CN114156088A - Heat dissipation type antidetonation aluminum electrolytic capacitor - Google Patents
Heat dissipation type antidetonation aluminum electrolytic capacitor Download PDFInfo
- Publication number
- CN114156088A CN114156088A CN202111621277.2A CN202111621277A CN114156088A CN 114156088 A CN114156088 A CN 114156088A CN 202111621277 A CN202111621277 A CN 202111621277A CN 114156088 A CN114156088 A CN 114156088A
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- Prior art keywords
- cover plate
- wall part
- electrolytic capacitor
- aluminum electrolytic
- heat dissipation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 18
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 230000035939 shock Effects 0.000 claims abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 7
- 239000011435 rock Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 210000003484 anatomy Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0003—Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
The invention relates to a heat dissipation type anti-seismic aluminum electrolytic capacitor, which comprises: the device comprises a cover plate, a shell, a lead and a lead; the structure is characterized in that the upper end surface of the cover plate is symmetrically provided with bulges by the center of the cover plate, and the circumferential direction of the lower end surface of the cover plate is provided with a wall part; the diameter of the inner periphery of the wall part is matched with the diameter of the outer periphery of the element; the outer peripheral surface of the wall part is contacted with the inner peripheral surface of the shell; the joint of the wall part and the cover plate is positioned below the corset groove; one end of the element, which is connected with the lead, is sleeved and fixed on the wall part to form a whole; one end of the element, which is far away from the cover plate, is sleeved with a ring-shaped part; the height of the bulge is larger than that of the waist part, and when the circuit board is installed on the circuit board, a gap is formed between the waist part and the circuit board. The cover plate structure is arranged, so that the capacitor is firmly installed and quickly cooled, the heat radiation performance and the shock resistance of the aluminum electrolytic capacitor are improved, and the purposes of high temperature resistance and stability are achieved.
Description
Technical Field
The invention belongs to the field of capacitors, and particularly relates to a heat dissipation type anti-seismic aluminum electrolytic capacitor.
Background
A capacitor is one of electronic components used in large numbers in electronic devices, and is an indispensable constituent in a circuit. Due to the development of electronic science and technology, electronic products are developed in the directions of high frequency, miniaturization and high reliability, and the requirements on the shock resistance of the capacitor, particularly the heat dissipation performance, are improved. The capacitor common to the market at present is especially applied to new energy automobile, and lacks antidetonation and heat radiation structure for the car is in the in-process condenser that removes the problem that rocks easily or the broken needle appears and the heat that the condenser during operation produced can't in time dispel the heat, thereby causes the damage of the inside component of condenser and causes the damage to the outside of condenser easily, thereby influences its whole life.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a heat dissipation type anti-seismic aluminum electrolytic capacitor, which is firm in installation and rapid in heat dissipation through the arrangement of a cover plate structure, improves the heat dissipation performance and the anti-seismic capacity of the aluminum electrolytic capacitor and achieves the purposes of high temperature resistance and stability.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
a heat-dissipating, shock-resistant aluminum electrolytic capacitor comprising: the device comprises a cover plate, a shell, a lead and a lead; the structure is characterized in that the upper end surface of the cover plate is symmetrically provided with bulges by the center of the cover plate, and the circumferential direction of the lower end surface of the cover plate is provided with a wall part; the diameter of the inner periphery of the wall part is matched with the diameter of the outer periphery of the element; the outer peripheral surface of the wall part is contacted with the inner peripheral surface of the shell; the joint of the wall part and the cover plate is positioned below the corset groove;
one end of the element, which is connected with the lead, is sleeved and fixed on the wall part to form a whole;
one end of the element, which is far away from the cover plate, is sleeved with a ring-shaped part;
the height of the bulge is larger than that of the waist part, and when the circuit board is installed on the circuit board, a gap is formed between the waist part and the circuit board.
Further, the element is arranged inside the shell; the cover plate is fixed at the opening of the shell, one end of the lead is connected with the element, and the other end of the lead penetrates through the cover plate to be exposed.
Furthermore, the bulges are uniformly distributed along the circumferential direction of the upper end surface of the cover plate, and the number of the bulges is at least more than two.
Furthermore, the cross section of the bulge is circular or polygonal.
Furthermore, two lead holes are symmetrically arranged in the cover plate; the lead holes are respectively penetrated with leads.
Further, the height of the wall part is larger than the thickness of the cover plate.
Further, the height of the protrusions is 1nm-4 nm.
The invention has the advantages and positive effects that:
the invention relates to a heat dissipation type anti-seismic aluminum electrolytic capacitor, which solves the technical problems of improving the heat dissipation performance and the anti-seismic capability of the aluminum electrolytic capacitor and achieving the purposes of high temperature resistance and stability, and compared with the prior art, the invention has the following advantages:
1. according to the invention, the protrusions, the wall parts and the ring-shaped parts are arranged in the cover plate and combined with each other, and the wall parts and the ring-shaped parts effectively fix the element and avoid shaking, so that a certain anti-seismic effect can be achieved, and therefore, protection measures can be taken on related elements in the capacitor, so that the vibration problem can be effectively avoided in the use process, the integral use and operation of the capacitor are safer, and the service life of the integral capacitor is prolonged.
2. The capacitor is supported and fixed in the circuit board through the bulges, so that the capacitor cover plate and the circuit board form a gap, part of heat of the capacitor can be dissipated through the gap between the cover plate and the circuit board, the heat dissipation performance of the capacitor is improved, and the stability is higher.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic representation of the volumetric anatomy of the present invention.
Fig. 3 is a schematic cross-sectional view of the present invention.
Fig. 4 is a schematic top perspective view of a cover plate according to a first embodiment of the invention.
Fig. 5 is a schematic top perspective view of a cover plate according to a second embodiment of the invention.
Fig. 6 is a schematic perspective view of the bottom end of the cover plate of the present invention.
Fig. 7 is a schematic cross-sectional view of the cover plate of the present invention.
Fig. 8 is an enlarged view of a portion a of fig. 3 according to the present invention.
The reference numbers illustrate: 1. a cover plate; 2. a housing; 3. a prime; 4. a lead wire; 5. an annular member; 101. a protrusion; 102. a wire hole; 103. a wall portion; 104. a vegetarian waist part; 105. 106, a circuit board; a waist binding groove; h1, bump height; h2, height of vegetarian waist.
Detailed Description
The embodiments of the invention will be described in further detail with reference to the accompanying drawings: the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, are only used for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or component being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, the term "comprises" and any variations thereof mean "including at least".
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integrally formed connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
As shown in fig. 1 to 8, the heat dissipation type anti-seismic aluminum electrolytic capacitor of the present invention comprises: the device comprises a cover plate 1, a shell 2, a prime mover 3 and a lead 4; the structure is characterized in that the upper end surface of the cover plate 1 is symmetrically provided with bulges 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with a wall part 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is in contact with the inner peripheral surface of the housing 2; the joint of the wall part 103 and the cover plate 1 is positioned below the corset groove;
one end of the element 3 connected with the lead 4 is sleeved and fixed on the wall part 103 to form a whole;
one end of the element 3, which is far away from the cover plate 1, is sleeved with a ring-shaped part 5;
the height of the protrusion 101 is greater than that of the primary waist portion 104, and when the circuit board 106 is mounted on the primary waist portion 104, a gap is formed between the primary waist portion 104 and the circuit board 106.
The bulges 101 are uniformly distributed along the circumferential direction of the upper end surface of the cover plate 1, and the number of the bulges 101 is at least more than two. Preferably two, are arranged with the center of the cover plate 1 being symmetrical. The height of the protrusion 101 is H1, the height of the primary waist part 104 is H2, the height of the protrusion 101 is larger than the height of the primary waist part 104, and when the circuit board 106 is mounted on, a gap is formed between the primary waist part 104 and the circuit board 106.
Two lead holes 102 are symmetrically arranged in the cover plate 1; the lead holes 102 are respectively penetrated with leads 4.
The cross section of the bulge 101 is circular or polygonal. When the capacitor is mounted on the circuit board 106 through the lead 4, the end of the bump 101 will contact with the circuit board 106, and the bump 101 will support and fix the capacitor in the circuit board 106, thus playing the role of fixing the capacitor, effectively protecting the lead 4 and being broken off in the vibration. The anti-seismic effect is achieved. Due to the height of the bumps 101, a gap is formed between the capacitor cover plate 1 and the circuit board 106. Part of heat of the capacitor is transferred outwards through the cover plate 1, and due to the fact that a gap is formed between the cover plate 1 and the circuit board 106, air convection is formed to facilitate heat transfer, and the effect of rapid heat dissipation is achieved.
The height of the wall part 103 is larger than the thickness of the cover plate 1. One end of the element 3 connected with the lead wire 4 is sleeved and fixed in the wall part 103 to form a whole. The upper end surface of the cover plate 1 is symmetrically provided with bulges 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with a wall part 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is in contact with the inner peripheral surface of the housing 2; the joint of the wall part 103 and the cover plate 1 is positioned below the corset groove. And one end of the element 3, which is far away from the cover plate 1, is sleeved with a ring-shaped part 5. Element 3 even has the one end of lead wire 4 promptly and is wrapped up inside shell 2 by wall portion 103, and element 3 keeps away from apron 1 one end and cup joints annular member 5 and fixes element 3 inside shell 2 by annular member 5, and the both ends of element 3 are all fixed inside shell 2 like this for when circuit board 106 vibrations, element 3 can not rock, has reached antidetonation effect.
Example one
In this embodiment, the protrusions 101 are uniformly distributed along the circumferential direction of the upper end surface of the cover plate 1, and the number of the protrusions 101 is two. The height of the protrusion 101 is 3 nm. The cross section of the bulge 101 is circular. The upper end surface of the cover plate 1 is symmetrically provided with bulges 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with a wall part 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is in contact with the inner peripheral surface of the housing 2; the joint of the wall part 103 and the cover plate 1 is positioned below the corset groove. One end of the element 3 connected with the lead wire 4 is sleeved and fixed in the wall part 103 to form a whole. And one end of the element 3, which is far away from the cover plate 1, is sleeved with a ring-shaped part 5. The height of the protrusion 101 is greater than that of the primary waist portion 104, and when the circuit board 106 is mounted on the primary waist portion 104, a gap is formed between the primary waist portion 104 and the circuit board 106.
When the capacitor is mounted on the circuit board 106 through the lead 4, the end of the bump 101 will contact with the circuit board 106, and the bump 101 will support and fix the capacitor in the circuit board 106, thus playing the role of fixing the capacitor, effectively protecting the lead 4 and being broken off in the vibration. The anti-seismic effect is achieved. Since the protrusion 101 has a certain height, the height of the protrusion 101 in this embodiment is 3nm, so that a 3nm gap is formed between the capacitor cover plate 1 and the circuit board 106. The whole gap of 3nm is beneficial to air circulation between the cover plate 1 and the circuit board 106, heat dissipation is accelerated, a part of heat of the capacitor is transferred outwards through the cover plate 1, and due to the fact that the gap is formed between the cover plate 1 and the circuit board 106, air convection is formed, heat transfer is facilitated, and the heat dissipation effect is improved.
The upper end surface of the cover plate 1 is symmetrically provided with bulges 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with a wall part 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is in contact with the inner peripheral surface of the housing 2; the joint of the wall part 103 and the cover plate 1 is positioned below the corset groove. And one end of the element 3, which is far away from the cover plate 1, is sleeved with a ring-shaped part 5. Element 3 even has the one end of lead wire 4 promptly and is wrapped up inside shell 2 by wall portion 103, and element 3 keeps away from apron 1 one end and cup joints annular member 5 and fixes element 3 inside shell 2 by annular member 5, and the both ends of element 3 are all fixed inside shell 2 like this for when circuit board 106 vibrations, element 3 can not rock, has reached antidetonation effect.
Example two
In this embodiment, the protrusions 101 are uniformly distributed along the circumferential direction of the upper end surface of the cover plate 1, and as shown in fig. 5, the number of the protrusions 101 is four. The height of the protrusion 101 is 2 nm. The cross section of the bulge 101 is circular. The upper end surface of the cover plate 1 is symmetrically provided with bulges 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with a wall part 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is in contact with the inner peripheral surface of the housing 2; the joint of the wall part 103 and the cover plate 1 is positioned below the corset groove. One end of the element 3 connected with the lead wire 4 is sleeved and fixed in the wall part 103 to form a whole. And one end of the element 3, which is far away from the cover plate 1, is sleeved with a ring-shaped part 5. The height of the protrusion 101 is greater than that of the primary waist portion 104, and when the circuit board 106 is mounted on the primary waist portion 104, a gap is formed between the primary waist portion 104 and the circuit board 106.
When the capacitor is mounted on the circuit board 106 through the lead 4, the end of the bump 101 will contact with the circuit board 106, and the bump 101 will support and fix the capacitor in the circuit board 106, thus playing the role of fixing the capacitor, effectively protecting the lead 4 and being broken off in the vibration. The anti-seismic effect is achieved. Since the protrusion 101 has a certain height, the height of the protrusion 101 in this embodiment is 3nm, so that a 3nm gap is formed between the capacitor cover plate 1 and the circuit board 106. The whole gap of 3nm is beneficial to air circulation between the cover plate 1 and the circuit board 106, heat dissipation is accelerated, a part of heat of the capacitor is transferred outwards through the cover plate 1, and due to the fact that the gap is formed between the cover plate 1 and the circuit board 106, air convection is formed, heat transfer is facilitated, and the heat dissipation effect is improved.
The upper end surface of the cover plate 1 is symmetrically provided with bulges 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with a wall part 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is in contact with the inner peripheral surface of the housing 2; the joint of the wall part 103 and the cover plate 1 is positioned below the corset groove. And one end of the element 3, which is far away from the cover plate 1, is sleeved with a ring-shaped part 5. Element 3 even has the one end of lead wire 4 promptly and is wrapped up inside shell 2 by wall portion 103, and element 3 keeps away from apron 1 one end and cup joints annular member 5 and fixes element 3 inside shell 2 by annular member 5, and the both ends of element 3 are all fixed inside shell 2 like this for when circuit board 106 vibrations, element 3 can not rock, has reached antidetonation effect.
It should be emphasized that the embodiments described herein are illustrative rather than restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but other embodiments derived from the technical solutions of the present invention by those skilled in the art are also within the scope of the present invention.
Claims (7)
1. A heat-dissipating, shock-resistant aluminum electrolytic capacitor comprising: the device comprises a cover plate (1), a shell (2), a prime mover (3) and a lead (4); the novel anti-theft cover plate is characterized in that protrusions (101) are symmetrically arranged on the upper end face of the cover plate (1) in the center of the cover plate (1), and a wall part (103) is arranged in the circumferential direction of the lower end face of the cover plate (1); the diameter of the inner periphery of the wall part (103) is matched with the diameter of the outer periphery of the element (3); the outer peripheral surface of the wall part (103) is contacted with the inner peripheral surface of the shell (2); the joint of the wall part (103) and the cover plate (1) is positioned below the corset groove;
one end of the element (3) connected with the lead (4) is sleeved and fixed on the wall part (103) to form a whole;
one end of the element (3) far away from the cover plate (1) is sleeved with a ring-shaped piece (5);
the height of the bulge (101) is larger than that of the plain waist part (104), and when the circuit board (106) is installed, a gap is formed between the plain waist part (104) and the circuit board (106).
2. The heat dissipation type anti-seismic aluminum electrolytic capacitor according to claim 1, characterized in that: the element (3) is arranged inside the shell (2); the cover plate (1) is fixed at the opening of the shell (2), one end of the lead (4) is connected with the element (3), and the other end of the lead passes through the cover plate (1) to be exposed.
3. The heat dissipation type anti-seismic aluminum electrolytic capacitor according to claim 1, characterized in that: the bulges (101) are uniformly distributed along the circumferential direction of the upper end surface of the cover plate (1), and the number of the bulges (101) is at least more than two.
4. The heat dissipation type anti-seismic aluminum electrolytic capacitor according to claim 1, characterized in that: the cross section of the bulge (101) is circular or polygonal.
5. The heat dissipation type anti-seismic aluminum electrolytic capacitor according to claim 1, characterized in that: two lead holes (102) are symmetrically arranged in the cover plate (1); the lead holes (102) are respectively penetrated with leads (4).
6. The heat dissipation type anti-seismic aluminum electrolytic capacitor according to claim 1, characterized in that: the height of the wall part (103) is larger than the thickness of the cover plate (1).
7. The heat dissipation type anti-seismic aluminum electrolytic capacitor according to claim 1, characterized in that: the height of the protrusion (101) is 1nm-4 nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111621277.2A CN114156088B (en) | 2021-12-28 | 2021-12-28 | Heat dissipation type anti-seismic aluminum electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111621277.2A CN114156088B (en) | 2021-12-28 | 2021-12-28 | Heat dissipation type anti-seismic aluminum electrolytic capacitor |
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| CN114156088A true CN114156088A (en) | 2022-03-08 |
| CN114156088B CN114156088B (en) | 2024-09-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003173942A (en) * | 2001-12-06 | 2003-06-20 | Matsushita Electric Ind Co Ltd | Aluminum electrolytic capacitor and its manufacturing method |
| US20030117764A1 (en) * | 2001-12-21 | 2003-06-26 | Sagal E. Mikhail | Capacitor post with improved thermal conductivity |
| JP2013058649A (en) * | 2011-09-09 | 2013-03-28 | Hitachi Aic Inc | Aluminum electrolytic capacitor |
| CN103199204A (en) * | 2013-03-28 | 2013-07-10 | 凯迈嘉华（洛阳）新能源有限公司 | Assembling process of electrode insulating sealing structure |
| CN207474283U (en) * | 2017-11-09 | 2018-06-08 | 玉环县鑫庄电子有限公司 | A kind of rubber pad for capacitor |
| CN208922917U (en) * | 2018-10-30 | 2019-05-31 | 丰宾电子（深圳）有限公司 | A kind of aluminium electrolutic capacitor structure |
| CN216818106U (en) * | 2021-12-28 | 2022-06-24 | 丰宾电子（深圳）有限公司 | Heat dissipation type antidetonation aluminum electrolytic capacitor |
-
2021
- 2021-12-28 CN CN202111621277.2A patent/CN114156088B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003173942A (en) * | 2001-12-06 | 2003-06-20 | Matsushita Electric Ind Co Ltd | Aluminum electrolytic capacitor and its manufacturing method |
| US20030117764A1 (en) * | 2001-12-21 | 2003-06-26 | Sagal E. Mikhail | Capacitor post with improved thermal conductivity |
| JP2013058649A (en) * | 2011-09-09 | 2013-03-28 | Hitachi Aic Inc | Aluminum electrolytic capacitor |
| CN103199204A (en) * | 2013-03-28 | 2013-07-10 | 凯迈嘉华（洛阳）新能源有限公司 | Assembling process of electrode insulating sealing structure |
| CN207474283U (en) * | 2017-11-09 | 2018-06-08 | 玉环县鑫庄电子有限公司 | A kind of rubber pad for capacitor |
| CN208922917U (en) * | 2018-10-30 | 2019-05-31 | 丰宾电子（深圳）有限公司 | A kind of aluminium electrolutic capacitor structure |
| CN216818106U (en) * | 2021-12-28 | 2022-06-24 | 丰宾电子（深圳）有限公司 | Heat dissipation type antidetonation aluminum electrolytic capacitor |
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| CN114156088B (en) | 2024-09-27 |
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Address after: 518106 workshop A102 (No. 4132, Songbai Road), Fengbin Industrial Park, Tangwei community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Fengbin Electronic Technology Co.,Ltd. Address before: 518106 workshop A102 (No. 4132, Songbai Road), Fengbin Industrial Park, Tangwei community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant before: CAPXON ELECTRONIC (SHEN ZHEN) Co.,Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |