CN114074133A

CN114074133A - Tin layer forming equipment

Info

Publication number: CN114074133A
Application number: CN202110398022.8A
Authority: CN
Inventors: 孙益民; 邓琴
Original assignee: Zhejiang Chuanhe New Material Co ltd
Current assignee: Zhejiang Chuanhe New Material Co ltd
Priority date: 2020-08-18
Filing date: 2021-04-14
Publication date: 2022-02-22
Also published as: CN114074132A; CN216655830U; CN216027182U; WO2022037593A1; CN216027184U; CN216027183U; CN216027180U; CN215879302U; CN114074131A; CN114074134A; CN216027179U; CN216705509U; CN216027178U; CN216027181U; CN112246909A

Abstract

The invention discloses tin layer forming equipment, wherein the tin layer forming equipment comprises a tin layer forming device and an automatic tin adding device, wherein the tin layer forming device is provided with a tin heating space, the automatic tin adding device is provided with a tin block accommodating cavity, a tin adding chute, at least one tin block outlet and an impact opening opposite to the tin block outlet, wherein the tinning chute, the tin block outlet and the impact port are communicated with the tin block accommodating cavity, wherein the automatic tinning device is held on one side of the tin layer forming device in a manner that the tinning chute can be communicated with the tin block outlet, and the tin adding sliding groove is communicated with the tin heating space, and a tin block in the tin block accommodating cavity can enter the tin adding sliding groove from the tin block outlet in a collision manner and enter the tin heating space along the tin adding sliding groove.

Description

Tin layer forming equipment

Technical Field

The invention relates to the field of solder strips, in particular to tin layer forming equipment.

Background

The solder strip has good conductivity and is applied to connection of the photovoltaic module and the cell. For example, a plurality of solar cells are connected by solder strips, so that the plurality of solar cells can perform energy conversion and electric quantity transmission. Specifically, the solder strip comprises a copper layer and two tin layers formed on the upper surface and the lower surface of the copper layer respectively, the tin layers of the solder strip are welded on the solar cells in the using process so as to connect the solar cells in series or in parallel, a complete electric path can be formed between the solar cells after the solar cells are connected to the junction box, then the solar cells convert solar energy into electric energy in the using process, and the generated current can be transmitted through the solder strip. The quality of the solder strip directly affects the solar energy collection efficiency of the photovoltaic module, and the manufacturing equipment and the manufacturing method of the solder strip directly affect the quality and the production efficiency of the solder strip.

Disclosure of Invention

An object of the present invention is to provide a solder strip manufacturing apparatus for efficiently producing a photovoltaic solder strip, which is advantageous for improving the production efficiency of the photovoltaic solder strip, reducing the production cycle of the photovoltaic solder strip, and reducing the labor cost.

One objective of the present invention is to provide a tin layer forming apparatus, wherein a copper layer is drawn to pass through the tin layer forming apparatus to form a tin layer on the copper layer, so as to obtain a photovoltaic solder strip.

Another object of the present invention is to provide a tin layer forming apparatus, wherein the tin layer forming apparatus includes a tin layer forming device, wherein the tin layer forming device has a tin containing pool, wherein the tin containing pool is used for containing melted tin, the melted tin is attached to the surface of the copper layer after the copper layer is drawn through the tin containing pool, and the tin layer is formed on the copper layer after cooling.

Another object of the present invention is to provide a tin layer forming apparatus, wherein the tin layer forming apparatus includes an automatic tin adding device, wherein the automatic tin adding device automatically adds at least one tin block into the tin containing pool of the tin layer forming device, thereby reducing manual operation, facilitating improvement of production efficiency, and saving labor cost.

According to one aspect of the present invention, there is provided a tin layer forming apparatus, comprising:

a tin layer forming device, wherein the tin layer forming device comprises a tin heating pool, a heating mechanism and at least one forming air knife, wherein the tin heating pool is provided with a tin heating space, the heating mechanism is arranged in the tin heating space of the tin heating pool, the forming air knife is provided with an air outlet, and the forming air knife is kept above the tin heating pool; and

an automatic tinning device, wherein the automatic tinning device comprises a tin block accommodating box, a guide mechanism and an impact mechanism, wherein the tin block accommodating box is provided with a tin block accommodating cavity, at least one tin block outlet and an impact opening relative to the tin block outlet, wherein the tin block outlet and the impact opening are communicated with the tin block accommodating cavity, wherein the guide mechanism is provided with a tinning chute, wherein the guide mechanism is held at one side of the tin block accommodating box in a mode that the tinning chute can be communicated with the tin block outlet of the tin block accommodating box, and the tinning chute of the guide mechanism is communicated with the tin heating space of the tin heating pool, wherein the impact mechanism is held at the other side of the tin block accommodating box in a mode corresponding to the impact opening for impacting a tin block in the tin block accommodating cavity, so that the tin block enters the tin adding sliding groove of the guide mechanism from the tin block outlet and enters the tin heating space along the tin adding sliding groove.

According to one embodiment of the invention, the shaping air knives are spaced to wind in a manner that maintains the same amount of wind force.

According to one embodiment of the invention, the shaping air knife continuously blows out air in a manner of changing the magnitude of the wind force.

According to one embodiment of the present invention, the two shaping air knives are implemented in two, wherein the two shaping air knives are spaced apart with the air outlets facing each other, and the two shaping air knives are symmetrically held above the tin heating bath.

According to one embodiment of the present invention, the two shaping air knives are provided at an interval such that the air outlets are opposite to each other, and the two shaping air knives are maintained above the tin heating bath in a staggered manner.

According to one embodiment of the invention, the shaping air knife is held above the tin heating bath in such a way that the air outlet is inclined downwards.

According to an embodiment of the present invention, the tin layer forming apparatus further includes a horizontal driving mechanism, wherein the forming air knife is drivably mounted to the horizontal driving mechanism.

According to an embodiment of the present invention, the tin layer forming apparatus further includes a vertical driving mechanism, wherein the forming air knife is drivably installed to the vertical driving mechanism.

According to an embodiment of the present invention, the tin layer forming apparatus further includes a vertical driving mechanism and a mounting base, wherein the horizontal driving mechanism is provided to the mounting base, and the mounting base is drivably mounted to the vertical driving mechanism.

According to an embodiment of the present invention, the shaping air knife includes a wind generating unit, an extension arm, a holding arm, and a cutter head, wherein the extension arm is disposed on the wind generating unit, wherein one end of the holding arm is mounted to the extension arm, the other end of the holding arm is mounted to the cutter head, and the wind generating unit, the extension arm, the holding arm, and the cutter head are communicated with each other, and the air outlet is formed in the cutter head.

According to one embodiment of the invention, the holding arm of the profiled air knife is detachably mounted to the extension arm, and the distance between the cutting head at the end of the holding arm and the extension arm is allowed to be adjusted.

According to one embodiment of the invention, the holding arm of the profiled air knife is rotatably mounted to the extension arm, the orientation of the air outlet of the cutter head allowing for adjustment.

According to one embodiment of the invention, the extension arm of the shaping air knife is rotatably mounted to the wind power generating unit.

According to an embodiment of the present invention, the tin layer forming apparatus further includes a cooling mechanism, wherein the cooling mechanism has a cooling passage, wherein the cooling mechanism is held above the tin heating bath in such a manner that the cooling passage is communicated with the tin heating space.

According to an embodiment of the present invention, the cooling mechanism includes a cooling main body, a wind shielding cover disposed on the cooling main body and forming the cooling passage between the cooling main body and the wind shielding cover, and a plurality of air nozzles disposed at intervals on the cooling passage and communicated with the cooling main body.

According to one embodiment of the present invention, the air nozzle is obliquely provided to the cooling body in such a manner that the air nozzle is opened downward.

According to one embodiment of the invention, the wind shield cover of the cooling mechanism is pivotally connected to the cooling body.

According to an embodiment of the present invention, the tin layer forming apparatus further includes a tin coating guide mechanism, wherein the tin coating guide mechanism includes a lower guide member and an upper guide member, wherein the lower guide member is disposed below the forming air knife, and the lower guide member is disposed in the tin heating space, wherein the upper guide member is disposed above the cooling mechanism.

According to one embodiment of the invention, the guide mechanism is held obliquely to one side of the solder bump accommodating box.

According to one embodiment of the invention, the guiding means defines the bottom surface of the tinning chute as an inclined surface.

According to one embodiment of the invention, the slug outlet of the slug accommodating cartridge allows only one of the slugs to pass through.

According to an embodiment of the present invention, the solder bump accommodating box includes a bottom plate, a front barrier, a rear barrier opposite to the front barrier, and two side barriers disposed between the front barrier and the rear barrier, wherein the solder bump outlet is formed at the bottom of the front barrier, wherein the bump opening is formed at the bottom of the rear barrier, and wherein the bottom plate has a concavo-convex texture.

According to one embodiment of the invention, the bottom plate of the solder ball receiving box has an inclined bearing surface.

According to one embodiment of the present invention, the automatic tinning apparatus further comprises a driving seat, wherein the solder ball containing box is drivingly mounted to the driving seat, wherein the solder ball containing box has a plurality of spaced solder ball outlets and a plurality of spaced bump outlets, wherein the guide mechanism and the bump mechanism are held on both sides of the solder ball containing box in such a manner as to be fixed to the driving seat, and the driving seat is capable of driving the solder ball containing box to move relative to the guide mechanism and the bump mechanism.

According to one embodiment of the invention, the automatic tinning device further comprises a shielding plate, wherein the shielding plate is held on one side of the solder ball containing box, the shielding plate and the guiding mechanism are located on the same side of the solder ball containing box, and the shielding plate only allows one solder ball outlet to be exposed.

According to one embodiment of the present invention, the automatic tinning apparatus further comprises a driving seat, wherein the guide mechanism and the striking mechanism are held on both sides of the slug accommodating box in such a manner as to be drivably mounted to the driving seat, the slug accommodating box having a plurality of the slug outlet openings spaced apart from each other and a plurality of the striking openings spaced apart from each other, wherein the driving seat is capable of driving the guide mechanism and the striking mechanism to move synchronously relative to the slug accommodating box.

According to one embodiment of the invention, the manner in which the striking mechanism pushes the solder bumps is selected from: the electric drive telescopic impact, the hydraulic drive telescopic impact and the swing impact.

Drawings

FIG. 1 is a schematic diagram of a solder strip manufacturing apparatus according to a preferred embodiment of the present invention.

FIG. 2A is a schematic diagram illustrating a wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2B is an exploded view of the wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2C is a schematic sectional view of the wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2D is a schematic view of an application of the wire releasing device of the solder strip manufacturing apparatus according to the preferred embodiment of the present invention.

FIG. 2E is a schematic view of an application of the wire releasing device of the solder strip manufacturing apparatus according to the preferred embodiment of the present invention.

Fig. 3A is a schematic structural diagram of a molding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3B is a schematic cross-sectional view of a forming unit of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3C is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3D is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3E is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3F is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4A is a schematic structural diagram of a pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4B is an exploded view schematically illustrating the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4C is a schematic sectional view of the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4D is a schematic diagram of a stage of the pressing process of the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 5A is a schematic structural diagram of an annealing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 5B is a schematic diagram illustrating the application of the annealing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 6A is a schematic diagram illustrating a structure of a flux covering device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the invention.

Fig. 6B is an exploded view of the flux covering device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7A is a schematic structural diagram of a tin layer forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7B is a schematic structural diagram of the tin layer forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7C is a schematic diagram of a stage of the tin coating process of the tin layer forming device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7D is a schematic diagram of a stage of the tin coating process of the tin layer forming device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8A is a schematic structural diagram of an automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8B is a schematic structural diagram of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8C is a schematic structural diagram of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8D is a schematic view showing the application of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9A is a schematic structural diagram of a wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9B is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9C is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9D is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 10 is a schematic perspective view of a tin layer forming apparatus according to a preferred embodiment of the present invention.

Fig. 11 is a schematic view of the tin layer forming apparatus according to the above preferred embodiment of the present invention, which shows that after a tin block of an automatic tin adding device of the tin layer forming apparatus is pushed into a tin heating space, the tin block is melted into a tin liquid.

Fig. 12A is a schematic view of the tin layer forming apparatus according to the above preferred embodiment of the present invention, which shows a forming air knife of the tin layer forming apparatus pre-forming the tin liquid attached to a copper layer, wherein the forming air knife blows air at intervals.

Fig. 12B is a schematic view of the tin layer forming apparatus according to another preferred embodiment of the present invention, which shows that the forming air knife of the tin layer forming apparatus pre-forms the tin liquid attached to the copper layer, wherein the forming air knife continuously blows air and strong wind and weak wind are alternately generated.

Fig. 12C is a schematic view of the tin layer forming apparatus according to another preferred embodiment of the present invention, which shows that the forming air knives of the tin layer forming apparatus pre-form the tin liquid attached to the copper layer, wherein the forming air knives continuously discharge air and the wind force is the same.

Fig. 12D is a schematic view of the tin layer forming apparatus according to a preferred embodiment of the present invention, which shows the forming air knife of the tin layer forming apparatus pre-forming the tin liquid attached to the copper layer, wherein the forming air knife is allowed to move left and right.

Fig. 12E is a schematic view of the tin layer forming apparatus according to the above preferred embodiment of the present invention, which shows that the forming air knife of the tin layer forming apparatus pre-forms the tin liquid attached to the copper layer, wherein the forming air knife is allowed to move up and down.

Fig. 13 is a schematic view of the tin layer forming apparatus according to the above preferred embodiment of the present invention, which shows that the cooling mechanism of the tin layer forming apparatus cools and shapes the tin liquid attached to the copper layer.

FIG. 14 is a schematic perspective view of an automatic tin adding device according to a preferred embodiment of the present invention.

Fig. 15 is an exploded view schematically illustrating the automatic tin adding device according to the above preferred embodiment of the present invention.

FIG. 16 is a schematic view of an application of the automatic tin adding device according to the above preferred embodiment of the present invention.

FIG. 17 is a schematic view of the automatic tin adding apparatus according to the above preferred embodiment of the present invention, showing a solder ball accommodating box of the automatic tin adding apparatus being drivingly moved, and the solder balls of different positions being added to the solder heating space.

Fig. 18 is a schematic perspective view of the automatic tin adding device according to another preferred embodiment of the present invention.

Fig. 19A and 19B are schematic views of the automatic tin adding device according to the above preferred embodiment of the present invention, which show that an impact mechanism and a guide mechanism of the automatic tin adding device are drivingly moved, and the tin nuggets at different positions are added to the tin heating space.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1 to 9D of the specification, a solder ribbon manufacturing apparatus 100 according to a preferred embodiment of the present invention will be described in the following description, wherein the solder ribbon manufacturing apparatus 100 is capable of efficiently producing a photovoltaic solder ribbon 200, improving the production efficiency of the photovoltaic solder ribbon 200, reducing the labor cost for producing the photovoltaic solder ribbon 200, and shortening the production cycle of the photovoltaic solder ribbon 200.

The photovoltaic solder ribbon 200 includes a copper layer 201 and a solder layer 202 formed on the surface of the copper layer 201. The photovoltaic solder strip 200 has a concave-convex surface, so that the welding area and the light reflection area of the photovoltaic solder strip 200 are increased, and the reliability and the light reflection rate of the photovoltaic solder strip 200 are improved.

Referring to fig. 2A to 2E, the solder ribbon manufacturing apparatus 100 includes a wire releasing device 10, wherein the wire releasing device 10 is adapted to fix copper wire trays 300 of different sizes. The copper wire coil 300 comprises a wire coil 301 and a copper wire 302 wound on the outer wall of the wire coil 301, the wire coil 301 is provided with a mounting channel 303, and the wire coil 301 is fixed on the paying-off device 10. The paying-off device 10 can drive the wire spool 301 to rotate, so that the paying-off operation is carried out in the rotating process, and the copper wire 302 is pulled to leave the wire spool 301. The copper wire 302 subsequently forms the copper layer 201 of the photovoltaic solder ribbon 200.

Specifically, the paying-off device 10 includes a driving body 110, a carrier body 120, and a fastening body 130 detachably mounted to the carrier body 120, wherein the carrier body 120 is drivably disposed on the driving body 110, the copper wire coil 300 is detachably mounted to the carrier body 120, and the carrier body 120 is held in the mounting passage 303 of the wire coil 301 of the copper wire coil 300. The fastening body 130 is detachably mounted to the carrier body 120 and fixes the wire spool 301 of the copper wire coil 300 to the carrier body 120. The driving body 110 can drive the bearing body 120 to rotate, so as to drive the copper wire coil 300 and the fastening body 130 disposed on the bearing body 120 to rotate. The copper wire 302 leaves the wire spool 301 during rotation.

The bearing body 120 includes a position-limiting portion 121 and a bearing shaft 122 extending outward from the position-limiting portion 121, wherein the position-limiting portion 121 has a position-limiting inclined surface 1201. The fastening body 130 includes a fastening portion 131 and a fitting portion 132 extending outward from the fastening portion 131, wherein the fastening portion 131 has a fastening slope 1301. The copper wire coil 300 is fixed between the carrier body 120 and the fastening body 130 so as to be disposed on the stopper slope 1201 of the stopper portion 121 and the fastening slope 1301 of the fastening portion 131.

The copper wire coil 300 is sleeved on the bearing shaft 122 in a manner that the mounting channel 303 of the wire coil 301 corresponds to the bearing shaft 122 of the bearing main body 120, and one end of the wire coil 301 defining the inner wall of the mounting channel 303 is abutted against the limiting inclined surface 1201 of the limiting portion 121 of the bearing main body 120.

The carrier body 120 further includes a mounting shaft 123, wherein the mounting shaft 123 extends outwardly from the carrier shaft 122. The fastening body 130 further has a fitting opening 1302 and a fitting channel 1303 communicated with the fitting opening 1302, wherein the fastening body 130 is detachably mounted to the carrying body 120 in such a manner that the fitting opening 1302 corresponds to the fitting shaft 123 of the carrying body 120. The end of the bearing shaft 122 of the bearing body 120 is held in the fitting channel 1303 of the fastening body 130, and the fitting shaft 123 is held in the fitting opening 1302 of the fastening body 120. The fastening portion 131 of the fastening body 130 is inserted into the mounting channel 303 of the wire spool 301, and the fastening slope 1301 of the fastening portion 131 of the fastening body 130 is abutted against the other end of the inner wall of the wire spool 301 defining the mounting channel 303.

That is, the stopper slope 1201 of the stopper portion 121 of the carrier body 120 and the fastening slope 1301 of the fastening portion 131 of the fastening body 130 apply an inward acting force to the wire spool 301 of the wire spool 300 so that the wire spool 300 is fixed between the stopper slope 1201 of the stopper portion 121 and the fastening slope 1301 of the fastening portion 131.

The position-limiting portion 121 of the bearing body 120 has a high end and a low end, and the position-limiting inclined plane 1201 is formed between the high end and the low end. That is, the longitudinal cross-sectional area of the stopper portion 121 of the carrier body 120 gradually decreases from the high end portion to the low end portion of the stopper portion 121. Preferably, the limiting portion 121 is a circular truncated cone structure. The bearing shaft 122 extends outward from the lower end of the limiting portion 121.

The fastening part 131 of the fastening body 130 has an upper end and a lower end, and the fastening slope 1301 is formed between the upper end and the lower end of the fastening part 131. That is, the longitudinal sectional area of the fastening portion 131 of the fastening body 130 gradually increases in a direction from the lower end portion 1302 to the upper end portion. The fitting part 132 of the fastening body 130 extends outward from the upper end of the fastening part 131. Preferably, the fastening portion 131 of the fastening body 130 has a circular truncated cone structure.

It is worth mentioning that the stopper portion 121 and the fastening portion 131 having inclined surfaces can fix the wire spool 301 of the mounting channel 303 having different diameters. For example, the wire spool 301 having the mounting channel 303 with a large size is abutted against the high end portion near the stopper portion 121 and the upper end portion of the fastening portion 131, and the wire spool 301 having the mounting channel 303 with a small size is abutted against the low end portion near the stopper portion 121 and the lower end portion of the fastening portion 131. In this way, the paying-off device 10 can be adapted to fix the copper wire coil 300 having the mounting passages 303 of different sizes.

The pay-off device 10 further includes a pay-off guide assembly 140, wherein the pay-off guide assembly 140 is held above the carrier body 120 and the fastening body 130. The copper wires 302 of the copper wire coil 300 mounted to the carrier body 120 and the fastening body 130 are wound around the wire unwinding guide 140, and the movement of the copper wires 302 is stably guided by the wire unwinding guide 140.

Referring to fig. 3A to 3F, the solder ribbon manufacturing apparatus 100 further includes a molding device 20, wherein the molding device 20 is disposed at one side of the wire unwinding device 10, and the copper wire 302 passing through the wire unwinding device 10 is drawn through the molding device 20. And, the copper wire 302 passing through the molding apparatus 20 forms the copper layer 201 having a cross section of a predetermined shape.

In this particular embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 having the cross section of the predetermined shape by wire drawing. Specifically, the molding device 20 includes a plurality of molding units 210, wherein the molding units 210 have a molding space 2101, and the cross section of the molding space 2101 is the preset shape. After the copper wire 302 is drawn to pass through the molding space 2101 of each molding unit 210 in sequence, the copper layer 201 having the cross-section of the predetermined shape is formed.

The molding unit 210 includes a molding body 211 and a molding die 212, wherein the molding body 211 has an inlet 2111, an outlet 2112, and a receiving space 2113 communicating with the inlet 2111 and the outlet 2112, and the molding space 2101 is formed in the molding die 212. The molding die 212 is detachably mounted to the accommodating space 2113 of the molding body 211, and the molding space 2101 of the molding die 212 is communicated with the inlet 2111, the accommodating space 2113 and the outlet 2112 of the molding body 211.

The copper wire 302 is drawn from the inlet 2111 of the molding main body 211 into the molding space 2101 of the imaging mold 212 placed in the accommodating space 2113, and the copper wire 302 entering the molding mold 212 is compressed by an external force and is capable of forming the copper layer 201 having the predetermined shape in cross section.

In a specific embodiment of the present invention, the number of the forming units 210 is four, the cross section of the forming space 2101 of the forming unit 210 is a pentagon, the copper wire 302 is compressed once in each forming space 2101, and the copper wire 201 with the cross section of the predetermined shape is formed after four drawing processes.

It should be noted that the specific number of the forming units 210 is not limited, and the forming units 210 may be implemented as one, two, three, five or more numbers. Also, a specific shape of the molding space 2101 of the molding unit 210 is not limited, and the cross-sectional shape of the molding space 2101 may be implemented as a triangle, a trapezoid, a hexagon, or other shapes, etc. By replacing the molding die 212 having the molding space 2101 of different shapes, the copper layer 201 of different cross-sectional shapes can be obtained. The specific embodiment of the molding unit 210 is only an example and should not be construed as limiting the content and scope of the solder strip manufacturing apparatus 100 and the molding device 20 of the present invention.

In a specific embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 with the predetermined cross-section shape by means of punch forming. In an embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 having a cross section with a predetermined shape by rolling. It should be understood by those skilled in the art that the specific embodiment of the copper wire 302 forming the copper layer 201 is merely illustrative and should not be construed as limiting the scope and content of the solder ribbon manufacturing apparatus 100 and the manufacturing method thereof according to the present invention.

The forming device 20 further comprises a forming guide assembly 220, wherein the forming guide assembly 220 is disposed around the forming body 210, and the copper wire 302 passing through the drawing assembly 140 of the paying-off device 10 is guided to pass through the forming body 211 and the forming mold 212 of each forming unit 210 in turn under the action of the forming guide assembly 220 of the forming device 20.

Referring to fig. 4A to 4D, the solder strip manufacturing apparatus 100 further includes a pressing device 30, wherein the pressing device 30 is disposed at one side of the forming device 20, and the copper layer 201 passing through the forming device 20 is drawn through the pressing device 30. And, the copper layer 201 passing through the pressing device 30 forms a structure having a concave-convex surface.

Specifically, the pressing device 30 includes a power body 310 and a pressing body 320 drivably connected to the power body 310, wherein the pressing body 320 has a pressing space 3201, the copper layer 201 passing through the forming device 20 is drawn into the pressing space 3201 of the pressing body 320, and the pressing body 320 presses the copper layer 201 entering the pressing space 3201.

In this particular embodiment of the present invention, the pressing body 320 includes two pressing wheels 321, wherein the two pressing wheels 321 are disposed one above the other and the pressing space 3201 is formed between the two pressing wheels 321. The distance between the two pressing wheels 321 is allowed to be adjusted, and the size of the pressing space 3201 may be adjusted, thereby enabling the copper layer 201 passing through the pressing space 3201 to form a structure having a concave-convex surface.

Specifically, at least one of the two pressing wheels 321 is drivably connected to the power body 310, and the power body 310 drives the at least one pressing wheel 321 to move up and down, thereby changing the distance between the two pressing wheels 321.

When the distance between the two pressing wheels 321 is smaller than the thickness of the copper layer 201, the copper layer 201 drawn from the molding device 20 to the pressing device 30 is pressed by the pressing wheels 321, and the thickness of the pressed portion is reduced. When the power body 310 drives the pressing wheels 321 to move, and the distance between the two pressing wheels 321 is increased, and the distance between the two pressing wheels 321 is greater than the thickness of the copper layer 210, the copper layer 210 can pass through without being pressed, that is, the thickness of the copper layer 210 does not change. The size of the pressing space 3201 is changed by driving the pressing wheel 321 to move up and down, thereby manufacturing the copper layer 201 having a concave-convex surface.

The embodiment of the pressing body 320 is not limited, and the two pressing wheels 321 of the pressing body 320 may be oppositely disposed left and right, and the power body 310 drives at least one pressing wheel 321 to move left and right. Alternatively, the pressing body 320 presses the copper layer 201 by rolling. Alternatively, the pressing body 320 presses the copper layer 201 by means of pressing. Alternatively, the pressing body 320 presses the copper layer 201 by means of stamping. It should be understood by those skilled in the art that the specific embodiment of the pressing body 320 is merely exemplary and should not be construed as limiting the scope and content of the manufacturing apparatus 100 and the manufacturing method thereof.

Preferably, the power body 310 drives the pressing wheel 321 to move through an electric driving manner. Preferably, the power body 310 drives the pressing wheel 321 to move through an electric driving manner. Preferably, the power body drives the pressing wheel 321 to move through a hydraulic driving mode. Alternatively, the power body 310 drives the pressing wheel 321 to move through a gear driving manner. It should be noted that the specific embodiment of the power body 310 driving the pressing wheel 321 to move is only an example, and is not intended to limit the content and scope of the welding strip manufacturing apparatus 100 and the manufacturing method thereof.

The pressing device 30 further includes a cooling body 330, wherein the cooling body 330 is disposed on the pressing body 320, and the cooling body 330 cools the pressing body 320 to prevent the quality of the solder strip 200 from being affected by the overhigh surface temperature of the pressing body 320.

Specifically, the cooling body 330 further includes at least one cooling portion 331 and at least one mounting portion 332, wherein the cooling portion 331 has a cooling channel 3311, and the mounting portion 332 is disposed on the cooling portion 331. The pressing wheel 321 of the pressing body 30 has a flow path 3211, wherein the mounting portion 332 is mounted to the pressing wheel 321, and the flow path 3211 of the pressing wheel 321 is communicated with the cooling path 3311 of the cooling portion 331. The cooling liquid in the cooling passage 3311 of the cooling portion 331 circularly flows into the circulation passage 3211 of the pressing wheel 321 and takes away heat of the pressing wheel 321 to lower the temperature of the surface of the pressing wheel 321.

The pressing apparatus 30 further includes a pressing guide assembly 340, wherein the pressing guide assembly 340 is disposed around the pressing main body 320, and the pressing guide assembly 340 stably guides the copper layer 201 into and out of the pressing space 3201 of the pressing main body 320.

Referring to fig. 5A and 5B, the solder strip manufacturing apparatus 100 further includes an annealing device 40, wherein the annealing device 40 is disposed at one side of the pressing device 30, and the annealing device 40 anneals the copper layer 201 after the pressing device 30.

The annealing device 40 includes a positive electrode wheel 410, a negative electrode wheel 420, a protection body 430, a temperature reduction body 440 and a drying body 450, wherein the protection body 430 has a protection channel 4301, wherein the temperature reduction body 440 has a liquid tank 4401, and wherein the drying body 450 has a drying channel 4501.

The protection body 430 is disposed between the positive wheel 410 and the negative wheel 420, and the copper layer 201 passing through the pressing space 3201 of the pressing device 30 is wound around the positive wheel 410. The copper layer 201 passing through the positive electrode wheel 410 enters the protection channel 4301 of the protection body 430 and is wound around the negative electrode wheel 420. An electric current passes between the positive electrode wheel 410 and the negative electrode wheel 420, thereby increasing the temperature of the copper layer 201 connected between the positive electrode wheel 410 and the negative electrode wheel 420.

Further, the protection channel 4301 of the protection body 430 contains a protection gas to prevent the copper layer 201 from being oxidized at a high temperature. Preferably, the protection channel 4301 of the protection device 430 contains an inert gas, such as but not limited to nitrogen.

Further, the liquid containing groove 4401 of the cooling body 440 contains a cooling liquid, the negative wheel 420 is disposed in the liquid containing groove 4401 of the cooling body 440, the copper layer 201 is drawn through the cooling liquid in the solution groove 4401 of the cooling body 440, and the heated copper layer 201 is cooled in the cooling liquid.

The copper layer 201 passing through the cooling liquid is drawn into the drying space 4501 of the drying body 450, and the drying body 450 removes the liquid from the surface of the copper layer 201, so that the surface of the copper layer 201 passing through the drying body 450 is dried, facilitating the subsequent process. Preferably, the drying body 450 dries the copper layer 201 by blow-drying the surface of the copper layer 201. For example, a plurality of air knives are disposed in the drying space 4501, and the air knives generate wind to dry the moisture on the surface of the copper layer 201. Alternatively, the drying body 450 dries the copper layer 201 by adsorbing the surface moisture of the copper layer 201. It should be understood by those skilled in the art that the specific embodiment of the drying body 450 for extracting the moisture from the surface of the copper layer 201 is only an example and is not intended to limit the content and scope of the solder strip manufacturing apparatus 100 of the present invention.

The annealing apparatus 40 further includes an annealing guide element 460, wherein the annealing guide element 460 is disposed around the positive electrode wheel 410, the negative electrode wheel 420, the protective body 430, the temperature reduction body 440, and the drying body 450 to guide the copper layer 201 stably through the positive electrode wheel 410, the negative electrode wheel 420, the protective body 430, the temperature reduction body 440, and the drying body 450. Preferably, the annealing guide assembly 460 is capable of controlling the speed of movement of the copper layer 201.

Referring to fig. 6A and 6B, the solder ribbon manufacturing apparatus 100 further includes a flux covering device 50, wherein the flux covering device 50 is disposed at one side of the annealing device 40, and the flux covering device 50 covers a flux on the surface of the copper layer 201, so as to protect the copper layer 201 and prevent the copper layer 201 from oxidation reaction.

Specifically, the flux covering device 50 includes a protection housing 510 and a spraying body 520, wherein the protection housing 510 has a maintaining space 5101 and a maintaining inlet 5102 and a maintaining outlet 5103 respectively communicating with the maintaining space 5101, the spraying body 520 has a spraying opening, and the spraying body 520 is disposed above the protection housing 510 with the spraying opening facing the maintaining space 5101 of the protection housing 510. The copper layer 201 passing through the annealing device 40 is drawn from the maintenance inlet 5102 into the maintenance space 5101 of the protective shell 510, and a flux contained in the spraying body 520 enters the maintenance space 5101 of the protective shell 510 from the spraying opening of the spraying body 520 and covers the surface of the copper layer 201 to form a flux film on the surface of the copper layer 201, so that the performance of the photovoltaic solder strip 200 is improved. The copper layer 201, on which the fluxing film is formed, is drawn away from the maintenance vent 5103.

Preferably, the shielding shell is disposed obliquely, which facilitates the flux to uniformly cover the surface of the copper layer 201.

It is worth mentioning that the kind of the flux is not limited, and the flux may be implemented as liquid or solid powder, etc. Preferably, the spraying body 520 is used for covering the soldering flux on the surface of the copper layer 201 by spraying.

The flux covering device 50 further includes a protective cover 530, wherein the protective cover 530 has a flow opening 5301, and the protective cover 530 is disposed on the protective housing 510 in such a manner that the flow opening 5301 is communicated with the protective housing 510. The protective cover 530 shields the maintaining space 5101 of the protective housing 510, and prevents the flux sprayed from the spraying opening of the spraying body 520 from splashing to the external environment.

Specifically, the spraying body 520 has a flux containing box 521 and at least one guide tube 522 communicated with the containing space of the column welding containing box 521, and the spraying port is formed in the guide tube 522. The guide pipe 522 extends downward from the receiving portion 521 to the maintaining space 5101 of the shield case 510, and the guide pipe 522 is located at the circulation port 5301 of the shield cover 530 in such a manner that the spray port is communicated with the maintaining space 5101 of the shield case 510. The spray opening of the guide tube 522 is located below the circulation opening 5301 of the protective cover 530. When the guiding tube 522 sprays the flux toward the copper layer 201 in the maintaining space 5101 of the protective housing 510, the splashed flux is blocked by the protective cover 530 and cannot splash into the external environment, which is beneficial to reducing waste of flux and avoiding pollution to the environment.

It should be noted that the specific number of the guiding tubes 522 is not limited, and the guiding tubes 522 may be implemented as one, by covering the flux on the surface of one copper layer 201 through one guiding tube 522, or by covering the flux on the surfaces of two or more copper layers 201 through one guiding tube 522. The guiding pipes 522 may also be implemented in two or more numbers, wherein each guiding pipe 522 corresponds to one copper layer 201, so as to spray the flux on two or more numbers of copper layers 201 at the same time.

The flux covering device 50 further includes a flux guide assembly 540, wherein the flux guide assembly 540 is disposed around the protective casing 510, and the flux guide assembly 540 guides the copper layer 201 from the maintenance inlet 5102 into the maintenance space 5101 of the protective casing 510 and pulls the copper layer 201 away from the maintenance outlet 5103 after a flux film is formed.

Referring to fig. 7A to 7D, the solder ribbon manufacturing apparatus 100 further includes a tin layer forming device 60, wherein the tin layer forming device 60 is disposed at one side of the flux covering device 50, and the tin layer 202 is formed on the surface of the copper layer 201 after the copper layer 201 passing through the flux covering device 50 passes through the tin layer forming device 60.

Specifically, the tin layer forming device 60 includes a tin containing pool 610 and a heating body 620, wherein the tin containing pool 610 has a containing space 6101, the heating body 620 is disposed in the tin containing pool 610, and the heating body 620 can melt a tin block entering the containing space 6101 in the containing space 6101. The copper layer 201 passing through the soldering flux covering device 50 is drawn into the accommodating space 6101 of the tin accommodating pool 610, and the melted tin covers the surface of the copper layer 201, and then the tin layer 202 is formed.

The tin layer forming device 60 further includes at least one blowing main body 630, wherein the blowing main body 630 is disposed above the tin containing tank 610, and the blowing main body 630 has an air outlet 6301. The copper layer 201 covered by tin is pulled to pass through the air blowing main body 630, the air outlet 6301 of the air blowing main body 630 faces the copper layer 201, the air blowing main body 630 generates wind power from the air outlet 6301 and blows the tin covering the copper layer 201, so that the tin covering the surface 201 of the copper layer has different thicknesses, which is beneficial to improving the performance of the photovoltaic solder strip 200.

The tin layer forming device 60 further includes at least one cooling forming body 640, wherein the cooling forming body 640 is disposed above the blowing body 630, and wherein the cooling forming body 640 has a cooling forming passage 6401. The copper layer 201 passing through the air outlet 6301 of the air blowing main body 630 is drawn into the cooling molding passage 6401 of the cooling molding main body 640, and the tin covering the copper layer 201 is cooled in the cooling molding passage 6401, thereby forming the tin layer 202 on the copper layer 201. Preferably, a plurality of air knives are arranged in the cooling and forming channel 6401, and the air generated by the air knives carries away the heat of the tin, so that the tin is cooled and formed on the copper layer 201, and the photovoltaic solder strip 200 is further manufactured.

The tin layer forming apparatus 60 further includes a tin coating guide assembly 650, wherein the tin coating guide assembly 650 is disposed around the tin containing pool 610, the blowing main body 630 and the cooling forming main body 640, and the tin coating guide assembly 650 guides the cooling forming space 6401 passing through the containing space 6101 of the tin containing pool 610, the blowing port 6301 of the blowing main body 630 and the cooling forming main body 640 in sequence.

Referring to fig. 8A to 8D, the solder strip manufacturing apparatus 100 further includes an automatic tin adding device 70, wherein the automatic shelf device 70 is disposed at one side of the tin containing pool 610 of the tin forming device 60, and the automatic tin adding device 70 can automatically add the tin block into the containing space 6101 of the tin containing pool 610, so that the tin adding safety is improved, and the labor cost is also saved.

Specifically, the automatic tin adding device 70 includes a receiving main body 710, an impact main body 720, a guiding main body 730 and a power mechanism 740, wherein the receiving main body 710 has a receiving cavity 7101, a plurality of spaced tin block outlets 7102 communicated with the receiving cavity 7101 and a plurality of spaced pushing ports 7103, wherein the tin block outlets 7102 are opposite to the pushing ports 7103, and the guiding main body 730 has a guiding groove 7301. The slug outlet 7102 and the push port 7103 are located at the bottom of the containment body 710. The striking body 720 and the guide body 730 are respectively held at both sides of the receiving body 710. The striking body 720 and the guide body 730 correspond to each other, and the striking body 720 and the guide body 730 can correspond to the solder bump outlet 7102 and the push port 7103, respectively. The guiding groove 7301 of the guiding body 730 can be communicated with the accommodating space 6101 of the tin accommodating pool 610 of the tin layer molding device 60 and the accommodating cavity 7101 of the accommodating body 710.

The size of the solder bump outlet 7102 only allows one solder bump to pass through, the impact main body 720 can impact the solder bumps corresponding to the solder bump outlet 7102 and the pushing port 7103 and enter the guide groove 7301 of the guide main body 730 from the solder bump outlet 7102, the solder bumps enter the accommodating space 6101 of the solder accommodating pool 610 from the guide groove 7301, and the solder bumps are melted after being heated. The solder bumps are placed inside the containing cavity 7101 of the containing body 710 in an overlapped manner, and the striking body 720 in turn strikes the solder bumps into the containing space 6101 of the solder containing pool 610.

In one embodiment of the invention, the impact body 720 is implemented as an electric push rod, the impact body 720 is driven to extend and retract and generate an impact force on the solder bump when the impact body 720 moves toward the solder bump, so that the solder bump rapidly exits the receiving cavity 7101 from the solder bump outlet 7102. Optionally, the striking body 720 extends and retracts in a hydraulic driving manner, and strikes the solder bump into the accommodating space 6101 of the solder accommodating pool 610. Alternatively, the striking body 720 strikes the solder bump or the like by means of oscillation. It should be understood by those skilled in the art that the specific manner in which the striking body 720 drives the solder bumps into the receiving space 6101 of the tin receiving pool 610 is merely exemplary and should not be construed as limiting the scope and content of the solder ribbon manufacturing apparatus 100 and the method of manufacturing the same.

Preferably, the accommodating main body 710 is movably and drivably disposed on the power mechanism 740, and the power mechanism 740 is capable of driving the accommodating main body 710 to move left and right, so that the different solder bump outlets 7102 and the pushing openings 7103 of the accommodating main body 710 respectively correspond to the guiding main body 730 and the striking main body 720, and thus the solder bumps in the accommodating main body 710 can be automatically pushed into the accommodating space 6101 of the solder accommodating pool 610.

Referring to fig. 9A to 9D, the solder ribbon manufacturing apparatus 100 further includes an automatic take-up device 80, wherein the automatic take-up device 80 is disposed at one side of the tin layer forming device 60, the photovoltaic solder ribbon 200 manufactured after passing through the cooling forming passage 6401 of the cooling forming body 640 of the tin layer forming device 60 is drawn through the automatic take-up device 80, and the automatic take-up device 80 automatically receives the photovoltaic solder ribbon into a solder ribbon reel.

Specifically, the automatic wire rewinding device 80 includes at least one driving mechanism 810, a rotating body 820, at least two rotating shafts 830, and at least two wire rewinding disks 840, wherein the rotating body 820 and the rotating shafts 830 are rotatably and drivably connected to the driving mechanism 810, wherein the two rotating shafts 830 are adjacently disposed on the rotating body 820, and wherein the wire rewinding disks 840 are detachably mounted on the rotating shafts 830.

The photovoltaic solder ribbon 200 manufactured after passing through the cooling molding passage 6401 is drawn through the take-up reel 840 of the automatic take-up device 80, and the driving body 820 drives the rotating shaft 830 to rotate, so that the photovoltaic solder ribbon 200 is wound around the take-up reel 840 rotating along with the rotating shaft 830.

The automatic wire takeup device 80 further includes a control body 850, wherein the control body 850 is communicatively coupled to the drive mechanism 810 and the rotating shaft 830. When the amount of the photovoltaic solder strip 200 disposed on the take-up reel 840 reaches a predetermined standard, the driving mechanism 810 is controlled to rotate, so as to change the take-up reel 840 around which the photovoltaic solder strip is wound.

For example, the two rotating shafts 830 are provided at left and right intervals, the number of rotations of the left rotating shaft 830 is set, and when the left rotating shaft rotates, the take-up reel 840 attached to the left rotating shaft receives the photovoltaic strip, and at this time, the right rotating shaft 830 is stationary. When the left rotating shaft 830 rotates to a set number of turns, that is, the photovoltaic solder strip 200 wound on the take-up reel 840 reaches the preset standard, the control main body 850 controls the driving mechanism 810 to drive the rotating main body 820 to rotate, the two rotating shafts 830 arranged on the left and right exchange positions, the rotating shaft 830 arranged on the right side stops rotating, the rotating shaft 830 arranged on the left side starts rotating, and the photovoltaic solder strip 200 wound on the take-up reel 840 is changed.

Alternatively, the control body 850 may control the rotation of the rotating body 820, the rotating shaft 830 and the take-up reel 840 according to the weight of the photovoltaic solder ribbon wound around the take-up reel 840. It should be noted that the angle, the timing and the basis of the rotation of the rotating body 820 and the rotating shaft 830 controlled by the control body 850 are only examples, and the specific number of the rotating shafts 830 is also only an example, and should not be construed as limiting the content and scope of the solder strip manufacturing apparatus 100 and the manufacturing method thereof according to the present invention.

The automatic wire winding device 80 further includes a wire winding guide assembly 860, wherein the wire winding guide assembly 860 is disposed at one side of the rotating body 820, and the wire winding guide assembly 860 draws the photovoltaic solder ribbon 200 passing through the tin layer forming device 60 to be wound around the wire winding drum 840.

It should be noted that the solder strip manufacturing apparatus 100 may process one copper wire or a plurality of copper wires at the same time. Moreover, at least one of the wire releasing device 10, at least one of the forming device 20, at least one of the pressing device 30, at least one of the annealing device 40, at least one of the flux covering device 50, at least one of the tin layer forming device 60, at least one of the automatic tin adding device 70 and at least one of the automatic wire winding device 80 may be arranged according to production requirements, and the arrangement illustrated in fig. 1 is only an illustration and should not be construed as limiting the content and scope of the solder ribbon manufacturing apparatus 100 and the solder ribbon manufacturing method of the present invention.

Referring to fig. 10, in accordance with an aspect of the present invention, a tin layer forming apparatus 900 according to a preferred embodiment of the present invention will be described in the following description, wherein the tin layer forming apparatus 900 is used for forming a tin layer 210 on a surface of a copper layer 220 to produce a photovoltaic solder ribbon 200.

Specifically, tin layer former 900 includes a tin layer forming device 910 and an automatic tin adding device 920, wherein tin layer forming device 910 has a tin heating space 9101, automatic tin adding device 920 has a tin adding chute 9201 and is communicated in a tin block accommodating cavity 9202 of tin adding chute 9201, automatic tin adding device 920 with tin adding chute 9201 be communicated in tin layer forming device 910 the mode of tin heating space 9101 be set up in one side of tin layer forming device 910. The automatic tin adding device 910 can automatically add a tin block accommodated in the tin block accommodating cavity 9202 into the tin heating space 9101 of the tin layer molding device 910. The solder bumps are heated and melted in the solder bump accommodating cavities 9202. At least one of the copper layers 220 is drawn through the tin heating space 9101 in a manner of being immersed in molten tin, which covers the copper layer 220 in a manner of being attached to the surface of the copper layer 220. After the tin is cooled, the tin layer 210 is formed on the copper layer 220 to obtain the photovoltaic solder strip 200.

Referring to fig. 10 and 11, in this embodiment of the present invention, the tin layer forming apparatus 910 includes a tin heating bath 911 and a heating mechanism 912, wherein the tin heating space 9101 is formed at the tin heating bath 911, and the heating mechanism 912 is disposed at the bottom of the tin heating bath 911. The heating mechanism 912 heats the solder bumps entering the solder heating bath 911 and melts the solder bumps to form a molten solder having fluidity. After the copper layer 220 passes through the molten tin, the molten tin adheres to the copper layer 220. Preferably, the heating mechanism 912 is implemented as a heating wire, and the heating mechanism 912 generates heat and melts the solder bumps after being electrified. It should be understood by those skilled in the art that the specific embodiment of the heating mechanism 912 is not limited, and the heating mechanism may also perform heating by other means, such as but not limited to infrared heating, high frequency electromagnetic heating, etc.

Referring to fig. 10 and 12A to 12E, the tin layer forming apparatus 910 further includes at least one forming air blade 913, wherein the forming air blade 913 has an air outlet 9130, and the forming air blade 913 is disposed above the tin heating bath 911 in a manner that the air outlet 9130 faces the copper layer 220 passing through. The copper layer 220 attached with the molten tin passes through the air outlet 9130 of the forming air knife 913, the air outlet 9130 of the forming air knife 913 generates forming air, and the wind power of the forming air is enough to blow the molten tin covering the copper layer 220 to flow, so that the molten tin covering the copper layer 220 can form the tin layer 210 with a preset structure. The forming air blade 913 cools the molten tin while the forming air blows the molten tin, so that the fluidity of the molten tin is reduced, and the molten tin can form the tin layer 210 having the preset structure after being cooled. In other words, the forming air knife 913 pre-shapes the tin liquid attached to the copper layer 220, and then the tin liquid is completely cooled to form the tin layer 210 having the predetermined structure on the copper layer 220.

Referring to fig. 12A, in a specific embodiment of the present invention, the shaping wind blades 913 generate the shaping wind at intervals in such a manner that the same magnitude of wind force is maintained. Thus, the molten tin blown by the shaping wind flows rapidly, that is, the thickness of the tin layer 210 is thinner at the position corresponding to the shaping tuyere 9130 where the shaping wind is generated, and the thickness of the tin layer 210 is thicker at the position corresponding to the shaping tuyere 9130 where the shaping wind is not generated. Further, the tin solution passing through the forming air knife 913 can form the tin layer 210 having a concave-convex structure on the copper layer 220. The tin layer 210 with the concave-convex structure is more easily and firmly welded on a photovoltaic module in the subsequent use process, and the tin layer 210 with the concave-convex structure is also beneficial to reflecting sunlight to the photovoltaic module, so that the solar energy collection efficiency of the photovoltaic module is improved. Preferably, the interval time between the generation of the shaping wind by the shaping wind knives 913 is the same. Alternatively, the interval time between the generation of the shaping wind by the shaping wind knives 913 is different.

Referring to fig. 12B, in a specific embodiment of the present invention, the shaping air blade 913 continuously generates the shaping air in a manner of varying the magnitude of the wind force, and the tin layer 210 formed by the tin melt is thinner for the shaping air with a larger wind force and thicker for the tin melt 210 formed by the shaping air with a smaller wind force. In this way, the tin layer 210 having a concave-convex structure can be formed on the copper layer 220.

In this particular embodiment of the tin layer forming apparatus 900 according to the present invention, the forming air knives 913 are implemented in two, two of the forming air knives 913 are disposed at an interval in such a manner that the air outlets 9130 are opposed, and the copper layer 220 attached with the tin liquid is drawn to pass between the two opposed forming air knives 913. Further, the tin layer 210 formed on both opposite sides of the copper layer 220 has a concave-convex structure.

Alternatively, the forming air knife 913 is implemented as one, and the molten tin attached to one side of the copper layer 220 is shaped by one of the forming air knives 913. Alternatively, the forming air knives 913 located on the same side of the copper layer 220 may be implemented in more than two numbers, and the more than two forming air knives 913 are arranged from top to bottom, so as to shape the copper layer 220 multiple times, so as to obtain the tin layer 210 with a predetermined shape. Preferably, at least two of the forming air knives 913 are symmetrically held on both sides of the copper layer 220. Optionally, at least two of the forming air knives 913 are asymmetrically held on two sides of the copper layer 220, that is, the two forming air knives 913 are disposed above the tin heating bath 911 in a staggered manner. It should be understood by those skilled in the art that a plurality of sets of the forming air knives 913 may be disposed to treat the molten tin adhered to the surfaces of the copper layers 220 at the same time, which is beneficial to improve the working efficiency. The specific number and embodiments of the shaping air knives 913 are merely exemplary and should not be construed as limiting the scope and content of the tin layer forming apparatus 900 of the present invention.

Referring to fig. 12C, optionally, the shaping air blade 913 continuously generates the shaping air in a manner of maintaining the same amount of air force, and the molten tin passing through the shaping air blade 913 can form the tin layer 210 with a uniform thickness on the copper layer 220.

Referring to fig. 12D, in an embodiment of the invention, two of the forming air knives 913 are movably held at two sides of the copper layer 220, and the force of the forming air generated by the forming air knives 913 on the molten tin attached to the copper layer 220 is changed by adjusting the distance between the forming air knives 913 and the copper layer 220, so as to form the tin layers 220 with different thicknesses.

Specifically, the tin layer forming apparatus 910 further includes a horizontal driving mechanism 914, wherein the forming air blade 913 is drivably installed to the horizontal driving mechanism 914. The horizontal driving mechanism 914 can drive the forming air blade 913 to move left and right, thereby changing the distance between the forming air blade 913 and the copper layer 220. More specifically, when the forming air blade 913 is driven to be close to the copper layer 220, the force of the forming air generated by the forming air blade 913 on the molten tin attached to the copper layer 220 is increased, and the thickness of the correspondingly formed tin layer 210 is smaller; when the shaping air blade 913 is driven away from the copper layer 220, the force of the shaping air generated by the shaping air blade 913 on the molten tin adhered to the copper layer 220 is reduced, and the thickness of the correspondingly formed tin layer 210 is larger.

The shaping air knife 913 includes a wind generating unit 9131, an extension arm 9132, a holding arm 9133 and a knife head 9134, wherein the extension arm 9132 is disposed on the wind generating unit 9131, one end of the holding arm 9133 is installed on the extension arm 9132, the other end of the holding arm 9134 is installed on the knife head 9134, and the wind generating unit 9131, the extension arm 9132, the holding arm 9133 and the knife head 9134 communicate with each other. The air outlet 9130 is formed in the tool bit 9134, and the shaping air generated by the wind generating unit 9131 is blown from the tool bit 9134 to the molten tin attached to the copper layer 220 after passing through the extension arm 9132 and the holding arm 9133.

The wind-force generating unit 9131 is drivably and movably disposed on a horizontal rail of the horizontal driving mechanism 914, the horizontal driving mechanism 914 drives the wind-force generating unit 9131 to move left and right along the horizontal rail of the horizontal driving mechanism 914, and the extension arm 9132, the holding arm 9233, and the tool bit 9134 disposed on the wind-force generating unit 9131 move left and right along with the wind-force generating unit 9131. In this way, the distance between the tool bit 9134 and the copper layer 220 can be changed, and the amount of the shaping air blown from the air outlet 9130 of the tool bit 9134 to the copper layer 220 can be changed.

Alternatively, the holding arm 9133 is detachably mounted in a fitting hole of the extension arm 9132, and the distance between the tool bit 9134 mounted to the end of the holding arm 9133 and the copper layer 220 can be adjusted by changing the position at which the holding arm 9133 is fixed to the extension arm 8132. Specifically, when the retaining arm 9133 is fixed to the extension arm 9132 at a position close to the tool tip 9134, the tool tip 9134 is located a distance away from the copper layer 220; when the holding arm 9133 is fixed to the extension arm 9132 at a position away from the tool tip 9134, the tool tip 9134 is located closer to the copper layer 220.

Referring to FIG. 12E, the tin layer molding apparatus 910 further includes a mounting seat 917 and a vertical driving mechanism 918, wherein the mounting seat 917 is movably and drivably mounted to a vertical rail of the vertical driving mechanism 918, and the horizontal driving mechanism 914 is fixed to the mounting seat 917. The vertical driving mechanism 918 drives the assembly seat 917 to move up and down along the vertical track, and drives the horizontal driving mechanism 914, the wind generating unit 9131, the extension arm 9132, the holding arm 9133, and the tool bit 9134 to move up and down. In this way, the sizes of the convex portions and the concave portions of the tin layer 210 formed by the tin liquid can be adjusted. In addition, the tin layer 210 can be formed with different structures and shapes by varying the distance between the tool tip 9134 and the copper layer 220 passing therethrough in the horizontal and vertical directions.

In an embodiment of the invention, the forming wind generated by the forming wind blade 913 blows the molten tin attached to the copper layer 220 obliquely downward, which is beneficial to quickly blowing the molten tin, and the molten tin is prevented from splashing to both sides because the forming wind blows the copper layer 220 vertically.

Specifically, the extension direction of the extension arm 9132 is parallel to a horizontal plane, the copper layer 220 attached with the molten tin is drawn to move from bottom to top perpendicular to the horizontal plane, the holding arm 9133 is obliquely arranged on the extension arm 9133, and the extension direction of the tool bit 9134 is consistent with the extension direction of the holding arm 9133, that is, an inclined included angle exists between the extension direction of the tool bit 9134 and the horizontal plane. Further, the tool tip is held obliquely downward to one side of the copper layer 220. When the copper layer 220 is drawn through the tool tip 9134, the shaping air is blown obliquely downward to the tin liquid adhering to the copper layer 220.

Alternatively, the tool tip 9134 can be held obliquely upward to one side of the copper layer 220. It is worth mentioning that the inclination angle of the cutter head 9134 of the shaping air knife 913 is not limited, and the air outlet angle of the shaping air is also not limited. The specific tilt angles shown in the drawings are merely exemplary and should not be construed as limiting the scope and content of the tin layer forming apparatus 900 of the present invention.

Preferably, the inclination angle of the cutter head 9134 of the shaping air-knife 913 is allowed to be adjusted. In a specific embodiment of the present invention, the holding arm 9133 is rotatably mounted to the extension arm 9132, and the wind direction of the shaping wind can be changed by rotating the holding arm 9133, thereby changing the shape of the tin layer 210 formed by the molten tin. In a specific embodiment of the present invention, the extension arm 9132 is rotatably mounted to the wind generating unit 9131, and the wind direction of the shaping wind is changed by rotating the extension arm 9132.

Referring to fig. 10 and 13, the tin layer molding apparatus 910 further includes a cooling mechanism 915, wherein the cooling mechanism 915 has a cooling passage 9150, and wherein the cooling mechanism 915 is held above the molding air blade 913. The copper layer 220 passing through the forming air blade 913 is drawn into the cooling passage 9150 of the cooling mechanism 915, the predetermined molten tin is completely cooled in the cooling passage 9150, and the tin layer 210 having the predetermined structure is formed on the copper layer 220. That is, the cooling mechanism 915 secondarily shapes the molten tin attached to the copper layer 220.

Specifically, the cooling mechanism 915 includes a cooling body 9151 and a wind shielding cover 9152, wherein the wind shielding cover 9152 is provided to the cooling body 9151, and the cooling passage 9150 is formed between the cooling body 9151 and the wind shielding cover 9152. The cooling body 9151 can produce cold wind, the cold wind flood in cooling channel 9150, pass through cooling channel 9150 the tin liquid on copper layer 220 surface is in cooling channel 9150 internal cooling, and then the formation has predetermine the structure the tin layer 210 in copper layer 220.

The cooling mechanism 915 further includes a plurality of air nozzles 9153, wherein a plurality of the air nozzles 9153 are disposed at intervals on the cooling main body 9151, and the air nozzles 9152 are communicated with the cooling main body 9151 and the cooling passage 9150. Utilize air cock 9152 will the cold air is blown to attached to copper layer 220 the tin liquid is concentrated, is favorable to the tin liquid rapid cooling, form fast and have the shape of predetermineeing tin layer 210. Preferably, the air nozzles 9153 are obliquely provided to the cooling body 9151 with their openings facing downward. Alternatively, the air nozzles 9153 may be obliquely provided to the cooling body 9151 in such a manner that the openings face upward.

In this embodiment of the present invention, the windshield 9152 of the cooling mechanism 915 is pivotally connected to the cooling body 915, so that an operator can timely check the molding condition of the tin layer 210 by rotating the windshield 9152, and further adjust the air outlet condition of the cooling body 9151, such as, but not limited to, the wind intensity and the air outlet temperature.

Referring to fig. 10, the tin layer molding apparatus 910 further includes a tin-coating guiding mechanism 916, wherein the tin-coating guiding mechanism 916 includes a lower guiding component 9161 and an upper guiding component 9162, wherein the lower guiding component 9161 is disposed below the tool tip 9134 of the molding air knife 913, and the upper guiding component 9162 is disposed above the cooling body 9151 of the cooling mechanism 915. The copper layer 220 is wound around the upper guide member 9162 and the lower guide member 9161, and the copper layer 220 sequentially passes through the tin heating space 9101 of the tin heating bath 911, the air outlet 9130 of the shaping air blade 913, and the cooling passage 9151 of the cooling mechanism 915 from bottom to top under the guide of the lower guide member 9161 and the upper guide member 9162.

It is noted that the lower guiding assembly 9161 is retained in the tin heating space 9101 of the tin heating bath 911, and the molten tin formed after melting is submerged in the lower guiding assembly 9161, so as to prevent the uncooled molten tin from being scraped off during the drawing movement.

Referring to fig. 10 and 14 to 17, in this particular embodiment of the tin layer molding apparatus 900 of the present invention, the automatic tin adding device 920 includes a tin block accommodating box 921, a guiding mechanism 922, and an impacting mechanism 923, wherein the tin block accommodating box 921 has a plurality of tin block outlets 92101 and a plurality of impacting ports 92102 communicated with the tin block accommodating chamber 9201. The slug outlet 92101 and the impact ports 92102 are located at the bottom of the slug accommodating cartridge 921, with each of the slug outlet 92101 and each of the impact ports 92102 opposing each other. The solder bump accommodating cavity 9201 is formed in the solder bump accommodating box 921, and the tinning chute 9202 is formed in the guide mechanism 922. The guide mechanism 922 is held on one side of the solder bump housing box 921 so that the solder-applying chute 9202 can be communicated with the solder bump outlet 92101 of the solder bump housing box 921. The striking mechanism 923 is held on the other side of the solder bump accommodating case 921 so as to correspond to the striking hole 92102.

Further, the tinning device 920 is held on one side of the tin layer molding device 910 in such a manner that the tinning chute 9202 of the guide mechanism 922 is communicated with the tin heating space 9101 of the tin heating bath 911. The tin ingot is located tin ingot export 92101 with strike between the mouth 92102, work as tin ingot export 92101 with strike mouth 92102 is corresponding to respectively the guiding mechanism 922 add tin spout 9202 with strike mechanism 923. Striking mechanism 923 passes through striking mouth 92102 striking the tin ingot holds in the chamber 9201 the tin ingot, the tin ingot certainly the tin ingot export 92101 gets into guiding mechanism 922 add tin spout 9202. The solder bumps enter the solder heating space 9101 of the solder heating bath 911 of the solder layer molding apparatus 910 along the solder feeding chute 9202 under the inertia effect.

More specifically, referring to fig. 14 to 17, the solder bump accommodating box 921 includes a bottom plate 9211, a front barrier 9212, a rear barrier 9213 opposite to the front barrier 9212, and two side barriers 9214 provided between the front barrier 9212 and the rear barrier 9213. The front barrier 9212, the rear barrier 9213, and the side barrier 9214 are provided to the bottom plate 9211, and the solder bump accommodating chamber 9102 is formed between the bottom plate 9211, the front barrier 9212, the rear barrier 9213, and the side barrier 9214. The solder bump outlet 92101 and the bump opening 92102 are formed at the bottom of the front barrier 9212 and the rear barrier 9213, respectively.

Further, a plurality of the solder bumps are stacked in the solder bump accommodating cavities 9201, and each row of the solder bumps corresponds to one solder bump outlet 92101. The solder bump outlet 92101 allows only one solder bump to pass through, i.e., the striking mechanism 923 strikes the solder bump positioned at the bottom one at a time to enter the solder heating space 9101 of the solder heating bath 911.

Preferably, striking mechanism 923 is implemented as an electric push rod, striking mechanism 923 is by electric drive ground flexible, and striking mechanism 923 is towards when the tin pig moves, it is right the tin pig produces striking effort, makes the tin pig certainly tin pig export 92101 leaves fast the tin pig holds chamber 9201. Optionally, the striking mechanism 923 extends and retracts in a hydraulic driving manner, and strikes the solder bumps into the solder heating space 9101 of the solder heating bath 911. Optionally, the striking mechanism 923 strikes the solder bumps or the like by oscillating. It should be understood by those skilled in the art that the specific manner in which the striking mechanism 923 drives the solder bumps into the solder heating space 9101 of the solder heating bath 911 is exemplary only and should not be construed as limiting the scope and content of the automated solder dispensing apparatus 920 of the present invention.

Preferably, the bottom plate 9211 has a bearing surface that is inclined to facilitate the solder bumps placed on the bearing surface of the bottom plate 9211 to rapidly leave the solder bump receiving cavities 9201 and enter the solder heating spaces 9101 of the solder heating bath 911 after being bumped.

Preferably, the bearing surface of the bottom plate 9211 is provided with concave-convex lines to avoid being arranged on the bearing surface of the bottom plate 9211 when the solder bumps are not impacted, the solder bumps do not slide into the solder heating space 9101 of the solder heating bath 911 by themselves.

In this particular embodiment of the present invention, the automatic tinning device 920 further comprises an actuating seat 924, wherein the solder ball containing cartridge 921 is drivably mounted to the actuating seat 924, and the guide mechanism 922 and the striking mechanism 923 are held on both sides of the solder ball containing cartridge 921 in such a manner as to be fixed to both sides of the actuating seat 924. The drive seat 924 can drive the tin ingot holds the box 921 along the movable track of drive seat 924 removes to make the difference the tin ingot export 92101 with striking mouth 92102 corresponds respectively the guiding mechanism 922 with striking mechanism 923, and then can with all tin ingots that the tin ingot held in the box 921 all add gradually the tin heating space 9101 of tin heating bath 911.

For example, when the solder ball containing box 921 is filled with solder balls, the solder ball containing box 921 corresponds to the guiding mechanism 922 and the striking mechanism 923 with the first solder ball outlet 92101 and the striking port 92102 on the rightmost side. When the solder bumps in the first row are completely inserted into the solder heating space 9101 of the solder heating bath 911, the driving seat 924 drives the solder bump accommodating box 921 to move towards the right, and the second solder bump outlet 92101 and the second solder bump outlet 92102 are made to correspond to the guiding mechanism 922 and the impacting mechanism 923. Thus, the striking mechanism 923 can strike the second column of solder bumps in the solder bump receiving box 921 into the solder heating space 9101 of the solder heating bath 911. Repeating this operation, all the solder bumps in the solder bump accommodating box 921 can be completely inserted into the solder heating space 9101 of the solder heating bath 911.

Specifically, referring to fig. 14 to 17, the driving seat 924 includes a driving element 9241, a carrying element 9242 and a guiding element 9243, wherein the carrying element 9242 has a moving space 92420, wherein the guiding element 9243 is retained in the moving space 92420, and wherein the solder ball containing box 921 is movably mounted to the carrying element 9242. The solder bump accommodating case 921 is drivably connected to the driving member 9241, and the driving member 9241 can drive the solder bump accommodating case 921 to reciprocate in the movement space along the extending direction of the guide member 9243.

Referring to fig. 18 to 19B, in another specific embodiment of the present invention, the guide mechanism 922 and the striking mechanism 923 are held at both sides of the solder bump accommodating box in such a manner as to be drivably mounted to the driving seat 924. The driving seat 924 can drive the guiding mechanism 922 and the striking mechanism 923 to synchronously move relative to the solder bump containing box 921. When the guiding mechanism 922 and the striking mechanism 923 correspond to the solder bumps outlet 92101 and the striking port 92102 at different positions, the striking mechanism 923 can add solder bumps in different columns to the solder heating space 9101 of the solder heating bath 911.

Specifically, the solder bump accommodating box 921 is fixed in the moving space 92420 of the carrying element 9242, the guiding mechanism 922 and the striking mechanism 923 are installed at two sides of the carrying element 9242, the carrying element 9242 is drivably installed on the driving element 9241, and the driving element 9241 can drive the carrying element 9242 and the guiding mechanism 922 and the striking mechanism 923 fixed to the carrying element 9242 to reciprocate relative to the solder bump accommodating box 921.

It should be understood by those skilled in the art that the specific movement of the automatic tin adding device 920 is merely exemplary and should not be construed as limiting the scope and content of the tin layer forming apparatus 900 of the present invention. It should be noted that, the specific implementation of the driving element 9241 of the driving base 924 is not limited, and the driving element 9241 of the driving base 924 can drive the solder bump accommodating box 921, the guiding mechanism 922 and the striking mechanism 923 to move through electric driving, hydraulic driving, gear driving or other manners known to those skilled in the art.

Preferably, the automatic tinning device 920 further comprises at least one shielding plate 925, wherein the shielding plate is held on one side of the solder ball containing box 921, the shielding plate 925 and the guiding mechanism 922 are located on the same side of the solder ball containing box 921, the shielding plate 925 shields the solder ball outlet 92101 formed at the bottom of the solder ball containing box 921, and only one solder ball outlet 92101 is exposed, and the solder ball contained in the solder ball containing box 921 is prevented from leaving the solder ball containing cavity 9201 from a position except for the tinning slide 9202 of the guiding mechanism 922.

In a specific embodiment of the present invention, the slug outlet 92101 may be implemented as one, and correspondingly, the impingement port 92102 may be implemented as one. The volume of the solder bump housing case 911 can be increased by increasing the number of the solder bump housing cases 911, increasing the number of the bump openings 92102, and the like.

It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily conceivable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A tin layer forming apparatus, comprising:

2. A tin layer forming apparatus according to claim 1, wherein the forming air knives blow air at intervals in such a manner as to maintain the same magnitude of wind force.

3. A tin layer forming apparatus according to claim 1, wherein the forming air knife blows air continuously in a manner of varying magnitude of wind force.

4. A tin layer forming apparatus according to claim 1, wherein the forming air knives are implemented in two, wherein the two forming air knives are disposed at intervals in such a manner that the air outlets are opposed, and the two forming air knives are symmetrically held above the tin heating bath.

5. A tin layer forming apparatus according to claim 1, wherein the forming air knives are implemented in two, wherein the two forming air knives are disposed at intervals in such a manner that the air outlets are opposed, and the two forming air knives are held above the tin heating bath in an offset manner.

6. A tin layer forming apparatus according to claim 1, wherein the forming air knife is held above the tin heating bath in such a manner that the air outlet is inclined downward.

7. A tin layer forming apparatus according to any one of claims 1 to 6, wherein the tin layer forming device further includes a horizontal driving mechanism, wherein the forming air knife is drivably mounted to the horizontal driving mechanism.

8. A tin layer forming apparatus according to any one of claims 1 to 6, wherein the tin layer forming device further includes a vertical driving mechanism, wherein the forming air knife is drivably mounted to the vertical driving mechanism.

9. A tin layer forming apparatus according to claim 7, wherein the tin layer forming device further includes a vertical driving mechanism and a mounting base, wherein the horizontal driving mechanism is provided to the mounting base, and the mounting base is drivably mounted to the vertical driving mechanism.

10. The tin layer forming apparatus as set forth in any one of claims 1 to 6, wherein the forming air knife includes a wind generating unit, an extension arm, a holding arm, and a cutter head, wherein the extension arm is provided to the wind generating unit, wherein one end of the holding arm is mounted to the extension arm, the other end of the holding arm is mounted to the cutter head, and the wind generating unit, the extension arm, the holding arm, and the cutter head communicate with each other, and the air outlet is formed in the cutter head.

11. A tin layer forming apparatus according to claim 10, wherein the holding arm of the forming air knife is detachably mounted to the extension arm, and the distance between the bit at the end of the holding arm and the extension arm is allowed to be adjusted.

12. A tin layer forming apparatus according to claim 10, wherein the holding arm of the forming air knife is rotatably mounted to the extension arm, the direction of the air outlet of the tool bit allowing for adjustment.

13. A tin layer forming apparatus according to claim 10, wherein the extension arm of the forming air knife is rotatably mounted to the wind generating unit.

14. The tin layer forming apparatus as claimed in any one of claims 1 to 6, wherein the tin layer forming device further includes a cooling mechanism, wherein the cooling mechanism has a cooling passage, wherein the cooling mechanism is held above the tin heating bath in such a manner that the cooling passage is communicated with the tin heating space.

15. A tin layer forming apparatus according to claim 14, wherein the cooling mechanism includes a cooling body, a wind shielding cover provided to the cooling body and forming the cooling passage between the cooling body and the wind shielding cover, and a plurality of gas nozzles provided at intervals to the cooling passage, the gas nozzles being communicated with the cooling body.

16. A tin layer forming apparatus according to claim 15, wherein the air nozzles are provided obliquely to the cooling body with the openings facing downward.

17. A tin layer forming apparatus according to claim 15, wherein the wind shielding cover of the cooling mechanism is pivotally connected to the cooling body.

18. A tin layer forming apparatus according to claim 14, wherein the tin layer forming device further includes a tin-coated guide mechanism, wherein the tin-coated guide mechanism includes a lower guide member and an upper guide member, wherein the lower guide member is disposed below the forming air knife, and the lower guide member is disposed in the tin heating space, wherein the upper guide member is disposed above the cooling mechanism.

19. A tin layer forming apparatus according to claim 1, wherein the guide mechanism is held obliquely to one side of the tin block accommodating box.

20. A tin layer forming apparatus according to claim 1, wherein a bottom surface of the guide mechanism defining the tinning chute is an inclined surface.

21. A tin layer forming apparatus according to claim 1, wherein the tin block outlet of the tin block accommodating box allows only one of the tin blocks to pass therethrough.

22. A tin layer forming apparatus according to claim 1, wherein the tin block accommodating box includes a bottom plate, a front barrier, a rear barrier opposed to the front barrier, and both side barriers disposed between the front barrier and the rear barrier, wherein the tin block outlet is formed at a bottom of the front barrier, wherein the bump port is formed at a bottom of the rear barrier, and wherein the bottom plate has a concavo-convex grain.

23. A tin layer forming apparatus in accordance with claim 22, wherein the bottom plate of the tin bar housing box has an inclined bearing surface.

24. A tin layer forming apparatus according to any one of claims 19 to 23, wherein the automatic tin adding device further includes a driving seat, wherein the tin block accommodating box is drivingly mounted to the driving seat, wherein the tin block accommodating box has a plurality of the tin block outlet ports spaced apart from each other and a plurality of the bump outlet ports spaced apart from each other, wherein the guide mechanism and the bump mechanism are held on both sides of the tin block accommodating box in such a manner as to be fixed to the driving seat, and the driving seat is capable of driving the tin block accommodating box to move relative to the guide mechanism and the bump mechanism.

25. A tin layer forming apparatus in accordance with claim 24, wherein the automated tinning means further comprises a shutter, wherein the shutter is held to one side of the tin containing cartridge, the shutter and the guide mechanism being located on the same side of the tin containing cartridge, the shutter allowing only one of the tin outlet ports to be exposed.

26. A tin layer forming apparatus according to any one of claims 19 to 23, wherein the automatic tin adding device further includes a driving seat, wherein the guide mechanism and the striking mechanism are held on both sides of the tin bar housing box in such a manner as to be drivably mounted to the driving seat, the tin bar housing box having a plurality of the tin bar outlet openings spaced apart from each other and a plurality of the striking openings spaced apart from each other, wherein the driving seat is capable of driving the guide mechanism and the striking mechanism to move synchronously relative to the tin bar housing box.

27. A tin layer forming apparatus according to any one of claims 19 to 23, wherein the striking mechanism pushes the tin slug in a manner selected from the group consisting of: the electric drive telescopic impact, the hydraulic drive telescopic impact and the swing impact.