CN114131502A - Check ring of grinding head for chemical mechanical grinding equipment - Google Patents
Check ring of grinding head for chemical mechanical grinding equipment Download PDFInfo
- Publication number
- CN114131502A CN114131502A CN202111289530.9A CN202111289530A CN114131502A CN 114131502 A CN114131502 A CN 114131502A CN 202111289530 A CN202111289530 A CN 202111289530A CN 114131502 A CN114131502 A CN 114131502A
- Authority
- CN
- China
- Prior art keywords
- ring
- metal material
- plastic
- retainer ring
- material ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 title claims abstract description 21
- 238000000227 grinding Methods 0.000 title abstract description 43
- 239000007769 metal material Substances 0.000 claims abstract description 64
- 239000004033 plastic Substances 0.000 claims abstract description 31
- 229920003023 plastic Polymers 0.000 claims abstract description 31
- 230000008878 coupling Effects 0.000 claims abstract description 12
- 238000010168 coupling process Methods 0.000 claims abstract description 12
- 238000005859 coupling reaction Methods 0.000 claims abstract description 12
- 230000000149 penetrating effect Effects 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000002425 crystallisation Methods 0.000 abstract description 8
- 230000008025 crystallization Effects 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 7
- 238000007517 polishing process Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- -1 polybutylene naphthalate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001039 duplex stainless steel Inorganic materials 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a retainer ring of a grinding head for a chemical mechanical grinding device, which comprises: a ring of metallic material; the plastic embedded structure is embedded and wrapped in the metal material ring and is connected with the metal material ring through a coupling structure; wherein, the retaining ring is provided with at least one through hole penetrating through the inner side wall and the outer side wall of the retaining ring. According to the retainer ring, the through hole penetrating through the inner side wall and the outer side wall of the retainer ring is formed, so that liquid for cleaning the grinding head can enter a gap between the retainer ring and the diaphragm from the side surface, the grinding liquid remained in the gap is removed, the crystallization of the grinding liquid is reduced, and the wafer scratch caused by the falling of the crystallization is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor integrated circuit manufacturing equipment, in particular to a check ring of a grinding head of chemical mechanical grinding equipment.
Background
Chemical Mechanical Polishing (CMP) is a precision processing technique for planarizing the surface of a wafer. The most central component of a chemical mechanical polishing apparatus is a polishing head, and one of the most important components of the polishing head is a retaining ring for holding a wafer. The retainer ring is usually an annular ring, and is sleeved on the periphery of the diaphragm to prevent the wafer from sliding out and simultaneously enable the grinding fluid to be uniformly distributed on the surface of the grinding pad.
The grinding fluid continuously supplied in the grinding process is easy to remain in the gap between the retainer ring and the diaphragm and form crystals, and the crystals fall on the grinding pad to scratch the wafer, so that the wafer has defects and even is scrapped. At present, the lower surface of a grinding head can only be cleaned, and grinding fluid in a gap cannot be cleaned.
Therefore, it is necessary to develop a new retainer ring, which can reduce the existence of the crystal of the slurry in the gap, thereby reducing the wafer scratch caused by the falling of the crystal.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a retainer ring for a grinding head of a chemical mechanical grinding device, wherein the retainer ring is provided with a through hole penetrating through the inner side wall and the outer side wall of the retainer ring, so that liquid for cleaning the grinding head can enter a gap between the retainer ring and a diaphragm from the side surface, the grinding liquid remained in the gap is removed, the crystallization of the grinding liquid is reduced, and the wafer scratch caused by the falling of the crystallization is reduced.
Another object of the present invention is to provide a polishing head including the above-mentioned retainer ring.
Still another object of the present invention is to provide a chemical mechanical polishing apparatus including the above polishing head.
In order to achieve the above object, the present invention provides the following technical solutions.
A retainer ring for a polishing head of a chemical mechanical polishing apparatus, comprising:
a ring of metallic material; and
the plastic embedded structure is embedded and wrapped in the metal material ring and is connected with the metal material ring through a coupling structure;
wherein, the retaining ring is provided with at least one through hole penetrating through the inner side wall and the outer side wall of the retaining ring.
The present invention also provides a polishing head for a chemical mechanical polishing apparatus, comprising:
a base;
a diaphragm disposed on the base lower surface; and
the check ring is sleeved on the periphery of the diaphragm.
The invention also provides chemical mechanical polishing equipment comprising the polishing head.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a check ring of a grinding head for chemical mechanical grinding equipment, which enables liquid for cleaning the grinding head to enter a gap between the check ring and a diaphragm from the side surface by arranging a through hole penetrating through the inner side wall and the outer side wall of the check ring, thereby removing grinding liquid remained in the gap, reducing the crystallization of the grinding liquid and further reducing the wafer scratch caused by the falling of the crystallization.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a top view of an exemplary retainer ring of the present invention.
Fig. 2-4 are cross-sectional views of fig. 1 in the direction a-a.
Fig. 5 is a top view of another exemplary retainer ring of the present invention.
Fig. 6-8 are cross-sectional views of fig. 3 in the direction a-a.
Figure 9 is a cross-sectional view of the polishing head of the present invention.
Description of the reference numerals
100 is a metal ring, 101 is a bolt hole, 200 is a plastic embedded structure, 300 is a coupling structure, 400 is a through hole, 500 is a polishing head, 600 is a base, and 700 is a diaphragm.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
The retainer ring of the present invention will be further described with reference to the accompanying drawings.
Fig. 1 provides a top view of an exemplary retainer ring of the present invention. Fig. 2-4 show cross-sectional views in the direction a-a of fig. 1. Specifically, as shown in fig. 1 to 4, the retainer ring of the polishing head for a chemical mechanical polishing apparatus of the present invention includes: a metal material ring 100; the plastic embedding structure 200 is embedded in the metal material ring 100, and the plastic embedding structure 200 is connected with the metal material ring 100 through the coupling structure 300; wherein the retainer ring is provided with at least one through hole 400 penetrating through inner and outer sidewalls thereof.
In the present invention, the retainer ring is provided with the bolt holes 101 extending from the upper surface to the inside, and the through-hole is located between the center lines of two adjacent bolt holes. This reduces the effect on the strength of the collar. The retainer ring is provided with bolt holes 101 extending from the upper surface inward, and the through-holes 400 are located between the center lines of adjacent two bolt holes.
Preferably, the number of the through holes 400 may be 18 to 36.
In some embodiments, the through-hole 400 opens on the sidewall of the plastic-encased structure portion encased with the metal material ring 100, and the through-hole 400 penetrates through the plastic-encased structure 200 and the metal material ring 100, as shown in fig. 2. In the present invention, a first hole structure penetrating through the inner and outer sidewalls of the metal material ring 100 may be first formed, then the metal material ring 100 is embedded in the plastic embedding structure 200 through a molding process, and then a second hole structure is correspondingly formed on the plastic embedding structure 200, so that the second hole structure and the first hole structure are communicated, thereby forming the through hole 400. In the present invention, the through hole 400 preferably penetrates through the plastic embedding structure 200 and the metal material ring 100, so that the through hole 400 is not deformed during the grinding process, and the through hole is prevented from being blocked, thereby ensuring that the liquid for cleaning the grinding head reaches the gap between the retainer ring and the diaphragm, and achieving the purpose of cleaning.
In another embodiment, at least a portion of the through-hole 400 opens on the sidewall of the portion of the plastic-encased structure that is not encased by the ring of metal material 100, and the through-hole 400 extends through the plastic-encased structure 200.
In another embodiment, at least a portion of the through hole 400 opens on the sidewall of the plastic-encased structure portion encased with the metal material ring 100, and the through hole 400 penetrates through the plastic-encased structure 200 and the metal material ring 100; and at least part of the through hole 400 is opened on the sidewall of the plastic embedding structure part which is not embedded with the metal material ring 100, and the through hole 400 penetrates through the plastic embedding structure 200.
Preferably, the aperture at the outer sidewall of the retainer of the present invention is larger than the aperture at the inner sidewall thereof. Therefore, the liquid for cleaning the grinding head can wash the gap between the check ring and the diaphragm with larger pressure, thereby realizing better cleaning effect.
In some embodiments, the retainer ring is provided with a plurality of through holes 400, and at least some of the through holes 400 are provided at different heights of the retainer ring, and the center lines of the through holes may be on the same plane, as shown in fig. 4. This arrangement allows the through holes 400 to be distributed at different heights of the retainer ring, facilitating more efficient removal of slurry from the gap.
Fig. 5 provides a top view of another exemplary retainer ring of the present invention. Fig. 6-8 show cross-sectional views of fig. 5 in the direction a-a. Specifically, as shown in fig. 5 to 8, the retainer ring of the polishing head for a chemical mechanical polishing apparatus of the present invention includes: the metal material ring 100, the upper surface of the metal material ring 100 is provided with a bolt hole 101; the plastic embedding and packaging structure 200 is connected with the metal material ring 100 through the coupling structure 300, the plastic embedding and packaging structure 200 is arranged on two side surfaces and the lower surface of the metal material ring 100, and the upper surface of the plastic embedding and packaging structure 200 is flush with the upper surface of the metal material ring 100; wherein, the retaining ring is provided with a plurality of through holes penetrating through the inner side wall and the outer side wall of the retaining ring.
Preferably, the metallic material ring 100 may be a stainless steel or the like, such as a martensitic stainless steel, a ferritic stainless steel, an austenitic-ferritic duplex stainless steel, or a precipitation hardened stainless steel, among others. The material of the metal material ring of the present invention is not limited to stainless steel, and any high-strength metal material that does not precipitate metal and is not corroded during the grinding process can be used in the present invention.
Preferably, the upper surface of the metal material ring 100 is horizontal to facilitate connection with the polishing head body. Preferably, the lower surface of the metal material ring 100 is also horizontal.
In some embodiments, the coupling structure 300 is at least a portion of a raised structure on the side of the metal material ring 100 and a corresponding at least a portion of a recessed structure disposed on the inner sidewall of the plastic-encased structure 200, as shown in fig. 6. The coupling structure 300 is used to improve the connection strength of the plastic-encased structure and the metal material ring. Preferably, the raised structure is annularly disposed on a side surface of the metal material ring 100; correspondingly, the recessed structure is annularly disposed on the inner sidewall of the plastic embedding structure 200. The shape, size and number of the convex structures and the concave structures are not particularly limited, and can be adjusted according to the size of the metal material ring. For example, 1-3 annular protrusion structures are respectively disposed on two side surfaces of the metal material ring 100; correspondingly, two side walls of the interior of the plastic-embedded structure 200 are respectively provided with 1-3 annular concave structures. Alternatively, a plurality of discontinuous bumps are respectively disposed on two side surfaces of the metal material ring 100; correspondingly, a plurality of discontinuous grooves are respectively arranged on two side walls of the interior of the plastic embedding structure 200.
As shown in fig. 7, the upper portion of the metal material ring 100 has a trapezoidal shape. The plastic material around the metal material ring 100 forms a gripping structure that secures the metal material ring 100 therein.
In other embodiments, the coupling structure 300 is at least a portion of a concave structure on the side of the metal material ring 100 and a corresponding at least a portion of a convex structure on the inner sidewall of the plastic-encased structure 200, as shown in fig. 8. The coupling structure 300 is used to improve the connection strength of the plastic-encased structure and the metal material ring. Preferably, the recessed structure is annularly disposed on a side surface of the metal material ring 100; correspondingly, the protruding structure is annularly disposed on the inner sidewall of the plastic embedding structure 200. The shape, size and number of the concave structures and the convex structures are not particularly limited, and can be adjusted according to the size of the metal material ring. For example, 1 to 3 annular recessed structures are respectively disposed on two side surfaces of the metal material ring 100; correspondingly, two side walls of the interior of the plastic-embedded structure 200 are respectively provided with 1-3 annular protruding structures. Alternatively, a plurality of discontinuous grooves are respectively formed on two side surfaces of the metal material ring 100; correspondingly, a plurality of discontinuous bumps are respectively disposed on two sidewalls of the interior of the plastic-embedded structure 200.
The thickness and width of the metal material ring 100 can be adjusted according to actual needs.
The upper surface of the metal material ring 100 is provided with bolt holes 101 for securing the retainer ring to the base of the grinding head. The number of bolt holes 101 is at least 3, preferably 10-20. In some embodiments, the number of bolt holes is 18. The opening direction of the bolt holes 101 is perpendicular to the upper surface of the metal material ring 100.
The upper surface of the metal material ring 100 is free of plastic materials, and the bolt holes arranged on the metal material ring are used for being connected with the grinding head, so that the problem that the working surface of the check ring cannot be kept horizontal due to deformation of a plastic embedding structure when the bolts are screwed is avoided, and the flatness of the wafer is guaranteed.
As shown in fig. 6-8, plastic-encased structures 200 are provided on both sides and the lower surface of the metal material ring 100. The plastic-encased structure 200 is an integrally molded structure obtained by a molding process. The invention utilizes the molding process to wrap the plastic embedding and packaging structure on the periphery of the metal material ring, and the metal material ring and the plastic embedding and packaging structure can be fixed together without adhesive, thereby solving the problems of powder falling and stripping of the adhesive, and avoiding the occurrence of wafer scratching, slipping and chipping.
The plastic-encased structure 200 can be a variety of wear-resistant engineering plastics, such as polyphenylene sulfide (PPS), Polyetheretherketone (PEEK), or polybutylene naphthalate (PBN), among others. The upper surface of the plastic embedding structure 200 is flush with the upper surface of the metal material ring 100, and the upper and lower surfaces are flat. When performing the chemical mechanical polishing, the lower surface of the plastic embedding structure 200 is a working surface. In order to prevent the plastic embedded structure 200 from dropping particles during the grinding process and scratching the wafer, the lower surface of the plastic embedded structure 200 is preferably smooth. The thickness and width of the plastic-encased structure 200 can be adjusted as desired.
The position of the metal material ring 100 in the plastic-encased structure 200 can be adjusted according to actual needs.
The retainer ring of the invention can be used for various grinding heads of chemical mechanical grinding equipment, such as a three-zone grinding head, a five-zone grinding head, a six-zone grinding head or a seven-zone grinding head. The retainer ring of the invention can be used for various chemical mechanical polishing processes, such as a silicon polishing process, a silicon oxide polishing process, a silicon carbide polishing process, a tungsten polishing process or a copper polishing process.
Figure 9 sets forth a cross-sectional view of the polishing head of the present invention. Specifically, as shown in fig. 9, the polishing head 500 for a chemical mechanical polishing apparatus of the present invention includes: a base 600; a diaphragm 700 disposed on a lower surface of the base 600; and the above-mentioned retainer ring, is fitted over the periphery of the diaphragm 70.
The material of the separator 700 may be a chloroprene resin, a polyethylene resin, a polypropylene resin, a silicone resin, or a combination thereof.
The grinding head can reduce the crystallization of the grinding fluid in the gap between the retainer ring and the diaphragm, thereby reducing the wafer scratch caused by the falling of the crystallization.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A retainer ring for a polishing head of a chemical mechanical polishing apparatus, comprising:
a ring of metallic material; and
the plastic embedded structure is embedded and wrapped in the metal material ring and is connected with the metal material ring through a coupling structure;
wherein, the retaining ring is provided with at least one through hole penetrating through the inner side wall and the outer side wall of the retaining ring.
2. The retainer ring of claim 1, wherein the through-hole opens on a sidewall of the portion of the plastic-encased structure encasing the metal material ring, and the through-hole extends through the plastic-encased structure and the metal material ring; and/or the through hole is arranged on the side wall of the plastic embedding structure part which is not embedded and wrapped with the metal material ring, and the through hole penetrates through the plastic embedding structure.
3. The retainer ring according to claim 1 or 2, wherein the aperture at the outer sidewall of the retainer ring is larger than the aperture at the inner sidewall thereof.
4. Retainer ring according to claim 1 or 2, characterized in that the retainer ring is provided with a plurality of said through holes, and that at least some of said through holes are provided at different heights of the retainer ring.
5. Retainer ring according to claim 1 or 2, characterized in that the retainer ring is provided with bolt holes extending from the upper surface inwards, and that the through hole is located between the centre lines of two adjacent bolt holes.
6. The retainer ring of claim 5, wherein the plastic insert structures are disposed on both sides and a lower surface of the metal material ring, an upper surface of the plastic insert structures is flush with an upper surface of the metal material ring, and the bolt holes open on the upper surface of the metal material ring.
7. Retainer ring according to claim 1 or 2, characterized in that the coupling structure is an at least partly convex structure provided on a side face of the metal material ring and an at least partly concave structure provided correspondingly on an inner side wall of the plastic inlay structure;
alternatively, the coupling structure is at least a partially recessed structure provided on a side surface of the metal material ring and at least a partially raised structure correspondingly provided on an inner sidewall of the plastic-encased structure.
8. The retainer ring of claim 1 or 2, wherein the plastic-encased structure is an integrally molded structure obtained by a molding process.
9. A polishing head for a chemical mechanical polishing apparatus, comprising:
a base;
a diaphragm disposed on the base lower surface; and
the retainer of any of claims 1-8 fitted around the periphery of the diaphragm.
10. A chemical mechanical polishing apparatus comprising the polishing head of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111289530.9A CN114131502A (en) | 2021-11-02 | 2021-11-02 | Check ring of grinding head for chemical mechanical grinding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111289530.9A CN114131502A (en) | 2021-11-02 | 2021-11-02 | Check ring of grinding head for chemical mechanical grinding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114131502A true CN114131502A (en) | 2022-03-04 |
Family
ID=80392077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111289530.9A Pending CN114131502A (en) | 2021-11-02 | 2021-11-02 | Check ring of grinding head for chemical mechanical grinding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114131502A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207289794U (en) * | 2017-09-26 | 2018-05-01 | 武汉新芯集成电路制造有限公司 | A kind of baffle ring suitable for grinding head |
| CN112536713A (en) * | 2019-09-23 | 2021-03-23 | 清华大学 | Retaining ring |
-
2021
- 2021-11-02 CN CN202111289530.9A patent/CN114131502A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207289794U (en) * | 2017-09-26 | 2018-05-01 | 武汉新芯集成电路制造有限公司 | A kind of baffle ring suitable for grinding head |
| CN112536713A (en) * | 2019-09-23 | 2021-03-23 | 清华大学 | Retaining ring |
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| PB01 | Publication | ||
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Application publication date: 20220304 |