CN114150325B - Low-stripping-rate cleaning agent for high-speed electroplating of brass cutting steel wires - Google Patents
Low-stripping-rate cleaning agent for high-speed electroplating of brass cutting steel wires Download PDFInfo
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- CN114150325B CN114150325B CN202111343568.XA CN202111343568A CN114150325B CN 114150325 B CN114150325 B CN 114150325B CN 202111343568 A CN202111343568 A CN 202111343568A CN 114150325 B CN114150325 B CN 114150325B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/19—Iron or steel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a low-stripping-rate cleaning agent for high-speed electroplating of brass cutting steel wires. The low deplating rate cleaning agent comprises 0.5-1 wt% of strong alkaline compound, 0.5-1 wt% of water softener, 0.1-0.5% (PO) m (EO) n polyether and the balance of water, wherein the diameter of the cutting steel wire is 0.025-0.1mm, and the deplating rate is the percentage of the shedding phenomenon of a coating and a base material when the steel wire is bent for ten times. The invention can strengthen the binding force between the plating layer and the matrix and reduce the plating stripping rate of the plating layer.
Description
Technical Field
The invention relates to a low-stripping-rate cleaning agent for high-speed electroplating of brass cutting steel wires, and belongs to the field of continuous plating cleaning of diamond wires.
Background
The diamond wire electroplating belongs to continuous plating, and in order to wrap the diamond wire with the diamond, a thicker nickel plating layer is needed to fix the diamond, so that the plating layer is easy to have overlarge stress, namely poor bonding force (high plating stripping rate); meanwhile, with the development of the prior art, the plating speed of the diamond wire continuous plating is faster and faster, so that the cleaning time is shortened, and the cleaning pollution is caused by the rapid increase of the liquid brought into the previous working procedure by the cleaning tank due to the steel wire, thereby causing poor bonding force between the plating layer and the steel wire brass matrix; in addition, the pH value of the cleaning agent is too large, and the brass plating on the surface of the yellow wire steel wire is easy to corrode, so that the nickel plating and the surface of the yellow wire steel wire are directly electroplated, and the binding force is poor. Currently, the electroplating diamond wire market requires that the deplating rate of electroplating manufacturers must be lower than 5%.
Disclosure of Invention
In view of the above-mentioned drawbacks, an object of the present invention is to provide a low-stripping-rate cleaning agent for high-speed electroplating of brass cutting wires, which can enhance the bonding force between a plating layer and a substrate and reduce the stripping rate of the plating layer.
The technical scheme adopted by the invention is as follows:
the low-deplating-rate cleaning agent for high-speed electroplating of brass cutting steel wires comprises 0.5-1 wt% of a strong alkaline compound, 0.5-1 wt% of a water softener, 0.1-0.5% (PO) m (EO) n polyether and the balance of water, wherein the diameter of the cutting steel wires is 0.025-0.1mm, and the deplating rate is the percentage of the shedding phenomenon of a coating and a base material when the steel wires are bent ten times.
As a further improvement of the above technical scheme, the strong alkaline compound is at least one of sodium hydroxide, potassium hydroxide, trisodium phosphate, sodium carbonate, potassium carbonate, sodium pyrophosphate and potassium pyrophosphate.
As a further improvement of the technical scheme, the viscosity of the low-deplating-rate cleaning agent is less than 1.20 mPs, the conductivity of the cleaning agent is less than 100 mu S/cm, and the pH value is 8-12.
As a further improvement of the technical scheme, the solid content of the low-deplating-rate cleaning agent is less than 2.5 and wt percent.
As a further improvement of the technical scheme, the water softener is at least one of gluconate, benzoate and citrate.
As a further improvement of the technical scheme, the gluconate is at least one of sodium gluconate and potassium gluconate; the benzoate is at least one of benzoic acid, sodium benzoate and potassium benzoate; the citrate is at least one of citric acid, sodium citrate and potassium citrate.
As a further improvement of the technical scheme, m in the (PO) m (EO) n polyether is 1 or 2, and n is any one of 1-9.
The application method of the low-deplating-rate cleaning agent for high-speed electroplating of brass cutting steel wires comprises the steps of using the low-deplating-rate cleaning agent at 50-70 ℃ and soaking for 3-5 s.
The invention has the advantages that:
the invention is used for the high-speed electroplating pretreatment cleaning of the brass cutting steel wire, the lower conductivity and the low solid content can improve the cleaning capability in the high-speed electroplating process, so that the pollution rate of the subsequent washing water is reduced, the cleaning capability is improved, and the water consumption for cleaning is reduced; the low viscosity can reduce the blocking phenomenon of the alkaline washing tank liquid level meter in the continuous electroplating process, greatly improves the binding force of a plating layer and a substrate, and reduces the low deplating.
Detailed Description
The advantages and features of the present invention will become more apparent from the following description of the embodiments, but the scope of the invention is not limited to the following embodiments.
The low-deplating-rate cleaning agent for high-speed electroplating of brass cutting steel wires comprises 0.5-1 wt% of a strong alkaline compound, 0.5-1 wt% of a water softener, 0.1-0.5% (PO) m (EO) n polyether and the balance of water, wherein the diameter of the cutting steel wires is 0.025-0.1mm, and the deplating rate is the percentage of the shedding phenomenon of a coating and a base material when the steel wires are bent ten times.
As a further improvement of the above technical scheme, the strong alkaline compound is at least one of sodium hydroxide, potassium hydroxide, trisodium phosphate, sodium carbonate, potassium carbonate, sodium pyrophosphate and potassium pyrophosphate.
As a further improvement of the technical scheme, the viscosity of the low-deplating-rate cleaning agent is less than 1.20 mPs, the conductivity of the cleaning agent is less than 100 mu S/cm, and the pH value is 8-12.
As a further improvement of the technical scheme, the solid content of the low-deplating-rate cleaning agent is less than 2.5 and wt percent.
As a further improvement of the technical scheme, the water softener is at least one of gluconate, benzoate and citrate.
As a further improvement of the technical scheme, the gluconate is at least one of sodium gluconate and potassium gluconate; the benzoate is at least one of benzoic acid, sodium benzoate and potassium benzoate; the citrate is at least one of citric acid, sodium citrate and potassium citrate.
As a further improvement of the technical scheme, m in the (PO) m (EO) n polyether is 1 or 2, and n is any one of 1-9.
The application method of the low-deplating-rate cleaning agent for high-speed electroplating of brass cutting steel wires comprises the steps of using the low-deplating-rate cleaning agent at 50-70 ℃ and soaking for 3-5 s.
Example 1
A low-deplating rate cleaning agent for high-speed electroplating of brass cutting steel wires comprises the following components in percentage by weight:
sodium hydroxide 0.5wt%
Malic acid 0.5wt%
ST1903{ [(EO) 8 (PO) 2 ]Polyether, hebei Shengshan chemical industry } 0.2wt%
The diamond wire electroplating process is as follows:
cleaning agent: the treatment time is 3s at 50 ℃;
acid washing: 10% hydrochloric acid solution at normal temperature for 5s;
sand coating and preplating: the temperature is 55 ℃, the pH value is 5.5, the electroplating time is 1min, and the cathode current density is 20A/dm 2 The anode current density was 1.2A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The sand-feeding preplating solution A comprises the following components: 500ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate, 30g/L of boric acid and 4g/L of silicon carbide;
thickening plating: the temperature is 60 ℃, the pH value is 4.5, the electroplating time is 0.2min, and the cathode current density is 30A/dm 2 The anode current density was 1.5A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The thickened plating solution B comprises: 550ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate and 40g/L of boric acid;
washing: washing with deionized water;
and (3) drying: the temperature is 120 ℃ and the time is 1 s;
folding detection: folded in half for 10 times.
Example 2
A low-deplating rate cleaning agent for high-speed electroplating of brass cutting steel wires comprises the following components in percentage by weight:
trisodium phosphate 1wt%
Sodium gluconate 0.5wt%
LS114{ [(EO) 9 (PO) 1 ]Polyether, japanese flower king 0.5wt%
The diamond wire electroplating process is as follows:
cleaning agent: the treatment time is 3s at 60 ℃;
acid washing: 10% hydrochloric acid solution at normal temperature for 5s;
sand coating and preplating: the temperature is 55 ℃, the pH value is 5.5, the electroplating time is 1min, and the cathode current density is 20A/dm 2 The anode current density was 1.2A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The sand-feeding preplating solution A comprises the following components: 500ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate, 30g/L of boric acid and 4g/L of silicon carbide;
thickening plating: the temperature is 60 ℃, the pH value is 4.5, the electroplating time is 0.2min, and the cathode current density is 30A/dm 2 The anode current density was 1.5A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The thickened plating solution B comprises the following components: 550ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate and 40g/L of boric acid;
washing: washing with deionized water;
and (3) drying: the temperature is 120 ℃ and the time is 1 s;
folding detection: folded in half for 10 times.
Example 3
A low-deplating rate cleaning agent for high-speed electroplating of brass cutting steel wires comprises the following components in percentage by weight:
potassium pyrophosphate 0.5wt%
Potassium citrate 1wt%
MSC{ [(EO) 5 (PO) 2 ]Polyether, japanese flower king })0.1wt%
The diamond wire electroplating process is as follows:
cleaning agent: the treatment time is 3s at 70 ℃;
acid washing: 10% hydrochloric acid solution at normal temperature for 5s;
sand coating and preplating: the temperature is 55 ℃, the pH value is 5.5, the electroplating time is 1min, and the cathode current density is 20A/dm 2 The anode current density was 1.2A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The sand-feeding preplating solution A comprises the following components: 500ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate, 30g/L of boric acid and 4g/L of silicon carbide;
thickening plating: the temperature is 60 ℃, the pH value is 4.5, the electroplating time is 0.2min, and the cathode current density is 30A/dm 2 The anode current density was 1.5A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The thickened plating solution B comprises the following components: 550ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate and 40g/L of boric acid;
washing: washing with deionized water;
and (3) drying: the temperature is 120 ℃ and the time is 1 s;
folding detection: folded in half for 10 times.
Comparative example 1
Trisodium phosphate 1wt%
Sodium gluconate 10wt%
MSC{ [(EO) 5 (PO) 2 ]Polyether, japanese flower king } 5wt%
The diamond wire electroplating process is as follows:
cleaning agent: the treatment time is 3s at 70 ℃;
acid washing: 10% hydrochloric acid solution at normal temperature for 5s;
sand coating and preplating: the temperature is 55 ℃, the pH value is 5.5, the electroplating time is 1min, and the cathode current density is 20A/dm 2 The anode current density was 1.2A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The sand-feeding preplating solution A comprises the following components: 500ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate, 30g/L of boric acid and 4g/L of silicon carbide;
thickening plating: the temperature is 60 ℃, the pH value is 4.5, the electroplating time is 0.2min, and the cathode current density is 30A/dm 2 The anode current density was 1.5A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The thickened plating solution B comprises the following components: nickel sulfamate 550ml/L, hexahydrate10g/L of nickel chloride and 40g/L of boric acid;
washing: washing with deionized water;
and (3) drying: the temperature is 120 ℃ and the time is 1 s;
folding detection: folded in half for 10 times.
Comparative example 2
Potassium hydroxide 1wt%
Sodium citrate 1wt%
Sodium dodecyl benzene sulfonate 0.5wt%
The diamond wire electroplating process is as follows:
cleaning agent: the treatment time is 3s at 70 ℃;
acid washing: 10% hydrochloric acid solution at normal temperature for 5s;
sand coating and preplating: the temperature is 55 ℃, the pH value is 5.5, the electroplating time is 1min, and the cathode current density is 20A/dm 2 The anode current density was 1.2A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The sand-feeding preplating solution A comprises the following components: 500ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate, 30g/L of boric acid and 4g/L of silicon carbide;
thickening plating: the temperature is 60 ℃, the pH value is 4.5, the electroplating time is 0.2min, and the cathode current density is 30A/dm 2 The anode current density was 1.5A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The thickened plating solution B comprises the following components: 550ml/L of nickel sulfamate, 10g/L of nickel chloride hexahydrate and 40g/L of boric acid;
washing: washing with deionized water;
and (3) drying: the temperature is 120 ℃ and the time is 1 s;
folding detection: folded in half for 10 times.
Table 1 shows the results of the plating removal rate test
The above examples are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above examples, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principle of the present invention should be made in the equivalent manner, and the embodiments are included in the protection scope of the present invention.
Claims (2)
1. The low-deplating-rate cleaning agent for high-speed electroplating of brass cutting steel wires is characterized by comprising 0.5-1 wt% of a strong alkaline compound, 0.5-1 wt% of a water softener, 0.1-0.5% (PO) m (EO) n polyether and the balance of water, wherein the diameter of the cutting steel wires is 0.025-0.1mm, and the deplating rate is the percentage of the shedding phenomenon of a coating and a base material when the steel wires are bent for ten times; the strong alkaline compound is at least one of sodium hydroxide, potassium hydroxide, trisodium phosphate, sodium carbonate, potassium carbonate, sodium pyrophosphate and potassium pyrophosphate; the viscosity of the low-deplating-rate cleaning agent is less than 1.20 mPas, the conductivity of the cleaning agent is less than 100 mu S/cm, and the pH value is 8-12; the solid content of the low-deplating-rate cleaning agent is less than 2.5 and wt percent; the water softener is at least one of gluconate, benzoate and citrate; the gluconate is at least one of sodium gluconate and potassium gluconate; the benzoate is at least one of benzoic acid, sodium benzoate and potassium benzoate; the citrate is at least one of citric acid, sodium citrate and potassium citrate; and (PO) m (EO) n polyether, wherein m is 1 or 2, and n is any one of 1-9.
2. The method for using the low-stripping-rate cleaning agent for high-speed electroplating of brass cutting wires, which is characterized in that the use temperature of the low-stripping-rate cleaning agent is 50-70 ℃ and the soaking time is 3-5 s.
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| CN114150325B true CN114150325B (en) | 2023-09-29 |
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| CN105331472A (en) * | 2015-11-20 | 2016-02-17 | 金川集团股份有限公司 | Alkaline electrolytic cleaning agent and cleaning method for electroplated parts |
| CN107488861A (en) * | 2017-09-08 | 2017-12-19 | 武汉钢铁有限公司 | A kind of electrogalvanizing pre-treatment alkali electroless cleaning agent |
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| CN108517529A (en) * | 2018-06-27 | 2018-09-11 | 武汉钢铁有限公司 | A kind of aluminum-zinc alloy Coil Coating Products pre-treatment alkali electroless cleaning agent |
| CN110218994A (en) * | 2019-07-17 | 2019-09-10 | 高特(江苏)新材料有限公司 | A kind of manufacturing method of high efficiency cutting silicon wafer diamond wire |
| CN112410832A (en) * | 2020-11-18 | 2021-02-26 | 中钢集团郑州金属制品研究院有限公司 | Electrochemical copper plating process for steel wire |
-
2021
- 2021-11-13 CN CN202111343568.XA patent/CN114150325B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1036895A (en) * | 1996-07-30 | 1998-02-10 | Mitsubishi Materials Corp | Water-base degreasing detergent |
| CN103930614A (en) * | 2011-11-15 | 2014-07-16 | 株式会社普利司通 | Method for manufacturing brass-plated steel wire and brass-plated steel wire |
| CN104451505A (en) * | 2014-10-30 | 2015-03-25 | 江苏兴达钢帘线股份有限公司 | Brass-plating process of pearlite steel wires |
| CN105331472A (en) * | 2015-11-20 | 2016-02-17 | 金川集团股份有限公司 | Alkaline electrolytic cleaning agent and cleaning method for electroplated parts |
| CN107488861A (en) * | 2017-09-08 | 2017-12-19 | 武汉钢铁有限公司 | A kind of electrogalvanizing pre-treatment alkali electroless cleaning agent |
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