CN114137386A

CN114137386A - Test device, test method and test equipment

Info

Publication number: CN114137386A
Application number: CN202111326052.4A
Authority: CN
Inventors: 胡兴亿; 张东卫; 卢程显; 李健龙; 杜康; 陆贺身; 刘金全; 李玉辉
Original assignee: Henan Yuzhan Precision Technology Co Ltd
Current assignee: Henan Yuzhan Precision Technology Co Ltd
Priority date: 2021-11-10
Filing date: 2021-11-10
Publication date: 2022-03-04

Abstract

The invention provides a testing device which is used for testing a circuit board. The testing device comprises a base, a testing jig, two moving assemblies, two probe assemblies and a detection module. The test fixture is arranged on the base, the two moving assemblies are connected with the base in a sliding manner, and each probe assembly is respectively connected with one moving assembly in a rotating manner and is positioned on the opposite side surfaces of the two moving assemblies; the detection module is electrically connected with the two probe assemblies and receives detection signals of the two probe assemblies. The two probe assemblies are respectively driven by the two moving assemblies to move to the first detection point and the second detection point of the circuit board so that the two probe assemblies are respectively contacted with the first detection point and the second detection point, and the detection module is used for receiving detection signals of the two probe assemblies and analyzing the detection signals to obtain a test result of the circuit board. The two probe assemblies are matched with the connected detection device to complete the detection of the circuit board, so that the test difficulty can be reduced, and the detection efficiency can be improved. The invention also provides a test method and test equipment.

Description

Test device, test method and test equipment

Technical Field

The invention relates to the technical field of circuit board detection, in particular to a testing device, a testing method and testing equipment.

Background

The circuit board is used as one of the core components of electronic products, and testing the circuit board is a key step for judging whether the circuit board is good or bad.

In electronic products, circuit boards of smart phones or microelectronic devices are often detected manually due to small size and dense test points. However, the manual detection method has a high difficulty and a low efficiency.

Disclosure of Invention

In view of the above, it is necessary to provide a testing apparatus, a testing method and a testing device to solve the technical problem of how to reduce the difficulty of testing the circuit board and improve the testing efficiency.

A first aspect of the present invention provides a test apparatus for testing a circuit board, the test apparatus comprising:

a base;

the test fixture is arranged on the base and used for fixing the circuit board;

the two moving components are connected with the base in a sliding manner;

the two probe assemblies are respectively and rotatably connected to one moving assembly and are positioned on the opposite side surfaces of the two moving assemblies, and the two moving assemblies are used for respectively driving the two probe assemblies to move to a first detection point and a second detection point of the circuit board so that the two probe assemblies are respectively contacted with the first detection point and the second detection point; and

and the detection module is electrically connected with the two probe assemblies and is used for receiving detection signals of the two probe assemblies and analyzing the detection signals to obtain a test result of the circuit board.

In the testing device, the circuit board is fixed on the testing jig, the two moving assemblies respectively drive the two probe assemblies to move to the first detection point and the second detection point of the circuit board so as to enable the two probe assemblies to be respectively contacted with the first detection point and the second detection point, and the detection module receives detection signals of the two probe assemblies and analyzes the detection signals to obtain a testing result of the circuit board. The two probe assemblies are matched with the connected detection device to complete the detection of the circuit board, so that the test difficulty can be reduced, and the detection efficiency can be improved.

In some embodiments, the probe assembly includes a rotary driving member and a probe, the rotary driving member includes a fixed portion and a rotary portion rotatably disposed in the fixed portion, the fixed portion is connected to the moving assembly, and the rotary portion is connected to the probe.

So, connect in the motion subassembly through the fixed part with the probe subassembly to drive the probe subassembly at the motion subassembly and remove, and connect the probe of probe subassembly in the rotating part, with under the rotation of rotating part, the inclination that drives the probe adjusts, tests with the target detection point that realizes the probe subassembly different inclination on to the circuit board.

In some embodiments, the axis of rotation of the rotating portion is parallel to the direction of movement of the motion assembly.

So, the rotation axis through with the rotating part is parallel with the direction of motion subassembly to there is not interference in the direction of movement that makes motion subassembly drive probe subassembly and rotation axis drive probe direction of rotation, goes on smoothly with realization probe subassembly test circuit board.

In some embodiments, the testing apparatus further includes an rf probe connected to one of the rotating portions and spaced apart from the probe.

So, through setting up the radio frequency probe to connect the radio frequency probe in a rotating part, can realize testing the circuit board with the realization utilizes single radio frequency probe.

In some embodiments, the test fixture includes a fixture body and a rotating component, the fixture body is disposed on the rotating component, the rotating component is connected to the base and is used for driving the fixture body to rotate, and the fixture body is used for fixing the circuit board.

Therefore, through the arrangement of the jig main body and the rotating assembly, the jig main body is used for fixing the circuit board, the rotating assembly is used for driving the jig main body to rotate, the jig main body rotates to drive the circuit board to rotate, so that the circuit board is adjusted in a rotating mode in the horizontal direction, the probe assembly can detect target test points on the circuit board conveniently, and detection efficiency is improved.

In some embodiments, the jig main body includes a support frame, a support platform, and a turning assembly, the support platform is rotatably connected to the support frame, the turning assembly is respectively connected to the support platform and the support frame and is configured to drive the support platform to turn over on the support frame, the support frame is disposed on the rotating assembly, and the support platform is configured to fix the circuit board.

So, it is rotatory through upset subassembly drive supporting platform, fixed circuit board on the supporting platform to the realization overturns the circuit board, tests with two base planes on to the circuit board.

In some embodiments, the turning assembly includes a first driving member, and the first driving member is disposed on the supporting frame and connected to the supporting platform to drive the supporting platform to turn.

So, through connecting first driving piece in support frame and supporting platform to drive supporting platform overturns, and the drive direction place plane of first driving piece is perpendicular with rotating assembly's drive direction place plane, with under first driving piece and rotating assembly's cooperation, realizes the multi-angle of the circuit board on the supporting platform and adjusts.

In some embodiments, the testing device further comprises a tool setting assembly, the tool setting assembly comprises a base and a tool setting rod, the tool setting rod is arranged on the base, the base is arranged on the base, and the tool setting assembly is used for calibrating or correcting the probe.

Therefore, by arranging the tool setting assembly, the tool setting is carried out on the tool setting rod by the probe by utilizing the tool setting rod as a reference coordinate, the coordinate of the probe is corrected and calibrated, and the accuracy of the test device for the circuit board is improved.

In some embodiments, the testing apparatus further includes an imaging assembly, the imaging assembly respectively includes a body, a second driving member and an imaging device, the second driving member is connected to the body, the imaging device is connected to the second driving member, the body is connected to the moving assembly, and the imaging assembly is configured to image the circuit board.

So, through setting up body, second driving piece and image device to make the motion subassembly drive the motion of image device, the second driving piece is connected in image device and is driven the image device and remove, gets for instance in order to realize the different target position points of image device to the circuit board.

A second aspect of the present invention provides a test method for testing a circuit board, the test method comprising: acquiring the coordinates (X1, Y1) and the polarity of a first detection point of a target element on a circuit board, and the coordinates (X2, Y2) and the polarity of a second detection point;

calculating a distance between the first detection point and the second detection point based on the coordinates of the first detection point and the coordinates of the second detection point;

controlling a first probe assembly and a second probe assembly to move and respectively contact the first detection point and the second detection point based on the distance;

and receiving detection signals of the first probe assembly and the second probe assembly, generating a detection value, and judging whether the target element is qualified according to the detection value.

Therefore, the first probe assembly and the second probe assembly are controlled to move and respectively contact the first detection point and the second detection point by meeting the steps, a detection signal is generated, a detection value is generated based on the detection signal, whether the target element is qualified or not is judged according to the detection value, automatic detection of the target element is achieved, the testing difficulty is reduced, and the testing efficiency is improved.

In some embodiments, the step of controlling the first probe assembly and the second probe assembly to move and contact the first probing point and the second probing point, respectively, based on the distance comprises:

determining | X1-X2| > XL, wherein XL is a preset distance threshold;

moving the first probe assembly to the first test site and into contact with the first test site, and moving the second probe assembly to the second test site and into contact with the second test site.

Therefore, by meeting the steps, when the first probe assembly is moved to the first detection point and the second probe assembly is moved to the second detection point, the first probe assembly and the second probe assembly do not interfere with each other, and the test safety is improved.

determining | X1-X2| < XL and | Y1-Y2| > XL, wherein XL is a distance threshold;

driving the circuit board to rotate 90 degrees; moving the first probe assembly to the first test site and into contact with the first test site, and moving the second probe assembly to the second test site and into contact with the second test site.

Therefore, by the steps, when the first probe assembly is moved to the first detection point and the second probe assembly is moved to the second detection point, the first probe assembly and the second probe assembly do not interfere with each other, so that the first probe assembly and the second probe assembly can smoothly detect the first detection point and the second detection point respectively, and the testing efficiency is improved.

In some embodiments, the testing method further comprises:

determining X1-X2 > 0;

reversing the polarity of the first probe assembly and the second probe assembly.

Therefore, by meeting the steps, the polarities of the first probe assembly and the second probe assembly are exchanged, so that interference between the first probe assembly and the second probe assembly can be avoided in the process of moving the first probe assembly and the second probe assembly, normal work of the first probe assembly and the second probe assembly is ensured, and the detection efficiency is improved.

In some embodiments, the testing method further comprises:

determining | X1-X2| < XL and | Y1-Y2| < XL, wherein XL is a preset distance threshold;

and outputting an alarm signal.

Therefore, the first probe assembly and the second probe assembly do not work by meeting the steps, interference between the first probe assembly and the second probe assembly is avoided, damage caused by collision of the first probe assembly and the second probe assembly is avoided, and normal work of the probe assembly is ensured.

In some embodiments, the step of receiving the detection signals of the first probe assembly and the second probe assembly, generating a detection value, and determining whether the target component is qualified according to the detection value includes:

comparing the detection value with a standard property value of the target element;

if the difference value between the detection value and the standard attribute value exceeds a preset range, acquiring image information of the target element;

position information of the target element is obtained based on the image information, and the target element is re-detected based on the position information.

Thus, by satisfying the above steps, the accuracy of detection of the target element can be ensured.

In some embodiments, said deriving position information of said target element based on said image information, said re-detecting said target element based on said position information comprises:

and if the target element does not exist, controlling the first probe assembly and the second probe assembly not to work and outputting an alarm signal.

Therefore, by meeting the steps, when the target element does not exist, the first probe assembly and the second probe assembly are controlled not to work, useless work is avoided, and the detection efficiency is improved.

A third aspect of the application provides a test apparatus comprising a processor and a memory, the memory storing a computer program which, when executed by the processor, causes the processor to perform any of the above-described test methods.

Therefore, when the computer program is executed by the processor, the target element is tested, automatic detection of the target element is achieved, testing difficulty is reduced, and testing efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a testing apparatus and a detecting apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a testing apparatus according to an embodiment of the present invention.

Fig. 3A is an enlarged schematic view at a in fig. 2.

Fig. 3B is an enlarged schematic view at B in fig. 2.

Fig. 4 is a schematic structural diagram of a jig main body according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of an imaging assembly according to an embodiment of the present invention.

Fig. 6 is a test diagram corresponding to the test method according to an embodiment of the present invention.

Fig. 7 is a flowchart illustrating a testing method according to an embodiment of the invention.

Fig. 8 is a flowchart illustrating a first implementation method of step S3 in fig. 7.

Fig. 9 is a flowchart illustrating a second implementation method of step S3 in fig. 7.

Fig. 10 is a test diagram corresponding to the test method according to an embodiment of the present invention.

Fig. 11 is a flowchart illustrating a third implementation method of step S3 in fig. 7.

Fig. 12 is a flowchart illustrating a fourth implementation method of step S3 in fig. 7.

Fig. 13 is a test diagram corresponding to the test method according to an embodiment of the present invention.

Fig. 14 is a flowchart illustrating a fifth implementation method of step S3 in fig. 7.

Fig. 15 is a flowchart illustrating a sixth implementation method of step S3 in fig. 7.

Fig. 16 is a flowchart illustrating the implementation method of step S5 in fig. 7.

Fig. 17 is a block diagram of a test apparatus according to an embodiment of the present invention.

Description of the main elements

Test apparatus 100

Base 10

Test fixture 20

Tool main body 21

Supporting frame 210

Support platform 211

Flipping assembly 212

First driving member 2120

Rotating assembly 22

Kinematic assembly 30

Probe assembly 40

Rotary drive 41

Fixed part 411

Rotating part 412

Probe 42

First probe assembly 43

Second probe assembly 44

Detection module 50

Radio frequency probe 60

Tool setting assembly 70

Imaging assembly 80

Body 81

Second driving member 82

Imaging device 83

Test apparatus 200

Processor 201

Memory 202

Computer program 203

Circuit board 300

Target element 310

First detection point 311

Second detection point 312

Detailed Description

So that the objects, features and advantages of the present invention can be more clearly understood, a detailed description of the present invention will be given below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention, and the described embodiments are merely a subset of the embodiments of the present invention, rather than a complete embodiment.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The embodiment of the invention provides a testing device which is used for testing a circuit board. The testing device comprises a base, a testing jig, two moving assemblies, two probe assemblies and a detection module. The test fixture is arranged on the base and used for fixing the circuit board, the two moving assemblies are both connected with the base in a sliding manner, each probe assembly is respectively connected with one moving assembly in a rotating manner and is positioned on the opposite side surfaces of the two moving assemblies, and the two moving assemblies are used for respectively driving the two probe assemblies to move to a first detection point and a second detection point of the circuit board so as to enable the two probe assemblies to be respectively contacted with the first detection point and the second detection point; the detection module is electrically connected with the two probe assemblies and used for receiving detection signals of the two probe assemblies and analyzing the detection signals to obtain a test result of the circuit board.

In the testing device, the circuit board is fixed on the testing jig, the two moving assemblies respectively drive the two probe assemblies to move to the first detection point and the second detection point of the circuit board along the first direction and the second direction so as to enable the two probe assemblies to be respectively contacted with the first detection point and the second detection point, and the detection module receives detection signals of the two probe assemblies and analyzes the detection signals to obtain a testing result of the circuit board. The two probe assemblies are matched with the connected detection device to complete the detection of the circuit board, so that the test difficulty can be reduced, and the detection efficiency can be improved.

The embodiment of the invention also provides a test method for testing the circuit board, which comprises the following steps: acquiring the coordinates (X1, Y1) and the polarity of a first detection point of a target element on a circuit board, and the coordinates (X2, Y2) and the polarity of a second detection point; calculating the distance between the first detection point and the second detection point based on the coordinates of the first detection point and the coordinates of the second detection point; controlling the first probe assembly and the second probe assembly to move and respectively contact the first detection point and the second detection point based on the distance; and receiving detection signals of the first probe assembly and the second probe assembly, generating a detection value, and judging whether the target element is qualified according to the detection value.

Therefore, by meeting the steps, the probe assembly is moved to the first detection point of the circuit board and the other probe assembly is moved to the second detection point of the circuit board, the probes on the two probe assemblies are controlled to be respectively in contact with the first detection point and the second detection point of the circuit board for testing, a detection signal is generated, a detection value is generated based on the detection signal, whether the target element is qualified or not is judged according to the detection value, automatic detection of the target element is achieved, the testing difficulty is reduced, and the testing efficiency is improved.

The embodiment of the invention also provides a test device, which comprises a processor and a memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the test method.

Therefore, when the computer program is executed by the processor, the circuit board is tested, automatic detection of the circuit board is achieved, testing difficulty is reduced, and testing efficiency is improved.

Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to fig. 3, a testing apparatus 100 for testing a circuit board (not shown) is provided in an embodiment of the present invention. The testing apparatus 100 includes a base 10, a testing fixture 20, two moving assemblies 30, two probe assemblies 40, and a detecting module 50. Specifically, the testing jig 20 is disposed on the base 10, and the testing jig 20 is used for fixing the circuit board; the two moving assemblies 30 are both connected with the base 10 in a sliding way and are arranged oppositely; each probe assembly 40 of the two probe assemblies 40 is rotatably connected to one moving assembly 30 and is located on the opposite side of the two moving assemblies 30, and the two moving assemblies 30 are used for driving the two probe assemblies 40 to move to the first detecting point and the second detecting point of the circuit board respectively, so that the two probe assemblies 40 are in contact with the first detecting point and the second detecting point respectively; the detecting module 50 is electrically connected to both of the probe assemblies 40, receives the detecting signals of the probe assemblies 40, and analyzes the detecting signals to obtain the testing result of the circuit board.

In some embodiments, the fixing manner of the test fixture 20 for fixing the circuit board may be to form a receiving slot on the test fixture 20, the receiving slot being adapted to the circuit board. In other embodiments, the way of fixing the circuit board by the test fixture 20 may be to press the circuit board onto the test fixture 20 by using a pressing device.

It is understood that the circuit board can be fixed by the test fixture 20 by other fixing methods, for example, two-way pressing and fixing the two opposite sides of the circuit board.

In some embodiments, the two moving assemblies 30 are gantry transfer devices, and the two gantry transfer devices are disposed opposite to each other, and the two moving assemblies 30 are configured to drive the probe assembly 40 to move along a first direction, a second direction and a third direction, wherein the first direction, the second direction and the third direction are mutually perpendicular in pairs, as shown in fig. 2, and the first direction is the same direction or the opposite direction of the X axis in the three-dimensional coordinate system in fig. 2; the second direction is the same direction or opposite direction of the Y axis in the three-dimensional coordinate system in fig. 2, and the third direction is the same direction or opposite direction of the Z axis in the three-dimensional coordinate system in fig. 2, and the two probe assemblies 40 can be driven by the two moving assemblies 30 to move to each position on the circuit board detection plane. In some embodiments, the moving assembly 30 includes a gantry and three sets of linear motors, the gantry is disposed on the base 10, one set of linear motors drives the gantry to move on the base 10 along the X direction, and the other two sets of linear motors are disposed on the gantry and are perpendicular to each other, wherein one set of linear motors is connected with the probe assembly 40 to drive the probe assembly 40 to move along the second direction and the third direction, respectively. In other embodiments, it is also contemplated that the motion assembly 30 includes a gantry and three sets of lead screw and nut mechanisms.

It should be noted that, along the Z-axis direction, the two moving assemblies 30 are disposed above the test fixture 20.

In the above-mentioned testing apparatus, the circuit board is fixed on the testing fixture 20, the two moving assemblies 30 respectively drive the two probe assemblies 40 to move to the positions above the first detecting point and the second detecting point of the circuit board along the first direction and the second direction, and drive the probe assemblies 40 to move downward in the third direction, so that the two probe assemblies 40 respectively contact with the first detecting point and the second detecting point, and the detecting module 50 receives the detecting signals of the two probe assemblies 40 and analyzes the detecting signals to obtain the testing result of the circuit board. The two probe assemblies 40 cooperate with the connected detection module 50 to complete the detection of the circuit board, thereby reducing the difficulty of the test and improving the detection efficiency.

It should be noted that the detecting module 50 is electrically connected to both the probe assemblies 40, so that when the two probe assemblies 40 contact with the probing points of the circuit board, the two probe assemblies 40 and the detecting module 50 form a path, and the detecting module 50 obtains a test result by detecting an electrical signal in the path.

In some embodiments, as shown in fig. 3A, the probe assembly 40 includes a rotary drive 41 and a probe 42, the rotary drive 41 includes a stationary portion 411 and a rotary portion 412 that rotates within the stationary portion 411, the stationary portion 411 is connected to the motion assembly 30, and the rotary portion 412 is connected to the probe 42.

In this embodiment, the rotary driving member 41 can be a motor, which includes a fixed portion 411 and a rotating portion 412, wherein the fixed portion 411 is connected to the moving assembly 30, and the rotating portion 412 is connected to the probe 42. So, the motion subassembly 30 drives the probe subassembly 40 through the fixed part 411 and moves along first direction and second direction, and the probe 42 on the probe subassembly 40 is driven to the rotating part 412 to the falling needle angle of the probe 42 on the probe subassembly 40 is adjusted, so that the circuit board test is more convenient, improves efficiency of software testing.

It will be appreciated that the rotary drive 41 may also be other rotary members, such as a hollow rotary platform or the like.

In some embodiments, the axis of rotation of rotating portion 412 is parallel to the direction of movement of motion assembly 30. Therefore, the probe assembly 40 is driven by the motion assembly 30 to move, and the probe 42 is driven by the rotating shaft to rotate in the Y direction without interference, so that the probe assembly 40 can test the circuit board smoothly.

In some embodiments, as shown in fig. 3B, the testing apparatus 100 further includes an rf probe 60, wherein the rf probe 60 is connected to a rotating part 412 and electrically connected to the detecting module 50.

The rotation part 412 can drive the rf probe 60 to rotate so as to adjust the tilt angle of the rf probe 60, so as to meet the testing requirements of target detection points with different tilt angles. An rf probe 60 is disposed adjacent to one of the probe assemblies 40, the rf probe 60 being used to detect rf signals on the circuit board.

Thus, by disposing the rf probe 60 and connecting the rf probe 60 to a rotating part 412, the rf probe 60 can be used to test the rf signal of the circuit board.

Referring to fig. 4, in some embodiments, the test fixture 20 includes a fixture body 21 and a rotating component 22, the fixture body 21 is used for fixing the circuit board, and the rotating component 22 is connected to the base 10 and the fixture body 21 and located between the base 10 and the fixture body 21.

The rotating assembly 22 is a hollow rotating platform, and is used for driving the jig main body 21 to rotate in the horizontal direction, so as to rotate and adjust the circuit board fixed on the jig main body 21 in the horizontal plane.

So, the rotating assembly 22 drives the tool main body 21 to rotate, the tool main body 21 rotates to drive the circuit board to rotate, on one hand, the probe assembly 40 can conveniently detect the target test point on the circuit board, and the detection efficiency is improved, on the other hand, the circuit board can be rotatably adjusted through the tool main body, so that the two moving assemblies 30 do not interfere in the X direction when driving the two probe assemblies 40 to move and move respectively, and the circuit board can be smoothly tested by the probe assemblies 40.

In some embodiments, the fixture body 21 includes a support frame 210, a support platform 211, and an overturning assembly 212. The supporting platform 211 is rotatably connected to the supporting frame 210, the turning assembly 212 is connected to the supporting frame 210 and can drive the supporting platform 211 to rotate, the supporting frame 210 is connected to the rotating assembly 22, the supporting platform 211 is used for fixing the circuit board, and a rotating shaft of the rotating assembly 22 is perpendicular to a rotating shaft of the turning assembly 212.

The supporting frame 210 is connected to the rotating component 22, for example, the rotating component 22 is a hollow rotating platform or a boss divider, etc. to drive the supporting frame 210 to rotate in the horizontal direction under the driving of the rotating component 22; the supporting platform 211 is rotatably connected with the supporting frame 210; the turning component 212 is connected with the supporting frame 210 and the supporting platform 211 and used for driving the supporting platform 211 to rotate, the supporting platform 211 is used for fixing the circuit board, and under the condition that the rotating shaft of the rotating component 22 is perpendicular to the rotating shaft of the turning component 212, the turning component 212 drives the supporting platform 211 to turn up and down by taking the shaft in the horizontal direction as the center, so that the upper surface and the lower surface of the supporting platform 211 are turned over.

Specifically, the tilting assembly 212 includes a first driving element 2120, for example, the first driving element 2120 is a rotary cylinder or a motor, the first driving element 2120 is connected to the supporting frame 210, the first driving element 2120 is connected to the supporting platform 211, and a driving direction of the first driving element 2120 is perpendicular to a driving direction of the rotating assembly 22.

Thus, the rotating assembly 22 drives the supporting frame 210 to rotate, and the supporting frame 210 rotates to drive the circuit board on the supporting platform 211 to rotate in the horizontal direction. The first driving member 2120 drives the supporting platform 211 to turn, and the supporting platform 211 turns to drive the circuit board to turn, so that the circuit board on the supporting platform 211 can be turned up and down under the cooperation of the first driving member 2120 and the rotating assembly 22, and the probe assembly 40 can detect electronic components on the other surface of the circuit board.

Referring to fig. 3B and fig. 5, in some embodiments, the testing apparatus 100 further includes an imaging assembly 80, the imaging assembly 80 includes a body 81, a second driving member 82, and an imaging device 83, the second driving member 82 is connected to the body 81, the imaging device 83 is connected to the second driving member 82, the body 81 is connected to the moving assembly 30, and a driving direction of the second driving member 82 is perpendicular to a plane in which the moving directions of the two moving assemblies 30 are located.

In this embodiment, a three-dimensional coordinate system is established, wherein the plane of the two motion assemblies 30 is the plane of the X-axis and the Y-axis, and the driving direction of the second driving member 82 is the Z-axis direction of the three-dimensional coordinate system, so as to drive the imaging device 83 to move closer to or away from the plane formed by X, Y. The second driving member 82 may be a motor or a cylinder. So, through the perpendicular setting in drive direction and the plane of two motion assembly 30 direction of motion with second driving piece 82, second driving piece 82 drives imaging device 83 and can move towards or keep away from the direction of circuit board to the realization is adjusted imaging device 83's height, improves imaging device 83 and gets for instance the definition, and this imaging device 83 is used for shooing electronic components's image, in order to obtain electronic components's image and positional information etc..

In some embodiments, the testing device 100 further comprises a knife setting assembly 70, wherein the knife setting assembly 70 comprises a base (not shown) and a knife setting bar (not shown), the knife setting bar is disposed on the base, and the base is disposed on the base 10. Therefore, the cutter bar is used as a reference, the imaging device 83 acquires images and position information of the cutter bar, and the probe 42 performs tool setting on the cutter bar, so that the coordinates of the probe and the imaging device 83 are unified, and meanwhile, the cutter bar can also correct and calibrate the coordinates of the probe 42, and the accuracy of the test device 100 for the circuit board is improved.

Specifically, the probe assembly 40 drives the probe 42 to move close to the tool setting rod along the Z direction, when the probe 42 is not in contact with the tool setting rod, the detection module 50 does not generate an electric signal, the probe 42 is in an off state with the tool setting rod, when the tip of the probe 42 is in contact with the tool setting rod, a closed circuit is formed between the probe 42 and the tool setting rod, the detection module 50 generates an electric signal, coordinate unification between the tip of the probe 42 and the tool setting rod is realized, and a tool setting process is completed.

Fig. 6 is a test diagram corresponding to the test method provided by the embodiment of the invention. Fig. 7 is a schematic flowchart of a testing method according to an embodiment of the present invention. The test method is used to test the circuit board 300. There are one or more components on the circuit board 300, and the currently detected component is a target component 310.

It should be noted that, according to different requirements, the order of the steps in the flowchart may be changed, and some steps may be omitted. For convenience of explanation, only relevant portions of the embodiments of the present invention are shown. The test method comprises the following steps:

s1, acquiring the coordinate (X1, Y1) and the polarity of the first detection point 311 and the coordinate (X2, Y2) and the polarity of the second detection point 312 of the target element 310 on the circuit board 300;

specifically, the coordinates (X1, Y1) of the first detection point 311 and the coordinates (X2, Y2) of the second detection point 312 are acquired, and the polarities of the first detection point 311 and the second detection point 312 are acquired. For example, the polarity of the first detecting point 311 is positive, and the polarity of the second detecting point 312 is negative, during the test, the first detecting point 311 should contact with the positive probe of the detecting module 50, and the second detecting point 312 should contact with the negative probe of the detecting module 50.

S2, calculating the distance between the first detection point 311 and the second detection point 312 based on the coordinates of the first detection point 311 and the coordinates of the second detection point 312;

specifically, before the probes 42 on the two probe assemblies 40 test the circuit board 300, the walking tracks of the two probes 42 are calculated and simulated in advance, and the distance between the first detection point 311 and the second detection point 312 is calculated to determine whether the walking tracks of the two probes 42 interfere with each other, so as to ensure that the probes 42 on the probe assemblies 40 test the circuit board 300 smoothly, and improve the testing efficiency.

S3, controlling the first probe assembly 43 and the second probe assembly 44 to move and contact the first probing point 311 and the second probing point 312 respectively based on the distance;

after the distance is measured, the first probe assembly 43 is controlled to contact the first probing points 311, and the second probe assembly 44 is controlled to contact the second probing points 312 to test the target component 310.

S4, receiving the detection signals from the first probe assembly 43 and the second probe assembly 44, generating a detection value, and determining whether the target device 310 is qualified according to the detection value.

Specifically, a test value is obtained, and whether the target element 310 meets a test requirement is determined according to the test value, where the test requirement may be a preset threshold, for example, the threshold of the target element 310 is 0 to 1; if the test value is judged to be between 0 and 1, the test value is judged to meet the requirement, and if the test result is judged not to be between 0 and 1, the test value is judged not to meet the requirement, so that the accuracy of the test result of the circuit board 300 is realized, the test difficulty of the circuit board 300 is reduced, and the test efficiency is improved.

Referring to fig. 8, the step of controlling the first probe assembly 43 and the second probe assembly 44 to move and contact the first probing points 311 and the second probing points 312 respectively based on the distance in step S3 includes:

s31, determining | X1-X2| > XL, wherein XL is a preset distance threshold. In the present embodiment, the first probe assembly 43 and the second probe assembly 44 are adopted to detect the first detecting point 311 and the second detecting point 312 respectively, and both the first probe assembly 43 and the second probe assembly 44 can move along the X and Y directions, but have a certain interference thickness in the X direction, so that the probe 42 cannot directly contact in the X direction, and further a distance threshold needs to be set. In other embodiments, if there is an interference thickness in the Y direction or other directions, the distance threshold in the corresponding direction is set. The test method can be applied to the test apparatus 100 shown in fig. 1 and 2, and can also be applied to detection equipment with other structures.

Specifically, XL is a preset distance threshold between the first detection point 311 and the second detection point 312, and is 5mm, for example. The distance between the coordinates (X1, Y1) of the first detection point 311 and the coordinates (X2, Y2) of the second detection point 312 on the X axis is calculated, and the calculated distance between the first detection point 311 and the second detection point 312 on the X axis is compared with the distance threshold XL.

S32, the first probe assembly 43 is moved to the first probing point 311 and contacts the first probing point 311, and the second probe assembly 44 is moved to the second probing point 312 and contacts the second probing point 312.

In particular, based on | X1-X2| > XL, during the process of moving the first probe assembly 43 and the second probe assembly 44, no interference occurs between the first probe assembly 43 and the second probe assembly 44, so that the normal test of the target element 310 by the first probe assembly 43 and the second probe assembly 44 is ensured, and the test reliability is improved. In one embodiment, the first probe assembly 43 and the second probe assembly 44 may be two sets of probe assemblies 40 as shown in FIG. 2.

Referring to fig. 9, the step of controlling the first probe assembly 43 and the second probe assembly 44 to move and contact the first probing points 311 and the second probing points 312 respectively based on the distance in step S3 includes:

S3A, determining | X1-X2| < XL and | Y1-Y2| > XL, wherein XL is a preset distance threshold;

in particular, XL is a preset distance threshold between the first detection point 311 and the second detection point 312, for example XL is 5 mm. The distance between the X axis and the Y axis of the coordinates (X1, Y1) of the first detection point 311 and the coordinates (X2, Y2) of the second detection point 312 are calculated, respectively, and the calculated distance between the X axis and the Y axis of the first detection point 311 and the second detection point 312 is compared with the distance by the threshold XL.

S3B, driving the circuit board 300 to rotate for 90 degrees; the first probe assembly 43 is moved to the first probe station 311 and contacts the first probe station 311, and the second probe assembly 44 is moved to the second probe station 312 and contacts the second probe station 312.

Specifically, as shown in fig. 10, | X1-X2| < XL indicates that the distance between the first detection point 311 and the second detection point 312 on the X axis is smaller than the distance threshold XL, and the first probe assembly 43 and the second probe assembly 44 move to the first detection point 311 and the second detection point 312 in the X direction respectively to detect, which may cause interference, but | Y1-Y2| > XL indicates that the distance between the first detection point 311 and the second detection point 312 on the Y axis is smaller than the distance threshold XL, the X axis and the Y axis are exchanged, the detection point Y coordinate is converted into the X coordinate, and the first probe assembly 43 and the second probe assembly 44 move to the first detection point 311 and the second detection point 312 respectively to detect, which may not cause interference, so that the circuit board 300 is driven to rotate 90 °, and the exchange of the detection point X coordinate and the Y coordinate is realized. When a motion assembly 30 is controlled to drive the first probe assembly 43 to the first probing point 311 and move the second probe assembly 44 to the second probing point 312, no interference occurs between the first probe assembly 43 and the second probe assembly 44, so as to ensure that the first probing point 311 and the second probing point 312 are successfully detected by the first probe assembly 43 and the second probe assembly 44, thereby improving the testing efficiency.

Referring to fig. 11, the testing method further includes:

s301, determining that X1-X2 is more than 0;

s302, the polarities of the first probe assembly 43 and the second probe assembly 44 are reversed.

Since the first probing point 311 and the second probing point 312 have different polarities in the present embodiment, the first probe assembly 43 for detecting the first probing point 311 needs to have the same polarity as the first probing point, and the second probe assembly 44 for detecting the second probing point 312 also needs to have the same polarity as the second probing point, so after determining that the distance between the first probing point 311 and the second probing point 312 on the X axis is greater than XL, the position of the first probing point 311 relative to the first probe assembly 43 and the position of the second probing point 312 relative to the second probe assembly 44 need to be determined. In this embodiment, the positions of the first probe assembly 43 and the second probe assembly 44 and the first probing points 311 and the second probing points 312 on the circuit board 300 are all located at the right side of the X-axis zero point, and the first probe assembly 43 for detecting the first probing points 311 is located at the left side of the second probe assembly 44 for detecting the second probing points 312, so that the first probe assembly 43 for detecting the first probing points 311 is located at a position close to the zero point. In the situation of | X1-X2| > XL, if the first probe assembly 43 moves directly to the first detecting point 311 and the second probe assembly 44 moves directly to the second detecting point 312, the first detecting point 311 needs to be located close to the zero point on the X axis, and the second detecting point 312 needs to be located far from the zero point, i.e., X2 > X1, and X1-X2 < 0. Based on X1-X2 > 0, it is indicated that the second detecting point 312 is close to the zero point on the X axis, and the first detecting point 311 is far away from the zero point, so that if the first probe assembly 43 and the second probe assembly 44 move to the detecting points for detection, interference occurs in position, and polarities of the two probe assemblies 40 are exchanged, so that the probe assemblies 40 and the detecting points with the same polarity are located on the same side, thereby avoiding interference between the two probe assemblies 40 in the process of moving the two probe assemblies 40, avoiding collision when the two probe assemblies 40 move, ensuring normal operation of the two probe assemblies 40, and improving detection efficiency.

In one embodiment, referring to fig. 12, the step of controlling the first probe assembly 43 and the second probe assembly 44 to move and contact the first probing point 311 and the second probing point 312 based on the distance in step S3 includes:

s31, determining | X1-X2| > XL, wherein XL is a preset distance threshold.

S301, determining that X1-X2 is more than 0;

s302, polarity of the first probe assembly 43 and the second probe assembly 44 is exchanged;

Referring to fig. 13, it can be seen from fig. 13 that the first probing point 311 is farther from the first probing assembly 43 than the second probing assembly 44, and the second probing point 312 is the same, so the polarities of the first probing assembly 43 and the second probing assembly 44 need to be changed, the probing point with the same polarity as the first probing assembly 43 is defined as the first probing point 311, and the other probing point is the second probing point 312, after the polarity is changed, the first probing assembly 43 moves to the new first probing point 311, and the second probing assembly 44 moves to the new second probing point 312 without the interference problem.

In another embodiment, referring to fig. 14, the step of controlling the first probe assembly 43 and the second probe assembly 44 to move and contact the first probing point 311 and the second probing point 312 based on the distance in step S3 includes:

S3B1, the driving circuit board 300 rotates for 90 degrees;

s301, determining that X1-X2 is more than 0;

S3B2, the first probe assembly 43 is moved to the first probing point 311 and contacts the first probing point 311, and the second probe assembly 44 is moved to the second probing point 312 and contacts the second probing point 312.

In this embodiment, the distance between the first detecting point 311 and the second detecting point 312 on the X axis is determined, based on | X1-X2| < XL and | Y1-Y2| > XL, it is described that there is interference in the X axis detection, and the distance gap between the Y axis satisfies the requirement, and the first probe assembly 43 and the second probe assembly 44 do not have interference on the Y axis, so the circuit board 300 is driven to rotate 90 °, the exchange between the X axis coordinate and the Y axis coordinate is realized, so the distance between the original Y axis is changed to the distance in the current X direction, and the problem of non-interference can be satisfied, at this time, the relationship between X1 and X2 of the new coordinate position needs to be determined, if X1-X2 < 0, the first probe assembly 43 directly moves to the first detecting point 311, the second detecting assembly directly moves to the second detecting point, if X1-X2 > 0, the polarities of the first probe assembly 43 and the second probe assembly 44 are exchanged, a probe assembly is moved to the first probing point 311 and contacts the first probing point 311, and a second probe assembly 44 is moved to the second probing point 312 and contacts the second probing point 312.

Referring to fig. 15, the step of controlling the first probe assembly 43 and the second probe assembly 44 to move and contact the first probing points 311 and the second probing points 312 respectively based on the distance in step S3 includes:

S3C, determining | X1-X2| < XL and | Y1-Y2| < XL, wherein XL is a preset distance threshold;

and S3D, controlling the first probe assembly 43 and the second probe assembly 44 not to work, and outputting an alarm signal.

Thus, it is determined that | X1-X2| < XL and | Y1-Y2| < XL, it can be determined that the first probe assembly 43 and the second probe assembly 44 will interfere during a subsequent test, and the first probe assembly 43 and the second probe assembly 44 are prevented from being damaged due to interference by controlling the first probe assembly 43 and the second probe assembly 44 not to operate, so as to ensure the normal operation of the first probe assembly 43 and the second probe assembly 44. And simultaneously, alarming and reminding are carried out to prompt staff.

Referring to fig. 16, the step of receiving the detection signals of the first probe assembly 43 and the second probe assembly 44 in step S5 to generate a detection value, and determining whether the target device 310 is qualified according to the detection value includes:

s51, comparing the detection value with the standard attribute value of the target element 310;

specifically, the standard attribute value is a standard value of the target component 310, wherein the standard attribute value may be a preset threshold value, for example, the threshold value of the target component 310 is 0-1; if the test value is judged to be between 0 and 1, the test value is judged to meet the requirement.

S52a, if the difference between the detected value and the standard attribute value exceeds the preset range, acquiring the image information of the target element 310, obtaining the position information of the target element 310 based on the image information, and re-detecting the target element 310 based on the position information.

If the test value is not between 0 and 1, the test value is judged not to meet the requirement, the imaging device obtains the image information of the target element 310, the position information of the target element 310 is obtained based on the image information, the target element 310 is re-detected based on the position information to achieve the accuracy of the test result of the circuit board 300, missing detection can be avoided, and the detection effect is improved. When the acquired position information does not match the preset position information, it is described that the position of the target device 310 is deviated, and the target device 310 is detected again by the position information in the image.

S52b, if the target element 310 is not present, controlling the first probe assembly 43 and the second probe assembly 44 to be out of operation, and outputting an alarm signal.

Therefore, when the target element 310 does not exist, the two probe assemblies are controlled not to work, useless work is avoided, and the detection efficiency is improved. If the attribute information of the target element 310 in the image is not consistent with the preset element attribute information, the element is wrongly attached, the two probe assemblies 40 are controlled not to work, useless work is avoided, and an alarm is given to remind a worker.

Fig. 17 is a block diagram of a test apparatus according to an embodiment of the present application. The testing device 200 comprises a processor 201 and a memory 202, the memory 202 storing a computer program 203, the computer program 203, when executed by the processor 201, causing the processor 201 to perform any of the above-described testing methods.

Illustratively, the computer program 203 may be one or more modules that are stored in the memory 202 and executed by the processor 201 to accomplish the present application.

It will be understood by those skilled in the art that the schematic diagram 12 is merely an example of the test apparatus 200 and does not constitute a limitation of the test apparatus 200, and that the test apparatus 200 may include more or less components than those shown, or some components may be combined, or different components.

The Processor 201 may be a Central Processing Unit (CPU), and may include other general purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field-Programmable Gate arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components, and the like. The general purpose processor 201 may be a microprocessor or the processor 201 may be any conventional processor 201 or the like, the processor 201 being the control center of the test apparatus 200, and various interfaces and lines connecting the various parts of the entire test apparatus 200.

The memory 202 may be used to store computer programs 203 and/or modules, and the processor 201 may implement various functions of the test device 200 by running or executing the computer programs 203 and/or modules stored in the memory 202 and invoking data stored in the memory 202. The storage 202 may include an external storage medium, and may also include a memory. Further, the memory 202 may include high speed random access memory 202, and may also include non-volatile memory 202, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), at least one piece of disk memory 202, a Flash memory device, or other piece of volatile solid state memory 202.

Thus, when the processor 201 executes the computer program 203, the target element 310 is tested, so that the target element 310 is automatically detected, the testing difficulty is reduced, and the testing efficiency is improved.

In one embodiment, there are multiple components on the circuit board 300, and the status of the components on the circuit board 300 can be at least one of the components in fig. 6, 10 and 13, and after the current target component 310 is tested, the probe assembly 40 moves to the next target component 310 for testing.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A test apparatus for testing a circuit board, the test apparatus comprising:

a base;

the test fixture is arranged on the base and used for fixing the circuit board;

the two moving components are connected with the base in a sliding manner;

the probe assemblies are respectively and rotatably connected with the motion assembly and are positioned on the opposite side surfaces of the motion assembly, and the motion assemblies are used for respectively driving the probe assemblies to move to a first detection point and a second detection point of the circuit board so that the probe assemblies are respectively contacted with the first detection point and the second detection point; and

2. The test apparatus of claim 1,

the probe subassembly is including rotating driving piece and probe, rotating driving piece includes the fixed part and is in the rotating part that the fixed part internal rotation set up, the fixed part connect in the motion subassembly, the rotating part is connected the probe.

3. The test apparatus of claim 2,

the rotation axis of the rotating part is parallel to the moving direction of the moving assembly.

4. The test apparatus of claim 2,

the testing device further comprises a radio frequency probe, and the radio frequency probe is connected to the rotating part and arranged at an interval with the probe.

5. The test apparatus of claim 1,

the test fixture comprises a fixture main body and a rotating assembly, wherein the fixture main body is arranged on the rotating assembly, the rotating assembly is connected with the base and used for driving the fixture main body to rotate, and the fixture main body is used for fixing the circuit board.

6. The test apparatus of claim 5,

the jig main body comprises a support frame, a support platform and a turnover assembly, the support platform is rotatably connected to the support frame, the turnover assembly is respectively connected with the support platform and the support frame and used for driving the support platform to turn over on the support frame, the support frame is arranged on the rotating assembly, and the support platform is used for fixing the circuit board.

7. The test apparatus of claim 6,

the overturning assembly comprises a first driving piece, the first driving piece is arranged on the supporting frame and connected to the supporting platform so as to drive the supporting platform to overturn.

8. The test apparatus of claim 2,

the testing device further comprises a tool setting assembly, the tool setting assembly comprises a base and a tool setting rod, the tool setting rod is arranged on the base, the base is arranged on the base, and the tool setting assembly is used for calibrating or correcting the probe.

9. The test apparatus of claim 1,

the testing arrangement still includes the formation of image subassembly, the formation of image subassembly includes body, second driving piece and formation of image device respectively, the second driving piece connect in the body, the formation of image device connect in the second driving piece, this body connect in the motion subassembly, the formation of image subassembly is used for right the circuit board is got for instance.

10. A test method for testing a circuit board, comprising:

acquiring the coordinates (X1, Y1) and the polarity of a first detection point of a target element on a circuit board, and the coordinates (X2, Y2) and the polarity of a second detection point;

11. The testing method of claim 10, wherein the step of controlling the first and second probe assemblies to move and contact the first and second probing points, respectively, based on the distance comprises:

determining | X1-X2| > XL, wherein XL is a preset distance threshold;

12. The testing method of claim 10, wherein the step of controlling the first and second probe assemblies to move and contact the first and second probing points, respectively, based on the distance comprises:

determining | X1-X2| < XL and | Y1-Y2| > XL, wherein XL is a preset distance threshold;

driving the circuit board to rotate 90 degrees;

13. The test method of claim 11 or 12, wherein the test method further comprises:

determining X1-X2 > 0;

14. The test method of claim 10, wherein the test method further comprises:

and outputting an alarm signal.

15. The method of claim 10, wherein the step of receiving the test signals from the first and second probe assemblies, generating a test value, and determining whether the target component is acceptable based on the test value comprises:

16. The test method according to claim 15, wherein the step of obtaining position information of the target element based on the image information and re-detecting the target element based on the position information comprises:

17. A test apparatus comprising a processor and a memory, the memory storing a computer program which, when executed by the processor, causes the processor to carry out a test method according to any one of claims 10-16.