CN114134373A - Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof - Google Patents

Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof Download PDF

Info

Publication number
CN114134373A
CN114134373A CN202111369544.1A CN202111369544A CN114134373A CN 114134373 A CN114134373 A CN 114134373A CN 202111369544 A CN202111369544 A CN 202111369544A CN 114134373 A CN114134373 A CN 114134373A
Authority
CN
China
Prior art keywords
silicon
aluminum alloy
packaging material
tensile strength
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111369544.1A
Other languages
Chinese (zh)
Inventor
赵永红
邢大伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Ding Ding Institute Of New Mstar Technology Ltd
Original Assignee
Harbin Ding Ding Institute Of New Mstar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin Ding Ding Institute Of New Mstar Technology Ltd filed Critical Harbin Ding Ding Institute Of New Mstar Technology Ltd
Priority to CN202111369544.1A priority Critical patent/CN114134373A/en
Publication of CN114134373A publication Critical patent/CN114134373A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/298—Semiconductor material, e.g. amorphous silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/248—Thermal after-treatment
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/002—Carbon nanotubes

Abstract

The invention discloses a silicon-aluminum alloy packaging material with high tensile strength and a preparation method thereof, belonging to the technical field of electronic packaging materials for electronic information industry. The invention solves the problem that the tensile strength of the material is lower when the silicon content of the existing high-silicon aluminum alloy material is more than 50 percent. In the invention, under the condition that the content of silicon in the high-silicon aluminum alloy material is 50-85%, a proper proportion of carbon nano tubes are added, so that the thermal expansion coefficient of the packaging material is kept at(6～9)×10‑6The temperature is lower, namely the expansion and shrinkage phenomenon of the material at high temperature is smaller, and the tensile strength of the alloy material is improved from 110MPa to 150 MPa-350 MPa. Therefore, the high-silicon aluminum alloy material has higher tensile strength under the condition of the same volume.

Description

Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof
Technical Field
The invention relates to a silicon-aluminum alloy packaging material with high tensile strength and a preparation method thereof, belonging to the technical field of electronic packaging materials for electronic information industry.
Background
The silicon-aluminum alloy electronic device is widely applied to the fields of space flight and aviation, ship-based radar and the like. In addition, the high-end electronic packaging material, namely the high-silicon aluminum alloy, is developed by particularly researching the packaging material of the high-end electronic chip. The high-silicon aluminum alloy refers to a silicon-aluminum-based composite material with the Si content of more than 27 percent. The high-silicon aluminum alloy electronic packaging material is developed in 90 years of 20 th century in China. As a light electronic packaging material, the material has outstanding advantages, and firstly, the physical property design of the material can be realized by changing the alloy components; the material is a metal-based electronic packaging material with the lightest mass for the aircraft, and has excellent comprehensive performance; thirdly, the low cost requirement can be realized. When the silicon content of the high-silicon aluminum alloy material is more than 50%, the tensile strength of the material is low, and the performance of the material is influenced, so that the silicon aluminum alloy packaging material with high tensile strength is very necessary.
Disclosure of Invention
In order to solve the technical problems, the invention provides a silicon-aluminum alloy packaging material with high tensile strength and a preparation method thereof.
The technical scheme of the invention is as follows:
a silicon-aluminum alloy packaging material with high tensile strength comprises the following chemical components in parts by weight: 50-85% of silicon, 50-15% of aluminum and the total content of other metals Mg, Cu, Zn, Pb and Fe is below 2%.
Further defined, the alloy packaging material comprises the following raw materials: silicon powder, silicon-aluminum alloy powder and carbon nano tubes.
Further limited, the silicon powder and the silicon-aluminum alloy powder are mixed into alloy powder with the silicon content of 50-85 percent.
Further limited, the mass content of the carbon nano tube is 0.5 to 2 percent of the total mass of the alloy powder.
Further, the carbon nanotube is a single-walled carbon nanotube having a diameter of 0.6 to 2nm and an aspect ratio of (20 to 200): 1.
Further limit, the grain sizes of the silicon powder and the silicon-aluminum alloy powder are both more than 200 meshes.
The preparation method of the silicon-aluminum alloy packaging material comprises the following steps:
step 1, uniformly mixing silicon powder and silicon-aluminum alloy powder to obtain high-silicon-aluminum alloy powder;
step 2, putting the high-silicon aluminum alloy powder and the single-walled carbon nanotubes into a mixer for rolling mixing until the materials are uniformly mixed;
step 3, putting the powder mixed in the step 2 into an aluminum sheath, sealing, vacuumizing the sheath to ensure that the vacuum degree in the sheath is less than or equal to 2 multiplied by 104Pa, performing heat treatment on the sheath in an argon atmosphere, and performing gradient cooling to room temperature;
and 4, removing the sheath after the heat treatment in the step 3, performing heat treatment again, and cooling to obtain the silicon-aluminum alloy packaging material with high tensile strength.
Further limiting, the heat treatment temperature in the step 3 is 560 ℃, and the treatment time is 5 h.
Further limiting, the heat treatment temperature in the step 4 is 530 ℃, and the treatment time is 4 h.
The invention has the beneficial effects that:
under the condition that the content of silicon in the high-silicon aluminum alloy material is 50-85%, the carbon nano tube is added in a proper proportion, so that the thermal expansion coefficient of the packaging material is kept at (6-9) x 10-6The temperature is lower, namely the expansion and shrinkage phenomenon of the material at high temperature is smaller, and the tensile strength of the alloy material is improved from 110MPa to 150 MPa-350 MPa. Therefore, the high-silicon aluminum alloy material has higher tensile strength under the condition of the same volume.
Drawings
FIG. 1 is a graph comparing tensile strength performance curves of high silicon aluminum alloy materials doped with single-walled carbon nanotubes of different content and different aspect ratios;
FIG. 2 is a graph of a thermal expansion coefficient test of a high silicon aluminum alloy material with a silicon content of 70%;
FIG. 3 is a thermal expansion coefficient test graph of a high silicon aluminum alloy material with 70% silicon content and doped carbon nanotubes with an aspect ratio of 200:1 and a doping amount of 2%;
FIG. 4 is a gold phase diagram of a high silicon aluminum alloy material with a doping amount of 2.5% for carbon nanotubes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The experimental procedures used in the following examples are conventional unless otherwise specified. The materials, methods and apparatus used, unless otherwise specified, are conventional in the art and are commercially available to those skilled in the art.
Example 1:
the specific operation steps of this embodiment are as follows:
step 1, selecting Si powder and AlSi41 alloy powder, wherein the mesh number of the powder is more than 200 meshes;
step 2, uniformly mixing 19.66g of Si powder and 20.34g of AlSi41 alloy powder to ensure that the silicon content in the alloy powder is 70 percent;
step 3, selecting a single-walled nanotube with the diameter of 0.6-2nm and the length-diameter ratio of 20: 1;
step 4, weighing single-walled nanotubes accounting for 0.5 percent of the total mass of the alloy powder;
step 5, putting the weighed high-silicon aluminum alloy powder and the single-walled nanotubes into a mixer, and rolling for 10 hours to ensure that the mixed materials are uniformly mixed;
step 6, placing the mixed powder into an aluminum sheath, and sealing;
step 7, performing vacuum-pumping treatment on the sheath to ensure that the vacuum degree in the sheath is less than or equal to 2 multiplied by 104Pa；
Step 8, carrying out hot pressing treatment under the argon environment of the sheath, wherein the hot pressing temperature is 560 ℃, the time is 5 hours, the temperature is reduced to room temperature in a gradient manner, the temperature is kept for 1 hour at constant temperature every time the temperature is reduced by 100 ℃, and the temperature reduction rate is 10 ℃/min;
step 9, performing heat treatment after removing the sheath, wherein the treatment temperature is 530 ℃, and the time is 4 hours;
step 10, taking the sample after heat treatment to perform a tensile strength test, and cutting the sample with the cross section of 14.4mm2The test sample was subjected to tensile strength test, the result is shown in fig. 1, curve 2, and the test instrument was a twin column tensile tester.
Example 2:
the difference between this example and example 1 is: and 3, selecting the single-walled nanotube with the length-diameter ratio of 200:1, and setting the rest operation steps and parameters completely the same as those in the embodiment 1. The obtained sample piece was cut to a cross-sectional area of 14.4mm2The test sample was subjected to tensile strength test, the result is shown in fig. 1, curve 4, and the test instrument was a twin column tensile tester.
Example 3:
the difference between this example and example 1 is: and 4, weighing single-walled nanotubes accounting for 2.0 percent of the total mass of the alloy powder, wherein the rest operation steps and parameter settings are completely the same as those in the embodiment 1. The obtained sample piece was cut to a cross-sectional area of 14.4mm2The test sample was subjected to tensile strength test, the result is shown in fig. 1, curve 3, and the test instrument was a twin column tensile tester.
Example 4:
the difference between this example and example 3 is: and 3, selecting the single-walled nanotube with the length-diameter ratio of 200:1, and setting the rest operation steps and parameters completely the same as those in the embodiment 3. The obtained sample piece was cut to a cross-sectional area of 14.4mm2The test sample was subjected to tensile strength test, the result is shown in fig. 1, curve 5, and the test instrument was a twin column tensile tester.
The sample obtained in this example had an expansion coefficient curve as shown in FIG. 3, and the maximum value of the expansion coefficient was 8.4X 10-6The coefficient of thermal expansion change of the 70 silicon-aluminum alloy material doped with the carbon nano tube is 15 percent at the temperature of/° c. The thermal expansion coefficient range (6.8-8.5) x 10 of 70 silicon is satisfied-6Requirement of/° c.
Comparative example 1:
the comparative example differs from the examples in that: the single-walled carbon nanotubes are not doped, and the rest of the operation steps and parameter settings are completely the same as those of the example 2.The obtained sample piece was cut to a cross-sectional area of 14.4mm2The test sample was subjected to tensile strength test, the result is shown in fig. 1, curve 1, and the test instrument was a twin column tensile tester.
The curve of the coefficient of expansion of the undoped 70Si sample obtained in this comparative example is shown in FIG. 2, and the coefficient of thermal expansion is at a maximum of 7.3X 10-6/° c (test temperature is from 20 ℃ to 250 ℃).
The tensile strength data obtained for the above examples and comparative examples are shown in the following table:
Figure BDA0003356878520000041
from the above table, when the aspect ratio of the single-walled carbon nanotube is 200: when the doping amount is 2.0 percent at 1, the tensile strength of the sample piece is improved by more than 3 times compared with the tensile strength of the sample piece without the single-walled carbon nanotube.
Because the carbon nano tube has strong agglomeration effect when reaching the nano size, the mutual attraction of the particles is also obviously increased, and the strong agglomeration effect of the carbon nano tube is shown. Experiments prove that in the high-silicon aluminum alloy material, when the content of the doped carbon nanotubes is more than 2.0%, the carbon nanotubes agglomerate, as shown in a gold phase diagram of fig. 4 when the content of the doped carbon nanotubes is 2.5%.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. The silicon-aluminum alloy packaging material with high tensile strength is characterized by comprising the following chemical components in parts by weight: 50-85% of silicon, 50-15% of aluminum and the total content of other metals Mg, Cu, Zn, Pb and Fe is below 2%.
2. The silicon aluminum alloy packaging material with high tensile strength as claimed in claim 1, wherein the alloy packaging material comprises the following raw materials: silicon powder, silicon-aluminum alloy powder and carbon nano tubes.
3. The silicon aluminum alloy encapsulating material with high tensile strength as claimed in claim 2, wherein the silicon powder and the silicon aluminum alloy powder are mixed into an alloy powder with a silicon content of 50-85%.
4. The silicon-aluminum alloy packaging material with high tensile strength as claimed in claim 3, wherein the mass of the carbon nanotube is 0.5-2% of the total mass of the alloy powder.
5. The silicon-aluminum alloy packaging material with high tensile strength as claimed in any one of claims 2-4, wherein the carbon nanotubes are single-walled carbon nanotubes, the diameter is 0.6-2nm, and the aspect ratio is (20-200): 1.
6. The silicon aluminum alloy packaging material with high tensile strength as claimed in claim 2, wherein the particle sizes of the silicon powder and the silicon aluminum alloy powder are both below 200 meshes.
7. A method for preparing the silicon aluminum alloy packaging material of claim 1, which comprises the following steps:
step 1, uniformly mixing silicon powder and silicon-aluminum alloy powder to obtain high-silicon-aluminum alloy powder;
step 2, putting the high-silicon aluminum alloy powder and the single-walled carbon nanotubes into a mixer for rolling mixing until the materials are uniformly mixed;
step 3, putting the powder mixed in the step 2 into an aluminum sheath, sealing, vacuumizing the sheath to ensure that the vacuum degree in the sheath is less than or equal to 2 multiplied by 104Pa, performing heat treatment on the sheath in an argon atmosphere, and performing gradient cooling to room temperature;
and 4, removing the sheath after the heat treatment in the step 3, performing heat treatment again, and cooling to obtain the silicon-aluminum alloy packaging material with high tensile strength.
8. The preparation method of the silicon-aluminum alloy packaging material according to claim 7, characterized in that the gradient cooling process is performed at a constant temperature for 1h every 100 ℃ reduction, and the cooling rate is 10 ℃/min.
9. The method for preparing the silicon-aluminum alloy packaging material according to claim 7, wherein the heat treatment temperature in the step 3 is 560 ℃ and the treatment time is 5 hours.
10. The method for preparing the silicon-aluminum alloy packaging material according to claim 7, wherein the heat treatment temperature in the step 4 is 530 ℃ and the treatment time is 4 hours.
CN202111369544.1A 2021-11-16 2021-11-16 Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof Pending CN114134373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111369544.1A CN114134373A (en) 2021-11-16 2021-11-16 Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111369544.1A CN114134373A (en) 2021-11-16 2021-11-16 Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof

Publications (1)

Publication Number Publication Date
CN114134373A true CN114134373A (en) 2022-03-04

Family

ID=80390278

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111369544.1A Pending CN114134373A (en) 2021-11-16 2021-11-16 Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof

Country Status (1)

Country Link
CN (1) CN114134373A (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104550975A (en) * 2015-01-30 2015-04-29 苏州赛菲集团有限公司 Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding
CN104561847A (en) * 2013-10-29 2015-04-29 北京有色金属研究总院 Silicon particle and carbon nanotube mixing enhanced aluminum-based composite material and preparation method thereof
CN104831132A (en) * 2015-05-26 2015-08-12 云南永昌硅业股份有限公司 High-silicon aluminum alloy and preparation method thereof
CN106086494A (en) * 2016-06-08 2016-11-09 航天材料及工艺研究所 A kind of preparation method of silico-aluminum used for electronic packaging
US20170102043A1 (en) * 2015-10-07 2017-04-13 Goodrich Corporation Composite brake disks with an integrated heat sink, methods for manufacturing the same, and methods for producing encapsulated heat sink material
CN110303161A (en) * 2019-07-31 2019-10-08 哈尔滨铸鼎工大新材料科技有限公司 A kind of gradient silicon aluminum/silicon carbide aluminium electronic packaging composite material and preparation method thereof
CN110423922A (en) * 2019-08-26 2019-11-08 中国矿业大学 A kind of silico-aluminum and its preparation method and application for Electronic Packaging
US10497587B1 (en) * 2018-06-13 2019-12-03 Infineon Technologies Ag Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials
CN111778431A (en) * 2020-07-02 2020-10-16 苏州阿罗米科技有限公司 High-toughness single-walled carbon nanotube aluminum alloy-based composite material and preparation method thereof
CN112371986A (en) * 2020-10-26 2021-02-19 宁夏荣华缘特种新材料有限公司 Preparation method of high-silicon aluminum alloy electronic packaging material

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104561847A (en) * 2013-10-29 2015-04-29 北京有色金属研究总院 Silicon particle and carbon nanotube mixing enhanced aluminum-based composite material and preparation method thereof
CN104550975A (en) * 2015-01-30 2015-04-29 苏州赛菲集团有限公司 Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding
CN104831132A (en) * 2015-05-26 2015-08-12 云南永昌硅业股份有限公司 High-silicon aluminum alloy and preparation method thereof
US20170102043A1 (en) * 2015-10-07 2017-04-13 Goodrich Corporation Composite brake disks with an integrated heat sink, methods for manufacturing the same, and methods for producing encapsulated heat sink material
CN106086494A (en) * 2016-06-08 2016-11-09 航天材料及工艺研究所 A kind of preparation method of silico-aluminum used for electronic packaging
US10497587B1 (en) * 2018-06-13 2019-12-03 Infineon Technologies Ag Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials
CN110303161A (en) * 2019-07-31 2019-10-08 哈尔滨铸鼎工大新材料科技有限公司 A kind of gradient silicon aluminum/silicon carbide aluminium electronic packaging composite material and preparation method thereof
CN110423922A (en) * 2019-08-26 2019-11-08 中国矿业大学 A kind of silico-aluminum and its preparation method and application for Electronic Packaging
CN111778431A (en) * 2020-07-02 2020-10-16 苏州阿罗米科技有限公司 High-toughness single-walled carbon nanotube aluminum alloy-based composite material and preparation method thereof
CN112371986A (en) * 2020-10-26 2021-02-19 宁夏荣华缘特种新材料有限公司 Preparation method of high-silicon aluminum alloy electronic packaging material

Similar Documents

Publication Publication Date Title
JP2843900B2 (en) Method for producing oxide-particle-dispersed metal-based composite material
JPS62156240A (en) Powder metallurgical production of copper-nickel-tin spinodal alloy
CN113399662A (en) Preparation method of molybdenum-lanthanum alloy sintered blank and product thereof
Straumal et al. Phase Transformations in Copper—Tin Solid Solutions at High-Pressure Torsion
WO2008032437A1 (en) Carbonated tungsten powder, method for production of the same, and superhard material and tool using the same
CN114134373A (en) Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof
CN112680636A (en) Micro-nano composite configuration aluminum matrix composite material and preparation method thereof
US10541064B2 (en) SiC powder, SiC sintered body, SiC slurry and manufacturing method of the same
CN108342634B (en) Material capable of adjusting negative thermal expansion coefficient and preparation method and application thereof
CN111644632A (en) Preparation method of rare earth lanthanum oxide doped TZM alloy
CN113798488B (en) Aluminum-based powder metallurgy material and preparation method thereof
CN113773083B (en) Bismuth telluride-based material with high strength and high thermoelectric property and preparation method thereof
JP2001250990A (en) Thermoelectric material and its manufacturing method
Abdoos et al. Nano-particles in powder injection molding of an aluminum matrix composite: Rheological behavior, production and properties
CN111069589B (en) Preparation method of granulation powder for aluminum alloy, aluminum alloy and preparation method of aluminum alloy
JP3319338B2 (en) Thermoelectric material and method of manufacturing the same
JPH0762467A (en) Dispersion-strengthening type copper alloy and its production
WO2003062482A2 (en) Stabilized grain size refractory metal powder metallurgy mill products
JPH1017959A (en) Composite material and its production
CN116386973B (en) High-strength and high-toughness neodymium-iron-boron magnet and preparation method thereof
CN115261695A (en) Corrosion-resistant tantalum-tungsten-platinum alloy and preparation method thereof
JP3942280B2 (en) Method for producing hexagonal boron nitride sintered body
Paramore et al. Powder Casting: Producing Bulk Metal Components from Powder Without Compaction
Van Trinh et al. Production and properties of copper matrix composite containing multi-walled carbon nanotubes
JPH09172205A (en) Manufacture of thermoelectric material

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20220304