CN114138083A - Liquid medium heat radiator - Google Patents
Liquid medium heat radiator Download PDFInfo
- Publication number
- CN114138083A CN114138083A CN202010921245.3A CN202010921245A CN114138083A CN 114138083 A CN114138083 A CN 114138083A CN 202010921245 A CN202010921245 A CN 202010921245A CN 114138083 A CN114138083 A CN 114138083A
- Authority
- CN
- China
- Prior art keywords
- liquid medium
- heat
- cover
- housing
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a liquid medium heat dissipation device which is suitable for arranging a heating element and dissipating heat of the heating element. The shell is provided with at least one groove body formed in the shell. The liquid medium is arranged in the tank body. The cover body is connected with the shell body and seals the groove body. The heating element is in contact with the tank body, and heat generated by the heating element is transferred to the outside of the shell and the outside of the cover body through the tank body and the liquid medium to be radiated. Therefore, the effect of rapid heat dissipation can be achieved.
Description
Technical Field
The present disclosure relates to heat dissipation devices, and particularly to a liquid medium heat dissipation device.
Background
With the rapid development of network technology, the user's requirements for the computer booting speed, the software reading speed, and the playing speed of photos and videos are continuously increased, so as to effectively save time as a necessary condition for the consumer to select products.
Along with the improvement of performance and reading speed, the heat productivity and temperature of electronic components are also increasing, and the high temperature not only makes most electronic components aging, but also reduces the reading and writing speed of the solid state disk, so how to maintain the operating temperature becomes an important issue.
Most of the solid state disk products on the market at present mainly use an aluminum housing, or fins are added on the outer portion of the solid state disk product to increase the surface heat dissipation area, and air is mostly used as a heat conducting medium in the solid state disk product. However, the thermal conductivity of air is low, so that the heat transfer efficiency is not good, and even if there is a certain heat dissipation efficiency outside, the heat generated by the electronic component is still difficult to be effectively dissipated from the inside.
Therefore, how to develop a liquid medium heat dissipation device that can effectively solve the problems and disadvantages of the prior art is a problem that remains to be solved.
Disclosure of Invention
It is therefore an objective of the present invention to provide a liquid medium heat dissipation device to solve and improve the problems and disadvantages of the prior art.
Another objective of the present invention is to provide a liquid medium heat dissipation device, which uses a liquid medium with a high thermal conductivity as a heat conducting medium to quickly transfer heat energy to the exterior of the housing and the cover, thereby achieving quick heat dissipation.
Another objective of the present invention is to provide a liquid medium heat dissipation device, in which a plurality of heat conductors are immersed in the liquid medium, so as to improve the heat transfer efficiency and achieve the effect of increasing the heat dissipation speed. In addition, the injection hole can be used for manufacturers or users to replace liquid media with higher heat conductivity coefficients or specific colors, so that the effects of diversification and easy customization are achieved.
In order to achieve the above object, a preferred embodiment of the present invention provides a liquid medium heat dissipation device, adapted to dispose a heating element and dissipate heat of the heating element, the liquid medium heat dissipation device including: a shell body, which is provided with at least one groove body, wherein the groove body is formed on the shell body; the liquid medium is arranged in the groove body; and a cover body, which is connected with the shell body and seals the groove body; the heating element is in contact with the tank body, and heat generated by the heating element is transferred to the outside of the shell and the outside of the cover body through the tank body and the liquid medium to be radiated.
In order to achieve the above object, a preferred embodiment of the present invention provides a liquid medium heat dissipation device, adapted to dispose a heating element and dissipate heat of the heating element, the liquid medium heat dissipation device including: a shell body which is provided with a plurality of groove bodies, wherein the groove bodies are formed on two opposite side walls of the shell body; the liquid medium is arranged in the plurality of grooves; the cover body is assembled with the shell body and seals the plurality of groove bodies, wherein the cover body is provided with a plurality of heat conductors which are arranged in the plurality of groove bodies and at least partially immersed in the liquid medium; the heating element is arranged between the cover body and the shell in the vertical direction and between at least two groove bodies in the horizontal direction, and heat generated by the heating element is transferred to the outside of the shell and the outside of the cover body through the groove bodies, the liquid medium and the heat conductors to be radiated.
The liquid medium heat dissipation device has the beneficial effects that the liquid medium with high heat conductivity coefficient is used as a heat conduction medium, so that heat energy can be quickly transferred to the outer parts of the shell and the cover body, and further, quick heat dissipation is achieved. Furthermore, the heat conductors are immersed in the liquid medium, so that the heat transfer efficiency is improved and the effect of improving the heat dissipation speed is achieved. In addition, the injection hole can be used for manufacturers or users to replace liquid media with higher heat conductivity coefficients or specific colors, so that the effects of diversification and easy customization are achieved.
Drawings
Fig. 1 is a schematic view of a combination structure of a liquid medium heat dissipation device according to an embodiment of the present invention.
Fig. 2 is an exploded schematic view of a liquid medium heat dissipation device according to an embodiment of the invention.
Fig. 3 is a schematic view of an assembly structure of the liquid medium heat dissipation device shown in fig. 1 from another view angle.
Fig. 4 is an exploded view of the liquid medium heat dissipation device shown in fig. 1 from another view angle.
Fig. 5 is a cross-sectional view of a partially exploded structure of a liquid medium heat dissipation device according to an embodiment of the invention.
Fig. 6 is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the invention.
Fig. 7 is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the invention.
Fig. 8 is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the invention.
Fig. 9 is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the invention.
Fig. 10 is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the invention.
The reference numbers are as follows:
11: shell body
111: trough body
112: side wall
113: sealing cover plate
114: injection hole
12: liquid medium
13: cover body
131: heat conductor
132: long side
133: short side
134: cooling tank
135: hole(s)
14: cooling liquid
2: heating element
3: thermally conductive material
B: bottom part
O: opening of the container
T: top part
Detailed Description
Some exemplary embodiments that embody features and advantages of the invention will be described in detail in the description that follows. As will be realized, the invention is capable of other and different modifications and its several details are capable of modifications in various obvious respects, all without departing from the scope of the invention, and the description and drawings are to be regarded as illustrative in nature, and not as restrictive.
Referring to fig. 1 to 6, fig. 1 is a schematic view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the present invention, fig. 2 is a schematic view of an exploded structure of a liquid medium heat dissipation device according to an embodiment of the present invention, fig. 3 is a schematic view of an assembly structure of the liquid medium heat dissipation device shown in fig. 1 from another perspective, fig. 4 is a schematic view of an exploded structure of the liquid medium heat dissipation device shown in fig. 1 from another perspective, fig. 5 is a cross-sectional view of a portion of an exploded structure of a liquid medium heat dissipation device according to an embodiment of the present invention, and fig. 6 is a cross-sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the present invention. As shown in fig. 1 to fig. 6, the liquid medium heat dissipation device 1 according to an embodiment of the present invention is suitable for disposing the heating element 2 and dissipating heat from the heating element 2, wherein the liquid medium heat dissipation device 1 may be a hard outer box that utilizes a liquid medium to enhance heat dissipation effect, and the heating element 2 may be a solid hard disk, a display card or a memory, but not limited thereto. The liquid medium heat dissipation device 1 includes a housing 11, a liquid medium 12, and a cover 13. The housing 11 has at least one slot 111 formed in the housing 11. The liquid medium 2 is disposed in the tank 111. The cover 13 is assembled with the housing 11 and seals the groove 111. The heating element 2 is in contact with the tank 111, and heat generated by the heating element 2 is transferred to the outside of the housing 11 and the outside of the lid 13 through the tank 111 and the liquid medium 12 to be dissipated. Therefore, the effect of rapid heat dissipation can be achieved.
In some embodiments, the slot 111 of the present invention is preferably formed on the sidewall 112 of the housing 11, but not limited thereto. The cover 13 has a plurality of heat conductors 131, and the plurality of heat conductors 131 extend from the cover 13 to the housing 11 and are correspondingly disposed in the groove 111. The plurality of heat conductors 131 are at least partially immersed in the liquid medium 12 (as shown in fig. 6), and heat generated by the heating element 2 is transferred to the outside of the housing 11 and the outside of the cover 13 through the tank 111, the liquid medium 12 and the plurality of heat conductors 131 for heat dissipation.
In some embodiments, the housing has a plurality of slots 111, and the plurality of slots 111 are formed on two opposite sidewalls 112 of the housing 11. The heating element 2 is disposed between at least two grooves 111 in the horizontal direction. The cover 13 has a plurality of heat conductors 131, and the plurality of heat conductors 131 are a plurality of cylinders. Specifically, the cover 13 has two long sides 132 and two short sides 133. Two long sides 132 are formed on opposite sides of the cover 13; two short edges 133 are formed on opposite sides of the cover 13. Each long side 132 is connected with two short sides 133, and each short side 133 is connected with two long sides 132. In other words, the two long sides 132 and the two short sides 133 are connected to each other to form the entire circumference of the lid 13.
Preferably, the plurality of heat conductors 131 are arranged along the two long sides 132 and are correspondingly disposed in the plurality of grooves 111, and the plurality of heat conductors 131 are at least partially immersed in the liquid medium 12. The heat generated by the heating element 2 is transferred to the outside of the case 11 and the outside of the lid 13 through the plurality of grooves 111, the liquid medium 12, and the plurality of heat conductors 131, and is dissipated. Therefore, the present invention provides a liquid medium heat dissipation device 1, which can improve the heat transfer efficiency and achieve the effect of increasing the heat dissipation speed by immersing a plurality of heat conductors 131 in the liquid medium 12.
Please refer to fig. 1 to 4. The housing 11 has a top T and a bottom B, and further includes a sealing cover plate 113. The cover 13 is assembled with the top T of the housing 11. The bottom B has an opening O, and a sealing cover plate 113 is disposed on the bottom B and seals the opening O. In this embodiment, the liquid medium 12 may be injected into the groove 111 through the opening O, but not limited thereto. The opening O and the sealing cover 113 also allow the manufacturer or user to inspect the inside of the liquid medium heat dissipation device 1 for maintenance or component replacement.
Please refer to fig. 5 and fig. 6. According to the idea of the present invention, the housing 11 of the liquid medium heat dissipation device 1 of the present invention may further have at least one injection hole 114, and each injection hole 114 is formed in one of the plurality of grooves 111 and penetrates through the housing 11, and may penetrate through the bottom surface or the side surface of the housing 11, but not limited thereto. Through the injection hole 114, the liquid medium heat dissipation device 1 of the present invention can be used by a manufacturer or a user to replace a liquid medium with a higher thermal conductivity or a specific color, so as to achieve the effects of diversification and easy customization.
Please refer to fig. 1 to 6. In some embodiments, the heat generating element 2 may be disposed between the housing 11 and the cover 13, or the cover 13, the heat generating element 2 and the housing 11 may be arranged in a single direction. In other embodiments, the heating element 2 may be disposed outside the housing 11 and contact the groove 111 of the housing 11, or indirectly contact the groove through the heat conductive material 3. The heat conductive material may be a heat conductive adhesive or a heat conductive sheet, but not limited thereto.
According to the idea of the present invention, the housing 11 and the cover 13 of the liquid medium heat dissipation device 1 can be transparent respectively, so as to increase the design and technological sense. In addition, the light emitting diode can be arranged on the shell 11, the cover 13 or between the shell 11 and the cover 13, and the liquid medium is matched to form interesting light shadow, so that the design is rich in variety.
The following description is provided for several possible embodiments of the liquid medium heat dissipation device 1, and it is intended that the liquid medium heat dissipation device 1 of the present invention can have many possible embodiments according to the different heat generating elements 2 or according to the design requirements, and is not intended to limit the present invention.
Please refer to fig. 7, which is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the present invention. As shown in fig. 7, the housing 11 has a plurality of tanks 111, and the liquid medium 12 is disposed in the plurality of tanks 111. The cover 13 is assembled with the housing 11 and seals the plurality of grooves 111. The heating element 2 is disposed between the cover 13 and the housing 11 in the vertical direction and disposed between the at least two slots 111 in the horizontal direction, and heat generated by the heating element 2 is transferred to the outside of the housing 11 and the outside of the cover 13 through the slots 111 and the liquid medium 12 for heat dissipation. The liquid medium 12 may be injected into the groove 111 through the injection hole 114.
Please refer to fig. 8, which is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the present invention. As shown in fig. 8, the housing 11 has a tank 111, and the liquid medium 12 is disposed in the tank 111. The cover 13 is assembled with the housing 11 and seals the groove 111. The heating element 2 is disposed between the cover 13 and the housing 11 in the vertical direction and directly contacts the tank 111, and the heat generated by the heating element 2 is transferred to the outside of the housing 11 and the outside of the cover 13 through the tank 111 and the liquid medium 12 for heat dissipation. The liquid medium 12 may be injected into the groove 111 through the injection hole 114.
Please refer to fig. 9, which is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the present invention. As shown in fig. 9, the housing 11 has a tank 111, and the liquid medium 12 is disposed in the tank 111. The cover 13 is assembled with the housing 11 and seals the groove 111. The heating element 2 is disposed between the cover 13 and the housing 11 in the vertical direction and the horizontal direction and directly contacts the tank 111, and the heat generated by the heating element 2 is transferred to the outside of the housing 11 and the outside of the cover 13 through the tank 111 and the liquid medium 12 for heat dissipation. The liquid medium 12 may be injected into the groove 111 through the injection hole 114.
In some embodiments, the liquid medium heat dissipation device 1 of the present invention may also have a cooling tank and a cooling liquid on the cover 13, so as to further enhance the heat dissipation effect. Please refer to fig. 10, which is a sectional view of an assembly structure of a liquid medium heat dissipation device according to an embodiment of the present invention. As shown in fig. 10, the housing 11 has a groove 111, and the liquid medium 12 is disposed in the groove 111, and the liquid medium 12 can be injected into the groove 111 through the injection hole 114. The cover 13 is assembled with the housing 11 and seals the groove 111. The cover 13 further has a cooling tank 134 and a hole 135, and the cooling liquid 14 is disposed in the cooling tank 134. The cooling groove 134 and the hole 135 are formed in the cover 13, and the hole 135 partially penetrates the cover 13. The cooling liquid 14 can be injected into the cooling tank 134 through the hole 135, but not limited thereto. The heating element 2 is disposed between the cover 13 and the housing 11 in the vertical direction and the horizontal direction and directly contacts with the tank 111 and the cooling tank 134, and heat generated by the heating element 2 is transmitted to the outside of the housing 11 through the tank 111 and the liquid medium 12, and is also transmitted to the outside of the cover 13 through the cooling tank 134 and the cooling liquid 14 for heat dissipation.
In summary, the present invention provides a liquid medium heat dissipation device, which can quickly transfer heat energy to the exterior of the housing and the cover body by using a liquid medium with a high thermal conductivity as a heat conductive medium, so as to achieve quick heat dissipation. Furthermore, the heat conductors are immersed in the liquid medium, so that the heat transfer efficiency is improved and the effect of improving the heat dissipation speed is achieved. In addition, the injection hole can be used for manufacturers or users to replace liquid media with higher heat conductivity coefficients or specific colors, so that the effects of diversification and easy customization are achieved.
While the present invention has been described in detail with respect to the above-described embodiments, it will be apparent to those skilled in the art that various modifications can be made without departing from the scope of the invention as defined in the appended claims.
Claims (10)
1. A liquid medium heat sink is suitable for setting a heating element and dissipating heat of the heating element, and comprises:
a shell body, which is provided with at least one groove body, wherein the groove body is formed on the shell body;
the liquid medium is arranged in the groove body; and
a cover body which is connected with the shell body and seals the groove body;
the heating element is in contact with the tank body, and heat generated by the heating element is transferred to the outside of the shell and the outside of the cover body through the tank body and the liquid medium to be radiated.
2. A liquid medium heat sink as claimed in claim 1, wherein the slot is formed in a side wall of the housing.
3. The liquid medium heat dissipating device according to claim 1, wherein the cover has a plurality of heat conductors extending from the cover to the housing and correspondingly disposed in the tank, the plurality of heat conductors are at least partially immersed in the liquid medium, and heat generated by the heat generating element is transferred to the outside of the housing and the outside of the cover through the tank, the liquid medium and the plurality of heat conductors for heat dissipation.
4. A liquid medium heat sink as claimed in claim 1, wherein the housing has a plurality of slots formed on two opposite sidewalls of the housing.
5. The liquid medium heat sink according to claim 4, wherein the cover has a plurality of heat conductors.
6. The liquid medium heat sink as claimed in claim 5, wherein the cover has two long sides and two short sides, the two long sides are formed on two opposite sides of the cover, the two short sides are formed on two opposite sides of the cover, each long side is connected to the two short sides, and each short side is connected to the two long sides.
7. The liquid medium heat dissipating device according to claim 6, wherein the plurality of heat conducting bodies are arranged along the two long sides and are correspondingly disposed in the plurality of slots, the plurality of heat conducting bodies are at least partially immersed in the liquid medium, and heat generated by the heat generating element is transferred to the outside of the housing and the outside of the cover through the plurality of slots, the liquid medium and the plurality of heat conducting bodies for heat dissipation.
8. The liquid medium heat dissipating device according to claim 1, wherein the housing has a top and a bottom and comprises a sealing cover, the cover is assembled to the top of the housing, the bottom has an opening, and the sealing cover is disposed on the bottom and seals the opening.
9. The liquid medium heat dissipating device according to claim 1, wherein the housing has at least one injection hole, and each injection hole is formed in the plurality of grooves and penetrates the housing.
10. A liquid medium heat sink is suitable for setting a heating element and dissipating heat of the heating element, and comprises:
a shell with a plurality of groove bodies, wherein the groove bodies are formed on two opposite side walls of the shell;
the liquid medium is arranged in the plurality of grooves; and
the cover body is assembled with the shell body and seals the plurality of groove bodies, wherein the cover body is provided with a plurality of heat conductors which are arranged in the plurality of groove bodies and at least partially immersed in the liquid medium;
the heating element is arranged between the cover body and the shell in the vertical direction and between at least two groove bodies in the horizontal direction, and heat generated by the heating element is transferred to the outside of the shell and the outside of the cover body through the groove bodies, the liquid medium and the heat conductors to be radiated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010921245.3A CN114138083A (en) | 2020-09-04 | 2020-09-04 | Liquid medium heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010921245.3A CN114138083A (en) | 2020-09-04 | 2020-09-04 | Liquid medium heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114138083A true CN114138083A (en) | 2022-03-04 |
Family
ID=80438338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010921245.3A Pending CN114138083A (en) | 2020-09-04 | 2020-09-04 | Liquid medium heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114138083A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784176A (en) * | 2009-01-19 | 2010-07-21 | 周文强 | Insulated heat radiation structure of electronic part |
| CN203014901U (en) * | 2012-12-17 | 2013-06-19 | 黄杨 | Cellphone heat radiation rear cover |
| CN104362136A (en) * | 2014-07-25 | 2015-02-18 | 辜旭 | Quick passive radiator |
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN205491593U (en) * | 2016-01-08 | 2016-08-17 | 云南科威液态金属谷研发有限公司 | A heat radiation structure and cooling parts for electronic equipment |
| CN206698262U (en) * | 2017-03-29 | 2017-12-01 | 深圳天珑无线科技有限公司 | Mobile terminal |
| CN208434023U (en) * | 2018-06-11 | 2019-01-25 | 薛靖锡 | A kind of water cooled heat radiating mobile phone shell |
| CN109275318A (en) * | 2018-10-27 | 2019-01-25 | Oppo广东移动通信有限公司 | Radiator, shell and mobile terminal |
| CN110191626A (en) * | 2019-06-28 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit, preparation method and electronic equipment |
| CN110850947A (en) * | 2019-11-27 | 2020-02-28 | 佛山市龙之声电热科技股份有限公司 | Heat pipe for rear housing and mobile device having the same |
-
2020
- 2020-09-04 CN CN202010921245.3A patent/CN114138083A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784176A (en) * | 2009-01-19 | 2010-07-21 | 周文强 | Insulated heat radiation structure of electronic part |
| CN203014901U (en) * | 2012-12-17 | 2013-06-19 | 黄杨 | Cellphone heat radiation rear cover |
| CN104362136A (en) * | 2014-07-25 | 2015-02-18 | 辜旭 | Quick passive radiator |
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN205491593U (en) * | 2016-01-08 | 2016-08-17 | 云南科威液态金属谷研发有限公司 | A heat radiation structure and cooling parts for electronic equipment |
| CN206698262U (en) * | 2017-03-29 | 2017-12-01 | 深圳天珑无线科技有限公司 | Mobile terminal |
| CN208434023U (en) * | 2018-06-11 | 2019-01-25 | 薛靖锡 | A kind of water cooled heat radiating mobile phone shell |
| CN109275318A (en) * | 2018-10-27 | 2019-01-25 | Oppo广东移动通信有限公司 | Radiator, shell and mobile terminal |
| CN110191626A (en) * | 2019-06-28 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit, preparation method and electronic equipment |
| CN110850947A (en) * | 2019-11-27 | 2020-02-28 | 佛山市龙之声电热科技股份有限公司 | Heat pipe for rear housing and mobile device having the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7755902B2 (en) | Heat dissipation device for computer add-on cards | |
| US7443680B1 (en) | Heat dissipation apparatus for heat producing device | |
| CN102065667B (en) | Electronic device and heat radiating device thereof | |
| KR102134756B1 (en) | Connector | |
| US20070217154A1 (en) | Vapor chamber for dissipation heat generated by electronic component | |
| US20070097643A1 (en) | Thermal structure for electric devices | |
| KR100469529B1 (en) | Electronic apparatus having a heat conducting sheet that promote heat radiation from a memory module | |
| AU1667601A (en) | Electronic equipment and television game machine having heat radiation structure | |
| CN213583120U (en) | Memory radiator | |
| CN207968366U (en) | A kind of compact(ing) machine controller | |
| US20080246383A1 (en) | LED-lamp heat-dissipation device | |
| CN114138083A (en) | Liquid medium heat radiator | |
| TW201931979A (en) | Dynamic random access memory module | |
| CN108633213B (en) | Electronic device | |
| CN218417125U (en) | Heat sink device | |
| CN201252711Y (en) | Casing body structure capable of combining with a radiator | |
| JP7225340B2 (en) | socket structure | |
| US11832421B2 (en) | Control device | |
| US20050088827A1 (en) | Electrical card having heatsink device | |
| TWM607473U (en) | Liquid medium heat dissipation device | |
| TWM381817U (en) | Computer system | |
| TWM379962U (en) | Computer system | |
| CN215648052U (en) | Heat radiation structure and electronic equipment | |
| CN212727850U (en) | Storage device | |
| CN216134743U (en) | Mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |