CN114074132A

CN114074132A - Manufacturing method of photovoltaic solder strip

Info

Publication number: CN114074132A
Application number: CN202110398001.6A
Authority: CN
Inventors: 孙益民; 邓琴
Original assignee: Zhejiang Chuanhe New Material Co ltd
Current assignee: Zhejiang Chuanhe New Material Co ltd
Priority date: 2020-08-18
Filing date: 2021-04-14
Publication date: 2022-02-22
Also published as: CN216655830U; CN216027182U; WO2022037593A1; CN216027184U; CN216027183U; CN216027180U; CN215879302U; CN114074131A; CN114074133A; CN114074134A; CN216027179U; CN216705509U; CN216027178U; CN216027181U; CN112246909A

Abstract

The invention discloses a manufacturing method of a photovoltaic solder strip, which comprises the following steps: pressing at least one area of a copper layer at intervals to obtain the copper layer with the concave-convex structure; and forming a tin layer on the copper layer to obtain the photovoltaic solder strip. The photovoltaic solder strip prepared by the manufacturing method has a concave-convex surface, and the solar energy collecting capacity of the photovoltaic solder strip is improved.

Description

Manufacturing method of photovoltaic solder strip

Technical Field

The invention relates to the field of solder strips, in particular to a manufacturing method of a photovoltaic solder strip.

Background

The solder strip has good conductivity and is applied to connection of the photovoltaic module and the cell. For example, a plurality of solar cells are connected by solder strips, so that the plurality of solar cells can perform energy conversion and electric quantity transmission. Specifically, the solder strip comprises a copper layer and two tin layers formed on the upper surface and the lower surface of the copper layer respectively, the tin layers of the solder strip are welded on the solar cells in the using process so as to connect the solar cells in series or in parallel, a complete electric path can be formed between the solar cells after the solar cells are connected to the junction box, then the solar cells convert solar energy into electric energy in the using process, and the generated current can be transmitted through the solder strip. The quality of the solder strip directly affects the solar energy collection efficiency of the photovoltaic module, and the manufacturing equipment and the manufacturing method of the solder strip directly affect the quality and the production efficiency of the solder strip.

Disclosure of Invention

An object of the present invention is to provide a manufacturing method of a photovoltaic solder strip, wherein the manufacturing method of the photovoltaic solder strip can be used to efficiently produce a photovoltaic solder strip, which is beneficial to improving the production efficiency of the photovoltaic solder strip, reducing the production cycle of the photovoltaic solder strip, and reducing the labor cost.

Another object of the present invention is to provide a method for manufacturing a photovoltaic solder ribbon, wherein a wire releasing device is used to fix copper wire coils with different sizes, and the wire releasing device can stably drive the copper wire coils to rotate and release wires during the rotation.

Another object of the present invention is to provide a manufacturing method of a photovoltaic solder ribbon, wherein in the manufacturing method, at least one region of the copper layer is pressed at intervals, so that the copper layer forms a concave-convex structure, which is beneficial for improving the solar energy collection capability of the photovoltaic solder ribbon manufactured by using the copper layer.

Another object of the present invention is to provide a manufacturing method of a photovoltaic solder strip, wherein in the manufacturing method, the pressing device of the solder strip manufacturing apparatus can dissipate heat in time during the process of pressing the copper layer, so as to avoid affecting the quality of the copper layer.

Another object of the present invention is to provide a method for manufacturing a photovoltaic solder ribbon, wherein in the manufacturing method, the copper layer is subjected to an annealing treatment to improve the performance of the copper layer.

Another object of the present invention is to provide a method for manufacturing a photovoltaic solder ribbon, wherein in the manufacturing method, the copper layer is heated by electrifying the copper layer, and the heated copper layer is surrounded by a protective gas and enters a cooling liquid, so as to prevent the heated copper layer from being oxidized.

Another object of the present invention is to provide a method for manufacturing a photovoltaic solder ribbon, wherein in the manufacturing method, a flux is coated on the surface of the copper layer.

Another object of the present invention is to provide a manufacturing method of a photovoltaic solder strip, wherein in the manufacturing method, a tin layer with a concave-convex structure is formed on the surface of the copper layer, which is beneficial to further improve the solar energy collection capability of the photovoltaic solder strip.

Another object of the present invention is to provide a method for manufacturing a photovoltaic solder strip, wherein in the manufacturing method, a tin block is automatically added into an accommodating space, the molten tin is covered on the surface of the copper layer, and the tin layer is formed subsequently, and the automatic tin adding process replaces the manual tin adding process, so as to improve the operation efficiency, reduce the labor cost, and facilitate to prevent the operation personnel from being scalded during the tin adding process.

Another object of the present invention is to provide a method for manufacturing a photovoltaic solder ribbon, wherein in the manufacturing method, the manufactured photovoltaic solder ribbon is automatically stored into a solder ribbon reel, the storage speed is high, the efficiency is high, and the labor cost is saved.

According to one aspect of the present invention, there is provided a method of manufacturing a photovoltaic solder ribbon, the method comprising the steps of:

(a) pressing at least one area of a copper layer at intervals to obtain the copper layer with the concave-convex structure; and

(b) and forming a tin layer on the copper layer to obtain the photovoltaic solder strip.

According to an embodiment of the present invention, before the step (a), the method further includes the step (c) of forming the copper layer having a predetermined cross-section after at least one shaping of a copper wire.

According to an embodiment of the present invention, in the step (c), the copper wire is formed to have the copper layer with the cross-section of the predetermined shape by wire drawing, press forming, extrusion forming or roll forming.

According to one embodiment of the invention, in step (a), the copper layer is pressed by stamping or rolling.

According to one embodiment of the present invention, after the step (a), there is a step (d) of annealing the copper layer.

According to an embodiment of the present invention, in the step (d), after the copper layer is heated to a predetermined heating temperature, the heated copper layer is cooled to a predetermined cooling temperature.

According to an embodiment of the invention, in the above method, the copper layer is heated by passing an electric current through the copper layer.

According to an embodiment of the present invention, in the above method, the heated copper layer is cooled by being enveloped by a protective gas into a cooling liquid.

According to an embodiment of the invention, in the above method, the cooled copper layer is dried.

According to an embodiment of the present invention, in the above method, the copper layer is dried by blowing the copper layer or adsorbing moisture on the surface of the copper layer.

According to an embodiment of the present invention, after the step (d), the method further comprises the step (e) of forming a fluxing film on the copper layer.

According to an embodiment of the present invention, in the step (b), the step (f) of immersing the copper layer in a tin solution to adhere the tin solution to the surface of the copper layer is further included.

According to an embodiment of the present invention, after the step (f), further comprising the step (g) of pre-shaping the tin bath on the surface of the copper layer.

According to an embodiment of the invention, in the above method, the tin bath on the surface of the copper layer is blown by means of a gas flow.

According to one embodiment of the invention, in the above method, the gas flow is generated towards the copper layer in a manner selected from: the air flow is generated towards the copper layer at intervals, the air flow is generated towards the copper layer continuously in a mode of changing the magnitude of wind force, the air flow is generated towards the copper layer continuously in a mode of keeping the same magnitude of wind force, the air flow is generated towards the copper layer in a mode of being close to the copper layer at intervals, and the air flow is generated towards the copper layer in a mode of moving up and down.

According to an embodiment of the present invention, after the step (g), further comprising the step (h): and cooling and shaping the tin liquid attached to the copper layer.

According to an embodiment of the present invention, before the step (f), further comprising a step (i): and heating the tin block to form tin liquid capable of adhering to the surface of the copper layer.

According to one embodiment of the present invention, before the step (i), the step (j) of automatically adding the tin bumps is further included.

According to one embodiment of the invention, in step (j), the solder bumps are added by impacting the solder bumps.

According to one embodiment of the invention, in the above method, the way of impacting the tin slug is selected from: electric telescopic impact, hydraulic telescopic impact and swing impact.

According to an embodiment of the present invention, after the step (b), further comprising a step (k): and automatically accommodating the photovoltaic solder strip.

According to an embodiment of the present invention, in the step (k), the photovoltaic solder ribbon is automatically wound on a take-up reel.

According to one embodiment of the invention, in the step (k), the take-up reel receiving the photovoltaic solder strip is automatically switched.

According to one embodiment of the invention, in the above method, a copper wire coil is supported by means of a limiting ramp, the copper wire wound around the copper wire coil leaving the copper wire coil during rotation.

Drawings

FIG. 1 is a schematic diagram of a solder strip manufacturing apparatus according to a preferred embodiment of the present invention.

FIG. 2A is a schematic diagram illustrating a wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2B is an exploded view of the wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2C is a schematic sectional view of the wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2D is a schematic view of an application of the wire releasing device of the solder strip manufacturing apparatus according to the preferred embodiment of the present invention.

FIG. 2E is a schematic view of an application of the wire releasing device of the solder strip manufacturing apparatus according to the preferred embodiment of the present invention.

Fig. 3A is a schematic structural diagram of a molding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3B is a schematic cross-sectional view of a forming unit of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3C is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3D is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3E is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3F is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4A is a schematic structural diagram of a pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4B is an exploded view schematically illustrating the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4C is a schematic sectional view of the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4D is a schematic diagram of a stage of the pressing process of the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 5A is a schematic structural diagram of an annealing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 5B is a schematic diagram illustrating the application of the annealing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 6A is a schematic diagram illustrating a structure of a flux covering device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the invention.

Fig. 6B is an exploded view of the flux covering device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7A is a schematic structural diagram of a tin layer forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7B is a schematic structural diagram of the tin layer forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7C is a schematic diagram of a stage of the tin coating process of the tin layer forming device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7D is a schematic diagram of a stage of the tin coating process of the tin layer forming device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8A is a schematic structural diagram of an automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8B is a schematic structural diagram of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8C is a schematic structural diagram of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8D is a schematic view showing the application of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9A is a schematic structural diagram of a wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9B is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9C is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9D is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1 to 9D of the specification, a solder ribbon manufacturing apparatus 100 according to a preferred embodiment of the present invention will be described in the following description, wherein the solder ribbon manufacturing apparatus 100 is capable of efficiently producing a photovoltaic solder ribbon 200, improving the production efficiency of the photovoltaic solder ribbon 200, reducing the labor cost for producing the photovoltaic solder ribbon 200, and shortening the production cycle of the photovoltaic solder ribbon 200.

The photovoltaic solder ribbon 200 includes a copper layer 201 and a solder layer 202 formed on the surface of the copper layer 201. The photovoltaic solder strip 200 has a concave-convex surface, so that the welding area and the light reflection area of the photovoltaic solder strip 200 are increased, and the reliability and the light reflection rate of the photovoltaic solder strip 200 are improved.

Referring to fig. 2A to 2E, the solder ribbon manufacturing apparatus 100 includes a wire releasing device 10, wherein the wire releasing device 10 is adapted to fix copper wire trays 300 of different sizes. The copper wire coil 300 comprises a wire coil 301 and a copper wire 302 wound on the outer wall of the wire coil 301, the wire coil 301 is provided with a mounting channel 303, and the wire coil 301 is fixed on the paying-off device 10. The paying-off device 10 can drive the wire spool 301 to rotate, so that the paying-off operation is carried out in the rotating process, and the copper wire 302 is pulled to leave the wire spool 301. The copper wire 302 subsequently forms the copper layer 201 of the photovoltaic solder ribbon 200.

Specifically, the paying-off device 10 includes a driving body 110, a carrier body 120, and a fastening body 130 detachably mounted to the carrier body 120, wherein the carrier body 120 is drivably disposed on the driving body 110, the copper wire coil 300 is detachably mounted to the carrier body 120, and the carrier body 120 is held in the mounting passage 303 of the wire coil 301 of the copper wire coil 300. The fastening body 130 is detachably mounted to the carrier body 120 and fixes the wire spool 301 of the copper wire coil 300 to the carrier body 120. The driving body 110 can drive the bearing body 120 to rotate, so as to drive the copper wire coil 300 and the fastening body 130 disposed on the bearing body 120 to rotate. The copper wire 302 leaves the wire spool 301 during rotation.

The bearing body 120 includes a position-limiting portion 121 and a bearing shaft 122 extending outward from the position-limiting portion 121, wherein the position-limiting portion 121 has a position-limiting inclined surface 1201. The fastening body 130 includes a fastening portion 131 and a fitting portion 132 extending outward from the fastening portion 131, wherein the fastening portion 131 has a fastening slope 1301. The copper wire coil 300 is fixed between the carrier body 120 and the fastening body 130 so as to be disposed on the stopper slope 1201 of the stopper portion 121 and the fastening slope 1301 of the fastening portion 131.

The copper wire coil 300 is sleeved on the bearing shaft 122 in a manner that the mounting channel 303 of the wire coil 301 corresponds to the bearing shaft 122 of the bearing main body 120, and one end of the wire coil 301 defining the inner wall of the mounting channel 303 is abutted against the limiting inclined surface 1201 of the limiting portion 121 of the bearing main body 120.

The carrier body 120 further includes a mounting shaft 123, wherein the mounting shaft 123 extends outwardly from the carrier shaft 122. The fastening body 130 further has a fitting opening 1302 and a fitting channel 1303 communicated with the fitting opening 1302, wherein the fastening body 130 is detachably mounted to the carrying body 120 in such a manner that the fitting opening 1302 corresponds to the fitting shaft 123 of the carrying body 120. The end of the bearing shaft 122 of the bearing body 120 is held in the fitting channel 1303 of the fastening body 130, and the fitting shaft 123 is held in the fitting opening 1302 of the fastening body 120. The fastening portion 131 of the fastening body 130 is inserted into the mounting channel 303 of the wire spool 301, and the fastening slope 1301 of the fastening portion 131 of the fastening body 130 is abutted against the other end of the inner wall of the wire spool 301 defining the mounting channel 303.

That is, the stopper slope 1201 of the stopper portion 121 of the carrier body 120 and the fastening slope 1301 of the fastening portion 131 of the fastening body 130 apply an inward acting force to the wire spool 301 of the wire spool 300 so that the wire spool 300 is fixed between the stopper slope 1201 of the stopper portion 121 and the fastening slope 1301 of the fastening portion 131.

The position-limiting portion 121 of the bearing body 120 has a high end and a low end, and the position-limiting inclined plane 1201 is formed between the high end and the low end. That is, the longitudinal cross-sectional area of the stopper portion 121 of the carrier body 120 gradually decreases from the high end portion to the low end portion of the stopper portion 121. Preferably, the limiting portion 121 is a circular truncated cone structure. The bearing shaft 122 extends outward from the lower end of the limiting portion 121.

The fastening part 131 of the fastening body 130 has an upper end and a lower end, and the fastening slope 1301 is formed between the upper end and the lower end of the fastening part 131. That is, the longitudinal sectional area of the fastening portion 131 of the fastening body 130 gradually increases in a direction from the lower end portion 1302 to the upper end portion. The fitting part 132 of the fastening body 130 extends outward from the upper end of the fastening part 131. Preferably, the fastening portion 131 of the fastening body 130 has a circular truncated cone structure.

It is worth mentioning that the stopper portion 121 and the fastening portion 131 having inclined surfaces can fix the wire spool 301 of the mounting channel 303 having different diameters. For example, the wire spool 301 having the mounting channel 303 with a large size is abutted against the high end portion near the stopper portion 121 and the upper end portion of the fastening portion 131, and the wire spool 301 having the mounting channel 303 with a small size is abutted against the low end portion near the stopper portion 121 and the lower end portion of the fastening portion 131. In this way, the paying-off device 10 can be adapted to fix the copper wire coil 300 having the mounting passages 303 of different sizes.

The pay-off device 10 further includes a pay-off guide assembly 140, wherein the pay-off guide assembly 140 is held above the carrier body 120 and the fastening body 130. The copper wires 302 of the copper wire coil 300 mounted to the carrier body 120 and the fastening body 130 are wound around the wire unwinding guide 140, and the movement of the copper wires 302 is stably guided by the wire unwinding guide 140.

Referring to fig. 3A to 3F, the solder ribbon manufacturing apparatus 100 further includes a molding device 20, wherein the molding device 20 is disposed at one side of the wire unwinding device 10, and the copper wire 302 passing through the wire unwinding device 10 is drawn through the molding device 20. And, the copper wire 302 passing through the molding apparatus 20 forms the copper layer 201 having a cross section of a predetermined shape.

In this particular embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 having the cross section of the predetermined shape by wire drawing. Specifically, the molding device 20 includes a plurality of molding units 210, wherein the molding units 210 have a molding space 2101, and the cross section of the molding space 2101 is the preset shape. After the copper wire 302 is drawn to pass through the molding space 2101 of each molding unit 210 in sequence, the copper layer 201 having the cross-section of the predetermined shape is formed.

The molding unit 210 includes a molding body 211 and a molding die 212, wherein the molding body 211 has an inlet 2111, an outlet 2112, and a receiving space 2113 communicating with the inlet 2111 and the outlet 2112, and the molding space 2101 is formed in the molding die 212. The molding die 212 is detachably mounted to the accommodating space 2113 of the molding body 211, and the molding space 2101 of the molding die 212 is communicated with the inlet 2111, the accommodating space 2113 and the outlet 2112 of the molding body 211.

The copper wire 302 is drawn from the inlet 2111 of the molding main body 211 into the molding space 2101 of the imaging mold 212 placed in the accommodating space 2113, and the copper wire 302 entering the molding mold 212 is compressed by an external force and is capable of forming the copper layer 201 having the predetermined shape in cross section.

In a specific embodiment of the present invention, the number of the forming units 210 is four, the cross section of the forming space 2101 of the forming unit 210 is a pentagon, the copper wire 302 is compressed once in each forming space 2101, and the copper wire 201 with the cross section of the predetermined shape is formed after four drawing processes.

It should be noted that the specific number of the forming units 210 is not limited, and the forming units 210 may be implemented as one, two, three, five or more numbers. Also, a specific shape of the molding space 2101 of the molding unit 210 is not limited, and the cross-sectional shape of the molding space 2101 may be implemented as a triangle, a trapezoid, a hexagon, or other shapes, etc. By replacing the molding die 212 having the molding space 2101 of different shapes, the copper layer 201 of different cross-sectional shapes can be obtained. The specific embodiment of the molding unit 210 is only an example and should not be construed as limiting the content and scope of the solder strip manufacturing apparatus 100 and the molding device 20 of the present invention.

In a specific embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 with the predetermined cross-section shape by means of punch forming. In an embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 having a cross section with a predetermined shape by rolling. It should be understood by those skilled in the art that the specific embodiment of the copper wire 302 forming the copper layer 201 is merely illustrative and should not be construed as limiting the scope and content of the solder ribbon manufacturing apparatus 100 and the manufacturing method thereof according to the present invention.

The forming device 20 further comprises a forming guide assembly 220, wherein the forming guide assembly 220 is disposed around the forming body 210, and the copper wire 302 passing through the drawing assembly 140 of the paying-off device 10 is guided to pass through the forming body 211 and the forming mold 212 of each forming unit 210 in turn under the action of the forming guide assembly 220 of the forming device 20.

Referring to fig. 4A to 4D, the solder strip manufacturing apparatus 100 further includes a pressing device 30, wherein the pressing device 30 is disposed at one side of the forming device 20, and the copper layer 201 passing through the forming device 20 is drawn through the pressing device 30. And, the copper layer 201 passing through the pressing device 30 forms a structure having a concave-convex surface.

Specifically, the pressing device 30 includes a power body 310 and a pressing body 320 drivably connected to the power body 310, wherein the pressing body 320 has a pressing space 3201, the copper layer 201 passing through the forming device 20 is drawn into the pressing space 3201 of the pressing body 320, and the pressing body 320 presses the copper layer 201 entering the pressing space 3201.

In this particular embodiment of the present invention, the pressing body 320 includes two pressing wheels 321, wherein the two pressing wheels 321 are disposed one above the other and the pressing space 3201 is formed between the two pressing wheels 321. The distance between the two pressing wheels 321 is allowed to be adjusted, and the size of the pressing space 3201 may be adjusted, thereby enabling the copper layer 201 passing through the pressing space 3201 to form a structure having a concave-convex surface.

Specifically, at least one of the two pressing wheels 321 is drivably connected to the power body 310, and the power body 310 drives the at least one pressing wheel 321 to move up and down, thereby changing the distance between the two pressing wheels 321.

When the distance between the two pressing wheels 321 is smaller than the thickness of the copper layer 201, the copper layer 201 drawn from the molding device 20 to the pressing device 30 is pressed by the pressing wheels 321, and the thickness of the pressed portion is reduced. When the power body 310 drives the pressing wheels 321 to move, and the distance between the two pressing wheels 321 is increased, and the distance between the two pressing wheels 321 is greater than the thickness of the copper layer 201, the copper layer 201 can pass through without being pressed, that is, the thickness of the copper layer 201 does not change. The size of the pressing space 3201 is changed by driving the pressing wheel 321 to move up and down, thereby manufacturing the copper layer 201 having a concave-convex surface.

The embodiment of the pressing body 320 is not limited, and the two pressing wheels 321 of the pressing body 320 may be oppositely disposed left and right, and the power body 310 drives at least one pressing wheel 321 to move left and right. Alternatively, the pressing body 320 presses the copper layer 201 by rolling. Alternatively, the pressing body 320 presses the copper layer 201 by means of pressing. Alternatively, the pressing body 320 presses the copper layer 201 by means of stamping. It should be understood by those skilled in the art that the specific embodiment of the pressing body 320 is merely exemplary and should not be construed as limiting the scope and content of the manufacturing apparatus 100 and the manufacturing method thereof.

In an embodiment of the invention, the power body 310 of the forming apparatus 300 includes a driving element 311, at least one linking element 312, at least one lifting element 313 and a mounting element 314, wherein the linking element 312 is connected to the driving element 311 in a driving manner, one end of the lifting element 313 is connected to the linking element 312, the other end of the lifting element 313 is fixed to the mounting element 314, and a pressing wheel 321 is mounted on the mounting element 314. The driving element 311 rotates to drive the linkage element 312 to move, the linkage element 312 drives the lifting element 313 to lift, and then drives the assembling element 314 and the pressing wheels 321 mounted on the assembling element 314 to move up and down, so as to change the distance between the two pressing wheels 321.

Preferably, the power body 310 drives the pressing wheel 321 to reciprocate by a worm gear and worm driving manner so as to flatten the copper layer 201 at intervals. Preferably, the power body 310 drives the pressing wheel 321 to reciprocate in an electric driving manner. Preferably, the power body 310 drives the pressing wheel 321 to move through a hydraulic driving manner. Alternatively, the power body 310 drives the pressing wheel 321 to move through a gear driving manner. It should be noted that the specific embodiment of the power body 310 driving the pressing wheel 321 to move is only an example, and is not intended to limit the content and scope of the welding strip manufacturing apparatus 100 and the manufacturing method thereof. In some embodiments of the invention, the pressing wheel may be driven in a reciprocating motion by means of a manual drive.

The pressing device 30 further includes a cooling body 330, wherein the cooling body 330 is disposed on the pressing body 320, and the cooling body 330 cools the pressing body 320 to prevent the quality of the photovoltaic solder ribbon 200 from being affected by the overhigh surface temperature of the pressing body 320.

Specifically, the cooling body 330 further includes at least one cooling portion 331 and at least one mounting portion 332, wherein the cooling portion 331 has a cooling channel 3311, and the mounting portion 332 is disposed on the cooling portion 331. The pressing wheel 321 of the pressing body 30 has a flow path 3211, wherein the mounting portion 332 is mounted to the pressing wheel 321, and the flow path 3211 of the pressing wheel 321 is communicated with the cooling path 3311 of the cooling portion 331. The cooling liquid in the cooling passage 3311 of the cooling portion 331 circularly flows into the circulation passage 3211 of the pressing wheel 321 and takes away heat of the pressing wheel 321 to lower the temperature of the surface of the pressing wheel 321.

In this embodiment of the present invention, the cooling body 330 has an inlet port 3301, an inlet guide passage 3302 communicated with the inlet port 3301, an outlet guide passage 3303, and an outlet port 3304 communicated with the outlet guide passage 3303. The cooling body 330 is installed to the pressing wheel 321 in such a manner that the liquid inlet guide passage 3302 is communicated with the circulation passage 3211 of the pressing wheel 321 of the pressing device 30, and a heat radiating passage 3312 is formed between an inner wall of the pressing wheel 321 defining the circulation passage 3211 and an outer wall of the cooling body 330 defining the liquid inlet guide passage 3302. The heat dissipating passage 3312 is communicated with the outlet guide passage 3303 of the cooling body 330. The liquid inlet port 3301, the liquid inlet guide passage 3302, the liquid outlet guide passage 3303, and the liquid outlet port 3304 form the cooling passage 3311.

A coolant continuously enters the inlet guide passage 3302 from the inlet 3301 of the cooling body 330, and the coolant flows into the circulation passage 3211 and the heat dissipation passage 3312 of the pressing wheel 321 through the inlet guide passage 3302, absorbs heat of the pressing wheel 321, and enters the outlet guide passage 3303 with the heat of the pressing wheel 321, and then flows out from the outlet 3304. The coolant flowing out of the pressing wheel 321 can be used again for heat dissipation of the pressing wheel 321 after being cooled. That is, the heat generated by the pressing wheel 321 in the work process is taken away by the circulating flow of the cooling liquid, so that the influence on the quality of the copper layer 201 due to the overhigh temperature of the pressing wheel 321 is avoided.

In this embodiment of the present invention, the mounting portion 332 includes an inlet pipe 3321, a first mounting head 3322, a liquid outlet unit 3323, and a second mounting head 3324. The first mounting head 3322 has a fastening passage, a holding passage penetrates the liquid outlet unit 3323 and the second mounting head 3324, the liquid inlet port 3301 is formed at the liquid inlet pipe 3321, the liquid inlet guide passage 3302 is formed at the cooling portion 331, and the liquid outlet port 3304 is formed at the liquid outlet unit 3323. The cooling part 331 is held in the holding passages of the liquid outlet unit 3323 and the second mounting head 3324 in such a manner that end portions thereof are fixed to the fastening passages of the first mounting head 3322, and the liquid outlet guide passage 3303 is formed between an inner wall defining the holding passages and an outer wall of the cooling part 331. The liquid inlet pipe 3321 is installed in the first mounting head 3322 such that the liquid inlet 3301 is communicated with the liquid inlet guide passage 3302 of the cooling part 331. The second fitting head 3324 is mounted to the pressing wheel 321 in such a manner that the cooling part 331 is held in the flow passage 3211 of the pressing wheel 321, and the heat dissipation passage 3212 is formed between an inner wall of the pressing wheel 321 defining the cooling passage and an outer wall of the cooling part 331.

Preferably, the cooling body 330 further comprises a buffer space 3305, wherein the buffer space 3305 is connected to the outlet guide passage 3303 and the outlet 3304, and the buffer space 3305 is located between the outlet and the outlet guide passage 3303, and the buffer space 3305 is disposed to avoid the vortex or bubble of the cooling liquid from blocking the outlet 3304. Specifically, the inner wall of the liquid outlet unit 3313 defining the holding channel is recessed inwards to form the buffer space 3305.

In another embodiment of the present invention, the cooling body 330 comprises at least two liquid-cooled plates, wherein the cooling plates have a cooling liquid inlet, a cooling liquid outlet, and a cooling channel connected to the cooling liquid inlet and the cooling liquid outlet. The cooling plate is closely attached to the outer surface of the pressing wheel. The cooling liquid enters the cooling channel from the cooling liquid inlet, and the heat on the surface of the pressing wheel is taken away in the process of moving in the cooling channel by the cooling liquid. Preferably, the cooling channel is bent to extend inside the liquid cooling plate, so as to prolong the path of the cooling channel, increase the walking path of the cooling liquid, and further facilitate taking away more heat.

It is worth mentioning that the specific type of cooling liquid is not limited. Preferably, the cooling liquid is a fluid with good fluidity and large specific heat capacity. Those skilled in the art will appreciate that the specific embodiments of the cooling fluid are not limiting and should not be construed as limiting the scope and content of the weld manufacturing apparatus of the present invention.

The pressing apparatus 30 further includes a pressing guide assembly 340, wherein the pressing guide assembly 340 is disposed around the pressing main body 320, and the pressing guide assembly 340 stably guides the copper layer 201 into and out of the pressing space 3201 of the pressing main body 320.

Referring to fig. 5A and 5B, the solder strip manufacturing apparatus 100 further includes an annealing device 40, wherein the annealing device 40 is disposed at one side of the pressing device 30, and the annealing device 40 anneals the copper layer 201 after the pressing device 30.

The annealing device 40 includes a positive electrode wheel 410, a negative electrode wheel 420, a protection body 430, a temperature reduction body 440 and a drying body 450, wherein the protection body 430 has a protection channel 4301, wherein the temperature reduction body 440 has a liquid tank 4401, and wherein the drying body 450 has a drying channel 4501.

The protection body 430 is disposed between the positive wheel 410 and the negative wheel 420, and the copper layer 201 passing through the pressing space 3201 of the pressing device 30 is wound around the positive wheel 410. The copper layer 201 passing through the positive electrode wheel 410 enters the protection channel 4301 of the protection body 430 and is wound around the negative electrode wheel 420. An electric current passes between the positive electrode wheel 410 and the negative electrode wheel 420, thereby increasing the temperature of the copper layer 201 connected between the positive electrode wheel 410 and the negative electrode wheel 420.

Further, the protection channel 4301 of the protection body 430 contains a protection gas to prevent the copper layer 201 from being oxidized at a high temperature. Preferably, the protection channel 4301 of the protection device 430 contains an inert gas, such as but not limited to nitrogen.

Specifically, the protective body 430 comprises a gas containing tube 431 and a closure plug 432, wherein the closure plug 432 has a retaining channel 43201, wherein the protective channel 4301 is formed in the gas containing tube 431. The gas containing pipe 431 is held between the positive electrode wheel 410 and the negative electrode wheel 420, and the closing plug 432 is installed at the upper end of the gas containing pipe 431 in such a manner that the holding passage 43201 is communicated with the protection passage 4301. The lower end of the gas containing pipe 431 of the protection body 430 is immersed in the cooling liquid of the liquid containing groove 4401 of the temperature reduction body 440, and the protection channel 4301 of the gas containing pipe 431 is filled with a protection gas. The copper layer 201 is drawn from the retention channel 43201 of the closure plug 432 into the protection channel 4301 and out of the protection body 430 from the lower retention channel 43301 of the lower closure plug 433. Preferably, the protection channel 4301 of the protection body 430 contains an inert gas, such as but not limited to nitrogen.

Preferably, the protective body 430 further comprises a sealing element 433, wherein the sealing element 433 is arranged in the holding channel 43201 of the closing plug 423 and the sealing element 433 is held between the copper layer 201 and the closing plug 432. Leakage of the shielding gas within the shield passage 4301 may be reduced by the sealing member 433.

Further, the liquid containing groove 4401 of the cooling body 440 contains a cooling liquid, the negative wheel 420 is disposed in the liquid containing groove 4401 of the cooling body 440, the copper layer 201 is drawn through the cooling liquid in the solution groove 4401 of the cooling body 440, and the heated copper layer 201 is cooled in the cooling liquid.

In this specific embodiment of the present invention, the drying mechanism 450 includes a drying box 451 and at least one liquid removing element 452, wherein the liquid removing element 452 has a holding channel 45201, wherein the drying space 4501, the upper opening 4502 and the lower opening 4503 are formed in the drying box 451, the liquid removing element 452 is disposed in the drying space 4501 of the drying box 451, and the liquid removing element 452 is communicated with the drying space 4501. The liquid removing element 452 performs a drying process on the copper layer 201 to remove the cooling liquid on the surface of the copper layer 201.

Preferably, the liquid removing element 452 is implemented as an air knife, and the liquid removing element 452 dries the copper layer 201 by blowing air toward the surface of the copper layer 201. The drying box 451 surrounds the copper layer 201, so as to prevent the cooling liquid on the surface of the copper layer 201 from splashing to surrounding equipment during the process of drying the copper layer 201 by the liquid removing element 452.

Preferably, the liquid removing element 452 dries the copper layer 201 by absorbing the cooling liquid on the surface of the copper layer 201. For example, the liquid removing element 452 is a dry sponge, and the moisture passing through the surface of the copper layer 201 is absorbed or wiped by the dry sponge. Preferably, the drying space 4501 of the drying box 451 is filled with a drying agent, and the cooling liquid passing through the surface of the copper layer 201 of the drying space 4501 of the drying box 451 is absorbed by the drying agent.

The copper layer 201 passing through the cooling liquid is drawn into the drying space 4501 of the drying body 450, and the drying body 450 removes the liquid from the surface of the copper layer 201, so that the surface of the copper layer 201 passing through the drying body 450 is dried, facilitating the subsequent process. Preferably, the drying body 450 dries the copper layer 201 by blow-drying the surface of the copper layer 201. For example, a plurality of air knives are disposed in the drying space 4501, and the air knives generate wind to dry the moisture on the surface of the copper layer 201. Alternatively, the drying body 450 dries the copper layer 201 by adsorbing the surface moisture of the copper layer 201. It should be understood by those skilled in the art that the specific embodiment of the drying body 450 for extracting the moisture from the surface of the copper layer 201 is only an example and is not intended to limit the content and scope of the solder strip manufacturing apparatus 100 of the present invention.

The annealing apparatus 40 further includes an annealing guide element 460, wherein the annealing guide element 460 is disposed around the positive electrode wheel 410, the negative electrode wheel 420, the protective body 430, the temperature reduction body 440, and the drying body 450 to guide the copper layer 201 stably through the positive electrode wheel 410, the negative electrode wheel 420, the protective body 430, the temperature reduction body 440, and the drying body 450. Preferably, the annealing guide assembly 460 is capable of controlling the speed of movement of the copper layer 201.

Referring to fig. 6A and 6B, the solder ribbon manufacturing apparatus 100 further includes a flux covering device 50, wherein the flux covering device 50 is disposed at one side of the annealing device 40, and the flux covering device 50 covers a flux on the surface of the copper layer 201, so as to protect the copper layer 201 and prevent the copper layer 201 from oxidation reaction.

Specifically, the flux covering device 50 includes a protection housing 510 and a spraying body 520, wherein the protection housing 510 has a maintaining space 5101, a maintaining inlet 5102 and a maintaining outlet 5103 which are communicated with the maintaining space 5101, the spraying body 520 has a spraying opening, and the spraying body 520 is disposed above the protection housing 510 in a manner that the spraying opening faces the maintaining space 5101 of the protection housing 510. The copper layer 201 passing through the annealing device 40 is drawn from the maintenance inlet 5102 into the maintenance space 5101 of the protective shell 510, and a flux contained in the spraying body 520 enters the maintenance space 5101 of the protective shell 510 from the spraying opening of the spraying body 520 and covers the surface of the copper layer 201 to form a flux film on the surface of the copper layer 201, so that the performance of the photovoltaic solder strip 200 is improved. The copper layer 201, on which the fluxing film is formed, is drawn away from the maintenance vent 5103.

Preferably, the shielding shell is disposed obliquely, which facilitates the flux to uniformly cover the surface of the copper layer 201.

It is worth mentioning that the kind of the flux is not limited, and the flux may be implemented as liquid or solid powder, etc. Preferably, the spraying body 520 is used for covering the soldering flux on the surface of the copper layer 201 by spraying.

The flux covering device 50 further includes a protective cover 530, wherein the protective cover 530 has a flow opening 5301, and the protective cover 530 is disposed on the protective housing 510 in such a manner that the flow opening 5301 is communicated with the protective housing 510. The protective cover 530 shields the maintaining space 5101 of the protective housing 510, and prevents the flux sprayed from the spraying opening of the spraying body 520 from splashing to the external environment.

Specifically, the spraying body 520 has a flux containing box 521 and at least one guide tube 522 communicated with the containing space of the column welding containing box 521, and the spraying port is formed in the guide tube 522. The guide pipe 522 extends downward from the receiving portion 521 to the maintaining space 5101 of the shield case 510, and the guide pipe 522 is located at the circulation port 5301 of the shield cover 530 in such a manner that the spray port is communicated with the maintaining space 5101 of the shield case 510. The spray opening of the guide tube 522 is located below the circulation opening 5301 of the protective cover 530. When the guiding tube 522 sprays the flux toward the copper layer 201 in the maintaining space 5101 of the protective housing 510, the splashed flux is blocked by the protective cover 530 and cannot splash into the external environment, which is beneficial to reducing waste of flux and avoiding pollution to the environment.

It should be noted that the specific number of the guiding tubes 522 is not limited, and the guiding tubes 522 may be implemented as one, by covering the flux on the surface of one copper layer 201 through one guiding tube 522, or by covering the flux on the surfaces of two or more copper layers 201 through one guiding tube 522. The guiding pipes 522 may also be implemented in two or more numbers, wherein each guiding pipe 522 corresponds to one copper layer 201, so as to spray the flux on two or more numbers of copper layers 201 at the same time.

The flux covering device 50 further includes a flux guide assembly 540, wherein the flux guide assembly 540 is disposed around the protective casing 510, and the flux guide assembly 540 guides the copper layer 201 from the maintenance inlet 5102 into the maintenance space 5101 of the protective casing 510 and pulls the copper layer 201 away from the maintenance outlet 5103 after a flux film is formed.

Referring to fig. 7A to 7D, the solder ribbon manufacturing apparatus 100 further includes a tin layer forming device 60, wherein the tin layer forming device 60 is disposed at one side of the flux covering device 50, and the tin layer 202 is formed on the surface of the copper layer 201 after the copper layer 201 passing through the flux covering device 50 passes through the tin layer forming device 60.

Specifically, the tin layer forming device 60 includes a tin containing pool 610 and a heating body 620, wherein the tin containing pool 610 has a containing space 6101, the heating body 620 is disposed in the tin containing pool 610, and the heating body 620 can melt a tin block entering the containing space 6101 in the containing space 6101. The copper layer 201 passing through the soldering flux covering device 50 is drawn into the accommodating space 6101 of the tin accommodating pool 610, and the melted tin covers the surface of the copper layer 201, and then the tin layer 202 is formed. Preferably, the heating body 620 is implemented as a heating wire, and the heating body 620 generates heat and melts the solder bumps after being electrified. It should be understood by those skilled in the art that the specific embodiment of the heating body 620 is not limited, and the heating mechanism may also perform heating by other means, such as, but not limited to, infrared heating, high frequency electromagnetic heating, etc.

The tin layer forming device 60 further includes at least one blowing main body 630, wherein the blowing main body 630 is disposed above the tin containing tank 610, and the blowing main body 630 has an air outlet 6301. The copper layer 201 covered by tin is pulled to pass through the air blowing main body 630, the air outlet 6301 of the air blowing main body 630 faces the copper layer 201, the air blowing main body 630 generates wind power from the air outlet 6301 and blows the tin covering the copper layer 201, so that the tin covering the surface 201 of the copper layer has different thicknesses, which is beneficial to improving the performance of the photovoltaic solder strip 200.

In a specific embodiment of the present invention, the blowing bodies 630 generate wind at intervals in such a manner that the same magnitude of wind is maintained. Thus, the tin liquid blown by the wind flows rapidly, that is, the tin layer 202 corresponding to the position of the wind outlet 6301 where the wind is generated has a small thickness, and the tin layer 202 corresponding to the position of the wind outlet 6301 where the wind is not generated has a large thickness. Further, the tin layer 202 having a concavo-convex structure may be formed on the copper layer 201 by the tin liquid passing through the blower main body 630. The tin layer 202 with the concave-convex structure is more easily and firmly welded on a photovoltaic module in the subsequent use process, and the tin layer 202 with the concave-convex structure is also beneficial to reflecting sunlight to the photovoltaic module, so that the solar energy collection efficiency of the photovoltaic module is improved. Preferably, the interval time between the wind generation of the wind blowing main bodies 630 is the same. Alternatively, the interval time between the wind generation of the wind blowing bodies 630 is different.

Optionally, in a specific embodiment of the present invention, the air blowing main body 630 continuously generates wind power in a manner of varying the magnitude of the wind power, the thickness of the tin layer 202 formed by the tin liquid corresponding to the wind power with the larger wind power is smaller, and the thickness of the tin layer 202 formed by the tin liquid corresponding to the wind power with the smaller wind power is thicker. In this way, the tin layer 202 having a textured structure can be formed on the copper layer 201.

Alternatively, the blowing main body 630 is implemented as one, and the molten tin attached to one side of the copper layer 201 is shaped by one blowing main body 630. Alternatively, the blowing main bodies 630 located on the same side of the copper layer 201 may be implemented in more than two numbers, and the blowing main bodies 630 in more than two numbers are arranged from top to bottom, so as to shape the copper layer 201 multiple times, so as to obtain the tin layer 202 with a preset shape. Preferably, at least two of the blower main bodies 630 are symmetrically held at both sides of the copper layer 201. Alternatively, at least two of the blowing main bodies 630 are asymmetrically held at both sides of the copper layer 201, that is, the two blowing main bodies 630 are disposed above the tin accommodating bath 610 in a staggered manner. It should be understood by those skilled in the art that a plurality of sets of the blowing main bodies 630 may be provided to simultaneously treat the molten tin adhered to the surfaces of the plurality of copper layers 201, which is beneficial to improving the working efficiency. The specific number and embodiments of the blower bodies 630 are merely examples and should not be construed as limiting the scope and content of the apparatus for manufacturing a solder strip according to the present invention.

Alternatively, the blower main body 630 may continuously generate wind in a manner of maintaining the same magnitude of the wind, and the molten tin passing through the blower main body 630 may form the tin layer 202 having a uniform thickness on the copper layer 201.

In a specific embodiment of the present invention, the two blowing main bodies 630 are movably held at both sides of the copper layer 201, and the force of the wind generated by the blowing main bodies 630 acting on the molten tin attached to the copper layer 201 is changed by adjusting the distance between the blowing main bodies 630 and the copper layer 201, thereby forming the tin layer 220 having different thicknesses.

Specifically, the tin layer forming device 630 further includes a horizontal driving mechanism 634, wherein the blowing main body 630 is installed on the horizontal driving mechanism 634 in a driving manner. The horizontal driving mechanism 634 can drive the air blowing main body 630 to move left and right, thereby changing the distance between the air blowing main body 630 and the copper layer 201. More specifically, when the blowing main body 630 is driven to be close to the copper layer 201, the force of the wind generated by the blowing main body 630 on the molten tin attached to the copper layer 201 is increased, and the thickness of the correspondingly formed tin layer 202 is smaller; when the blower main body 630 is driven to be away from the copper layer 201, the force of the wind generated by the blower main body 630 on the molten tin attached to the copper layer 201 is reduced, and the thickness of the correspondingly formed tin layer 202 is larger.

The blower main body 630 includes a wind power generating unit 6331, an extension arm 6332, a holding arm 6333, and a cutter head 6334, wherein the extension arm 6332 is provided to the wind power generating unit 6331, one end of the holding arm 6333 is mounted to the extension arm 6332, the other end of the holding arm 6334 is mounted to the cutter head 6334, and the wind power generating unit 6331, the extension arm 6332, the holding arm 6333, and the cutter head 6334 communicate with each other. The air outlet 6301 is formed in the tool bit 6334, and the wind generated by the wind generating unit 6331 passes through the extension arm 6332 and the holding arm 6333 and then blows the molten tin attached to the copper layer 201 from the tool bit 6334.

The wind power generating unit 6331 is drivingly movably disposed on a horizontal rail of the horizontal driving mechanism 634, the horizontal driving mechanism 634 drives the wind power generating unit 6331 to move left and right along the horizontal rail of the horizontal driving mechanism 634, and the extension arm 6332, the holding arm 6333, and the tool bit 6334 disposed on the wind power generating unit 6331 move left and right along with the wind power generating unit 6331. In this way, the distance between the tool bit 6334 and the copper layer 201 can be changed, and the amount of wind blowing from the wind outlet 6301 of the tool bit 6334 to the copper layer 201 can be changed.

Alternatively, the retaining arm 6333 is detachably mounted in a mounting hole of the extension arm 6332, and the distance between the tool bit 6334 mounted to the end of the retaining arm 6333 and the copper layer 201 can be adjusted by changing the position at which the retaining arm 6333 is fixed to the extension arm 8132. Specifically, when the retaining arm 6333 is fixed to the extending arm 6332 at a position close to the tool bit 6334, the tool bit 6334 is far from the copper layer 201; when the retaining arms 6333 are secured to the extending arms 6332 at a position away from the tool tip 6334, the tool tip 6334 is located closer to the copper layer 201.

The tin layer molding apparatus 630 further includes a mounting block 637 and a vertical driving mechanism 638, wherein the mounting block 637 is movably mounted on a vertical rail of the vertical driving mechanism 638 in a driving manner, and the horizontal driving mechanism 634 is fixed to the mounting block 637. The vertical driving mechanism 638 drives the mounting block 637 up and down along the vertical rail, and drives the horizontal driving mechanism 634, the wind generating unit 6331, the extension arm 6332, the holding arm 6333, and the tool bit 6334 up and down. In this way, the sizes of the convex portions and the concave portions of the tin layer 202 formed by the tin liquid can be adjusted. In addition, the tin layer 202 can be formed to have various structures and shapes by varying the distance between the tool tip 6334 and the copper layer 201 passing therethrough in the horizontal and vertical directions.

In an embodiment of the invention, the wind generated by the wind blowing body 630 blows obliquely downward to the molten tin attached to the copper layer 201, which is beneficial to quickly blow the molten tin, and the molten tin is prevented from splashing to both sides because the wind blows perpendicularly to the copper layer 201.

Specifically, the extending direction of the extending arm 6332 is parallel to the horizontal plane, the copper layer 201 attached with the molten tin is drawn to move from bottom to top perpendicular to the horizontal plane, the holding arm 6333 is obliquely disposed on the extending arm 6333, and the extending direction of the tool bit 6334 is consistent with the extending direction of the holding arm 6333, i.e., there is an oblique included angle between the extending direction of the tool bit 6334 and the horizontal plane. Further, the tool tip is held obliquely downward on one side of the copper layer 201. When the copper layer 201 is drawn past the tool bit 6334, wind is blown obliquely downward to the molten tin adhering to the copper layer 201.

Alternatively, the tool bit 6334 may be held obliquely upward to one side of the copper layer 201. It should be noted that the inclination angle of the cutter head 6334 of the air supply main body 630 is not limited, and the air outlet angle of the wind power is also not limited. The specific tilt angles shown in the drawings of the specification are merely examples and are not intended to limit the scope and content of the apparatus for manufacturing a tin-clad solder strip according to the present invention.

Preferably, the inclination angle of the cutter head 6334 of the blower main body 630 is allowed to be adjusted. In an embodiment of the invention, the holding arm 6333 is rotatably mounted to the extension arm 6332, and the wind direction of the wind is changed by rotating the holding arm 6333, so as to change the shape of the tin layer 202 formed by the tin liquid. In a specific embodiment of the present invention, the extension arm 6332 is rotatably installed to the wind power generating unit 6331, and the wind direction of the wind power is changed by rotating the extension arm 6332.

The tin layer forming device 60 further includes at least one cooling forming body 640, wherein the cooling forming body 640 is disposed above the blowing body 630, and wherein the cooling forming body 640 has a cooling forming passage 6401. The copper layer 201 passing through the air outlet 6301 of the air blowing main body 630 is drawn into the cooling molding passage 6401 of the cooling molding main body 640, and the tin covering the copper layer 201 is cooled in the cooling molding passage 6401, thereby forming the tin layer 202 on the copper layer 201. Preferably, a plurality of air knives are arranged in the cooling and forming channel 6401, and the air generated by the air knives carries away the heat of the tin, so that the tin is cooled and formed on the copper layer 201, and the photovoltaic solder strip 200 is further manufactured. That is, the blowing main body 630 pre-shapes the tin liquid attached to the surface of the copper layer 201, and the tin liquid attached to the surface of the copper layer 201 is cooled and shaped in the cooling and forming passage 6401 of the cooling and forming main body 640 to form the tin layer 202 having a predetermined shape on the copper layer 201, thereby manufacturing the photovoltaic solder ribbon 200.

Specifically, the cooling molding body 640 includes a cooling body 641 and a wind blocking cover 642, wherein the wind blocking cover 642 is disposed on the cooling body 641, and the cooling molding passage 6401 is formed between the cooling body 641 and the wind blocking cover 642. The cooling body 641 can generate cold air, the cold air is filled in the cooling forming passage 6401, the tin liquid passing through the surface of the copper layer 201 of the cooling forming passage 6401 is cooled in the cooling forming passage 6401, and then the tin layer 202 having the predetermined structure is formed on the copper layer 201.

The cooling forming body 640 further comprises a plurality of air nozzles 643, wherein a plurality of air nozzles 643 are arranged at intervals in the cooling body 641, and the air nozzles 643 are communicated with the cooling body 641 and the cooling forming passage 6401. The cold air is intensively blown to the molten tin attached to the copper layer 201 by using the air nozzles 643, so that the molten tin is rapidly cooled, and the tin layer 202 with the preset structure is rapidly formed. Preferably, the air nozzle 643 is obliquely disposed to the cooling body 641 with its opening facing downward. Alternatively, the air nozzle 643 is obliquely provided to the cooling body 641 with its opening facing upward.

In this embodiment of the invention, the wind shield 642 of the cooling forming body 640 is pivotally connected to the cooling body 645, so that an operator can timely check the forming condition of the tin layer 202 by rotating the wind shield 642, and further adjust the wind outlet condition of the cooling body 641, such as but not limited to wind power and wind outlet temperature.

The tin layer forming apparatus 60 further includes a tin coating guide assembly 650, wherein the tin coating guide assembly 650 is disposed around the tin containing pool 610, the blowing main body 630 and the cooling forming main body 640, and the tin coating guide assembly 650 guides the cooling forming space 6401 passing through the containing space 6101 of the tin containing pool 610, the blowing port 6301 of the blowing main body 630 and the cooling forming main body 640 in sequence.

Referring to fig. 8A to 8D, the solder strip manufacturing apparatus 100 further includes an automatic tin adding device 70, wherein the automatic shelf device 70 is disposed at one side of the tin containing pool 610 of the tin forming device 60, and the automatic tin adding device 70 can automatically add the tin block into the containing space 6101 of the tin containing pool 610, so that the tin adding safety is improved, and the labor cost is also saved.

Specifically, the automatic tin adding device 70 includes a receiving main body 710, an impact main body 720, a guiding main body 730 and a power mechanism 740, wherein the receiving main body 710 has a receiving cavity 7101, a plurality of spaced tin block outlets 7102 communicated with the receiving cavity 7101 and a plurality of spaced pushing ports 7103, wherein the tin block outlets 7102 are opposite to the pushing ports 7103, and the guiding main body 730 has a guiding groove 7301. The slug outlet 7102 and the push port 7103 are located at the bottom of the containment body 710. The striking body 720 and the guide body 730 are respectively held at both sides of the receiving body 710. The striking body 720 and the guide body 730 correspond to each other, and the striking body 720 and the guide body 730 can correspond to the solder bump outlet 7102 and the push port 7103, respectively. The guiding groove 7301 of the guiding body 730 can be communicated with the accommodating space 6101 of the tin accommodating pool 610 of the tin layer molding device 60 and the accommodating cavity 7101 of the accommodating body 710.

Further, the solder bump is located between the solder bump outlet 7102 and the pushing opening 7103, when the solder bump outlet 7102 and the pushing opening 7103 correspond to the solder adding chute 7102 and the impact main body 720 of the guide main body 730, respectively. The striking body 720 strikes the solder slug in the receiving cavity 7101 through the pushing opening 7103, and the solder slug enters the tinning chute 7102 of the guide body 730 from the solder slug outlet 7102. The tin slug enters the accommodating space 6101 of the tin accommodating pool 610 of the tin layer forming device 630 along the tin adding chute 7102 under the inertia effect.

More specifically, the receiving body 710 includes a bottom plate 7111, a front baffle 7112, a back baffle 7113 opposite the front baffle 7112, and two side baffles 7114 disposed between the front baffle 7112 and the back baffle 7113. The front baffle 7112, the rear baffle 7113 and the side baffle 7114 are disposed on the bottom plate 7111, and the receiving cavity 7101 is formed among the bottom plate 7111, the front baffle 7112, the rear baffle 7113 and the side baffle 7114. The slug outlet 7102 and the push port 7103 are formed at the bottom of the front baffle 7112 and the rear baffle 7113, respectively.

The size of the solder bump outlet 7102 only allows one solder bump to pass through, the impact main body 720 can impact the solder bumps corresponding to the solder bump outlet 7102 and the pushing port 7103 and enter the guide groove 7301 of the guide main body 730 from the solder bump outlet 7102, the solder bumps enter the accommodating space 6101 of the solder accommodating pool 610 from the guide groove 7301, and the solder bumps are melted after being heated. The solder bumps are placed inside the containing cavity 7101 of the containing body 710 in an overlapped manner, and the striking body 720 in turn strikes the solder bumps into the containing space 6101 of the solder containing pool 610.

In one embodiment of the invention, the impact body 720 is implemented as an electric push rod, the impact body 720 is driven to extend and retract and generate an impact force on the solder bump when the impact body 720 moves toward the solder bump, so that the solder bump rapidly exits the receiving cavity 7101 from the solder bump outlet 7102. Optionally, the striking body 720 extends and retracts in a hydraulic driving manner, and strikes the solder bump into the accommodating space 6101 of the solder accommodating pool 610. Alternatively, the striking body 720 strikes the solder bump or the like by means of oscillation. It should be understood by those skilled in the art that the specific manner in which the striking body 720 drives the solder bumps into the receiving space 6101 of the tin receiving pool 610 is merely exemplary and should not be construed as limiting the scope and content of the solder ribbon manufacturing apparatus 100 and the method of manufacturing the same. Preferably, the bottom plate 7111 has a tilted bearing surface, which is beneficial to the solder bumps placed on the bearing surface of the bottom plate 7111 to rapidly leave the accommodating cavity 7101 and enter the accommodating space 6101 of the solder accommodating pool 610 after being impacted.

Preferably, the bearing surface of the bottom plate 7111 is provided with concave-convex lines, so that the tin block disposed on the bearing surface of the bottom plate 7111 is prevented from sliding into the accommodating space 6101 of the tin accommodating pool 610 when not being impacted.

Preferably, the accommodating main body 710 is movably and drivably disposed on the power mechanism 740, and the power mechanism 740 is capable of driving the accommodating main body 710 to move left and right, so that the different solder bump outlets 7102 and the pushing openings 7103 of the accommodating main body 710 respectively correspond to the guiding main body 730 and the striking main body 720, and thus the solder bumps in the accommodating main body 710 can be automatically pushed into the accommodating space 6101 of the solder accommodating pool 610.

In this embodiment of the present invention, the accommodating body 710 is drivably mounted to the power mechanism 740, and the guide body 730 and the striking body 720 are held at both sides of the accommodating body 710 in such a manner as to be fixed to both sides of the power mechanism 740. The power mechanism 740 can drive the accommodating main body 710 to move along the movable track of the power mechanism 740, so that the different solder bump outlets 7102 and the pushing openings 7103 respectively correspond to the guiding main body 730 and the striking main body 720, and further, all the solder bumps in the accommodating main body 710 can be gradually added into the accommodating space 6101 of the solder accommodating pool 610.

For example, when the receiving body 710 is filled with the solder bumps, the receiving body 710 corresponds to the guide body 730 and the striking body 720 with the first solder bump outlet 7102 and the push port 7103 on the rightmost side. After the first row of solder bumps is completely inserted into the receiving space 6101 of the solder receiving chamber 610, the power mechanism 740 drives the receiving main body 710 to move to the right, and makes the second solder bump outlet 7102 and the pushing opening 7103 correspond to the guiding main body 730 and the striking main body 720. Thus, the striking body 720 can strike the second row of the solder bumps in the accommodating body 710 into the accommodating space 6101 of the solder accommodating pool 610. By repeating the above steps, all the solder bumps in the accommodating main body 710 can be completely added into the accommodating space 6101 of the solder accommodating pool 610. Specifically, the power mechanism 740 includes a driving element 741, a carrying element 742 and a guiding element 743, wherein the carrying element 742 has a moving space 7420, wherein the guiding element 743 is retained in the moving space 7420, and wherein the accommodating main body 710 is movably mounted to the carrying element 742. The accommodating main body 710 is drivably connected to the driving member 741, and the driving member 741 is capable of driving the accommodating main body 710 to reciprocate in the movement space along the extending direction of the guide member 743.

In another embodiment of the present invention, the guide body 730 and the striking body 720 are held at both sides of the solder ball receiving container in such a manner as to be drivably mounted to the power mechanism 740. The power mechanism 740 may drive the guide body 730 and the striking body 720 to move synchronously with respect to the receiving body 710. When the guide main body 730 and the impact main body 720 correspond to the solder bump outlet 7102 and the push port 7103 at different positions, the impact main body 720 can add solder bumps of different columns into the accommodating space 6101 of the solder accommodating tank 610.

Specifically, the accommodating body 710 is fixed in the movement space 7420 of the carrying element 742, the guide body 730 and the impact body 720 are mounted on both sides of the carrying element 742, the carrying element 742 is drivably mounted on the driving element 741, and the driving element 741 is capable of driving the carrying element 742 and the guide body 730 and the impact body 720 fixed to the carrying element 742 to reciprocate relative to the accommodating body 710.

It should be understood by those skilled in the art that the specific movement of the automatic tin adding device 70 is only exemplary and should not be construed as limiting the scope and content of the solder strip manufacturing apparatus 100 of the present invention. It should be noted that the specific embodiment of the power mechanism 740 is not limited, and the power mechanism 740 may drive the accommodating body 710, the guiding body 730 and the striking body 720 to move through an electric drive, a hydraulic drive, a gear drive, or other manners known to those skilled in the art.

Preferably, the automatic tin adding device 70 further comprises at least one shielding plate 750, wherein the shielding plate is maintained at one side of the accommodating main body 710, the shielding plate 750 and the guiding main body 730 are located at the same side of the accommodating main body 710, the shielding plate 750 shields the tin block outlet 7102 formed at the bottom of the accommodating main body 710 and exposes only one tin block outlet 7102, preventing the tin block accommodated in the accommodating main body 710 from leaving the accommodating cavity 7101 from a position except the guiding groove 7301 of the guiding main body 730.

In a specific embodiment of the present invention, the slug outlet 7102 may be implemented as one, and correspondingly, the push port 7103 may be implemented as one. The capacity size of the accommodating main body 710 can be increased by increasing the number of the accommodating main bodies 710, increasing the number of the push ports 7103, and the like.

Referring to fig. 9A to 9D, the solder ribbon manufacturing apparatus 100 further includes an automatic take-up device 80, wherein the automatic take-up device 80 is disposed at one side of the tin layer forming device 60, the photovoltaic solder ribbon 200 manufactured after passing through the cooling forming passage 6401 of the cooling forming body 640 of the tin layer forming device 60 is drawn through the automatic take-up device 80, and the automatic take-up device 80 automatically receives the photovoltaic solder ribbon into a solder ribbon reel.

Specifically, the automatic wire rewinding device 80 includes at least one driving mechanism 810, a rotating body 820, at least two rotating shafts 830, and at least two wire rewinding disks 840, wherein the rotating body 820 and the rotating shafts 830 are rotatably and drivably connected to the driving mechanism 810, wherein the two rotating shafts 830 are adjacently disposed on the rotating body 820, and wherein the wire rewinding disks 840 are detachably mounted on the rotating shafts 830.

The photovoltaic solder ribbon 200 manufactured after passing through the cooling molding passage 6401 is drawn through the take-up reel 840 of the automatic take-up device 80, and the driving body 820 drives the rotating shaft 830 to rotate, so that the photovoltaic solder ribbon 200 is wound around the take-up reel 840 rotating along with the rotating shaft 830.

The automatic wire takeup device 80 further includes a control body 850, wherein the control body 850 is communicatively coupled to the drive mechanism 810 and the rotating shaft 830. When the amount of the photovoltaic solder strip 200 disposed on the take-up reel 840 reaches a predetermined standard, the driving mechanism 810 is controlled to rotate, so as to change the take-up reel 840 around which the photovoltaic solder strip is wound.

For example, the two rotating shafts 830 are provided at left and right intervals, the number of rotations of the left rotating shaft 830 is set, and when the left rotating shaft rotates, the take-up reel 840 attached to the left rotating shaft receives the photovoltaic strip, and at this time, the right rotating shaft 830 is stationary. When the left rotating shaft 830 rotates to a set number of turns, that is, the photovoltaic solder strip 200 wound on the take-up reel 840 reaches the preset standard, the control main body 850 controls the driving mechanism 810 to drive the rotating main body 820 to rotate, the two rotating shafts 830 arranged on the left and right exchange positions, the rotating shaft 830 arranged on the right side stops rotating, the rotating shaft 830 arranged on the left side starts rotating, and the photovoltaic solder strip 200 wound on the take-up reel 840 is changed.

Alternatively, the control body 850 may control the rotation of the rotating body 820, the rotating shaft 830 and the take-up reel 840 according to the weight of the photovoltaic solder ribbon wound around the take-up reel 840. It should be noted that the angle, the timing and the basis of the rotation of the rotating body 820 and the rotating shaft 830 controlled by the control body 850 are only examples, and the specific number of the rotating shafts 830 is also only an example, and should not be construed as limiting the content and scope of the solder strip manufacturing apparatus 100 and the manufacturing method thereof according to the present invention.

The automatic wire winding device 80 further includes a wire winding guide assembly 860, wherein the wire winding guide assembly 860 is disposed at one side of the rotating body 820, and the wire winding guide assembly 860 draws the photovoltaic solder ribbon 200 passing through the tin layer forming device 60 to be wound around the wire winding drum 840.

It should be noted that the solder strip manufacturing apparatus 100 may process one copper wire or a plurality of copper wires at the same time. Moreover, at least one of the wire releasing device 10, at least one of the forming device 20, at least one of the pressing device 30, at least one of the annealing device 40, at least one of the flux covering device 50, at least one of the tin layer forming device 60, at least one of the automatic tin adding device 70, and at least one of the automatic wire rewinding device 80 may be arranged according to production requirements, and the arrangement illustrated in fig. 1 is only an illustration and should not be construed as limiting the content and scope of the solder ribbon manufacturing apparatus 100 and the solder ribbon manufacturing method of the present invention.

In accordance with one aspect of the present invention, a method for manufacturing a photovoltaic solder ribbon according to a preferred embodiment of the present invention will be described in the following description, wherein the method for manufacturing a photovoltaic solder ribbon includes the steps of:

(c) pressing at least one region of the copper layer 201 at intervals to obtain the copper layer 201 with a concave-convex structure; and

(d) forming the tin layer 202 on the copper layer 201 to obtain the photovoltaic solder strip 200.

Before the step (a), the step (c) of forming the copper layer 201 with the cross section of the predetermined shape after the copper wire 302 is subjected to at least one shaping is further included.

Specifically, in the step (c), the copper wire 302 is formed into the copper layer 201 having the cross section of the predetermined shape by wire drawing, press forming, extrusion forming, rolling forming, or the like.

In the step (a), the copper layer 201 is pressed by stamping or rolling.

In the method for manufacturing a photovoltaic solder ribbon according to the present invention, after the step (a), the step (d) of annealing the copper layer 201 is included. Specifically, after the copper layer 201 is heated to a predetermined heating temperature, the heated copper layer 201 is cooled to a predetermined cooling temperature. Preferably, the copper layer 201 is heated by passing a current through the copper layer 201. Alternatively, the copper layer 201 is heated by heating coil or induction coil. It should be understood by those skilled in the art that the specific heating manner of the copper layer 201 is only an example and is not intended to limit the content and scope of the manufacturing method of the photovoltaic solder strip of the present invention.

Preferably, the heated copper layer 201 is cooled by being enveloped by a protective gas into a cooling liquid. Specifically, the protective gas is an inert gas, such as but not limited to nitrogen, which is beneficial to prevent the copper layer 201 from being oxidized after being heated at a high temperature.

Further, the cooled copper layer 201 is dried. Preferably, the copper layer 201 is dried by blow drying the copper layer 201. Optionally, the copper layer 201 is dried by absorbing moisture on the surface of the copper layer 201.

After the step (d), a step (e) of forming a fluxing film on the copper layer 201 is included. Specifically, the flux film is formed on the copper layer 201 by spraying flux on the copper layer 201.

In the step (b), the method further includes the step (f) of immersing the copper layer 201 in a tin solution to adhere the tin solution to the surface of the copper layer 201.

After the step (f), a step (g) of pre-shaping the tin liquid on the surface of the copper layer 201 is further included. Specifically, the tin liquid on the surface of the copper layer 201 is blown by means of generating air flow, so that the tin liquid can form the preset structure. Preferably, the gas flow is generated at intervals toward the molten tin. Optionally, an air flow is continuously generated towards the copper layer 201 in a manner that varies the magnitude of the wind. Alternatively, the air flow is continuously generated toward the copper layer 201 in such a manner as to maintain the same magnitude of the wind force. Optionally, a gas flow is generated towards the copper layer 201 in spaced proximity to the copper layer 201. Optionally, the gas flow is generated toward the copper layer 201 in a manner of moving up and down.

After the step (g), further comprising the step (h): and cooling the tin liquid attached to the copper layer 201 to form the tin layer 202 on the copper layer 201.

Prior to the step (f), further comprising the step (i): and heating the tin block to form tin liquid capable of adhering to the surface of the copper layer 201.

Before the step (i), further comprising the step (j): the tin nuggets are added automatically.

Specifically, in the step (j), the solder bump is added to the accommodating space 6101 of the solder accommodating pool 610 by impacting the solder bump. Furthermore, the tin block can be impacted in a mode of electric expansion, hydraulic expansion or swing and the like.

After the step (b), further comprising the step (k): and automatically accommodating the photovoltaic solder strip 200. Specifically, in the step (k), the photovoltaic solder ribbon 200 is automatically wound on a take-up reel 840. Further, in the step (k), the take-up reel 840 receiving the photovoltaic solder ribbon 200 is automatically switched.

Specifically, the take-up reel 840 of the automatic receiving device 80 receives the photovoltaic solder ribbon 200 while being drivingly rotated. Further, when the amount of the photovoltaic solder ribbon 200 disposed on the take-up reel 840 reaches a predetermined standard, the take-up reel 840 around which the photovoltaic solder ribbon 200 is wound is automatically switched. For example, the two rotary shafts 830 provided on the take-up reel 840 are provided at left and right intervals, the number of rotations of the left rotary shaft 830 is set, and when the left rotary shaft 830 rotates, the take-up reel 840 attached to the left rotary shaft 830 receives the photovoltaic strip, and at this time, the right rotary shaft 830 is stationary. When the left rotating shaft 830 rotates to a set number of turns, that is, the photovoltaic solder strip 200 wound on the take-up reel 840 reaches the preset standard, the control main body 850 controls the driving mechanism 810 to drive the rotating main body 820 to rotate, the two rotating shafts 830 arranged on the left and right exchange positions, the rotating shaft 830 arranged on the right side stops rotating, the rotating shaft 830 arranged on the left side starts rotating, and the photovoltaic solder strip 200 wound on the take-up reel 840 is changed.

In this particular embodiment of the method for manufacturing photovoltaic solder ribbon according to the present invention, a copper wire coil is supported by a limiting slope 1201, and the copper wire 302 wound around the copper wire coil 300 is separated from the copper wire coil 300 during rotation.

It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily conceivable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A manufacturing method of a photovoltaic solder strip is characterized by comprising the following steps:

2. The method of claim 1, wherein before the step (a), further comprising the step (c) forming the copper layer with a predetermined cross-section after at least one shaping of a copper wire.

3. The manufacturing method as claimed in claim 2, wherein in the step (c), the copper wire is formed to have the copper layer having the predetermined shape in cross section by wire drawing, press forming, extrusion forming or roll forming.

4. The manufacturing method according to claim 1, wherein in the step (a), the copper layer is pressed by means of stamping or rolling.

5. The method of manufacturing according to claim 2, wherein after the step (a), comprising the step (d) of annealing the copper layer.

6. The method according to claim 5, wherein in the step (d), after the copper layer is heated to a predetermined heating temperature, the heated copper layer is cooled to a predetermined cooling temperature.

7. The manufacturing method according to claim 6, wherein in the above method, the copper layer is heated by passing an electric current through the copper layer.

8. The method of claim 6, wherein the heated copper layer is cooled by introducing the heated copper layer into a cooling liquid while being surrounded by a protective gas.

9. The manufacturing method according to claim 8, wherein in the above method, the copper layer after cooling is dried.

10. The manufacturing method according to claim 9, wherein in the above method, the copper layer is dried by blow-drying the copper layer or by adsorbing moisture on the surface of the copper layer.

11. The method of manufacturing according to claim 10, wherein after the step (d), a step (e) of forming a fluxing film on the copper layer is included.

12. The method of manufacturing according to claim 2, wherein in the step (b), further comprising the step (f) the copper layer is dipped in a tin bath to adhere the tin bath to a surface of the copper layer.

13. The manufacturing method according to claim 12, wherein after the step (f), further comprising the step (g) of pre-shaping the tin bath of the copper layer surface.

14. The manufacturing method according to claim 13, wherein in the above method, the tin liquid on the surface of the copper layer is blown by means of generating a gas flow.

15. The method of manufacturing according to claim 13, wherein in the method, the gas flow is generated toward the copper layer in a manner selected from the group consisting of: the air flow is generated towards the copper layer at intervals, the air flow is generated towards the copper layer continuously in a mode of changing the magnitude of wind force, the air flow is generated towards the copper layer continuously in a mode of keeping the same magnitude of wind force, the air flow is generated towards the copper layer in a mode of being close to the copper layer at intervals, and the air flow is generated towards the copper layer in a mode of moving up and down.

16. The manufacturing method according to claim 13, wherein after the step (g), further comprising a step (h): and cooling and shaping the tin liquid attached to the copper layer.

17. The manufacturing method according to claim 12, wherein, before the step (f), further comprising a step (i): and heating the tin block to form tin liquid capable of adhering to the surface of the copper layer.

18. The method of manufacturing of claim 17, wherein prior to step (i), further comprising step (j) automatically adding a tin slug.

19. The method of manufacturing of claim 18, wherein in step (j), the solder bumps are added by impacting the solder bumps.

20. The method of manufacturing of claim 18, wherein in the method, the bump is impacted on the tin slug by a method selected from the group consisting of: electric telescopic impact, hydraulic telescopic impact and swing impact.

21. The manufacturing method according to claim 2, wherein after the step (b), further comprising a step (k): and automatically accommodating the photovoltaic solder strip.

22. The method of claim 21, wherein in step (k), the photovoltaic solder ribbon is automatically wound on a take-up reel.

23. The method of manufacturing of claim 22, wherein in step (k), the take-up reel receiving the photovoltaic solder strip is automatically switched.

24. A manufacturing method according to any one of claims 1 to 23, wherein in the above method, a copper wire coil is supported by a limit slope, and the copper wire wound around the copper wire coil is separated from the copper wire coil during rotation.