CN114156226A - Semiconductor wafer back cleaning equipment for semiconductor production - Google Patents
Semiconductor wafer back cleaning equipment for semiconductor production Download PDFInfo
- Publication number
- CN114156226A CN114156226A CN202111478266.3A CN202111478266A CN114156226A CN 114156226 A CN114156226 A CN 114156226A CN 202111478266 A CN202111478266 A CN 202111478266A CN 114156226 A CN114156226 A CN 114156226A
- Authority
- CN
- China
- Prior art keywords
- wall
- circular
- fixed
- semiconductor
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 78
- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 230000001681 protective effect Effects 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 33
- 239000007788 liquid Substances 0.000 claims description 28
- 238000001035 drying Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000005485 electric heating Methods 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 9
- 230000002000 scavenging effect Effects 0.000 claims description 8
- 230000001954 sterilising effect Effects 0.000 claims description 7
- 239000002351 wastewater Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 abstract description 80
- 238000000034 method Methods 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/0209—Cleaning of wafer backside
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111478266.3A CN114156226A (en) | 2021-12-06 | 2021-12-06 | Semiconductor wafer back cleaning equipment for semiconductor production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111478266.3A CN114156226A (en) | 2021-12-06 | 2021-12-06 | Semiconductor wafer back cleaning equipment for semiconductor production |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114156226A true CN114156226A (en) | 2022-03-08 |
Family
ID=80453011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111478266.3A Pending CN114156226A (en) | 2021-12-06 | 2021-12-06 | Semiconductor wafer back cleaning equipment for semiconductor production |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114156226A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
CN115401549A (en) * | 2022-08-31 | 2022-11-29 | 安徽富乐德长江半导体材料股份有限公司 | Adjusting device for improving flatness of surface of wafer |
CN116130388A (en) * | 2023-04-11 | 2023-05-16 | 常州市常航干燥设备有限公司 | Wafer drying device |
CN116666288A (en) * | 2023-06-12 | 2023-08-29 | 深圳龙芯半导体科技有限公司 | Positioning mechanism for semiconductor chip production |
CN117223602A (en) * | 2023-11-13 | 2023-12-15 | 四川省中医药科学院 | Pollen pollinator for paris polyphylla planting and use method |
-
2021
- 2021-12-06 CN CN202111478266.3A patent/CN114156226A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115401549A (en) * | 2022-08-31 | 2022-11-29 | 安徽富乐德长江半导体材料股份有限公司 | Adjusting device for improving flatness of surface of wafer |
CN115401549B (en) * | 2022-08-31 | 2024-04-16 | 安徽富乐德长江半导体材料股份有限公司 | Adjusting device for improving surface flatness of wafer |
CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
CN115178435B (en) * | 2022-09-14 | 2022-12-30 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
CN116130388A (en) * | 2023-04-11 | 2023-05-16 | 常州市常航干燥设备有限公司 | Wafer drying device |
CN116666288A (en) * | 2023-06-12 | 2023-08-29 | 深圳龙芯半导体科技有限公司 | Positioning mechanism for semiconductor chip production |
CN117223602A (en) * | 2023-11-13 | 2023-12-15 | 四川省中医药科学院 | Pollen pollinator for paris polyphylla planting and use method |
CN117223602B (en) * | 2023-11-13 | 2024-01-26 | 四川省中医药科学院 | Pollen pollinator for paris polyphylla planting and use method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Country or region after: China Address after: 214000 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Applicant after: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Address before: 214000 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Applicant before: ENERGY INTELLIGENT TECHNOLOGY WUXI CO.,LTD. Country or region before: China |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Country or region after: China Address after: 214000 Jiangsu Wuxi Jinshanbei Science and Technology Industrial Park C1-8 Applicant after: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Address before: 214000 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Applicant before: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Country or region before: China |
|
CB02 | Change of applicant information |