CN115050574A - Low waist antidetonation bedplate of condenser - Google Patents
Low waist antidetonation bedplate of condenser Download PDFInfo
- Publication number
- CN115050574A CN115050574A CN202210691111.6A CN202210691111A CN115050574A CN 115050574 A CN115050574 A CN 115050574A CN 202210691111 A CN202210691111 A CN 202210691111A CN 115050574 A CN115050574 A CN 115050574A
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- lead
- capacitor
- capacitor body
- base plate
- auxiliary
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 90
- 238000003466 welding Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims 1
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 16
- 230000035882 stress Effects 0.000 description 10
- 238000005476 soldering Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention relates to a short waist anti-seismic seat plate of a capacitor, which comprises a seat plate and a capacitor body; the method is characterized in that: the base plate is used for fixing the capacitor body; the base plate of the base plate is provided with a first surface for mounting the capacitor body and a second surface for welding and fixing, wherein the first surface of the base plate is provided with a high wall and a low wall for fixing the capacitor body, and the middle of the base plate is provided with a pair of through holes for inserting lead wires at intervals; lead grooves are arranged on the second surface of the seat plate at intervals; the lead slot is provided with a first auxiliary pin; the second surface of bedplate is provided with a plurality of second auxiliary feet, first auxiliary foot and second auxiliary foot all are used for connecting fixedly the bedplate. The technical problems that in the prior art, a lead of a capacitor body is directly welded with a circuit board, the structure of a stress surface is single, and the lead is easily broken and falls off in a high-frequency high-amplitude working environment are solved.
Description
Technical Field
The invention belongs to the field of capacitors, and particularly relates to a low waist anti-seismic seat plate of a capacitor.
Background
The capacitor is one of electronic components used in a large number of electronic devices, is an indispensable component in a circuit, and is fixed on a circuit board by means of soldering. The rapid development of automobile electronics represented by new energy automobiles, automatic driving and the like expands the application of aluminum electrolytic capacitors in automobile products, and as part of automobile core functions have extremely high requirements on vibration resistance, the traditional aluminum electrolysis and chip type aluminum electrolysis are difficult to meet the requirements of customers, so that the design of a product with extremely high vibration resistance to meet the requirement of the rapidly developed automobile electronics in China becomes increasingly important, and in order to well maintain the connection state of the capacitor and a mounting surface, the high vibration resistance is required for the capacitor, especially in the working environment with larger vibration. The phenomenon that the condenser appears becoming flexible or drops easily in the circuit board, leads to electrical equipment to break down unable operation, and in prior art, the lead wire of capacitor body is direct and the circuit board welding, and stress surface single structure, the lead wire is broken easily, is difficult to guarantee the firm connection of condenser and circuit board in the operational environment of the high amplitude of high frequency, appears the problem that the condenser is not flexible or drops easily.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a low waist anti-seismic seat plate of a capacitor, which aims to solve the technical problems that in the prior art, a lead of a capacitor body is directly welded with a circuit board, the structure of a stress surface is single, and the lead is easy to break off and fall off in a high-frequency and high-amplitude working environment.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
a low waist anti-seismic seat plate of a capacitor comprises a seat plate and a capacitor body; the method is characterized in that: the base plate is used for fixing the capacitor body; the base plate of the base plate is provided with a first surface for mounting the capacitor body and a second surface for welding and fixing;
the first surface of the seat plate is provided with a high wall and a low wall for fixing the capacitor body, and a pair of through holes for inserting leads are arranged in the middle of the seat plate at intervals;
lead wire grooves are formed in the second surface of the seat plate at intervals; the lead slot is provided with a first auxiliary pin; the second surface of bedplate is provided with a plurality of second auxiliary feet, first auxiliary foot and second auxiliary foot all are used for connecting fixedly the bedplate.
Further, the high wall abuts against the curled portion of the housing, and the low wall abuts against the curled portion of the housing.
Furthermore, concave parts are respectively arranged on the inner sides of the high wall and the low wall, the concave parts are matched with the curling part of the capacitor body, and the joint parts of the high wall and the low wall and the first surface are provided with joint parts used for abutting against the sealing end of the capacitor body.
Furthermore, the lead groove is communicated with the through hole, and one side of the lead groove, which is far away from the through hole, extends to the outer side of the substrate.
Further, first supplementary foot includes first end portion and second end portion, first end portion sets up in the lead wire inslot, the second end portion interval sets up in the lead wire groove both sides, first end portion extends to the lead wire groove outside along the lead wire groove.
Further, the second auxiliary leg has thermal conductivity, and the shape of the second auxiliary leg is circular or polygonal.
Furthermore, the lead penetrates through the sealing body and the through hole, the lead penetrates through the through hole and is bent and contained in the lead groove, and the lead is abutted to the first auxiliary pin and used for leading out an electrode of the capacitor body.
The invention has the advantages and positive effects that:
according to the short waist anti-seismic seat plate of the capacitor, the high wall and the short wall for fixing the capacitor body are arranged on the first surface of the seat plate, the capacitor body is clamped by the high wall and the short wall together, the capacitor body is stabilized in the seat plate, meanwhile, the first auxiliary pin and the second auxiliary pin for welding with the circuit board are arranged on the second surface of the seat plate, the welding area of the seat plate and the circuit board is increased, the first auxiliary pin, the second auxiliary pin and the lead wire resist external force together, the stress is uniform, the lead wire is prevented from being stressed independently, the anti-seismic property is enhanced, and the technical problems that in the prior art, the lead wire of the capacitor body is directly welded with the circuit board, the stress surface is single in structure, and the lead wire is easy to break and fall off in a high-frequency and high-amplitude working environment are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a perspective view of a seat plate according to the present invention.
Fig. 2 is a perspective view of the capacitor body of the present invention mounted on a base plate.
FIG. 3 is a schematic front sectional view of the capacitor body of the present invention mounted on a base plate.
Fig. 4 is a side view of the seat plate of the present invention.
Fig. 5 is a bottom view of the seat plate of the present invention.
Fig. 6 is an enlarged schematic view of portion a of fig. 3 of the present invention.
Fig. 7 is a schematic diagram of the soldering of the first auxiliary pin and the circuit board according to the present invention.
The reference numbers illustrate: 1. a seat plate; 2. a capacitor body; 3. a projected area; 4. a first auxiliary leg; 4. a second auxiliary leg; 5. a circuit board; 101. a substrate; 102. a high wall; 103. a low wall; 104. a through hole; 105. a lead slot; 106. a recess; 107. a joining portion; 108. a convex portion; 201. a housing; 202. a lead wire; 203. a sealing body; 204. a plain core; 301. a first end portion; 302. a second end portion; 1011. a first surface; 1012. a second surface; 2021. a curled portion.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, "and/or" in the whole text includes three schemes, taking a and/or B as an example, including a technical scheme, and a technical scheme that a and B meet simultaneously; in addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The embodiments of the invention will be described in further detail with reference to the accompanying drawings:
as shown in fig. 1-7, a low waist anti-seismic seat plate for a capacitor comprises a seat plate 1 and a capacitor body 2; the method is characterized in that: the base plate 1 is used for fixing the capacitor body 2; the substrate 101 of the base plate 1 has a first surface 1011 for mounting the capacitor body 2 and a second surface 1012 for solder fixing; the first surface 1011 of the base plate 1 is provided with a high wall 102 and a low wall 103 for fixing the capacitor body 2, and the base plate 1 is provided with a pair of through holes 104 for inserting the leads 202 at intervals.
The second surface 1012 of the seat plate 1 is provided with lead grooves 105 at intervals; the lead groove 105 is provided with a first auxiliary pin 3; the second surface 1012 of the seat board 1 is provided with a plurality of second auxiliary feet 4, and the first auxiliary feet 3 and the second auxiliary feet 4 are both used for connecting and fixing the seat board 1.
When mounting, the seat plate 1 is used for fixing the capacitor body 2, and the substrate 101 of the seat plate 1 has a first surface 1011 for mounting the capacitor body 2 and a second surface 1012 for solder fixing. Specifically, the first surface 1011 is provided with a high wall 102 and a low wall 103 for fixing the capacitor body 2, a drop height is formed between the high wall 102 and the low wall 103 in height, the high wall 102 and the low wall 103 clamp the outside of the capacitor body 2 together, so that the capacitor body 2 is fixed in the seat plate 1, the first surface 1011 abuts against one end of the capacitor body 2 with the sealing body 203, the lead 202 penetrates through the sealing body 203 and the through hole 104, the lead 202 penetrates through the through hole 104 and is bent and accommodated in the lead groove 105, and the lead 202 abuts against the first auxiliary pin 3. Simultaneously be provided with on bedplate 1's second surface 1012 and be used for assisting foot 3 and second with circuit board 5 welded for bedplate 1 and circuit board welding area increase, external force is resisted jointly to first supplementary foot 3 and second supplementary foot 4 and lead wire 202, the atress is even, lead wire 202 stress alone has been avoided, the shock resistance has been strengthened, among the prior art has been solved, capacitor body's lead wire is direct to be welded with circuit board 5, the stress surface single structure, the technical problem that the lead wire is dropped by the rupture easily in the operational environment of the high-frequency high amplitude.
In some embodiments, as shown in fig. 3, the lead 202 penetrates through the sealing body 203 and the through hole 104, the lead 202 is bent and accommodated in the lead groove 105 through the through hole 104, and the lead 202 abuts against the first auxiliary pin 3 for leading out an electrode of the capacitor body 2. Specifically, the capacitor body 2 holds a predetermined electrolytic solution between an anode foil and a cathode foil, and an electrolytic paper is wound between the anode foil and the cathode foil; the sealing body 203 seals the electrode and leads the electrode out through the lead 202. The lead 202 penetrates the sealing body 203 to lead out the capacitor body 2, wherein the lead can be divided into an anode lead and a cathode lead, when the lead 202 is mounted, the lead 202 penetrates through the through hole 104 of the seat plate 1 until the sealing body 203 abuts against the first surface 1011 of the seat plate 1, then the lead 202 is bent and flattened, the bent part of the lead 202 is accommodated in the lead groove 105, and the lead 202 abuts against the first auxiliary pin 3. In the present embodiment, the type of the capacitor body 2 is not particularly limited, and examples thereof include an aluminum electrolytic capacitor, a tantalum electrolytic capacitor, a solid electrolytic capacitor provided with a solid electrolyte, a hybrid electrolytic capacitor, and the like. The shape of the capacitor body 2 is not particularly limited, and in the present embodiment, the outer shape of the capacitor body 2 is a cylindrical shape.
In some embodiments, as shown in fig. 1 and 3, tall wall 102 abuts curl 2021 of housing 201 and short wall 103 abuts curl 2021 of housing 201. Specifically, the high walls 102 and the low walls 103 are spaced apart in the seat plate 1 and extend in a direction away from the first surface 1011. The number of the high walls 102 and the short walls 103 is several, in this embodiment, two high walls 102 and two short walls 103 are respectively and symmetrically distributed, in another embodiment, the high walls 102 and the short walls 103 can also be distributed at intervals, more specifically, the high walls 102 and the short walls 103 are respectively arranged at the corners of the seat plate 1, and the height of the high walls 102 is higher than that of the short walls 103 to form a step. The high wall 102 and the short wall are respectively abutted to different parts of the capacitor body 2 to form different stress points, so that stress distribution is more uniform, wherein a fall is formed on the height of the high wall 102 and the short wall 103, so that the exposed area of the shell 201 of the capacitor body 2 is larger, heat dissipation is improved, and meanwhile, materials for manufacturing the seat plate 1 can be saved.
Further, referring to fig. 1 and 3, the insides of the high wall 102 and the low wall 103 are respectively provided with a recess 106, the recess 106 is matched with the curl 2021 of the capacitor body 2, and the joint portion 107 for abutting against the sealing end of the capacitor body 2 is provided at the joint of the high wall 102 and the low wall 103 and the first surface 1011. Specifically, when capacitor body 2 is installed in bedplate 1, the shell 201 of capacitor body 2 is in mutual pressing contact with high wall 102 and low wall 103, high wall 102 and low wall 103 distribute around capacitor body 2 circumferencial direction, because high wall 102 and low wall 103 inboard are provided with recess 106 respectively, mutual encirclement between recess 106, the shape is similar circular and with capacitor body 2's shell 201 assorted space, make capacitor body 2's shell 201 part laminate firmly in recess 106, under the centre gripping of high wall 102 and low wall 103, make capacitor body 2 stabilize in bedplate 1, avoid capacitor body 2 to rock in bedplate 1. The mounting firmness of the capacitor body 2 is enhanced. Further improving the earthquake-resistant performance. On the other hand, the joints 107 for abutting the sealing end of the capacitor body 2 are provided at the joints between the high walls 102 and the low walls 103 and the first surface 1011. When the capacitor body 2 is installed in the base plate 1 and the lead 202 is in the lead slot 105 of the base plate 1, at this time, the open end of the capacitor body 2, that is, one end of the sealing body 203 is in close contact with the first surface 1011 of the base plate 1, and the joint portion 107 for abutting against the sealing end of the capacitor body 2 is arranged at the joint of the first surface 1011, so that a closed space is formed between the sealing body 203 and the first surface 1011, the sealing body 203 is prevented from being in direct contact with air, the problem that the sealing body 203 is prevented from being exposed in the air and the sealing performance of the sealing body 203 is deteriorated due to oxidation, aging and shrinkage is solved, and the service life is prolonged.
In some embodiments, as shown in fig. 5 and 6, the lead groove 105 is in communication with the through hole 104, and the lead groove 105 extends to the outside of the substrate 101 away from the side of the through hole 104. One end of the specific lead groove 105 is communicated with the through hole 104, and is used for bending and accommodating the lead 202 in the lead groove 105 after passing through the through hole 104, specifically, the shape of the lead groove 105 is not limited, and the lead groove 105 can be a circular groove or a rectangular or polygonal groove, the lead groove 105 of the embodiment adopts a rectangular groove, and the lead 202 is matched with the lead groove 105 after being flattened and bent. The lead groove 105 extends to the outer side of the substrate 101 away from the through hole 104, and the lead 202 is bent, stuck in the lead groove 105 and extended out of the substrate 101 along the lead groove 105. The assembly and welding with the circuit board 5 are convenient.
In some embodiments, the first auxiliary leg 3 includes a first end 301 and a second end 302, the first end 301 is disposed in the lead groove 105, the second end 302 is disposed on two sides of the lead groove 105 at an interval, and the first end 301 extends along the lead groove 105 to the outside of the lead groove 105. Specifically, the number of the first auxiliary pins 3 is several, in this embodiment, the number of the first auxiliary pins 3 is two, and the first auxiliary pins 3 are respectively disposed in the two lead grooves 105, wherein the first end portion 301 is recessed toward the depth direction of the lead groove 105, embedded in the lead groove 105, and abutted against the bent lead 202. The second end portions 302 are arranged on two sides of the lead groove 105 at intervals, the end faces of the second end portions 302 are exposed out of the second surface 1012 of the base plate 1, when the capacitor body 2 and the base plate 1 are assembled on the circuit board 5, the lead 202 and the first auxiliary pins 3 are abutted to welding positions of the circuit board 5, when welding is carried out, a part of the solder penetrates into the lead groove 105 and fills the lead groove 105 under a melting state, and the lead 202 and the first end portion 301 are connected into a whole. Increasing the robustness of the lead 202. Meanwhile, the second end 302 of the first auxiliary pin 3 is disposed on two sides of the lead groove 105 at an interval, and when welding, the second end 302 is connected with the welding position of the circuit board 5 through soldering tin, so that the second end 302 is attached to the circuit board 5, and at this time, the lead 202 and the second end 302 are connected into a whole, and the base plate 1 and the capacitor body 2 are firmly fixed in the circuit board 5. Compared with the single welding of the lead 202 in the prior art, the welding area is increased, the stress area is increased, the performance of resisting external force is improved, and the anti-seismic effect is achieved.
In some embodiments, the second auxiliary leg 4 has thermal conductivity, and the shape of the second auxiliary leg 4 is circular or polygonal. Specifically, the second surface 1012 of the seat plate 1 is provided with a plurality of second auxiliary pins 4, and the second auxiliary pins 4 are exposed at the second surface 1012, in another embodiment, the second auxiliary pins 4 may also penetrate through two end faces of the second auxiliary pin 4 of the substrate 101 and are respectively exposed at the first surface 1011 and the second surface 1012 of the substrate 101, so as to transmit the temperature of the end of the capacitor body 2 in contact with the seat plate 1 to the circuit board 5 through the second auxiliary pins 4, and remove a part of heat. The heat dissipation effect is achieved. On the other hand, the second auxiliary leg 4 abuts against the soldering position in the circuit board 5, and the second auxiliary leg 4 is soldered to the circuit board 5 by soldering, so that the fixing property of the seat plate 1 to the circuit board 5 is further enhanced. This bedplate 1 possesses first supplementary foot 3, the supplementary foot 4 fixed action of second simultaneously, and when bedplate 1 and capacitor body 2 received external force, external force was resisted simultaneously to first supplementary foot 3, the supplementary foot 4 of second, offsets external force for bedplate 1 and capacitor body 2 more firmly install in circuit board 5, make capacitor body 2 can adapt to and use in the vibrations environment of high strength. The structure improves the anti-seismic performance and the heat dissipation effect, and solves the technical problems that in the prior art, the lead of the capacitor body is directly welded with the circuit board, the stress surface has a single structure, and the lead is easily broken and falls off in the high-frequency and high-amplitude working environment.
It should be emphasized that the embodiments described herein are illustrative rather than restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but other embodiments derived from the technical solutions of the present invention by those skilled in the art are also within the scope of the present invention.
Claims (7)
1. A short waist anti-seismic seat plate of a capacitor comprises a seat plate (1) and a capacitor body (2); the method is characterized in that: the seat plate (1) is used for fixing the capacitor body (2); the base plate (101) of the base plate (1) is provided with a first surface (1011) for installing the capacitor body (2) and a second surface (1012) for welding and fixing;
the first surface (1011) of the seat plate (1) is provided with a high wall (102) and a low wall (103) for fixing the capacitor body (2), and a pair of through holes (104) for penetrating leads (202) are arranged in the middle of the seat plate (1) at intervals;
lead grooves (105) are arranged on the second surface (1012) of the seat plate (1) at intervals; the lead groove (105) is provided with a first auxiliary pin (3); the second surface (1012) of bedplate (1) is provided with a plurality of second auxiliary feet (4), first auxiliary foot (3) all are used for the connection with second auxiliary foot (4) and fix bedplate (1).
2. The short waist anti-seismic base plate of capacitor as claimed in claim 1, wherein: the high wall (102) abuts against a curl portion (2021) of the housing (201), and the low wall (103) abuts against a lower half portion of the curl portion (2021) of the housing (201).
3. The short waist anti-seismic base plate of capacitor as claimed in claim 1, wherein: the inner sides of the high wall (102) and the low wall (103) are respectively provided with a concave part (106), the concave part (106) is matched with a curling part (2021) of the capacitor body (2), and a joint part (107) used for abutting against the sealing end of the capacitor body (2) is arranged at the joint of the high wall (102) and the low wall (103) and the first surface (1011).
4. The short waist anti-seismic base plate of capacitor as claimed in claim 1, wherein: the lead groove (105) is communicated with the through hole (104), and one side, far away from the through hole (104), of the lead groove (105) extends to the outer side of the substrate (101).
5. The short waist anti-seismic base plate of capacitor as claimed in claim 1, wherein: the first auxiliary pin (3) comprises a first end portion (301) and a second end portion (302), the first end portion (301) is arranged in the lead groove (105), the second end portion (302) is arranged on two sides of the lead groove (105) at intervals, and the first end portion (301) extends to the outer side of the lead groove (105) along the lead groove (105).
6. The short waist anti-seismic base plate of capacitor as claimed in claim 1, wherein: the second auxiliary leg (4) has thermal conductivity, and the shape of the second auxiliary leg (4) is circular or polygonal.
7. The short waist anti-seismic base plate of capacitor as claimed in claim 1, wherein: the lead (202) penetrates through the sealing body (203) and the through hole (104), the lead (202) penetrates through the through hole (104) to be bent and contained in the lead groove (105), and the lead (202) is abutted to the first auxiliary pin (3) and used for leading out an electrode of the capacitor body (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210691111.6A CN115050574A (en) | 2022-06-18 | 2022-06-18 | Low waist antidetonation bedplate of condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210691111.6A CN115050574A (en) | 2022-06-18 | 2022-06-18 | Low waist antidetonation bedplate of condenser |
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CN115050574A true CN115050574A (en) | 2022-09-13 |
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CN202210691111.6A Pending CN115050574A (en) | 2022-06-18 | 2022-06-18 | Low waist antidetonation bedplate of condenser |
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- 2022-06-18 CN CN202210691111.6A patent/CN115050574A/en active Pending
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