer of circuit board. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and the description thereof is omitted.

With reference to the first possible implementation manner of the second aspect, the first adapter board is a printed circuit board or a flexible circuit board, one first adapter board is disposed on each side of at least two layers of circuit boards, and the structural stability of the multi-layer circuit board in the circuit board assembly is improved through a plurality of first adapter boards disposed around at least two layers of circuit boards.

With reference to the first possible implementation manner of the second aspect, the first adapter board is a flexible circuit board, each side of the at least two layers of circuit boards is wrapped by a first adapter board, and the structural stability of the multi-layer circuit board in the circuit board assembly is improved through the flexible first adapter board which is arranged around the periphery of the at least two layers of circuit boards.

With reference to the first possible implementation manner of the second aspect, a side surface of the circuit board has a plurality of first electrical connectors disposed at intervals. The first electrical connector is electrically connected to a metal wiring inside the circuit board. The first adapter plate is provided with a plurality of second electric connectors which are arranged at intervals. The second electrical connector is electrically connected with the metal wiring inside the first adapter plate. A first electrical connector is electrically connected to a second electrical connector. The first electrical connector and the second electrical connector may be pads.

With reference to the first possible implementation manner of the second aspect, an upper surface of the circuit board has a plurality of third electrical connectors disposed at intervals. The third electrical connector is electrically connected to the metal wiring inside the circuit board. The first adapter plate is provided with a plurality of second electric connecting pieces which are arranged at intervals, and the second electric connecting pieces are electrically connected with metal wiring inside the first adapter plate. A second electrical connector is electrically connected to a third electrical connector. The third electrical connector may be a pad.

In a second possible implementation manner of the second aspect, the circuit board assembly further includes at least one second interposer, where the second interposer and the first interposer are disposed on different sides of the at least two layers of circuit boards, and the second interposer is a flexible circuit board. One end of the second adapter plate is embedded into one layer of circuit board in the at least two layers of circuit boards, the second adapter plate is electrically connected with the circuit board through metallized holes arranged on the second adapter plate and the circuit board, and the other end of the second adapter plate is electrically connected with the rest of at least one layer of circuit board in the at least two layers of circuit boards. One end of the second adapter plate is embedded into a layer of circuit board, so that the area of the upper surface and the lower surface of the circuit board is not occupied.

In a third possible implementation manner of the second aspect, the circuit board assembly further includes at least one insulating support pillar disposed between two adjacent layers of circuit boards for supporting the two adjacent layers of circuit boards. In this way, in the use process of the circuit board assembly, the structural stability and reliability of the circuit board assembly can be improved through the insulating support columns, so that the distance between two adjacent layers of circuit boards is kept unchanged.

With reference to the third possible implementation manner of the second aspect, the insulating support column is in contact with a portion of the upper surface or the lower surface of the circuit board where no electronic component is disposed. In this way, the insulating support column is prevented from contacting with the electronic component, so that the terminal is prevented from applying the received force to the electronic component in the use process, and the electronic component is prevented from being damaged.

In view of the foregoing, embodiments of the present application provide a circuit board assembly and a terminal. In the circuit board assembly, PCBA formed by each layer of circuit board and electronic components integrated on the circuit board can be used as a unit module capable of independently realizing at least one function. In this case, the circuit module occupying a large area of the PCB may be divided into a plurality of the above-described unit modules having a small area. Based on this, in the above circuit board assembly, each layer of circuit board and a plurality of electronic components integrated on the circuit board can be used as the unit module. In addition, the circuit board assembly further comprises a first adapter plate. The first adapter plate can enable circuit boards of different layers to be electrically connected, and further enable a plurality of unit modules to achieve signal transmission. And the plurality of unit modules perform signal transmission in the working process, so that the function of the circuit module occupying a larger PCB area can be realized. Because the planar area of the circuit board is smaller, the circuit boards with multiple layers for bearing electronic components are stacked, so that the component space of the circuit board assembly occupying the terminal in the plane can be reduced, and more space is saved for arranging other devices or batteries with larger capacity. In addition, as the terminal is capable of realizing more functions, the number of electronic components that need to be provided in the terminal is increased. Under the condition, the electronic components can be provided with enough distributing space along the height direction of the circuit board assembly by increasing the number of the circuit boards in the circuit board assembly, so that the aim of integrating more electronic components is fulfilled. In this case, the circuit board assembly increases in height, and the area of the circuit board assembly in the plane can be kept unchanged. Therefore, the integration level of the terminal can be improved on the premise of not influencing the space for distributing the pieces in the plane of the terminal.

Drawings

Fig. 1a is a schematic structural diagram of a terminal according to some embodiments of the present application;

FIG. 1b is a schematic diagram of the electronic component shown in FIG. 1 a;

FIG. 2a is a schematic view of a portion of the circuit board assembly of FIG. 1 a;

FIG. 2b is a schematic diagram of the circuit board in FIG. 2 a;

FIG. 3 is a schematic perspective view of the circuit board assembly of FIG. 1 a;

Fig. 4a is a schematic structural diagram of a connection between an interposer and a side of a circuit board according to some embodiments of the present application;

Fig. 4b is a schematic diagram of another structure of a connection between an interposer and a circuit board according to some embodiments of the present application;

fig. 4c is a schematic diagram of another structure of a connection between an interposer and a side of a circuit board according to some embodiments of the present application;

FIG. 4d is a schematic diagram of another configuration of an interposer electrically connected to a side of a circuit board according to some embodiments of the present application;

fig. 5a is a schematic structural diagram of an electrical connection between an interposer and an upper surface of a circuit board according to some embodiments of the present application;

Fig. 5b is a schematic diagram of another structure of an electrical connection between an interposer and an upper surface of a circuit board according to some embodiments of the present application;

fig. 6a is a schematic structural diagram of an interposer electrically connected to upper and lower surfaces of a circuit board according to some embodiments of the present application;

fig. 6b is a schematic diagram of another structure of an interposer electrically connected to upper and lower surfaces of a circuit board according to some embodiments of the present application;

fig. 6c is a schematic diagram of another structure of an interposer electrically connected to upper and lower surfaces of a circuit board according to some embodiments of the present application;

fig. 6d is a schematic diagram of another structure of an interposer electrically connected to upper and lower surfaces of a circuit board according to some embodiments of the present application;

fig. 6e is a schematic diagram of another structure of an interposer electrically connected to upper and lower surfaces of a circuit board according to some embodiments of the present application;

fig. 7a is a schematic diagram of a structure in which one interposer is an FPC and the other interposer is a PCB according to some embodiments of the present application;

FIG. 7b is a schematic diagram of the electrical connection structure between the interposer embedded in the circuit board in FIG. 7a and the circuit board;

Fig. 7c is a schematic diagram of another structure of a PCB, in which one interposer is an FPC and the other interposer is a PCB according to some embodiments of the present application;

Fig. 7d is a schematic diagram of another structure of a PCB, in which one interposer is an FPC and the other interposer is a PCB according to some embodiments of the present application;

FIG. 8a is a schematic diagram of another perspective view of the circuit board assembly of FIG. 1 a;

FIG. 8b is a schematic view of another perspective view of the circuit board assembly of FIG. 1 a;

FIG. 9 is a schematic diagram of the circuit board of FIG. 8a or FIG. 8b and a first electrical connector on a side of the circuit board;

FIGS. 10a and 10b are schematic views illustrating a process for fabricating the first electrical connector on the side of the circuit board in FIG. 8a or FIG. 8 b;

FIG. 11 is a schematic view of a circuit board with a third electrical connector on a surface according to some embodiments of the present application;

Fig. 12a and 12b are schematic views illustrating an electrical connection process between a layer of the circuit board and the interposer in fig. 8a or 8 b;

FIG. 13a is a schematic top view of the circuit board assembly of FIG. 1 a;

FIG. 13b is a schematic view of another perspective view of the circuit board assembly of FIG. 1 a;

FIG. 13c is a schematic top view of the adapter plate of FIG. 13 b;

FIG. 14a is a schematic top view of the circuit board assembly of FIG. 1 a;

FIG. 14b is a schematic top view of the circuit board assembly of FIG. 1 a;

FIG. 14c is a schematic top view of the circuit board assembly of FIG. 1 a;

Fig. 14d is a schematic structural view of a multi-layer circuit board when the interposer in the circuit board assembly is an FPC according to some embodiments of the present application;

FIG. 15a is a schematic cross-sectional view of the circuit board assembly of FIG. 1 a;

Fig. 15b is a schematic top view of fig. 15 a.

Reference numerals:

01-terminal, 10-display module, 11-middle frame, 12-shell, 20-circuit board assembly, 201-circuit board, 2010-insulating carrier board, 2011-metal wiring, 2012-adhesive layer, 202-first adapter board, 212-second adapter board, 30-electronic component, 300-packaging structure, 301-chip, 40-third electrical connector, 41-first electrical connector, 410-metal film layer, 411-drill bit, 412-solder paste, 42-second electrical connector, 43-lead wire and 50-insulating support column.

Detailed Description

The following description of the technical solutions according to the embodiments of the present invention will be given with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments.

In addition, the terms "first," "second," are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

Furthermore, in the present application, the terms "upper," "lower," "left," "right," and the like are defined with respect to the orientation of the components in the drawings as schematically illustrated, and it should be understood that these directional terms are relative terms, which are used for descriptive and clarity with respect to each other and which may be varied accordingly with respect to the orientation of the components in the drawings.

The embodiment of the application provides a terminal 01 shown in fig. 1 a. The terminal 01 can be consumer electronic products on the market, such as mobile phones, tablet computers, notebook computers, vehicle-mounted computers, wearable electronic products, such as watches or bracelets.

The embodiment of the present application does not particularly limit the specific form of the terminal 01. For convenience of explanation, the following description will be made taking the terminal 01 as an example of a mobile phone.

The mobile phone, as shown in fig. 1a, mainly includes a display module 10, a middle frame 11, and a housing 12. The display module 10 and the middle frame 11 are disposed in the housing 12.

In some embodiments of the present application, the display module 10 may include a Liquid Crystal Display (LCD) screen, and a backlight unit (BLU) for providing a light source to the LCD screen.

Or in other embodiments of the present application, the display module 10 may include an Organic LIGHT EMITTING Diode (OLED) display screen capable of self-luminescence.

In addition, in order to enable the terminal 01 to realize more functions, the terminal 01 further includes a plurality of electronic components 30.

As shown in fig. 1b, in some embodiments of the present application, the electronic component 30 includes a package structure 300, and at least one chip 301 encapsulated within the package structure 300.

In this case, a plurality of electronic components 30 are provided in the terminal 01 so as to be within a limited space in the terminal 01. An embodiment of the present application provides a circuit board assembly 20 as shown in fig. 1a disposed within a terminal 01.

In some embodiments of the present application, as shown in fig. 1a, a circuit board assembly 20 may be provided on a side surface of the middle frame 11 facing the housing 12.

The circuit board assembly 20 includes at least two layers of circuit board 201 as shown in fig. 2 a. The circuit board 201 includes an upper surface A1 and a lower surface A2 disposed opposite to each other.

The electronic component 30 may be integrated on the upper surface A1 or the lower surface A2 of the circuit board 201. As shown in fig. 4a, the electronic component 30 is integrated on both the upper surface A1 and the lower surface A2 of the circuit board 201.

In some embodiments of the present application, the circuit board 201 may be a printed circuit board (printed circuit board, PCB). As shown in fig. 2b, the circuit board 201 includes at least one insulating carrier 2010 as seen in the cross-sectional structure of the circuit board 201. The adjacent two layers of insulating carrier plates 2010 are fixedly connected through an adhesive layer 2012.

In some embodiments of the present application, the upper or lower surface of the insulating carrier 2010 is provided with metal wiring 2011. Alternatively, in other embodiments of the present application, the upper and lower surfaces of the insulating carrier 2010 are each provided with a metal wiring 2011. The metal wiring 2011 in the circuit board 201 is used to electrically connect the plurality of electronic components 30 integrated on the circuit board 201.

In addition, the circuit board assembly 20 also includes at least one first adapter board 202, as shown in fig. 3. The first adapter board 202 is disposed on at least one side of at least two layers of circuit boards 201.

Furthermore, the first adapter board 202 is electrically connected to the at least two-layer circuit board 201, so that the at least two-layer circuit board 201 can realize signal transmission through the first adapter board 202.

It should be noted that the first adapter board 202 may be a PCB or a flexible circuit board (flexible printed circuit board, FPC). The cross-sectional structure of the PCB and FPC is shown in fig. 2b, and may include an insulating carrier 2010 and metal wirings 2011 on upper and lower surfaces of the insulating carrier 2010. The difference is that the material constituting the insulating carrier 2010 in the FPC is a flexible insulating material. For example, the flexible insulating material may be a polymer material such as polyimide or polyester. In this case, the insulating carrier 2010 may be a polyimide film or a polyester film.

In some embodiments of the present application, after the first adapter board 202 electrically connects the two circuit boards 201, signals of one circuit board 201 may be transferred to the other first circuit board 201 through the first adapter board 202. The first adapter board 202 does not need to process the transmitted signal, and thus the electronic component 30 is not required to be integrated on the first adapter board 202.

To enable the first interposer 202 to electrically connect the at least two layers of circuit boards 201, in some embodiments of the application, the first interposer 202 is electrically connected to a surface of the at least two layers of circuit boards 201.

The surface of the circuit board 201 refers to the upper surface A1, the lower surface A2, or the side surface B of the circuit board 201.

The side B of the circuit board 201 is a surface of the circuit board 201 perpendicular to the upper surface A1 or the lower surface A2 of the circuit board 201.

The manner in which the first interposer 202 electrically connects the at least two layers of circuit boards 201 is illustrated below.

Example one

In this example, a first adapter board 202 is electrically connected to a side B of at least two layers of circuit boards 201 on the same side.

For example, in some embodiments of the present application, as shown in FIG. 4a, the circuit board assembly 20 includes a circuit board 201a and a circuit board 201b.

The first adapter board 202a is electrically connected to the side B on the left side of the circuit board 201a and the side B on the left side of the circuit board 201B. The first adapter board 202B is electrically connected to the side B on the right side of the circuit board 201a and the side B on the right side of the circuit board 201B.

In this case, the circuit board 201a and the electronic component 30 integrated on the circuit board 201a constitute a first unit module. The first unit module may transmit the generated signal to the circuit board 201b through the first conversion board 202a and the first conversion board 202b during operation. The circuit board 201b and the electronic component 30 integrated on the circuit board 201b form a second unit module, and the second unit module can process the signals output by the first conversion board 202a and the first conversion board 202b after receiving the signals, so that the circuit board assembly 20 can realize the corresponding functions.

As can be seen from the above, the circuit board 201a and the circuit board 201b can be electrically connected to the first adapter board 202a and the first adapter board 202b to realize signal communication.

In other embodiments of the present application, when the circuit board 201a and the circuit board 201b can communicate signals only through the first adapter board 202a, only the first adapter board 202a may be provided in the circuit board assembly 20. Or when the circuit board 201a and the circuit board 201b can realize signal communication only through the first adapter board 202b, only the first adapter board 202b may be provided in the circuit board assembly 20.

In still other embodiments of the present application, as shown in fig. 4b, the circuit board assembly 20 includes a circuit board 201a, a circuit board 201b, and a circuit board 201c.

Or as shown in fig. 4c, the circuit board assembly 20 includes a circuit board 201a, a circuit board 201b, a circuit board 201c, and a circuit board 201d.

For the configuration of fig. 4a and 4c, the first adapter plate 202 is arranged in the same manner as described above in electrical connection with side B of each circuit board 201 in the circuit board assembly 20.

Furthermore, in still other embodiments of the present application, when at least three layers of circuit boards 201 are included in the circuit board assembly 20, the first adapter board 202 may not need to electrically connect all of the sides B of the circuit boards 201.

For example, as shown in fig. 4d, the first interposer 202a on the left side may electrically connect the circuit board 201a and the side B of the circuit board 201B, so that the circuit board 201a and the circuit board 201B realize signal transmission through the interposer 202 a.

As can be seen from the above description, in the present example, since the first adapter board 202 is disposed on at least one side of the at least two layers of circuit boards 201, the first adapter board 202 is electrically connected to the side B of the circuit board 201. For example, the first adapter plate 202a is electrically connected to the left side B of the circuit board 201a in fig. 4 a. In this case, the first adapter plate 202a is not in contact with the upper surface A1 and the lower surface A2 of the circuit board 201 a. The first adapter board 202a does not occupy the area of the upper surface A1 and the lower surface A2 of the circuit board 201a, so that the upper surface A1 and the lower surface A2 of the circuit board 201a can be provided with more electronic components 30.

Example two

In this example, a first adapter board 202 is electrically connected to the upper surface A1 or the lower surface A2 of one of the at least two circuit boards 201, and is electrically connected to the side B of the remaining at least one circuit board 201 of the at least two circuit boards 201.

Taking the circuit board assembly 20 as an example, which includes a circuit board 201a, a circuit board 201B and a circuit board 201c, in some embodiments of the present application, as shown in fig. 5a, a first adapter board 202a located at the left side of the circuit board assembly 20 is electrically connected to an upper surface A1 of the circuit board 201a and is electrically connected to a side B of the circuit board 201B.

In this case, the circuit board 201a and the circuit board 201b may be electrically connected through the first adapter board 202a, and signal transmission may be achieved.

Further, the first adapter plate 202B located on the right side in the circuit board assembly 20 is electrically connected to the upper surface A1 of the circuit board 201a, and is electrically connected to the circuit board 201B and the side face B of the circuit board 201 c. The circuit board 201a, the circuit board 201b, and the circuit board 201c may be electrically connected through the first adapter board 202b, and signal transmission may be achieved.

Alternatively, in other embodiments of the present application, as shown in fig. 5B, the first adapter plate 202a on the left side is electrically connected to the upper surface A1 of the circuit board 201B and is electrically connected to the side B of the circuit board 201 c. The circuit board 201b and the circuit board 201c may be made to realize signal transmission through the first adapter board 202 a.

It should be noted that, since the upper surface A1 and the lower surface A2 of the circuit board 201 are defined with respect to the schematic placement orientation of the circuit board assembly 20 in the drawings, only the circuit board assembly 20 needs to be turned over to obtain a solution that one first adapter board 202 of the circuit board assembly 20 is electrically connected to the lower surface A2 of the circuit board 201 and is electrically connected to the side B of at least one layer of the circuit board 201 except the circuit board 201, which is not described herein.

Example three

In this example, one end of one first adapter board 202 is electrically connected to the upper surface A1 of one of the at least two layers of circuit boards 201, and the other end is electrically connected to the lower surface A2 of the remaining one of the at least two layers of circuit boards 201.

In some embodiments of the present application, taking the circuit board assembly 20 including the circuit board 201a and the circuit board 201b as an example, as shown in fig. 6a, the first board 202a on the left side is electrically connected to the upper surface A1 of the circuit board 201a and the lower surface A2 of the circuit board 201 b. The first adapter plate 202b on the right side is arranged in the same manner as the first adapter plate 202 b.

In this case, the circuit boards 201a and 201b realize signal transmission through the first adapter board 202a and the first adapter board 202 b.

Alternatively, in other embodiments of the present application, as shown in fig. 6B, the first adapter board 202B located on the right side may also be disposed in the manner of example one, that is, electrically connected to the circuit board 201a and the side B of the circuit board 201B.

Still or in other embodiments of the present application, as shown in fig. 6c, the first adapter plate 202B located on the right side may also be disposed in a second exemplary manner, that is, electrically connected to the upper surface A1 of the circuit board 201a and electrically connected to the side B of the circuit board 201B.

In addition, in the case where the circuit board assembly 20 includes at least three layers of circuit boards, one end of one first adapter board 202 is electrically connected to the upper surface A1 of the upper layer circuit board 201 and the other end is electrically connected to the lower surface A2 of the lower layer circuit board 201.

The first adapter board 202 is also electrically connected to the side B of at least one layer of the circuit boards 201 between the upper and lower layers of the circuit boards 201.

As shown in fig. 6d, the first adapter plate 202a on the left side is electrically connected to the upper surface A1 of the circuit board 201a, the side surface B of the circuit board 201B, and the lower surface A2 of the circuit board 201 c. The first adapter plate 202b on the right side is arranged in the same manner as the first adapter plate 202 b.

In this case, the circuit board 201a, the circuit board 201b, and the circuit board 201c realize signal transmission through the first adapter board 202a and the first adapter board 202 b.

Or in other embodiments of the present application, as shown in fig. 6e, the first adapter board 202b located on the right side may be further electrically connected to the upper surface A1 of the circuit board 201a and the lower surface A2 of the circuit board 201b, so that the circuit board 201a and the circuit board 201b implement signal transmission through the first adapter board 202 b.

In addition, the first adapter plate 202b located on the right side may also adopt the arrangement manner of example one or example two, which will not be described in detail herein.

As can be seen from the above, when a first adapter board 202 is electrically connected to the upper surface A1 or the lower surface A2 of the circuit board 201, the first adapter board 202 is not required to be electrically connected to the side B of the circuit board 201. For example, in fig. 6e the first adapter plate 202a is electrically connected to the upper surface A1 of the circuit board 201 a. At this time, the first adapter board 202a no longer needs to be electrically connected to the side B of the circuit board 201 a.

In this way, the first adapter plate 202a can realize signal transmission between the first adapter plate 202a and the circuit board 201a only by satisfying the manufacturing precision when electrically connected with the upper surface A1 of the circuit board 201 a. Thus, it can be avoided that when both the upper surface A1 and the side surface B of the circuit board 201a are electrically connected to the first adapter board 202a, the positions where the first adapter board 202a is electrically connected to the upper surface A1 of the circuit board 201a and the side surface B of the circuit board 201a are required to satisfy the above-described manufacturing accuracy. Further, the manufacturing process of the circuit board assembly 20 can be simplified, and the manufacturing cost can be reduced.

Similarly, when a first adapter board 202 is electrically connected to the side B of a circuit board 201, the first adapter board 202 is not required to be electrically connected to the upper surface A1 or the lower surface A2 of the circuit board 201. For example, as in fig. 6c, the first adapter plate 202B is electrically connected to the side B of the circuit board 201B. At this time, the first adapter board 202b is not required to be electrically connected to the lower surface A2 of the circuit board 201 b.

The first, second and third embodiments described above provide an explanation of a manner in which a portion of the first adapter board 202 is electrically connected to the surface of the at least two-layer circuit board 201. Since the first adapter plate 202 is electrically connected to the surface of the circuit board 201, the first adapter plate 202 is more easily peeled off from the surface of the circuit board 201 at the time of returning the circuit board assembly 20 to the factory for maintenance, thereby reducing maintenance costs.

The present application also provides another way of electrically connecting at least two layers of circuit boards 201, as in example four below.

Example four

In this example, the circuit board assembly 20 includes a circuit board 201a and a circuit board 201 b. The circuit board assembly 20 further includes at least one second interposer 212 as shown in fig. 7 a.

It should be noted that the second adapter plate 212 may be used only for signal transmission, and no signal processing is required. The second interposer 212 does not need to have integrated electronic components 30 thereon.

The second interposer 212 and the first interposer 202 are disposed on different sides of at least two layers of circuit boards. The second interposer 212 is an FPC. The first adapter board 202 may be an FPC or a PCB.

In this case, in some embodiments of the present application, as shown in fig. 7a, one end of the second interposer 212 is embedded in the circuit board 201a and electrically connected with the circuit board 201 a. In addition, the other end of the second interposer 212 is embedded in the circuit board 201b, and is electrically connected to the circuit board 201 b. The first right-hand adapter plate 202 is provided in the manner of example one.

In this case, in order to enable one end of the second interposer 212 embedded in the circuit board 201a to be electrically connected with the circuit board 201 a. As shown in fig. 7b, in the process of manufacturing the circuit board 201a, one end of the second interposer 212 is pressed into two adjacent insulating carrier boards 2010 in the circuit board 201 a.

Metallized holes (plating through hole, PTH) as shown in fig. 7b are then formed by punching and hole wall metallization. In this case, the metal wiring 2011 on the circuit board 201a is electrically connected to the metal wiring 2011 on the second interposer 212 through the PTH, thereby achieving the electrical connection of the second interposer 212 to the circuit board 201 a.

In this case, since one end of the second interposer 212 is embedded in a circuit board, for example, the circuit board 201a, the areas of the upper surface A1 and the lower surface A2 of the circuit board 201a are not occupied, so that the upper surface A1 and the lower surface A2 of the circuit board 201a can be provided with more electronic components 30.

In addition, the other end of the second interposer 212 is electrically connected to the remaining at least one circuit board 201 of the at least two layers of circuit boards.

For example, in fig. 7a, the other end of the second interposer 212 is embedded in the circuit board 201 b. The other end of the second interposer 212 embedded in the circuit board 201b is electrically connected to the circuit board 201b in the same manner as described above, and will not be described again here.

Or in some embodiments of the present application, as shown in fig. 7c, one end of the second interposer 212 is embedded in the circuit board 201a and electrically connected to the circuit board 201 a. In addition, the other end of the second interposer 212 is electrically connected to the side B of the circuit board 201B. The first right-hand adapter plate 202 is arranged in the manner of example three.

Or in some embodiments of the present application, as shown in fig. 7d, one end of the second interposer 212 is embedded in the circuit board 201a and electrically connected to the circuit board 201 a. Further, the other end of the second interposer 212 is electrically connected to the lower surface A2 of the circuit board 201 b. The first adapter plate 202 on the right side is arranged in the manner of example two.

In summary, in the present embodiment, one end of the second interposer 212 formed by the FPC may be pressed into the circuit board 201 during the manufacturing process of the circuit board 201, and the one end of the second interposer 212 pressed into the circuit board 201 may be electrically connected to the circuit board 201 by manufacturing the PTH.

With the continuous increase of the requirements of the endurance and the integration of functions of the terminal 01, the number of circuit boards 201 in the circuit board assembly 20 can be increased when the area of the plane (XOY plane as shown in fig. 3) for arranging the circuit board assembly 20 in the terminal 01 is smaller and the number of electronic components 30 to be arranged in the terminal 01 is larger.

At this time, since the area in the plane of the circuit board assembly 20 (XOY plane as shown in fig. 3) is affected by the limitation of the component space in the plane of the terminal 01, it is not possible to increase any more, so that a plurality of electronic components 30 have a sufficient layout space in the Z direction by increasing the height of the circuit board assembly 20 in the Z direction (fig. 3), i.e., increasing the number of circuit boards 201 in the circuit board assembly 20 to carry more electronic components 30.

As can be seen from the above, the number of circuit boards 201 in the circuit board assembly 20 is proportional to the height of the circuit board assembly 20 along the Z direction. The number of circuit boards 201 in the circuit board assembly 20 cannot be increased wirelessly, and the overall size of the terminal 01 needs to be considered in the design process. For example, when the height of the circuit board assembly 20 along the Z direction is set according to the thickness of the terminal 01 along the Z direction (as shown in fig. 1 a), the phenomenon that the middle frame 11 cannot be engaged with the housing 12 due to the too large height of the circuit board assembly 20 along the Z direction is avoided.

The XOY plane is parallel to the surface of the display module 10 on which the image is displayed, and the upper surface A1 and the lower surface A2 of the circuit board 201. The Z direction is parallel to the side surface B of the circuit board 201.

The number of circuit boards 201 in the circuit board assembly 20 and the arrangement of the electronic components 30 integrated thereon will be described below by taking the circuit board assembly 20 including the baseband circuit functional module and the radio frequency circuit functional module as an example. For convenience of explanation, the following description will be given by taking, as an example, a structure in which the circuit board assemblies 20 each electrically connect the multilayer circuit boards 201 using the first adapter board 202.

Example five

As shown in fig. 4a, the circuit board assembly 20 may include two layers of circuit boards, such as circuit board 201a and circuit board 201b. In fig. 4a, the upper surface A1 and the lower surface A2 of each circuit board 201 of the circuit board assembly 20 are each integrated with a plurality of electronic components 30.

The plurality of electronic components 30 integrated on the circuit board 201a may be a central processing unit (central processing unit, CPU), an audio/video control chip, a memory, such as a Double Data Rate (DDR) synchronous dynamic random access memory (dram), a random access memory (random access memory, RAM), a flash memory (NAND FLASH), or a Read Only Memory (ROM), etc.

In this case, a unit module composed of a plurality of electronic components 30 integrated on the circuit board 201a and the circuit board 201a serves as the above-described baseband circuit function module. The baseband circuit functional module is used for demodulating, descrambling, despreading and decoding the wireless signals received by the radio frequency circuit functional module and processing the wireless signals.

In some embodiments of the present application, when the CPU functional chip, the memory functional chip, etc. are packaged in one package structure 300 and the package structure 300 is integrated on the circuit board 201a with a smaller size, the printed circuit board assembly (printed circuit board assembly, PCBA) structure is configured to implement the functions of the baseband circuit. The smaller PCBA may be referred to as a system in package (SYSTEM IN A PACKAGE, SIP) structure.

In addition, the plurality of electronic components 30 integrated on the circuit board 201b may be a radio frequency receiving chip, a transmitting chip, a power amplifier, a Wi-Fi chip, a bluetooth chip, a GPS chip, etc., respectively.

In this case, the unit module composed of the plurality of electronic components 30 integrated on the circuit board 201b and the circuit board 201b serves as the above-described radio frequency circuit function module. The radio frequency circuit functional module is used for realizing a wireless communication function.

Example six

In the case where the planar area for disposing the circuit board assembly 20 in the terminal 01 is further reduced, the above-described functional modules can be further detached and the number of circuit boards 201 in the circuit board assembly 20 can be increased.

As shown in fig. 4b, the circuit board assembly 20 may include three layers of circuit boards, such as circuit board 201a, circuit board 201b, and circuit board 201c.

The plurality of electronic components 30 integrated on the circuit board 201a are the same as those in example five, and the unit module formed by the plurality of electronic components 30 integrated on the circuit board 201a and the circuit board 201a is used as a baseband circuit functional module.

In addition, the radio frequency circuit functional module is split into a first functional sub-module and a second functional sub-module with independent functions.

In this case, the plurality of electronic components 30 integrated on the circuit board 201b may be a radio frequency receiving chip, a transmitting chip, and a power amplifier, respectively.

At this time, the unit module composed of the plurality of electronic components 30 integrated on the circuit board 201b and the circuit board 201b serves as the first functional sub-module. The first function submodule is used for realizing a long-distance wireless communication function.

The plurality of electronic components 30 integrated on the circuit board 201c may be a Wi-Fi chip, a bluetooth chip, or a GPS chip, respectively.

At this time, the unit module composed of the plurality of electronic components 30 integrated on the circuit board 201c and the circuit board 201c serves as the second functional sub-module. The second function submodule is used for realizing a short-range wireless communication function.

Example seven

In the case where the planar area for disposing the circuit board assembly 20 in the terminal 01 is further reduced and the number of the electronic components 30 is further increased, the number of circuit boards in the circuit board assembly 20 may be further increased on the basis of example six.

As shown in fig. 4c, the circuit board assembly 20 may include four layers of circuit boards, such as circuit board 201a, circuit board 201b, circuit board 201c, and circuit board 201d.

The plurality of electronic components 30 integrated on the circuit board 201a are the same as those in the fifth example, and the unit module formed by the plurality of electronic components 30 integrated on the circuit board 201a and the circuit board 201a is the baseband circuit functional module.

The plurality of electronic components 30 integrated on the circuit board 201b are the same as those of the sixth example, and the unit module formed by the plurality of electronic components 30 integrated on the circuit board 201b and the circuit board 201b is used as the first functional sub-module for realizing the long-distance wireless communication function.

The plurality of electronic components 30 integrated on the circuit board 201c are the same as those of the sixth example, and the unit module formed by the plurality of electronic components 30 integrated on the circuit board 201c and the circuit board 201c is used as the second functional sub-module for realizing the above-described short-range wireless communication function.

The circuit boards 201a, 201b, and 201c are electrically connected through the first adapter board 202 to realize the functions of the motherboard.

In addition, the plurality of electronic components 30 integrated on the circuit board 201d may be an earphone, a motor, a data transmission and charging interface connector, a switch key interface connector, and the like, respectively.

At this time, the unit module formed by the plurality of electronic components 30 integrated on the circuit board 201b and the circuit board 201b may be used as a sub-board to realize auxiliary functions, so that the functions that the terminal 01 can realize are more diversified.

The foregoing is illustrative of the number of circuit boards 201 in the circuit board assembly 20 and the arrangement of the electronic components 30 integrated thereon, and other examples are similarly available, and will not be described in detail herein.

In the case where the thickness of the terminal 01 in the Z-direction is limited, in order to control the number of circuit boards 201 in the circuit board assembly 20, a unit module composed of one layer of the circuit boards 201 and a plurality of electronic components 30 integrated on the circuit boards 201 can independently perform at least one function.

Furthermore, in order to electrically connect the first adapter plate 202 with the side B of the circuit board 201, in some embodiments of the application, as shown in fig. 8a, the side B of the circuit board 201 has a plurality of first electrical connectors 41 arranged at intervals.

Based on this, in order to enable signal communication between the circuit boards 201 of different layers through the first adapter board 202, as shown in fig. 9, the first electrical connector 41 located on the side B of the circuit board 201 is electrically connected to the metal wiring 2011 inside the circuit board 201.

In addition, as shown in fig. 8a, a plurality of second electrical connectors 42 are disposed on the first adapter plate 202 at intervals. Wherein the first electrical connector 41 is electrically connected to the second electrical connector 42 one by one.

In some embodiments of the present application, the first electrical connector 41 and the second electrical connector 42 may be pads. The pads are rectangular as shown in fig. 8 a. Or may also be circular. The shape of the bonding pad is not limited in the application.

In the case that the first electrical connector 41 is a bonding pad, the method for manufacturing the first electrical connector 41 may include, first, electroplating a metal film layer 410 on a side B of a circuit board 201 as shown in fig. 10 a. The material constituting the metal thin film layer 410 may be copper.

Then, as shown in fig. 10b, a drilling process is performed using a drill 411 to remove unnecessary portions of the unnecessary metal film layer 410, so as to form a plurality of first electrical connectors 41 arranged at intervals.

It should be noted that the specification of the drill 411, for example, the diameter of the drill 411, may be selected according to the spacing between two adjacent first electrical connectors 41 to be fabricated on the side B of the circuit board 201. For example, when the pitch of adjacent two first electrical connectors 41 is large, a drill 411 having a large diameter may be selected. Or when the pitch of two adjacent first electrical connectors 41 is smaller, a smaller diameter drill bit 411 may be selected.

The second electrical connector 42, which is formed by means of the drill bit 411, is generally rectangular. Therefore, when the second electrical connector 42 is rectangular, it is easy to manufacture.

In other embodiments of the present application, the unnecessary portions of the metal film layer 410 may be removed by a laser process to form the second electrical connector 41.

The intervals between the first electrical connectors 41 located on the same side of the circuit board 201 may be set according to the circuit structure in the circuit board 201 and the circuit structure in another layer of circuit board 201 that needs to be electrically connected with the circuit board 201, so long as it is ensured that signal transmission can be achieved after the two layers of circuit boards 201 are electrically connected through the first adapter board 202.

The manner in which the first adapter board 202 is electrically connected to the side B of the at least two-layer circuit board 201 is exemplified below. For example, in some embodiments of the present application, circuit board assembly 20, as shown in fig. 8a, includes a circuit board 201a and a circuit board 201b.

One first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected to one second electrical connector 42 on the upper side of the first adapter plate 202, and one first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected to one second electrical connector 42 on the lower side of the first adapter plate 202.

In addition, in order to enable the circuit board 201a and the circuit board 201b to be electrically connected, as shown in fig. 8a, a lead 43 for electrically connecting at least two second electrical connectors 42, for example, upper and lower two second electrical connectors 42 located in the same column in the vertical direction in fig. 8a, is further provided on the first adapter plate 202.

In this case, one first electrical connector 41 on the side B1 of the circuit board 201a and one first electrical connector 41 on the side B2 of the circuit board 201B may be electrically connected through the first adapter board 202, thereby enabling signal transmission between the circuit board 201a and the circuit board 201B. The side B1 of the circuit board 201a is located on the same side as the side B2 of the circuit board 201B.

The above is an illustration of the first interposer 202 being electrically connected to the sides of two adjacent circuit boards.

Or, for another example, in other embodiments of the present application, the circuit board assembly 20, as shown in fig. 8b, includes three layers of circuit boards, circuit board 201a, circuit board 201b, and third circuit board 201c, respectively.

In this case, one first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected to one second electrical connector 42 above the second left column on the first adapter plate 202, and one first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected to one second electrical connector 42 below the second left column on the first adapter plate 202. In addition, the two second electrical connectors 42 are electrically connected by leads 43.

In this case, one first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected with one first electrical connector 41 on the side B2 of the circuit board 201B through the first adapter plate 202. Thereby realizing signal transmission between the circuit board 201a and the circuit board 201 b.

Or one first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected to one second electrical connector 42 on the first adapter plate 202 above the third left column, and one first electrical connector 41 on the side B3 of the third circuit board 201c is electrically connected to one second electrical connector 42 on the first adapter plate 202 below the third left column. In addition, the two second electrical connectors 42 are electrically connected by leads 43.

In this case, one first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected with one first electrical connector 41 on the side B3 of the third circuit board 201c through the first adapter plate 202. Thereby realizing signal transmission between the circuit board 201b and the third circuit board 201 c.

Or one first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected to one second electrical connector 42 on the first adapter plate 202 above the first right column, and one first electrical connector 41 on the side B3 of the third circuit board 201c is electrically connected to one second electrical connector 42 on the first adapter plate 202 below the first right column. In addition, the two second electrical connectors 42 are electrically connected by leads 43.

In this case, one first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected with one first electrical connector 41 on the side B3 of the third circuit board 201c through the first adapter plate 202. Thereby realizing signal transmission between the circuit board 201a and the third circuit board 201 c.

Or one first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected to one second electrical connector 42 on the first adapter plate 202 above the first left column, one first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected to one second electrical connector 42 in the middle of the first left column on the first adapter plate 202, and one first electrical connector 41 on the side B3 of the third circuit board 201c is electrically connected to one second electrical connector 42 below the first left column on the first adapter plate 202. In addition, three second electrical connectors 42 are electrically connected by leads 43.

In this case, one first electrical connector 41 on the side B1 of the circuit board 201a, one first electrical connector 41 on the side B2 of the circuit board 201B, and one first electrical connector 41 on the side B3 of the third circuit board 201c are electrically connected through the first adapter plate 202. Thereby realizing signal transmission among the circuit board 201a, the circuit board 201b, and the third circuit board 201 c.

The side B1 of the circuit board 201a, the side B2 of the circuit board 201B, and the side B3 of the third circuit board 201c are located on the same side.

The above description is given of the manner in which the first adapter board 202 is electrically connected to the side surface B of the circuit board 201. As can be seen from the above description, the first adapter plate 202 can also be electrically connected to the upper surface A1 or the lower surface A2 of a circuit board 201. In this case, as shown in fig. 11, the third electrical connector 40 needs to be provided on the upper surface A1 (or the lower surface A2) of the circuit board 201. A third electrical connector 40 is electrically connected to a second electrical connector 42 on the first adapter plate 202.

In an embodiment of the present application, the third electrical connector 40 may be a pad. In the case where the circuit board 201 is a PCB, the copper layer covered on the insulating carrier 2010 shown in fig. 2b may be patterned to form the metal wiring 2011 in the process of manufacturing the circuit board 201. The metal wiring 2011 may serve as the third electrical connector 40.

As can be seen from the above description, the first adapter board 202 may be a PCB or an FPC, in which case, when the second electrical connector 42 is a pad, the copper layer covered on the insulating carrier 2010 may be patterned to form a plurality of metal wirings 2011 during the manufacturing process of the PCB or the FPC. The plurality of metal wirings 2011 may serve as the second electrical connectors 42, and leads 43 for electrically connecting different second electrical connectors 42.

In the case where the first electrical connector 41 and the second electrical connector 42 are pads, a manner in which the first adapter board 202 is electrically connected to the circuit board 201 will be described.

First, as shown in fig. 12a, the first electrical connector 41 on the side B of the one-layer circuit board 201 is pre-coated with solder paste 412 by printing, spraying (jetting), or dispensing.

Then, as shown in fig. 12b, the circuit board 201 integrated with the electronic component 30 is picked up using an automated mounting apparatus, and placed on the horizontal first transfer board 202 by bonding. Wherein, a first electrical connector 41 pre-coated with solder paste 412 on the circuit board 201 is adhered to a second electrical connector 42 on the first adapter board 202 through the solder paste 412.

Then, the first electrical connector 41 and the second electrical connector 42 are soldered by the melted solder paste 412 by means of high-temperature reflow.

Or in other embodiments of the application, solder paste 412 may be replaced with conductive paste. In this case, after the circuit board 201 integrated with the electronic component 30 is placed on the horizontal first adapter board 202, the conductive adhesive may be cured by high-temperature curing, so that one first electrical connector 41 coated with the conductive adhesive is adhered and electrically connected with one second electrical connector 42 on the first adapter board 202 through the cured conductive adhesive.

In other embodiments of the present application, in order to electrically connect the first adapter board 202 to the circuit board 201, the first electrical connector 201 disposed on the side B of the circuit board 201 and the second electrical connector 202 disposed on the first adapter board 202 may be configured as a plug-in structure.

For example, the first electrical connector 201 is a pin and the second electrical connector 202 is a recess that mates with the pin. Or the first electrical connector 201 is a groove and the second electrical connector 202 is a pin that mates with the groove.

In summary, the circuit board assembly 20 according to the embodiment of the application has a multi-layer circuit board 201. The upper and lower surfaces A1, A2 of each layer of circuit board 201 are used for integrating the electronic components 30. Thus, the PCBA formed by each layer of the circuit board 201 and the electronic component 30 integrated thereon can be used as a unit module capable of independently realizing at least one function. In this case, the circuit module occupying a large area of the PCB may be divided into a plurality of the above-described unit modules having a small area. Based on this, in the circuit board assembly 20, each layer of the circuit board 201 and the plurality of electronic components 30 integrated on the circuit board 201 may function as a unit module. In the working process, the plurality of unit modules perform signal transmission, so that the function of the circuit module which occupies a larger area of the PCB originally can be realized.

Since the planar area of the circuit board 201 is small, stacking multiple layers of circuit boards 201 for carrying the electronic components 30 can reduce the component space of the circuit board assembly 20 occupied by the terminal 01 in the plane (XOY plane), thereby saving more space for arranging other devices or a battery with larger capacity.

Further, as the terminal 01 can realize more functions, the number of electronic components 30 that need to be provided in the terminal 01 increases. In this case, the purpose of integrating more electronic components 30 can be achieved by increasing the number of circuit boards 201 in the circuit board assembly 20 so that the electronic components 30 have sufficient layout space in the height direction (Z direction) of the circuit board assembly 20. In this case, the height (Z direction) of the circuit board assembly 20 increases, and the area of the circuit board assembly 20 in the plane (XOY plane) can be kept unchanged. Therefore, the integration level of the terminal 01 can be improved on the premise of not influencing the space for arranging the components in the plane of the terminal 01.

On the basis of this, the circuit board assembly 20 further comprises a first adapter plate 202 in order to enable signal transmission between the plurality of unit modules of the circuit board assembly 20 during operation. The first adapter plate 202 can be electrically connected with the first electrical connectors 41 on the side surface of the circuit board 201 of one layer through the second electrical connectors 42, or electrically connected with the third electrical connectors 40 on the upper surface A1 or the lower surface A2 of the circuit board 201 of one layer, so that the circuit boards 201 of different layers can be electrically connected through the first adapter plate 202, and further, the signal transmission of the unit modules can be realized.

In other embodiments, where the circuit board assembly 20 further includes the second interposer 212, at least two layers of the circuit boards 201 may be electrically connected by the second interposer 212 having one end embedded in the circuit board 201, so that the plurality of unit modules can realize signal transmission.

In some embodiments of the present application, to improve structural stability of the multi-layered circuit board 201 in the circuit board assembly 20, as shown in fig. 13a, each side of the multi-layered circuit board 201 may be provided with a first adapter board 202.

For example, in the case where the first adapter board 202 is a PCB, as shown in fig. 13B, the circuit board assembly 20 includes a plurality of first adapter boards 202, one first adapter board 202 being connected to one side B of the circuit board 201. The plurality of first tabs 202 are spliced to form a closed frame structure as shown in fig. 13 c. It should be noted that the connection of the first adapter plate 202 to the side B of the circuit board 201 means that, when the first adapter plate 202 is electrically connected to the circuit board 201, the second electrical connector 42 on the first adapter plate 202 is electrically connected to the first electrical connector 41 on the side B of the circuit board 201 through conductive paste or solder paste.

Or may be bonded to the first adapter plate 202 by an adhesive layer when one of the sides of the circuit board 201 is not provided with the first electrical connector 41.

In this way, the first adapter plate 202 is provided on each side of the circuit board 201 to support it, so that the space between two adjacent layers of circuit boards 201 can be kept stable, and the reliability of the circuit board assembly 20 as shown in fig. 13b can be improved.

Based on this, in order to improve stability of signal transmission between the plurality of circuit boards 201 requiring electrical connection, in the case where each side of the circuit board 201 is connected to the first adapter board 202, each side B of the circuit board 201 is electrically connected to the first adapter board 202. In this case, there may be a plurality of first electrical connectors 41 on each side of the circuit board 201, and each first electrical connector 41 is electrically connected to one second electrical connector 42 on the first adapter board 202 on the side of the circuit board 201 through solder paste or conductive paste.

Thus, a plurality of first electrical connectors 41 are disposed on each side B of the circuit board 201 at intervals, and signals on the circuit board 201 can be transmitted to the first adapter board 202 through the first electrical connectors 41 on each side of the circuit board 201. Thus, the output channels of the circuit structures on the circuit board 201 are increased, and the problem of signal transmission failure caused by failure of a certain first electric connector 41 is avoided, so that signal transmission among a plurality of circuit boards 201 electrically connected through the first adapter board 202 is more stable.

The above description is given taking the shape of the circuit board 201 in plan view as a rectangle as an example. In some embodiments of the application, the top view shape of the circuit board 201 may be rectangular as shown in fig. 13 a. Or may be circular as shown in fig. 14a, L-shaped as shown in fig. 14b, or irregularly shaped as shown in fig. 14 c.

With the circuit boards 201 shown in fig. 14a, 14B and 14c, since the structure is complicated with respect to the rectangle shown in fig. 13a, the first adapter board 202 is provided so that all the sides B of the respective circuit boards 201 can be provided. The first adapter plate 202 may be an FPC.

As shown in fig. 14d, the first adapter plate 202 formed by the FPC has a flexible and bendable property, so that each side B of the first adapter plate 202 can be wrapped along the edge of the circuit board 201, so that the first adapter plate 202 is attached to the side of the circuit board 201 more tightly, and the reliability of the electrical connection between the first adapter plate 202 and the circuit board 201 and the reliability of signal transmission are improved.

In other embodiments of the present application, the circuit board 201 may also have a C-shape, a convex shape, a concave shape, etc. in plan view. In this case, as described above, the first adapter board 202 constituted by the FPC may be used to cover all sides of each circuit board. The first adapter plate 202 is now in a closed frame configuration.

Further, in the embodiment of the present application, when the first adapter board 202 is electrically connected only to the side B of each circuit board 201, the shape and the external dimensions of the horizontal cross-section of all the circuit boards 201 in the circuit board assembly 20 are the same. For example, the horizontal cross-sections of all the circuit boards 201 in the circuit board assembly 20 are rectangular in shape as shown in fig. 13a, or circular in shape as shown in fig. 14 a.

In this way, the first adapter board 202 can be more easily electrically connected to the side B of the circuit board 201 in different layers, so as to avoid the occurrence of a protrusion or a depression in the circuit board assembly 20 when the first adapter board 202 formed by FPC is electrically connected to the side of the circuit board 201 in different specifications due to the specification of the circuit board 201 in a certain layer and other circuit boards 201.

Or, in the process of manufacturing the circuit board assembly 20, when the first adapter board 202 formed by using the PCB is electrically connected with the side surfaces of the circuit boards 201 with different specifications, the space between the first adapter board 202 and part of the circuit boards 201 is different, so that the coating amount of the circuit boards with different specifications needs to be independently adjusted when the solder paste or the conductive adhesive is coated, thereby causing the problem of complex manufacturing process.

In addition, in order to improve structural stability and reliability of the circuit board assembly 20 during use thereof such that the spacing between adjacent two layers of circuit boards 201 remains unchanged, the circuit board assembly 20 further includes at least one insulating support post 50, as shown in fig. 15 a.

The insulating support column 50 is disposed between two adjacent layers of circuit boards 201, and is used for supporting the two adjacent layers of circuit boards 201.

In the embodiment of the present application, the material constituting the insulating support group 50 may include at least one of a resin having insulating properties and a ceramic.

In order to avoid the insulating support group 50 from affecting the electronic component 30 integrated on the upper surface A1 or the lower surface A2 of the circuit board 201, as shown in fig. 15a, the insulating support column 50 is in contact with a portion of the upper surface A1 or the lower surface A2 of the circuit board 201 where the electronic component 30 is not disposed.

In this way, the insulating support column 50 is prevented from contacting the electronic component 30, so that the terminal 01 applies the force applied to the electronic component 30 during the use process of the insulating support column 50, and the electronic component 30 is prevented from being damaged.

In other embodiments of the present application, in the surface of the circuit board 201 that contacts the insulating support posts 50, as shown in fig. 15b, the orthographic projection of the insulating support posts 50 on the surface is located at the angle between two adjacent intersecting edges (e.g., C1 and C2) of the surface.

Based on this, an insulating support column 50 may be disposed at each position of the above included angle of the circuit board 201, so that each insulating support column 50 disposed on the same layer of circuit board 201 is stressed uniformly, thereby further improving the stability of the structure of two adjacent layers of circuit boards 201.

The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A circuit board assembly, characterized in that it comprises:

At least two circuit boards; the circuit boards have upper and lower surfaces disposed opposite to each other;

The at least one circuit board includes two insulating substrates, the surface of which is provided with metal wiring and metallized holes.

At least one first adapter board is disposed on at least one side of at least two layers of the circuit boards and is electrically connected to at least two layers of the circuit boards;

The circuit board assembly further includes at least one second adapter board, which is disposed on different sides of at least two layers of the circuit board, along with the first adapter board; the second adapter board is a flexible circuit board and has metal wiring.

One end of the second adapter board is embedded between an insulating carrier board in one of the at least two circuit boards, and the metal wiring of the second adapter board is electrically connected to the metal wiring of the circuit board through the metallized hole.

The first adapter board is electrically connected to the side of at least two layers of the circuit board located on the same side.

The side of the circuit board has a plurality of spaced-apart first electrical connectors; the first electrical connectors are electrically connected to the metal wiring inside the circuit board.

The first adapter plate has a plurality of spaced-apart second electrical connectors; the second electrical connectors are electrically connected to the metal wiring inside the first adapter plate; one first electrical connector is electrically connected to one second electrical connector;

The first adapter board also has leads that electrically connect the second electrical connector of the upper circuit board to the second electrical connector of the lower circuit board in the two circuit boards.

2. The circuit board assembly according to claim 1, wherein the second adapter plate is electrically connected to the surface of at least one layer of the circuit board.

3. The circuit board assembly according to claim 1, wherein the second adapter plate is electrically connected to at least one side of the circuit board.

4. The circuit board assembly according to any one of claims 1-3, wherein the first adapter plate is electrically connected to the surface of at least two layers of the circuit board.

5. The circuit board assembly according to claim 4, wherein one of the first adapter boards is electrically connected to the upper or lower surface of one of the at least two circuit boards, and is electrically connected to the side surface of the remaining at least one circuit board.

6. The circuit board assembly according to claim 4, wherein one end of a first adapter board is electrically connected to the upper surface of one of the at least two circuit boards, and the other end is electrically connected to the lower surface of the remaining circuit boards.

7. The circuit board assembly according to claim 4, wherein the first adapter board is a printed circuit board, and each side of at least two layers of the circuit board is provided with a first adapter board.

8. The circuit board assembly according to claim 4, wherein the first adapter plate is a flexible circuit board, and each side of at least two layers of the circuit board is wrapped by a first adapter plate.

9. The circuit board assembly according to claim 5, wherein the upper or lower surface of the circuit board has a plurality of spaced third electrical connectors; the third electrical connectors are electrically connected to the metal wiring inside the circuit board;

The first adapter plate has a plurality of spaced-apart second electrical connectors; the second electrical connectors are electrically connected to the metal wiring inside the first adapter plate;

One of the second electrical connectors is electrically connected to one of the third electrical connectors.

10. The circuit board assembly according to claim 9, wherein the first electrical connector is bonded to and electrically connected to the second electrical connector by conductive adhesive.

11. The circuit board assembly according to claim 1, wherein the circuit board assembly further comprises:

At least one insulating support column is disposed between two adjacent layers of the circuit board for supporting the two adjacent layers of the circuit board.

12. An electronic terminal, characterized in that the electronic terminal comprises a circuit board assembly as described in any one of claims 1-11.