US20140020871A1 - Heat sink with built-in fan - Google Patents

Heat sink with built-in fan Download PDF

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Publication number
US20140020871A1
US20140020871A1 US13/551,448 US201213551448A US2014020871A1 US 20140020871 A1 US20140020871 A1 US 20140020871A1 US 201213551448 A US201213551448 A US 201213551448A US 2014020871 A1 US2014020871 A1 US 2014020871A1
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Prior art keywords
heat radiation
fan
heat
built
radiation fin
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Abandoned
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US13/551,448
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Tsung-Hsien Huang
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Individual
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Individual
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Priority to US13/551,448 priority Critical patent/US20140020871A1/en
Publication of US20140020871A1 publication Critical patent/US20140020871A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08Fluid driving means, e.g. pumps, fans
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink and more particularly, to a heat sink with a built-in fan.
  • a conventional heat sink for an electronic component comprises a heat radiation base, a heat radiation fin module made of aluminum or copper, and a fan.
  • the heat sink may be connected with at least one heat conduction pipe to enhance the heat radiation efficiency.
  • the heat radiation base is attached to the electronic component to absorb heat, so that the heat can be radiated through the heat radiation fin module.
  • the heat conduction pipe and the fan are adapted to facilitate heat radiation.
  • Another conventional cylindrical heat sink comprises a cylindrical body and a plurality of heat radiation fins which may be integrally formed with or welded to the cylindrical body and arranged radially from the peripheral wall of the cylindrical body.
  • the electronic component is attached to the bottom of the cylindrical body, such that the heat can be transmitted through the bottom of the cylindrical body to the plurality of heat radiation fins.
  • the heat radiation fins of this heat sink are integrally formed with the body so the number of the heat radiation fins is limited and the heat radiation fins have a certain thickness and weight.
  • the heat sink doesn't have a good heat radiation efficiency and the cost is high.
  • This cylindrical heat sink has a cylindrical wall, so the fan is limited to be mounted on the upper end of the body, not in the body. Moreover, the size of the heat sink is large.
  • the heat radiation fins are coupled to the wall of the cylindrical body by stamping.
  • This structure must have a cylindrical body.
  • the cylindrical body has a plurality of grooves for insertion of the heat radiation fins.
  • the heat radiation fins are compressed and connected to the cylindrical body by stamping and arranged in a radial direction.
  • the cylindrical body is an essential part which has a certain weight and uses a certain material, so the heat sink is heavy and not cost-effective.
  • the primary object of the present invention is to provide a heat sink with a built-in fan.
  • the heat sink comprises a heat radiation base, a heat radiation fin module and a fan.
  • the heat radiation base has a plurality of spaced grooves formed on an inner side thereof for engagement of heat radiation fins of the heat radiation fin module.
  • the heat radiation fins are respectively inserted in the grooves of the heat radiation base and compressed in the grooves by stamping so that the heat radiation fins are connected to the heat radiation base.
  • the fan is located inside the heat radiation fin module and surrounded by the plurality of heat radiation fins. When the heat radiation base absorbs heat, the fan is started to dissipate heat quickly. The entire assembly is easy, quick and stable to save the material and assembly cost.
  • the fan is coupled in the heat radiation fin module, without increasing the size of the heat sin.
  • the heat sink of the present invention further comprises an upper cover disposed on the heat radiation fin module to enhance the entire connection of the heat sink.
  • the upper cover has a plurality of insertion holes corresponding to the heat radiation fins for insertion of the heat radiation fins.
  • Each heat radiation fin of the heat radiation fin module has an extension portion extending from an upper end thereof. The extension portion is inserted through the respective insertion hole of the upper cover and then bent to achieve a better fixing.
  • the heat radiation fin has a notch at one side or both sides of the extension portion. After the extension portion is inserted through the respective insertion hole of the upper cover, the one side or both sides of the extension portion are bent outwardly to hold against the upper cover.
  • the heat sink of the present invention further comprises at least one heat conduction pipe connected between the heat radiation base and the heat radiation fin module.
  • the heat conduction pipe is attached to the bottom of the heat radiation base and surrounds the heat radiation fins of the heat radiation fin module.
  • the heat conduction pipe is in contact with the electronic component directly to quickly dissipate heat by cooperating with the built-in fan.
  • the fan is a turbo fan.
  • the fan comprises a plurality of blades to enhance the heat radiation effect.
  • each heat radiation fin is bent to form a dual-layer or multi-layer insertion portion.
  • the insertion portion is inserted and compressed by stamping to be embedded in the respective groove, so that the insertion portion of each heat radiation fin is connected in the respective groove to ensure that the heat radiation fins won't disengage from the grooves.
  • FIG. 1 is an exploded view of the heat sink with built-in fan according to a preferred embodiment of the present invention
  • FIG. 2 is a perspective view of the heat sink with built-in fan according to the preferred embodiment of the present invention
  • FIG. 3 is another perspective view from the bottom of the heat sink with built-in fan according to the preferred embodiment of the present invention.
  • FIG. 4 is an exploded view showing the heat radiation fin, the heat radiation base and the upper cover according to the preferred embodiment of the present invention
  • FIG. 5 is a top view of the heat sink with built-in fan according to the preferred embodiment of the present invention.
  • FIG. 6 is a sectional view taken along line A-A of FIG. 5 ;
  • FIG. 7 is a perspective view of the heat sink with built-in fan according to the preferred embodiment of the present invention coupled with the two symmetrical foot seats;
  • FIG. 8 is another perspective view of FIG. 7 ;
  • FIG. 9 is a perspective view of the heat sink with built-in fan according to the preferred embodiment of the present invention coupled with the heat conduction pipe and the foot seats;
  • FIG. 10 is another perspective view of FIG. 9 ;
  • FIG. 11 is a perspective view showing another embodiment of the heat radiation fin
  • FIG. 12 is a perspective view showing a further embodiment of the heat radiation fin.
  • FIG. 13 is a perspective view according to another embodiment of the present invention.
  • the heat sink with a built-in fan comprises a heat radiation base 1 , a heat radiation fin module 2 and a fan 3 .
  • the present invention further comprises an upper cover 4 disposed on the heat radiation fin module 2 .
  • the heat radiation base 1 is a flat plate.
  • the heat radiation base 1 has a plurality of spaced grooves 11 formed on an inner side 101 thereof and a stepped protrusion 12 formed on an outer side 102 thereof, as shown in FIG. 3 .
  • the stepped protrusion 12 is adapted to make contact with an electronic component (not shown).
  • the heat radiation fin module 2 is composed of a plurality of heat radiation fins 21 .
  • the lower end of each heat radiation fin 2 is inserted in a respective groove 11 of the heat radiation base 1 .
  • the fan 3 is coupled to the inner side 101 of the heat radiation base 1 .
  • the fan 3 is located inside the heat radiation fin module 2 and surrounded by the plurality of heat radiation fins 21 .
  • the fan 3 is a turbo fan.
  • the fan 3 comprises a rotation axle 31 and a plurality of blades 32 .
  • the rotation axle 31 is coupled to the inner side 101 of the heat radiation base 1 .
  • the upper cover 4 is an annular cover fitted on the heat radiation fin module 2 .
  • the upper cover 4 has a plurality of insertion holes 41 corresponding to the heat radiation fins 21 for insertion of the heat radiation fins 21 .
  • the heat radiation fins 21 of the heat radiation fin module 2 are respectively inserted in the grooves 11 of the heat radiation base 1 and compressed by stamping, such that the lower ends of the heat radiation fins 21 are embedded in the grooves 11 of the heat radiation base 1 .
  • the fan 3 is located in the heat radiation fin module 2 . When the heat radiation base 1 absorbs heat, the fan 3 is started to dissipate heat quickly.
  • the blades 32 of the turbo fan 3 are curved and arranged in the same direction.
  • the heat radiation fins 21 are curved and arranged in a reverse direction relative to the blades 32 .
  • the blades 32 of the turbo fan 3 and the heat radiation fins 21 of the heat radiation fin module 2 are arranged in opposite directions to generate a strong turbulent flow for heat dissipation.
  • each heat radiation fin 21 of the heat radiation fin module 2 has an extension portion 211 extending from an upper end thereof.
  • the extension portion 211 is inserted in the respective insertion hole 41 of the upper cover 4 and then bent, such that the upper end of each heat radiation fin 21 is secured to the upper cover 4 , as shown in FIG. 5 and FIG. 6 .
  • each heat radiation fin 21 can be bent to form a dual-layer or multi-layer insertion portion 212 .
  • the insertion portion 212 is inserted and compressed by stamping to be embedded in the respective groove 11 , so that the insertion portion 212 of each heat radiation fin 21 is connected in the respective groove 11 to ensure that the heat radiation fins 21 won't disengage from the grooves 11 .
  • the heat radiation base 1 comprises two symmetric foot seats 51 , 52 coupled to the outer side 102 thereof.
  • the shape of the stepped protrusion 12 (as shown in FIG. 3 ) or 12 ′ (as shown in FIG. 8 ) can be changed as desired for making contact with different electronic components.
  • the present invention further comprises at least one heat conduction pipe 6 connected between the heat radiation base 1 and the heat radiation fin module 2 .
  • the heat conduction pipe 6 is attached to the bottom of the heat radiation base 1 and surrounds the heat radiation fins 21 a of the heat radiation fin module 2 a so that the heat conduction pipe 6 , the heat radiation base 1 and the heat radiation fin module 2 a are connected together.
  • the heat conduction pipe 6 may be in contact with the electronic component directly or applied with thermally conductive grease 7 to dissipate heat by cooperating with the built-in fan 3 .
  • each heat radiation fin 21 a of the heat radiation fin module 2 a has an engaging recess 213 a and a recess wall 214 a along the engaging recess 213 a for engagement of the heat conduction pipe 6 .
  • the recess wall 214 a can increase the contact area of the heat conduction pipe 6 and the heat radiation fin 21 a.
  • the heat radiation fin 21 b has a notch 215 b at one side or both sides of the extension portion 211 b.
  • the extension portion 211 b is inserted through the respective insertion hole 41 a of the upper cover 4 a, the one side or both sides of the extension portion 211 b are bent outwardly to form a bent section 216 b to hold against the upper cover 4 a, as shown in FIG. 13 .
  • the insertion hole 41 a of the upper cover 4 a may extend to its edge of the upper cover 4 a.
  • the edge of the insertion hole 41 a is closed by stamping to seal the outer end of the insertion hole 41 a, and the extension portion 211 b and the bent portion 216 b are compressed by stamping. In this way, the upper cover 4 a and the heat radiation fins 21 b are firmly connected.
  • the feature of the present invention is that the inner side of the heat radiation base 1 has the plurality of spaced grooves 11 for engagement of the plurality of heat radiation fins 21 by stamping.
  • the heat radiation fins 21 and the heat radiation base 1 can be connected by stamping, so the assembly is simply and quick.
  • the built-in fan 3 in the heat radiation fin module 2 the heat can be dissipated quickly.
  • the heat conduction pip 6 is provided to enhance the heat radiation efficiency.
  • the upper cover 4 or 4 a is included to firm up the entire structure.

Abstract

A heat sink with a built-in fan includes a heat radiation base, a heat radiation fin module and a fan. The heat radiation base has a plurality of spaced grooves formed on an inner side thereof for engagement of heat radiation fins of the heat radiation fin module. The heat radiation fins are respectively inserted in the grooves of the heat radiation base and compressed in the grooves by stamping so that the heat radiation fins are connected to the heat radiation base. The fan is located inside the heat radiation fin module and surrounded by the plurality of heat radiation fins. When the heat radiation base absorbs heat, the fan is started to dissipate heat quickly. At least one heat conduction pipe is connected between the heat radiation base and the heat radiation fin module to enhance the heat dissipation efficiency of the heat sink.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention
  • The present invention relates to a heat sink and more particularly, to a heat sink with a built-in fan.
  • (b) Description of the Prior Art
  • A conventional heat sink for an electronic component comprises a heat radiation base, a heat radiation fin module made of aluminum or copper, and a fan. The heat sink may be connected with at least one heat conduction pipe to enhance the heat radiation efficiency. The heat radiation base is attached to the electronic component to absorb heat, so that the heat can be radiated through the heat radiation fin module. The heat conduction pipe and the fan are adapted to facilitate heat radiation.
  • Another conventional cylindrical heat sink comprises a cylindrical body and a plurality of heat radiation fins which may be integrally formed with or welded to the cylindrical body and arranged radially from the peripheral wall of the cylindrical body. The electronic component is attached to the bottom of the cylindrical body, such that the heat can be transmitted through the bottom of the cylindrical body to the plurality of heat radiation fins. The heat radiation fins of this heat sink are integrally formed with the body so the number of the heat radiation fins is limited and the heat radiation fins have a certain thickness and weight. The heat sink doesn't have a good heat radiation efficiency and the cost is high. This cylindrical heat sink has a cylindrical wall, so the fan is limited to be mounted on the upper end of the body, not in the body. Moreover, the size of the heat sink is large.
  • As an alternative to the integral heat sink, the heat radiation fins are coupled to the wall of the cylindrical body by stamping. This structure must have a cylindrical body. The cylindrical body has a plurality of grooves for insertion of the heat radiation fins. The heat radiation fins are compressed and connected to the cylindrical body by stamping and arranged in a radial direction. The cylindrical body is an essential part which has a certain weight and uses a certain material, so the heat sink is heavy and not cost-effective.
  • SUMMARY OF THE INVENTION
  • The primary object of the present invention is to provide a heat sink with a built-in fan. The heat sink comprises a heat radiation base, a heat radiation fin module and a fan. The heat radiation base has a plurality of spaced grooves formed on an inner side thereof for engagement of heat radiation fins of the heat radiation fin module. The heat radiation fins are respectively inserted in the grooves of the heat radiation base and compressed in the grooves by stamping so that the heat radiation fins are connected to the heat radiation base. The fan is located inside the heat radiation fin module and surrounded by the plurality of heat radiation fins. When the heat radiation base absorbs heat, the fan is started to dissipate heat quickly. The entire assembly is easy, quick and stable to save the material and assembly cost. The fan is coupled in the heat radiation fin module, without increasing the size of the heat sin.
  • Preferably, the heat sink of the present invention further comprises an upper cover disposed on the heat radiation fin module to enhance the entire connection of the heat sink. The upper cover has a plurality of insertion holes corresponding to the heat radiation fins for insertion of the heat radiation fins. Each heat radiation fin of the heat radiation fin module has an extension portion extending from an upper end thereof. The extension portion is inserted through the respective insertion hole of the upper cover and then bent to achieve a better fixing.
  • Preferably, the heat radiation fin has a notch at one side or both sides of the extension portion. After the extension portion is inserted through the respective insertion hole of the upper cover, the one side or both sides of the extension portion are bent outwardly to hold against the upper cover.
  • Preferably, the heat sink of the present invention further comprises at least one heat conduction pipe connected between the heat radiation base and the heat radiation fin module. The heat conduction pipe is attached to the bottom of the heat radiation base and surrounds the heat radiation fins of the heat radiation fin module. The heat conduction pipe is in contact with the electronic component directly to quickly dissipate heat by cooperating with the built-in fan.
  • Preferably, the fan is a turbo fan. The fan comprises a plurality of blades to enhance the heat radiation effect.
  • Preferably, the lower end of each heat radiation fin is bent to form a dual-layer or multi-layer insertion portion. The insertion portion is inserted and compressed by stamping to be embedded in the respective groove, so that the insertion portion of each heat radiation fin is connected in the respective groove to ensure that the heat radiation fins won't disengage from the grooves.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of the heat sink with built-in fan according to a preferred embodiment of the present invention;
  • FIG. 2 is a perspective view of the heat sink with built-in fan according to the preferred embodiment of the present invention;
  • FIG. 3 is another perspective view from the bottom of the heat sink with built-in fan according to the preferred embodiment of the present invention;
  • FIG. 4 is an exploded view showing the heat radiation fin, the heat radiation base and the upper cover according to the preferred embodiment of the present invention;
  • FIG. 5 is a top view of the heat sink with built-in fan according to the preferred embodiment of the present invention;
  • FIG. 6 is a sectional view taken along line A-A of FIG. 5;
  • FIG. 7 is a perspective view of the heat sink with built-in fan according to the preferred embodiment of the present invention coupled with the two symmetrical foot seats;
  • FIG. 8 is another perspective view of FIG. 7;
  • FIG. 9 is a perspective view of the heat sink with built-in fan according to the preferred embodiment of the present invention coupled with the heat conduction pipe and the foot seats;
  • FIG. 10 is another perspective view of FIG. 9;
  • FIG. 11 is a perspective view showing another embodiment of the heat radiation fin;
  • FIG. 12 is a perspective view showing a further embodiment of the heat radiation fin; and
  • FIG. 13 is a perspective view according to another embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings.
  • As shown in FIG. 1 and FIG. 2, the heat sink with a built-in fan according to a preferred embodiment of the present invention comprises a heat radiation base 1, a heat radiation fin module 2 and a fan 3. The present invention further comprises an upper cover 4 disposed on the heat radiation fin module 2.
  • The heat radiation base 1 is a flat plate. The heat radiation base 1 has a plurality of spaced grooves 11 formed on an inner side 101 thereof and a stepped protrusion 12 formed on an outer side 102 thereof, as shown in FIG. 3. The stepped protrusion 12 is adapted to make contact with an electronic component (not shown).
  • The heat radiation fin module 2 is composed of a plurality of heat radiation fins 21. The lower end of each heat radiation fin 2 is inserted in a respective groove 11 of the heat radiation base 1.
  • The fan 3 is coupled to the inner side 101 of the heat radiation base 1. The fan 3 is located inside the heat radiation fin module 2 and surrounded by the plurality of heat radiation fins 21. As shown in the drawings, the fan 3 is a turbo fan. The fan 3 comprises a rotation axle 31 and a plurality of blades 32. The rotation axle 31 is coupled to the inner side 101 of the heat radiation base 1.
  • The upper cover 4 is an annular cover fitted on the heat radiation fin module 2. The upper cover 4 has a plurality of insertion holes 41 corresponding to the heat radiation fins 21 for insertion of the heat radiation fins 21.
  • To assemble the present invention, the heat radiation fins 21 of the heat radiation fin module 2 are respectively inserted in the grooves 11 of the heat radiation base 1 and compressed by stamping, such that the lower ends of the heat radiation fins 21 are embedded in the grooves 11 of the heat radiation base 1. The fan 3 is located in the heat radiation fin module 2. When the heat radiation base 1 absorbs heat, the fan 3 is started to dissipate heat quickly.
  • As shown in the drawings, the blades 32 of the turbo fan 3 are curved and arranged in the same direction. The heat radiation fins 21 are curved and arranged in a reverse direction relative to the blades 32. The blades 32 of the turbo fan 3 and the heat radiation fins 21 of the heat radiation fin module 2 are arranged in opposite directions to generate a strong turbulent flow for heat dissipation.
  • As shown in FIG. 4, each heat radiation fin 21 of the heat radiation fin module 2 has an extension portion 211 extending from an upper end thereof. The extension portion 211 is inserted in the respective insertion hole 41 of the upper cover 4 and then bent, such that the upper end of each heat radiation fin 21 is secured to the upper cover 4, as shown in FIG. 5 and FIG. 6.
  • As shown in FIG. 6, the lower end of each heat radiation fin 21 can be bent to form a dual-layer or multi-layer insertion portion 212. The insertion portion 212 is inserted and compressed by stamping to be embedded in the respective groove 11, so that the insertion portion 212 of each heat radiation fin 21 is connected in the respective groove 11 to ensure that the heat radiation fins 21 won't disengage from the grooves 11.
  • As shown in FIG. 7 and FIG. 8, the heat radiation base 1 comprises two symmetric foot seats 51, 52 coupled to the outer side 102 thereof. The shape of the stepped protrusion 12 (as shown in FIG. 3) or 12′ (as shown in FIG. 8) can be changed as desired for making contact with different electronic components.
  • As shown in FIG. 9 and FIG. 10, the present invention further comprises at least one heat conduction pipe 6 connected between the heat radiation base 1 and the heat radiation fin module 2. The heat conduction pipe 6 is attached to the bottom of the heat radiation base 1 and surrounds the heat radiation fins 21 a of the heat radiation fin module 2 a so that the heat conduction pipe 6, the heat radiation base 1 and the heat radiation fin module 2 a are connected together. The heat conduction pipe 6 may be in contact with the electronic component directly or applied with thermally conductive grease 7 to dissipate heat by cooperating with the built-in fan 3.
  • As shown in FIG. 11, each heat radiation fin 21 a of the heat radiation fin module 2 a has an engaging recess 213 a and a recess wall 214 a along the engaging recess 213 a for engagement of the heat conduction pipe 6. The recess wall 214 a can increase the contact area of the heat conduction pipe 6 and the heat radiation fin 21 a.
  • As shown in FIG. 12, the heat radiation fin 21 b has a notch 215 b at one side or both sides of the extension portion 211 b. After the extension portion 211 b is inserted through the respective insertion hole 41 a of the upper cover 4 a, the one side or both sides of the extension portion 211 b are bent outwardly to form a bent section 216 b to hold against the upper cover 4 a, as shown in FIG. 13.
  • As shown in FIG. 13, the insertion hole 41 a of the upper cover 4 a may extend to its edge of the upper cover 4 a. After the extension portion 211 b is inserted through the insertion hole 41 a, the edge of the insertion hole 41 a is closed by stamping to seal the outer end of the insertion hole 41 a, and the extension portion 211 b and the bent portion 216 b are compressed by stamping. In this way, the upper cover 4 a and the heat radiation fins 21 b are firmly connected.
  • The feature of the present invention is that the inner side of the heat radiation base 1 has the plurality of spaced grooves 11 for engagement of the plurality of heat radiation fins 21 by stamping. The heat radiation fins 21 and the heat radiation base 1 can be connected by stamping, so the assembly is simply and quick. By the built-in fan 3 in the heat radiation fin module 2, the heat can be dissipated quickly. The heat conduction pip 6 is provided to enhance the heat radiation efficiency. Finally, the upper cover 4 or 4 a is included to firm up the entire structure.
  • Although particular embodiments of the present invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the present invention. Accordingly, the present invention is not to be limited except as by the appended claims.

Claims (10)

What is claimed is:
1. A heat sink with a built-in fan, comprising a heat radiation base, a heat radiation fin module and a fan;
the heat radiation base being a flat plate, the heat radiation base having a plurality of spaced grooves formed on an inner side thereof;
the heat radiation fin module comprising a plurality of heat radiation fins, each heat radiation fin having a lower end;
the fan being coupled to the inner side of the heat radiation base, the fan being located inside the heat radiation fin module and surrounded by the plurality of heat radiation fins;
wherein the lower ends of the heat radiation fins of the heat radiation fin module are respectively inserted in the grooves of the heat radiation base and compressed by stamping so that the lower ends of the heat radiation fins are embedded in the grooves of the heat radiation base.
2. The heat sink with a built-in fan as claim in claim 1, further comprising an upper cover disposed on the heat radiation fin module.
3. The heat sink with a built-in fan as claim in claim 2, wherein the upper cover is an annular cover, the upper cover having a plurality of insertion holes corresponding to the heat radiation fins, each heat radiation fin of the heat radiation fin module having an extension portion extending from an upper end thereof, the extension portions of the heat radiation fins being respectively inserted through the insertion holes of the upper cover and bent over the upper cover.
4. The heat sink with a built-in fan as claim in claim 1, wherein the fan is a turbo fan, the fan comprising a rotation axle and a plurality of blades, the rotation axle being coupled to the inner side of the heat radiation base.
5. The heat sink with a built-in fan as claim in claim 4, wherein the blades of the turbo fan are curved and arranged in the same direction and the heat radiation fins are curved and arranged in a reverse direction relative to the blades.
6. The heat sink with a built-in fan as claim in claim 1, wherein the lower end of each heat radiation fin is a dual-layer or multi-layer insertion portion.
7. The heat sink with a built-in fan as claim in claim 1, wherein the heat radiation base comprises two symmetric foot seats coupled to an outer side of the heat radiation base.
8. The heat sink with a built-in fan as claim in claim 1, further comprising at least one heat conduction pipe connected between the heat radiation base and the heat radiation fin module, the heat conduction pipe being attached to a bottom of the heat radiation base and surrounding the heat radiation fins of the heat radiation fin module.
9. The heat sink with a built-in fan as claim in claim 8, wherein each heat radiation fin of the heat radiation fin module has an engaging recess and a recess wall along the engaging recess for engagement of the heat conduction pipe.
10. The heat sink with a built-in fan as claim in claim 2, wherein the upper cover is an annular cover, the upper cover having a plurality of insertion holes corresponding to the heat radiation fins, each heat radiation fin of the heat radiation fin module having an extension portion extending from an upper end thereof and a notch at one side or both sides of the extension portion, wherein the extension portions are respectively inserted through the insertion holes of the upper cover, and the one side or both sides of the extension portions are bent outwardly to hold against the upper cover.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD787455S1 (en) * 2015-10-23 2017-05-23 Harman International Industries, Incorporated Loudspeaker heat sink
USD808929S1 (en) * 2016-10-07 2018-01-30 Curtis E. Graber Speaker

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060042777A1 (en) * 2004-08-31 2006-03-02 Delano Andrew D Heat sink fin with stator blade
US20070012420A1 (en) * 2005-07-18 2007-01-18 Lin Hsin-Cheng Fixing device for a radiator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060042777A1 (en) * 2004-08-31 2006-03-02 Delano Andrew D Heat sink fin with stator blade
US20070012420A1 (en) * 2005-07-18 2007-01-18 Lin Hsin-Cheng Fixing device for a radiator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD787455S1 (en) * 2015-10-23 2017-05-23 Harman International Industries, Incorporated Loudspeaker heat sink
USD808929S1 (en) * 2016-10-07 2018-01-30 Curtis E. Graber Speaker

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