CN114077169B - Developer solution heat exchange system - Google Patents
Developer solution heat exchange system Download PDFInfo
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- CN114077169B CN114077169B CN202111364677.XA CN202111364677A CN114077169B CN 114077169 B CN114077169 B CN 114077169B CN 202111364677 A CN202111364677 A CN 202111364677A CN 114077169 B CN114077169 B CN 114077169B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a developing solution heat exchange system which comprises a base and a thermal circulation developing solution nozzle, wherein a constant-temperature water tank, a hot dipping tank and a wafer sucker are fixedly arranged at the top of the base through a bracket, and a developing solution first input pipe and a developing solution second input pipe are arranged at the bottom of the hot dipping tank through a mounting seat. Through the setting of hot soaking jar, can heat the developer through the heat preservation water, then through cold-proof sheathed tube setting, can keep warm the developer between circulating water heat exchange piece and thermal cycle developer nozzle, through the setting of heat exchange mechanism, can make the cold-proof water circulation that constant temperature basin provided use, and can keep warm and heat multichannel developer, realized that the invariable of developer temperature can not make the return water influence the heat preservation water, make multichannel developer (including all the way) control in the process temperature that sets for developing effect improves by a wide margin simultaneously when developing technology.
Description
Technical Field
The invention belongs to the technical field of semiconductor spin development, and particularly relates to a developer heat exchange system.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. In the production process of semiconductor wafers, in order to fulfill more and more severe process requirements, strict control on each link of equipment is required, and temperature control of developing solution is important;
the development is the most important step in the spin coater, because the developing solution is particularly sensitive to temperature, the process is greatly influenced when exceeding the specified range, the whole wafer process is possibly started from the beginning, the productivity is seriously influenced, and the economic benefit is influenced.
Therefore, the development liquid heat exchange system is provided to solve the problems in the prior art, so that the development liquid heat exchange system can simultaneously perform heat preservation and heating on multiple paths of development liquids, and prevent backwater from affecting heat preservation water.
Disclosure of Invention
The invention aims to provide a developing solution heat exchange system so as to solve the problems that in the prior art, backwater can affect heat preservation water and multi-path developing solution cannot be simultaneously subjected to heat preservation and heating.
In order to achieve the above purpose, the invention adopts the following technical scheme: the developing solution heat exchange system comprises a base and a thermal circulation developing solution nozzle, wherein a constant-temperature water tank, a hot dipping tank and a wafer sucker are fixedly arranged at the top of the base through a bracket, and a developing solution first input pipe and a developing solution second input pipe are arranged at the bottom of the hot dipping tank through a mounting seat;
one end of the first input tube of the developing solution and one end of the second input tube of the developing solution penetrate through the surface of the hot dipping tank, one end of the first input tube of the developing solution and one end of the second input tube of the developing solution are communicated with the inside of a thermal circulation developing solution nozzle, the thermal circulation developing solution nozzle is arranged right above a wafer sucker, a circulating water heat exchange block is fixedly arranged at the top of the constant temperature water tank through a bracket, the first input tube of the developing solution and the second input tube of the developing solution penetrate through the inside of the circulating water heat exchange block, and a heat exchange mechanism is arranged between the thermal circulation developing solution nozzle and the constant temperature water tank.
Preferably, the heat exchange mechanism comprises a constant temperature water pipe, a warm water inlet pipe and a warm water return pipe, one end of the constant temperature water pipe is communicated with the inside of the constant temperature water tank through a mounting seat, the other end of the constant temperature water pipe is communicated with the inside of the hot dipping tank through the mounting seat, the hot dipping tank and the circulating water heat exchange block are mutually communicated through the warm water inlet pipe, the surface of the circulating water heat exchange block is communicated with the warm water return pipe through the mounting seat, and one end of the warm water return pipe is communicated with the inside of the constant temperature water tank through mounting.
Preferably, two groups of warm-keeping sleeves are arranged between the circulating water heat exchange block and the heat circulation developing solution nozzle, the first developing solution input pipe and the second developing solution input pipe are respectively arranged in the warm-keeping sleeves, and the warm water return pipe and the warm water inlet pipe are respectively communicated with the warm-keeping sleeves through mounting seats.
Preferably, the outer wall fixed mounting of warm water return pipe has the connecting seat, the inner wall of mount pad sets up to internal thread structure, the connecting seat sets up to external thread structure, connecting seat threaded connection is in the inside of mount pad, just warm water return pipe intercommunication is in cold-proof sheathed tube inside.
Preferably, a rubber pad is arranged on the end face of the warm water return pipe, a circular groove is formed in the surface of the rubber pad, and the groove and the warm water return pipe are concentrically arranged.
Preferably, the terminal surface integrated into one piece of connecting seat has fixed sleeve, the lateral wall integrated into one piece of rubber pad has rubber fixed sleeve, rubber fixed sleeve cup joints in fixed sleeve's outer wall.
Preferably, the clamping groove is formed in the outer wall of the rubber fixing sleeve, two groups of semi-annular clamping rings are clamped on the inner wall of the clamping groove, the two groups of semi-annular clamping rings are welded with each other, and the outer wall of the rubber fixing sleeve is attached to the inner wall of the thermal insulation sleeve.
Preferably, the top of base welding has the service board, the first input tube of developer, developer second input tube, constant temperature water pipe and constant temperature wet return all run through in the surface of service board.
Preferably, the first developer inlet pipe and the second developer inlet pipe are spirally arranged inside the hot dipping tank.
Preferably, the first input pipe and the second input pipe are provided with a developing solution control valve for controlling the flow of the developing solution, and the developing solution control valve is arranged between the heat soaking tank and the circulating water heat exchange block.
Preferably, the connection mode of the first developer liquid input pipe, the second developer liquid input pipe, the constant-temperature water pipe and the warm water inlet pipe is the same as the connection mode of the warm water return pipe and the circulating water heat exchange block.
Preferably, the thermal cycle developer nozzle is arranged above the wafer chuck, and the thermal cycle developer nozzle and the wafer chuck are concentrically arranged.
The invention has the technical effects and advantages that: compared with the prior art, the developing solution heat exchange system provided by the invention has the following advantages:
through the setting of hot soaking jar, can heat the developer through the heat preservation water, then through cold-proof sheathed tube setting, can keep warm the developer between circulating water heat exchange piece and thermal cycle developer nozzle, through the setting of heat exchange mechanism, can make the cold-proof water circulation that constant temperature basin provided use, and can keep warm and heat multichannel developer, realized that the invariable of developer temperature can not make the return water influence the heat preservation water, make multichannel developer (including all the way) control in the process temperature that sets for developing effect improves by a wide margin simultaneously when developing technology.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic diagram of the connection structure of the warm water return pipe and the circulating water heat exchange block according to the present invention;
FIG. 3 is an enlarged schematic view of the area A of FIG. 2 according to the present invention;
FIG. 4 is a schematic view showing the internal structure of the heat soaking tank according to the present invention;
fig. 5 is a schematic view showing the internal structure of the thermal cycle developer nozzle of the present invention.
In the figure: 1. a factory board; 2. a developer first input pipe; 3. a developer liquid second input pipe; 4. a constant temperature water tank; 5. a constant temperature water pipe; 6. a hot soaking tank; 7. a warm water inlet pipe; 8. a developer control valve; 9. a circulating water heat exchange block; 10. a thermal cycling developer nozzle; 11. a wafer chuck; 12. a warm water return pipe; 13. a base; 14. a mounting base; 15. warming sleeve; 16. a connecting seat; 17. a groove; 18. a rubber pad; 19. a rubber fixing sleeve; 20. a clasp; 21. a clamping groove; 22. and fixing the sleeve.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a developer heat exchange system as shown in fig. 1-5, comprising a base 13 and a thermal cycle developer nozzle 10;
the top of the base 13 is fixedly provided with a constant-temperature water tank 4, a hot dipping tank 6 and a wafer sucker 11 through a bracket, and the bottom of the hot dipping tank 6 is provided with a developing solution first input pipe 2 and a developing solution second input pipe 3 through a mounting seat 14;
one ends of the first input tube 2 and the second input tube 3 penetrate through the surface of the hot soaking tank 6, one ends of the first input tube 2 and the second input tube 3 are communicated with the inside of a heat circulation developing solution nozzle 10, the heat circulation developing solution nozzle 10 is arranged right above a wafer sucker 11, a circulating water heat exchange block 9 is fixedly arranged at the top of the constant temperature water tank 4 through a bracket, the first input tube 2 and the second input tube 3 penetrate through the inside of the circulating water heat exchange block 9, a heat exchange mechanism is arranged between the heat circulation developing solution nozzle 10 and the constant temperature water tank 4, multiple paths of developing solutions can be heated and insulated simultaneously through the arrangement of the heat exchange mechanism, and warm keeping water provided by the constant temperature water tank 4 is circulated for use;
the heat exchange mechanism comprises a constant temperature water pipe 5, a warm water inlet pipe 7 and a warm water return pipe 12, one end of the constant temperature water pipe 5 is communicated with the inside of the constant temperature water tank 4 through a mounting seat 14, the other end of the constant temperature water pipe 5 is communicated with the inside of the hot dipping tank 6 through the mounting seat 14, the hot dipping tank 6 and the circulating water heat exchange block 9 are mutually communicated through the warm water inlet pipe 7, the surface of the circulating water heat exchange block 9 is communicated with the warm water return pipe 12 through the mounting seat 14, one end of the warm water return pipe 12 is communicated with the inside of the constant temperature water tank 4 through mounting, the warm water inlet pipe 7 and the warm water return pipe 12 divide the input and output of heating water, and the normal heat preservation of the heating water is prevented from being disturbed by backwater;
two groups of warm-keeping sleeves 15 are arranged between the circulating water heat exchange block 9 and the heat circulation developing solution nozzle 10, the first developing solution input pipe 2 and the second developing solution input pipe 3 are respectively arranged in the warm-keeping sleeves 15, the warm water return pipe 12 and the warm water inlet pipe 7 are respectively communicated with the warm-keeping sleeves 15 through mounting seats 14, and the warm-keeping sleeves 15 can keep warm on the developing solution between the circulating water heat exchange block 9 and the heat circulation developing solution nozzle 10, so that the constant temperature of the developing solution is ensured;
the outer wall of the warm water return pipe 12 is fixedly provided with a connecting seat 16, the inner wall of the mounting seat 14 is of an internal thread structure, the connecting seat 16 is of an external thread structure, the connecting seat 16 is in threaded connection with the inside of the mounting seat 14, the warm water return pipe 12 is communicated with the inside of the warm-keeping sleeve 15, the end face of the warm water return pipe 12 is provided with a rubber pad 18, the surface of the rubber pad 18 is provided with a circular groove 17, the groove 17 and the warm water return pipe 12 are concentrically arranged, the end face of the connecting seat 16 is integrally formed with a fixed sleeve 22, the side wall of the rubber pad 18 is integrally formed with a rubber fixed sleeve 19, the rubber fixed sleeve 19 is sleeved on the outer wall of the fixed sleeve 22, the outer wall of the rubber fixed sleeve 19 is provided with a clamping groove 21, the inner wall of the clamping groove 21 is clamped with two groups of semi-annular clamping rings 20, the two groups of clamping rings 20 are welded with each other, the outer wall of the rubber fixed sleeve 19 is attached to the inner wall of the warm-keeping sleeve 15, detachable installation of the warm water return pipe 12 is realized through threaded connection between the mounting seat 14 and the connecting seat 16, the arrangement of the rubber pad 18 and the rubber fixed sleeve 19 can increase the tightness between the warm water return pipe 12 and the sleeve 15, and the clamping groove 21 can be fixed with the clamping ring and the clamping ring 21;
the top of the base 13 is welded with a factory board 1, a first developer input pipe 2, a second developer input pipe 3, a constant-temperature water pipe 5 and a constant-temperature water return pipe are all penetrated through the surface of the factory board 1, and the factory board 1 can fix the first developer input pipe 2, the second developer input pipe 3, the constant-temperature water pipe 5 and the constant-temperature water return pipe;
the first developer inlet pipe 2 and the second developer inlet pipe 3 are arranged in a spiral manner in the hot dipping tank 6, and the first developer inlet pipe 2 and the second developer inlet pipe 3 can slow down the flow rate of the developer and increase the conveying time of the developer, so that the developer is heated conveniently;
the first input pipe 2 of developer and the second input pipe 3 of developer are last to install the developer control valve 8 that is used for controlling developer flow, and developer control valve 8 sets up between hot soaking tank 6 and circulating water heat exchange piece 9, and developer control valve 8 can control the flow of developer to can prevent that the developer from flowing in order to heat the developer.
The connection mode of the first developer input pipe 2, the second developer input pipe 3, the constant temperature water pipe 5 and the warm water inlet pipe 7 is the same as the connection mode of the warm water return pipe 12 and the circulating water heat exchange block 9;
the thermal cycle developer nozzle 10 is disposed above the wafer chuck 11, and the thermal cycle developer nozzle 10 is disposed concentrically with the wafer chuck 11, so that the thermal cycle developer nozzle 10 sprays the developer to the wafer.
Working principle: two or more kinds of developing solutions are output through the first developing solution input pipe 2 and the second developing solution input pipe 3, heating water is introduced into the hot soaking tank 6 through the constant-temperature water tank 4 and the constant-temperature water pipe 5, at the moment, the first developing solution input pipe 2 and the second developing solution input pipe 3 stay in the spiral part and are heated by the heating water, when the developing solution is heated to a required temperature, a switch of the developing solution control valve 8 is opened to convey the developing solution, at the moment, the heating water in the hot soaking tank 6 enters the heat preservation sleeve 15 through the warm water inlet pipe 7 to preserve heat of the developing solution in the first developing solution input pipe 2 and the second developing solution input pipe 3 until the developing solution is sprayed through the heat circulation developing solution nozzle 10, then the heat preservation water flows back to the inside of the circulating water heat exchange block 9 through the sleeve 15 on the surface of the first developing solution input pipe 2, and then flows back to the inside the constant-temperature water tank 4 through the warm water return pipe 12 to continue heating.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (7)
1. The developer solution heat exchange system comprises a base (13) and a thermal cycle developer solution nozzle (10), and is characterized in that: the top of the base (13) is fixedly provided with a constant-temperature water tank (4), a hot soaking tank (6) and a wafer sucker (11) through a bracket, and the bottom of the hot soaking tank (6) is provided with a first developing solution input pipe (2) and a second developing solution input pipe (3) through a mounting seat (14);
one ends of the first developing solution input pipe (2) and the second developing solution input pipe (3) penetrate through the surface of the hot soaking tank (6), one ends of the first developing solution input pipe (2) and the second developing solution input pipe (3) are communicated with the inside of the heat circulation developing solution nozzle (10), the top of the constant temperature water tank (4) is fixedly provided with a circulating water heat exchange block (9) through a bracket, the first developing solution input pipe (2) and the second developing solution input pipe (3) penetrate through the inside of the circulating water heat exchange block (9), and a heat exchange mechanism is arranged between the heat circulation developing solution nozzle (10) and the constant temperature water tank (4);
the heat exchange mechanism comprises a constant temperature water pipe (5), a warm water inlet pipe (7) and a warm water return pipe (12), one end of the constant temperature water pipe (5) is communicated with the inside of the constant temperature water tank (4) through a mounting seat (14), the other end of the constant temperature water pipe (5) is communicated with the inside of the hot dipping tank (6) through the mounting seat (14), the hot dipping tank (6) and the circulating water heat exchange block (9) are mutually communicated through the warm water inlet pipe (7), the surface of the circulating water heat exchange block (9) is communicated with the warm water return pipe (12) through the mounting seat (14), and one end of the warm water return pipe (12) is communicated with the inside of the constant temperature water tank (4) through mounting; two groups of warm-keeping sleeves (15) are arranged between the circulating water heat exchange block (9) and the heat circulation developing solution nozzle (10), the first developing solution input pipe (2) and the second developing solution input pipe (3) are respectively arranged in the warm-keeping sleeves (15), and the warm water return pipe (12) and the warm water inlet pipe (7) are respectively communicated with the warm-keeping sleeves (15) through mounting seats (14); the outer wall of the warm water return pipe (12) is fixedly provided with a connecting seat (16), the inner wall of the mounting seat (14) is of an internal thread structure, the connecting seat (16) is of an external thread structure, the connecting seat (16) is in threaded connection with the inside of the mounting seat (14), and the warm water return pipe (12) is communicated with the inside of the warm-keeping sleeve (15); the end face of the warm water return pipe (12) is provided with a rubber pad (18), the surface of the rubber pad (18) is provided with a circular groove (17), and the groove (17) and the warm water return pipe (12) are concentrically arranged; the end face integrated into one piece of connecting seat (16) has fixed sleeve (22), the lateral wall integrated into one piece of rubber pad (18) has rubber fixed sleeve (19), rubber fixed sleeve (19) cup joints in the outer wall of fixed sleeve (22).
2. The developer heat exchange system according to claim 1, wherein: clamping grooves (21) are formed in the outer wall of the rubber fixing sleeve (19), two groups of semi-annular clamping rings (20) are clamped on the inner wall of the clamping grooves (21), the two groups of semi-annular clamping rings (20) are welded with each other, and the outer wall of the rubber fixing sleeve (19) is attached to the inner wall of the thermal insulation sleeve (15).
3. The developer heat exchange system according to claim 1, wherein: the top welding of base (13) has factory board (1), developer first input tube (2), developer second input tube (3), constant temperature water pipe (5) and constant temperature wet return all run through in the surface of factory board (1).
4. The developer heat exchange system according to claim 1, wherein: the first developer inlet pipe (2) and the second developer inlet pipe (3) are spirally arranged in the hot dipping tank (6).
5. The developer heat exchange system according to claim 1, wherein: and a developing solution control valve (8) for controlling the flow of the developing solution is arranged on the first developing solution input pipe (2) and the second developing solution input pipe (3), and the developing solution control valve (8) is arranged between the heat soaking tank (6) and the circulating water heat exchange block (9).
6. The developer heat exchange system according to claim 1, wherein: the connection mode of the first developer input pipe (2), the second developer input pipe (3), the constant-temperature water pipe (5) and the warm water inlet pipe (7) is the same as the connection mode of the warm water return pipe (12) and the circulating water heat exchange block (9).
7. The developer heat exchange system according to claim 1, wherein: the thermal cycle developer nozzle (10) is arranged above the wafer sucker (11), and the thermal cycle developer nozzle (10) and the wafer sucker (11) are concentrically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111364677.XA CN114077169B (en) | 2021-11-17 | 2021-11-17 | Developer solution heat exchange system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111364677.XA CN114077169B (en) | 2021-11-17 | 2021-11-17 | Developer solution heat exchange system |
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| Publication Number | Publication Date |
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| CN114077169A CN114077169A (en) | 2022-02-22 |
| CN114077169B true CN114077169B (en) | 2023-07-21 |
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| CN202111364677.XA Active CN114077169B (en) | 2021-11-17 | 2021-11-17 | Developer solution heat exchange system |
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| CN108074837A (en) * | 2016-11-15 | 2018-05-25 | 沈阳芯源微电子设备有限公司 | A kind of semiconductor technology water heat-insulation system |
| CN112379580A (en) * | 2020-11-10 | 2021-02-19 | 芯米(厦门)半导体设备有限公司 | Developing solution constant temperature pipeline system |
| CN214098111U (en) * | 2020-11-10 | 2021-08-31 | 芯米(厦门)半导体设备有限公司 | Developing solution constant temperature pipeline system |
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2021
- 2021-11-17 CN CN202111364677.XA patent/CN114077169B/en active Active
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| JPH0914814A (en) * | 1995-06-28 | 1997-01-17 | Sigma Merutetsuku Kk | Liquid temperature adjusting device |
| JPH11121336A (en) * | 1997-10-17 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Developing apparatus |
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| CN114077169A (en) | 2022-02-22 |
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