CN114149758A - Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard - Google Patents
Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard Download PDFInfo
- Publication number
- CN114149758A CN114149758A CN202111578043.4A CN202111578043A CN114149758A CN 114149758 A CN114149758 A CN 114149758A CN 202111578043 A CN202111578043 A CN 202111578043A CN 114149758 A CN114149758 A CN 114149758A
- Authority
- CN
- China
- Prior art keywords
- shrinkage
- low
- adhesive tape
- adhesive
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a low-shrinkage ultrathin adhesive tape, a preparation method thereof and a keyboard. This ultra-thin sticky tape of low shrink is including substrate layer, glue film, the release film that sets gradually, wherein: the base material layer is made of black polyethylene terephthalate with the heat shrinkage rate MD not higher than 0.15% at 150 ℃. The invention also relates to a preparation method of the low-shrinkage ultrathin adhesive tape and a keyboard adopting the adhesive tape. The low-shrinkage ultrathin adhesive tape provided by the invention can play a role in shading, insulating and isolating, can collect light sources sent by LEDs below a keyboard flexible circuit board, and can prevent the light sources from leaking laterally to reduce the brightness of the LEDs.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to a low-shrinkage ultrathin adhesive tape, a preparation method thereof and a keyboard.
Background
The Flexible Printed Circuit (FPC) is arranged below the keyboard of the notebook computer, generally, polyethylene glycol terephthalate or polyimide is used as a base material, and a circuit design is embedded in a bendable light and thin plastic sheet, so that a bendable flexible circuit is formed, and the circuit can be bent and folded at will, and is light in weight, small in size, good in heat dissipation performance and convenient to install.
In order to avoid the situation that the keyboard can be clearly seen at night and in the dark, the LED light source is arranged below the keyboard for the notebook computer and the like, but because a gap exists between the keys and the keyboard substrate, light is easy to leak from the edges of the keys to be processed, so that loss is caused, and the brightness of a normal light-emitting area is influenced.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide an ultra-thin adhesive tape, which can be attached to a flexible circuit board of a notebook computer, and can prevent light source side leakage from reducing LED brightness.
In order to achieve the above object, the present invention firstly provides a low-shrinkage ultrathin adhesive tape, which comprises a substrate layer, an adhesive layer, and a release film, wherein:
the base material layer is made of black polyethylene terephthalate with the heat shrinkage rate MD not higher than 0.15% at 150 ℃.
According to a specific embodiment of the present invention, preferably, the TD of the black polybutylene terephthalate is not higher than 0.04%.
According to a specific embodiment of the present invention, preferably, the black polyethylene terephthalate is black polyethylene terephthalate that has undergone two pre-shrinkages;
more preferably, the pre-shrinking is performed by:
feeding black polyethylene terephthalate into an oven for baking, wherein the oven is divided into 6 sections, the length of each section is 5 meters, the temperature of each section is 110 ℃, 150 ℃, 180 ℃, 200 ℃, 160 ℃ and 100 ℃ in sequence, and the speed of a conveyor is controlled to be about 20 meters per minute, so as to finish primary pre-shrinkage; this process was repeated to complete two pre-shrinkages.
According to a specific embodiment of the present invention, in the low-shrinkage ultrathin adhesive tape, the thickness of the base material layer is preferably 20 μm or more, and more preferably 25 μm.
According to a specific embodiment of the present invention, preferably, in the low-shrinkage ultrathin adhesive tape, a material of the adhesive layer satisfies the following condition: the initial adhesion of the rolling ball is #16-25, the adhesion force is more than or equal to 1.5Kg for 24 hours, the rolling ball slips less than 1mm under the high-temperature retention force of 150 ℃, and the softening temperature is more than 150 ℃; more preferably, the material of the adhesive layer is adhesive S19 (acrylic adhesive).
According to a specific embodiment of the present invention, preferably, in the above low-shrinkage ultrathin adhesive tape, the thickness of the adhesive layer is 25 μm.
According to a specific embodiment of the present invention, preferably, in the above low-shrinkage ultrathin adhesive tape, the thickness of the release film is 75 μm.
According to the specific embodiment of the present invention, preferably, the sum of the thicknesses of the substrate layer and the subbing layer of the low-shrinkage ultrathin adhesive tape is 0.05 mm.
The invention also provides a preparation method of the low-shrinkage ultrathin adhesive tape, which comprises the following steps:
coating an adhesive on the surface of a release film to form an adhesive layer, and then compounding the adhesive layer with a base material layer to obtain a semi-finished adhesive tape;
baking the semi-finished adhesive tape to obtain the low-shrinkage ultrathin adhesive tape;
wherein, the oven used for baking is 6 sections from the entrance to the exit, the length of each section is 5 meters, the temperature of the 6 sections is 70 ℃, 85 ℃, 115 ℃, 120 ℃ and 70 ℃ in sequence, and the conveying speed of the semi-finished product of the adhesive tape is 25 m/min.
After the preparation process is completed, the low-shrinkage ultrathin adhesive tape can be subjected to hot-pressing embossing design.
According to the specific embodiment of the present invention, preferably, in the above preparation method, when the release layer with the adhesive layer is combined with the substrate layer, the dyne value of the substrate layer is not lower than 52.
According to a specific embodiment of the present invention, preferably, the preparation method further comprises a step of curing the adhesive tape semi-finished product at 45 ℃ for 24 hours before baking.
The invention also provides a keyboard, wherein the surface of the flexible circuit board of the keyboard is attached with the low-shrinkage ultrathin adhesive tape provided by the invention.
According to the specific embodiment of the invention, the low-shrinkage ultrathin adhesive tape is attached to the flexible circuit board and only exposes the keyboard keys.
The low-shrinkage ultrathin adhesive tape provided by the invention can play a role in shading, insulating and isolating, can collect light sources sent by LEDs below a keyboard flexible circuit board, and can prevent the light sources from leaking laterally to reduce the brightness of the LEDs.
The low-shrinkage ultrathin adhesive tape provided by the invention can be wrapped along the edge of a keyboard key, can be provided with a hot-pressing embossment design, can perfectly wrap individual protruding parts, ensures the integral attractiveness, can meet the requirement of a high-temperature process at the rear section of 120 ℃ for 8min, and cannot be warped or curled to influence subsequent processing and assembly.
Detailed Description
The technical solutions of the present invention will be described in detail below in order to clearly understand the technical features, objects, and advantages of the present invention, but the present invention is not limited to the practical scope of the present invention.
Selection of material for substrate layer
The invention compares the material of the substrate layer, and carries out the hot-pressing relief formability test, which is shown in the following table 1:
TABLE 1 comparison of substrate layer materials
The judgment of the hot-pressing embossment is based on visual observation, and whether the edge of the extruded shape of the real object is clear and neat or whether the real object has collapse is mainly seen.
As can be seen from the experimental results of table 1: polyimide is the best in the performance parts of electrical insulation, temperature resistance, thermal shrinkage and the like, but the hot-pressing relief forming is difficult because the material strength is too high and the thermoplasticity is low. In view of the overall appearance, polyethylene terephthalate is preferable in all aspects, and is a preferable material for the base material layer.
High temperature process contrast test
The test is used for confirming whether the high-temperature process requirement of 120 ℃ multiplied by 8min can be met after the base material layer is attached to the FPC, and whether the high-temperature process is not tilted and curled can be achieved.
1. The FPC and the black polyethylene glycol terephthalate with the adhesive are attached to prepare a semi-finished product, the semi-finished product is kept stand for 24 hours at normal temperature, then the semi-finished product is sent into an oven with an iron net conveying belt to be baked, the temperature is set to be 120 ℃, the time is 8 minutes, after the baking is finished, the partial area of the semi-finished product is seriously curled, in addition, the part of the semi-finished product corresponding to the rectangular keyboard is only warped (280mm multiplied by 115mm), and the part of the semi-finished product corresponding to the rectangular keyboard is seriously curled at the long-strip interface (99mm multiplied by 25mm) positioned above the keyboard part. The strip interface is a handle or grip designed for back end processing outside the keyboard portion, which is severely curled and will severely affect the back end processing technology.
2. Different black polyethylene terephthalate is selected to be further subjected to a heat shrinkage test experiment, different materials are respectively placed in an environment with the temperature of 120 ℃ and the temperature of 150 ℃ for 30min, the heat shrinkage rate and the temperature resistance performance of the materials are tested, and the experiment results are shown in table 2.
TABLE 2 Heat shrinkage test results
The test shows that: when the black polyethylene terephthalate and the FPC (flexible printed circuit) to be pasted are tested independently, the experimental results are flat and no abnormity is found, but if the black polyethylene terephthalate and the FPC are combined, the result is curled.
3. Different types of black polyethylene terephthalate are selected for experiments, the temperature resistance and the thermal shrinkage rate are mainly compared, specifically, different materials are respectively placed in an environment with the temperature of 120 ℃ and the temperature of 150 ℃ for 30min, the thermal shrinkage rate and the temperature resistance performance are tested, and the experimental results are shown in table 3.
TABLE 3 test results of temperature resistance and thermal shrinkage
Wherein the pre-shrinking is performed in the following manner: the black polyethylene terephthalate is sent into an oven to be baked, the oven is divided into 6 sections, the length of each section is 5 meters, the temperature of the 6 sections is 110 ℃, 150 ℃, 180 ℃, 200 ℃, 160 ℃ and 100 ℃ in sequence, and the speed of a conveyor is controlled to be about 20 meters per minute.
The pre-shrinking once means that the process is performed only once, and the pre-shrinking twice means that the process is performed twice.
4. Selecting different types of black polyethylene terephthalate to be attached to the FPC, standing for 24 hours at normal temperature, then sending the mixture into an oven with an iron net conveying belt to be baked, setting the temperature at 120 ℃ for 10 minutes, simultaneously respectively baking the mixture for 10 minutes at different temperatures, and testing the temperature resistance performance of the mixture. The results of the experiment are shown in table 4.
TABLE 4 temperature resistance test results of different types of black polyethylene terephthalate and FPC bonding
As can be seen from the test results of table 4: the black polyethylene terephthalate film pre-shrunk only twice can be matched with the FPC. The heat shrinkage rate of the black polyethylene terephthalate subjected to the pre-shrinkage twice at 150 ℃ is MD 0.15%, the heat shrinkage rate of the attached object FPC at 150 ℃ is MD 0.09%, the difference between the two is only 0.06% (or less than 0.1%), and the flatness is best after the combination. Thus, combining the two can solve the curling problem.
Moreover, the simulation experiment shows that the actual application process baking curling result can be simulated only when the temperature condition of the oven reaches 150 ℃, and the thermal influence of the material in the baking of the actual production process can be judged to be larger. Differences in results mainly result from equipment differences; the general experimental oven is a square space, hot air circulation is adopted, and a circulation port can not directly blow materials; the oven of actual production technology is low in height, wide and narrow in width, makes the hot-blast mouth be located the top and directly influences blowing material great, and the iron stand transmission band makes the material receive the temperature in reality and is higher than 120 ℃. Therefore, the material chosen for the FPC should actually have a temperature resistance higher than 120 ℃.
By combining the experimental results, the material of the substrate layer is black polyethylene terephthalate which is subjected to a secondary high-temperature pre-shrinking process, namely the black polyethylene terephthalate with the heat shrinkage rate of 150 ℃ not higher than MD 0.15%.
Determination of substrate thickness
The invention takes the hot-pressing embossment process as a main index aiming at the thickness of the base material, and the hot-pressing embossment can be formed by needing certain stiffness and thickness. The thickness of the base material is more than or equal to 0.02mm, which can meet the requirement of the hot-pressing embossment process.
Comparative testing of adhesives
Comparative tests were performed on different types of adhesives and the results are shown in table 5.
Table 5 performance test results for different adhesives
Wherein the adhesive SR37 is produced by Add adhesive products of Thai;
the adhesives SR17 and S21 were produced by tide adhesive products ltd;
the adhesive S19 is produced by Kunshan Shimei new material science and technology limited;
the adhesive SR52-3 is produced by Dongguan macro stone functional material science and technology limited company;
the adhesive S35 was produced by teddy adhesive products, ltd.
According to the test results in table 5, the adhesives SR17 and SR52-3, which are superior in initial adhesion and adhesion, are prone to delamination, and therefore are eliminated, and the adhesives SR37, S19, S21 and S35 have relatively good performances, so that the following problems of the keyboard can be solved well by using the four adhesives: firstly, the keyboard itself has many places naked empty, and the adhesion area that significantly reduces, stickness part need emphatically strengthen. Secondly, the hot pressing relief part is naked empty, when toasting through production process high temperature, and the air that the inside was wrapped up is because of heating expansion, and then pressurizes in the glue film of four sides, leads to the glue film to appear "gas through" or advance the air phenomenon, therefore high temperature cohesion part needs emphatically to strengthen.
Further tests were carried out on the adhesives SR37, S19, S21, S35: the adhesive is coated on the surface of black polyethylene terephthalate which is pre-shrunk twice, the thickness of the adhesive layer is controlled to be 0.025mm (25 micrometers), and then the adhesive layer is attached to the FPC for relevant tests, and the specific test results are shown in Table 6.
TABLE 6
RT means room temperature and NG means poor effect.
From the above experimental results, it can be seen that the S19 results are optimal. SR37 and S21 have slightly lower adhesion and cohesion than S19, and thus air-bleeding occurs at the edges of the hot-pressed embossments after a long time of standing. Although S35 has excellent temperature resistance and heat-resistant retention, the adhesion is not sufficient, and delamination occurs immediately after the sheet is left for a long time.
S19 is used as an adhesive, and the technical problem that the adhesive is easy to overflow when the keyboard is designed to have multiple holes and thin edge strips and is subjected to die cutting processing can be solved by controlling the thickness of the adhesive layer to be not more than 0.025 mm.
After confirming that the thickness of the glue layer is 0.025mm, the thickness of the black polyethylene terephthalate which is secondarily pre-shrunk on the substrate is preferably set to 0.025mm, and the total thickness is controlled to be in the range of 0.05mm which is preferred in the application.
The preparation method comprises the following steps:
in order to maintain the dimensional stability of the substrate secondary pre-shrinking polyethylene terephthalate, the invention adopts transfer coating production, the adhesive is coated on a substrate release film, and the substrate release film is transferred to the substrate at the coating tail. The dyne value of the PET substrate in the transfer process should be greater than or equal to 52 so as to ensure the best adhesion of the glue and the substrate.
The oven temperature is controlled to be 70 ℃, 85 ℃, 115 ℃, 120 ℃, 70 ℃, the machine speed is controlled to be 25M/min, under the high-temperature/slow-speed production condition, the glue has sufficient curing energy, molecular chains can be fully cured, and the colloid reaction is more complete. After the coating is finished, the coating can be cured for 24 hours at 45 ℃, the integrity of the whole curing of the base material and the glue is strengthened, and then the baking is carried out.
Examples
The embodiment provides a low ultra-thin sticky tape that contracts, it is including the substrate layer, the glue film that set gradually, from the type membrane, wherein:
the material of the base material layer is secondary pre-shrinkage black polyethylene terephthalate, and the heat shrinkage rates at 150 ℃ are MD 0.15% and TD 0.04%;
the adhesive layer is made of adhesive S19, the thickness of the adhesive layer is 0.025mm, the adhesive force is more than or equal to 1.5Kg for 24h, the slip is less than 1mm under the high-temperature retention force of 150 ℃, and the softening temperature is at least 150 ℃;
the release film is a conventional release film.
The semi-finished product obtained by laminating the secondary pre-shrinkage black polyethylene glycol terephthalate serving as the material of the substrate layer and the FPC (with the heat shrinkage rate of 150 ℃ MD 0.09% and TD 0.02%) has good die cutting processability, and 5000-time 6000-time micro-overflow adhesive is not sticky; after the hot-pressing embossing process is carried out, standing is carried out for more than or equal to 72H, and no air is introduced or layering is carried out; after being baked at 120 ℃ for 8min, the coating is free of air inlet, layering and flattening (the end part is tilted to be less than 3 mm).
Claims (10)
1. The utility model provides a low ultra-thin sticky tape that contracts, its includes substrate layer, glue film, the release film that sets gradually, wherein:
the material of the substrate layer is black polyethylene terephthalate with the heat shrinkage rate MD of not higher than 0.15% at 150 ℃;
preferably, the black polybutylene terephthalate has a TD of not higher than 0.04%.
2. The low-shrinkage ultrathin tape according to claim 1, wherein the thickness of the base material layer is 20 μm or more, preferably 25 μm;
preferably, the black polyethylene terephthalate is black polyethylene terephthalate which is subjected to two times of pre-shrinking;
more preferably, the pre-shrinking is performed by:
feeding black polyethylene terephthalate into an oven for baking, wherein the oven is divided into 6 sections, the length of each section is 5 meters, the temperature of each section is 110 ℃, 150 ℃, 180 ℃, 200 ℃, 160 ℃ and 100 ℃ in sequence, and the speed of a conveyor is controlled to be 20 meters per minute, so as to finish primary pre-shrinkage; this process was repeated to complete two pre-shrinkages.
3. The low-shrinkage ultrathin adhesive tape according to claim 1, wherein the material of the adhesive layer meets the following conditions: the initial adhesion of the rolling ball is #16-25, the adhesion force is more than or equal to 1.5Kg for 24 hours, the rolling ball slips less than 1mm under the high-temperature retention force of 150 ℃, and the softening temperature is more than 150 ℃;
preferably an adhesive S19.
4. The low shrinkage ultra-thin tape of claim 1 or 3, wherein the thickness of the subbing layer is 25 μm.
5. The low shrinkage ultra-thin tape of claim 1, wherein the release film has a thickness of 75 μ ι η.
6. The low-shrinkage ultrathin adhesive tape according to any one of claims 1 to 5, wherein the sum of the thicknesses of the substrate layer and the adhesive layer of the low-shrinkage ultrathin adhesive tape is 0.05 mm.
7. The method for preparing low-shrinkage ultra-thin adhesive tape according to any one of claims 1 to 6, comprising the steps of:
coating an adhesive on the surface of a release film to form an adhesive layer, and then compounding the adhesive layer with a base material layer to obtain a semi-finished adhesive tape;
baking the semi-finished adhesive tape to obtain the low-shrinkage ultrathin adhesive tape;
wherein, the oven used for baking is 6 sections from the entrance to the exit, the length of each section is 5 meters, the temperature of the 6 sections is 70 ℃, 85 ℃, 115 ℃, 120 ℃ and 70 ℃ in sequence, and the conveying speed of the semi-finished product of the adhesive tape is 25 m/min.
8. The preparation method of claim 7, wherein when the release layer with the adhesive layer is combined with the substrate layer, the dyne value of the substrate layer is not lower than 52.
9. The method of claim 7, further comprising the step of curing the semi-finished product at 45 ℃ for 24 hours before baking.
10. A keyboard, wherein the surface of the flexible circuit board of the keyboard is adhered with the low-shrinkage ultrathin adhesive tape of any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111578043.4A CN114149758B (en) | 2021-12-22 | 2021-12-22 | Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111578043.4A CN114149758B (en) | 2021-12-22 | 2021-12-22 | Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114149758A true CN114149758A (en) | 2022-03-08 |
| CN114149758B CN114149758B (en) | 2023-08-15 |
Family
ID=80451725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111578043.4A Active CN114149758B (en) | 2021-12-22 | 2021-12-22 | Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114149758B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332132A (en) * | 2000-05-22 | 2001-11-30 | Nitto Denko Corp | Transparent conductive film having protective film and its usage method |
| CN202626083U (en) * | 2012-03-31 | 2012-12-26 | 常州宏巨电子科技有限公司 | Shading adhesive tape |
| JP2015072903A (en) * | 2012-12-07 | 2015-04-16 | 日東電工株式会社 | Laminate |
| CN106575081A (en) * | 2014-06-03 | 2017-04-19 | 富林特集团德国有限公司 | Flexographic printing elements capable of being dried rapidly |
| WO2018043155A1 (en) * | 2016-08-30 | 2018-03-08 | 東レフィルム加工株式会社 | Protective film and laminated film |
| CN108841335A (en) * | 2018-05-30 | 2018-11-20 | 宁波科莱恩新材料科技有限公司 | A kind of black shading rubber belt and preparation method thereof |
| CN112126362A (en) * | 2020-09-25 | 2020-12-25 | 广东东立新材料科技股份有限公司 | Shading material functional film and preparation method and application thereof |
| CN112457791A (en) * | 2020-12-09 | 2021-03-09 | 江苏日久光电股份有限公司 | High-temperature-resistant protective film, preparation process thereof and ITO conductive film |
-
2021
- 2021-12-22 CN CN202111578043.4A patent/CN114149758B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332132A (en) * | 2000-05-22 | 2001-11-30 | Nitto Denko Corp | Transparent conductive film having protective film and its usage method |
| CN202626083U (en) * | 2012-03-31 | 2012-12-26 | 常州宏巨电子科技有限公司 | Shading adhesive tape |
| JP2015072903A (en) * | 2012-12-07 | 2015-04-16 | 日東電工株式会社 | Laminate |
| CN106575081A (en) * | 2014-06-03 | 2017-04-19 | 富林特集团德国有限公司 | Flexographic printing elements capable of being dried rapidly |
| WO2018043155A1 (en) * | 2016-08-30 | 2018-03-08 | 東レフィルム加工株式会社 | Protective film and laminated film |
| CN108841335A (en) * | 2018-05-30 | 2018-11-20 | 宁波科莱恩新材料科技有限公司 | A kind of black shading rubber belt and preparation method thereof |
| CN112126362A (en) * | 2020-09-25 | 2020-12-25 | 广东东立新材料科技股份有限公司 | Shading material functional film and preparation method and application thereof |
| CN112457791A (en) * | 2020-12-09 | 2021-03-09 | 江苏日久光电股份有限公司 | High-temperature-resistant protective film, preparation process thereof and ITO conductive film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114149758B (en) | 2023-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103722807B (en) | High pressure aluminum-based copper-clad plate of a kind of high heat conduction and preparation method thereof | |
| CN107187128B (en) | A kind of curved surface protective film and its laminating method of coating and forming method | |
| CN114149758A (en) | Low-shrinkage ultrathin adhesive tape, preparation method thereof and keyboard | |
| CN102139496B (en) | A kind of melamine decorative veneer hot-pressing concavo-convex forming process | |
| CN107406731A (en) | Graphite adhesive tape with release liner | |
| CN216969112U (en) | Electric aluminum capable of high-speed gold stamping | |
| CN202773177U (en) | Copper foil substrate having composite type structure | |
| CN216972402U (en) | Hardened belt antistatic acrylic protective film | |
| CN206818903U (en) | A kind of light guide plate and backlight | |
| CN114015370A (en) | Ultrathin printing grid adhesive tape and production method thereof | |
| CN111959001A (en) | Method for manufacturing carbon fiber decorative plate | |
| CN203126052U (en) | Composite double-sided copper foil substrate | |
| CN208604053U (en) | A kind of fire-retardant one-faced tapes of battery cladding | |
| CN113512900A (en) | Flexible embossing process suitable for triamine plate | |
| CN113291032A (en) | Leather rear cover of electronic product capable of being thermoformed and production process thereof | |
| CN202174778U (en) | Copper foil base plate with composite structure | |
| JP2010076443A (en) | Method for molding of textiles | |
| CN202773178U (en) | Composite type ultra-thin double-sided copper foil substrate | |
| CN110576628A (en) | Non-silicon matte double-sided release film and preparation process thereof | |
| CN219753788U (en) | Silica gel decorative board | |
| CN207449444U (en) | A kind of super mute wear-resisting transfer film | |
| CN217085310U (en) | Optical film and optical film assembly | |
| CN211222378U (en) | High-temperature-resistant melamine impregnated paper | |
| CN110776845A (en) | Low-temperature deformation antistatic release film and preparation process and application thereof | |
| CN215162313U (en) | Sustainable recovery type high temperature resistant embossing paper |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |