CN104550975A - Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding - Google Patents
Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding Download PDFInfo
- Publication number
- CN104550975A CN104550975A CN201510054970.4A CN201510054970A CN104550975A CN 104550975 A CN104550975 A CN 104550975A CN 201510054970 A CN201510054970 A CN 201510054970A CN 104550975 A CN104550975 A CN 104550975A
- Authority
- CN
- China
- Prior art keywords
- silicon
- packing material
- aluminum alloy
- electronic packing
- aluminium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 24
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 16
- 238000001746 injection moulding Methods 0.000 title abstract description 4
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 title abstract 7
- 239000005022 packaging material Substances 0.000 title abstract 4
- 239000000843 powder Substances 0.000 claims abstract description 26
- 239000011230 binding agent Substances 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 42
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 claims description 24
- 238000012856 packing Methods 0.000 claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 17
- 239000007924 injection Substances 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- 238000007493 shaping process Methods 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 5
- 235000013312 flour Nutrition 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 5
- 238000004377 microelectronic Methods 0.000 claims description 5
- 238000010298 pulverizing process Methods 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract description 4
- 238000003801 milling Methods 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000005484 gravity Effects 0.000 abstract 1
- 238000000227 grinding Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 12
- 239000000047 product Substances 0.000 description 7
- 238000011161 development Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000551 Silumin Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001540 jet deposition Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510054970.4A CN104550975B (en) | 2015-01-30 | 2015-01-30 | Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510054970.4A CN104550975B (en) | 2015-01-30 | 2015-01-30 | Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104550975A true CN104550975A (en) | 2015-04-29 |
CN104550975B CN104550975B (en) | 2017-01-25 |
Family
ID=53068633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510054970.4A Active CN104550975B (en) | 2015-01-30 | 2015-01-30 | Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104550975B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106676333A (en) * | 2016-12-09 | 2017-05-17 | 北京有色金属研究总院 | High-thermal-conductivity electronic packaging material for radioresistance reinforcement |
CN107739920A (en) * | 2017-09-21 | 2018-02-27 | 东莞华晶粉末冶金有限公司 | Aluminum alloy materials, Al-alloy products and preparation method thereof |
CN108213409A (en) * | 2018-01-17 | 2018-06-29 | 河北中瓷电子科技有限公司 | The preparation method of kovar alloy wall used for electronic packaging |
CN113210609A (en) * | 2021-04-14 | 2021-08-06 | 中国电子科技集团公司第二十九研究所 | Integrated microwave box body packaging method with locally adjustable thermal expansion coefficient |
CN114134373A (en) * | 2021-11-16 | 2022-03-04 | 哈尔滨铸鼎工大新材料科技有限公司 | Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008133512A (en) * | 2006-11-29 | 2008-06-12 | National Institute Of Advanced Industrial & Technology | Method for producing high density aluminum sintered material by metal powder injection molding process |
CN101462165A (en) * | 2007-12-20 | 2009-06-24 | 北京有色金属研究总院 | Liquid phase sintering method of spray forming aluminium silicon electronic packing material |
CN102114541A (en) * | 2009-12-30 | 2011-07-06 | 北京有色金属研究总院 | Preparation process of high volume fraction silicon particle enhanced aluminum based composite material |
CN103038006A (en) * | 2010-04-01 | 2013-04-10 | 维也纳科技大学 | Method for producing shaped bodies from aluminium alloys |
KR20130044550A (en) * | 2011-10-24 | 2013-05-03 | (주)태원시스켐 | Silcon mould for alluminium alloy and preparation method thereof |
CN103643067A (en) * | 2013-12-23 | 2014-03-19 | 苏州赛菲集团有限公司 | Nanoscale silicon carbide reinforcing metal group composite material and preparation method thereof |
CN103740956A (en) * | 2014-01-08 | 2014-04-23 | 镇江镨利玛新型材料科技有限公司 | Preparation method of high-silicon aluminum alloy |
-
2015
- 2015-01-30 CN CN201510054970.4A patent/CN104550975B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008133512A (en) * | 2006-11-29 | 2008-06-12 | National Institute Of Advanced Industrial & Technology | Method for producing high density aluminum sintered material by metal powder injection molding process |
CN101462165A (en) * | 2007-12-20 | 2009-06-24 | 北京有色金属研究总院 | Liquid phase sintering method of spray forming aluminium silicon electronic packing material |
CN102114541A (en) * | 2009-12-30 | 2011-07-06 | 北京有色金属研究总院 | Preparation process of high volume fraction silicon particle enhanced aluminum based composite material |
CN103038006A (en) * | 2010-04-01 | 2013-04-10 | 维也纳科技大学 | Method for producing shaped bodies from aluminium alloys |
KR20130044550A (en) * | 2011-10-24 | 2013-05-03 | (주)태원시스켐 | Silcon mould for alluminium alloy and preparation method thereof |
CN103643067A (en) * | 2013-12-23 | 2014-03-19 | 苏州赛菲集团有限公司 | Nanoscale silicon carbide reinforcing metal group composite material and preparation method thereof |
CN103740956A (en) * | 2014-01-08 | 2014-04-23 | 镇江镨利玛新型材料科技有限公司 | Preparation method of high-silicon aluminum alloy |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106676333A (en) * | 2016-12-09 | 2017-05-17 | 北京有色金属研究总院 | High-thermal-conductivity electronic packaging material for radioresistance reinforcement |
CN107739920A (en) * | 2017-09-21 | 2018-02-27 | 东莞华晶粉末冶金有限公司 | Aluminum alloy materials, Al-alloy products and preparation method thereof |
CN107739920B (en) * | 2017-09-21 | 2019-11-19 | 东莞华晶粉末冶金有限公司 | Aluminum alloy materials, Al-alloy products and preparation method thereof |
CN108213409A (en) * | 2018-01-17 | 2018-06-29 | 河北中瓷电子科技有限公司 | The preparation method of kovar alloy wall used for electronic packaging |
CN113210609A (en) * | 2021-04-14 | 2021-08-06 | 中国电子科技集团公司第二十九研究所 | Integrated microwave box body packaging method with locally adjustable thermal expansion coefficient |
CN114134373A (en) * | 2021-11-16 | 2022-03-04 | 哈尔滨铸鼎工大新材料科技有限公司 | Silicon-aluminum alloy packaging material with high tensile strength and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN104550975B (en) | 2017-01-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104550975A (en) | Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding | |
CN101774020B (en) | Method for preparing molybdenum-copper component | |
CN103924119B (en) | A kind of super-high heat-conductive graphite flakes/carbon/carbon-copper composite material and preparation method thereof | |
CN102962434B (en) | Silicon carbide/copper silicon alloy codual-continuous composite and preparation method thereof | |
CN102676901B (en) | Process for preparing SiC/Al electronic packaging materials by means of pressureless infiltration | |
CN103602869A (en) | Process for preparing high-volume-fraction aluminum silicon carbide-based composite material by powder metallurgic method | |
CN108774699A (en) | Aluminium silicon/aluminium gold hard rock gradient composites and preparation method thereof | |
US20180215668A1 (en) | Aluminum-silicon-carbide composite and method of manufacturing same | |
US8048366B2 (en) | Process for making copper tungsten and copper molybdenum composite electronic packaging materials | |
CN103094694B (en) | A kind of Metamaterial dielectric substrate and processing method thereof | |
Xiao et al. | Realization of high thermal conductivity and tunable thermal expansion in the ScF3@ Cu core-shell composites | |
CN112011717A (en) | High-strength low-expansion composite material and preparation method thereof | |
CN106220176A (en) | A kind of diamond/ceramic composite substrate material and preparation method thereof | |
CN112573925B (en) | High-performance electromagnetic shielding NdB 6 /SiO 2 Complex phase ceramic material and preparation method thereof | |
CN102358924A (en) | Method for preparing gradient silicon-aluminum alloy electronic packaging material through rapid hot pressing | |
CN116334435A (en) | Silicon carbide aluminum-based composite material and preparation method and application thereof | |
CN102140600A (en) | Aluminum-silicon electronic packaging material and preparation method thereof | |
CN105886821B (en) | A kind of gradient of porosity consecutive variations POROUS TUNGSTEN base and preparation method | |
CN107805071B (en) | Preparation method of titanium-trialuminum-carbon-mullite composite ceramic with low glass wettability | |
KR100779033B1 (en) | A method for manufacturing tungsten-copper composite powder | |
CN109317685A (en) | A kind of preparation method preparing ingot blank using AlSi50 alloy powder | |
Wei et al. | Aluminum-based ceramic/metal composites with tailored thermal expansion fabricated by spark plasma sintering | |
Hafed et al. | Effects of cobalt addition and temperature on microstructure and density of W-25Cu composites prepared via liquid infiltration | |
Varma et al. | Sinterability and dielectric properties of ZnNb2O6–glass ceramic composites | |
CN105803247A (en) | Low-expansion high-thermal-conducting copper-stainless invar alloy composite material and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SUZHOU ZHONGBAO COMPOSITES CO., LTD. Free format text: FORMER OWNER: SUZHOU SAIFEI GROUP CO., LTD. Effective date: 20150828 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150828 Address after: A street in Suzhou City Industrial Park, 215126 No. 18 in Jiangsu Province Applicant after: Suzhou Zhongbao Composites Co., Ltd. Address before: 215000, Suzhou Industrial Park, Jiangsu Province, if waterway 398 Applicant before: Suzhou Saifei Group Co., Ltd. |
|
CB02 | Change of applicant information |
Address after: A street in Suzhou City Industrial Park, 215126 No. 18 in Jiangsu Province Applicant after: SUZHOU SAIFEI GROUP CO., LTD. Address before: A street in Suzhou City Industrial Park, 215126 No. 18 in Jiangsu Province Applicant before: Suzhou Zhongbao Composites Co., Ltd. |
|
COR | Change of bibliographic data | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding Effective date of registration: 20170313 Granted publication date: 20170125 Pledgee: Wuhan Tianfeng Ruide Investment Center (limited partnership) Pledgor: SUZHOU SAIFEI GROUP CO., LTD. Registration number: 2017320010017 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PP01 | Preservation of patent right |
Effective date of registration: 20190320 Granted publication date: 20170125 |
|
PP01 | Preservation of patent right | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20210320 Granted publication date: 20170125 |
|
PD01 | Discharge of preservation of patent | ||
PP01 | Preservation of patent right |
Effective date of registration: 20220310 Granted publication date: 20170125 |
|
PP01 | Preservation of patent right |