CN114122294A

CN114122294A - Display substrate and display device

Info

Publication number: CN114122294A
Application number: CN202111388408.7A
Authority: CN
Inventors: 包征; 王明强; 陈功; 胡宏锦; 杨皓天; 张家祥; 郝晓东; 王康; 张燚; 左堃; 傅晓亮; 张斌
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2022-03-01
Anticipated expiration: 2041-11-22
Also published as: CN114122294B

Abstract

A display substrate and a display device are provided, the display substrate comprises a driving structure layer and a light emitting structure layer which are sequentially stacked on a substrate, the light emitting structure layer comprises a first electrode layer, a pixel defining layer, a water oxygen barrier layer, an organic functional layer and a second electrode layer; the first electrode layer comprises a plurality of first electrodes arranged on the driving structure layer, the pixel defining layer is arranged on one side, far away from the substrate, of the first electrodes and is provided with a plurality of first pixel openings, and each first pixel opening exposes the surface, far away from the substrate, of the corresponding first electrode; a water oxygen barrier layer at least partially disposed on a circumferential sidewall of the first pixel opening; the organic functional layer comprises an organic light emitting layer, and the organic functional layer and the second electrode layer are sequentially stacked on one side of the first electrode, which is far away from the substrate. The display substrate of the embodiment of the disclosure can prevent water and oxygen volatilized by the pixel defining layer from invading the organic light emitting layer.

Description

Display substrate and display device

Technical Field

The embodiment of the disclosure relates to the technical field of display, in particular to a display substrate and a display device.

Background

Some organic electroluminescent diode (OLED) display products are sold in high-altitude areas where Ultraviolet (UV) light irradiation is strong and customers evaluate the effect of UV irradiation on electronic products. Taking a certain model product as an example, when a module screen is lightened, debugging a Normal W255 picture, and testing the initial brightness L0 at the moment of T0; the module screen is not lighted, the UV light is continuously irradiated for 580h, then the screen is lighted, the Normal W255 picture is debugged, and the test T580h shows that the brightness is L580h, and the L580h/L0 is less than 80%, namely the brightness is greatly reduced.

The above problems were analyzed as follows: 1. and (4) phenomenon analysis, after the module screen is continuously irradiated for 580 hours by UV light, the RGB (red, green and blue) pixels shrink to different degrees. Taking the B pixel (i.e., the blue sub-pixel P1) as an example, the light emitting area of the B pixel at the time T0 is shown in fig. 1a, and fig. 1a is a schematic diagram of the light emitting area of the B pixel at the time T0 of the display substrate of some technologies; when irradiated with UV light, the B pixel at time T580h shows significant pixel shrinkage (i.e., pixel light emitting area is reduced), as shown in fig. 1B, which is a schematic diagram of the light emitting area of the B pixel (i.e., blue sub-pixel P1) at time T580h of some display substrates of the prior art. 2. Analysis of root cause, as shown in fig. 2, fig. 2 is a schematic partial cross-sectional structure of a display substrate according to some technologies, when UV light (indicated by a dotted line with an arrow in fig. 2) is irradiated for a long time, a pixel defining layer (PDL, a material such as polyimide series organic substance) 32 volatilizes water and oxygen (indicated by a dotted circle in fig. 2), a material of an organic light emitting layer 36 is sensitive to water and oxygen, the material of the organic light emitting layer 36 absorbs the water and oxygen volatilized by the PDL layer 32, and then a failure portion 3601 extends from the periphery of a pixel to the center of the pixel, and finally the pixel shrinks, which causes brightness to be attenuated.

Disclosure of Invention

Embodiments of the present disclosure provide a display substrate and a display device, which can prevent water and oxygen volatilized from a pixel defining layer from invading an organic light emitting layer, so as to avoid a significant decrease in brightness of the display substrate.

The embodiment of the disclosure provides a display substrate, which comprises a driving structure layer and a light emitting structure layer, wherein the driving structure layer and the light emitting structure layer are sequentially stacked on a substrate; the light emitting structure layer comprises a first electrode layer, a pixel defining layer, a water oxygen barrier layer, an organic functional layer and a second electrode layer; the first electrode layer comprises a plurality of first electrodes arranged on the driving structure layer, the pixel defining layer is arranged on one side of the first electrodes far away from the substrate and is provided with a plurality of first pixel openings, and each first pixel opening exposes the surface of the corresponding first electrode far away from the substrate; the water-oxygen barrier layer is at least partially disposed on a circumferential sidewall of the first pixel opening; the organic functional layer comprises an organic light emitting layer, the organic functional layer and the second electrode layer are sequentially stacked on one side, far away from the substrate, of the first electrode, and each of the first electrode, the organic functional layer and the second electrode layer forms a light emitting device.

Optionally, a portion of the water-oxygen barrier layer is further disposed on a portion of a surface of the pixel defining layer remote from the substrate, proximate to the first pixel opening.

Optionally, the material of the water-oxygen barrier layer is a conductive material, the water-oxygen barrier layer includes a plurality of connection electrodes, each of the connection electrodes is disposed on a surface of a corresponding one of the first electrodes exposed by the first pixel opening, and is partially disposed on a circumferential sidewall of the first pixel opening, and is partially disposed on a portion of a surface of the pixel defining layer away from the substrate, the portion being close to the first pixel opening; the organic functional layer is arranged on the surface of the water oxygen barrier layer far away from the substrate.

Optionally, the orthographic projection of the connection electrode on the substrate includes an orthographic projection of the first pixel opening on the substrate.

Optionally, the organic light emitting layer includes a plurality of sub-light emitting layers disposed in the first pixel opening, and an orthogonal projection of the first pixel opening on the substrate includes an orthogonal projection of the sub-light emitting layers on the substrate.

Optionally, the first electrode comprises a first conductive material layer, and the connection electrode comprises a fourth conductive material layer;

the first electrode further comprises a second conductive material layer, and the second conductive material layer is stacked between the first conductive material layer and the fourth conductive material layer; and/or the connecting electrode further comprises a third conductive material layer, and the third conductive material layer is arranged between the first conductive material layer and the fourth conductive material layer in a laminated mode.

Optionally, the first electrode includes a first conductive material layer and a second conductive material layer that are sequentially stacked along a direction away from the substrate, and the connection electrode includes a third conductive material layer and a fourth conductive material layer that are sequentially stacked along a direction away from the substrate; the material of the first conductive material layer is the same as that of the fourth conductive material layer, and the material of the second conductive material layer is the same as that of the third conductive material layer.

Optionally, the first conductive material layer and the fourth conductive material layer are both made of indium tin oxide or indium zinc oxide, and the second conductive material layer and the third conductive material layer are both made of silver, titanium or aluminum;

the thickness of the first conductive material layer is

To

The thickness of the second conductive material layer is

To

The thickness of the third conductive material layer is

To

The thickness of the fourth conductive material layer is

To

Optionally, the water and oxygen blocking layer is made of an insulating material, the water and oxygen blocking layer is provided with a plurality of second pixel openings, and each second pixel opening exposes a surface of a corresponding one of the first electrodes, which is exposed by the first pixel opening;

the organic functional layer is disposed on a surface of the first electrode exposed by the first and second pixel openings and on a surface of the water-oxygen barrier layer remote from the substrate.

Optionally, the water oxygen barrier layer is a unitary structure.

Optionally, the material of the water-oxygen barrier layer comprises one or more of silicon oxide, silicon nitride, and silicon oxynitride.

Optionally, the organic functional layer further comprises any one or more of the following layers disposed between the first electrode and the organic light emitting layer: a hole injection layer, a hole transport layer, an electron blocking layer;

the organic functional layer further comprises any one or more of the following layers disposed between the organic light emitting layer and the second electrode layer: a hole blocking layer, an electron transport layer, an electron injection layer.

The embodiment of the disclosure also provides a display device, which includes the display substrate of any embodiment.

The display substrate of the embodiment of the disclosure, through setting up the water oxygen barrier layer, and the water oxygen barrier layer sets up on the circumference lateral wall of the first pixel opening of pixel definition layer at least partially, like this, the water oxygen barrier layer can block that water and oxygen that the pixel definition layer volatilizees invade organic light emitting layer, avoids causing the problem of organic light emitting layer material inefficacy to can avoid the decay by a wide margin of display substrate luminance.

Drawings

The accompanying drawings are included to provide a further understanding of the disclosed embodiments and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the example serve to explain the principles of the disclosure and not to limit the disclosure. The shapes and sizes of the components in the drawings are not to scale and are merely illustrative of the present disclosure.

FIG. 1a is a schematic diagram of a display substrate of some technologies illustrating the light emitting area of a blue sub-pixel at time T0;

FIG. 1b is a schematic diagram of the light-emitting area of a blue sub-pixel at time T580h for some display substrates of the prior art;

FIG. 2 is a schematic diagram of a partial cross-sectional structure of a display substrate according to some techniques;

FIG. 3a is a schematic partial cross-sectional view of a display substrate according to some exemplary embodiments;

FIG. 3b is a schematic top view of the display substrate of FIG. 3a in some example embodiments;

FIG. 4a is a schematic view of a partial cross-sectional structure of a display substrate according to further exemplary embodiments;

FIG. 4b is a schematic top view of the display substrate of FIG. 4a in some example embodiments;

fig. 5 is a schematic partial cross-sectional structure of a display substrate after an active layer is formed according to some example embodiments;

fig. 6 is a schematic partial cross-sectional view of a display substrate according to some exemplary embodiments after a first gate metal layer is formed;

fig. 7 is a schematic partial cross-sectional view of a display substrate according to some exemplary embodiments after a second gate metal layer is formed;

FIG. 8 is a schematic partial cross-sectional view of a display substrate after forming an interlayer insulating layer according to some example embodiments;

FIG. 9 is a schematic view of a partial cross-sectional structure of a display substrate after formation of source drain metal layers in accordance with certain example embodiments;

FIG. 10 is a schematic partial cross-sectional view of a display substrate after formation of a planarization layer in accordance with certain exemplary embodiments;

FIG. 11 is a schematic partial cross-sectional view of a display substrate after a first electrode layer is formed according to some example embodiments;

fig. 12 is a schematic partial cross-sectional view of a display substrate after spacers are formed thereon according to some example embodiments.

The reference signs are:

10. a substrate, 20, a driving structure layer, 21, a buffer layer, 22, a first gate insulating layer, 23, a second gate insulating layer, 24, an interlayer insulating layer, 25, a flat layer, 30, a light emitting structure layer, 31, a first electrode, 32, a pixel defining layer, 33, a spacer, 34, a water-oxygen barrier layer, 35, a first organic structure layer, 36, an organic light emitting layer, 37, a second organic structure layer, 38, a second electrode layer, 40 and an encapsulation structure layer;

201. a thin film transistor 202, a storage capacitor 203, a first via hole 204, a second via hole 205, a third via hole 321, a first pixel opening 341, a connection electrode 342, a second pixel opening 361, a sub-emission layer 3601, and a failure part;

2011. the active layer, 2012, the gate electrode, 2013, the source electrode, 2014, the drain electrode, 2021, the first polar plate, 2022, the second polar plate.

Detailed Description

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the embodiments of the disclosure, which are defined by the appended claims.

In some exemplary embodiments, as shown in fig. 3a, fig. 3a is a schematic partial cross-sectional structure view of a display substrate according to some exemplary embodiments, the display substrate includes a driving structure layer 20 and a light emitting structure layer 30 sequentially stacked on a substrate 10, and the driving structure layer 20 may include a plurality of pixel driving circuits. The pixel driving circuit may include a plurality of thin film transistors and storage capacitors, and the pixel driving circuit may have a structure of 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, or 7T1C, which is not limited in this embodiment.

The light emitting structure layer 30 includes a first electrode layer, a pixel defining layer 32, a water oxygen barrier layer 34, an organic functional layer, and a second electrode layer 38; the first electrode layer includes a plurality of first electrodes 31 disposed on the driving structure layer 20, each first electrode 31 is connected to one of the pixel driving circuits, and each pixel driving circuit drives a corresponding one of the light emitting devices to emit light.

The pixel defining layer 32 is disposed on a side of the first electrodes 31 away from the substrate 10 and has a plurality of first pixel openings 321, and each of the first pixel openings 321 exposes a surface of a corresponding one of the first electrodes 31 away from the substrate 10.

The material of the water oxygen barrier layer 34 may be a conductive material, the water oxygen barrier layer 34 includes a plurality of connection electrodes 341, and each of the connection electrodes 341 is disposed on a surface of a corresponding one of the first electrodes 31 exposed by the first pixel opening 321, and is partially disposed on a circumferential sidewall of the first pixel opening 321, and is partially disposed on a portion of a surface of the pixel defining layer 32 away from the substrate 10, which is close to the first pixel opening 321.

The organic functional layer comprises an organic light emitting layer 36, the organic functional layer is arranged on the surface of the water oxygen barrier layer 34 far away from the substrate 10, the organic functional layer and the second electrode layer 38 are sequentially stacked on one side of the first electrode 31 far away from the substrate 10, and each first electrode 31, the organic functional layer and the second electrode layer 38 form a light emitting device.

In this embodiment, the material of the water oxygen barrier layer 34 is a conductive material, each connection electrode 341 of the water oxygen barrier layer 34 is connected to a corresponding one of the first electrodes 31, and the organic functional layer is connected to each connection electrode 341 of the water oxygen barrier layer 34, so that each connection electrode 341 of the water oxygen barrier layer 34 can not only block water and oxygen volatilized from the pixel defining layer 32 from invading the organic light emitting layer 36, but also can connect a corresponding one of the first electrodes 31 to the organic functional layer, thereby ensuring that each of the first electrodes 31, the organic functional layer and the second electrode layer 38 can form a light emitting device.

In an example of this embodiment, as shown in fig. 3a and 3b, fig. 3b is a schematic top view structure diagram of the display substrate of fig. 3a in some exemplary embodiments, and an orthogonal projection of the connection electrode 341 on the substrate 10 may include an orthogonal projection of the first pixel opening 321 on the substrate 10. For example, the cross-sectional shape of the first pixel opening 321 may be a trapezoid, and an orthogonal projection of an end of the first pixel opening 321 away from the substrate 10 on the substrate 10 may include an orthogonal projection of an end of the first pixel opening 321 close to the substrate 10 on the substrate 10, where the orthogonal projection of the first pixel opening 321 on the substrate 10 refers to an orthogonal projection of an end of the first pixel opening 321 away from the substrate 10 on the substrate 10.

The organic light emitting layer 36 includes a plurality of sub-light emitting layers 361 (fig. 3a shows one sub-light emitting layer 361), and as shown in fig. 3a, the sub-light emitting layers 361 may be disposed in the first pixel opening 321, and an orthogonal projection of the first pixel opening 321 on the substrate 10 may include an orthogonal projection of the sub-light emitting layers 361 on the substrate 10.

In some exemplary embodiments, the display substrate may include three sub-pixels of red, green, and blue, each of the red sub-pixels including one red light emitting device, each of the green sub-pixels including one green light emitting device, and each of the blue sub-pixels including one blue light emitting device. The organic light emitting layer may include a plurality of red sub-light emitting layers, a plurality of green sub-light emitting layers, and a plurality of blue sub-light emitting layers, a red light emitting device includes a red sub-light emitting layer, a green light emitting device includes a green sub-light emitting layer, and a blue light emitting device includes a blue sub-light emitting layer. As shown in fig. 3a, the sub-emission layer 361 of each light emitting device emits light of a corresponding color by the voltage of the first electrode 31 and the second electrode layer 38. The light emitting device may be an OLED device. The organic functional layer may include a first organic structural layer 35, an organic light emitting layer 36, and a second organic structural layer 37, which are sequentially stacked, the first organic structural layer 35 may include any one or more of a hole injection layer, a hole transport layer, and an electron blocking layer, and the second organic structural layer 37 may include any one or more of a hole blocking layer, an electron transport layer, and an electron injection layer. Any one of the film layers of the first and second organic structure layers 35 and 37 may be a unitary structure and a common layer of the plurality of sub-pixels (or the plurality of light emitting devices).

In some exemplary embodiments, as shown in fig. 3a, the first electrode 31 includes a first conductive material layer, and the connection electrode 341 includes a fourth conductive material layer. The first electrode 31 may further include a second conductive material layer stacked between the first conductive material layer and the fourth conductive material layer. The connection electrode 341 may further include a third conductive material layer stacked between the first conductive material layer and the fourth conductive material layer. The first electrode 31 and the connection electrode 341 may each have a single-layer structure or a multi-layer composite structure.

In an example of this embodiment, the first electrode 31 may include a first conductive material layer and a second conductive material layer sequentially stacked in a direction away from the substrate 10, and the connection electrode 341 may include a third conductive material layer and a fourth conductive material layer sequentially stacked in the direction away from the substrate 10; the material of the first conductive material layer and the material of the fourth conductive material layer may be the same, and the material of the second conductive material layer and the material of the third conductive material layer may be the same. Thus, the water-oxygen barrier layer 34 does not largely affect the work function of the first electrode 31.

In one example of this embodiment, the material of the first conductive material layer and the material of the fourth conductive material layer may be Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or the like, and the material of the second conductive material layer and the material of the third conductive material layer may be silver, titanium, aluminum, or the like. The thickness of the first conductive material layer may be

To

Such as

The thickness of the second conductive material layer may be

To

Such as

The thickness of the third conductive material layer may be

To

Such as

The thickness of the fourth conductive material layer may be

To

Such as

In other exemplary embodiments, as shown in fig. 4a, fig. 4a is a schematic partial cross-sectional structure view of a display substrate according to other exemplary embodiments, where the display substrate includes a driving structure layer 20 and a light emitting structure layer 30 sequentially stacked on a substrate 10, and the driving structure layer 20 may include a plurality of pixel driving circuits. The pixel driving circuit may include a plurality of thin film transistors and storage capacitors, and the pixel driving circuit may have a structure of 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, or 7T1C, which is not limited in this embodiment.

The material of the water-oxygen barrier layer 34 is an insulating material, and the water-oxygen barrier layer 34 is at least partially disposed on the circumferential sidewall of the first pixel opening 321 and at least partially disposed on a portion of the surface of the pixel defining layer 32 away from the substrate 10, which is close to the first pixel opening 321; the water-oxygen barrier layer 34 is provided with a plurality of second pixel openings, each of which exposes a surface of a corresponding one of the first electrodes 31 exposed by the first pixel opening 321.

The organic functional layer includes an organic light emitting layer 36, and is disposed on a surface of the first electrode 31 exposed by the first pixel opening 321 and the second pixel opening, and on a surface of the water oxygen barrier layer 34 away from the substrate 10; the organic functional layer and the second electrode layer 38 are sequentially stacked on one side of the first electrode 31 far away from the substrate 10, and each of the first electrode 31, the organic functional layer and the second electrode layer 38 forms a light emitting device.

In this embodiment, the material of the water oxygen barrier layer 34 is an insulating material, and the water oxygen barrier layer 34 is at least partially disposed on the circumferential sidewall of the first pixel opening 321, and at least partially disposed on a portion of the surface of the pixel defining layer 32 away from the substrate 10, which is close to the first pixel opening 321; the water-oxygen barrier layer 34 is provided with a plurality of second pixel openings, each of which exposes a surface of a corresponding one of the first electrodes 31 exposed by the first pixel opening 321, so that the water-oxygen barrier layer 34 can prevent water and oxygen volatilized from the pixel defining layer 32 from invading the organic light emitting layer 36, and can expose a surface of the first electrode 31 exposed by the first pixel opening 321 through the provided second pixel opening, so as to ensure that a subsequently formed organic functional layer can be connected with the first electrode 31.

In some exemplary embodiments, as shown in fig. 4a, the water and oxygen blocking layer 34 may completely cover the circumferential sidewall of the first pixel opening 321 to prevent water and oxygen generated from the pixel defining layer 32 from invading the organic light emitting layer 36 from the circumferential sidewall of the first pixel opening 321. Exemplarily, as shown in fig. 4b, fig. 4b is a schematic top view structure diagram of the display substrate of fig. 4a in some exemplary embodiments, and an orthogonal projection of the first pixel opening 321 on the substrate 10 may include an orthogonal projection of the second pixel opening 342 on the substrate 10.

In some exemplary embodiments, as shown in fig. 4a, the water oxygen barrier layer 34 may be a unitary structure.

In some exemplary embodiments, as shown in fig. 4a, the material of the water oxygen barrier layer 34 may include one or more of silicon oxide, silicon nitride, silicon oxynitride. The water oxygen barrier layer 34 may be a single layer structure or a multi-layer composite structure.

In some exemplary embodiments, as shown in fig. 4a, the display substrate may further include a spacer 33(PS) disposed on a surface of the pixel defining layer 32 away from the substrate 10, where the spacer 33 may be used to support a mask plate during a subsequent evaporation process to form a film layer of an organic functional layer. The water-oxygen barrier layer 34 may be partially disposed on the circumferential sidewall of the first pixel opening 321, and partially disposed on the surfaces of the pixel defining layer 32 and the spacer 33 away from the substrate 10.

The following exemplarily illustrates a method of manufacturing a display substrate of the present disclosure. As used herein, a "patterning process" includes processes such as depositing a film, applying a photoresist, masking exposure, developing, etching, and stripping a photoresist. The deposition may employ any one or more selected from sputtering, evaporation and chemical vapor deposition, the coating may employ any one or more selected from spray coating and spin coating, and the etching may employ any one or more selected from dry etching and wet etching. "thin film" refers to a layer of a material deposited or coated onto a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process throughout the fabrication process. When the "thin film" requires a patterning process throughout the fabrication process, it is referred to as a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process includes at least one "pattern". The "a and B are disposed in the same layer" as used herein means that a and B are formed simultaneously by the same patterning process. "the orthographic projection of A includes the orthographic projection of B" means that the orthographic projection of B falls within the orthographic projection range of A, or the orthographic projection of A covers the orthographic projection of B.

With reference to fig. 3a to 12, the method for manufacturing a display substrate may include the following steps:

(1) forming the buffer layer 21 and the active layer 2011 pattern on the substrate 10 may include:

a buffer film is deposited on the substrate 10 and a buffer layer 21 is formed. As shown in fig. 5, fig. 5 is a schematic partial cross-sectional structure diagram of a display substrate according to some example embodiments after forming the active layer 2011.

(2) Forming the first gate insulating layer 22 and the first gate metal layer may include:

a first gate insulating film is deposited on the side of the active layer 2011 pattern away from the substrate 10, i.e., a first gate insulating layer 22 is formed. As shown in fig. 6, a first gate metal film is deposited on a side of the first gate insulating layer 22 away from the substrate 10, and a patterning process is performed on the first gate metal film to form a first gate metal layer pattern, where the first gate metal layer pattern includes a gate electrode 2012 and a first electrode plate 2021, and fig. 6 is a schematic partial cross-sectional structure of the display substrate after the first gate metal layer is formed according to some exemplary embodiments.

In this example, after the first gate metal layer pattern is formed, a portion of the active layer 2011 not covered by the gate electrode 2012 may be subjected to a conductor forming process to form a first region configured to be connected to the source electrode 2013 to be formed later and a second region configured to be connected to the drain electrode 2014 to be formed later.

(3) Forming the second gate insulating layer 23 and the second gate metal layer may include:

and depositing a second gate insulating film on the side of the first gate metal layer far away from the substrate 10 to form a second gate insulating layer 23. A second gate metal film is deposited on a side of the second gate insulating layer 23 away from the substrate 10, and a patterning process is performed on the second gate metal film to form a second gate metal layer, where the second gate metal layer may include a second pole plate 2022, and the second pole plate 2022 may correspond to the first pole plate 2021 and form the storage capacitor 202, as shown in fig. 7, and fig. 7 is a schematic partial cross-sectional structure of the display substrate after the second gate metal layer is formed according to some exemplary embodiments.

(4) Forming the interlayer insulating layer 24 and the source-drain metal layer may include:

depositing an interlayer insulating film on the side of the second gate metal layer away from the substrate 10, forming a first via 203 and a second via 204 penetrating the interlayer insulating film, the second gate insulating layer 23 and the first gate insulating layer 22 by using an etching process, and forming an interlayer insulating layer 24, as shown in fig. 8, where fig. 8 is a schematic partial cross-sectional structure of the display substrate after forming the interlayer insulating layer 24 according to some exemplary embodiments.

Depositing a source-drain metal film on the side, away from the substrate 10, of the interlayer insulating layer 24, performing patterning processing on the source-drain metal film by using a patterning process to form a source-drain metal layer, where the source-drain metal layer includes a source electrode 2013 and a drain electrode 2014, the source electrode 2013 is connected with a first region of an active layer 2011 through a first via hole 203, and the drain electrode 2014 is connected with a second region of an active layer 2011 through a second via hole 204, as shown in fig. 9, fig. 9 is a schematic diagram showing a local cross-sectional structure of the substrate after the source-drain metal layer is formed in some exemplary embodiments. The source electrode 2013, the drain electrode 2014, the gate electrode 2012 and the active layer 2011 form the thin film transistor 201 (which may be a driving thin film transistor in a pixel driving circuit).

(5) Forming the planarization layer 25 and the first electrode layer may include:

coating a flat film of an organic material on the side of the source-drain metal layer away from the substrate 10, where the flat film may cover the aforementioned structure on the substrate 10, and then forming a third via 205 on the flat film through a masking, exposing, developing and post-baking process to expose the drain electrode 2014, so as to form a flat layer 25, as shown in fig. 10, where fig. 10 is a schematic partial cross-sectional structure diagram of the display substrate after forming the flat layer 25 according to some exemplary embodiments.

A transparent conductive film is deposited on the planar layer 25, and a patterning process is performed on the transparent conductive film to form a first electrode layer, where the first electrode layer includes a plurality of first electrodes 31, and the first electrodes 31 are connected to the drain electrode 2014 through third vias 205 on the planar layer 25, as shown in fig. 11, fig. 11 is a schematic partial cross-sectional structure diagram of the display substrate after the first electrode layer is formed in some exemplary embodiments.

(6) Forming the pixel defining layer 32 and the spacer 33 may include:

a pixel defining film is coated on the substrate 10 on which the pattern is formed, and a pixel defining layer 32 is formed through masking, exposing, developing and post-baking processes, wherein the pixel defining layer 32 includes a plurality of first pixel openings 321, and the first pixel openings 321 expose the surface of the first electrode 31 away from the substrate 10.

A spacer 33 film is coated on the surface of the pixel defining layer 32 away from the substrate 10, and a patterning process is performed on the spacer 33 film to form a spacer 33, where the spacer 33 is disposed on the surface of the pixel defining layer 32 away from the substrate 10, as shown in fig. 12, and fig. 12 is a schematic partial cross-sectional structure of the display substrate after the spacer 33 is formed according to some exemplary embodiments.

(7) Forming the water oxygen barrier layer 34 may include:

a water oxygen barrier film is formed on the substrate 10 on which the aforementioned pattern is formed, and the water oxygen barrier film is patterned by using a patterning process to form the water oxygen barrier layer 34.

In some examples, as shown in fig. 3a, the material of the water oxygen barrier layer 34 may be a conductive material, the water oxygen barrier layer 34 includes a plurality of connection electrodes 341, and each of the connection electrodes 341 is disposed on a surface of a corresponding one of the first electrodes 31 exposed by the first pixel opening 321, partially on a circumferential sidewall of the first pixel opening 321, and partially on a portion of a surface of the pixel defining layer 32 away from the substrate 10, the portion being close to the first pixel opening 321. An orthogonal projection of the connection electrode 341 on the substrate 10 may include an orthogonal projection of the first pixel opening 321 on the substrate 10.

In other examples, as shown in fig. 4a, the material of the water-oxygen barrier layer 34 is an insulating material, and the water-oxygen barrier layer 34 is at least partially disposed on the circumferential sidewall of the first pixel opening 321 and at least partially disposed on a portion of the surface of the pixel defining layer 32 away from the substrate 10, which is close to the first pixel opening 321; the water-oxygen barrier layer 34 is provided with a plurality of second pixel openings, each of which exposes a surface of a corresponding one of the first electrodes 31 exposed by the first pixel opening 321. As shown in fig. 4a, the water oxygen barrier layer 34 may be a unitary structure.

(8) Forming the organic functional layer, the second electrode layer 38, and the encapsulation structure layer 40 may include:

as shown in fig. 3a and 4a, the organic functional layer may include a first organic structure layer 35, an organic light emitting layer 36, and a second organic structure layer 37 sequentially stacked on the substrate 10, the first organic structure layer 35 may include any one or more of a hole injection layer, a hole transport layer, and an electron blocking layer, the second organic structure layer 37 may include any one or more of a hole blocking layer, an electron transport layer, and an electron injection layer, any one of the first organic structure layer 35 and the second organic structure layer 37 may be an integral structure and a common layer of a plurality of sub-pixels (or a plurality of light emitting devices), the organic light emitting layer 36 includes a plurality of sub-light emitting layers 361, and each light emitting device includes one sub-light emitting layer 361. Each of the first electrode 31, the organic functional layer and the second electrode layer 38 are sequentially stacked to form a light emitting device.

An encapsulation structure layer 40 is formed on the substrate 10 with the aforementioned pattern, as shown in fig. 3a and 4 a. The encapsulation structure layer 40 may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are sequentially stacked. A touch structure layer and the like may be formed on the package structure layer 40.

In some exemplary embodiments, the substrate may be a flexible substrate, or may be a rigid substrate. The rigid substrate may be, but is not limited to, one or more of glass, quartz, and the flexible substrate may be, but is not limited to, one or more of polyethylene terephthalate, ethylene terephthalate, polyetheretherketone, polystyrene, polycarbonate, polyarylate, polyimide, polyvinyl chloride, polyethylene, and textile fibers.

In some exemplary embodiments, the first gate metal layer, the second gate metal layer, and the source/drain metal layer may be made of a metal material, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), and molybdenum (Mo), or an alloy material of the above metals, such as aluminum neodymium (AlNd) or molybdenum niobium (MoNb), and may be a single-layer structure or a multi-layer composite structure, such as Mo/Cu/Mo, and the like. The Buffer (Buffer) layer, the first gate insulating (GI2) layer, the second gate insulating (GI2) layer, and the interlayer Insulating (ILD) layer may each be one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may have a single-layer structure or a multi-layer composite structure. The planarization layer may employ an organic material such as resin or the like. The buffer layer can be used to improve the water and oxygen resistance of the substrate. The active layer may be made of amorphous indium gallium zinc Oxide (a-IGZO), zinc oxynitride (ZnON), Indium Zinc Tin Oxide (IZTO), amorphous silicon (a-Si), polysilicon (p-Si), hexathiophene, polythiophene, or the like, that is, the present disclosure is applicable to a transistor manufactured based on an Oxide (Oxide) technology, a silicon technology, or an organic technology. The first electrode may have a single-layer structure, such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO); alternatively, the first electrode may adopt a multi-layer composite structure, such as ITO/Ag/ITO, etc. The pixel defining layer may employ polyimide, acryl, or polyethylene terephthalate. The second electrode layer may employ any one or more of magnesium (Mg), silver (Ag), aluminum (Al), copper (Cu), and lithium (Li), or an alloy made of any one or more of the above metals.

An embodiment of the present disclosure further provides a display device, including the display substrate according to any one of the embodiments. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

In the drawings, the size of the constituent elements, the thickness of layers, or regions may be exaggerated for clarity. Therefore, the embodiments of the present disclosure are not necessarily limited to the dimensions, and the shape and size of each component in the drawings do not reflect a true scale. In addition, the drawings schematically show some examples, and embodiments of the present disclosure are not limited to the shapes or numerical values shown in the drawings.

In the description herein, "parallel" refers to a state where two straight lines form an angle of-10 ° or more and 10 ° or less, and thus includes a state where the angle is-5 ° or more and 5 ° or less. The term "perpendicular" refers to a state in which the angle formed by two straight lines is 80 ° or more and 100 ° or less, and therefore includes a state in which the angle is 85 ° or more and 95 ° or less.

In the description herein, the terms "upper", "lower", "left", "right", "top", "inner", "outer", "axial", "four corners", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of simplifying the description of the embodiments of the present disclosure, and do not indicate or imply that the structures referred to have a particular orientation, are constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present disclosure.

In the description herein, unless expressly stated or limited otherwise, the terms "connected," "fixedly connected," "mounted," or "coupled" are to be construed broadly and may, for example, be fixedly connected, or detachably connected, or integrally connected; the terms "mounted," "connected," and "fixedly connected" may be directly connected or indirectly connected through intervening elements, or may be connected through the interior of two elements. The meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

Claims

1. A display substrate comprises a driving structure layer and a light emitting structure layer which are sequentially stacked on a substrate, wherein the driving structure layer comprises a pixel driving circuit; the method is characterized in that:

the light emitting structure layer comprises a first electrode layer, a pixel defining layer, a water oxygen barrier layer, an organic functional layer and a second electrode layer; the first electrode layer comprises a plurality of first electrodes arranged on the driving structure layer, the pixel defining layer is arranged on one side of the first electrodes far away from the substrate and is provided with a plurality of first pixel openings, and each first pixel opening exposes the surface of the corresponding first electrode far away from the substrate;

the water-oxygen barrier layer is at least partially disposed on a circumferential sidewall of the first pixel opening;

the organic functional layer comprises an organic light emitting layer, the organic functional layer and the second electrode layer are sequentially stacked on one side, far away from the substrate, of the first electrode, and each of the first electrode, the organic functional layer and the second electrode layer forms a light emitting device.

2. The display substrate of claim 1, wherein: a portion of the water oxygen barrier layer is also disposed on a portion of a surface of the pixel defining layer distal from the substrate proximate to the first pixel opening.

3. The display substrate of claim 1, wherein: the material of the water-oxygen barrier layer is a conductive material, the water-oxygen barrier layer comprises a plurality of connection electrodes, each of the connection electrodes is arranged on the surface of the corresponding one of the first electrodes exposed by the first pixel opening, is partially arranged on the circumferential side wall of the first pixel opening, and is partially arranged on the part, close to the first pixel opening, of the surface of the pixel defining layer far away from the substrate; the organic functional layer is arranged on the surface of the water oxygen barrier layer far away from the substrate.

4. The display substrate of claim 3, wherein: an orthographic projection of the connection electrode on the substrate includes an orthographic projection of the first pixel opening on the substrate.

5. The display substrate of claim 3, wherein: the organic light emitting layer includes a plurality of sub light emitting layers disposed within the first pixel opening, and an orthographic projection of the first pixel opening on the substrate includes an orthographic projection of the sub light emitting layers on the substrate.

6. The display substrate of claim 3, wherein: the first electrode comprises a first conductive material layer, and the connection electrode comprises a fourth conductive material layer;

7. The display substrate of claim 6, wherein: the first electrode comprises a first conductive material layer and a second conductive material layer which are sequentially stacked along the direction far away from the substrate, and the connecting electrode comprises a third conductive material layer and a fourth conductive material layer which are sequentially stacked along the direction far away from the substrate; the material of the first conductive material layer is the same as that of the fourth conductive material layer, and the material of the second conductive material layer is the same as that of the third conductive material layer.

8. The display substrate of claim 7, wherein: the first conductive material layer and the fourth conductive material layer are both made of indium tin oxide or indium zinc oxide, and the second conductive material layer and the third conductive material layer are both made of silver, titanium or aluminum;

the thickness of the first conductive material layer is

To

The thickness of the second conductive material layer is

To

The thickness of the third conductive material layer is

To

The thickness of the fourth conductive material layer is

To

9. The display substrate of claim 1, wherein: the water and oxygen blocking layer is made of an insulating material and provided with a plurality of second pixel openings, and each second pixel opening exposes the surface of the corresponding first electrode exposed by the first pixel opening;

10. The display substrate of claim 9, wherein: the water oxygen barrier layer is of an integrated structure.

11. The display substrate of claim 9, wherein: the material of the water-oxygen barrier layer comprises one or more of silicon oxide, silicon nitride and silicon oxynitride.

12. The display substrate of claim 1, wherein: the organic functional layer further comprises any one or more of the following layers disposed between the first electrode and the organic light emitting layer: a hole injection layer, a hole transport layer, an electron blocking layer;

13. A display device, characterized in that: comprising a display substrate according to any one of claims 1 to 12.