CN114158181A

CN114158181A - Circuit board assembly and terminal

Info

Publication number: CN114158181A
Application number: CN202111305945.0A
Authority: CN
Inventors: 朱福建; 丁海幸; 乔吉涛
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-01-31
Filing date: 2019-01-31
Publication date: 2022-03-08
Also published as: CN111511108B; CN111511108A

Abstract

The application discloses circuit board assembly, terminal relates to electron device technical field for solve the limited condition of plane area that the circuit board took in the electronic product complete machine, lead to the unable problem of integrating on this circuit board simultaneously of multiple electronic components. The circuit board assembly includes at least two layers of circuit boards and at least one first transfer board. Wherein the circuit board has an upper surface and a lower surface which are oppositely arranged. The upper surface and the lower surface of the circuit board are used for integrating electronic components. In addition, the first adapter plate is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards.

Description

Circuit board assembly and terminal

Technical Field

The application relates to the technical field of electronic devices, in particular to a circuit board assembly and a terminal.

Background

At least one layer of circuit board is typically disposed within the consumer electronic product. The circuit board has a plurality of electronic components, such as a memory, a processor, and the like, integrated thereon.

However, as electronic products have more and more functions, for example, in order to realize functions of video and audio, entertainment, and the like, the electronic products need to provide sufficient space inside the electronic products for display components, camera components, and the like. In addition, in order to improve the cruising ability of the electronic product, a battery with larger capacity and volume needs to be arranged inside the electronic product so as to realize long-time standby. In addition, with the development of wireless communication, more different types of antennas are disposed inside electronic products to implement wireless communication connection such as 4G, wireless-fidelity (Wi-Fi), Global Positioning System (GPS), or bluetooth. Enough space needs to be provided between different antennas to avoid mutual interference between the antennas.

In this case, the smaller the planar area occupied by the circuit board in the whole electronic product is, so that the circuit board cannot provide more area for integrating electronic components. Moreover, as the functions of electronic products are diversified, the number of electronic components integrated on the circuit board is increased gradually, so that the requirement that various electronic components occupy a larger space cannot be met.

Disclosure of Invention

The application provides a circuit board assembly, terminal for solve in the limited condition of plane area that the circuit board took in the electronic product complete machine, lead to the unable problem of integrating on this circuit board of multiple electronic components simultaneously.

In order to achieve the purpose, the technical scheme is as follows:

in a first aspect, a circuit board assembly is provided. The circuit board assembly includes at least two layers of circuit boards and at least one first transfer board. The circuit board is provided with an upper surface and a lower surface which are oppositely arranged. The upper surface and the lower surface of the circuit board are used for integrating electronic components. In addition, the first adapter plate is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards. In the circuit board assembly provided by the embodiment of the application, a PCBA formed by each layer of circuit board and electronic components integrated thereon can be used as a unit module capable of independently realizing at least one function. In this case, a circuit module occupying a large area of the PCB may be divided into a plurality of the above-described unit modules having a small area. In the circuit board assembly, each layer of circuit board and a plurality of electronic components integrated on the circuit board can be used as the unit module. In addition, the circuit board assembly further comprises a first adapter plate. The first adapter plate can enable circuit boards on different layers to be electrically connected, and further enable the unit modules to achieve signal transmission. The plurality of unit modules perform signal transmission among each other in the working process, and the function of the circuit module occupying a large PCB area can be realized. Because the plane area of the circuit board is smaller, the multilayer circuit board used for bearing the electronic components is arranged in a stacking mode, the component space of the circuit board assembly occupying a terminal in the plane can be reduced, and therefore more space is saved for arranging other devices or batteries with larger capacity. In addition, when the terminal can realize more functions, the number of electronic components to be provided in the terminal is increased. Under the condition, the number of the circuit boards in the circuit board assembly can be increased, so that the electronic components have enough piece distribution space in the height direction of the circuit board assembly, and the purpose of integrating more electronic components is achieved. In this case, the circuit board assembly is increased in height, and the area of the circuit board assembly in the plane can be kept constant. Therefore, the integration level of the terminal can be improved on the premise of not influencing the in-plane layout space of the terminal.

In a first possible implementation manner of the first aspect, the first adapter plate is electrically connected with the surfaces of the at least two layers of circuit boards. Therefore, when the circuit board assembly is returned to the factory for maintenance, the first transfer plate is easier to be stripped from the surface of the circuit board, and the maintenance cost is reduced.

With reference to the first possible implementation manner of the first aspect, one first adapter plate is electrically connected to the side surface of the at least two layers of circuit boards, which is located on the same side. Therefore, the first transfer plate does not occupy the area of the upper surface and the lower surface of the circuit board, so that more electronic components can be arranged on the upper surface and the lower surface of the circuit board.

With reference to the first possible implementation manner of the first aspect, one first adapter plate is electrically connected to the upper surface or the lower surface of one of the at least two layers of circuit boards, and is electrically connected to the side surfaces of the remaining at least one layer of circuit board. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and are not described herein again.

With reference to the first possible implementation manner of the first aspect, one end of one first adapter plate is electrically connected to the upper surface of one of the at least two layers of circuit boards, and the other end of the one first adapter plate is electrically connected to the lower surfaces of the other layers of circuit boards.

With reference to the first possible implementation manner of the first aspect, the circuit board assembly includes at least three layers of circuit boards. One end of a first adapter plate is electrically connected with the upper surface of the upper layer circuit board and the other end of the first adapter plate is electrically connected with the lower surface of the lower layer circuit board in the at least three layers of circuit boards. The first adapter plate is also electrically connected with the side surface of at least one layer of circuit board between the upper layer circuit board and the lower layer circuit board in the at least three layers of circuit boards. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and are not described herein again.

In combination with the first possible implementation manner of the first aspect, the first transfer board is a printed circuit board or a flexible circuit board, one first transfer board is disposed on each side of the at least two layers of circuit boards, and the structural stability of the multilayer circuit board in the circuit board assembly is improved by the plurality of first transfer boards disposed around the at least two layers of circuit boards in a circle.

In combination with a first possible implementation manner of the first aspect, the first transfer board is a flexible circuit board, each side of at least two layers of circuit boards is wrapped by the first transfer board, and the structural stability of the multilayer circuit board in the circuit board assembly is improved by the flexible first transfer board arranged around the at least two layers of circuit boards in a circle.

With reference to the first possible implementation manner of the first aspect, the side surface of the circuit board has a plurality of first electrical connectors arranged at intervals. The first electrical connector is electrically connected to a metal wiring inside the circuit board. The first adapter plate has a plurality of second electrical connectors arranged at intervals. The second electrical connector is electrically connected to the metal wiring inside the first transfer plate. A first electrical connector is electrically connected to a second electrical connector. The first and second electrical connections may be pads.

With reference to the first possible implementation manner of the first aspect, the upper surface of the circuit board has a plurality of third electrical connectors arranged at intervals. The third electrical connector is electrically connected to the metal wiring inside the circuit board. The first adapter plate is provided with a plurality of second electric connectors arranged at intervals; the second electrical connector is electrically connected to the metal wiring inside the first transfer plate. A second electrical connector is electrically connected to a third electrical connector. The third electrical connection may be a pad.

In a second possible implementation manner of the first aspect, the circuit board assembly further includes at least one second adapter plate, and the second adapter plate and the first adapter plate are disposed on different sides of the at least two layers of circuit boards; the second adapter plate is a flexible circuit board. One end of the second adapter plate is embedded into one circuit board of the at least two layers of circuit boards, and the second adapter plate is electrically connected with the circuit board through metalized holes formed in the second adapter plate and the circuit board; the other end of the second adapter plate is electrically connected with at least one layer of the rest circuit boards in the at least two layers of circuit boards. One end of the second adapter plate is embedded in a layer of circuit board, so that the area of the upper surface and the lower surface of the circuit board cannot be occupied.

In a third possible implementation manner of the first aspect, the circuit board assembly further includes at least one insulating support pillar disposed between two adjacent layers of circuit boards for supporting the two adjacent layers of circuit boards. Therefore, in the using process of the circuit board assembly, the structural stability and the reliability of the circuit board assembly can be improved through the insulating support columns, and the distance between two adjacent layers of circuit boards is kept unchanged.

With reference to the third possible implementation manner of the first aspect, the insulating support columns are in contact with the portions of the upper surface or the lower surface of the circuit board where no electronic component is disposed. Therefore, the insulating support columns are prevented from contacting with the electronic components, so that the terminal is caused to apply force to the electronic components in the using process, and the electronic components are damaged.

In a second aspect, a terminal is provided that includes a circuit board assembly. The circuit board assembly comprises at least two layers of circuit boards and at least one first adapter plate. The circuit board has an upper surface and a lower surface which are oppositely arranged. The first adapter plate is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards. The terminal further comprises a plurality of electronic components, and one electronic component is arranged on the upper surface or the lower surface of one circuit board in the circuit board assembly. The terminal has the same technical effect as the circuit board assembly provided by the foregoing embodiment, and details are not described here.

In a first possible implementation manner of the second aspect, the first adapter plate is electrically connected with the surfaces of the at least two layers of circuit boards. Therefore, when the circuit board assembly is returned to the factory for maintenance, the first transfer plate is easier to be stripped from the surface of the circuit board, and the maintenance cost is reduced.

With reference to the first possible implementation manner of the second aspect, a first adapter plate is electrically connected to the side surface of the at least two layers of circuit boards located on the same side. Therefore, the first transfer plate does not occupy the area of the upper surface and the lower surface of the circuit board, so that more electronic components can be arranged on the upper surface and the lower surface of the circuit board.

With reference to the second aspect, in a first possible implementation manner, one first adapter plate is electrically connected to the upper surface or the lower surface of one of the at least two layers of circuit boards, and is electrically connected to the side surfaces of the other at least one layer of circuit board. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and are not described herein again.

With reference to the second aspect, in a first possible implementation manner, one end of one first adapter plate is electrically connected to the upper surface of one of the at least two layers of circuit boards, and the other end of the one first adapter plate is electrically connected to the lower surfaces of the other layers of circuit boards.

With reference to the first possible implementation manner of the second aspect, the circuit board assembly includes at least three layers of circuit boards. One end of a first adapter plate is electrically connected with the upper surface of the upper layer circuit board and the other end of the first adapter plate is electrically connected with the lower surface of the lower layer circuit board in the at least three layers of circuit boards. The first adapter plate is also electrically connected with the side surface of at least one layer of circuit board between the upper layer circuit board and the lower layer circuit board in the at least three layers of circuit boards. The technical effects of the scheme of electrically connecting the first adapter plate and the side surface of the circuit board are the same as those described above, and are not described herein again.

In combination with the first possible implementation manner of the second aspect, the first transfer board is a printed circuit board or a flexible circuit board, one first transfer board is disposed on each side of the at least two layers of circuit boards, and the structural stability of the multilayer circuit board in the circuit board assembly is improved by the plurality of first transfer boards disposed around the at least two layers of circuit boards in a circle.

In combination with the first possible implementation manner of the second aspect, the first transfer board is a flexible circuit board, each side of the at least two layers of circuit boards is wrapped by the first transfer board, and the structural stability of the multilayer circuit board in the circuit board assembly is improved by the flexible first transfer board arranged around the at least two layers of circuit boards in a circle.

With reference to the first possible implementation manner of the second aspect, the side surface of the circuit board is provided with a plurality of first electrical connectors arranged at intervals. The first electrical connector is electrically connected to a metal wiring inside the circuit board. The first adapter plate has a plurality of second electrical connectors arranged at intervals. The second electrical connector is electrically connected to the metal wiring inside the first transfer plate. A first electrical connector is electrically connected to a second electrical connector. The first and second electrical connections may be pads.

With reference to the first possible implementation manner of the second aspect, the upper surface of the circuit board has a plurality of third electrical connectors arranged at intervals. The third electrical connector is electrically connected to the metal wiring inside the circuit board. The first adapter plate is provided with a plurality of second electric connectors arranged at intervals; the second electrical connector is electrically connected to the metal wiring inside the first transfer plate. A second electrical connector is electrically connected to a third electrical connector. The third electrical connection may be a pad.

In a second possible implementation manner of the second aspect, the circuit board assembly further includes at least one second adapter plate, and the second adapter plate and the first adapter plate are disposed on different sides of the at least two layers of circuit boards; the second adapter plate is a flexible circuit board. One end of the second adapter plate is embedded into one circuit board of the at least two layers of circuit boards, and the second adapter plate is electrically connected with the circuit board through metalized holes formed in the second adapter plate and the circuit board; the other end of the second adapter plate is electrically connected with at least one layer of the rest circuit boards in the at least two layers of circuit boards. One end of the second adapter plate is embedded in a layer of circuit board, so that the area of the upper surface and the lower surface of the circuit board cannot be occupied.

In a third possible implementation manner of the second aspect, the circuit board assembly further includes at least one insulating support pillar disposed between two adjacent layers of circuit boards for supporting the two adjacent layers of circuit boards. Therefore, in the using process of the circuit board assembly, the structural stability and the reliability of the circuit board assembly can be improved through the insulating support columns, and the distance between two adjacent layers of circuit boards is kept unchanged.

With reference to the third possible implementation manner of the second aspect, the insulating support columns contact with the portions of the upper surface or the lower surface of the circuit board where no electronic component is disposed. Therefore, the insulating support columns are prevented from contacting with the electronic components, so that the terminal is caused to apply force to the electronic components in the using process, and the electronic components are damaged.

In view of the above, the present application provides a circuit board assembly and a terminal. In the circuit board assembly, a PCBA formed by each layer of circuit board and electronic components integrated thereon may be used as a unit module capable of independently implementing at least one function. In this case, a circuit module occupying a large area of the PCB may be divided into a plurality of the above-described unit modules having a small area. In the circuit board assembly, each layer of circuit board and a plurality of electronic components integrated on the circuit board can be used as the unit module. In addition, the circuit board assembly further comprises a first adapter plate. The first adapter plate can enable circuit boards on different layers to be electrically connected, and further enable the unit modules to achieve signal transmission. The plurality of unit modules perform signal transmission among each other in the working process, and the function of the circuit module occupying a large PCB area can be realized. Because the plane area of the circuit board is smaller, the multilayer circuit board used for bearing the electronic components is arranged in a stacking mode, the component space of the circuit board assembly occupying a terminal in the plane can be reduced, and therefore more space is saved for arranging other devices or batteries with larger capacity. In addition, when the terminal can realize more functions, the number of electronic components to be provided in the terminal is increased. Under the condition, the number of the circuit boards in the circuit board assembly can be increased, so that the electronic components have enough piece distribution space in the height direction of the circuit board assembly, and the purpose of integrating more electronic components is achieved. In this case, the circuit board assembly is increased in height, and the area of the circuit board assembly in the plane can be kept constant. Therefore, the integration level of the terminal can be improved on the premise of not influencing the in-plane layout space of the terminal.

Drawings

Fig. 1a is a schematic structural diagram of a terminal according to some embodiments of the present application;

FIG. 1b is a schematic diagram of a structure of the electronic component shown in FIG. 1 a;

FIG. 2a is a schematic diagram of a portion of the circuit board assembly of FIG. 1 a;

FIG. 2b is a schematic diagram of a structure of the circuit board of FIG. 2 a;

FIG. 3 is a schematic perspective view of the circuit board assembly of FIG. 1 a;

FIG. 4a is a schematic diagram of an electrical connection between an interposer and a side of a circuit board according to some embodiments of the present application;

FIG. 4b is a schematic view of another embodiment of the present application providing an interposer electrically connected to a side of a circuit board;

FIG. 4c is a schematic view of another embodiment of the present application providing an interposer electrically connected to a side of a circuit board;

FIG. 4d is another schematic illustration of an alternative configuration for electrically connecting an interposer to a side of a circuit board according to some embodiments of the present application;

FIG. 5a is a schematic diagram of an electrical connection between an interposer and a top surface of a circuit board according to some embodiments of the present application;

FIG. 5b is a schematic view of another embodiment of the present application providing an interposer electrically connected to a top surface of a circuit board;

FIG. 6a is a schematic diagram of an electrical connection between an interposer and upper and lower surfaces of a circuit board according to some embodiments of the present application;

FIG. 6b is a schematic view of another embodiment of the present application providing an interposer electrically connected to upper and lower surfaces of a circuit board;

FIG. 6c is a schematic view of another embodiment of the present application providing an interposer electrically connected to upper and lower surfaces of a circuit board;

FIG. 6d is a schematic view of another embodiment of the present application providing an interposer electrically connected to the upper and lower surfaces of a circuit board;

FIG. 6e is a schematic view of another embodiment of the present application providing an interposer electrically connected to the upper and lower surfaces of a circuit board;

fig. 7a is a schematic structural diagram of an embodiment of the present application, in which one interposer is an FPC and the other interposer is a PCB;

FIG. 7b is a schematic diagram of an electrical connection structure between the interposer embedded in the circuit board of FIG. 7a and the circuit board;

fig. 7c is another schematic structural diagram of an interposer that is provided as an FPC and another interposer that is provided as a PCB according to some embodiments of the present application;

FIG. 7d is another schematic structural diagram of an interposer that is provided as an FPC and another interposer that is provided as a PCB according to some embodiments of the present application;

FIG. 8a is a schematic perspective view of the circuit board assembly of FIG. 1 a;

FIG. 8b is a schematic perspective view of the circuit board assembly of FIG. 1 a;

FIG. 9 is a schematic structural view of the circuit board of FIG. 8a or FIG. 8b and a first electrical connector on a side of the circuit board;

FIGS. 10a and 10b are schematic views illustrating a process for manufacturing a first electrical connector on a side surface of the circuit board in FIG. 8a or FIG. 8 b;

FIG. 11 is a schematic diagram of a circuit board provided with a third electrical connector on a surface thereof according to some embodiments of the present application;

fig. 12a and 12b are schematic diagrams illustrating an electrical connection process between a layer of circuit board and the interposer in fig. 8a or 8 b;

FIG. 13a is a schematic top view of the circuit board assembly of FIG. 1 a;

FIG. 13b is a schematic perspective view of the circuit board assembly of FIG. 1 a;

FIG. 13c is a schematic top view of the transfer plate of FIG. 13 b;

FIG. 14a is a schematic diagram of another top view configuration of the circuit board assembly of FIG. 1 a;

FIG. 14b is a schematic diagram of another top view configuration of the circuit board assembly of FIG. 1 a;

FIG. 14c is another schematic top view of the circuit board assembly of FIG. 1 a;

fig. 14d is a schematic structural diagram illustrating a multi-layer circuit board wrapped with an FPC according to some embodiments of the present application;

FIG. 15a is a schematic cross-sectional view of the circuit board assembly of FIG. 1 a;

fig. 15b is a schematic top view of the structure of fig. 15 a.

Reference numerals:

01-a terminal; 10-a display module; 11-middle frame; 12-a housing; 20-a circuit board assembly; 201-a circuit board; 2010-insulating carrier plate; 2011-metal routing; 2012-adhesive layer; 202-a first transfer plate; 212-a second interposer; 30-electronic components; 300-a package structure; 301-chip; 40-a third electrical connection; 41-a first electrical connection; 410-a metal thin film layer; 411-a drill bit; 412-solder paste; 42-a second electrical connection; 43-lead wire; 50-insulating support columns.

Detailed Description

The technical solutions in the embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.

In addition, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

Further, in the present application, directional terms such as "upper", "lower", "left", "right", and the like are defined with respect to a schematically placed orientation of a component in the drawings, and it is to be understood that these directional terms are relative concepts, which are used for descriptive and clarifying purposes, and may vary accordingly depending on the orientation in which the component is placed in the drawings.

The embodiment of the present application provides a terminal 01 as shown in fig. 1 a. The terminal 01 may be a consumer electronic product on the market, for example, including a mobile phone, a tablet computer, a notebook computer, a vehicle-mounted computer, a wearable electronic product, such as a watch or a bracelet.

The embodiment of the present application does not specifically limit the specific form of the terminal 01. For convenience of description, the following description will be given taking the terminal 01 as a mobile phone as an example.

As shown in fig. 1a, the mobile phone mainly includes a display module 10, a middle frame 11 and a housing 12. The display module 10 and the middle frame 11 are disposed in the housing 12.

In some embodiments of the present disclosure, the display module 10 may include a Liquid Crystal Display (LCD) screen and a backlight unit (BLU) for providing a light source to the LCD screen.

Alternatively, in other embodiments of the present application, the display module 10 may include an Organic Light Emitting Diode (OLED) display screen capable of self-emitting light.

In order to enable the terminal 01 to realize more functions, the terminal 01 further includes a plurality of electronic components 30.

As shown in fig. 1b, in some embodiments of the present application, the electronic component 30 includes a package structure 300, and at least one chip 301 packaged in the package structure 300.

In this case, a plurality of electronic components 30 are provided in the terminal 01 so as to be within a limited space in the terminal 01. The present embodiment provides a circuit board assembly 20 disposed in a terminal 01, as shown in fig. 1 a.

In some embodiments of the present application, as shown in fig. 1a, the circuit board assembly 20 may be disposed on a side surface of the middle frame 11 facing the housing 12.

The circuit board assembly 20 comprises at least two layers of circuit boards 201 as shown in fig. 2 a. The circuit board 201 includes an upper surface a1 and a lower surface a2 that are oppositely disposed.

The electronic component 30 may be integrated on the upper surface a1 or the lower surface a2 of the circuit board 201. Alternatively, as shown in fig. 4a, the electronic component 30 is integrated on both the upper surface a1 and the lower surface a2 of the circuit board 201.

In some embodiments of the present application, the circuit board 201 may be a Printed Circuit Board (PCB). As shown in fig. 2b, as known from the cross-sectional structure of the circuit board 201, the circuit board 201 includes at least one layer of an insulating carrier 2010. Two adjacent insulating carrier plates 2010 are fixedly connected through an adhesive layer 2012.

In some embodiments of the present application, the upper surface or the lower surface of the insulating carrier 2010 is provided with a metal wiring 2011. Alternatively, in other embodiments of the present application, the metal wirings 2011 are disposed on both the upper surface and the lower surface of the insulating carrier 2010. The metal wiring 2011 in the circuit board 201 is used to electrically connect a plurality of electronic components 30 integrated on the circuit board 201.

In addition, circuit board assembly 20 further includes at least one first transfer plate 202, as shown in FIG. 3. The first transfer board 202 is disposed on at least one side of the at least two layers of circuit boards 201.

In addition, the first adapter plate 202 is electrically connected to the at least two layers of circuit boards 201, so that the at least two layers of circuit boards 201 can perform signal transmission through the first adapter plate 202.

It should be noted that the first adapter board 202 may be a PCB or a flexible printed circuit board (FPC). The cross-sectional structure of the PCB and the FPC as shown in fig. 2b may include an insulating carrier 2010 and metal wires 2011 on the upper and lower surfaces of the insulating carrier 2010. Except that the material of the FPC constituting the insulating carrier 2010 is a flexible insulating material. For example, the flexible insulating material may be a polymer material such as polyimide or polyester. In this case, the insulating carrier 2010 may be a polyimide film or a polyester film.

In some embodiments of the present application, after the first adapter plate 202 electrically connects two layers of circuit boards 201, signals of one layer of circuit board 201 can be transmitted to the other layer of circuit board 201 through the first adapter plate 202. The first adapter plate 202 does not need to process the transmitted signals, and therefore, the electronic component 30 does not need to be integrated on the first adapter plate 202.

In order to enable the first transfer plate 202 to electrically connect the at least two layers of circuit boards 201, in some embodiments of the present application, the first transfer plate 202 is electrically connected with surfaces of the at least two layers of circuit boards 201.

The surface of the circuit board 201 refers to the upper surface a1, the lower surface a2, or the side surface B of the circuit board 201.

The side B of the circuit board 201 is a surface of the circuit board 201 perpendicular to the upper surface a1 or the lower surface a2 of the circuit board 201.

The manner in which the first adapter plate 202 electrically connects at least two circuit boards 201 is illustrated below.

Example 1

In this example, a first adapter plate 202 is electrically connected to the side B of the at least two circuit boards 201 on the same side.

For example, in some embodiments of the present application, as shown in fig. 4a, the circuit board assembly 20 includes a circuit board 201a and a circuit board 201 b.

The first transfer board 202a is electrically connected to the side B of the left side of the circuit board 201a and the side B of the left side of the circuit board 201B. The first transfer plate 202B is electrically connected to the side B on the right side of the circuit board 201a and the side B on the right side of the circuit board 201B.

In this case, the circuit board 201a and the electronic component 30 integrated on the circuit board 201a constitute a first unit module. The first unit module may transmit the generated signal to the circuit board 201b through the first interposer 202a and the first interposer 202b during operation. The circuit board 201b and the electronic components 30 integrated on the circuit board 201b form a second unit module, and the second unit module can process the signals after receiving the signals output by the first adapter plate 202a and the first adapter plate 202b, so that the circuit board assembly 20 can realize the corresponding functions.

As can be seen from the above, the circuit board 201a and the circuit board 201b can be electrically connected to the first adapter plate 202a and the first adapter plate 202b to realize signal communication therebetween.

In other embodiments of the present application, only the first interposer 202a may be provided in the circuit board assembly 20, as the circuit board 201a and the circuit board 201b may communicate signals only through the first interposer 202 a. Alternatively, when the circuit board 201a and the circuit board 201b can realize signal communication only through the first interposer 202b, only the first interposer 202b may be provided in the circuit board assembly 20.

In still other embodiments of the present application, as shown in fig. 4b, the circuit board assembly 20 includes a circuit board 201a, a circuit board 201b, and a circuit board 201 c.

Alternatively, as shown in fig. 4c, the circuit board assembly 20 includes a circuit board 201a, a circuit board 201b, a circuit board 201c, and a circuit board 201 d.

With the configuration of fig. 4a and 4c, the first adapter plate 202 is disposed in the same manner as described above and is electrically connected to the side B of each circuit board 201 in the circuit board assembly 20.

Furthermore, in still other embodiments of the present application, when at least three layers of circuit boards 201 are included in the circuit board assembly 20, the first transfer plate 202 may not be required to electrically connect the side surfaces B of all the circuit boards 201.

For example, as shown in fig. 4d, the first adapter plate 202a on the left side may electrically connect the circuit board 201a and the side B of the circuit board 201B, so that the circuit board 201a and the circuit board 201B realize signal transmission through the adapter plate 202 a.

As mentioned above, in this example, the first adapter plate 202 is disposed on at least one side of at least two layers of circuit boards 201, and a first adapter plate 202 is electrically connected to a side surface B of a circuit board 201. For example, the first adapter plate 202a in fig. 4a is electrically connected to the side B on the left side of the circuit board 201 a. In this case, the first transfer plate 202a is not in contact with the upper surface a1 and the lower surface a2 of the circuit board 201 a. Therefore, the first transfer plate 202a does not occupy the area of the upper surface a1 and the lower surface a2 of the circuit board 201a, so that the upper surface a1 and the lower surface a2 of the circuit board 201a can be provided with more electronic components 30.

Example two

In this example, one first interposer 202 is electrically connected to the upper surface a1 or the lower surface a2 of one of the at least two layers of circuit boards 201, and electrically connected to the side surface B of the remaining at least one layer of circuit board 201 of the at least two layers of circuit boards 201.

Taking the circuit board assembly 20 including the circuit board 201a, the circuit board 201B and the circuit board 201c as an example, in some embodiments of the present application, as shown in fig. 5a, the first adapter plate 202a on the left side of the circuit board assembly 20 is electrically connected to the upper surface a1 of the circuit board 201a and is electrically connected to the side surface B of the circuit board 201B.

In this case, it is possible to electrically connect the circuit board 201a and the circuit board 201b through the first relay board 202a, and to realize signal transmission.

Further, the first relay board 202B on the right side in the circuit board assembly 20 is electrically connected to the upper surface a1 of the circuit board 201a, and is electrically connected to the side surfaces B of the circuit board 201B and the circuit board 201 c. It is possible to electrically connect the circuit board 201a, the circuit board 201b, and the circuit board 201c through the first relay board 202b and realize signal transmission.

Alternatively, in other embodiments of the present application, as shown in fig. 5B, the first adapter plate 202a on the left side is electrically connected to the upper surface a1 of the circuit board 201B, and is electrically connected to the side B of the circuit board 201 c. The circuit board 201b and the circuit board 201c can be made to realize signal transmission through the first adapter plate 202 a.

It should be noted that, since the upper surface a1 and the lower surface a2 of the circuit board 201 are defined relative to the schematic placement orientation of the circuit board assembly 20 in the drawing, the scheme that one first adapter plate 202 of the circuit board assembly 20 is electrically connected to the lower surface a2 of one layer of the circuit board 201 and is electrically connected to the side surface B of at least one layer of the circuit board 201 except the circuit board 201 can be obtained only by turning over the circuit board assembly 20, and details are not repeated herein.

Example three

In this example, one first transfer board 202 has one end electrically connected to the upper surface a1 of one of the at least two layers of circuit boards 201, and the other end electrically connected to the lower surface a2 of the remaining one of the at least two layers of circuit boards 201.

In some embodiments of the present application, taking the circuit board assembly 20 including the

circuit boards

201a and 201b as an example, as shown in fig. 6a, the first adapter plate 202a on the left side is electrically connected to the upper surface a1 of the circuit board 201a and the lower surface a2 of the circuit board 201 b. The first transfer plate 202b on the right side is disposed in the same manner as the first transfer plate 202 b.

In this case, the

circuit boards

201a and 201b realize signal transmission through the first relay board 202a and the first relay board 202 b.

Alternatively, in other embodiments of the present application, as shown in fig. 6B, the first adapter plate 202B on the right side may also adopt the arrangement of example one, i.e., electrically connected to the circuit boards 201a and the side B of the circuit board 201B.

Still alternatively, in other embodiments of the present application, as shown in fig. 6c, the first adapter plate 202B on the right side may also be electrically connected to the upper surface a1 of the circuit board 201a and the side surface B of the circuit board 201B in the second configuration.

In addition, in the case where the circuit board assembly 20 includes at least three circuit boards, one end of one first transfer board 202 is electrically connected to the upper surface a1 of the upper circuit board 201 and the other end is electrically connected to the lower surface a2 of the lower circuit board 201 among the at least three circuit boards.

In addition, the first transfer board 202 is electrically connected to the side B of at least one circuit board 201 between the circuit boards 201 of the upper and lower layers among the at least three circuit boards.

As shown in fig. 6d, the first transfer board 202a on the left side is electrically connected to the upper surface a1 of the circuit board 201a, the side surface B of the circuit board 201B, and the lower surface a2 of the circuit board 201 c. The first transfer plate 202b on the right side is disposed in the same manner as the first transfer plate 202 b.

In this case, the

circuit boards

201a, 201b, and 201c realize signal transmission through the first relay board 202a and the first relay board 202 b.

Alternatively, in other embodiments of the present application, as shown in fig. 6e, the first adapter plate 202b on the right side may also be electrically connected to the upper surface a1 of the circuit board 201a and the lower surface a2 of the circuit board 201b, so that the circuit board 201a and the circuit board 201b realize signal transmission through the first adapter plate 202 b.

In addition, the first adapter plate 202b on the right side may also adopt the arrangement manner of example one or example two, which is not described herein again.

As mentioned above, when a first adapter plate 202 is electrically connected to the upper surface a1 or the lower surface a2 of a circuit board 201, the first adapter plate 202 does not need to be electrically connected to the side B of the circuit board 201. For example, in fig. 6e, the first adapter plate 202a is electrically connected to the upper surface a1 of the circuit board 201 a. At this time, the first adapter plate 202a does not need to be electrically connected to the side B of the circuit board 201 a.

Thus, the first adapter plate 202a only needs to satisfy the manufacturing accuracy when electrically connected to the upper surface a1 of the circuit board 201a, and the signal transmission between the first adapter plate 202a and the circuit board 201a can be realized. Therefore, when the upper surface a1 and the side surface B of the circuit board 201a are electrically connected to the first adapter plate 202a, the positions where the first adapter plate 202a is electrically connected to the upper surface a1 of the circuit board 201a and the side surface B of the circuit board 201a need to satisfy the manufacturing accuracy. Further, the manufacturing process of the circuit board assembly 20 can be simplified, and the manufacturing cost can be reduced.

Similarly, when a first adapter plate 202 is electrically connected to the side B of a circuit board 201, the first adapter plate 202 does not need to be electrically connected to the upper surface a1 or the lower surface a2 of the circuit board 201. For example, as in fig. 6c, the first adapter plate 202B is electrically connected to side B of the circuit board 201B. At this time, the first adapter plate 202b does not need to be electrically connected to the lower surface a2 of the circuit board 201 b.

The solutions provided in the first example, the second example, and the third example are described in terms of a manner in which a portion of the first adapter plate 202 is electrically connected to the surfaces of the at least two layers of circuit boards 201. Since the first transfer plate 202 is electrically connected to the surface of the circuit board 201, when the circuit board assembly 20 is returned to the factory for maintenance, the first transfer plate 202 is more easily peeled off from the surface of the circuit board 201, thereby reducing the maintenance cost.

The present application also provides another way to electrically connect at least two layers of circuit boards 201, such as the fourth example below.

Example four

In this example, the circuit board assembly 20 includes a circuit board 201a and a circuit board 201 b. The circuit board assembly 20 further includes at least one second interposer 212 as shown in fig. 7 a.

It should be noted that the second interposer 212 may also be used only for signal transmission, and does not need to process signals. There is no need to integrate the electronic component 30 on the second interposer 212.

The second interposer 212 and the first interposer 202 are disposed on different sides of at least two layers of circuit boards. The second interposer 212 is an FPC. The first adapter plate 202 may be an FPC or a PCB.

In this case, in some embodiments of the present application, as shown in fig. 7a, one end of the second interposer 212 is embedded in the circuit board 201a and electrically connected to the circuit board 201 a. In addition, the other end of the second interposer 212 is embedded in the circuit board 201b and electrically connected to the circuit board 201 b. The first adapter plate 202 on the right side is arranged in the manner of example one.

In this case, in order to enable one end of the second interposer 212 embedded in the circuit board 201a to be electrically connected to the circuit board 201 a. As shown in fig. 7b, in the process of manufacturing the circuit board 201a, one end of the second interposer 212 is pressed into two adjacent layers of the insulating carrier 2010 of the circuit board 201 a.

Then, a Plated Through Hole (PTH) is formed as shown in fig. 7b by a punching and hole wall metallization process. In this case, the metal wirings 2011 on the circuit board 201a are electrically connected to the metal wirings 2011 on the second interposer 212 through the PTHs, thereby achieving electrical connection of the second interposer 212 to the circuit board 201 a.

In this case, since one end of the second interposer 212 is embedded in a circuit board, such as the circuit board 201a, the area of the upper surface a1 and the lower surface a2 of the circuit board 201a is not occupied, so that more electronic components 30 can be disposed on the upper surface a1 and the lower surface a2 of the circuit board 201 a.

In addition, the other end of the second interposer 212 is electrically connected to the remaining at least one circuit board 201 of the at least two circuit boards.

For example, in fig. 7a, the other end of the second interposer 212 is embedded in the circuit board 201 b. The other end of the second interposer 212 embedded in the circuit board 201b is electrically connected to the circuit board 201b in the same manner as described above, and is not described herein again.

Alternatively, in some embodiments of the present application, as shown in fig. 7c, one end of the second interposer 212 is embedded in the circuit board 201a and electrically connected to the circuit board 201 a. Further, the other end of the second interposer 212 is electrically connected to the side B of the circuit board 201B. The first adapter plate 202 on the right side is arranged in the manner of example three.

Alternatively, in some embodiments of the present application, as shown in fig. 7d, one end of the second interposer 212 is embedded in the circuit board 201a and electrically connected to the circuit board 201 a. Further, the other end of the second interposer 212 is electrically connected to the lower surface a2 of the circuit board 201 b. The first adapter plate 202 on the right side is arranged in the manner of example two.

In summary, in the present embodiment, in the manufacturing process of the circuit board 201, one end of the second interposer 212 formed by the FPC is pressed into the circuit board, and the PTH is manufactured to electrically connect one end of the second interposer 212 pressed into the circuit board 201 to the circuit board 201.

As the endurance requirement and the function integration requirement of the terminal 01, for example, a mobile phone, are continuously increased, the area of a plane (such as an XOY plane shown in fig. 3) for disposing the circuit board assembly 20 in the terminal 01 is smaller, and when the number of electronic components 30 to be disposed in the terminal 01 is larger, the number of circuit boards 201 in the circuit board assembly 20 may be increased.

At this time, since the area in the plane of the circuit board assembly 20 (such as the XOY plane shown in fig. 3) is affected by the space limitation of the components in the plane of the terminal 01, and cannot be increased any more, the height of the circuit board assembly 20 in the Z direction (fig. 3) can be increased, that is, the number of the circuit boards 201 in the circuit board assembly 20 can be increased to carry more electronic components 30, so that the plurality of electronic components 30 have enough layout space in the Z direction.

As can be seen from the above, the number of circuit boards 201 in the circuit board assembly 20 is proportional to the height of the circuit board assembly 20 along the Z-direction. Therefore, the number of circuit boards 201 in the circuit board assembly 20 cannot be increased wirelessly, and the overall size of the terminal 01 needs to be considered in the design process. For example, when the height of the circuit board assembly 20 along the Z direction needs to be set according to the thickness of the terminal 01 along the Z direction (as shown in fig. 1 a), so as to avoid the phenomenon that the middle frame 11 cannot be engaged with the housing 12 due to the too large height of the circuit board assembly 20 along the Z direction.

The XOY plane is parallel to the surface of the display module 10 displaying images, and the upper surface a1 and the lower surface a2 of the circuit board 201. The Z direction is parallel to the side surface B of the circuit board 201.

The following description will be given by taking the circuit board assembly 20 as an example, which includes a baseband circuit functional module and a radio frequency circuit functional module, and the number of circuit boards 201 in the circuit board assembly 20 and the arrangement manner of the electronic components 30 integrated thereon are exemplified. For convenience of description, the following description is given taking as an example a structure in which the circuit board assemblies 20 are all electrically connected to the multilayer circuit board 201 using the first transfer board 202.

Example five

As shown in fig. 4a, circuit board assembly 20 may include two layers of circuit boards, such as circuit board 201a and circuit board 201 b. Fig. 4a illustrates an example in which a plurality of electronic components 30 are integrated on both the upper surface a1 and the lower surface a2 of each circuit board 201 of the circuit board assembly 20.

The plurality of electronic components 30 integrated on the circuit board 201a may be: a Central Processing Unit (CPU), an audio/video control chip, a memory, such as a Double Data Rate (DDR) synchronous dynamic random access memory (dram), a Random Access Memory (RAM), a flash memory (nand flash), or a Read Only Memory (ROM), etc.

In this case, a unit module formed by the plurality of electronic components 30 integrated on the circuit board 201a and the circuit board 201a functions as the baseband circuit function module. The baseband circuit function module is used for demodulating, descrambling, despreading and decoding the wireless signals received by the radio frequency circuit function module and processing the wireless signals.

In some embodiments of the present application, when a CPU functional chip, a memory functional chip, etc. are packaged in a package structure 300, and the package structure 300 is integrated on a circuit board 201a with a smaller size, a Printed Circuit Board Assembly (PCBA) structure is formed, which can implement the functions of the baseband circuit. This smaller size PCBA may be referred to as a system in a package (SIP) structure.

In addition, the plurality of electronic components 30 integrated on the circuit board 201b may be: the device comprises a radio frequency receiving chip, a transmitting chip, a power amplifier, a Wi-Fi chip, a Bluetooth chip, a GPS chip and the like.

In this case, a unit module formed by the plurality of electronic components 30 integrated on the circuit board 201b and the circuit board 201b functions as the radio frequency circuit function module. The radio frequency circuit function module is used for realizing a wireless communication function.

Example six

In the case where the planar area for disposing the circuit board assembly 20 in the terminal 01 is further reduced, the above-described functional modules may be further separated, and the number of circuit boards 201 in the circuit board assembly 20 may be increased.

As shown in fig. 4b, the circuit board assembly 20 may include three layers of circuit boards, such as circuit board 201a, circuit board 201b, and circuit board 201 c.

The plurality of electronic components 30 integrated on the circuit board 201a are the same as those in the fifth example, and a unit module formed by the plurality of electronic components 30 integrated on the circuit board 201a and the circuit board 201a serves as a baseband circuit function module.

In addition, the radio frequency circuit functional module is divided into a first functional sub-module and a second functional sub-module which have independent functions.

In this case, the plurality of electronic components 30 integrated on the circuit board 201b may be: radio frequency receiving chip, transmitting chip, power amplifier.

In this case, a unit module formed by the plurality of electronic components 30 integrated on the circuit board 201b and the circuit board 201b functions as the first functional sub-module. The first functional sub-module is used for realizing a long-distance wireless communication function.

The plurality of electronic components 30 integrated on the circuit board 201c may be: Wi-Fi chip, bluetooth chip, GPS chip.

In this case, a unit module formed by the plurality of electronic components 30 integrated on the circuit board 201c and the circuit board 201c serves as the second functional sub-module. The second functional sub-module is used for realizing the short-distance wireless communication function.

Example seven

In the case where the planar area for disposing the circuit board assembly 20 in the terminal 01 is further reduced and the number of the electronic components 30 is further increased, the number of circuit boards in the circuit board assembly 20 may be continuously increased on the basis of the sixth example.

As shown in fig. 4c, the circuit board assembly 20 may include four layers of circuit boards, such as circuit board 201a, circuit board 201b, circuit board 201c, and circuit board 201 d.

The plurality of electronic components 30 integrated on the circuit board 201a are the same as those in the fifth example, and a unit module formed by the plurality of electronic components 30 integrated on the circuit board 201a and the circuit board 201a serves as the baseband circuit function module.

The plurality of electronic components 30 integrated on the circuit board 201b are the same as those in the sixth example, and the unit module formed by the plurality of electronic components 30 integrated on the circuit board 201b and the circuit board 201b serves as the first functional sub-module for implementing the long-distance wireless communication function.

The plurality of electronic components 30 integrated on the circuit board 201c are the same as those in the sixth example, and a unit module formed by the plurality of electronic components 30 integrated on the circuit board 201c and the circuit board 201c at this time is used as the second functional sub-module for implementing the short-range wireless communication function.

The circuit board 201a, the circuit board 201b, and the circuit board 201c may implement the function of a motherboard after being electrically connected through the first adapter plate 202.

In addition, the plurality of electronic components 30 integrated on the circuit board 201d may be: earphone, motor, data transmission and interface connector that charges, switch press the key interface connector etc..

In this case, the plurality of electronic components 30 integrated on the circuit board 201b and the unit module formed by the circuit board 201b may be used as a sub board to realize an auxiliary function, so that the functions that the terminal 01 can realize are more diversified.

The above is an example of the number of circuit boards 201 in the circuit board assembly 20 and the arrangement of the electronic components 30 integrated thereon, and other examples can be obtained in the same way, and are not described in detail herein.

In the case where the thickness of the terminal 01 in the Z direction is limited, in order to control the number of circuit boards 201 in the circuit board assembly 20, a unit module composed of one layer of the circuit board 201 and a plurality of electronic components 30 integrated on the circuit board 201 can independently perform at least one function.

Furthermore, in order to electrically connect the first adapter plate 202 with the side B of the circuit board 201, in some embodiments of the present application, as shown in fig. 8a, the side B of the circuit board 201 has a plurality of first electrical connectors 41 arranged at intervals.

Based on this, in order to enable signal communication between the circuit boards 201 of different layers through the first relay board 202, as shown in fig. 9, the first electrical connector 41 on the side B of the circuit board 201 is electrically connected to the metal wiring 2011 inside the circuit board 201.

Furthermore, as shown in fig. 8a, the first adapter plate 202 is provided with a plurality of second electrical connectors 42 arranged at intervals. Wherein, the first electrical connectors 41 are electrically connected with the second electrical connectors 42 one by one.

In some embodiments of the present application, the first electrical connections 41 and the second electrical connections 42 may be pads. The pads are rectangular as shown in figure 8 a. Alternatively, it may be circular. The shape of the pad is not limited in this application.

In the case where the first electrical connector 41 is a pad, the method of manufacturing the first electrical connector 41 may include: first, as shown in fig. 10a, a metal film layer 410 is electroplated on the side surface B of a circuit board 201. The metal thin film layer 410 may be made of copper.

Then, as shown in fig. 10b, a drilling process is performed using a drill 411 to remove unnecessary portions of the unnecessary metal thin film layer 410 to form a plurality of first electrical connectors 41 arranged at intervals.

It should be noted that the specification of the drill 411, for example, the diameter of the drill 411, can be selected according to the distance between two adjacent first electrical connectors 41 to be manufactured on the side surface B of the circuit board 201. For example, when the pitch between two adjacent first electrical connectors 41 is large, the drill bit 411 having a large diameter may be selected. Alternatively, when the pitch between two adjacent first electrical connectors 41 is small, the drill 411 having a small diameter may be selected.

The second electrical connector 42 formed by means of the drill bit 411 is generally rectangular. Therefore, when the second electrical connector 42 is rectangular, it is easy to manufacture.

In other embodiments of the present application, the unwanted portions of the metal thin film layer 410 may be removed by laser processing to form the second electrical connector 41.

The distance between the first electrical connectors 41 on the same side of the circuit board 201 can be set according to the circuit structure in the circuit board 201 and the circuit structure in another layer of circuit board 201 that needs to be electrically connected to the circuit board 201, as long as it can ensure that the signal transmission can be realized after the two layers of circuit boards 201 are electrically connected through the first adapter plate 202.

The manner in which the first adapter plate 202 is electrically connected to the side B of the at least two layers of circuit boards 201 is illustrated below. For example, in some embodiments of the present application, circuit board assembly 20, as shown in fig. 8a, includes circuit board 201a and circuit board 201 b.

A first electrical connector 41 on side B1 of circuit board 201a is electrically connected to an upper second electrical connector 42 on first transfer plate 202, and a first electrical connector 41 on side B2 of circuit board 201B is electrically connected to a lower second electrical connector 42 on first transfer plate 202.

In addition, in order to enable the circuit board 201a and the circuit board 201b to be electrically connected, as shown in fig. 8a, the first adapter plate 202 is further provided with leads 43 for electrically connecting at least two second electrical connectors 42, for example, the upper and lower second electrical connectors 42 located in the same column in the vertical direction in fig. 8 a.

In this case, a first electrical connector 41 on the side B1 of the circuit board 201a and a first electrical connector 41 on the side B2 of the circuit board 201B can be electrically connected through the first interposer 202, thereby enabling signal transmission between the circuit board 201a and the circuit board 201B. Note that the side B1 of the circuit board 201a is located on the same side as the side B2 of the circuit board 201B.

The above is an example of the electrical connection between the first adapter plate 202 and the side surfaces of two adjacent circuit boards.

Alternatively, for another example, in other embodiments of the present application, the circuit board assembly 20 includes three layers of circuit boards, namely, a circuit board 201a, a circuit board 201b and a third circuit board 201c, as shown in fig. 8 b.

In this case, a first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected to a second electrical connector 42 on the first transfer plate 202 above the second left row, and a first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected to a second electrical connector 42 on the first transfer plate 202 below the second left row. Furthermore, the two second electrical connections 42 are electrically connected by leads 43.

In this case, a first electrical connector 41 on the side B1 of the circuit board 201a and a first electrical connector 41 on the side B2 of the circuit board 201B are electrically connected through the first interposer 202. Thereby achieving signal transmission between the

circuit boards

201a and 201 b.

Alternatively, a first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected to a second electrical connector 42 above the third left column on the first transfer plate 202, a first electrical connector 41 on the side B3 of the third circuit board 201c is electrically connected to a second electrical connector 42 below the third left column on the first transfer plate 202. Furthermore, the two second electrical connections 42 are electrically connected by leads 43.

In this case, a first electrical connector 41 on the side B2 of the circuit board 201B and a first electrical connector 41 on the side B3 of the third circuit board 201c are electrically connected through the first interposer 202. Thereby, signal transmission between the circuit board 201b and the third circuit board 201c is realized.

Alternatively, a first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected to a second electrical connector 42 on the first transfer plate 202 above the right first column, and a first electrical connector 41 on the side B3 of the third circuit board 201c is electrically connected to a second electrical connector 42 on the first transfer plate 202 below the right first column. Furthermore, the two second electrical connections 42 are electrically connected by leads 43.

In this case, a first electrical connector 41 on the side B1 of the circuit board 201a and a first electrical connector 41 on the side B3 of the third circuit board 201c are electrically connected through the first interposer 202. Thereby, signal transmission between the circuit board 201a and the third circuit board 201c is realized.

Alternatively, a first electrical connector 41 on the side B1 of the circuit board 201a is electrically connected to a second electrical connector 42 on the first column on the left of the first electrical connector 41 on the first transfer plate 202; a first electrical connector 41 on the side B2 of the circuit board 201B is electrically connected to a second electrical connector 42 in the middle of the first row on the left on the first transfer plate 202; a first electrical connector 41 on the side B3 of the third circuit board 201c is electrically connected to a second electrical connector 42 on the first left column below the first bridge 202. Further, the three second electrical connections 42 are electrically connected by leads 43.

In this case, a first electrical connector 41 on the side B1 of the circuit board 201a, a first electrical connector 41 on the side B2 of the circuit board 201B, and a first electrical connector 41 on the side B3 of the third circuit board 201c are electrically connected through the first interposer 202. Thereby, signal transmission between the

circuit boards

201a, 201b, and the third circuit board 201c is realized.

Note that the side B1 of the circuit board 201a, the side B2 of the circuit board 201B, and the side B3 of the third circuit board 201c are located on the same side.

The above description is made of the manner in which the first transfer plate 202 is electrically connected to the side face B of the circuit board 201. As mentioned above, the first adapter plate 202 can also be electrically connected to the upper surface a1 or the lower surface a2 of a circuit board 201. In this case, as shown in fig. 11, it is necessary to provide the third electrical connectors 40 on the upper surface a1 (or the lower surface a2) of the circuit board 201. A third electrical connector 40 is electrically connected to a second electrical connector 42 on first adapter plate 202.

In the embodiment of the present application, the third electrical connection members 40 may be pads. In the case where the circuit board 201 is a PCB, in the process of manufacturing the circuit board 201, a copper layer covered on the insulating carrier 2010 shown in fig. 2b may be patterned to form a metal wire 2011. The metal wiring 2011 may serve as the third electrical connection member 40.

As can be seen from the above description, the first transfer board 202 may be a PCB or an FPC, in which case, when the second electrical connector 42 is a pad, a copper layer covered on the insulating carrier 2010 may be patterned during a manufacturing process of the PCB or the FPC to form a plurality of metal wires 2011. The plurality of metal wirings 2011 may serve as the second electrical connectors 42, and the leads 43 for electrically connecting the different second electrical connectors 42.

In the case where the first electrical connector 41 and the second electrical connection 42 are pads, a description will be given of a manner in which the first relay board 202 is electrically connected to the circuit board 201.

First, as shown in fig. 12a, a solder paste 412 is pre-coated on the first electrical connector 41 on the side B of the circuit board 201 by printing, jetting, or dispensing.

Then, as shown in fig. 12b, the circuit board 201 integrated with the electronic component 30 is picked up by an automated placement machine and placed on the horizontal first transfer plate 202. Wherein a first electrical connector 41 pre-coated with solder paste 412 on the circuit board 201 is bonded with a second electrical connector 42 on the first transfer board 202 by the solder paste 412.

Then, the first electrical connector 41 and the second electrical connector 42 are soldered by means of the melted solder paste 412 by means of high-temperature reflow.

Alternatively, in other embodiments of the present application, the solder paste 412 may be replaced with a conductive paste. In this case, after the circuit board 201 integrated with the electronic component 30 is placed on the horizontal first transfer plate 202, the conductive adhesive may be cured by high temperature curing, so that the first electrical connector 41 coated with the conductive adhesive is bonded and electrically connected with the second electrical connector 42 on the first transfer plate 202 through the cured conductive adhesive.

In other embodiments of the present application, in order to electrically connect the first adapter plate 202 to the circuit board 201, the first electrical connector 201 disposed on the side B of the circuit board 201 and the second electrical connector 202 disposed on the first adapter plate 202 may be disposed in a plug-in structure.

For example, first electrical connector 201 is a pin and second electrical connector 202 is a groove that mates with the pin. Alternatively, the first electrical connector 201 is a groove and the second electrical connector 202 is a pin that fits into the groove.

In summary, the circuit board assembly 20 provided in the embodiment of the present application has a multilayer circuit board 201. The upper surface a1 and the lower surface a2 of each layer of circuit board 201 are used for integrating the electronic component 30. In this way, the PCBA formed by each layer of the circuit board 201 and the electronic components 30 integrated thereon can be a unit module capable of independently performing at least one function. In this case, a circuit module occupying a large area of the PCB may be divided into a plurality of the above-described unit modules having a small area. In this regard, in the circuit board assembly 20, each layer of the circuit board 201 and the plurality of electronic components 30 integrated on the circuit board 201 may be regarded as a unit module. The plurality of unit modules perform signal transmission among each other in the working process, and therefore the function of the circuit module which occupies a large area of the PCB originally can be achieved.

Since the planar area of the circuit board 201 is small, stacking multiple layers of circuit boards 201 for carrying the electronic components 30 can reduce the space occupied by the circuit board assembly 20 in the plane (XOY plane) of the terminal 01, thereby saving more space for arranging other devices or batteries with larger capacity.

In addition, when the terminal 01 can realize more functions, the number of the electronic components 30 to be provided in the terminal 01 is increased. In this case, the number of the circuit boards 201 in the circuit board assembly 20 can be increased, so that the electronic components 30 have a sufficient layout space in the height direction (Z direction) of the circuit board assembly 20, thereby achieving the purpose of integrating more electronic components 30. In this case, the circuit board assembly 20 is increased in height (Z direction), and the area of the circuit board assembly 20 in the plane (XOY plane) can be kept constant. Therefore, the integration level of the terminal 01 can be improved on the premise of not influencing the in-plane layout space of the terminal 01.

On this basis, in order to allow the plurality of unit modules of the circuit board assembly 20 to perform signal transmission between each other during operation, the circuit board assembly 20 further includes a first transfer plate 202. The first adapter plate 202 can be electrically connected with the first electrical connectors 41 on the side of the circuit board 201 by the second electrical connectors 42, or electrically connected with the third electrical connectors 40 on the a1 or the a2 of the circuit board 201 by the third electrical connectors 41, so that the circuit boards 201 on different layers can be electrically connected by the first adapter plate 202, and then the unit modules can realize signal transmission.

In other embodiments, in the case where the circuit board assembly 20 further includes the second interposer 212, at least two layers of the circuit board 201 may be electrically connected through the second interposer 212 having one end embedded in the circuit board 201, so that a plurality of unit modules can perform signal transmission.

In some embodiments of the present application, in order to improve the structural stability of the multilayer circuit board 201 in the circuit board assembly 20, as shown in fig. 13a, each side of the multilayer circuit board 201 may be provided with a first adapter plate 202.

For example, in the case where the first transfer board 202 is a PCB, as shown in fig. 13B, the circuit board assembly 20 includes a plurality of first transfer boards 202, and one first transfer board 202 is connected to one side B of the circuit board 201. A plurality of first adapter plates 202 are spliced to form a closed frame structure as shown in fig. 13 c. It should be noted that, when a first adapter plate 202 is connected to a side B of the circuit board 201, the second electrical connectors 42 on the first adapter plate 202 and the first electrical connectors 41 on the side B of the circuit board 201 are electrically connected through conductive paste or solder paste under the condition that the first adapter plate 202 is electrically connected to the circuit board 201.

Alternatively, when the first electrical connector 41 is not disposed on one side of the circuit board 201, the side may be bonded to the first transfer board 202 by a glue layer.

In this way, the first transfer plate 202 is provided on each side of the circuit board 201 to support the circuit board, so that the distance between two adjacent layers of the circuit board 201 can be kept stable, and the reliability of the circuit board assembly 20 shown in fig. 13b can be improved.

Based on this, in order to improve the stability of signal transmission between a plurality of circuit boards 201 requiring electrical connection, each side B of the circuit board 201 is electrically connected to the first relay board 202 in a state where each side of the circuit board 201 is connected to the first relay board 202. In this case, there may be a plurality of first electrical connectors 41 on each side of the circuit board 201, and each first electrical connector 41 is electrically connected to one second electrical connector 42 on the first transfer plate 202 on the side of the circuit board 201 by solder paste or conductive adhesive.

In this way, a plurality of first electrical connectors 41 are disposed on each side B of the circuit board 201, and signals on the circuit board 201 can be transmitted to the first adapter plate 202 through the first electrical connectors 41 on each side of the circuit board 201. Therefore, the output channels of the circuit structures on the circuit boards 201 are increased, and the problem of signal transmission failure caused by the failure of one first electric connector 41 is avoided, so that the signal transmission among the circuit boards 201 electrically connected through the first adapter plate 202 is more stable.

The above description is made by taking the example in which the planar shape of the circuit board 201 is rectangular. In some embodiments of the present application, the top view shape of the circuit board 201 may be rectangular as shown in fig. 13 a. Or may be circular as shown in fig. 14a, L-shaped as shown in fig. 14b, or irregular as shown in fig. 14 c.

With the circuit boards 201 shown in fig. 14a, 14B and 14c, since the structure is complicated relative to the rectangular shape shown in fig. 13a, the first transfer plates 202 are provided for all the sides B of the respective circuit boards 201. The first transfer board 202 may be an FPC.

As shown in fig. 14d, the first adapter plate 202 made of FPC has flexible and bendable characteristics, so that each side B of the circuit board 201 can be wrapped along the edge of the circuit board 201, the first adapter plate 202 is attached to the side of the circuit board 201 more tightly, and the reliability of electrical connection and the reliability of signal transmission between the first adapter plate 202 and the circuit board 201 are improved.

In other embodiments of the present application, the circuit board 201 may also have a C-shape, a convex shape, a concave shape, and the like in a plan view. In this case, as described above, the first transfer board 202 made of FPC may be used to cover all sides of each circuit board. The first adapter plate 202 is now in a closed frame configuration.

In addition, in the embodiment of the present application, when the first transfer plate 202 is electrically connected to only the side surface B of each circuit board 201, the shapes and the outer dimensions of the horizontal cross sections of all the circuit boards 201 in the circuit board assembly 20 are the same. For example, the horizontal cross-sections of all the circuit boards 201 in the circuit board assembly 20 are rectangular as shown in fig. 13a, or circular as shown in fig. 14 a.

Thus, the first adapter plate 202 can be more easily electrically connected to the side surfaces B of the circuit boards 201 in different layers, so as to avoid the occurrence of protrusions or depressions in the circuit board assembly 20 when the first adapter plate 202 formed by FPC is electrically connected to the side surfaces of the circuit boards 201 in different layers due to the specification of one layer of circuit board 201 and the other circuit boards 201.

Or, it can also avoid the problem that in the manufacturing process of the circuit board assembly 20, when the first adapter plate 202 formed by using the PCB is electrically connected to the side surfaces of the circuit boards 201 with different multilayer specifications, because the distances between the first adapter plate 202 and part of the circuit boards 201 are different, the coating amount needs to be adjusted separately when the circuit boards with different specifications are coated with solder paste or conductive adhesive, thereby resulting in a complicated manufacturing process.

In addition, in order to improve the structural stability and reliability of the circuit board assembly 20 during its use, such that the spacing between two adjacent layers of circuit boards 201 remains constant, the circuit board assembly 20 further comprises at least one insulating support column 50, as shown in fig. 15 a.

The insulating support column 50 is disposed between two adjacent layers of circuit boards 201, and is used for supporting the two adjacent layers of circuit boards 201.

In the embodiment of the present application, the material constituting the insulating support group 50 may include at least one of resin having an insulating property and ceramic.

In order to avoid the influence of the insulating support members 50 on the electronic component 30 integrated on the upper surface a1 or the lower surface a2 of the circuit board 201, as shown in fig. 15a, the insulating support members 50 contact the portions of the upper surface a1 or the lower surface a2 of the circuit board 201 where the electronic component 30 is not disposed.

Therefore, the insulating support columns 50 are prevented from contacting the electronic component 30, so that the force applied to the insulating support columns 50 is applied to the electronic component 30 in the use process of the terminal 01, and the electronic component 30 is damaged.

In other embodiments of the present application, in the surface of the circuit board 201 that is in contact with the insulating support posts 50, as shown in fig. 15b, an orthographic projection of the insulating support posts 50 on the surface is located at a corner between two adjacent intersecting edges (e.g., C1 and C2) in the surface.

Based on this, an insulating support column 50 can be arranged at each included angle position of the circuit board 201, so that the stress of each insulating support column 50 arranged on the same layer of circuit board 201 is uniform, and the stability of the structure of the two adjacent layers of circuit boards 201 can be further improved.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A circuit board assembly, comprising:

at least two layers of circuit boards; the circuit board is provided with an upper surface and a lower surface which are oppositely arranged;

the at least one layer of circuit board comprises two layers of insulating carrier plates, metal wiring is arranged on the surfaces of the insulating carrier plates, and metallized holes are formed in the insulating carrier plates;

the first transfer board is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards;

the circuit board assembly further comprises at least one second adapter plate, and the second adapter plate and the first adapter plate are arranged on different sides of at least two layers of the circuit boards; the second adapter plate is a flexible circuit board and is provided with metal wiring

One end of the second adapter plate is embedded between the insulating carrier plates in one of the circuit boards of at least two layers of the circuit boards, and the metal wiring of the second adapter plate is electrically connected with the metal wiring of the circuit board through the metallization hole;

2. the circuit board assembly of claim 1, wherein the second interposer is electrically connected to a surface of at least one of the layers of circuit boards.

3. The circuit board assembly of claim 1, wherein the second interposer is electrically connected to at least one layer of the circuit board side.

4. A circuit board assembly according to any of claims 1-3, wherein the first interposer board is electrically connected to at least two layers of surfaces of the circuit board.

5. The circuit board assembly of claim 4, wherein the first interposer board is electrically connected to the side of at least two layers of the circuit boards that are on the same side.

6. The circuit board assembly of claim 4, wherein one of said first interposer boards is electrically connected to at least two of said circuit boards, one of said circuit boards having an upper or lower surface electrically connected thereto, and to at least one of the remaining circuit boards having a side surface electrically connected thereto.

7. The circuit board assembly of claim 4, wherein one of said first interposer boards is electrically connected at one end to an upper surface of at least two of said circuit boards, and at the other end to a lower surface of the remaining one of said circuit boards.

8. A circuit board assembly according to any of claims 1 to 7, wherein the first interface board is a printed circuit board or a flexible circuit board, one on each side of at least two layers of the circuit board.

9. A circuit board assembly according to any of claims 1 to 7, wherein the first transfer plate is a flexible circuit board, at least two layers of the circuit board being wrapped on each side by one of the first transfer plates.

10. A circuit board assembly according to any of claims 3, 5 or 6, wherein the side of the circuit board has a plurality of first electrical connectors arranged at intervals; the first electric connector is electrically connected with a metal wiring inside the circuit board;

the first adapter plate is provided with a plurality of second electric connectors arranged at intervals; the second electric connector is electrically connected with the metal wiring inside the first transfer plate;

one of the first electrical connections is electrically connected to one of the second electrical connections.

11. The circuit board assembly of claim 6, wherein the upper or lower surface of the circuit board has a plurality of spaced third electrical connections; the third electrical connector is electrically connected with a metal wiring inside the circuit board;

one of the second electrical connections is electrically connected to one of the third electrical connections.

12. The circuit board assembly according to claim 11, wherein the first electrical connector 41 is bonded and electrically connected to the second electrical connector 42 by a conductive adhesive.

13. The circuit board assembly of claim 1, further comprising:

and the at least one insulating support column is arranged between the two adjacent layers of circuit boards and is used for supporting the two adjacent layers of circuit boards.

14. An electronic terminal, characterized in that it comprises a circuit board assembly according to any of claims 1-13.