CN114156226A - Semiconductor wafer back cleaning equipment for semiconductor production - Google Patents
Semiconductor wafer back cleaning equipment for semiconductor production Download PDFInfo
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- CN114156226A CN114156226A CN202111478266.3A CN202111478266A CN114156226A CN 114156226 A CN114156226 A CN 114156226A CN 202111478266 A CN202111478266 A CN 202111478266A CN 114156226 A CN114156226 A CN 114156226A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 78
- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 230000001681 protective effect Effects 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 33
- 239000007788 liquid Substances 0.000 claims description 28
- 238000001035 drying Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000005485 electric heating Methods 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 9
- 230000002000 scavenging effect Effects 0.000 claims description 8
- 230000001954 sterilising effect Effects 0.000 claims description 7
- 239000002351 wastewater Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 abstract description 80
- 238000000034 method Methods 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/0209—Cleaning of wafer backside
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses semiconductor wafer back cleaning equipment for semiconductor production, relates to the technical field of semiconductor production, and aims to solve the problems in the prior art. When the wafer is cleaned, the second servo motor is firstly utilized to drive the second annular gear ring to rotate, so that the arc-shaped supporting plate is driven to rotate, the middle part is limited, the distance between the tail ends of the second annular gear ring can be adjusted in the rotating process, the equipment can be matched with wafers of various diameters to be fixedly clamped, a large amount of time can be saved, and the protective rubber pad is arranged at the joint of the equipment and the wafer, so that the contact surface of the wafer can be in soft contact, and the wafer can be prevented from being scratched.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a semiconductor wafer back cleaning device for semiconductor production.
Background
Wafers are the basic material for manufacturing semiconductor chips, and the most important raw material of semiconductor integrated circuits is silicon, so that the corresponding is silicon wafers. Silicon is widely found in nature in rocks, grits in the form of silicates or silica, and the manufacture of silicon wafers can be summarized in three basic steps: silicon extraction and purification, monocrystalline silicon growth and wafer molding.
After the silicon wafer is manufactured, more impurities are often left on the surface of the silicon wafer, and in order to remove the impurities and improve subsequent manufacturing quality, the silicon wafer is often required to be cleaned.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a semiconductor wafer back cleaning device for semiconductor production.
In order to achieve the purpose, the invention adopts the following technical scheme:
the semiconductor wafer back cleaning equipment for semiconductor production comprises a cleaning table, wherein a support frame is welded on the outer wall of the top of the cleaning table, a first electric telescopic rod is mounted at the top of the support frame, a cylindrical drying cover is fixed at a piston rod at the bottom of the first electric telescopic rod, and a heating shell is fixed at the top of the support frame;
an annular chute is fixed at the top of the cleaning table, sliding blocks which are symmetrically distributed are connected to the inner wall of the annular chute in a sliding mode, fixed seats are fixed at the tops of the sliding blocks, a second electric telescopic rod is installed on the inner wall of one side, opposite to the fixed seats, of each fixed seat, a liquid inlet pipe is fixed at the top of each second electric telescopic rod, a spray head is installed at the bottom of each liquid inlet pipe, and sterilizing lamps which are distributed equidistantly are installed on the inner wall of the annular chute;
a circular through groove is formed in the center of the top of the cleaning table, a fixing frame is fixed to the bottom of the cleaning table through bolts, a cylindrical containing shell is welded to the fixing frame, a circular groove is formed in the axis position of the inner wall of the top of the cylindrical containing shell, a liquid discharge pipe is communicated with the axis position of the bottom of the circular groove, a piston rod is inserted into the inner wall of the liquid discharge pipe, and a rubber sealing plug is bonded to the top of the piston rod;
the utility model discloses a bearing of a motor vehicle seat, including the cylindricality shell, the cylindricality is accomodate the casing bottom inner wall and is installed ultrasonic oscillator, and still is equipped with the rubber fore-set between the ultrasonic oscillator, the cylindricality is accomodate the casing top and all welds the backup pad that has the equidistance to distribute all around, and the welding of backup pad top has the gag lever post, the arc layer board that has the spacing hole is inserted to the gag lever post outer wall, and open arc layer board one end outer wall has the cavity, cavity internal connection has the connecting piece, and the connecting piece rotates and is connected with circular connecting rod, the welding of circular connecting rod outer wall has second annular ring gear, and the transmission of second annular ring gear meshing has the second gear, second gear bottom is connected with second servo motor, and second servo motor installs on the mount pad.
Further, an air inlet hose is communicated between the heating shell and the cylindrical drying cover, electric heating wires distributed at equal intervals are fixed inside the heating shell, and an air inlet fan is fixed at the air inlet of the heating shell.
Furthermore, the welding of fixing base outer wall has first annular ring gear, and the meshing transmission of first annular ring gear outer wall has first gear, first gear connection has a servo motor, and a servo motor passes through the locating rack to be fixed on clean platform.
Furthermore, the bottom of the piston rod is slidably inserted into the connecting pipe, the connecting pipe is communicated with a pressurizing chamber, and the pressurizing chamber is connected with a scavenging pump through a conduit.
Furthermore, the size of the rubber sealing plug is matched with that of the inner wall of the circular groove, and the circular groove is tightly matched with the rubber sealing plug.
Further, first electric telescopic handle, electric heating wire, air inlet fan, second electric telescopic handle, first servo motor, sterilamp, ultrasonic oscillator and second servo motor all are connected with the PLC controller through the signal line, and the PLC controller is connected with external power source through the wire.
Furthermore, the arc layer board is kept away from the one end welding of second annular ring gear and is had circular tray, and is equipped with pivoted extrusion round wheel above the circular tray, the outer wall of extrusion round wheel and circular tray all is equipped with protective rubber pad, and protective rubber pad outer wall all is equipped with anti-skidding screw thread.
Furthermore, the axes of the cylindrical drying cover, the circular through groove, the piston rod and the rubber sealing plug are all located on the same straight line, and the size of the cylindrical drying cover is matched with that of the circular through groove.
Furthermore, a transparent sealing cover is installed at the top of the cleaning table, and a wastewater collection box is arranged at the bottom of the cleaning table.
The invention has the beneficial effects that:
1. according to the semiconductor wafer back cleaning equipment for semiconductor production, when wafers are cleaned, the second servo motor is firstly utilized to drive the second annular gear ring to rotate, so that the arc-shaped supporting plate is driven to rotate, the middle part of the second annular gear ring is limited, the distance between the tail ends of the second annular gear ring can be adjusted in the rotating process, the equipment can be matched with wafers of various diameters to be fixedly clamped, a large amount of time can be saved, the protective rubber pad is arranged at the joint of the equipment and the wafers, the wafer contact surface can be in soft contact, and therefore the wafers are prevented from being scratched;
2. according to the semiconductor wafer back cleaning equipment for semiconductor production, after the wafer is fixed, the surface of the wafer can be effectively cleaned by utilizing the rotary spray head to be matched with the telescopic adjustment of the second electric telescopic rod, and the cleaned wafer is placed in the cylindrical containing shell and is vibrated and cleaned by utilizing the ultrasonic oscillator, so that the back of the wafer can be efficiently cleaned;
3. according to the semiconductor wafer back cleaning equipment for semiconductor production, after the wafer is cleaned, the wafer is jacked up by utilizing the air pressure adjusting rubber sealing plug for convenient subsequent treatment, and then the heated air is utilized for drying the wafer, so that the drying of the wafer can be accelerated, and the subsequent treatment can be facilitated.
Drawings
FIG. 1 is a front view of an overall three-dimensional structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention;
FIG. 2 is a side view of an overall three-dimensional structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention;
FIG. 3 is a schematic diagram of an overall three-dimensional structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention;
FIG. 4 is a bottom view of the overall three-dimensional structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention;
FIG. 5 is a schematic view of a partial structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention from a first perspective;
FIG. 6 is a second perspective view of a partial structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention;
FIG. 7 is a schematic diagram of a third perspective view of a partial structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention;
FIG. 8 is a fourth perspective view of a partial structure of a semiconductor wafer backside cleaning apparatus for semiconductor manufacturing according to the present invention;
fig. 9 is a schematic three-dimensional structure diagram of a cleaning table of a semiconductor wafer back side cleaning apparatus for semiconductor manufacturing according to the present invention.
In the figure: 1 cleaning table, 2 support frames, 3 first electric telescopic rods, 4 cylindrical drying covers, 5 heating shells, 6 air inlet hoses, 7 electric heating wires, 8 air inlet fans, 9 annular sliding grooves, 10 sliding blocks, 11 fixing seats, 12 second electric telescopic rods, 13 liquid inlet pipes, 14 spray heads, 15 first annular gear rings, 16 first gears, 17 first servo motors, 18 sterilizing lamps, 19 circular through grooves, 20 fixing frames, 21 cylindrical containing shells, 22 circular grooves, 23 liquid discharge pipes, 24 piston rods, 25 rubber sealing plugs, 26 connecting pipes, 27 pressurizing chambers, 28 air exchange pumps, 29 ultrasonic oscillators, 30 rubber support posts, 31 supporting plates, 32 limiting rods, 33 limiting holes, 34 arc supporting plates, 35 cavities, 36 connecting pieces, 37 circular connecting rods, 38 second annular gear rings, 39 second gears, 40 second servo motors, 41 mounting seats and 42PLC controllers.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1:
referring to fig. 1-8, the semiconductor wafer back cleaning equipment for semiconductor production comprises a cleaning table 1, wherein a support frame 2 is welded on the outer wall of the top of the cleaning table 1, a first electric telescopic rod 3 is installed at the top of the support frame 2, a cylindrical drying cover 4 is fixed at a piston rod at the bottom of the first electric telescopic rod 3, a heating shell 5 is fixed at the top of the support frame 2, a transparent sealing cover is installed at the top of the cleaning table 1, and a wastewater collection box is arranged at the bottom of the cleaning table 1;
an annular chute 9 is fixed at the top of the cleaning table 1, sliding blocks 10 which are symmetrically distributed are connected on the inner wall of the annular chute 9 in a sliding way, an air inlet hose 6 is communicated between the heating shell 5 and the cylindrical drying cover 4, electric heating wires 7 distributed at equal intervals are fixed in the heating shell 5, an air inlet fan 8 is fixed at an air inlet of the heating shell 5, fixed seats 11 are fixed at the tops of the sliding blocks 10, and the inner wall of one side opposite to the fixed seat 11 is provided with a second electric telescopic rod 12, the top of the second electric telescopic rod 12 is fixed with a liquid inlet pipe 13, and the bottom of the liquid inlet pipe 13 is provided with a spray head 14, the outer wall of the fixed seat 11 is welded with a first annular gear ring 15, and the outer wall of the first annular gear ring 15 is engaged with and driven by a first gear 16, the first gear 16 is connected with a first servo motor 17, the first servo motor 17 is fixed on the cleaning table 1 through a positioning frame, and sterilizing lamps 18 which are distributed equidistantly are arranged on the inner wall of the annular chute 9;
a circular through groove 19 is formed in the center of the top of the cleaning table 1, a fixing frame 20 is fixed to the bottom of the cleaning table 1 through bolts, a cylindrical containing shell 21 is welded to the fixing frame 20, a circular groove 22 is formed in the axis position of the inner wall of the top of the cylindrical containing shell 21, a liquid discharge pipe 23 is communicated with the axis position of the bottom of the circular groove 22, a piston rod 24 is inserted into the inner wall of the liquid discharge pipe 23, and a rubber sealing plug 25 is bonded to the top of the piston rod 24;
the size of the rubber sealing plug 25 is matched with that of the inner wall of the circular groove 22, the circular groove 22 and the rubber sealing plug 25 are tightly matched, the bottom of the piston rod 24 is inserted in the connecting pipe 26 in a sliding mode, the connecting pipe 26 is communicated with the pressurizing chamber 27, the pressurizing chamber 27 is connected with the scavenging pump 28 through a conduit, the axes of the cylindrical drying cover 4, the circular through groove 19, the piston rod 24 and the rubber sealing plug 25 are all located on the same straight line, and the size of the cylindrical drying cover 4 is matched with that of the circular through groove 19;
when the wafer is cleaned, the second servo motor 40 is firstly utilized to drive the second annular gear ring 38 to rotate, so that the arc-shaped supporting plate 34 is driven to rotate, the middle part is limited, the distance between the tail ends of the second annular gear ring 38 can be adjusted in the rotating process, the equipment can be matched with wafers of various diameters to be fixedly clamped, a large amount of time can be saved, and the protective rubber pad is arranged at the joint of the equipment and the wafer, so that the contact surface of the wafer can be in soft contact, and the wafer is prevented from being scratched;
the ultrasonic oscillator 29 is installed on the inner wall of the bottom of the cylindrical containing shell 21, the rubber support columns 30 are further arranged between the ultrasonic oscillators 29, the supporting plates 31 which are distributed equidistantly are welded on the periphery of the top of the cylindrical containing shell 21, the limiting rods 32 are welded on the tops of the supporting plates 31, the arc-shaped supporting plates 34 with limiting holes 33 are inserted into the outer walls of the limiting rods 32, cavities 35 are formed in the outer walls of one ends of the arc-shaped supporting plates 34, connecting pieces 36 are connected inside the cavities 35, the connecting pieces 36 are rotatably connected with circular connecting rods 37, second annular gear rings 38 are welded on the outer walls of the circular connecting rods 37, second gears 39 are meshed with the second annular gear rings 38 and driven by the second annular gear rings 39, second servo motors 40 are connected to the bottoms of the second gears 39, and the second servo motors 40 are installed on the installation seats 41;
When using the semiconductor package device for semiconductor chip production, the device is first connected to an external power supply. Then utilize second servo motor 39 drive second annular ring gear 38 to rotate to drive arc layer board 34 and rotate, then place the wafer in arc layer board 34 top, it is fixed that slow rotation second annular ring gear 38 carries out the centre gripping to the wafer, the length of adjusting second electric telescopic handle 12 after the centre gripping finishes, and with the liquid inlet pipe 13 external connection flush fluid, slow movement second electric telescopic handle 12, and start first servo motor 17 drive shower nozzle and rotate, thereby carry out cleaning process to the surface of wafer.
Example 2:
referring to fig. 2-7, the semiconductor wafer back cleaning equipment for semiconductor production comprises a cleaning table 1, wherein a support frame 2 is welded on the outer wall of the top of the cleaning table 1, a first electric telescopic rod 3 is installed at the top of the support frame 2, a cylindrical drying cover 4 is fixed at a piston rod at the bottom of the first electric telescopic rod 3, a heating shell 5 is fixed at the top of the support frame 2, a transparent sealing cover is installed at the top of the cleaning table 1, and a wastewater collection box is arranged at the bottom of the cleaning table 1;
an annular chute 9 is fixed at the top of the cleaning table 1, sliding blocks 10 which are symmetrically distributed are connected on the inner wall of the annular chute 9 in a sliding way, an air inlet hose 6 is communicated between the heating shell 5 and the cylindrical drying cover 4, electric heating wires 7 distributed at equal intervals are fixed in the heating shell 5, an air inlet fan 8 is fixed at an air inlet of the heating shell 5, fixed seats 11 are fixed at the tops of the sliding blocks 10, and the inner wall of one side opposite to the fixed seat 11 is provided with a second electric telescopic rod 12, the top of the second electric telescopic rod 12 is fixed with a liquid inlet pipe 13, and the bottom of the liquid inlet pipe 13 is provided with a spray head 14, the outer wall of the fixed seat 11 is welded with a first annular gear ring 15, and the outer wall of the first annular gear ring 15 is engaged with and driven by a first gear 16, the first gear 16 is connected with a first servo motor 17, the first servo motor 17 is fixed on the cleaning table 1 through a positioning frame, and sterilizing lamps 18 which are distributed equidistantly are arranged on the inner wall of the annular chute 9;
a circular through groove 19 is formed in the center of the top of the cleaning table 1, a fixing frame 20 is fixed to the bottom of the cleaning table 1 through bolts, a cylindrical containing shell 21 is welded to the fixing frame 20, a circular groove 22 is formed in the axis position of the inner wall of the top of the cylindrical containing shell 21, a liquid discharge pipe 23 is communicated with the axis position of the bottom of the circular groove 22, a piston rod 24 is inserted into the inner wall of the liquid discharge pipe 23, and a rubber sealing plug 25 is bonded to the top of the piston rod 24;
after the wafer is fixed, the surface of the wafer can be effectively cleaned by the aid of the rotating spray head matched with the telescopic adjustment of the second electric telescopic rod 12, and the cleaned wafer is placed inside the cylindrical containing shell 21 and is cleaned in an oscillating mode through the ultrasonic oscillator 29, so that the back surface of the wafer can be efficiently cleaned;
the size of the rubber sealing plug 25 is matched with that of the inner wall of the circular groove 22, the circular groove 22 and the rubber sealing plug 25 are tightly matched, the bottom of the piston rod 24 is inserted in the connecting pipe 26 in a sliding mode, the connecting pipe 26 is communicated with the pressurizing chamber 27, the pressurizing chamber 27 is connected with the scavenging pump 28 through a conduit, the axes of the cylindrical drying cover 4, the circular through groove 19, the piston rod 24 and the rubber sealing plug 25 are all located on the same straight line, and the size of the cylindrical drying cover 4 is matched with that of the circular through groove 19;
the ultrasonic oscillator 29 is installed on the inner wall of the bottom of the cylindrical containing shell 21, the rubber support columns 30 are further arranged between the ultrasonic oscillators 29, the supporting plates 31 which are distributed equidistantly are welded on the periphery of the top of the cylindrical containing shell 21, the limiting rods 32 are welded on the tops of the supporting plates 31, the arc-shaped supporting plates 34 with limiting holes 33 are inserted into the outer walls of the limiting rods 32, cavities 35 are formed in the outer walls of one ends of the arc-shaped supporting plates 34, connecting pieces 36 are connected inside the cavities 35, the connecting pieces 36 are rotatably connected with circular connecting rods 37, second annular gear rings 38 are welded on the outer walls of the circular connecting rods 37, second gears 39 are meshed with the second annular gear rings 38 and driven by the second annular gear rings 39, second servo motors 40 are connected to the bottoms of the second gears 39, and the second servo motors 40 are installed on the installation seats 41;
When using the semiconductor package device for semiconductor chip production, the device is first connected to an external power supply. Then, a second servo motor 39 is used for driving a second annular gear ring 38 to rotate so as to drive an arc-shaped supporting plate 34 to rotate, then the wafer is placed above the arc-shaped supporting plate 34, the second annular gear ring 38 is slowly rotated to clamp and fix the wafer, after clamping is finished, the length of a second electric telescopic rod 12 is adjusted, the outside of a liquid inlet pipe 13 is connected with washing liquid, the second electric telescopic rod 12 is slowly moved, and a first servo motor 17 is started to drive a spray head to rotate so as to clean the surface of the wafer;
after the surface of the wafer is cleaned, the piston rod 24 is jacked up by starting the scavenging pump 28, wastewater inside the cylindrical housing shell 21 is discharged, then the wafer is jacked up by using the rubber sealing plug 25, the arc-shaped supporting plate 34 is housed by reversely rotating the second annular toothed ring 38, then the wafer is slowly placed above the rubber top column 30, the circular groove 22 is blocked by using the rubber sealing plug 25, cleaning liquid is put in, the ultrasonic oscillator 29 is turned on to carry out oscillation cleaning, and therefore the back cleaning of the wafer is completed.
Example 3:
referring to fig. 4-9, the semiconductor wafer back cleaning equipment for semiconductor production comprises a cleaning table 1, wherein a support frame 2 is welded on the outer wall of the top of the cleaning table 1, a first electric telescopic rod 3 is installed at the top of the support frame 2, a cylindrical drying cover 4 is fixed at a piston rod at the bottom of the first electric telescopic rod 3, a heating shell 5 is fixed at the top of the support frame 2, a transparent sealing cover is installed at the top of the cleaning table 1, and a wastewater collection box is arranged at the bottom of the cleaning table 1;
after the wafer is cleaned, in order to facilitate subsequent treatment, the wafer is jacked up by using the air pressure adjusting rubber sealing plug 25, and then the wafer is dried by using heated air, so that the drying of the wafer can be accelerated, and the subsequent treatment can be facilitated;
an annular chute 9 is fixed at the top of the cleaning table 1, sliding blocks 10 which are symmetrically distributed are connected on the inner wall of the annular chute 9 in a sliding way, an air inlet hose 6 is communicated between the heating shell 5 and the cylindrical drying cover 4, electric heating wires 7 distributed at equal intervals are fixed in the heating shell 5, an air inlet fan 8 is fixed at an air inlet of the heating shell 5, fixed seats 11 are fixed at the tops of the sliding blocks 10, and the inner wall of one side opposite to the fixed seat 11 is provided with a second electric telescopic rod 12, the top of the second electric telescopic rod 12 is fixed with a liquid inlet pipe 13, and the bottom of the liquid inlet pipe 13 is provided with a spray head 14, the outer wall of the fixed seat 11 is welded with a first annular gear ring 15, and the outer wall of the first annular gear ring 15 is engaged with and driven by a first gear 16, the first gear 16 is connected with a first servo motor 17, the first servo motor 17 is fixed on the cleaning table 1 through a positioning frame, and sterilizing lamps 18 which are distributed equidistantly are arranged on the inner wall of the annular chute 9;
a circular through groove 19 is formed in the center of the top of the cleaning table 1, a fixing frame 20 is fixed to the bottom of the cleaning table 1 through bolts, a cylindrical containing shell 21 is welded to the fixing frame 20, a circular groove 22 is formed in the axis position of the inner wall of the top of the cylindrical containing shell 21, a liquid discharge pipe 23 is communicated with the axis position of the bottom of the circular groove 22, a piston rod 24 is inserted into the inner wall of the liquid discharge pipe 23, and a rubber sealing plug 25 is bonded to the top of the piston rod 24;
the size of the rubber sealing plug 25 is matched with that of the inner wall of the circular groove 22, the circular groove 22 and the rubber sealing plug 25 are tightly matched, the bottom of the piston rod 24 is inserted in the connecting pipe 26 in a sliding mode, the connecting pipe 26 is communicated with the pressurizing chamber 27, the pressurizing chamber 27 is connected with the scavenging pump 28 through a conduit, the axes of the cylindrical drying cover 4, the circular through groove 19, the piston rod 24 and the rubber sealing plug 25 are all located on the same straight line, and the size of the cylindrical drying cover 4 is matched with that of the circular through groove 19;
the ultrasonic oscillator 29 is installed on the inner wall of the bottom of the cylindrical containing shell 21, the rubber support columns 30 are further arranged between the ultrasonic oscillators 29, the supporting plates 31 which are distributed equidistantly are welded on the periphery of the top of the cylindrical containing shell 21, the limiting rods 32 are welded on the tops of the supporting plates 31, the arc-shaped supporting plates 34 with limiting holes 33 are inserted into the outer walls of the limiting rods 32, cavities 35 are formed in the outer walls of one ends of the arc-shaped supporting plates 34, connecting pieces 36 are connected inside the cavities 35, the connecting pieces 36 are rotatably connected with circular connecting rods 37, second annular gear rings 38 are welded on the outer walls of the circular connecting rods 37, second gears 39 are meshed with the second annular gear rings 38 and driven by the second annular gear rings 39, second servo motors 40 are connected to the bottoms of the second gears 39, and the second servo motors 40 are installed on the installation seats 41;
When using the semiconductor package device for semiconductor chip production, the device is first connected to an external power supply. Then, a second servo motor 39 is used for driving a second annular gear ring 38 to rotate so as to drive an arc-shaped supporting plate 34 to rotate, then the wafer is placed above the arc-shaped supporting plate 34, the second annular gear ring 38 is slowly rotated to clamp and fix the wafer, after clamping is finished, the length of a second electric telescopic rod 12 is adjusted, the outside of a liquid inlet pipe 13 is connected with washing liquid, the second electric telescopic rod 12 is slowly moved, and a first servo motor 17 is started to drive a spray head to rotate so as to clean the surface of the wafer;
after the surface of the wafer is cleaned, starting the scavenging pump 28 to jack the piston rod 24, discharging wastewater in the cylindrical accommodating shell 21, then jacking the wafer by using the rubber sealing plug 25, reversely rotating the second annular gear ring 38 to accommodate the arc-shaped supporting plate 34, then slowly placing the wafer above the rubber top column 30, blocking the circular groove 22 by using the rubber sealing plug 25, putting in a cleaning solution, and opening the ultrasonic oscillator 29 for oscillation cleaning, thereby completing the back cleaning of the wafer;
after the wafer is cleaned, the cylindrical sealing plug 25 is jacked up by using the scavenging pump 28, then the position of the arc-shaped supporting plate 34 is adjusted to fix the wafer again, after the wafer is fixed, the electric heating wire 7 and the air inlet fan 8 are started, the position of the cylindrical drying cover 4 is adjusted to cover the wafer, and then the wafer is dried.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The semiconductor wafer back cleaning equipment for semiconductor production comprises a cleaning table (1) and is characterized in that a support frame (2) is welded on the outer wall of the top of the cleaning table (1), a first electric telescopic rod (3) is installed at the top of the support frame (2), a cylindrical drying cover (4) is fixed at a piston rod at the bottom of the first electric telescopic rod (3), and a heating shell (5) is fixed at the top of the support frame (2);
an annular sliding chute (9) is fixed to the top of the cleaning table (1), sliding blocks (10) which are symmetrically distributed are connected to the inner wall of the annular sliding chute (9) in a sliding mode, fixing seats (11) are fixed to the tops of the sliding blocks (10), second electric telescopic rods (12) are installed on the inner wall of one side, opposite to the fixing seats (11), of each second electric telescopic rod (12), a liquid inlet pipe (13) is fixed to the top of each second electric telescopic rod, a spray head (14) is installed at the bottom of each liquid inlet pipe (13), and sterilizing lamps (18) which are distributed equidistantly are installed on the inner wall of the annular sliding chute (9);
a circular through groove (19) is formed in the center of the top of the cleaning table (1), a fixing frame (20) is fixed to the bottom of the cleaning table (1) through bolts, a cylindrical containing shell (21) is welded to the fixing frame (20), a circular groove (22) is formed in the axis position of the inner wall of the top of the cylindrical containing shell (21), a liquid discharge pipe (23) is communicated with the axis position of the bottom of the circular groove (22), a piston rod (24) is inserted into the inner wall of the liquid discharge pipe (23), and a rubber sealing plug (25) is bonded to the top of the piston rod (24);
ultrasonic oscillator (29) are installed to the inner wall of cylindricality storage shell (21) bottom, and still be equipped with rubber fore-set (30) between ultrasonic oscillator (29), cylindricality storage shell (21) top all welds backup pad (31) that the equidistance distributes all around, and backup pad (31) top welding has gag lever post (32), arc layer board (34) that gag lever post (32) outer wall was inserted and is had spacing hole (33), and arc layer board (34) one end outer wall opens has cavity (35), cavity (35) internal connection has connecting piece (36), and connecting piece (36) rotate and be connected with circular connecting rod (37), circular connecting rod (37) outer wall welding has second annular ring gear (38), and second annular ring gear (38) meshing transmission has second gear (39), second gear (39) bottom is connected with second servo motor (40), and the second servo motor (40) is mounted on the mounting base (41).
2. The semiconductor wafer back cleaning device for semiconductor production as claimed in claim 1, wherein an air inlet hose (6) is communicated between the heating shell (5) and the cylindrical drying hood (4), electric heating wires (7) are fixed inside the heating shell (5) and distributed equidistantly, and an air inlet fan (8) is fixed at an air inlet of the heating shell (5).
3. The semiconductor wafer back side cleaning device for semiconductor production as claimed in claim 1, wherein a first annular gear ring (15) is welded on the outer wall of the fixed seat (11), a first gear (16) is meshed and driven on the outer wall of the first annular gear ring (15), the first gear (16) is connected with a first servo motor (17), and the first servo motor (17) is fixed on the cleaning table (1) through a positioning frame.
4. The semiconductor wafer back side cleaning device for semiconductor production as claimed in claim 1, wherein the bottom of the piston rod (24) is slidably inserted into the connecting pipe (26), and the connecting pipe (26) is communicated with a pressurizing chamber (27), and the pressurizing chamber (27) is connected with a scavenging pump (28) through a conduit.
5. The semiconductor wafer back side cleaning device for semiconductor production as claimed in claim 1, wherein the rubber sealing plug (25) is adapted to the inner wall of the circular groove (22) in size, and the circular groove (22) and the rubber sealing plug (25) form a tight fit.
6. The semiconductor wafer back side cleaning device for semiconductor production as claimed in claim 2, wherein the first electric telescopic rod (3), the electric heating wire (7), the air supply fan (8), the second electric telescopic rod (12), the first servo motor (17), the sterilizing lamp (18), the ultrasonic oscillator (29) and the second servo motor (40) are all connected with a PLC controller (42) through signal lines, and the PLC controller (42) is connected with an external power supply through a lead.
7. The semiconductor wafer back cleaning device for semiconductor production as claimed in claim 1, wherein a circular supporting block is welded at one end of the arc supporting plate (34) far away from the second annular gear ring (38), a rotary extrusion circular wheel is arranged above the circular supporting block, protective rubber pads are arranged on the outer walls of the extrusion circular wheel and the circular supporting block, and anti-skid threads are arranged on the outer walls of the protective rubber pads.
8. The semiconductor wafer back cleaning device for semiconductor production as claimed in claim 1, wherein the axes of the cylindrical drying hood (4), the circular through groove (19), the piston rod (24) and the rubber sealing plug (25) are all located on the same straight line, and the size of the cylindrical drying hood (4) is matched with the size of the circular through groove (19).
9. The semiconductor wafer back side cleaning device for semiconductor production as claimed in claim 1, wherein a transparent sealing cover is installed on the top of the cleaning table (1), and a waste water collection tank is arranged on the bottom of the cleaning table (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111478266.3A CN114156226A (en) | 2021-12-06 | 2021-12-06 | Semiconductor wafer back cleaning equipment for semiconductor production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111478266.3A CN114156226A (en) | 2021-12-06 | 2021-12-06 | Semiconductor wafer back cleaning equipment for semiconductor production |
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| CN202111478266.3A Pending CN114156226A (en) | 2021-12-06 | 2021-12-06 | Semiconductor wafer back cleaning equipment for semiconductor production |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
| CN115401549A (en) * | 2022-08-31 | 2022-11-29 | 安徽富乐德长江半导体材料股份有限公司 | Adjusting device for improving flatness of surface of wafer |
| CN116130388A (en) * | 2023-04-11 | 2023-05-16 | 常州市常航干燥设备有限公司 | Wafer drying device |
| CN117223602A (en) * | 2023-11-13 | 2023-12-15 | 四川省中医药科学院 | Pollen pollinator for paris polyphylla planting and use method |
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2021
- 2021-12-06 CN CN202111478266.3A patent/CN114156226A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115401549A (en) * | 2022-08-31 | 2022-11-29 | 安徽富乐德长江半导体材料股份有限公司 | Adjusting device for improving flatness of surface of wafer |
| CN115401549B (en) * | 2022-08-31 | 2024-04-16 | 安徽富乐德长江半导体材料股份有限公司 | Adjusting device for improving surface flatness of wafer |
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
| CN115178435B (en) * | 2022-09-14 | 2022-12-30 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
| CN116130388A (en) * | 2023-04-11 | 2023-05-16 | 常州市常航干燥设备有限公司 | Wafer drying device |
| CN117223602A (en) * | 2023-11-13 | 2023-12-15 | 四川省中医药科学院 | Pollen pollinator for paris polyphylla planting and use method |
| CN117223602B (en) * | 2023-11-13 | 2024-01-26 | 四川省中医药科学院 | Pollen pollinator for paris polyphylla planting and use method |
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