CN114149758B - Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard - Google Patents
Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard Download PDFInfo
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- CN114149758B CN114149758B CN202111578043.4A CN202111578043A CN114149758B CN 114149758 B CN114149758 B CN 114149758B CN 202111578043 A CN202111578043 A CN 202111578043A CN 114149758 B CN114149758 B CN 114149758B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a low-shrinkage ultrathin adhesive tape, a preparation method thereof and a keyboard. This ultra-thin sticky tape of low shrink is including substrate layer, glue film, the release film that sets gradually, wherein: the material of the base material layer is black polyethylene terephthalate with the heat shrinkage rate MD at 150 ℃ not higher than 0.15%. The invention also relates to a preparation method of the low-shrinkage ultrathin adhesive tape and a keyboard adopting the adhesive tape. The low-shrinkage ultrathin adhesive tape provided by the invention can play a role in shading, insulating and isolating, can gather light sources sent out by LEDs below a flexible circuit board of a keyboard, and can prevent the side leakage of the light sources to reduce the brightness of the LEDs.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to a low-shrinkage ultrathin adhesive tape, a preparation method thereof and a keyboard.
Background
A flexible circuit board (FPC) is arranged below a keyboard of a notebook computer, polyethylene terephthalate or polyimide is generally used as a base material, and a circuit design is embedded on a bendable light and thin plastic sheet, so that a bendable flexible circuit is formed, and the circuit can be bent at will, folded, light in weight, small in size, good in heat dissipation and convenient to install.
In order to avoid that the keyboard can be seen clearly at night under the condition of darker light, the notebook computer and the like can be provided with the LED light source below the keyboard, but the light is easy to leak from the edges of the keys to be processed due to gaps between the keys and the keyboard substrate, so that loss is caused, and the brightness of a normal light-emitting area is affected.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide an ultrathin adhesive tape which can be attached to a flexible circuit board of a notebook computer and can prevent side leakage of a light source from reducing the brightness of an LED.
In order to achieve the above objective, the present invention firstly provides a low shrinkage ultrathin adhesive tape, which comprises a substrate layer, an adhesive layer and a release film, wherein the substrate layer, the adhesive layer and the release film are sequentially arranged, and the adhesive layer comprises:
the material of the base material layer is black polyethylene terephthalate with the heat shrinkage rate MD at 150 ℃ not higher than 0.15%.
According to a specific embodiment of the present invention, preferably, the black polybutylene terephthalate has a TD of not more than 0.04%.
According to a specific embodiment of the present invention, preferably, the black polyethylene terephthalate is a black polyethylene terephthalate subjected to two precondensations;
more preferably, the pre-shrinking is performed by:
the black polyethylene terephthalate is sent into a baking oven for baking, the baking oven is divided into 6 sections, the length of each section is 5 meters, the temperature of the 6 sections is 110 ℃,150 ℃, 180 ℃, 200 ℃, 160 ℃, 100 ℃ and the conveyor speed is controlled to be about 20 meters/min, and one-time pre-shrinkage is completed; the process is repeated to complete the pre-shrinking twice.
According to a specific embodiment of the present invention, in the low shrinkage ultrathin adhesive tape described above, the thickness of the base material layer is preferably 20 μm or more, more preferably 25 μm.
According to a specific embodiment of the present invention, preferably, in the low shrinkage ultrathin adhesive tape, the material of the adhesive layer meets the following conditions: initial adhesion of the rolling ball is #16-25, the adhesive force is 24h more than or equal to 1.5Kg, the high-temperature holding power of 150 ℃ is lower than 1mm, and the softening temperature is above 150 ℃; more preferably, the adhesive layer is made of an adhesive S19 (acrylic adhesive).
According to a specific embodiment of the present invention, preferably, in the low shrinkage ultrathin adhesive tape described above, the thickness of the adhesive layer is 25 μm.
According to a specific embodiment of the present invention, preferably, in the low shrinkage ultrathin adhesive tape described above, the thickness of the release film is 75 μm.
According to a specific embodiment of the present invention, preferably, the sum of the thicknesses of the base material layer and the adhesive layer of the low shrinkage ultrathin adhesive tape is 0.05mm.
The invention also provides a preparation method of the low-shrinkage ultrathin adhesive tape, which comprises the following steps:
coating an adhesive on the surface of the release film to form an adhesive layer, and then compositing the adhesive layer with a substrate layer to obtain a semi-finished adhesive tape;
baking the semi-finished product of the adhesive tape to obtain the low-shrinkage ultrathin adhesive tape;
wherein, the oven adopted for baking has total 6 sections from the inlet to the outlet, the length of each section is 5m, the temperature of the 6 sections is 70 ℃, 85 ℃, 115 ℃, 120 ℃ and 70 ℃ in sequence, and the conveying speed of the semi-finished adhesive tape is 25m/min.
After the preparation process is completed, the low shrinkage ultrathin adhesive tape can be subjected to hot-pressing relief design.
According to a specific embodiment of the present invention, preferably, in the above preparation method, when the release layer with the adhesive layer is compounded with the substrate layer, the dyne value of the substrate layer is not lower than 52.
According to a specific embodiment of the present invention, preferably, the preparation method further comprises a step of curing the semi-finished tape product at 45 ℃ for 24 hours before baking.
The invention also provides a keyboard, wherein the surface of the flexible circuit board of the keyboard is attached with the low-shrinkage ultrathin adhesive tape.
According to the specific embodiment of the invention, the low-shrinkage ultrathin adhesive tape is adhered on the flexible circuit board and only exposes the keyboard keys.
The low-shrinkage ultrathin adhesive tape provided by the invention can play a role in shading, insulating and isolating, can gather light sources sent out by LEDs below a flexible circuit board of a keyboard, and can prevent the side leakage of the light sources to reduce the brightness of the LEDs.
The low-shrinkage ultrathin adhesive tape provided by the invention can be wrapped along the edges of keys of a keyboard, can be provided with a hot-pressing embossment design, can perfectly wrap individual protruding parts, ensures overall attractive appearance, can meet the high-temperature process of 120 ℃ multiplied by 8min at the rear section, and does not cause tilting or curling to influence subsequent processing and assembly.
Detailed Description
The technical solution of the present invention will be described in detail below for a clearer understanding of technical features, objects and advantageous effects of the present invention, but should not be construed as limiting the scope of the present invention.
Selection of material for substrate layer
The material of the substrate layer is compared, and a hot-press embossing formability experiment is carried out, and the hot-press embossing formability experiment is specifically shown in table 1:
TABLE 1 comparison of substrate layer materials
The hot-pressing embossment is judged by visual observation, and whether the edges of the shape pressed by the object are clear and neat or whether collapse exists or not is mainly judged.
From the experimental results in table 1, it can be seen that: polyimide is the best in the performance parts such as electric insulation, temperature resistance, thermal shrinkage and the like, but the hot-press embossing is difficult due to the fact that the material strength is too high and the thermoplasticity is low. In the overall aspect, polyethylene terephthalate is a preferred substrate layer material for its performance.
High temperature process contrast test
The test is used for confirming whether the substrate layer can meet the high-temperature process requirement of 120 ℃ multiplied by 8min after being attached to the FPC, and whether the substrate layer can reach the condition of no warping and no curling after the high-temperature process.
1. The FPC and the black polyethylene terephthalate with glue are attached to form a semi-finished product, the semi-finished product is kept stand for 24 hours at normal temperature, then the semi-finished product is sent to an oven with an iron mesh conveying belt for baking, the temperature is set to 120 ℃ for 8 minutes, after baking is finished, the local area of the semi-finished product is seriously curled, the part of the semi-finished product corresponding to the rectangular keyboard is only lifted (280 mm multiplied by 115 mm), and the part of the semi-finished product, which is positioned at a strip interface (99 mm multiplied by 25 mm) above the keyboard part, is seriously curled. The strip interface is a handle or grip designed for back end processing outside the keyboard portion, which is severely curled and would severely affect the back end processing.
2. Different black polyethylene terephthalate was selected for further heat shrinkage test, and the different materials were placed in an environment of 120 ℃ and 150 ℃ for 30min, respectively, and the heat shrinkage and temperature resistance performance were tested, and the test results are shown in table 2.
TABLE 2 thermal shrinkage test results
The test shows that: when the black polyethylene terephthalate and the adherend FPC were tested alone, the test results were all flat and no abnormality was found, but if the two were combined, the result was curling.
3. Different types of black polyethylene terephthalate are selected for experiments, and the temperature resistance and the heat shrinkage rate of the black polyethylene terephthalate are mainly compared, specifically, different materials are respectively placed in an environment of 120 ℃ and 150 ℃ for 30min, the heat shrinkage rate and the temperature resistance performance of the black polyethylene terephthalate are tested, and the experimental results are shown in table 3.
TABLE 3 test results of temperature resistance and Heat shrinkage
Wherein the pre-shrinking is performed in the following manner: the black polyethylene terephthalate is sent into a baking oven for baking, the baking oven is divided into 6 sections, the length of each section is 5 meters, the temperature of the 6 sections is 110 ℃,150 ℃, 180 ℃, 200 ℃, 160 ℃, 100 ℃ in sequence, and the conveyor speed is controlled to be about 20 meters/min.
The pre-shrinking once means that the above process is performed once, and the pre-shrinking twice means that the above process is performed twice.
4. Different types of black polyethylene terephthalate are selected to be attached to the FPC, kept stand for 24 hours at normal temperature, then sent to an oven with an iron net conveying belt for baking, the temperature is set at 120 ℃ for 10 minutes, and simultaneously placed at different temperatures for 10 minutes respectively for baking, and the temperature resistance performance of the black polyethylene terephthalate is tested. The experimental results are shown in table 4.
TABLE 4 thermal resistance test results of different types of black polyethylene terephthalate and FPC bonding
From the test results in table 4, it can be seen that: a black polyethylene terephthalate film pre-shrunk only twice can be matched to the FPC. The heat shrinkage rate of the black polyethylene terephthalate which is pre-shrunk twice is MD0.15 percent at 150 ℃, the heat shrinkage rate of the adhered FPC at 150 ℃ is MD0.09 percent, the difference between the two is only 0.06 percent (or <0.1 percent), and the flatness after combination shows the best. Thus, combining the two can solve the curling problem.
Furthermore, from the simulation experiments, the baking and curling result of the practical application process can be simulated when the temperature of the oven reaches 150 ℃, and the thermal influence of the material in the baking of the practical production process can be judged to be larger. Mainly results are different due to different equipment; the general experimental oven is square space, hot air circulation is adopted, and a circulation port can not directly blow materials; the oven of the actual production process is low in height, wide in width and narrow in making the hot air port located above and directly affecting the blowing of materials greatly, and the iron frame conveying belt makes the actual temperature of the materials higher than 120 ℃. Therefore, the material selected for the FPC should have a temperature resistance of higher than 120 ℃.
Based on the above experimental results, the material of the base material layer is black polyethylene terephthalate subjected to a secondary high-temperature pre-shrinking process, namely, black polyethylene terephthalate with the heat shrinkage rate of 150 ℃ not higher than 0.15% of MD.
Determination of substrate thickness
Aiming at the thickness of the base material, the invention takes the hot-pressing embossment process as a main index, and the hot-pressing embossment can be molded by requiring a certain stiffness and thickness. The thickness of the base material is more than or equal to 0.02mm, and the hot-pressing relief process can be satisfied.
Comparative test of adhesive
Comparative tests were performed on different types of adhesives and the results are shown in table 5.
TABLE 5 results of Performance test of different adhesives
Wherein the adhesive SR37 is manufactured by Adhesives Inc. of Texad;
adhesives SR17 and S21 are manufactured by tuina adhesive products limited;
the adhesive S19 is produced by Kunshan plum new material science and technology Co., ltd;
the adhesive SR52-3 is produced by Dongguan macro stone functional material science and technology Co., ltd;
adhesive S35 is manufactured by tuina adhesive products limited.
According to the test results shown in Table 5, the adhesives SR17 and SR52-3 are excellent in initial adhesion and adhesion, but are prone to delamination risk, so that the adhesives SR37, S19, S21 and S35 are relatively good in performance, and the following problems of the keyboard can be well solved by adopting the four adhesives: first, the keyboard itself has a plurality of bare areas, and the area of pasting that significantly reduces, stickness part needs to strengthen by an emphasis. Secondly, the hot-pressed relief part is bare, when the hot-pressed relief part is baked at high temperature in the production process, the air wrapped inside expands due to heating, and then is pressurized on the adhesive layers on four sides, so that the phenomenon of 'air passage' or air inlet occurs on the adhesive layers, and the high-temperature cohesive force part needs to be emphasized.
Further tests were performed on adhesives SR37, S19, S21, S35: the adhesive was coated on the surface of the pre-shrunk secondary black polyethylene terephthalate, the thickness of the adhesive layer was controlled to be 0.025mm (25 μm), and then the adhesive layer was attached to the FPC, and the relevant test was performed, and the specific test results are shown in table 6.
TABLE 6
RT refers to room temperature and NG refers to poor effect.
From the above experimental results, it can be seen that the S19 result is optimal. Since the adhesion and cohesion of SR37 and S21 are slightly lower than S19, air intake starts at the edge of the hot-pressed relief after a long period of time. While S35 is excellent in heat resistance and heat retention, insufficient adhesion does not satisfy adhesion, and delamination occurs immediately after a long period of time.
The S19 is adopted as an adhesive, and the thickness of the adhesive layer is controlled to be less than or equal to 0.025mm, so that the technical problem that adhesive overflows easily during die cutting processing caused by the fact that the keyboard is designed with multiple holes and the edges are thin can be solved.
After confirming that the thickness of the adhesive layer is 0.025mm, the thickness of the base material secondary pre-shrinking black polyethylene terephthalate is preferably set to 0.025mm, and the total thickness is controlled to be in the range of 0.05mm which is preferable for application.
The preparation method comprises the following steps:
in order to maintain the dimensional stability of the substrate secondary pre-polycondensation ethylene terephthalate, the invention adopts transfer coating production, and the adhesive is coated on a substrate release film and transferred onto the substrate at the coating tail. The PET substrate should have a dyne value of 52 or greater during the transfer process to ensure optimal adhesion of the glue to the substrate.
The oven temperature is controlled to be 70 ℃, 85 ℃, 115 ℃, 120 ℃ and 70 ℃ and the machine speed is controlled to be 25M/min, and the curing energy of the glue is sufficient under the high-temperature/slow-speed production condition, so that the molecular chains can be fully cured, and the colloid reaction is more complete. After the coating is completed, the substrate and the glue can be cured for 24 hours at 45 ℃ to consolidate the integrity of the whole curing of the substrate and the glue, and then baked.
Examples
The embodiment provides a low shrinkage ultrathin adhesive tape, it includes substrate layer, glue film, the release film that sets gradually, wherein:
the material of the base material layer is black polyethylene terephthalate with secondary pre-shrinking, and the heat shrinkage rate of 150 ℃ is MD0.15% and TD0.04%;
the adhesive layer is made of adhesive S19, the thickness of the adhesive layer is 0.025mm, the adhesive force is 24h more than or equal to 1.5Kg, the high-temperature holding power of 150 ℃ slides downwards by less than 1mm, and the softening temperature is at least 150 ℃;
the release film is a conventional release film.
The semi-finished product obtained by bonding the secondary pre-shrinking black polyethylene terephthalate as the material of the substrate layer with FPC (150 ℃ heat shrinkage rate MD0.09% and TD 0.02%) has good die cutting processability, and 5000-6000 times of micro-glue overflow is not sticky; after the hot-pressing relief process is carried out, standing is not less than 72H, and no air is introduced or layering is carried out; the material is baked at a high temperature of 120 ℃ for 8min, no air is introduced, no layering exists, and the material is flat (the end part is tilted to be less than 3 mm).
Claims (9)
1. The utility model provides a low shrinkage ultrathin adhesive tape, its includes substrate layer, glue film, release film that sets gradually, wherein:
the thickness of the substrate layer is more than 20 mu m, the substrate layer is made of black polyethylene terephthalate with the heat shrinkage rate MD at 150 ℃ not higher than 0.15%, and the TD of the black polybutylene terephthalate is not higher than 0.04%;
the black polyethylene terephthalate with the heat shrinkage rate MD at 150 ℃ not higher than 0.15% is black polyethylene terephthalate subjected to two pre-shrinking;
the adhesive layer is made of an adhesive S19;
the pre-shrinking is performed by:
the black polyethylene terephthalate is sent into a baking oven for baking, the baking oven is divided into 6 sections, the length of each section is 5 meters, the temperature of the 6 sections is 110 ℃,150 ℃, 180 ℃, 200 ℃, 160 ℃, 100 ℃ and the conveyor speed is controlled to be 20 meters/min, and one-time pre-shrinkage is completed; the process is repeated to complete the pre-shrinking twice.
2. The low shrinkage ultrathin tape of claim 1, wherein the thickness of the substrate layer is 25 μιη.
3. The low shrinkage ultrathin tape as in claim 1, wherein the thickness of the adhesive layer is 25 μιη.
4. The low shrinkage ultrathin tape of claim 1, wherein the release film has a thickness of 75 μιη.
5. The low shrinkage ultrathin tape as in claim 1, wherein the sum of the thicknesses of the substrate layer and the adhesive layer of the low shrinkage ultrathin tape is 0.05mm.
6. The method for preparing a low shrinkage ultrathin adhesive tape according to any one of claims 1-5, comprising the following steps:
coating an adhesive S19 on the surface of the release film to form a glue layer, and then compounding the glue layer with a substrate layer to obtain a semi-finished product of the adhesive tape;
baking the semi-finished product of the adhesive tape to obtain the low-shrinkage ultrathin adhesive tape;
wherein, the oven adopted for baking has total 6 sections from the inlet to the outlet, the length of each section is 5m, the temperature of the 6 sections is 70 ℃, 85 ℃, 115 ℃, 120 ℃ and 70 ℃ in sequence, and the conveying speed of the semi-finished adhesive tape is 25m/min.
7. The method according to claim 6, wherein the substrate layer has a dyne value of not less than 52 when the release film with the subbing layer is combined with the substrate layer.
8. The method according to claim 6, wherein the method further comprises a step of curing the semi-finished tape product at 45 ℃ for 24 hours before baking.
9. A keyboard, wherein the surface of a flexible circuit board of the keyboard is attached with the low shrinkage ultrathin adhesive tape according to any one of claims 1-5.
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| CN114149758B true CN114149758B (en) | 2023-08-15 |
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| CN112457791A (en) * | 2020-12-09 | 2021-03-09 | 江苏日久光电股份有限公司 | High-temperature-resistant protective film, preparation process thereof and ITO conductive film |
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2021
- 2021-12-22 CN CN202111578043.4A patent/CN114149758B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001332132A (en) * | 2000-05-22 | 2001-11-30 | Nitto Denko Corp | Transparent conductive film having protective film and its usage method |
| CN202626083U (en) * | 2012-03-31 | 2012-12-26 | 常州宏巨电子科技有限公司 | Shading adhesive tape |
| JP2015072903A (en) * | 2012-12-07 | 2015-04-16 | 日東電工株式会社 | Laminate |
| CN106575081A (en) * | 2014-06-03 | 2017-04-19 | 富林特集团德国有限公司 | Flexographic printing elements capable of being dried rapidly |
| WO2018043155A1 (en) * | 2016-08-30 | 2018-03-08 | 東レフィルム加工株式会社 | Protective film and laminated film |
| CN108841335A (en) * | 2018-05-30 | 2018-11-20 | 宁波科莱恩新材料科技有限公司 | A kind of black shading rubber belt and preparation method thereof |
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| CN114149758A (en) | 2022-03-08 |
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