CN114153165A - Control system and method for cooperation of solid-state power controller and secondary protection device - Google Patents
Control system and method for cooperation of solid-state power controller and secondary protection device Download PDFInfo
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- CN114153165A CN114153165A CN202111336661.8A CN202111336661A CN114153165A CN 114153165 A CN114153165 A CN 114153165A CN 202111336661 A CN202111336661 A CN 202111336661A CN 114153165 A CN114153165 A CN 114153165A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 56
- 238000005070 sampling Methods 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 3
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 3
- 238000009825 accumulation Methods 0.000 claims description 61
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
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- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 230000003044 adaptive effect Effects 0.000 description 3
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- G—PHYSICS
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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Abstract
The invention relates to a control system for matching a solid-state power controller with a secondary protection device, which comprises a power loop and an SSPC module, wherein the power loop comprises an MOS (metal oxide semiconductor) tube, a sampling resistor and a fuse which are sequentially connected in series, and the SSPC module comprises a microprocessor, a driving module, a current acquisition module, a temperature sensor and a temperature acquisition module. And also relates to a control method for the cooperation of the solid-state power controller and the secondary protection device. The invention is applicable to the field of aviation, and intelligent control and protection of loads are realized by adding a secondary protection device, and adding an overcurrent protection self-adaptive adjustment function, a heat dissipation function after turn-off and a method matched with the overcurrent protection self-adaptive adjustment function and the heat dissipation function in a solid-state power controller, so that the reliability of an aircraft power distribution network is improved.
Description
Technical Field
The invention relates to an aviation power distribution system, and belongs to the field of power distribution systems and load control. In particular to a control system and a method for matching a solid-state power controller with a secondary protection device.
Background
The Solid State Power Controller is abbreviated as SSPC (simple State Power Controller) and has been applied to airplanes for decades, the principle of the SSPC is that a DSP (digital signal processor) sends a driving signal to drive a grid of a Power MOSFET (metal-oxide-semiconductor field effect transistor) so as to realize the on-off of the MOSFET, and thus the on-off control is carried out on a load Power loop.
With the development of the aviation industry, the reliability of the SSPC power circuit needs to be improved, it is ensured that the post-stage cable can be protected from being burnt even under the condition that the SSPC overcurrent protection fails, and a secondary protection device fuse is connected in series in the SSPC power circuit, so that the characteristics of the solid-state power controller need to be matched with the characteristics of the series secondary protection device fuse.
Disclosure of Invention
The present invention is directed to solve the above technical problems, and an object of the present invention is to provide a control system and method for a solid state power controller to cooperate with a secondary protection device, so as to improve the safety, reliability and maintainability of a power loop of the solid state power controller, and better protect an aircraft cable.
The technical scheme of the invention is as follows:
the utility model provides a solid state power controller and secondary protection device complex control system, including power return circuit and SSPC module two parts, the power return circuit is including the MOS pipe of establishing ties in proper order, sampling resistor and fuse, the SSPC module includes microprocessor, drive module, current acquisition module, temperature sensor and temperature acquisition module, the temperature through temperature sensor collection fuse, carry out the numerical value conversion back through temperature acquisition module and send for microprocessor, microprocessor gathers the current of sampling resistor based on temperature signal and current acquisition module, judge when to drive module output trip signal, drive module controls the switching of MOS pipe according to trip signal.
The temperature acquisition module is used as a secondary protection device of the control system, the fuse, the temperature sensor and the temperature acquisition module are arranged close to the fuse, and acquired temperature signals are output to the microprocessor through the temperature acquisition module to be subjected to operation processing.
The temperature sensor is characterized in that the temperature sensor is a platinum resistor.
A control method for cooperation of a solid-state power controller and a secondary protection device comprises the following steps:
1) the current collecting module extracts a current sampling value of the sampling resistor and corrects the current sampling value in the microprocessor;
2) the temperature sensor acquires the temperature of the fuse, the temperature is subjected to numerical value conversion through the temperature acquisition module and then is sent to the microprocessor, and the microprocessor filters the temperature acquisition value;
3) the microprocessor judges whether the MOS tube is in a turn-on state, if the MOS tube is in a turn-on state, the step 4) is carried out, and if not, the step 5) is carried out;
4) if the MOS tube is in the on state, entering the over-current protection adjustment process
4.1) the microprocessor judges the temperature acquisition value, and obtains 4 different heat accumulation protection upper limit values by judging which of four ranges of the temperature of less than 30 ℃, 30-50 ℃, 50-70 ℃ and more than 70 ℃;
4.2) according to the read current heat accumulation protection upper limit value, the microprocessor calculates the current heat value and accumulates the current heat value into the total heat, and the heat accumulation frequency is added by 1;
4.3) judging whether the total heat value is greater than the upper heat limit, if so, recording the current heat value, outputting a trip signal to the driving module, closing the MOS (metal oxide semiconductor) tube by the driving module according to the trip signal, and if not, returning to the step 4.2), and accumulating the heat in a new round until the heat value is greater than or equal to the upper heat limit;
5) if the MOS tube is disconnected, the heat dissipation flow after the MOS tube is turned off is started
5.1) the microprocessor filters the temperature acquisition value, then carries out heat conversion on the temperature acquisition value, compensates the converted heat value according to a preset value,
5.2) simultaneously judging whether the MOS tube is in a tripping shutdown state, if so, entering a step 5.3), and if not, entering a step 5.4);
5.3) the microprocessor reads the upper limit value of the heat accumulation protection, calculates the current heat dissipation value, sequentially subtracts the upper limit value of the heat accumulation protection according to the current heat dissipation value, compares the upper limit value of the heat accumulation protection after each subtraction with the heat value compensated in the step 5.1), and if the upper limit value of the heat accumulation protection after the subtraction is smaller than the heat value compensated, the upper limit value of the heat accumulation protection after the subtraction is 105%, the heat dissipation coefficient k is 99%, and the heat dissipation times is added by 1; if the accumulated and subtracted upper limit value of the heat accumulation protection is not less than the compensated heat value, directly adding 1 to the heat dissipation times, judging whether the accumulated and subtracted upper limit value of the heat accumulation protection is less than 1% of the upper limit value of the heat accumulation protection read by the microprocessor or not, if not, returning to the step 5.3) to perform a new round of heat dissipation accumulation subtraction and adjustment, if so, indicating that the heat is basically dissipated completely, resetting the accumulated and subtracted upper limit value of the heat accumulation protection, recording the heat dissipation times, and calculating the heat dissipation time;
5.4) the microprocessor reads a preset normal heat value, performs heat dissipation accumulation and subtraction on the normal heat value, calculates a current heat dissipation value, sequentially performs accumulation and subtraction on the normal heat value according to the current heat dissipation value, compares the normal heat value after each accumulation and subtraction with the heat value compensated in the step 5.1), and if the normal heat value after accumulation and subtraction is smaller than the heat value compensated, the normal heat value after accumulation and subtraction is 105%, and the heat dissipation coefficient k is 99%, and the heat dissipation times is added by 1; if the normal heat value after accumulation is not less than the compensated heat value, directly adding 1 to the heat dissipation times, judging whether the normal heat value after accumulation is less than 20% of the normal heat value read by the microprocessor, if not, returning to the step 5.4) to perform new heat dissipation accumulation and adjustment, if so, indicating that the heat is basically dissipated, resetting the upper limit value of heat accumulation protection after accumulation, recording the heat dissipation times, and calculating the heat dissipation time.
The invention has the beneficial effects that:
the invention is suitable for a solid-state power controller and a control system and a method matched with a secondary protection device, is applied to the field of aviation, and realizes intelligent control and protection of loads and improves the reliability of an airplane power distribution network by adding the secondary protection device, adding an overcurrent protection self-adaptive adjustment function, a heat dissipation function after turn-off and a method matched with the overcurrent protection self-adaptive adjustment function and the heat dissipation function in the solid-state power controller.
Drawings
FIG. 1 is a schematic block diagram of over-current protection adaptive hardware
FIG. 2 is a flow chart of over-current protection adaptation
FIG. 3 is a flowchart of heat dissipation after shutdown
Detailed Description
The connection structure of the present invention will be described in detail with reference to the accompanying drawings and examples.
The first aspect of the method is that the temperature of the secondary protection device is collected and the adaptive adjustment of the over-current protection is carried out according to the temperature collection result, so that the over-current protection of the solid-state power controller can be guaranteed to play a role in priority over the secondary protection device when the power loop is over-current.
The second aspect is a heat dissipation strategy of a simulated secondary protection device of the solid-state power controller, under the condition that the power loop is turned off, the solid-state power controller continues to collect the temperature of the secondary protection device and simulates the heat dissipation process of the secondary protection device to dissipate heat, so that the initial heat of the solid-state power controller is not zero when next overcurrent occurs, and the solid-state power controller can perform trip protection in a shorter time.
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in figure 1, the invention is realized by the hardware schematic block diagram, which comprises a power loop and an SSPC, wherein the power loop comprises an MOS tube and a sampling resistor, a fuse is connected in series in a 28V power loop, and the SSPC comprises a microprocessor, a driving module, a current acquisition module, a temperature sensor and a temperature acquisition module. When the overcurrent phenomenon occurs in the power loop, a current signal acquired through the sampling resistor enters a current acquisition module in the SSPC, the current value after conditioning is sent to the microprocessor after signal conditioning and amplification, I2t heat accumulation is realized in the microprocessor through a software algorithm, a trip signal is output to the driving module after the heat accumulation reaches an upper limit value, and the MOS tube is turned off after the driving module lowers the driving signal. The current value of the temperature sensor is collected to the temperature collection module and the equivalent value is output to the processor, and the processor corrects the heat accumulation upper limit through the collected temperature value so as to achieve the control effect matched with the secondary protection device.
As shown in fig. 2, an adaptive rectification flow chart of overcurrent protection in a processor includes extracting a current sampling value after an algorithm flow starts, then correcting the current sampling value, filtering a temperature collection value, finally judging whether an MOS tube is open, judging a collection temperature if the MOS tube is open, outputting 4 different upper heat accumulation protection limits by judging whether the temperature is less than 30 ℃, whether the temperature is less than 50 ℃, and whether the temperature is less than 70 ℃, then reading the current upper heat accumulation protection limit, calculating a current heat value, accumulating the current heat value into a total heat, adding 1 to the heat accumulation number, judging whether the total heat value is greater than the upper heat limit, recording the current heat value if the total heat value is greater than or equal to the upper heat limit, closing a channel, and calculating protection time after recording the heat accumulation number. If the heat quantity value is smaller than the upper heat quantity limit, returning to the step of calculating the heat quantity, and performing a new round of heat quantity accumulation until the heat quantity value is larger than or equal to the upper heat quantity limit.
And if the MOS tube is in an off state, entering a heat dissipation process after the off state.
As shown in fig. 3, a heat dissipation process after shutdown is simulated in the processor, where after an algorithm starts, filtering is performed on temperature acquisition, then heat conversion is performed on a temperature acquisition value, a heat value is compensated according to a preset value, and at the same time, it is determined whether a shutdown state is a trip shutdown, if the shutdown state is the trip shutdown, after a heat accumulation upper limit value is read, a current heat dissipation value is calculated, the current heat dissipation value is accumulated and reduced to the heat accumulation upper limit value, it is determined whether a total heat value is smaller than the heat conversion value, if the total heat value is smaller than the total heat value, 105% is determined, after a heat dissipation coefficient k is k 99%, the number of heat dissipation times is increased by 1, if the total heat value is not smaller than the heat accumulation upper limit value, the number of heat dissipation times is directly increased by 1, it is determined whether the total heat value is smaller than 1% of the heat accumulation upper limit value, and if the total heat dissipation times are not smaller than the heat dissipation accumulation and adjustment of a new round are returned. If the heat dissipation time is less than the preset value, the simulation heat is basically dissipated completely, the heat value is cleared, the heat dissipation times are recorded, and the heat dissipation time is calculated.
If the current heat value is normally cut off, the current heat value is read to perform heat dissipation accumulation, and the subsequent process is the same as the process after tripping and cutting off.
Claims (8)
1. The utility model provides a solid state power controller and secondary protection device complex control system, including power return circuit and SSPC module two parts, the power return circuit is including the MOS pipe of establishing ties in proper order, sampling resistor and fuse, the SSPC module includes microprocessor, drive module, current acquisition module, temperature sensor and temperature acquisition module, the temperature through temperature sensor collection fuse, carry out the numerical value conversion back through temperature acquisition module and send for microprocessor, microprocessor gathers the current of sampling resistor based on temperature signal and current acquisition module, judge when to drive module output trip signal, drive module controls the switching of MOS pipe according to trip signal.
2. The control system of claim 1, wherein the fuse, the temperature sensor and the temperature acquisition module are used as a secondary protection device of the control system, the temperature sensor is disposed close to the fuse, and the acquired temperature signal is output to the microprocessor through the temperature acquisition module for operation.
3. The control system of claim 2, wherein the temperature sensor is a platinum resistor.
4. A control method implemented by a control system of a solid state power controller cooperating with a secondary protection device according to any of claims 1-3, comprising the steps of:
1) the current collecting module extracts a current sampling value of the sampling resistor and corrects the current sampling value in the microprocessor;
2) the temperature sensor acquires the temperature of the fuse, the temperature is subjected to numerical value conversion through the temperature acquisition module and then is sent to the microprocessor, and the microprocessor filters the temperature acquisition value;
3) the microprocessor judges whether the MOS tube is in a turn-on state, if the MOS tube is in a turn-on state, the step 4) is carried out, and if not, the step 5) is carried out;
4) if the MOS tube is in the on state, entering an overcurrent protection adjustment flow;
5) and if the MOS tube is in an off state, entering a heat dissipation process after the off state.
5. The control method according to claim 4, wherein the step 4) is specifically:
4.1) the microprocessor judges the temperature acquisition value, and obtains different heat accumulation protection upper limit values by judging which range the temperature is in;
4.2) according to the read current heat accumulation protection upper limit value, the microprocessor calculates the current heat value and accumulates the current heat value into the total heat, and the heat accumulation frequency is added by 1;
4.3) judging whether the total heat value is greater than the upper heat limit, if so, recording the current heat value, outputting a trip signal to the driving module, closing the MOS (metal oxide semiconductor) tube by the driving module according to the trip signal, and if not, returning to the step 4.2), and accumulating the heat in a new round until the heat value is greater than or equal to the upper heat limit.
6. The control method according to claim 5, wherein in the step 4.1), the microprocessor judges the temperature collection value, and obtains 4 different upper limit values of heat accumulation protection by judging which temperature is in 4 temperature ranges.
7. The control method according to claim 6, characterized in that said 4 temperature ranges are in particular four ranges less than 30 ℃, 30 ℃ to 50 ℃, 50 ℃ to 70 ℃ and more than 70 ℃.
8. The control method according to claim 7, wherein the step 5) is specifically:
5.1) the microprocessor filters the temperature acquisition value, then carries out heat conversion on the temperature acquisition value, compensates the converted heat value according to a preset value,
5.2) simultaneously judging whether the MOS tube is in a tripping shutdown state, if so, entering a step 5.3), and if not, entering a step 5.4);
5.3) the microprocessor reads the upper limit value of the heat accumulation protection, calculates the current heat dissipation value, sequentially subtracts the upper limit value of the heat accumulation protection according to the current heat dissipation value, compares the upper limit value of the heat accumulation protection after each subtraction with the heat value compensated in the step 5.1), and if the upper limit value of the heat accumulation protection after the subtraction is smaller than the heat value compensated, the upper limit value of the heat accumulation protection after the subtraction is 105%, the heat dissipation coefficient k is 99%, and the heat dissipation times is added by 1; if the accumulated and subtracted upper limit value of the heat accumulation protection is not less than the compensated heat value, directly adding 1 to the heat dissipation times, judging whether the accumulated and subtracted upper limit value of the heat accumulation protection is less than 1% of the upper limit value of the heat accumulation protection read by the microprocessor or not, if not, returning to the step 5.3) to perform a new round of heat dissipation accumulation subtraction and adjustment, if so, indicating that the heat is basically dissipated completely, resetting the accumulated and subtracted upper limit value of the heat accumulation protection, recording the heat dissipation times, and calculating the heat dissipation time;
5.4) the microprocessor reads a preset normal heat value, performs heat dissipation accumulation and subtraction on the normal heat value, calculates a current heat dissipation value, sequentially performs accumulation and subtraction on the normal heat value according to the current heat dissipation value, compares the normal heat value after each accumulation and subtraction with the heat value compensated in the step 5.1), and if the normal heat value after accumulation and subtraction is smaller than the heat value compensated, the normal heat value after accumulation and subtraction is 105%, and the heat dissipation coefficient k is 99%, and the heat dissipation times is added by 1; if the normal heat value after accumulation is not less than the compensated heat value, directly adding 1 to the heat dissipation times, judging whether the normal heat value after accumulation is less than 20% of the normal heat value read by the microprocessor, if not, returning to the step 5.4) to perform new heat dissipation accumulation and adjustment, if so, indicating that the heat is basically dissipated, resetting the upper limit value of heat accumulation protection after accumulation, recording the heat dissipation times, and calculating the heat dissipation time.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117293951A (en) * | 2023-09-06 | 2023-12-26 | 成都华储卡电新能源科技有限公司 | Heavy current protection method and device for discharge MOS tube, medium and electronic equipment |
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| US5854731A (en) * | 1995-07-15 | 1998-12-29 | Smiths Industries Public Limited Company | Electrical apparatus |
| CN1801560A (en) * | 2005-11-17 | 2006-07-12 | 南京航空航天大学 | Multipath solid-state power switch digitized integration controlling method |
| US20080174928A1 (en) * | 2007-01-22 | 2008-07-24 | Honeywell International Inc. | SSPC technology incorporated with thermal memory effects to achieve the fuse curve coordination |
| CN103094875A (en) * | 2012-12-26 | 2013-05-08 | 中国航天时代电子公司 | Solid state power controller based on microcontroller |
| CN104656476A (en) * | 2013-11-20 | 2015-05-27 | 通用电气航空系统有限公司 | Solid State Power Controller For An Aircraft |
| EP3487024A1 (en) * | 2017-11-21 | 2019-05-22 | Hamilton Sundstrand Corporation | Power dissipation monitoring and load management |
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2021
- 2021-11-12 CN CN202111336661.8A patent/CN114153165A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5854731A (en) * | 1995-07-15 | 1998-12-29 | Smiths Industries Public Limited Company | Electrical apparatus |
| CN1801560A (en) * | 2005-11-17 | 2006-07-12 | 南京航空航天大学 | Multipath solid-state power switch digitized integration controlling method |
| US20080174928A1 (en) * | 2007-01-22 | 2008-07-24 | Honeywell International Inc. | SSPC technology incorporated with thermal memory effects to achieve the fuse curve coordination |
| CN103094875A (en) * | 2012-12-26 | 2013-05-08 | 中国航天时代电子公司 | Solid state power controller based on microcontroller |
| CN104656476A (en) * | 2013-11-20 | 2015-05-27 | 通用电气航空系统有限公司 | Solid State Power Controller For An Aircraft |
| EP3487024A1 (en) * | 2017-11-21 | 2019-05-22 | Hamilton Sundstrand Corporation | Power dissipation monitoring and load management |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117293951A (en) * | 2023-09-06 | 2023-12-26 | 成都华储卡电新能源科技有限公司 | Heavy current protection method and device for discharge MOS tube, medium and electronic equipment |
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