CN114156215A - Automatic sintering equipment for diode element - Google Patents
Automatic sintering equipment for diode element Download PDFInfo
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- CN114156215A CN114156215A CN202210119669.7A CN202210119669A CN114156215A CN 114156215 A CN114156215 A CN 114156215A CN 202210119669 A CN202210119669 A CN 202210119669A CN 114156215 A CN114156215 A CN 114156215A
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- 238000005245 sintering Methods 0.000 title claims abstract description 76
- 238000012545 processing Methods 0.000 claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims description 27
- 230000005540 biological transmission Effects 0.000 claims description 22
- 238000009434 installation Methods 0.000 claims description 21
- 230000010354 integration Effects 0.000 claims description 6
- 210000003781 tooth socket Anatomy 0.000 claims description 5
- 210000001503 joint Anatomy 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 244000309464 bull Species 0.000 description 2
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- 230000008676 import Effects 0.000 description 2
- 238000012958 reprocessing Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010616 electrical installation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Abstract
The invention relates to the technical field of diode element processing, in particular to automatic diode element sintering equipment, which comprises an equipment base and a processing shell, wherein a plurality of pre-storage grooves are respectively arranged at two sides of the equipment base, the processing shell is fixedly arranged at one side of the upper surface of the equipment base, a bearing seat is fixedly arranged at one side of the upper surface of the equipment base, which is far away from the processing shell, and a supporting rotating rod is rotatably arranged at the upper end of the bearing seat. The problem of causing waste of material arises.
Description
Technical Field
The invention relates to the technical field of diode element processing, in particular to automatic sintering equipment for a diode element.
Background
The use demand of people on diodes is also improved along with the development of science and technology, wherein the diodes are electronic devices made of semiconductor materials and are widely applied, but the diodes need to be sintered when being processed so as to be normally used, but the process of the existing sintering process is complicated, the internal diodes need to be replaced before and after sintering, the diodes are generally replaced manually in the prior art, the equipment needs to be replaced, the existing sintering equipment cannot be subjected to automatic pre-temperature control treatment, the problem that the materials are broken when being processed or after being processed is easily caused, and the waste of the materials is caused.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides automatic sintering equipment for diode elements, which solves the problems that the internal diodes need to be replaced before and after sintering, so that the equipment processing time is occupied during replacement, and the existing sintering equipment can not automatically perform pre-temperature control treatment, so that the material is easily broken during reprocessing or after processing.
(II) technical scheme
In order to achieve the purpose, the invention adopts the technical scheme that:
an automatic sintering device for diode elements comprises a device base and a processing shell, wherein a plurality of pre-storage grooves are respectively formed in two sides of the device base, the processing shell is fixedly arranged on one side of the upper surface of the device base, a bearing seat is fixedly arranged on one side, far away from the processing shell, of the upper surface of the device base, a supporting rotating rod is rotatably arranged at the upper end of the bearing seat, a rotating shaft mounting plate is fixedly arranged at the top end of the rod body of the supporting rotating rod, a plurality of placing components are mounted on the rotating shaft mounting plate through component mounting grooves, a sintering component is mounted inside the processing shell, the placing components pass through the sintering component, a motor is fixedly mounted on one side, close to the bearing seat, of the upper surface of the device base, a cylinder is fixedly mounted on one side, close to the processing shell, of the upper surface of the device base, a connecting plate is fixedly mounted at the output end of the cylinder, and a positioning groove is fixedly mounted on the lower surface of the connecting plate and above the processing shell, the connecting plate is through the constant head tank with correspond the subassembly of placing and cooperate, every place the subassembly and all install a plurality of diode bodies.
Preferably, the output end of the motor is fixedly provided with a transmission gear, the support rotating rod body is integrally provided with a driven gear, the driven gear and the transmission gear are in meshing transmission, and a plurality of assembly mounting grooves are formed in one circle of the outer surface of the rotating shaft mounting disc respectively.
Preferably, every the subassembly mounting groove is inside all to alternate to install and to place the subassembly, the pivot mounting disc upper surface just is located to correspond the subassembly mounting groove position and all runs through and has seted up threaded fixing hole, every side position locating hole has all been seted up to threaded fixing hole both sides.
Preferably, the sintering assembly comprises a processing closed pipe and a sintering stopping groove, the sintering stopping groove is formed in the processing shell, the processing closed pipe is fixedly arranged at the bottom end of the sintering stopping groove, and a heating rod is electrically arranged inside the processing closed pipe.
Preferably, be located processing closed tube inner wall the heating rod periphery is provided with the cooperation spacing ring that is used for the diode body position of limiting position, the heating rod top carries out the chucking cooperation with the location butt joint cover, processing closed tube upside inner wall and installation are placed the dish and are carried out the chucking cooperation.
Preferably, a transmission limiting groove is formed in the middle of the processing shell, matching tooth grooves are formed in the inner walls of the two sides of the transmission limiting groove, material inlets and material outlets are formed in the surfaces of the two ends of the processing shell, an installation placing disc is movably inserted into the material inlets and the material outlets, power supply installation seats are respectively arranged on the two sides of the interior of the processing shell, and heating lamps are electrically installed on the upper surface of each power supply installation seat.
As preferred, every place the subassembly including fixed fixture block, every fixed fixture block is equallyd divide and is do not alternate the setting inside corresponding subassembly mounting groove, every the screw thread fixing hole has all been seted up at fixed fixture block center, every the inside equal threaded mounting of screw thread fixing hole has fixing bolt, fixing bolt rotates and installs at support mounting panel body center, support mounting panel both sides lower surface integration is provided with the side position reference column, every the side position reference column all alternates the setting inside corresponding side position locating hole.
Preferably, the outer end of each fixed fixture block is provided with an extension supporting rod in an integrated mode, each rotary lantern ring is fixedly mounted at one end, far away from the fixed fixture block, of each extension supporting rod, each rotary lantern ring is internally provided with an insertion rod in an inserted mode, each insertion rod body is fixedly mounted at the top end of the rotary lantern ring, a positioning chuck is fixedly mounted at the top end of the insertion rod body, each insertion rod body between the positioning chuck and the rotary lantern ring is sleeved with a reset spring, and a mounting placing disc is arranged below the insertion rod.
Preferably, each installing and placing disc upper surface homogeneity is provided with a connecting round rod, the connecting round rod upper surface is fixedly installed on the lower surface of the corresponding inserting rod, the connecting round rod body is integrally provided with a plurality of driven teeth, the driven teeth are adjacent to the matching tooth grooves, transmission matching is carried out between the driven teeth and the matching tooth grooves, and each installing and placing disc body lower surface is integrally provided with a positioning butting sleeve.
Preferably, a material mounting hole is formed in each mounting and placing disc body in a penetrating mode in one circle, a sliding groove is formed in one side of the inner wall of each material mounting hole, a sliding clamping block is arranged on the inner wall of each sliding groove in a limiting mode through a limiting spring, each sliding clamping block is movably arranged in the corresponding sliding groove, a limiting clamping groove is formed in one end, close to the material mounting hole, of each sliding clamping block, and each limiting clamping groove is matched with the material mounting hole to be provided with the diode body.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention can realize the unified installation of a plurality of diode bodies by arranging the assembly, and realize the rapid taking out and installation of the plurality of diode bodies by installing the placing disc, and can realize the automatic continuous sintering operation between the assembly and the sintering assembly by matching the rotation of the rotating shaft mounting disc, and the assembly can facilitate the taking and feeding operation of personnel under the condition of not influencing the normal processing.
2. Carry out preheating treatment to the diode body at first through the heat lamp when entering, and all carry out transmission fit between the cooperation tooth socket through adjacent driven tooth when rotating the messenger, thereby make the installation place the dish and drive a plurality of diode bodies and carry out the rotation operation and be convenient for carry out diversified heating to its inside, shift to the sintering after that and stop starting the cylinder when groove, install the connecting plate through the cylinder output and utilize the constant head tank to place the subassembly in correspondence and cooperate, make the pole that alternates downstream, carry out location fit with diode body below and cooperation spacing ring afterwards, and carry out the heating sintering processing to it.
3. Can carry out heat treatment respectively to a plurality of diode bodies through the sintering subassembly, wherein can preheat to the entering at first and heat, later cooperate the cylinder to carry out sintering treatment again, carry out the control of rising the temperature of temperature again after accomplishing to it to compare with prior art and solved current sintering equipment and can not carry out automation and carry out temperature control in advance and handle, thereby when leading to the material reprocessing very easily or appear in the cracked problem after the processing, cause the problem of the waste on the material to appear.
4. After the completion of the upward movement of the output end of the cylinder, wherein a rod body positioned between the positioning chuck and the rotating lantern ring is sleeved with a return spring through each insertion rod, the return spring drives the insertion rod to return upwards, then a motor is started to rotate, and the insertion rod is transferred to the other end in the processing shell to be heated subsequently, the next station in the processing flow of the invention is sequentially circulated to the processing operation of the previous station, so that the insertion rod is automatically processed, and the invention can ensure that the diode cannot be broken due to high temperature during sintering under the environment of continuous action, and can facilitate personnel to carry out material taking and loading operations under the condition of not influencing normal processing through the invention, wherein the invention can insert the upper end of the diode body into the material mounting holes and is positioned between the limiting clamping grooves which are matched with the material mounting holes during material loading, and carry on spacingly through spacing spring to the slip fixture block, make it can fix the material to plug between very simply can change the operation during the operation.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an automated sintering apparatus for diode components according to the present invention;
FIG. 2 is a schematic diagram of a rear view of an automatic sintering apparatus for diode components according to the present invention;
FIG. 3 is a schematic diagram of a part of the structure of an automatic sintering apparatus for diode components according to the present invention;
FIG. 4 is a schematic structural diagram of a front view of an automatic sintering device for diode components according to the present invention;
FIG. 5 is a schematic cross-sectional view taken along line A-A in FIG. 4 of an automated sintering apparatus for diode devices according to the present invention;
FIG. 6 is another schematic structural diagram of a portion of an automated sintering apparatus for diode components according to the present invention;
FIG. 7 is another schematic structural diagram of the automated sintering equipment for diode components in a top view according to the present invention;
FIG. 8 is a schematic cross-sectional view taken along line B-B in FIG. 7 of an automated sintering apparatus for diode devices according to the present invention;
FIG. 9 is an enlarged schematic view of the apparatus for automatically sintering a diode according to the present invention at A in FIG. 8;
FIG. 10 is a schematic view of a holder structure of an automated sintering apparatus for diode components according to the present invention;
FIG. 11 is a schematic view of a bottom-view fixing frame of an automated sintering apparatus for diode components according to the present invention;
FIG. 12 is a schematic cross-sectional view taken at C-C of FIG. 11 of an automated sintering apparatus for diode devices according to the present invention.
In the figure: 1. an equipment base; 2. supporting the rotating rod; 3. sintering the assembly; 301. a material inlet and outlet; 302. a sintering staying tank; 303. matching with the tooth socket; 304. a heating lamp; 305. a power supply mounting base; 306. processing a closed pipe; 307. a heating rod; 308. matching with a limiting ring; 309. a transmission limiting groove; 4. placing the component; 401. extending the support rod; 402. installing a placing disc; 4021. connecting the round rod; 4022. positioning the butting sleeve; 4023. a driven tooth; 4024. a material mounting hole; 4025. sliding the clamping block; 4026. a limiting clamping groove; 4027. a sliding groove; 4028. a limiting spring; 403. a return spring; 404. positioning the chuck; 405. fixing the bolt; 406. supporting the mounting plate; 407. inserting the rod; 408. fixing the fixture block; 409. side positioning columns; 410. rotating the lantern ring; 5. processing the shell; 6. a cylinder; 7. a connecting plate; 8. pre-storing a groove; 9. a bearing seat; 10. a rotating shaft mounting plate; 11. a motor; 12. a transmission gear; 13. an assembly mounting groove; 14. a driven gear; 15. positioning a groove; 16. a threaded fixing hole; 17. a diode body; 18. side position locating hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1-12, an automatic sintering device for diode elements comprises a device base 1 and a processing shell 5, wherein a plurality of pre-storage grooves 8 are respectively arranged on two sides of the device base 1, the processing shell 5 is fixedly arranged on one side of the upper surface of the device base 1, a bearing seat 9 is fixedly arranged on one side of the upper surface of the device base 1 away from the processing shell 5, a supporting rotating rod 2 is rotatably arranged at the upper end of the bearing seat 9, a rotating shaft mounting plate 10 is fixedly arranged at the top end of a rod body of the supporting rotating rod 2, a plurality of placing components 4 are arranged on the rotating shaft mounting plate 10 through component mounting grooves 13, a sintering component 3 is arranged in the processing shell 5, the placing components 4 pass through the sintering component 3, a motor 11 is fixedly arranged on one side of the upper surface of the device base 1 close to the bearing seat 9, a cylinder 6 is fixedly arranged on one side of the upper surface of the device base 1 close to the processing shell 5, and a connecting plate 7 is fixedly arranged at the output end of the cylinder 6, the top fixed mounting that connecting plate 7 lower surface just is located processing shell 5 has constant head tank 15, and connecting plate 7 cooperates with corresponding placing assembly 4 through constant head tank 15, and every placing assembly 4 all installs a plurality of diode bodies 17.
Through the technical scheme, the fixing bolt 405 is used and installed in the corresponding fixing clamping block 408, the fixing bolt 405 and the thread fixing hole 16 are in thread fixing to be matched, each side position positioning column 409 is inserted into the corresponding side position positioning hole 18, and the single placing component 4 is installed;
the invention can realize the unified installation of a plurality of diode bodies 17 by the placement component 4, and realize the rapid taking out and installation of a plurality of diode bodies 17 by the installation of the placement disk 402, and can realize the automatic continuous sintering operation between the sintering component 3 by the rotation of the rotating shaft installation disk 10 matched with the component, and the component can facilitate the taking and feeding operation of personnel under the condition of not influencing the normal processing, compared with the prior art, the invention solves the problems that the flow is more complicated in the existing sintering process, and the replacement operation of the internal diode is needed before and after sintering, the replacement is generally carried out by manpower in the prior art, thereby the problem that the processing time of equipment is occupied during the replacement is caused, and the sintering processing efficiency is improved;
can carry out heat treatment respectively to a plurality of diode bodies 17 through sintering subassembly 3, wherein can preheat the heating of beginning entering, later cooperate cylinder 6 to carry out sintering treatment again, carry out the control of rising the temperature to it again after the completion to compare with prior art and solved current sintering equipment and can not carry out automation and carry out the preliminary temperature control and handle, thereby when leading to the material to reprocess very easily or the cracked problem appears after the processing, cause the problem of the waste on the material to appear.
In this embodiment, motor 11 output end fixed mounting has drive gear 12, it is provided with driven gear 14 to support the integration of 2 poles of bull stick, mesh the transmission between driven gear 14 and the drive gear 12, a plurality of subassembly mounting grooves 13 have been seted up respectively to pivot mounting disc 10 surface a week, every subassembly mounting groove 13 is inside all to alternate to install and place subassembly 4, pivot mounting disc 10 upper surface just is located and corresponds subassembly mounting groove 13 position and all runs through and set up threaded fixing hole 16, side position locating hole 18 has all been seted up to every threaded fixing hole 16 both sides. Utilize drive gear 12 to drive driven gear 14 through 11 outputs of motor to rotate, realize supporting the rotation of bull stick 2 and drive pivot mounting disc 10 and rotate, and then drive a plurality of subassemblies 4 of placing and rotate, wherein each subassembly 4 of placing all rotates through processing shell 5 inside.
It should be noted that the sintering assembly 3 includes a processing closed tube 306 and a sintering stay groove 302, the sintering stay groove 302 is provided inside the processing housing 5, the processing closed tube 306 is fixedly installed at the bottom end inside the sintering stay groove 302, a heating rod 307 is electrically installed inside the processing closed tube 306, and a matching limit ring 308 for limiting the position of the diode body 17 at the position is provided on the periphery of the heating rod 307 on the inner wall of the processing closed tube 306. Diode body 17 is preheated by heating lamp 304, and is in transmission fit with matching tooth socket 303 through adjacent driven tooth 4023 when the rotation makes, so that installation placing disc 402 drives a plurality of diode bodies 17 to rotate for convenient multi-azimuth heating of the inside thereof.
When specifically setting up, heating rod 307 top carries out the chucking cooperation with location butt joint cover 4022, the dish 402 is placed with the installation to the processing is enclosed 306 upside inner wall and is carried out the chucking cooperation, transmission spacing groove 309 has been seted up at 5 middle parts of processing shell, cooperation tooth's socket 303 has all been seted up to transmission spacing groove 309 both sides inner wall, material import and export 301 has all been seted up on 5 end surfaces of processing shell, the inside activity of material import and export 301 alternates there is the installation to place dish 402, the inside both sides of processing shell 5 are provided with power mount 305 respectively, the equal electrical installation of every power mount 305 upper surface has heating lamp 304. Starting the cylinder 6 when shifting to sintering staying groove 302, installing connecting plate 7 through the cylinder 6 output and utilizing constant head tank 15 to place subassembly 4 in correspondence and cooperate for the pole 407 that pierces through moves down, carries out location fit with cooperation spacing ring 308 below diode body 17 afterwards, and carries out the heating sintering to it and process.
It can be understood that, in the present application, each placement component 4 includes a fixed fixture block 408, each fixed fixture block 408 is respectively inserted into the corresponding component mounting groove 13, a threaded fixing hole 16 is formed in the center of each fixed fixture block 408, a fixing bolt 405 is threaded into each threaded fixing hole 16, the fixing bolt 405 is rotatably mounted at the center of the plate body of the support mounting plate 406, side position positioning posts 409 are integrally disposed on the lower surfaces of both sides of the support mounting plate 406, each side position positioning post 409 is inserted into the corresponding side position positioning hole 18, an extension support rod 401 is integrally disposed at the outer end of each fixed fixture block 408, a rotation collar 410 is fixedly mounted at one end of each extension support rod 401 away from the fixed fixture block 408, an insertion rod 407 is inserted into each rotation collar 410, and a positioning chuck 404 is fixedly mounted at the top end of each insertion rod 407, the shaft body of each inserting rod 407 between the positioning chuck 404 and the rotating lantern ring 410 is sleeved with a return spring 403, and a mounting placing disc 402 is arranged below the inserting rod 407. The rod body of each inserting rod 407 between the positioning chuck 404 and the rotating sleeve ring 410 is sleeved with a return spring 403, so that the return spring 403 drives the inserting rod 407 to return upwards, the motor 11 is started to rotate, and the inserting rod is transferred to the other end inside the processing shell 5 to be heated subsequently, the next station in the processing flow of the invention is circulated to the processing operation of the previous station in sequence, and thus the inserting rod is subjected to automatic processing.
The upper surface of each installing and placing plate 402 is integrally provided with a connecting round rod 4021, the upper surface of each connecting round rod 4021 is fixedly installed on the lower surface of the corresponding inserting rod 407, a plurality of driven teeth 4023 are integrally arranged on the rod body of each connecting round rod 4021, adjacent driven teeth 4023 are in transmission fit with the matching tooth socket 303, the lower surface of the plate body of each installing and placing plate 402 is integrally provided with a positioning butt joint sleeve 4022, a material installing hole 4024 is respectively formed in a circle of the plate body of each installing and placing plate 402 in a penetrating mode, a sliding groove 4027 is formed in one side of the inner wall of each material installing hole 4024, the inner wall of each sliding groove 4027 is provided with a sliding fixture block 4025 in a limiting mode through a limiting spring 4028, each sliding fixture block 4025 is movably arranged in the corresponding sliding groove 4027, one end, close to the material installing hole 4024, of each sliding fixture block 4025 is provided with a limiting fixture 4026, and each limiting fixture 4026 is matched with the material installing hole 4024 to install a diode body 17. When the diode is loaded, the upper end of the diode body 17 is inserted into the material mounting hole 4024, the limiting clamping groove 4026 is located between the material mounting holes 4024, the sliding clamping block 4025 is limited by the limiting spring 4028, the material can be fixed, and the replacement operation can be performed by simple insertion and extraction.
The working principle of the automatic sintering equipment for the diode element is as follows:
when in use, the corresponding placing component 4 is firstly installed in advance according to the processing amount, wherein in order to ensure that the use is more stable, by using the fixing bolt 405 and installing the fixing bolt inside the corresponding fixing fixture block 408, and by screwing the fixing bolt 405 and the threaded fixing hole 16, so as to be matched, each side positioning column 409 is inserted and arranged inside the corresponding side positioning hole 18, so that the installation of a single placing component 4 is realized, and the diode body 17 to be processed is mounted into the mounting placing tray 402, and then the motor 11, the heating rod 307 and the heating lamp 304 are respectively started, wherein, the output end of the motor 11 utilizes the transmission gear 12 to drive the driven gear 14 to rotate, so as to realize the rotation of the supporting rotating rod 2 and drive the rotating shaft mounting disc 10 to rotate, thereby driving a plurality of placing components 4 to rotate, wherein each placing component 4 passes through the interior of the processing shell 5;
when the diode body 17 enters, the diode body 17 is preheated by the heating lamp 304, and when the diode body is rotated, the adjacent driven teeth 4023 are in transmission fit with the matching tooth grooves 303, so that the mounting and placing disc 402 drives the diode bodies 17 to rotate so as to heat the interior of the diode bodies in multiple directions, then the diode bodies are transferred to the sintering and stopping groove 302, the air cylinder 6 is started, the connecting plate 7 is mounted at the output end of the air cylinder 6 and is matched with the corresponding placing component 4 by the positioning groove 15, the inserting rod 407 moves downwards, then the lower part of the diode body 17 is in positioning fit with the matching limiting ring 308, and heating and sintering processing is performed on the diode bodies;
after the completion of the upward movement of the output end of the rear cylinder 6, wherein the rod body of each inserting rod 407 positioned between the positioning chuck 404 and the rotating sleeve ring 410 is sleeved with a return spring 403, the return spring 403 drives the inserting rod 407 to return upwards, the motor 11 is started again to rotate, and the inserting rod is transferred to the other end inside the processing shell 5 for subsequent heating, the next station in the processing flow of the invention is sequentially circulated to the processing operation of the previous station, so that the automatic processing is carried out, and in the environment of continuous action, the invention can ensure that the diode cannot be broken due to large temperature difference during sintering, and can facilitate the taking and loading operation of personnel without influencing normal processing;
when the diode is loaded, the upper end of the diode body 17 is inserted into the material mounting hole 4024, the limiting clamping groove 4026 is located between the material mounting holes 4024, the sliding clamping block 4025 is limited by the limiting spring 4028, the material can be fixed, and the replacement operation can be performed by simple insertion and extraction.
The specific model specification of the motor 11 is Y112M-44 KWB 3;
the specific model specification of the cylinder 6 is MAL40x 500.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides an automatic sintering equipment of diode component, includes equipment base (1) and processing shell (5), a plurality of grooves (8) of prestoring have been seted up respectively to equipment base (1) both sides, equipment base (1) upper surface one side fixed mounting has processing shell (5), one side fixed mounting that processing shell (5) were kept away from to equipment base (1) upper surface has bearing frame (9), its characterized in that: the device is characterized in that a supporting rotating rod (2) is rotatably installed at the upper end of a bearing seat (9), a rotating shaft mounting disc (10) is fixedly installed at the top end of a rod body of the supporting rotating rod (2), a plurality of placing components (4) are installed on the rotating shaft mounting disc (10) through component mounting grooves (13), sintering components (3) are installed inside a processing shell (5), the placing components (4) pass through the sintering components (3), a motor (11) is fixedly installed on one side, close to the bearing seat (9), of the upper surface of an equipment base (1), a cylinder (6) is fixedly installed on one side, close to the processing shell (5), of the upper surface of the equipment base (1), a connecting plate (7) is fixedly installed at the output end of the cylinder (6), a positioning groove (15) is fixedly installed on the lower surface of the connecting plate (7) and located above the processing shell (5), and the connecting plate (7) is matched with the corresponding placing components (4) through the positioning groove (15), each placing component (4) is provided with a plurality of diode bodies (17);
the sintering assembly (3) comprises a processing closed tube (306) and a sintering stay groove (302), the sintering stay groove (302) is formed in a processing shell (5), the processing closed tube (306) is fixedly installed at the bottom end of the interior of the sintering stay groove (302), a transmission limiting groove (309) is formed in the middle of the processing shell (5), matching tooth grooves (303) are formed in the inner walls of two sides of the transmission limiting groove (309), material inlet and outlet openings (301) are formed in the surfaces of two ends of the processing shell (5), and mounting and placing discs (402) are movably inserted into the material inlet and outlet openings (301);
every place subassembly (4) including fixed fixture block (408), every fixed fixture block (408) are equallyd divide and are do not alternate and set up inside corresponding subassembly mounting groove (13), every fixed fixture block (408) outer end homogeneous is provided with extension bracing piece (401), every extend the equal fixed mounting in one end that fixed fixture block (408) were kept away from in bracing piece (401) and have a rotation lantern ring (410), every it is provided with interlude pole (407) all to alternate in lantern ring (410) inside, every the equal fixed mounting in interlude pole (407) pole body top has location chuck (404).
2. The automated diode element sintering apparatus of claim 1, wherein: the output end of the motor (11) is fixedly provided with a transmission gear (12), the support rotating rod (2) is integrally provided with a driven gear (14), the driven gear (14) is in meshing transmission with the transmission gear (12), and a plurality of component mounting grooves (13) are formed in one circle of the outer surface of the rotating shaft mounting disc (10) respectively.
3. The automated diode element sintering apparatus of claim 2, wherein: every subassembly mounting groove (13) is inside all to alternate to install and to place subassembly (4), pivot mounting disc (10) upper surface just is located corresponding subassembly mounting groove (13) position and all runs through and sets up threaded fixing hole (16), every side position locating hole (18) have all been seted up to threaded fixing hole (16) both sides.
4. The automated diode element sintering apparatus of claim 1, wherein: and a heating rod (307) is electrically arranged in the processing closed pipe (306).
5. The automated diode element sintering apparatus of claim 4, wherein: be located processing closed tube (306) inner wall heating rod (307) periphery is provided with the cooperation spacing ring (308) that are used for limiting diode body (17) position of position, heating rod (307) top and location butt joint cover (4022) carry out the chucking cooperation, processing closed tube (306) upside inner wall and installation are placed dish (402) and are carried out the chucking cooperation.
6. The automated diode element sintering apparatus of claim 4, wherein: the processing shell (5) is internally provided with power supply installation seats (305) on two sides respectively, and each heating lamp (304) is electrically installed on the upper surface of each power supply installation seat (305).
7. The automated diode element sintering apparatus of claim 3, wherein: every fixed fixture block (408) center has all seted up screw thread fixed orifices (16), every fixing bolt (405) are installed to the inside equal screw thread in screw thread fixed orifices (16), fixing bolt (405) rotate to be installed at support mounting panel (406) board body center, support mounting panel (406) both sides lower surface integration and be provided with side position reference column (409), every side position reference column (409) all alternate the setting inside corresponding side position locating hole (18).
8. The automated diode element sintering apparatus of claim 7, wherein: each rod body of the inserting rod (407) located between the positioning chuck (404) and the rotating lantern ring (410) is sleeved with a return spring (403), and an installation placing disc (402) is arranged below the inserting rod (407).
9. The automated diode element sintering apparatus of claim 8, wherein: every the equal integration of dish (402) upper surface is placed in the installation is provided with connects round bar (4021), connect round bar (4021) upper surface fixed mounting in corresponding pole (407) lower surface of inserting, it is provided with a plurality of driven tooth (4023) to connect round bar (4021) pole body integration, and is adjacent driven tooth (4023) all with cooperate carry out the transmission cooperation between tooth socket (303), every dish (402) dish body lower surface is placed in the installation and is carried out the integration and be provided with the location and to connect cover (4022).
10. The automated diode element sintering apparatus of claim 9, wherein: each installing and placing disc (402) is provided with a material installing hole (4024) in a penetrating mode in a circle, one side of the inner wall of each material installing hole (4024) is provided with a sliding groove (4027), the inner wall of each sliding groove (4027) is provided with a sliding fixture block (4025) in a limiting mode through a limiting spring (4028), each sliding fixture block (4025) is movably arranged in the corresponding sliding groove (4027), one end, close to the material installing hole (4024), of each sliding fixture block (4025) is provided with a limiting clamping groove (4026), and each limiting clamping groove (4026) is matched with the material installing hole (4024) to install a diode body (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210119669.7A CN114156215B (en) | 2022-02-09 | 2022-02-09 | Automatic sintering equipment for diode element |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210119669.7A CN114156215B (en) | 2022-02-09 | 2022-02-09 | Automatic sintering equipment for diode element |
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| CN114156215B CN114156215B (en) | 2022-04-22 |
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| CN202210119669.7A Active CN114156215B (en) | 2022-02-09 | 2022-02-09 | Automatic sintering equipment for diode element |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1779928A (en) * | 2004-11-23 | 2006-05-31 | 敦南科技股份有限公司 | Semiconductor vacuum metal sintering device and manufacture flow |
| CN103236408A (en) * | 2013-05-23 | 2013-08-07 | 济南晶恒电子有限责任公司 | Sintering mold and sintering method of diode with square lead |
| CN103868350A (en) * | 2014-03-25 | 2014-06-18 | 宁夏日晶新能源装备股份有限公司 | Semiconductor target sintering device and method |
| CN205542906U (en) * | 2016-04-19 | 2016-08-31 | 鄂尔多斯市源盛光电有限责任公司 | Sintering equipment , organic light -emitting diode be encapsulation system for device |
| CN208012354U (en) * | 2017-12-29 | 2018-10-26 | 四川康明光电科技有限公司 | A kind of sintering equipment for laser diode |
| CN208223152U (en) * | 2018-04-28 | 2018-12-11 | 东莞市通科电子有限公司 | A kind of chain-conveyer furnace for glass sealed diode sintering |
| CN111081566A (en) * | 2018-10-18 | 2020-04-28 | 株洲中车时代电气股份有限公司 | Pressure-assisted silver sintering device for power semiconductor chip |
| CN111649590A (en) * | 2020-07-06 | 2020-09-11 | 中国振华集团永光电子有限公司（国营第八七三厂） | Sintering device of silicon Schottky diode and using method thereof |
| CN211575880U (en) * | 2019-12-18 | 2020-09-25 | 四川蜀伦欣电子有限公司 | Chain furnace for sintering glass-sealed diode |
-
2022
- 2022-02-09 CN CN202210119669.7A patent/CN114156215B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1779928A (en) * | 2004-11-23 | 2006-05-31 | 敦南科技股份有限公司 | Semiconductor vacuum metal sintering device and manufacture flow |
| CN103236408A (en) * | 2013-05-23 | 2013-08-07 | 济南晶恒电子有限责任公司 | Sintering mold and sintering method of diode with square lead |
| CN103868350A (en) * | 2014-03-25 | 2014-06-18 | 宁夏日晶新能源装备股份有限公司 | Semiconductor target sintering device and method |
| CN205542906U (en) * | 2016-04-19 | 2016-08-31 | 鄂尔多斯市源盛光电有限责任公司 | Sintering equipment , organic light -emitting diode be encapsulation system for device |
| CN208012354U (en) * | 2017-12-29 | 2018-10-26 | 四川康明光电科技有限公司 | A kind of sintering equipment for laser diode |
| CN208223152U (en) * | 2018-04-28 | 2018-12-11 | 东莞市通科电子有限公司 | A kind of chain-conveyer furnace for glass sealed diode sintering |
| CN111081566A (en) * | 2018-10-18 | 2020-04-28 | 株洲中车时代电气股份有限公司 | Pressure-assisted silver sintering device for power semiconductor chip |
| CN211575880U (en) * | 2019-12-18 | 2020-09-25 | 四川蜀伦欣电子有限公司 | Chain furnace for sintering glass-sealed diode |
| CN111649590A (en) * | 2020-07-06 | 2020-09-11 | 中国振华集团永光电子有限公司（国营第八七三厂） | Sintering device of silicon Schottky diode and using method thereof |
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| CN114156215B (en) | 2022-04-22 |
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Denomination of invention: An automatic sintering equipment for diode components Effective date of registration: 20220705 Granted publication date: 20220422 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Electronic Technology Co.,Ltd. Registration number: Y2022980009843 |
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Address after: 226400 group 4, Jincheng village, Hekou Town, Rudong County, Nantong City, Jiangsu Province Patentee after: Nantong Hongjinbei Textile Technology Co.,Ltd. Address before: 226400 group 4, Jincheng village, Hekou Town, Rudong County, Nantong City, Jiangsu Province Patentee before: Nantong Hongjinbei Electronic Technology Co.,Ltd. |
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Denomination of invention: An automated sintering equipment for diode components Effective date of registration: 20230704 Granted publication date: 20220422 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Textile Technology Co.,Ltd. Registration number: Y2023980047366 |
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