CN114134550A - Preparation method of ceramic membrane covered wire with small surface roughness - Google Patents
Preparation method of ceramic membrane covered wire with small surface roughness Download PDFInfo
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- CN114134550A CN114134550A CN202111435246.8A CN202111435246A CN114134550A CN 114134550 A CN114134550 A CN 114134550A CN 202111435246 A CN202111435246 A CN 202111435246A CN 114134550 A CN114134550 A CN 114134550A
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- aluminum substrate
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- covered wire
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- 239000000919 ceramic Substances 0.000 title claims abstract description 18
- 230000003746 surface roughness Effects 0.000 title claims abstract description 15
- 239000012528 membrane Substances 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003792 electrolyte Substances 0.000 claims abstract description 19
- 238000007745 plasma electrolytic oxidation reaction Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 238000009210 therapy by ultrasound Methods 0.000 claims abstract description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000012153 distilled water Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 abstract description 10
- 229910052574 oxide ceramic Inorganic materials 0.000 abstract description 10
- 230000004089 microcirculation Effects 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a preparation method of a ceramic membrane covered wire with small surface roughness, which comprises the steps of completely immersing an aluminum substrate into an electroplating bath filled with electrolyte, and then applying alternating voltage to two electrodes preset in the electroplating bath to alternately serve as an anode and a cathode so as to form an oxide ceramic membrane on the surface of the aluminum substrate immersed in the electrolyte; starting an ultrasonic generator in the electroplating bath after micro-arc oxidation treatment for 15min, and carrying out ultrasonic treatment on the electrolyte until the micro-arc oxidation treatment is finished; the introduction of the ultrasonic effect can effectively strengthen the microcirculation of the electrolyte on the surface of the aluminum substrate, so that the molten oxide formed on the surface of the aluminum substrate during the discharge of the micro plasma arc tends to be flat and fills micropores during cooling and solidification, thereby the surface of the formed oxide ceramic membrane is more flat, and the surface roughness is effectively improved.
Description
Technical Field
The invention relates to the technical field of transformer coil materials, in particular to a preparation method of a ceramic membrane covered wire with small surface roughness.
Background
Oxidation treatment generally refers to the deliberate oxidation of the surface of metallic and semiconductor materials by chemical, electrochemical (anodic oxidation), or other means. The oxide film layer formed during the oxidation treatment generally serves a protective, technical or decorative purpose. The existing micro-arc oxidation ceramic membrane is generally composed of a transition layer, a working layer and a porous layer, wherein the porous layer is positioned on the outermost surface, the pores of the porous layer are more, and the surface of the micro-arc oxidation layer with more pores is rough.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a preparation method of a ceramic membrane covered wire with small surface roughness.
In order to achieve the purpose, the invention provides a preparation method of a ceramic membrane covered wire with small surface roughness, which comprises the following steps:
step A1: polishing and washing the surface of the aluminum substrate;
step A2: immersing the aluminum substrate treated in the step a1 completely in a plating bath containing an electrolyte, and then alternately serving as an anode and a cathode by applying an alternating voltage to two electrodes provided in the plating bath, thereby forming a ceramic oxide film on the surface of the aluminum substrate immersed in the electrolyte;
step A3: after the micro-arc oxidation treatment is carried out for 15min in the step A2, starting an ultrasonic generator in the electroplating bath, and carrying out ultrasonic treatment on the electrolyte until the micro-arc oxidation treatment is finished;
step A4: the aluminum substrate treated in the step A3 was subjected to heat treatment, followed by standing and cooling.
Furthermore, the electrolyte components contained in the electroplating bath comprise NaOH, water glass and distilled water.
Furthermore, the power of the ultrasonic generator is 200W, and the frequency of the ultrasonic wave is 20 KHz-40 KHz.
Further, the heat treatment mode is as follows: and (4) placing the aluminum substrate treated by the step A3 in a thermal environment of 300-320 ℃, keeping the temperature for 1-2h in an inert atmosphere, and naturally cooling.
Through adopting this technical scheme, its beneficial effect lies in: the ultrasonic effect is introduced in the micro-arc oxidation treatment process, so that the microcirculation of the electrolyte on the surface of the aluminum substrate can be effectively enhanced, molten oxide formed on the surface of the aluminum substrate during micro-plasma arc discharge tends to be flat and fills micropores during cooling and solidification, the surface of the formed oxide ceramic membrane is more flat, and the surface roughness is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of an oxide ceramic membrane covered wire according to the present invention.
FIG. 2 is a schematic view of a plating cell of the invention.
Wherein, 100-aluminum substrate, 200-oxide ceramic membrane, 1-first electroplating bath, 2-electrode and 3-ultrasonic generator.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
It is to be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in the generic and descriptive sense only and not for purposes of limitation, as the term is used in the generic and descriptive sense, and not for purposes of limitation, unless otherwise specified or implied, and the specific reference to a device or element is intended to be a reference to a particular element, structure, or component. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-2, in this embodiment, a method for preparing a ceramic film covered wire includes the following steps:
step A1: the method comprises the steps of grinding and washing the surface of an aluminum substrate, specifically, mechanically grinding and polishing the surface of the aluminum substrate by a grinding wheel or a roller brush in advance, then immersing the ground aluminum substrate into a solution with sulfuric acid concentration of 140-.
Step A2: the aluminum substrate 100 treated in step A1 is completely immersed in a plating bath 1 containing an electrolyte, and then alternately used as an anode and a cathode by applying an alternating voltage to two electrodes 2 provided in the plating bath 1, thereby forming an oxide ceramic film 200 on the surface of the aluminum substrate 100 immersed in the electrolyte.
Specifically, the two electrodes 2 of the present embodiment are cylindrical structures coaxially arranged, since the electrodes 2 are completely immersed in the electrolyte so that the inner cavity of each electrode 2 is filled with the electrolyte. The aluminum substrate 100 is sequentially passed through the inner cavities of the electrodes 2 in the axial extension direction of the electrodes 2, whereby, during the oxidation, the current applied from the external power supply flows in accordance with the circuit "electrode 2-electrolyte-aluminum substrate 100-electrolyte-electrode 2", thereby forming a uniform ceramic oxide film 200 on the surface of the aluminum substrate 100.
Further, the electrolytic solution contained in the plating tank 1 includes NaOH, water glass, and distilled water.
Step A3: after the micro-arc oxidation treatment is carried out for 15min in the step A2, the ultrasonic generator 3 in the electroplating bath 1 is started, so that the electrolyte is subjected to ultrasonic treatment until the micro-arc oxidation treatment is finished.
Specifically, the microcirculation of the electrolyte on the surface of the aluminum substrate can be effectively enhanced through the ultrasonic action, so that molten oxide formed on the surface of the aluminum substrate during micro plasma arc discharge tends to be flat and fills micropores during cooling and solidification, the surface of the formed oxide ceramic film 200 is more flat, and the surface roughness is effectively improved.
Step A4: the aluminum substrate treated in the step A3 was subjected to heat treatment, followed by standing and cooling.
Specifically, the heat treatment method of this embodiment is: the aluminum substrate 100 is placed in a thermal environment of 300-320 ℃, and is kept at a constant temperature for 1-2 hours in an inert atmosphere, and is naturally cooled, so as to improve the thermal stress of the oxide ceramic film 200.
The ceramic oxide film 200 is formed on the surface of the aluminum substrate 100, and has the characteristics of flat and smooth surface, less pores and small surface roughness.
The specific parametric properties of the oxide ceramic film 200 for the ceramic film covered wire are as follows:
| hardness of | Coefficient of friction | Breakdown voltage | Corrosion resistance | High heat transfer coefficient | |
| Oxide ceramic membrane | 5200kg/mm² | ≤0.01 | 3KV | More than or equal to 12000 hours | 10W（m⋅K） |
The ceramic oxide film has the characteristics of high hardness, corrosion resistance, wear resistance, insulation, small surface roughness and the like.
The above-described embodiments are merely preferred embodiments of the present invention, which is not intended to limit the present invention in any way. Those skilled in the art can make many changes, modifications, and equivalents to the embodiments of the invention without departing from the scope of the invention as set forth in the claims below. Therefore, equivalent changes made according to the spirit of the present invention should be covered within the protection scope of the present invention without departing from the contents of the technical scheme of the present invention.
Claims (4)
1. A preparation method of a ceramic membrane covered wire with small surface roughness is characterized by comprising the following steps: the method comprises the following steps:
step A1: polishing and washing the surface of the aluminum substrate;
step A2: immersing the aluminum substrate (100) treated in the step A1 completely in a plating bath (1) filled with an electrolyte, and then alternately acting as an anode and a cathode by applying an alternating voltage to two electrodes (2) provided in the plating bath (1), thereby forming a ceramic oxide film (200) on the surface of the aluminum substrate (100) immersed in the electrolyte;
step A3: after the micro-arc oxidation treatment is carried out for 15min in the step A2, starting an ultrasonic generator (3) in the electroplating bath (1) so as to carry out ultrasonic treatment on the electrolyte until the micro-arc oxidation treatment is finished;
step A4: the aluminum substrate treated in the step A3 was subjected to heat treatment, followed by standing and cooling.
2. The method according to claim 1, wherein the ceramic film covered wire having a small surface roughness comprises: the electrolyte components contained in the electroplating bath comprise NaOH, water glass and distilled water.
3. The method according to claim 1, wherein the ceramic film covered wire having a small surface roughness comprises: the power of the ultrasonic generator is 200W, and the frequency of the ultrasonic wave is 20 KHz-40 KHz.
4. The method according to claim 1, wherein the ceramic film covered wire having a small surface roughness comprises: the heat treatment mode is as follows: the aluminum substrate (100) treated by the step A3 is placed in a thermal environment of 300-320 ℃ and is kept at the constant temperature for 1-2h under an inert atmosphere, and then is naturally cooled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111435246.8A CN114134550A (en) | 2021-11-29 | 2021-11-29 | Preparation method of ceramic membrane covered wire with small surface roughness |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111435246.8A CN114134550A (en) | 2021-11-29 | 2021-11-29 | Preparation method of ceramic membrane covered wire with small surface roughness |
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| Publication Number | Publication Date |
|---|---|
| CN114134550A true CN114134550A (en) | 2022-03-04 |
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| CN202111435246.8A Pending CN114134550A (en) | 2021-11-29 | 2021-11-29 | Preparation method of ceramic membrane covered wire with small surface roughness |
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| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102424998A (en) * | 2011-11-27 | 2012-04-25 | 西北有色金属研究院 | Method for reducing surface roughness of micro arc oxidized ceramic layer |
| CN111627592A (en) * | 2020-07-01 | 2020-09-04 | 西比里电机技术(苏州)有限公司 | High-temperature-resistant corona-resistant ceramic film covered wire and preparation method thereof |
| CN112647105A (en) * | 2021-01-16 | 2021-04-13 | 郝云霞 | Hole sealing treatment method for aluminum alloy micro-arc oxidation ceramic membrane |
-
2021
- 2021-11-29 CN CN202111435246.8A patent/CN114134550A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102424998A (en) * | 2011-11-27 | 2012-04-25 | 西北有色金属研究院 | Method for reducing surface roughness of micro arc oxidized ceramic layer |
| CN111627592A (en) * | 2020-07-01 | 2020-09-04 | 西比里电机技术(苏州)有限公司 | High-temperature-resistant corona-resistant ceramic film covered wire and preparation method thereof |
| CN112647105A (en) * | 2021-01-16 | 2021-04-13 | 郝云霞 | Hole sealing treatment method for aluminum alloy micro-arc oxidation ceramic membrane |
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