CN114101927A - Laser processing apparatus - Google Patents
Laser processing apparatus Download PDFInfo
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- CN114101927A CN114101927A CN202111444880.8A CN202111444880A CN114101927A CN 114101927 A CN114101927 A CN 114101927A CN 202111444880 A CN202111444880 A CN 202111444880A CN 114101927 A CN114101927 A CN 114101927A
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- semiconductor refrigeration
- cooling plate
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- 238000001816 cooling Methods 0.000 claims abstract description 72
- 239000004065 semiconductor Substances 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 59
- 238000005057 refrigeration Methods 0.000 claims abstract description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 12
- 229920000742 Cotton Polymers 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000000110 cooling liquid Substances 0.000 claims description 7
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 6
- 239000000498 cooling water Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 description 13
- 238000003698 laser cutting Methods 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 235000012149 noodles Nutrition 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 206010010904 Convulsion Diseases 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses laser processing equipment which comprises a machine table, a laser module, a two-axis moving carrier and a refrigerating device, wherein the laser module is positioned in the middle of the machine table and is provided with a laser nozzle, the axis of the laser nozzle extends in the vertical direction, and the laser nozzle upwards emits laser beams; the two-axis moving carrier is arranged on the base station and used for loading the materials to be processed and driving the materials to be processed to move in the X direction and the Y direction; the refrigerating device comprises a three-axis manipulator and a semiconductor refrigerating module, the three-axis manipulator is located above the machine table, and the semiconductor refrigerating module is installed on the three-axis manipulator and is used for driving the semiconductor refrigerating module to move in the X direction, the Y direction and the Z direction and be attached to a material to be processed, so that the material to be processed is cooled. According to the laser processing equipment disclosed by the invention, the semiconductor refrigeration module is used for cooling the material, so that the material can be rapidly cooled, the subsequent steps can be conveniently carried out, and the processing efficiency is improved.
Description
Technical Field
The invention relates to laser equipment, in particular to laser processing equipment.
Background
The laser cutting is to irradiate the material to be cut by using high-power-density laser beams, so that the material is heated to a vaporization temperature quickly and is evaporated to form holes, and the holes continuously form slits with narrow width (such as about 0.1 mm) along with the movement of the laser beams to the material, so as to finish the cutting of the material.
In the related art, in the laser cutting process, a long time is required for cooling the material to be processed after being cut, for example, a cutting die, and after being completely cooled, the subsequent operations such as discharging and the like can be performed. In addition, in some material processing, too high temperature easily causes problems such as material deformation, for example, tempered glass, and the like.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. The invention is based on the object of providing a laser machining device.
To achieve the above object, a laser processing apparatus according to an embodiment of the present invention includes:
a machine platform;
the laser module is positioned in the middle of the machine table and provided with a laser nozzle, the axis of the laser nozzle extends along the vertical direction, and the laser nozzle upwards emits laser beams;
the two-axis moving carrier is arranged on the base station and used for loading the materials to be processed and driving the materials to be processed to move in the X direction and the Y direction;
refrigerating plant, refrigerating plant includes triaxial manipulator and semiconductor refrigeration module, the triaxial manipulator is located the board top, semiconductor refrigeration module is installed on the triaxial manipulator, in order to pass through the drive of triaxial manipulator semiconductor refrigeration module removes and laminates in X direction, Y direction and Z direction treat on the processing material, it is right treat that the processing material cools off.
According to the laser processing equipment provided by the embodiment of the invention, the material to be processed is placed on the two-axis moving frame to move, the laser module provides laser beams to irradiate upwards on the material to be processed, the laser cutting of the material is completed, after the cutting is completed, the semiconductor refrigeration module can be driven by the three-axis manipulator to be close to or attached to the upper surface of the material, and the material is cooled by the semiconductor refrigeration module, so that the material can be rapidly cooled, the subsequent steps can be conveniently carried out, and the processing efficiency is improved. In addition, in the course of working, in order to prevent the material from closing to the regional high temperature of cutting the position, also can utilize three-axis manipulator drive semiconductor refrigeration module to be close to or paste on the upper surface of material, suitably reduce the peripheral region temperature of cutting the position, prevent deformation and fracture scheduling problem that the high temperature caused.
In addition, the laser processing apparatus according to the above embodiment of the present invention may further have the following additional technical features:
according to one embodiment of the invention, the semiconductor refrigeration module comprises:
the water cooling plate is internally provided with a water cooling channel, cooling liquid is stored in the water cooling channel, and the lower surface of the water cooling plate is suitable for being attached to a material to be processed;
the semiconductor refrigeration piece is positioned above the water cooling plate, and the cold surface of the semiconductor refrigeration piece is attached to the upper surface of the water cooling plate;
the radiator is positioned above the semiconductor condensing sheet and attached to the hot surface of the semiconductor condensing sheet.
According to an embodiment of the present invention, the semiconductor refrigeration module further includes a heat dissipation fan disposed above the heat sink for actively dissipating heat from the heat sink.
According to an embodiment of the present invention, the water cooling plate includes a cooling plate and a cover plate, a circuitous cooling water tank is disposed on a bottom surface of the cooling plate, the cover plate is fixed on the bottom surface of the cooling plate, and a sealing ring is disposed between the cover plate and the cooling plate, so that the cooling water tank is sealed to form the water cooling channel.
According to an embodiment of the invention, the semiconductor refrigeration module further comprises heat insulation cotton, the heat insulation cotton is attached to the upper surface of the water cooling plate, an embedded opening matched with the semiconductor condensation sheet is hollowed in the heat insulation cotton, and the semiconductor refrigeration sheet is embedded in the embedded opening.
According to one embodiment of the invention, the two-axis moving carrier comprises:
the two first guide rails are arranged on the machine table in parallel in the X-axis direction, and each first guide rail extends along the Y-axis direction;
the first screw rod transmission mechanism is arranged between the two first guide rails and extends along the Y axis;
the first moving frame is erected on the two first guide rails and can slide along the Y-axis direction;
the two second screw rod transmission mechanisms are respectively arranged on two sides of the first moving frame in the Y-axis direction and extend along the X-axis direction;
the two second guide rails are arranged on the first moving frame in parallel in the Y-axis direction, and each second guide rail extends along the X-axis direction;
and the second moving frame is arranged on the two second guide rails and can slide along the X-axis direction, and the second moving frame is suitable for loading materials to be processed.
According to one embodiment of the invention, the laser processing equipment further comprises a plurality of air cylinders and air draft equipment, the air cylinders are arranged on the machine platform and circumferentially arranged around the laser nozzle at intervals, and the air draft equipment is connected with the air cylinders so as to draft the air cylinders.
According to one embodiment of the invention, the three-axis manipulator comprises a Y-axis linear module, an X-axis linear module, a Z-axis linear module and a Z-axis descent control module, the Y-axis linear module is suspended above the machine table, the X-axis linear module is connected to the Y-axis linear module and moves along the Y-axis direction, the Z-axis linear module is connected to the X-axis linear module and moves along the X-axis direction, the Z-axis descent control module is connected to the Z-axis linear module and can slide along the Z-axis, and the refrigerating device is connected to the Z-axis descent control module and moves up and down under the driving of the Z-axis descent control module.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a laser processing apparatus according to an embodiment of the present invention;
FIG. 2 is a partially exploded schematic view of a laser machining apparatus according to an embodiment of the present invention;
fig. 3 is a bottom view of a part of the structure of a laser processing apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a semiconductor refrigeration module in the laser processing apparatus according to the embodiment of the present invention;
FIG. 5 is a cross-sectional view of a semiconductor refrigeration module in the laser processing apparatus according to the embodiment of the present invention;
FIG. 6 is an exploded view of a semiconductor refrigeration module of a laser processing apparatus according to an embodiment of the present invention;
FIG. 7 is an exploded view of another view of the semiconductor refrigeration module of the laser processing apparatus according to the embodiment of the present invention;
FIG. 8 is an exploded view of a water cooling plate of a semiconductor cooling module in a laser processing apparatus according to an embodiment of the present invention;
fig. 9 is an exploded view of a two-axis motion carriage in a laser processing apparatus according to an embodiment of the present invention.
Reference numerals:
10. a machine platform;
20. a laser module;
201. a laser nozzle;
202. a laser tube;
203. an optical lens module;
30. a two-axis moving carrier;
301. a first guide rail;
302. a first screw drive mechanism;
303. a first movable frame;
304. a second screw drive mechanism;
305. a second movable frame;
31. an air duct;
40. a three-axis manipulator;
41. a semiconductor refrigeration module;
411. a water-cooling plate;
4111. a cooling plate;
4112. a cover plate;
4113. a seal ring;
h41, a water cooling channel;
412. a semiconductor refrigeration sheet;
s01, cold noodle;
s02, hot noodle;
413. a heat sink;
414. a heat radiation fan;
415. and (4) heat insulation cotton.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," "radial," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
A laser processing apparatus according to an embodiment of the present invention is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 9, a laser processing apparatus according to an embodiment of the present invention includes a machine table 10, a laser module 20, a two-axis moving carrier 30, and a cooling device.
Specifically, the laser module 20 is located in the middle of the machine table 10, the laser module 20 has a laser nozzle 201, an axis of the laser nozzle 201 extends along the vertical direction, and the laser nozzle 201 emits a laser beam upward. It can be understood that the laser module 20 generally further includes a laser tube 202 and an optical lens module 203, and the laser emitted from the laser tube 202 forms a laser beam after being optically processed by the optical lens module 203 and is emitted upwards from the laser nozzle 201.
The two-axis moving carrier 30 is arranged on the base station, and is used for loading the materials to be processed and driving the materials to be processed to move in the X direction and the Y direction. That is, the material to be processed may be placed on the two-axis moving carrier 30, and the material to be processed is driven by the two-axis moving carrier 30 to move relative to the laser nozzle 201, thereby achieving cutting according to a predetermined trajectory.
Refrigerating plant includes triaxial manipulator 40 and semiconductor refrigeration module 41, triaxial manipulator 40 is located the board 10 top, semiconductor refrigeration module 41 is installed on the triaxial manipulator 40, with pass through the drive of triaxial manipulator 40 semiconductor refrigeration module 41 removes and laminates in X direction, Y direction and Z direction treat on the processing material, it is right to treat that the processing material cools off the temperature.
That is, the three-axis robot 40 can drive the semiconductor refrigeration module 41 to move in the space above the machine table 10, so that the semiconductor refrigeration module 41 can be close to or attached to the top surface of the material to be processed on the two-axis moving carrier 30, and the semiconductor refrigeration module 41 can be used to actively cool the material to be processed.
According to the laser processing equipment provided by the embodiment of the invention, the material to be processed is placed on the two-axis moving frame to move, the laser module 20 provides laser beams to irradiate upwards on the material to be processed, the laser cutting of the material is completed, after the cutting is completed, the semiconductor refrigeration module 41 can be driven by the three-axis manipulator 40 to be close to or attached to the upper surface of the material, and the semiconductor refrigeration module 41 is used for cooling the material, so that the material can be rapidly cooled, the subsequent steps can be conveniently carried out, and the processing efficiency is improved. In addition, in the processing process, in order to prevent the temperature of the area of the material near the cutting position from being too high, the three-axis robot 40 can also be used to drive the semiconductor refrigeration module 41 to be close to or attached to the upper surface of the material, so as to properly reduce the temperature of the peripheral area of the cutting position and prevent the problems of deformation, cracking and the like caused by the too high temperature.
Referring to fig. 4 to 8, in an embodiment of the present invention, the semiconductor refrigeration module 41 includes a water cooling plate 411, a semiconductor refrigeration sheet 412 and a heat sink 413, a water cooling channel H41 is formed in the water cooling plate 411, a cooling liquid is stored in the water cooling channel H41, and a lower surface of the water cooling plate 411 is suitable for being attached to a material to be processed. The semiconductor refrigeration piece 412 is located above the water cooling plate 411, and the cold surface S01 of the semiconductor refrigeration piece 412 is attached to the upper surface of the water cooling plate 411. The heat sink 413 is located above the semiconductor condensation sheet and attached to the hot surface S02 of the semiconductor condensation sheet. The heat sink 413 may be an aluminum profile, and the upper surface of the heat sink is configured with a plurality of heat dissipation fins, so as to increase the heat dissipation area S02 and improve the heat dissipation efficiency.
That is to say, the cooling liquid has in the water-cooling board 411, this water-cooling originally can adopt the material that the heat conductivity is good, for example, the aluminium material, the copper product etc., when triaxial manipulator 40 drive semiconductor refrigeration module 41 downstream, the bottom surface of water-cooling board 411 is pressed close to or is leaned on the top surface at the material, the heat conduction of material is to water-cooling board 411, water-cooling board 411 carries out the heat exchange with the cooling liquid with the heat, the temperature rises after the cooling liquid absorbs the heat, and the cold face S01 of semiconductor refrigeration piece 412 pastes the upper surface of establishing at water-cooling board 411, so, can conduct cold volume to water-cooling board 411 and cooling liquid, and then make the heat of material conduct to radiator 413 on by water-cooling board 411 and semiconductor refrigeration piece 412 fast, and conduct to the outside through this radiator 413, realize dispelling the heat to the material fast, its cooling speed piece, and even stable.
It is understood that the semiconductor cooling module 41 may be configured in different shapes, such as rectangular or circular, and in use, the semiconductor cooling module 41 with different shapes may be selected according to the shape of the cutting path, such as straight cutting, the semiconductor cooling module 41 with rectangular shape may be used, and the semiconductor cooling module 41 with circular shape may be used, so that the semiconductor cooling module 41 is adapted to the cutting path.
Referring to fig. 4 to 7, in an embodiment of the invention, the semiconductor refrigeration module 41 further includes a heat dissipation fan 414, wherein the heat dissipation fan 414 is disposed above the heat sink 413 and is used for actively dissipating heat from the heat sink 413.
In use, the heat of the heat sink 413 is quickly conducted to the external environment along with the airflow of the heat dissipation fan 414, so as to accelerate the heat dissipation speed of the heat sink 413, and further improve the heat dissipation efficiency and the heat dissipation effect.
Referring to fig. 5 and 8, in an embodiment of the present invention, the water cooling plate 411 includes a cooling plate 4111 and a cover plate 4112, a bottom surface of the cooling plate 4111 is provided with a winding-shaped cooling water groove, the cover plate 4112 is fixed on the bottom surface of the cooling plate 4111, and a sealing ring 4113 is disposed between the cover plate 4112 and the cooling plate 4111, so that the cooling water groove is closed to form the water cooling channel H41.
That is to say, water-cooling board 411 mainly comprises cooling plate 4111 and apron 4112, sets up the cooling trough on cooling plate 4111, utilizes apron 4112 and sealing ring 4113 to seal in the bottom of cooling plate 4111, defines water-cooling passageway H41, so, conveniently in the processing of water-cooling board 411 for inside water-cooling passageway H41 covers each position, and the heat dissipation is even, and this kind of structure also conveniently changes the coolant liquid.
Referring to fig. 5 to 7, in an embodiment of the present invention, the semiconductor refrigeration module 41 further includes a heat insulation cotton 415, the heat insulation cotton 415 is attached to an upper surface of the water cooling plate 411, an insertion opening adapted to the semiconductor condensation sheet is hollowed in the heat insulation cotton 415, and the semiconductor refrigeration sheet 412 is inserted in the insertion opening.
That is to say, the heat insulation cotton 415 wraps around the semiconductor condensation sheet, so that the heat insulation surface S02 can prevent the cold energy of the semiconductor refrigeration sheet 412 from conducting outwards, thereby reducing the loss of the cold energy and improving the refrigeration efficiency.
Referring to fig. 9, in some embodiments of the present invention, the two-axis mobile carrier 30 includes two first guide rails 301, a first screw actuator 302, a first mobile frame 303, two second screw actuators 304, two second guide rails, and a second mobile frame 305.
The two first guide rails 301 are arranged on the machine table 10 in parallel in the X-axis direction, and each first guide rail 301 extends along the Y-axis direction; a first screw drive 302 is arranged between the two first rails 301 and extends along the Y-axis.
The first moving frame 303 is mounted on the two first guide rails 301 and is slidable in the Y-axis direction. The two second screw transmission mechanisms 304 are respectively disposed on two sides of the first moving frame 303 in the Y-axis direction and extend along the X-axis direction.
The two second guide rails are arranged on the first moving frame 303 in parallel with each other in the Y-axis direction, and each of the second guide rails extends in the X-axis direction. The second moving rack 305 is disposed on the two second guide rails and is slidable along the X-axis direction, and the second moving rack 305 is adapted to carry the material to be processed.
That is, the first moving frame 303 can be driven to move in the Y-axis direction by the first screw rotating mechanism, and the second moving frame 305 can be driven to move in the X-axis direction by the second screw transmission mechanism 304 on the first moving frame 303, so that the second moving frame 305 can freely move in the X-axis direction and the Y-axis direction, the structure is simple, the driving is reliable, and the first screw transmission mechanism 302 and the second screw transmission mechanism 304 can ensure higher movement precision, thereby improving the cutting precision.
Referring to fig. 1 to 2, in an embodiment of the present invention, the laser processing apparatus further includes a plurality of air ducts 31 and an air draft apparatus, the plurality of air ducts 31 are disposed on the machine 10 and circumferentially spaced around the laser nozzle 201, and the air draft apparatus is connected to the plurality of air ducts 31 to draft the air ducts 31.
That is to say, the position that is close to laser nozzle 201 on platform 10 sets up dryer 31, and dryer 31 is connected to air extracting equipment, carries out convulsions to dryer 31 through air extracting equipment, and dryer 31 produces the suction air current, inhales the pollution that reduces the processing environment with laser cutting process production smog.
In an embodiment of the present invention, the three-axis manipulator 40 includes a Y-axis linear module, an X-axis linear module, a Z-axis linear module, and a Z-axis descent control module, the Y-axis linear module is suspended above the machine table 10, the X-axis linear module is connected to the Y-axis linear module and moves along the Y-axis direction, the Z-axis linear module is connected to the X-axis linear module and moves along the X-axis direction, the Z-axis descent control module is connected to the Z-axis linear module and can slide along the Z-axis, and the refrigeration device is connected to the Z-axis descent control module and moves up and down under the driving of the Z-axis descent control module.
In this embodiment, utilize Y axle sharp module, X axle sharp module, Z axle sharp module to realize at the ascending removal of X axle, Y axle and Z axle direction, can drive the semiconductor module and can remove to required position fast, and Z axle slowly falls the module and can realize the meticulous regulation at Z epaxial high position, ensures that semiconductor refrigeration piece 412's height is more accurate, through the meticulous regulation of high position, can adjust the effect of temperature conduction.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A laser machining apparatus, characterized by comprising:
a machine platform;
the laser module is positioned in the middle of the machine table and provided with a laser nozzle, the axis of the laser nozzle extends along the vertical direction, and the laser nozzle upwards emits laser beams;
the two-axis moving carrier is arranged on the base station and used for loading the materials to be processed and driving the materials to be processed to move in the X direction and the Y direction;
refrigerating plant, refrigerating plant includes triaxial manipulator and semiconductor refrigeration module, the triaxial manipulator is located the board top, semiconductor refrigeration module is installed on the triaxial manipulator, in order to pass through the drive of triaxial manipulator semiconductor refrigeration module removes and laminates in X direction, Y direction and Z direction treat on the processing material, it is right treat that the processing material cools off.
2. The laser processing apparatus of claim 1, wherein the semiconductor refrigeration module comprises:
the water cooling plate is internally provided with a water cooling channel, cooling liquid is stored in the water cooling channel, and the lower surface of the water cooling plate is suitable for being attached to a material to be processed;
the semiconductor refrigeration piece is positioned above the water cooling plate, and the cold surface of the semiconductor refrigeration piece is attached to the upper surface of the water cooling plate;
the radiator is positioned above the semiconductor condensing sheet and attached to the hot surface of the semiconductor condensing sheet.
3. The laser processing apparatus of claim 2, wherein the semiconductor cooling module further comprises a heat dissipation fan disposed above the heat sink for actively dissipating heat from the heat sink.
4. The laser processing apparatus according to claim 3, wherein the water cooling plate includes a cooling plate and a cover plate, a circuitous cooling water tank is disposed on a bottom surface of the cooling plate, the cover plate is fixed on the bottom surface of the cooling plate, and a sealing ring is disposed between the cover plate and the cooling plate, so that the cooling water tank is sealed to form the water cooling channel.
5. The laser processing equipment according to claim 3, wherein the semiconductor refrigeration module further comprises heat insulation cotton, the heat insulation cotton is attached to the upper surface of the water cooling plate, an embedded opening matched with the semiconductor condensation sheet is hollowed in the heat insulation cotton, and the semiconductor refrigeration sheet is embedded in the embedded opening.
6. The laser processing apparatus of claim 1, wherein the two-axis moving carrier comprises:
the two first guide rails are arranged on the machine table in parallel in the X-axis direction, and each first guide rail extends along the Y-axis direction;
the first screw rod transmission mechanism is arranged between the two first guide rails and extends along the Y axis;
the first moving frame is erected on the two first guide rails and can slide along the Y-axis direction;
the two second screw rod transmission mechanisms are respectively arranged on two sides of the first moving frame in the Y-axis direction and extend along the X-axis direction;
the two second guide rails are arranged on the first moving frame in parallel in the Y-axis direction, and each second guide rail extends along the X-axis direction;
and the second moving frame is arranged on the two second guide rails and can slide along the X-axis direction, and the second moving frame is suitable for loading materials to be processed.
7. The laser processing device of claim 1, further comprising a plurality of air ducts and an air draft device, wherein the plurality of air ducts are arranged on the machine platform and circumferentially arranged around the laser nozzles at intervals, and the air draft device is connected with the plurality of air ducts to draft the air ducts.
8. The laser processing apparatus of claim 1, wherein the three-axis manipulator comprises a Y-axis linear module, an X-axis linear module, a Z-axis linear module and a Z-axis descent control module, the Y-axis linear module is suspended above the machine table, the X-axis linear module is connected to the Y-axis linear module and moves along the Y-axis direction, the Z-axis linear module is connected to the X-axis linear module and moves along the X-axis direction, the Z-axis descent control module is connected to the Z-axis linear module and slides along the Z-axis, and the semiconductor refrigeration module is connected to the Z-axis descent control module and moves up and down under the driving of the Z-axis descent control module.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115922125A (en) * | 2022-12-30 | 2023-04-07 | 深圳市金百泰珠宝实业有限公司 | Refrigerating mechanism and laser welding machine |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1136487A (en) * | 1995-01-17 | 1996-11-27 | 三菱电机株式会社 | Laser working system |
| CN101031382A (en) * | 2005-07-15 | 2007-09-05 | 松下电器产业株式会社 | Laser machining apparatus and method of adjusting the same |
| JP2010090010A (en) * | 2008-10-10 | 2010-04-22 | Mitsuboshi Diamond Industrial Co Ltd | Method for cutting brittle material substrate and cutting device |
| JP2015091593A (en) * | 2013-11-08 | 2015-05-14 | 株式会社アマダ | Laser cutting processing method and device |
| CN206209566U (en) * | 2016-11-15 | 2017-05-31 | 东莞市冰暴电子科技有限公司 | A kind of semiconductor cooling device for water-cooling heat radiating system |
| CN107414320A (en) * | 2017-09-18 | 2017-12-01 | 安徽理工大学 | It is a kind of can fast cooling observing and controlling cutter device |
| CN207577687U (en) * | 2017-11-10 | 2018-07-06 | 深圳光韵达光电科技股份有限公司 | A kind of laser cutting system |
| CN109202308A (en) * | 2017-06-30 | 2019-01-15 | 株式会社迪思科 | Laser processing device and laser processing |
| CN209716785U (en) * | 2018-12-17 | 2019-12-03 | 深圳市直为精驱控制技术有限公司 | A kind of glass laser cutting direct driving motor workbench |
| CN110865700A (en) * | 2019-12-21 | 2020-03-06 | 李建春 | Temperature-adjustable heat dissipation equipment |
| CN210254729U (en) * | 2019-05-07 | 2020-04-07 | 临沂铭晟数控设备有限公司 | Laser cutting machine capable of achieving rapid identification, rapid positioning and rapid cutting |
| CN111001919A (en) * | 2019-12-27 | 2020-04-14 | 哈尔滨工业大学 | Thick plate aluminum alloy electron beam welding follow-up temperature field regulating and controlling device and welding method thereof |
| CN212599693U (en) * | 2020-04-30 | 2021-02-26 | 江苏思瑞奕精密科技有限公司 | Efficient laser processing equipment |
| CN213730035U (en) * | 2020-10-30 | 2021-07-20 | 武汉华注激光科技有限公司 | Intelligent optical fiber laser cutting machine that security performance is high |
| CN113510392A (en) * | 2021-09-02 | 2021-10-19 | 河南通用智能装备有限公司 | Wafer laser recessive cutting device |
-
2021
- 2021-11-30 CN CN202111444880.8A patent/CN114101927B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1136487A (en) * | 1995-01-17 | 1996-11-27 | 三菱电机株式会社 | Laser working system |
| CN101031382A (en) * | 2005-07-15 | 2007-09-05 | 松下电器产业株式会社 | Laser machining apparatus and method of adjusting the same |
| JP2010090010A (en) * | 2008-10-10 | 2010-04-22 | Mitsuboshi Diamond Industrial Co Ltd | Method for cutting brittle material substrate and cutting device |
| JP2015091593A (en) * | 2013-11-08 | 2015-05-14 | 株式会社アマダ | Laser cutting processing method and device |
| CN206209566U (en) * | 2016-11-15 | 2017-05-31 | 东莞市冰暴电子科技有限公司 | A kind of semiconductor cooling device for water-cooling heat radiating system |
| CN109202308A (en) * | 2017-06-30 | 2019-01-15 | 株式会社迪思科 | Laser processing device and laser processing |
| CN107414320A (en) * | 2017-09-18 | 2017-12-01 | 安徽理工大学 | It is a kind of can fast cooling observing and controlling cutter device |
| CN207577687U (en) * | 2017-11-10 | 2018-07-06 | 深圳光韵达光电科技股份有限公司 | A kind of laser cutting system |
| CN209716785U (en) * | 2018-12-17 | 2019-12-03 | 深圳市直为精驱控制技术有限公司 | A kind of glass laser cutting direct driving motor workbench |
| CN210254729U (en) * | 2019-05-07 | 2020-04-07 | 临沂铭晟数控设备有限公司 | Laser cutting machine capable of achieving rapid identification, rapid positioning and rapid cutting |
| CN110865700A (en) * | 2019-12-21 | 2020-03-06 | 李建春 | Temperature-adjustable heat dissipation equipment |
| CN111001919A (en) * | 2019-12-27 | 2020-04-14 | 哈尔滨工业大学 | Thick plate aluminum alloy electron beam welding follow-up temperature field regulating and controlling device and welding method thereof |
| CN212599693U (en) * | 2020-04-30 | 2021-02-26 | 江苏思瑞奕精密科技有限公司 | Efficient laser processing equipment |
| CN213730035U (en) * | 2020-10-30 | 2021-07-20 | 武汉华注激光科技有限公司 | Intelligent optical fiber laser cutting machine that security performance is high |
| CN113510392A (en) * | 2021-09-02 | 2021-10-19 | 河南通用智能装备有限公司 | Wafer laser recessive cutting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115922125A (en) * | 2022-12-30 | 2023-04-07 | 深圳市金百泰珠宝实业有限公司 | Refrigerating mechanism and laser welding machine |
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|---|---|
| CN114101927B (en) | 2024-06-14 |
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