CN112246909A

CN112246909A - Solder strip manufacturing equipment

Info

Publication number: CN112246909A
Application number: CN202010833064.5A
Authority: CN
Inventors: 孙益民
Original assignee: Zhejiang Huichuang Intelligent Equipment Co ltd; Ningbo Linyuan Optoelectronics Technology Co ltd
Current assignee: Zhejiang Huichuang Intelligent Equipment Co ltd; Ningbo Linyuan Optoelectronics Technology Co ltd
Priority date: 2020-08-18
Filing date: 2020-08-18
Publication date: 2021-01-22
Also published as: CN216027182U; CN215879302U; CN216027178U; CN216705509U; CN216027181U; CN216027179U; CN216027184U; CN114074131A; CN216655830U; CN114074134A; CN216027183U; WO2022037593A1; CN114074132A; CN216027180U; CN114074133A

Abstract

The invention discloses a welding strip manufacturing device, which comprises a pay-off device, wherein the pay-off device comprises a driving main body, a bearing main body and a fastening main body detachably mounted on the bearing main body, the bearing main body is provided with a limiting inclined plane, the fastening main body is provided with a fastening inclined plane, and the limiting inclined plane of the bearing main body is opposite to the fastening inclined plane of the fastening main body so as to fixedly mount a copper wire coil with different channel diameters.

Description

Solder strip manufacturing equipment

Technical Field

The invention relates to the field of welding strips, in particular to welding strip manufacturing equipment.

Background

The solder strip has good conductivity and is applied to connection of the photovoltaic module and the cell. For example, a plurality of solar cells are connected by solder strips, so that the plurality of solar cells can perform energy conversion and electric quantity transmission. Specifically, the solder strip comprises a copper layer and two tin layers formed on the upper surface and the lower surface of the copper layer respectively, the tin layers of the solder strip are welded on the solar cells in the using process so as to connect the solar cells in series or in parallel, a complete electric path can be formed between the solar cells after the solar cells are connected to the junction box, then the solar cells convert solar energy into electric energy in the using process, and the generated current can be transmitted through the solder strip. The quality of the solder strip directly affects the solar energy collection efficiency of the photovoltaic module, and the manufacturing equipment and the manufacturing method of the solder strip directly affect the quality and the production efficiency of the solder strip.

Disclosure of Invention

An object of the present invention is to provide a solder strip manufacturing apparatus for efficiently producing a photovoltaic solder strip, which is advantageous for improving the production efficiency of the photovoltaic solder strip, reducing the production cycle of the photovoltaic solder strip, and reducing the labor cost.

In accordance with one aspect of the present invention, there is provided a solder strip manufacturing apparatus comprising:

a pay-off device, wherein the pay-off device comprises a driving body, a bearing body and a fastening body detachably mounted on the bearing body, wherein the bearing body has a limit inclined surface, the fastening body has a fastening inclined surface, and the limit inclined surface of the bearing body is opposite to the fastening inclined surface of the fastening body.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further includes a molding device, wherein the molding device includes at least one molding unit, wherein the molding unit includes a molding body and a molding die, the molding die has a molding space, and the molding die is detachably disposed on the molding body.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further comprises a pressing device, wherein the pressing device comprises a power body and a pressing body driveably connected to the power body, wherein the pressing body has a pressing space.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further includes an annealing device, wherein the annealing device includes a positive electrode wheel, a negative electrode wheel, a protection body, a cooling body, and a drying body, wherein the protection body has a protection channel, wherein the cooling body has a liquid containing tank, wherein the drying body has a drying channel, the positive electrode wheel and the negative electrode wheel allow current to pass through, the protection body is disposed between the positive electrode wheel and the negative electrode wheel, and the negative electrode wheel is disposed in the liquid containing tank of the cooling body, and the drying body is disposed above the cooling body.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further includes a tin layer forming device, wherein the tin layer forming device includes a tin accommodating pool and at least one air blowing main body, wherein the air blowing main body has an air outlet, and the air blowing main body is held above the tin accommodating pool.

According to an embodiment of the present invention, the solder ribbon manufacturing apparatus further includes an automatic tinning device, wherein the automatic tinning device includes a receiving body, an impact body, and a guiding body, wherein the receiving body has a receiving cavity, a solder bump outlet communicated with the receiving cavity, and a pushing port, wherein the solder bump outlet is opposite to the pushing port, wherein the solder bump outlet and the pushing port are located at a bottom of the receiving body, and the impact body is disposed at one side of the receiving body in a manner corresponding to the pushing port of the receiving body.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further includes an automatic wire rewinding device, wherein the automatic wire rewinding device includes a driving mechanism, a rotating body, at least two rotating shafts, and a control body, wherein the control body is communicably connected to the driving mechanism, the rotating body, and the rotating shafts, the rotating body and the rotating shafts are drivably rotatably connected to the driving mechanism, and the rotating shafts are disposed at intervals on the rotating body.

an automatic tin adding device, wherein the automatic tin adding device comprises a containing body, an impact body and a guiding body, wherein the containing body is provided with a containing cavity, a tin block outlet and a pushing opening, the tin block outlet is communicated with the containing cavity, the tin block outlet is opposite to the pushing opening, the tin block outlet and the pushing opening are positioned at the bottom of the containing body, and the impact body is arranged on one side of the containing body in a mode corresponding to the pushing opening of the containing body.

an automatic wire take-up device, wherein the automatic wire take-up device comprises a driving mechanism, a rotating body, at least two rotating shafts and a control body, wherein the control body is communicably connected to the driving mechanism, the rotating body and the rotating shafts are drivably and rotatably connected to the driving mechanism, and the rotating shafts are arranged at intervals on the rotating body.

Drawings

FIG. 1 is a schematic diagram of a solder strip manufacturing apparatus according to a preferred embodiment of the present invention.

FIG. 2A is a schematic diagram illustrating a wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2B is an exploded view of the wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2C is a schematic sectional view of the wire releasing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 2D is a schematic view of an application of the wire releasing device of the solder strip manufacturing apparatus according to the preferred embodiment of the present invention.

FIG. 2E is a schematic view of an application of the wire releasing device of the solder strip manufacturing apparatus according to the preferred embodiment of the present invention.

Fig. 3A is a schematic structural diagram of a molding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3B is a schematic cross-sectional view of a forming unit of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3C is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3D is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3E is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3F is a schematic diagram of a stage of the forming process of the forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4A is a schematic structural diagram of a pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4B is an exploded view schematically illustrating the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4C is a schematic sectional view of the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4D is a schematic diagram of a stage of the pressing process of the pressing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 5A is a schematic structural diagram of an annealing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 5B is a schematic diagram illustrating the application of the annealing device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 6A is a schematic diagram illustrating a structure of a flux covering device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the invention.

Fig. 6B is an exploded view of the flux covering device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7A is a schematic structural diagram of a tin layer forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7B is a schematic structural diagram of the tin layer forming device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7C is a schematic diagram of a stage of the tin coating process of the tin layer forming device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7D is a schematic diagram of a stage of the tin coating process of the tin layer forming device of the solder ribbon manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8A is a schematic structural diagram of an automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8B is a schematic structural diagram of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8C is a schematic structural diagram of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8D is a schematic view showing the application of the automatic tin adding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9A is a schematic structural diagram of a wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9B is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9C is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 9D is a schematic diagram of a stage of the wire rewinding process of the wire rewinding device of the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1 to 9D of the specification, a solder ribbon manufacturing apparatus 100 according to a preferred embodiment of the present invention will be described in the following description, wherein the solder ribbon manufacturing apparatus 100 is capable of efficiently producing a photovoltaic solder ribbon 200, improving the production efficiency of the photovoltaic solder ribbon 200, reducing the labor cost for producing the photovoltaic solder ribbon 200, and shortening the production cycle of the photovoltaic solder ribbon 200.

The photovoltaic solder ribbon 200 includes a copper layer 201 and a solder layer 202 formed on the surface of the copper layer 201. The photovoltaic solder strip 200 has a concave-convex surface, so that the welding area and the light reflection area of the photovoltaic solder strip 200 are increased, and the reliability and the light reflection rate of the photovoltaic solder strip 200 are improved.

Referring to fig. 2A to 2E, the solder ribbon manufacturing apparatus 100 includes a wire releasing device 10, wherein the wire releasing device 10 is adapted to fix copper wire trays 300 of different sizes. The copper wire coil 300 comprises a wire coil 301 and a copper wire 302 wound on the outer wall of the wire coil 301, the wire coil 301 is provided with a mounting channel 303, and the wire coil 301 is fixed on the paying-off device 10. The paying-off device 10 can drive the wire spool 301 to rotate, so that the paying-off operation is carried out in the rotating process, and the copper wire 302 is pulled to leave the wire spool 301. The copper wire 302 subsequently forms the copper layer 201 of the photovoltaic solder ribbon 200.

Specifically, the paying-off device 10 includes a driving body 110, a carrier body 120, and a fastening body 130 detachably mounted to the carrier body 120, wherein the carrier body 120 is drivably disposed on the driving body 110, the copper wire coil 300 is detachably mounted to the carrier body 120, and the carrier body 120 is held in the mounting passage 303 of the wire coil 301 of the copper wire coil 300. The fastening body 130 is detachably mounted to the carrier body 120 and fixes the wire spool 301 of the copper wire coil 300 to the carrier body 120. The driving body 110 can drive the bearing body 120 to rotate, so as to drive the copper wire coil 300 and the fastening body 130 disposed on the bearing body 120 to rotate. The copper wire 302 leaves the wire spool 301 during rotation.

The bearing body 120 includes a position-limiting portion 121 and a bearing shaft 122 extending outward from the position-limiting portion 121, wherein the position-limiting portion 121 has a position-limiting inclined surface 1201. The fastening body 130 includes a fastening portion 131 and a fitting portion 132 extending outward from the fastening portion 131, wherein the fastening portion 131 has a fastening slope 1301. The copper wire coil 300 is fixed between the carrier body 120 and the fastening body 130 so as to be disposed on the stopper slope 1201 of the stopper portion 121 and the fastening slope 1301 of the fastening portion 131.

The copper wire coil 300 is sleeved on the bearing shaft 122 in a manner that the mounting channel 303 of the wire coil 301 corresponds to the bearing shaft 122 of the bearing main body 120, and one end of the wire coil 301 defining the inner wall of the mounting channel 303 is abutted against the limiting inclined surface 1201 of the limiting portion 121 of the bearing main body 120.

The carrier body 120 further includes a mounting shaft 123, wherein the mounting shaft 123 extends outwardly from the carrier shaft 122. The fastening body 130 further has a fitting opening 1302 and a fitting channel 1303 communicated with the fitting opening 1302, wherein the fastening body 130 is detachably mounted to the carrying body 120 in such a manner that the fitting opening 1302 corresponds to the fitting shaft 123 of the carrying body 120. The end of the bearing shaft 122 of the bearing body 120 is held in the fitting channel 1303 of the fastening body 130, and the fitting shaft 123 is held in the fitting opening 1302 of the fastening body 120. The fastening portion 131 of the fastening body 130 is inserted into the mounting channel 303 of the wire spool 301, and the fastening slope 1301 of the fastening portion 131 of the fastening body 130 is abutted against the other end of the inner wall of the wire spool 301 defining the mounting channel 303.

That is, the stopper slope 1201 of the stopper portion 121 of the carrier body 120 and the fastening slope 1301 of the fastening portion 131 of the fastening body 130 apply an inward acting force to the wire spool 301 of the wire spool 300 so that the wire spool 300 is fixed between the stopper slope 1201 of the stopper portion 121 and the fastening slope 1301 of the fastening portion 131.

The position-limiting portion 121 of the bearing body 120 has a high end and a low end, and the position-limiting inclined plane 1201 is formed between the high end and the low end. That is, the longitudinal cross-sectional area of the stopper portion 121 of the carrier body 120 gradually decreases from the high end portion to the low end portion of the stopper portion 121. Preferably, the limiting portion 121 is a circular truncated cone structure. The bearing shaft 122 extends outward from the lower end of the limiting portion 121.

The fastening part 131 of the fastening body 130 has an upper end and a lower end, and the fastening slope 1301 is formed between the upper end and the lower end of the fastening part 131. That is, the longitudinal sectional area of the fastening portion 131 of the fastening body 130 gradually increases in a direction from the lower end portion 1302 to the upper end portion. The fitting part 132 of the fastening body 130 extends outward from the upper end of the fastening part 131. Preferably, the fastening portion 131 of the fastening body 130 has a circular truncated cone structure.

It is worth mentioning that the stopper portion 121 and the fastening portion 131 having inclined surfaces can fix the wire spool 301 of the mounting channel 303 having different diameters. For example, the wire spool 301 having the mounting channel 303 with a large size is abutted against the high end portion near the stopper portion 121 and the upper end portion of the fastening portion 131, and the wire spool 301 having the mounting channel 303 with a small size is abutted against the low end portion near the stopper portion 121 and the lower end portion of the fastening portion 131. In this way, the paying-off device 10 can be adapted to fix the copper wire coil 300 having the mounting passages 303 of different sizes.

The pay-off device 10 further includes a pay-off guide assembly 140, wherein the pay-off guide assembly 140 is held above the carrier body 120 and the fastening body 130. The copper wires 302 of the copper wire coil 300 mounted to the carrier body 120 and the fastening body 130 are wound around the wire unwinding guide 140, and the movement of the copper wires 302 is stably guided by the wire unwinding guide 140.

Referring to fig. 3A to 3F, the solder ribbon manufacturing apparatus 100 further includes a molding device 20, wherein the molding device 20 is disposed at one side of the wire unwinding device 10, and the copper wire 302 passing through the wire unwinding device 10 is drawn through the molding device 20. And, the copper wire 302 passing through the molding apparatus 20 forms the copper layer 201 having a cross section of a predetermined shape.

In this particular embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 having the cross section of the predetermined shape by wire drawing. Specifically, the molding device 20 includes a plurality of molding units 210, wherein the molding units 210 have a molding space 2101, and the cross section of the molding space 2101 is the preset shape. After the copper wire 302 is drawn to pass through the molding space 2101 of each molding unit 210 in sequence, the copper layer 201 having the cross-section of the predetermined shape is formed.

The molding unit 210 includes a molding body 211 and a molding die 212, wherein the molding body 211 has an inlet 2111, an outlet 2112, and a receiving space 2113 communicating with the inlet 2111 and the outlet 2112, and the molding space 2101 is formed in the molding die 212. The molding die 212 is detachably mounted to the accommodating space 2113 of the molding body 211, and the molding space 2101 of the molding die 212 is communicated with the inlet 2111, the accommodating space 2113 and the outlet 2112 of the molding body 211.

The copper wire 302 is drawn from the inlet 2111 of the molding main body 211 into the molding space 2101 of the imaging mold 212 placed in the accommodating space 2113, and the copper wire 302 entering the molding mold 212 is compressed by an external force and is capable of forming the copper layer 201 having the predetermined shape in cross section.

In a specific embodiment of the present invention, the number of the forming units 210 is four, the cross section of the forming space 2101 of the forming unit 210 is a pentagon, the copper wire 302 is compressed once in each forming space 2101, and the copper wire 201 with the cross section of the predetermined shape is formed after four drawing processes.

It should be noted that the specific number of the forming units 210 is not limited, and the forming units 210 may be implemented as one, two, three, five or more numbers. Also, a specific shape of the molding space 2101 of the molding unit 210 is not limited, and the cross-sectional shape of the molding space 2101 may be implemented as a triangle, a trapezoid, a hexagon, or other shapes, etc. By replacing the molding die 212 having the molding space 2101 of different shapes, the copper layer 201 of different cross-sectional shapes can be obtained. The specific embodiment of the molding unit 210 is only an example and should not be construed as limiting the content and scope of the solder strip manufacturing apparatus 100 and the molding device 20 of the present invention.

In a specific embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 with the predetermined cross-section shape by means of punch forming. In an embodiment of the present invention, the forming device 20 forms the copper wire 302 into the copper layer 201 having a cross section with a predetermined shape by rolling. It should be understood by those skilled in the art that the specific embodiment of the copper wire 302 forming the copper layer 201 is merely illustrative and should not be construed as limiting the scope and content of the solder ribbon manufacturing apparatus 100 and the manufacturing method thereof according to the present invention.

The forming device 20 further comprises a forming guide assembly 220, wherein the forming guide assembly 220 is disposed around the forming body 210, and the copper wire 302 passing through the drawing assembly 140 of the paying-off device 10 is guided to pass through the forming body 211 and the forming mold 212 of each forming unit 210 in turn under the action of the forming guide assembly 220 of the forming device 20.

Referring to fig. 4A to 4D, the solder strip manufacturing apparatus 100 further includes a pressing device 30, wherein the pressing device 30 is disposed at one side of the forming device 20, and the copper layer 201 passing through the forming device 20 is drawn through the pressing device 30. And, the copper layer 201 passing through the pressing device 30 forms a structure having a concave-convex surface.

Specifically, the pressing device 30 includes a power body 310 and a pressing body 320 drivably connected to the power body 310, wherein the pressing body 320 has a pressing space 3201, the copper layer 201 passing through the forming device 20 is drawn into the pressing space 3201 of the pressing body 320, and the pressing body 320 presses the copper layer 201 entering the pressing space 3201.

In this particular embodiment of the present invention, the pressing body 320 includes two pressing wheels 321, wherein the two pressing wheels 321 are disposed one above the other and the pressing space 3201 is formed between the two pressing wheels 321. The distance between the two pressing wheels 321 is allowed to be adjusted, and the size of the pressing space 3201 may be adjusted, thereby enabling the copper layer 201 passing through the pressing space 3201 to form a structure having a concave-convex surface.

Specifically, at least one of the two pressing wheels 321 is drivably connected to the power body 310, and the power body 310 drives the at least one pressing wheel 321 to move up and down, thereby changing the distance between the two pressing wheels 321.

When the distance between the two pressing wheels 321 is smaller than the thickness of the copper layer 201, the copper layer 201 drawn from the molding device 20 to the pressing device 30 is pressed by the pressing wheels 321, and the thickness of the pressed portion is reduced. When the power body 310 drives the pressing wheels 321 to move, and the distance between the two pressing wheels 321 is increased, and the distance between the two pressing wheels 321 is greater than the thickness of the copper layer 210, the copper layer 210 can pass through without being pressed, that is, the thickness of the copper layer 210 does not change. The size of the pressing space 3201 is changed by driving the pressing wheel 321 to move up and down, thereby manufacturing the copper layer 201 having a concave-convex surface.

The embodiment of the pressing body 320 is not limited, and the two pressing wheels 321 of the pressing body 320 may be oppositely disposed left and right, and the power body 310 drives at least one pressing wheel 321 to move left and right. Alternatively, the pressing body 320 presses the copper layer 201 by rolling. Alternatively, the pressing body 320 presses the copper layer 201 by means of pressing. Alternatively, the pressing body 320 presses the copper layer 201 by means of stamping. It should be understood by those skilled in the art that the specific embodiment of the pressing body 320 is merely exemplary and should not be construed as limiting the scope and content of the manufacturing apparatus 100 and the manufacturing method thereof.

Preferably, the power body 310 drives the pressing wheel 321 to move through an electric driving manner. Preferably, the power body 310 drives the pressing wheel 321 to move through an electric driving manner. Preferably, the power body drives the pressing wheel 321 to move through a hydraulic driving mode. Alternatively, the power body 310 drives the pressing wheel 321 to move through a gear driving manner. It should be noted that the specific embodiment of the power body 310 driving the pressing wheel 321 to move is only an example, and is not intended to limit the content and scope of the welding strip manufacturing apparatus 100 and the manufacturing method thereof.

The pressing device 30 further includes a cooling body 330, wherein the cooling body 330 is disposed on the pressing body 320, and the cooling body 330 cools the pressing body 320 to prevent the quality of the solder strip 200 from being affected by the overhigh surface temperature of the pressing body 320.

Specifically, the cooling body 330 further includes at least one cooling portion 331 and at least one mounting portion 332, wherein the cooling portion 331 has a cooling channel 3311, and the mounting portion 332 is disposed on the cooling portion 331. The pressing wheel 321 of the pressing body 30 has a flow path 3211, wherein the mounting portion 332 is mounted to the pressing wheel 321, and the flow path 3211 of the pressing wheel 321 is communicated with the cooling path 3311 of the cooling portion 331. The cooling liquid in the cooling passage 3311 of the cooling portion 331 circularly flows into the circulation passage 3211 of the pressing wheel 321 and takes away heat of the pressing wheel 321 to lower the temperature of the surface of the pressing wheel 321.

The pressing apparatus 30 further includes a pressing guide assembly 340, wherein the pressing guide assembly 340 is disposed around the pressing main body 320, and the pressing guide assembly 340 stably guides the copper layer 201 into and out of the pressing space 3201 of the pressing main body 320.

Referring to fig. 5A and 5B, the solder strip manufacturing apparatus 100 further includes an annealing device 40, wherein the annealing device 40 is disposed at one side of the pressing device 30, and the annealing device 40 anneals the copper layer 201 after the pressing device 30.

The annealing device 40 includes a positive electrode wheel 410, a negative electrode wheel 420, a protection body 430, a temperature reduction body 440 and a drying body 450, wherein the protection body 430 has a protection channel 4301, wherein the temperature reduction body 440 has a liquid tank 4401, and wherein the drying body 450 has a drying channel 4501.

The protection body 430 is disposed between the positive wheel 410 and the negative wheel 420, and the copper layer 201 passing through the pressing space 3201 of the pressing device 30 is wound around the positive wheel 410. The copper layer 201 passing through the positive electrode wheel 410 enters the protection channel 4301 of the protection body 430 and is wound around the negative electrode wheel 420. An electric current passes between the positive electrode wheel 410 and the negative electrode wheel 420, thereby increasing the temperature of the copper layer 201 connected between the positive electrode wheel 410 and the negative electrode wheel 420.

Further, the protection channel 4301 of the protection body 430 contains a protection gas to prevent the copper layer 201 from being oxidized at a high temperature. Preferably, the protection channel 4301 of the protection device 430 contains an inert gas, such as but not limited to nitrogen.

Further, the liquid containing groove 4401 of the cooling body 440 contains a cooling liquid, the negative wheel 420 is disposed in the liquid containing groove 4401 of the cooling body 440, the copper layer 201 is drawn through the cooling liquid in the solution groove 4401 of the cooling body 440, and the heated copper layer 201 is cooled in the cooling liquid.

The copper layer 201 passing through the cooling liquid is drawn into the drying space 4501 of the drying body 450, and the drying body 450 removes the liquid from the surface of the copper layer 201, so that the surface of the copper layer 201 passing through the drying body 450 is dried, facilitating the subsequent process. Preferably, the drying body 450 dries the copper layer 201 by blow-drying the surface of the copper layer 201. For example, a plurality of air knives are disposed in the drying space 4501, and the air knives generate wind to dry the moisture on the surface of the copper layer 201. Alternatively, the drying body 450 dries the copper layer 201 by adsorbing the surface moisture of the copper layer 201. It should be understood by those skilled in the art that the specific embodiment of the drying body 450 for extracting the moisture from the surface of the copper layer 201 is only an example and is not intended to limit the content and scope of the solder strip manufacturing apparatus 100 of the present invention.

The annealing apparatus 40 further includes an annealing guide element 460, wherein the annealing guide element 460 is disposed around the positive electrode wheel 410, the negative electrode wheel 420, the protective body 430, the temperature reduction body 440, and the drying body 450 to guide the copper layer 201 stably through the positive electrode wheel 410, the negative electrode wheel 420, the protective body 430, the temperature reduction body 440, and the drying body 450. Preferably, the annealing guide assembly 460 is capable of controlling the speed of movement of the copper layer 201.

Referring to fig. 6A and 6B, the solder ribbon manufacturing apparatus 100 further includes a flux covering device 50, wherein the flux covering device 50 is disposed at one side of the annealing device 40, and the flux covering device 50 covers a flux on the surface of the copper layer 201, so as to protect the copper layer 201 and prevent the copper layer 201 from oxidation reaction.

Specifically, the flux covering device 50 includes a protection housing 510 and a spraying body 520, wherein the protection housing 510 has a maintaining space 5101, a maintaining inlet 5102 and a maintaining outlet 5103 which are communicated with the maintaining space 5101, the spraying body 520 has a spraying opening, and the spraying body 520 is disposed above the protection housing 510 in a manner that the spraying opening faces the maintaining space 5101 of the protection housing 510. The copper layer 201 passing through the annealing device 40 is drawn from the maintenance inlet 5102 into the maintenance space 5101 of the protective shell 510, and a flux contained in the spraying body 520 enters the maintenance space 5101 of the protective shell 510 from the spraying opening of the spraying body 520 and covers the surface of the copper layer 201 to form a flux film on the surface of the copper layer 201, so that the performance of the photovoltaic solder strip 200 is improved. The copper layer 201, on which the fluxing film is formed, is drawn away from the maintenance vent 5103.

Preferably, the shielding shell is disposed obliquely, which facilitates the flux to uniformly cover the surface of the copper layer 201.

It is worth mentioning that the kind of the flux is not limited, and the flux may be implemented as liquid or solid powder, etc. Preferably, the spraying body 520 is used for covering the soldering flux on the surface of the copper layer 201 by spraying.

The flux covering device 50 further includes a protective cover 530, wherein the protective cover 530 has a flow opening 5301, and the protective cover 530 is disposed on the protective housing 510 in such a manner that the flow opening 5301 is communicated with the protective housing 510. The protective cover 530 shields the maintaining space 5101 of the protective housing 510, and prevents the flux sprayed from the spraying opening of the spraying body 520 from splashing to the external environment.

Specifically, the spraying body 520 has a flux containing box 521 and at least one guide tube 522 communicated with the containing space of the column welding containing box 521, and the spraying port is formed in the guide tube 522. The guide pipe 522 extends downward from the receiving portion 521 to the maintaining space 5101 of the shield case 510, and the guide pipe 522 is located at the circulation port 5301 of the shield cover 530 in such a manner that the spray port is communicated with the maintaining space 5101 of the shield case 510. The spray opening of the guide tube 522 is located below the circulation opening 5301 of the protective cover 530. When the guiding tube 522 sprays the flux toward the copper layer 201 in the maintaining space 5101 of the protective housing 510, the splashed flux is blocked by the protective cover 530 and cannot splash into the external environment, which is beneficial to reducing waste of flux and avoiding pollution to the environment.

It should be noted that the specific number of the guiding tubes 522 is not limited, and the guiding tubes 522 may be implemented as one, by covering the flux on the surface of one copper layer 201 through one guiding tube 522, or by covering the flux on the surfaces of two or more copper layers 201 through one guiding tube 522. The guiding pipes 522 may also be implemented in two or more numbers, wherein each guiding pipe 522 corresponds to one copper layer 201, so as to spray the flux on two or more numbers of copper layers 201 at the same time.

The flux covering device 50 further includes a flux guide assembly 540, wherein the flux guide assembly 540 is disposed around the protective casing 510, and the flux guide assembly 540 guides the copper layer 201 from the maintenance inlet 5102 into the maintenance space 5101 of the protective casing 510 and pulls the copper layer 201 away from the maintenance outlet 5103 after a flux film is formed.

Referring to fig. 7A to 7D, the solder ribbon manufacturing apparatus 100 further includes a tin layer forming device 60, wherein the tin layer forming device 60 is disposed at one side of the flux covering device 50, and the tin layer 202 is formed on the surface of the copper layer 201 after the copper layer 201 passing through the flux covering device 50 passes through the tin layer forming device 60.

Specifically, the tin layer forming device 60 includes a tin containing pool 610 and a heating body 620, wherein the tin containing pool 610 has a containing space 6101, the heating body 620 is disposed in the tin containing pool 610, and the heating body 620 can melt a tin block entering the containing space 6101 in the containing space 6101. The copper layer 201 passing through the soldering flux covering device 50 is drawn into the accommodating space 6101 of the tin accommodating pool 610, and the melted tin covers the surface of the copper layer 201, and then the tin layer 202 is formed.

The tin layer forming device 60 further includes at least one blowing main body 630, wherein the blowing main body 630 is disposed above the tin containing tank 610, and the blowing main body 630 has an air outlet 6301. The copper layer 201 covered by tin is pulled to pass through the air blowing main body 630, the air outlet 6301 of the air blowing main body 630 faces the copper layer 201, the air blowing main body 630 generates wind power from the air outlet 6301 and blows the tin covering the copper layer 201, so that the tin covering the surface 201 of the copper layer has different thicknesses, which is beneficial to improving the performance of the photovoltaic solder strip 200.

The tin layer forming device 60 further includes at least one cooling forming body 640, wherein the cooling forming body 640 is disposed above the blowing body 630, and wherein the cooling forming body 640 has a cooling forming passage 6401. The copper layer 201 passing through the air outlet 6301 of the air blowing main body 630 is drawn into the cooling molding passage 6401 of the cooling molding main body 640, and the tin covering the copper layer 201 is cooled in the cooling molding passage 6401, thereby forming the tin layer 202 on the copper layer 201. Preferably, a plurality of air knives are arranged in the cooling and forming channel 6401, and the air generated by the air knives carries away the heat of the tin, so that the tin is cooled and formed on the copper layer 201, and the photovoltaic solder strip 200 is further manufactured.

The tin layer forming apparatus 60 further includes a tin coating guide assembly 650, wherein the tin coating guide assembly 650 is disposed around the tin containing pool 610, the blowing main body 630 and the cooling forming main body 640, and the tin coating guide assembly 650 guides the cooling forming space 6401 passing through the containing space 6101 of the tin containing pool 610, the blowing port 6301 of the blowing main body 630 and the cooling forming main body 640 in sequence.

Referring to fig. 8A to 8D, the solder strip manufacturing apparatus 100 further includes an automatic tin adding device 70, wherein the automatic shelf device 70 is disposed at one side of the tin containing pool 610 of the tin forming device 60, and the automatic tin adding device 70 can automatically add the tin block into the containing space 6101 of the tin containing pool 610, so that the tin adding safety is improved, and the labor cost is also saved.

Specifically, the automatic tin adding device 70 includes a receiving main body 710, an impact main body 720, a guiding main body 730 and a power mechanism 740, wherein the receiving main body 710 has a receiving cavity 7101, a plurality of spaced tin block outlets 7102 communicated with the receiving cavity 7101 and a plurality of spaced pushing ports 7103, wherein the tin block outlets 7102 are opposite to the pushing ports 7103, and the guiding main body 730 has a guiding groove 7301. The slug outlet 7102 and the push port 7103 are located at the bottom of the containment body 710. The striking body 720 and the guide body 730 are respectively held at both sides of the receiving body 710. The striking body 720 and the guide body 730 correspond to each other, and the striking body 720 and the guide body 730 can correspond to the solder bump outlet 7102 and the push port 7103, respectively. The guiding groove 7301 of the guiding body 730 can be communicated with the accommodating space 6101 of the tin accommodating pool 610 of the tin layer molding device 60 and the accommodating cavity 7101 of the accommodating body 710.

The size of the solder bump outlet 7102 only allows one solder bump to pass through, the impact main body 720 can impact the solder bumps corresponding to the solder bump outlet 7102 and the pushing port 7103 and enter the guide groove 7301 of the guide main body 730 from the solder bump outlet 7102, the solder bumps enter the accommodating space 6101 of the solder accommodating pool 610 from the guide groove 7301, and the solder bumps are melted after being heated. The solder bumps are placed inside the containing cavity 7101 of the containing body 710 in an overlapped manner, and the striking body 720 in turn strikes the solder bumps into the containing space 6101 of the solder containing pool 610.

In one embodiment of the invention, the impact body 720 is implemented as an electric push rod, the impact body 720 is driven to extend and retract and generate an impact force on the solder bump when the impact body 720 moves toward the solder bump, so that the solder bump rapidly exits the receiving cavity 7101 from the solder bump outlet 7102. Optionally, the striking body 720 extends and retracts in a hydraulic driving manner, and strikes the solder bump into the accommodating space 6101 of the solder accommodating pool 610. Alternatively, the striking body 720 strikes the solder bump or the like by means of oscillation. It should be understood by those skilled in the art that the specific manner in which the striking body 720 drives the solder bumps into the receiving space 6101 of the tin receiving pool 610 is merely exemplary and should not be construed as limiting the scope and content of the solder ribbon manufacturing apparatus 100 and the method of manufacturing the same.

Preferably, the accommodating main body 710 is movably and drivably disposed on the power mechanism 740, and the power mechanism 740 is capable of driving the accommodating main body 710 to move left and right, so that the different solder bump outlets 7102 and the pushing openings 7103 of the accommodating main body 710 respectively correspond to the guiding main body 730 and the striking main body 720, and thus the solder bumps in the accommodating main body 710 can be automatically pushed into the accommodating space 6101 of the solder accommodating pool 610.

Referring to fig. 9A to 9D, the solder ribbon manufacturing apparatus 100 further includes an automatic take-up device 80, wherein the automatic take-up device 80 is disposed at one side of the tin layer forming device 60, the photovoltaic solder ribbon 200 manufactured after passing through the cooling forming passage 6401 of the cooling forming body 640 of the tin layer forming device 60 is drawn through the automatic take-up device 80, and the automatic take-up device 80 automatically receives the photovoltaic solder ribbon into a solder ribbon reel.

Specifically, the automatic wire rewinding device 80 includes at least one driving mechanism 810, a rotating body 820, at least two rotating shafts 830, and at least two wire rewinding disks 840, wherein the rotating body 820 and the rotating shafts 830 are rotatably and drivably connected to the driving mechanism 810, wherein the two rotating shafts 830 are adjacently disposed on the rotating body 820, and wherein the wire rewinding disks 840 are detachably mounted on the rotating shafts 830.

The photovoltaic solder ribbon 200 manufactured after passing through the cooling molding passage 6401 is drawn through the take-up reel 840 of the automatic take-up device 80, and the driving body 820 drives the rotating shaft 830 to rotate, so that the photovoltaic solder ribbon 200 is wound around the take-up reel 840 rotating along with the rotating shaft 830.

The automatic wire takeup device 80 further includes a control body 850, wherein the control body 850 is communicatively coupled to the drive mechanism 810 and the rotating shaft 830. When the amount of the photovoltaic solder strip 200 disposed on the take-up reel 840 reaches a predetermined standard, the driving mechanism 810 is controlled to rotate, so as to change the take-up reel 840 around which the photovoltaic solder strip is wound.

For example, the two rotating shafts 830 are provided at left and right intervals, the number of rotations of the left rotating shaft 830 is set, and when the left rotating shaft rotates, the take-up reel 840 attached to the left rotating shaft receives the photovoltaic strip, and at this time, the right rotating shaft 830 is stationary. When the left rotating shaft 830 rotates to a set number of turns, that is, the photovoltaic solder strip 200 wound on the take-up reel 840 reaches the preset standard, the control main body 850 controls the driving mechanism 810 to drive the rotating main body 820 to rotate, the two rotating shafts 830 arranged on the left and right exchange positions, the rotating shaft 830 arranged on the right side stops rotating, the rotating shaft 830 arranged on the left side starts rotating, and the photovoltaic solder strip 200 wound on the take-up reel 840 is changed.

Alternatively, the control body 850 may control the rotation of the rotating body 820, the rotating shaft 830 and the take-up reel 840 according to the weight of the photovoltaic solder ribbon wound around the take-up reel 840. It should be noted that the angle, the timing and the basis of the rotation of the rotating body 820 and the rotating shaft 830 controlled by the control body 850 are only examples, and the specific number of the rotating shafts 830 is also only an example, and should not be construed as limiting the content and scope of the solder strip manufacturing apparatus 100 and the manufacturing method thereof according to the present invention.

The automatic wire winding device 80 further includes a wire winding guide assembly 860, wherein the wire winding guide assembly 860 is disposed at one side of the rotating body 820, and the wire winding guide assembly 860 draws the photovoltaic solder ribbon 200 passing through the tin layer forming device 60 to be wound around the wire winding drum 840.

It should be noted that the solder strip manufacturing apparatus 100 may process one copper wire or a plurality of copper wires at the same time. Moreover, at least one of the wire releasing device 10, at least one of the forming device 20, at least one of the pressing device 30, at least one of the annealing device 40, at least one of the flux covering device 50, at least one of the tin layer forming device 60, at least one of the automatic tin adding device 70 and at least one of the automatic wire winding device 80 may be arranged according to production requirements, and the arrangement illustrated in fig. 1 is only an illustration and should not be construed as limiting the content and scope of the solder ribbon manufacturing apparatus 100 and the solder ribbon manufacturing method of the present invention.

It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily conceivable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A solder ribbon manufacturing apparatus, comprising:

2. The solder strip manufacturing apparatus according to claim 1, further comprising a molding device, wherein the molding device includes at least one molding unit, wherein the molding unit includes a molding body and a molding die having a molding space, the molding die being detachably provided to the molding body.

3. The solder strip manufacturing apparatus according to claim 2, further comprising a pressing device, wherein the pressing device includes a power body and a pressing body drivably connected to the power body, wherein the pressing body has a pressing space.

4. The solder strip manufacturing apparatus according to claim 3, further comprising an annealing device, wherein the annealing device comprises a positive electrode wheel, a negative electrode wheel, a protection body, a cooling body and a drying body, wherein the protection body has a protection channel, wherein the cooling body has a liquid containing tank, wherein the drying body has a drying channel, the positive electrode wheel and the negative electrode wheel allow current to pass through, the protection body is disposed between the positive electrode wheel and the negative electrode wheel, the negative electrode wheel is disposed in the liquid containing tank of the cooling body, and the drying body is disposed above the cooling body.

5. The solder ribbon manufacturing apparatus according to claim 4, further comprising a tin layer forming device, wherein the tin layer forming device includes a tin accommodating bath and at least one blowing main body, wherein the blowing main body has an air outlet, and the blowing main body is held above the tin accommodating bath.

6. The solder strip manufacturing apparatus according to claim 5, further comprising an automatic tinning device, wherein the automatic tinning device comprises a containing body, an impact body and a guiding body, wherein the containing body has a containing cavity, a solder bump outlet and a pushing opening which are communicated with the containing cavity, wherein the solder bump outlet is opposite to the pushing button, wherein the solder bump outlet and the pushing opening are located at the bottom of the containing body, and the impact body is disposed at one side of the containing body in a manner corresponding to the pushing opening of the containing body.

7. The solder strip manufacturing apparatus according to claim 6, further comprising an automatic wire take-up device, wherein the automatic wire take-up device includes a driving mechanism, a rotating body, at least two rotating shafts, and a control body, wherein the control body is communicably connected to the driving mechanism, the rotating body, and the rotating shafts, the rotating body and the rotating shafts being drivably rotatably connected to the driving mechanism, the rotating shafts being provided at intervals to the rotating body.

8. A solder ribbon manufacturing apparatus, comprising:

9. A solder ribbon manufacturing apparatus, comprising: