CN114277418A - Preparation method of pore-free ceramic membrane covered wire - Google Patents
Preparation method of pore-free ceramic membrane covered wire Download PDFInfo
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- CN114277418A CN114277418A CN202111433477.5A CN202111433477A CN114277418A CN 114277418 A CN114277418 A CN 114277418A CN 202111433477 A CN202111433477 A CN 202111433477A CN 114277418 A CN114277418 A CN 114277418A
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- covered wire
- ceramic membrane
- aluminum substrate
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- polyvinylidene fluoride
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Abstract
The invention provides a preparation method of a pore-free ceramic membrane covered wire, which comprises the steps of completely immersing an aluminum substrate into an electroplating bath filled with electrolyte, and then applying alternating voltage to two electrodes preset in the electroplating bath to alternately serve as an anode and a cathode so as to form an oxide ceramic membrane on the surface of the aluminum substrate immersed in the electrolyte; and then, pressurizing and flushing the aluminum substrate with the oxide ceramic membrane for 20-35 min under a preset filling liquid, pressurizing and polishing the oxide ceramic membrane formed on the surface of the aluminum substrate by using grinding particles, and attaching polyvinylidene fluoride resin to the surface and the pores of the oxide ceramic membrane, so that the surface of the oxide ceramic membrane is smooth and flat and has no pores, the performance of the ceramic membrane covered wire is effectively improved, and the ceramic membrane covered wire has higher strength, corrosion resistance, wear resistance, insulation and high thermal conductivity.
Description
Technical Field
The invention relates to the technical field of transformer coil materials, in particular to a preparation method of a pore-free ceramic membrane covered wire.
Background
Oxidation treatment generally refers to the deliberate oxidation of the surface of metallic and semiconductor materials by chemical, electrochemical (anodic oxidation), or other means. The oxide film layer formed during the oxidation treatment generally serves a protective, technical or decorative purpose.
The existing ceramic oxide film formed by micro-arc oxidation generally comprises a transition layer, a working layer and a porous layer, wherein the porous layer is positioned on the outermost surface, the porous layer has more pores and low hardness, and the properties of the ceramic oxide film, such as hardness, corrosion resistance and the like, are greatly influenced, so that how to eliminate or reduce the thickness of the porous layer or reduce the number of the pores is of great importance, and the properties can be effectively improved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a preparation method of a pore-free ceramic membrane covered wire.
In order to achieve the aim, the invention provides a preparation method of a non-porous ceramic membrane covered wire, which comprises the following steps:
step A1: polishing and washing the surface of the aluminum substrate;
step A2: immersing the aluminum substrate treated in the step a1 completely in a plating bath containing an electrolyte, and then alternately serving as an anode and a cathode by applying an alternating voltage to two electrodes provided in the plating bath, thereby forming a ceramic oxide film on the surface of the aluminum substrate immersed in the electrolyte;
step A3: pressurizing and washing the aluminum matrix with the oxide ceramic membrane for 20-35 min under a preset filling liquid, wherein the filling liquid is an ionic water solution with grinding particles and polyvinylidene fluoride resin;
step A4: and D, carrying out heat treatment on the aluminum matrix treated in the step A3 at the temperature of 145-165 ℃ for 15-20min, and standing and cooling to obtain the required ceramic membrane covered wire.
Further, in step A4, the aluminum substrate is heat treated under an inert atmosphere.
Further, the heat treatment of step a4 is a high-temperature steam heat treatment.
Further, step a 5: and coating insulating resin on the surface of the ceramic membrane covered wire.
Further, the abrasive particles are alpha-Al 2O 3, and the particle size of the abrasive particles is 15-50 μm.
Furthermore, the concentration of the polyvinylidene fluoride resin is 6g/L, and the particle size of the polyvinylidene fluoride resin is 2-5 μm.
Through adopting this technical scheme, its beneficial effect lies in: the ceramic oxide film formed on the surface of the aluminum substrate is subjected to pressure polishing by the abrasive particles, and the polyvinylidene fluoride resin is attached to the surface and the pores of the ceramic oxide film, so that the surface of the ceramic oxide film is smooth and flat and has no pores, the performance of the ceramic film covered wire is effectively improved, and the ceramic film covered wire has higher strength, is corrosion-resistant, wear-resistant, insulating and high in thermal conductivity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of an oxide ceramic membrane covered wire according to the present invention;
FIG. 2 is a schematic view of a plating cell of the invention.
Among them, 100-aluminum substrate, 200-oxide ceramic membrane, 1-electroplating bath, 2-electrode.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
It is to be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in the generic and descriptive sense only and not for purposes of limitation, as the term is used in the generic and descriptive sense, and not for purposes of limitation, unless otherwise specified or implied, and the specific reference to a device or element is intended to be a reference to a particular element, structure, or component. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 and 2, in this embodiment, a method for preparing a ceramic film covered wire includes the following steps:
step A1: polishing and washing the surface of the aluminum substrate 100; specifically, the method is implemented by mechanically grinding and polishing the surface of the aluminum substrate in advance through a grinding wheel or a roller brush, then immersing the ground aluminum substrate into a solution with the sulfuric acid concentration of 140-200g/L for 3min, and then washing and scrubbing the aluminum substrate with clean water to remove stains on the surface.
Step A2: the aluminum substrate 100 treated in step A1 is completely immersed in a plating bath 1 containing an electrolyte, and then alternately used as an anode and a cathode by applying an alternating voltage to two electrodes 2 provided in the plating bath 1, thereby forming an oxide ceramic film 200 on the surface of the aluminum substrate 100 immersed in the electrolyte.
Specifically, the two electrodes 2 of the present embodiment are cylindrical structures coaxially arranged, since the electrodes 2 are completely immersed in the electrolyte so that the inner cavity of each electrode 2 is filled with the electrolyte. The aluminum substrate 100 is sequentially passed through the inner cavities of the electrodes 2 in the axial extension direction of the electrodes 2, whereby, during the oxidation, the current applied from the external power supply flows in accordance with the circuit "electrode 2-electrolyte-aluminum substrate 100-electrolyte-electrode 2", thereby forming a uniform ceramic oxide film 200 on the surface of the aluminum substrate 100.
Further, the electrolytic solution contained in the plating tank 1 includes NaOH, water glass, and distilled water.
In this embodiment, the thickness of the ceramic oxide film 200 formed on the surface of the aluminum substrate through the step A2 is 20 to 100. mu.m.
Step A3: and pressurizing and washing the aluminum substrate 100 with the oxide ceramic membrane 200 under a preset filling liquid for 20-35 min, wherein the filling liquid is an ionic water solution containing grinding particles and polyvinylidene fluoride resin.
Specifically, the filling liquid forms a high-pressure water flow to flush the surface of the aluminum substrate 100 after being pressurized, the particle size of the abrasive particles is larger than that of the polyvinylidene fluoride resin, the abrasive particles under the high-pressure impact will impact and polish the oxide ceramic membrane 200, and the porous layer located at the outermost layer of the oxide ceramic membrane 200 has more pores and low hardness, so the porous layer will be gradually polished under the impact of the abrasive particles. Meanwhile, the particle size of the polyvinylidene fluoride resin is close to the pore size of the porous layer, and under the high-pressure action and the grinding action of the grinding particles, the polyvinylidene fluoride resin can be attached to the surface of the porous layer and part of the polyvinylidene fluoride resin can be attached to and filled in the pores of the porous layer, so that the hole sealing operation is realized. Thus, the surface of the ceramic oxide film 200 treated in step a3 is smooth, and the polyvinylidene fluoride resin is attached to and filled in the pores.
The polyvinylidene fluoride resin is a white crystalline polymer, has high mechanical strength, excellent corrosion resistance, high temperature resistance, oxidation resistance and wear resistance, high dielectric strength and good insulativity, and can effectively improve the performance of ceramic membrane covered wires after being attached to the surface and in the pores of the oxide ceramic membrane 200.
Step A4: and D, carrying out heat treatment on the aluminum substrate 100 treated in the step A3 at the temperature of 145-165 ℃ for 15-20min, and then standing and cooling to obtain the required ceramic membrane covered wire. Specifically, the heat treatment in step a4 is a high-temperature steam heat treatment, so that the polyvinylidene fluoride resin filled into the pores is cured in a hydrothermal manner, and the pores are completely blocked by expansion of the polyvinylidene fluoride resin, thereby further improving the sealing effect.
Further, in step a4, the aluminum substrate 100 is heat treated under an inert atmosphere.
Further, the grinding particles are alpha-Al 2O 3, and the particle size of the grinding particles is 15-50 mu m; the concentration of the polyvinylidene fluoride resin is 6g/L, and the particle size of the polyvinylidene fluoride resin is 2-5 mu m.
Step A5: the ceramic film covered wire is coated with an insulating resin, and the ceramic oxide film 200 is protected by the insulating resin.
The performance of the ceramic film covered wire prepared in the above way compared with the conventional numerical transformer wire is as follows:
| weight (D) | Working temperature/. degree.C | Energy efficiency under nominal load conditions | Energy efficiency at double nominal load | Hardness of | |
| Conventional resin transformer | 300kg | -60 to +50 | 97.4% | / | 2000kg/mm² |
| Ceramic membrane covered wire | 96kg | -70 to +450 | 98.6% | 95% | 5200kg/mm² |
Further, the specific parameter performance of the ceramic oxide film 200 for the ceramic film covered wire is as follows:
| hardness of | Coefficient of friction | Breakdown voltage | Corrosion resistance | High heat transfer coefficient | |
| Oxide ceramic membrane | 5200kg/mm² | ≤0.02 | 3KV | More than or equal to 12000 hours | 10W（m⋅K） |
From the performance parameters mentioned above, one can derive: the ceramic film covered wire with the oxide ceramic film 200 has the characteristics of high hardness, corrosion resistance, wear resistance, insulation, high thermal conductivity, wide working temperature range and the like.
The above-described embodiments are merely preferred embodiments of the present invention, which is not intended to limit the present invention in any way. Those skilled in the art can make many changes, modifications, and equivalents to the embodiments of the invention without departing from the scope of the invention as set forth in the claims below. Therefore, equivalent changes made according to the spirit of the present invention should be covered within the protection scope of the present invention without departing from the contents of the technical scheme of the present invention.
Claims (6)
1. A preparation method of a pore-free ceramic membrane covered wire is characterized by comprising the following steps: the method comprises the following steps:
step A1: polishing and washing the surface of the aluminum substrate (100);
step A2: immersing the aluminum substrate (100) treated in the step A1 completely in a plating bath (1) filled with an electrolyte, and then alternately acting as an anode and a cathode by applying an alternating voltage to two electrodes (2) provided in the plating bath (1), thereby forming a ceramic oxide film (200) on the surface of the aluminum substrate (100) immersed in the electrolyte;
step A3: pressurizing and washing the aluminum substrate (100) with the oxide ceramic membrane (200) under a preset filling liquid for 20-35 min, wherein the filling liquid is an ionic water solution containing grinding particles and polyvinylidene fluoride resin;
step A4: and D, carrying out heat treatment on the aluminum matrix (100) treated in the step A3 at the temperature of 145-165 ℃ for 15-20min, and then standing and cooling to obtain the required ceramic membrane covered wire.
2. The method according to claim 1, wherein the ceramic film-covered wire is prepared by: in step A4, an aluminum substrate (100) is heat treated under an inert atmosphere.
3. The method according to claim 1, wherein the ceramic film-covered wire is prepared by: the heat treatment of step a4 is a high temperature steam heat treatment.
4. The method according to claim 1, wherein the ceramic film-covered wire is prepared by: step A5: and coating insulating resin on the surface of the ceramic membrane covered wire.
5. The method according to claim 1, wherein the ceramic film-covered wire is prepared by: the grinding particles are alpha-Al 2O 3, and the particle size of the grinding particles is 15-50 mu m.
6. The method according to claim 1, wherein the ceramic film-covered wire is prepared by: the concentration of the polyvinylidene fluoride resin is 6g/L, and the particle size of the polyvinylidene fluoride resin is 2-5 mu m.
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| CN202111433477.5A CN114277418A (en) | 2021-11-29 | 2021-11-29 | Preparation method of pore-free ceramic membrane covered wire |
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| CN202111433477.5A CN114277418A (en) | 2021-11-29 | 2021-11-29 | Preparation method of pore-free ceramic membrane covered wire |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0541115A (en) * | 1991-08-06 | 1993-02-19 | Showa Electric Wire & Cable Co Ltd | Heat resistant electric cable and manufacture thereof |
| CN101608332A (en) * | 2008-06-19 | 2009-12-23 | 深圳富泰宏精密工业有限公司 | Aluminium alloy of surface tool ceramic coating formed by micro-arc oxidation and preparation method thereof |
| CN103952742A (en) * | 2014-04-22 | 2014-07-30 | 上海理工大学 | Copper lead with insulating layer and preparation method thereof |
| JP2017186638A (en) * | 2016-04-08 | 2017-10-12 | 科▲こう▼電子股▲ふん▼有限公司 | Sealing device for sealing hole of anodic oxide film using vacuum and steam jet and method therefor |
| CN109023470A (en) * | 2018-09-25 | 2018-12-18 | 巩义市宏盛稀有金属有限公司 | The modified aluminium alloy extrusions of a kind of aluminium alloy section surface differential arc oxidation method of modifying and surface |
| CN111627592A (en) * | 2020-07-01 | 2020-09-04 | 西比里电机技术(苏州)有限公司 | High-temperature-resistant corona-resistant ceramic film covered wire and preparation method thereof |
| CN112647105A (en) * | 2021-01-16 | 2021-04-13 | 郝云霞 | Hole sealing treatment method for aluminum alloy micro-arc oxidation ceramic membrane |
-
2021
- 2021-11-29 CN CN202111433477.5A patent/CN114277418A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0541115A (en) * | 1991-08-06 | 1993-02-19 | Showa Electric Wire & Cable Co Ltd | Heat resistant electric cable and manufacture thereof |
| CN101608332A (en) * | 2008-06-19 | 2009-12-23 | 深圳富泰宏精密工业有限公司 | Aluminium alloy of surface tool ceramic coating formed by micro-arc oxidation and preparation method thereof |
| CN103952742A (en) * | 2014-04-22 | 2014-07-30 | 上海理工大学 | Copper lead with insulating layer and preparation method thereof |
| JP2017186638A (en) * | 2016-04-08 | 2017-10-12 | 科▲こう▼電子股▲ふん▼有限公司 | Sealing device for sealing hole of anodic oxide film using vacuum and steam jet and method therefor |
| CN109023470A (en) * | 2018-09-25 | 2018-12-18 | 巩义市宏盛稀有金属有限公司 | The modified aluminium alloy extrusions of a kind of aluminium alloy section surface differential arc oxidation method of modifying and surface |
| CN111627592A (en) * | 2020-07-01 | 2020-09-04 | 西比里电机技术(苏州)有限公司 | High-temperature-resistant corona-resistant ceramic film covered wire and preparation method thereof |
| CN112647105A (en) * | 2021-01-16 | 2021-04-13 | 郝云霞 | Hole sealing treatment method for aluminum alloy micro-arc oxidation ceramic membrane |
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