CN114113695A - Double-sided detection system and method for electronic chip - Google Patents
Double-sided detection system and method for electronic chip Download PDFInfo
- Publication number
- CN114113695A CN114113695A CN202111210977.2A CN202111210977A CN114113695A CN 114113695 A CN114113695 A CN 114113695A CN 202111210977 A CN202111210977 A CN 202111210977A CN 114113695 A CN114113695 A CN 114113695A
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- electronic chip
- clamping
- placing
- assembly
- transmission
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention discloses a double-sided detection system and method for an electronic chip, and belongs to the technical field of chip detection. Comprises a detection mechanism, a turnover mechanism arranged on one side of the detection mechanism and a conveying mechanism arranged on one side of the turnover mechanism; the turnover mechanism is provided with a carrier for carrying at least one electronic chip and a turnover assembly for driving the carrier to turn over; the bearing body is provided with at least two working surfaces which are arranged oppositely, and at least one placing cavity is arranged between the two working surfaces; the conveying mechanism is a clamping part which sequentially stacks a plurality of electronic chips from bottom to top; the electronic chip detection device has the advantages that the electronic chip is detected and turned over by forming the corresponding groove bodies, the direct touch of the clamping piece and the fixing piece on the electronic chip is avoided, the electronic chip is well protected in the whole detection process, and the possibility of damage to the electronic chip in the detection and turning process is reduced.
Description
Technical Field
The invention belongs to the technical field of chip detection, and particularly relates to a double-sided detection system and method for an electronic chip.
Background
The quality of two sides of an electronic chip needs to be detected when the electronic chip leaves a factory, and when the other side needs to be detected after one side is detected, a clamp is generally used for clamping the electronic chip in the prior art and then the electronic chip is turned over to realize the detection of the other side. Because the thickness of the electronic chip is limited, and the surface of the electronic chip is distributed with circuits with various connection relations, the electronic chip is easy to wear or be damaged hard when being clamped, and if the damage is on the detected surface, the phenomenon that the electronic chip cannot be found in the later period can exist, and the outgoing quality of the product is further reduced.
Disclosure of Invention
The invention provides a double-sided detection system and a double-sided detection method for an electronic chip, which aim to solve the technical problems in the background technology.
The invention adopts the following technical scheme: an electronic chip double-sided detection system, comprising: the device comprises a detection mechanism, a turnover mechanism arranged on one side of the detection mechanism and a conveying mechanism arranged on one side of the turnover mechanism;
the turnover mechanism is provided with a carrier for carrying at least one electronic chip and a turnover assembly for driving the carrier to turn over; the bearing body is provided with at least two working surfaces which are arranged oppositely, and at least one placing cavity is arranged between the two working surfaces;
the conveying mechanism is a clamping part which sequentially stacks a plurality of electronic chips from bottom to top;
when the bearing body is in a static state, the upper end surface of the placing cavity is in an open state, and the lower end surface of the placing cavity is in a closed state to form a placing groove;
when the bearing body is in a turnover state, both ends of the placing cavity are in a closed state to form a containing groove.
In a further embodiment, further comprising: the cover assembly is arranged at the two end faces of the placing cavity and is set to be in a state where the corresponding end faces are located: a closed state or an open state.
Through adopting above-mentioned technical scheme, the both ends of placing the chamber all set up the lid and close the subassembly, and for independent control, its purpose is in order to realize uncovered and the real-time switching between sealing, makes to place the chamber and suits to satisfy the demand of electronic chip at any state.
In a further embodiment, the closure assembly comprises:
the connecting frames are arranged at the edges of the placing cavities, and the number of the connecting frames is the same as that of the placing cavities;
the plurality of racks are movably inserted in the connecting frame in the radial direction;
the fixed rings with the same number as the placing cavities are fixed on the bearing body; the placing cavities are positioned in the corresponding fixed rings;
the inner gear ring is arranged in the fixed ring in a transmission manner;
the gears with the same number as the racks are simultaneously in transmission connection with the inner gear ring and the racks;
and the cover plates are fixed on the racks, and the number of the cover plates is the same as that of the racks.
By adopting the technical scheme, when the cover plate is in a gathering state, the corresponding covering assembly is in a closed state; otherwise, when the cover plates are in the mutually-backed state, the corresponding covering components are in an open state.
In a further embodiment, the outer wall of the inner gear ring is in transmission connection with the pushing cylinder.
In a further embodiment, the transport mechanism comprises:
a tri-axial transport assembly;
the frame is in transmission connection with the movable end of the three-shaft conveying assembly; a clamping cavity is formed on the bottom surface of the frame from bottom to top;
the at least two groups of transmission assemblies are vertically and oppositely arranged in the frame; the transmission assembly is provided with a plurality of clamping pieces, and the clamping pieces at least comprise the following two states under the transmission of the transmission assembly: when the clamping pieces are in a horizontal state and are oppositely arranged, a fixed clamping space is formed between the clamping pieces on the same horizontal plane;
when the holder is in the tilt state and is located the frame bottom, be and form an elasticity centre gripping space between two sets of holders that the mirror image set up, the elasticity space is the trend that reduces in proper order from supreme down.
By adopting the technical scheme, the elastic clamping space is used for completing a dynamic process of clamping and supporting the electronic chip to be detected, and the fixed clamping space is used for realizing a static state required by the electronic chip to be detected in the transfer process.
In a further embodiment, the transmission assembly comprises:
two groups of driving wheels which are respectively and rotatably arranged at the top and the bottom of the frame; one of the transmission wheels is connected with a positive and negative rotation motor in a transmission way;
the plate chain is in transmission connection with the transmission wheel; the outer wall of the plate link chain is used for fixedly connecting the clamping piece vertical to the plate link chain.
Through adopting above-mentioned technical scheme, realize the state of holder when different demands.
In a further embodiment, the clamping member comprises two oppositely arranged clamping surfaces and a supporting surface, wherein the clamping surfaces are recessed, and the distance between the clamping surfaces and the supporting surface decreases from the fixed end to the movable end until the clamping surfaces are finally close to each other.
In a further embodiment, the top of the frame is a hollow structure.
By adopting the technical scheme, the clamping piece is suitable for supporting and transferring the detected electronic chip.
A double-sided detection system using the electronic chip specifically comprises the following steps:
feeding: placing the electronic chip to be detected in the clamping part in a mode of sequentially overlapping from bottom to top by using a transmission assembly and a clamping piece in the conveying mechanism;
transferring: transferring the clamping part onto a turnover mechanism by using a three-axis conveying assembly; controlling the transmission assembly again to enable the electronic chips to be detected of the clamping parts to be placed in the placing grooves of the bearing bodies according to the preset sequence and the preset positions;
and (3) first detection: starting a detection mechanism to detect the first surface of the electronic chip to be detected, which is positioned in the placing groove;
switching the groove body for the first time: controlling the covering assembly to enable the two ends of the placing cavity to be in a closed state to form a containing groove;
turning: starting the turnover component to turn over the bearing body by 180 degrees;
a second switching groove body: controlling the covering assembly again to enable the top end of the placing cavity in the current state to be in an open state;
and (3) second detection: starting a detection mechanism to detect two surfaces of the electronic chip to be detected in the placing groove;
unloading: the clamping part of the conveying mechanism is positioned below the supporting body, the cover assembly at the bottom of the placing cavity is sequentially opened, the electronic chip which is finally detected is directly fallen into the clamping part, and the electronic chip is sequentially stacked in the clamping part from top to bottom.
The invention has the beneficial effects that: the electronic chip detection device has the advantages that the electronic chip is detected and turned over by forming the corresponding groove bodies, the direct touch of the clamping piece and the fixing piece on the electronic chip is avoided, the electronic chip is well protected in the whole detection process, and the possibility of damage to the electronic chip in the detection and turning process is reduced.
And set up the clamping part of looks adaptation with it, both be applicable to the material loading and unload, adopt the mode of superpose in proper order then unified transfer, high-efficient and do not have the damage to electronic chip.
Drawings
Fig. 1 is a schematic structural view of the turnover mechanism.
Fig. 2 is a schematic structural diagram of the closing assembly.
Fig. 3 is a structural view of the clamping portion.
Each of fig. 1 to 3 is labeled as: the connecting frame 101, the rack 102, the fixed ring 103, the inner gear ring 104, the gear 105, the cover plate 106, the plate link 201, the clamping surface 202, the supporting surface 203, the clamping piece 204, the bearing body 301 and the placing cavity 302.
Detailed Description
The invention is further described with reference to the following description and the accompanying drawings.
In the detection process of the electronic chip, the applicant finds that: when detecting, the electronic chip needs to be clamped, and clamping with certain force is needed. Generally, the electronic chip is small in size and thin in thickness, so that the detection surface of the electronic chip is not only blocked when the electronic chip is fixed, but also damaged due to clamping.
When the electronic chip needs to detect the upper surface and the lower surface, the electronic chip has a requirement of turning over. The clamping device is easy to wear or be hard damaged when being clamped, and if the damage is on the detected surface, the phenomenon that the damage cannot be found exists in the later period.
In order to solve the above technical problems, the applicant has developed an electronic chip double-sided detection system, which includes a detection mechanism, a turnover mechanism disposed on one side of the detection mechanism, and a conveying mechanism disposed on one side of the turnover mechanism. In this embodiment, the detection mechanism is determined according to the detection requirement, and can be implemented by using a corresponding detection mechanism in the prior art, which is not described herein again. Wherein conveying mechanism specifically stacks the clamping part of a plurality of electronic chip from bottom to top in proper order.
In a further embodiment, tilting mechanism can satisfy wait to detect the fixed demand of electronic chip when detecting, can realize detecting the required upset of another side again, and does not have the fixed effect that is external force still the upset to electronic chip of wheel, treats to detect electronic chip and plays the efficient guard action. Further shown are: the turnover mechanism is provided with a carrier 301 for carrying at least one electronic chip and a turnover assembly for driving the carrier 301 to turn over; the carrier 301 has at least two working surfaces arranged opposite to each other, and at least one placing cavity 302 is arranged between the two working surfaces.
When the carrier 301 is in a static state, the upper end surface of the placing cavity 302 is in an open state, and the lower end surface is in a closed state to form a placing groove; when the carrier 301 is in the flipped state, both ends of the placing cavity 302 are closed to form a receiving groove. In other words, the carrier 301 is defined to have a first working surface and a second working surface, and the current state is that the first working surface faces upward, and then the corresponding second working surface faces, and at this time, the top of the placing cavity 302 is in an open state, the bottom of the placing cavity is in a closed state, and the top of the open state is to provide an operating space for loading and detection. The bottom in the closed state provides a supporting surface 203 for the electronic chip to be detected in the placing cavity 302, and the bottom in the closed state is combined with the cavity of the placing cavity 302 to play a role in fixing and limiting. When the second working surface is required to face upwards, the carrier 301 needs to be turned 180 degrees, if the carrier is directly turned according to the state of the two ends of the current placing cavity 302, the electronic chip to be detected in the later period drops from the end of the placing cavity 302 in the open state, and therefore before turning, the current top of the placing cavity 302 is switched from the open state to the closed state and then turned. The updated states at both ends of the placement chamber 302 are processed as required: if the detection is continued, controlling the top of the updated placing cavity 302 to be in an open state and the bottom to be in a closed state; and if the discharging is required after the detection is finished, controlling the updated bottom of the placing cavity 302 to be in an open state.
To achieve the above function, in a further embodiment, two sets of separately controlled cover assemblies are provided at both ends of the placing cavity 302 (top and bottom when the placing cavity 302 is in the vertical direction), and the cover assemblies are set to achieve the state that the corresponding end surfaces are located: a closed state or an open state.
In a further embodiment, as shown in fig. 2, the closure assembly comprises: connecting frame 101, rack 102, fixed ring 103, inner gear ring 104, gear 105 and cover plate 106. The number of the connecting frames 101 is the same as that of the placing cavities 302, that is, one placing cavity 302 corresponds to one connecting frame 101, and the placing frame is arranged at the edge of the placing cavity 302. The rack 102 is movably inserted into the connecting frame 101 in a radial direction, that is, under the action of an external force, the rack 102 makes a relative movement in the radial direction. The number of the fixed rings 103 is the same as that of the placing cavities 302, the fixed rings are fixed on the carrier body 301, and the placing cavities 302 are arranged in the corresponding fixed rings 103. The inner transmission of the fixing ring 103 is connected with an inner gear ring 104, that is, the outer wall of the inner gear ring 104 is in concave-convex fit with the inner wall of the fixing ring 103, so that the inner gear ring 104 can rotate in the fixing ring 103. Wherein the gear 105 is installed between the ring gear 104 and the connecting bracket 101 and the gear 105 is simultaneously engaged with the ring gear 104 and the rack 102. Correspondingly, each rack 102 is fixedly connected with a cover plate 106, when the cover plates 106 are mutually in a gathering state, the current covering assembly is in a closed state, otherwise, the covering assembly is in an open state. In order to drive the inner gear ring 104 to rotate, the outer wall of the inner gear ring 104 is in transmission connection with the pushing cylinder.
The working principle of the covering assembly is as follows: the pushing cylinder pushes the inner gear ring 104 to rotate, the inner gear ring 104 rotates and drives the gear 105 to rotate, the gear 105 rotates and drives the rack 102 to move backwards, namely, the cover plates 106 move backwards mutually, and the covering assembly is opened; on the contrary, the gear 105 rotates and drives the rack 102 to move in opposite directions, that is, the plates move in opposite directions, and the cover assembly is closed.
Therefore when being in the detection state, the current lid of placing chamber 302 top closes the subassembly and opens and make it be in uncovered state, and the lid of bottom closes the subassembly and then closes and be in the encapsulated situation, treats that detection electronic chip plays supporting role, and the cavity of placing chamber 302 is combined again, treats that detection electronic chip plays spacing effect, and does not produce yeyeyesterly of other external forces to electronic chip and use. During overturning, the cover assemblies at the two ends of the placing cavity 302 are both closed, the electronic chip is overturned through the integral overturning of the carrier 301, and any external force cannot be generated on the electronic chip during overturning.
Based on the above description, the electronic chip is well protected in the detection and turning process. However, the carrier 301 used in this embodiment has a plurality of placing cavities 302, and if the carriers are gripped one by the gripper and then placed one by one, the gripping process will not only cause damage but also be inefficient.
Therefore, in order to solve one technical problem, the following improvements are made to the conveying mechanism in the embodiment: the conveying assembly comprises: the three-axis conveying assembly in this embodiment is a moving mechanism in the X-axis, Y-axis and Z-axis directions, and can be implemented by using the moving assembly in the prior art, and therefore, the details are not described herein. The electronic chip is convenient to transfer into the carrier 301, and a clamping cavity is formed on the surface of the frame from bottom to top; and two groups of transmission components which are oppositely arranged are arranged in the clamping cavity along the length direction of the clamping cavity. The transmission assembly is provided with a plurality of clamping pieces 204, and the clamping pieces 204 at least comprise the following two states under the transmission of the transmission assembly: when the clamping members 204 are in a horizontal state and are oppositely arranged, a fixed clamping space is formed between the clamping members 204 positioned on the same horizontal plane; when holder 204 is in the tilt state and is located the frame bottom, form an elasticity centre gripping space between two sets of holders 204 that are the mirror image setting, the elasticity space is the trend that reduces in proper order from supreme down.
In a further embodiment, the transmission assembly comprises: the transmission wheels are arranged at the top and the bottom of the frame, the two transmission wheels are in transmission connection through chain plates, and one of the transmission wheels is in transmission connection with a forward and reverse rotation motor. In this embodiment, select for use the link joint transmission to connect in order to increase the stability in centre gripping space, reduce and rock. If a belt wheel or a chain is used, the formed clamping space has elasticity because the belt wheel or the chain has certain elasticity, the stability is poor, and the clamping force is poor.
The chain plates are vertically fixed with clamping pieces 204, and when the clamping pieces 204 are in a horizontal state, the clamping pieces 204 on the two groups of transmission assemblies and located on the same horizontal plane form a fixed clamping space. The inclined clamping member 204 located at the bottom of the frame forms an elastic clamping space.
In order to facilitate clamping the electronic chip, the clamping member 204 comprises two oppositely disposed clamping surfaces 202 and supporting surfaces 203, wherein the clamping surfaces 202 are recessed, and a distance between the clamping surfaces 202 and the supporting surfaces 203 decreases from a fixed end to a movable end until the clamping surfaces are finally close to each other.
When in use, the device comprises a clamping procedure and a discharging procedure. Further shown are: when needing to jack up the electronic chip, shift the clamping part to the top of electronic chip and contact with the electronic chip, the link joint that transmission assembly drive wheel is located inside moves from bottom to top, the expansion end through the holder 204 that is located the bottom and inclines relatively (the link joint of holder 204 is located transmission wheel department this moment) offsets with the electronic chip, the link joint continues the rebound, the holder 204 of slope is close to the level gradually, at this in-process, the elastic space diminishes gradually, the stable support of electronic chip between the holder 204 that offsets with the electronic chip promptly, until holder 204 is in the horizontality, then the elastic space converts fixed space into, analogize in proper order, will wait to detect that the electronic chip holds up in proper order, and stack in the frame. Then the carrier 301 is transferred uniformly, and the transmission assembly stops working in the transferring process.
When the material needs to be unloaded, the chain plates move in the reverse direction, so that the original fixed clamping space is converted into the elastic clamping space, namely, the clamping piece 204 moves downwards (horizontally) under the action of the transmission assembly until reaching the transmission wheel (inclined), the clamping contact surface of the electronic chip is reduced until the clamping contact surface disappears, and the electronic chip falls into the corresponding placing cavity 302.
Based on the above embodiment, efficient and breakage-free grip transfer is achieved.
In another embodiment, since the electronic chip is placed in the placing cavity 302, if the tested electronic chip is transferred by extending the clamping jaws into and out of the clamp, the following problems will occur: the space in the placing cavity 302 is limited, the clamping jaws cannot extend into the bottom of the electronic chip for clamping, and then certain damage is caused, so that the applicant adjusts the frame as follows: the top of the frame is of a hollow structure.
The concrete expression is as follows: after the electronic chip is detected, the clamping parts are transferred to the corresponding lower part of the placing cavity 302, the cover assembly at the bottom of the placing cavity 302 is opened at the moment, the support of the electronic chip disappears, the electronic chip directly falls on the two symmetrically arranged clamping pieces 204, the chain plate moves downwards to move the electronic chip downwards, the clamping piece 204 at the top continues to accept the next electronic chip at the moment, and the process is repeated.
The method specifically comprises the following steps:
feeding: placing the electronic chip to be detected in the clamping part in a mode of sequentially overlapping from bottom to top by using a transmission assembly in the conveying mechanism and a clamping piece 204;
transferring: transferring the clamping part onto a turnover mechanism by using a three-axis conveying assembly; controlling the transmission assembly again to enable the electronic chips to be detected of the clamping parts to be placed in the placing groove of the carrier 301 according to the preset sequence and the preset positions;
and (3) first detection: starting a detection mechanism to detect the first surface of the electronic chip to be detected, which is positioned in the placing groove;
switching the groove body for the first time: controlling the covering assembly to enable the two ends of the placing cavity 302 to be in a closed state to form accommodating grooves;
turning: starting the turnover assembly to turn over the carrier 301 by 180 degrees;
a second switching groove body: controlling the covering assembly again to enable the top end of the placing cavity 302 in the current state to be in an open state;
and (3) second detection: starting a detection mechanism to detect two surfaces of the electronic chip to be detected in the placing groove; unloading: the clamping part in the conveying mechanism is positioned below the carrier body 301, the cover assembly at the bottom of the placing cavity 302 is sequentially opened, the electronic chips directly fall into the clamping part, and finally, the detected electronic chips are sequentially stacked in the clamping part from top to bottom.
Claims (10)
1. A double-sided detection system of an electronic chip is characterized by comprising: the device comprises a detection mechanism, a turnover mechanism arranged on one side of the detection mechanism and a conveying mechanism arranged on one side of the turnover mechanism;
the turnover mechanism is provided with a carrier for carrying at least one electronic chip and a turnover assembly for driving the carrier to turn over; the bearing body is provided with at least two working surfaces which are arranged oppositely, and at least one placing cavity is arranged between the two working surfaces;
the conveying mechanism is a clamping part which sequentially stacks a plurality of electronic chips from bottom to top;
when the bearing body is in a static state, the upper end surface of the placing cavity is in an open state, and the lower end surface of the placing cavity is in a closed state to form a placing groove;
when the bearing body is in a turnover state, both ends of the placing cavity are in a closed state to form a containing groove.
2. The system of claim 1, further comprising: the cover assembly is arranged at the two end faces of the placing cavity and is set to be in a state where the corresponding end faces are located: a closed state or an open state.
3. The system of claim 2, wherein the cover assembly comprises:
the connecting frames are arranged at the edges of the placing cavities, and the number of the connecting frames is the same as that of the placing cavities;
the plurality of racks are movably inserted in the connecting frame in the radial direction;
the fixed rings with the same number as the placing cavities are fixed on the bearing body; the placing cavities are positioned in the corresponding fixed rings;
the inner gear ring is arranged in the fixed ring in a transmission manner;
the gears with the same number as the racks are simultaneously in transmission connection with the inner gear ring and the racks;
and the cover plates are fixed on the racks, and the number of the cover plates is the same as that of the racks.
4. The system for detecting the double-sided performance of the electronic chip as claimed in claim 3, wherein the outer wall of the inner gear ring is connected with the pushing cylinder in a transmission manner.
5. The system for double-sided detection of electronic chips of claim 1, wherein the conveying mechanism comprises:
a tri-axial transport assembly;
the frame is in transmission connection with the movable end of the three-shaft conveying assembly; a clamping cavity is formed on the bottom surface of the frame from bottom to top;
the at least two groups of transmission assemblies are vertically and oppositely arranged in the frame; the transmission assembly is provided with a plurality of clamping pieces, and the clamping pieces at least comprise the following two states under the transmission of the transmission assembly: when the clamping pieces are in a horizontal state and are oppositely arranged, a fixed clamping space is formed between the clamping pieces on the same horizontal plane;
when the holder is in the tilt state and is located the frame bottom, be and form an elasticity centre gripping space between two sets of holders that the mirror image set up, the elasticity space is the trend that reduces in proper order from supreme down.
6. The system of claim 5, wherein the actuator assembly comprises:
two groups of driving wheels which are respectively and rotatably arranged at the top and the bottom of the frame; one of the transmission wheels is connected with a positive and negative rotation motor in a transmission way;
the plate chain is in transmission connection with the transmission wheel; the outer wall of the plate link chain is used for fixedly connecting the clamping piece vertical to the plate link chain.
7. The system of claim 5, wherein the clamping member comprises two opposing clamping surfaces and a supporting surface, wherein the clamping surfaces are recessed, and the distance between the clamping surfaces and the supporting surface decreases from the fixed end to the movable end until the clamping surfaces are finally closed.
8. The system of claim 5, wherein the top of the frame is a hollow structure.
9. An inspection method using the electronic chip double-sided inspection system according to any one of claims 1 to 8, comprising the following steps:
feeding: placing the electronic chip to be detected in the clamping part in a mode of sequentially overlapping from bottom to top by using a transmission assembly and a clamping piece in the conveying mechanism;
transferring: transferring the clamping part onto a turnover mechanism by using a three-axis conveying assembly; controlling the transmission assembly again to enable the electronic chips to be detected of the clamping parts to be placed in the placing grooves of the bearing bodies according to the preset sequence and the preset positions;
and (3) first detection: starting a detection mechanism to detect the first surface of the electronic chip to be detected, which is positioned in the placing groove;
switching the groove body for the first time: controlling the covering assembly to enable the two ends of the placing cavity to be in a closed state to form a containing groove;
turning: starting the turnover component to turn over the bearing body by 180 degrees;
a second switching groove body: controlling the covering assembly again to enable the top end of the placing cavity in the current state to be in an open state;
and (3) second detection: and starting the detection mechanism to detect two surfaces of the electronic chip to be detected, which are positioned in the placing groove.
10. The method for detecting both sides of an electronic chip according to claim 9,
still include and unload: the clamping part of the conveying mechanism is positioned below the supporting body, the cover assembly at the bottom of the placing cavity is sequentially opened, the electronic chip which is finally detected is directly fallen into the clamping part, and the electronic chip is sequentially stacked in the clamping part from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111210977.2A CN114113695A (en) | 2021-10-18 | 2021-10-18 | Double-sided detection system and method for electronic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111210977.2A CN114113695A (en) | 2021-10-18 | 2021-10-18 | Double-sided detection system and method for electronic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114113695A true CN114113695A (en) | 2022-03-01 |
Family
ID=80376268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111210977.2A Withdrawn CN114113695A (en) | 2021-10-18 | 2021-10-18 | Double-sided detection system and method for electronic chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114113695A (en) |
-
2021
- 2021-10-18 CN CN202111210977.2A patent/CN114113695A/en not_active Withdrawn
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Application publication date: 20220301 |