CN114069177A - Millimeter wave matching load of substrate integrated waveguide transmission line and millimeter wave radar - Google Patents

Millimeter wave matching load of substrate integrated waveguide transmission line and millimeter wave radar Download PDF

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Publication number
CN114069177A
CN114069177A CN202111534453.9A CN202111534453A CN114069177A CN 114069177 A CN114069177 A CN 114069177A CN 202111534453 A CN202111534453 A CN 202111534453A CN 114069177 A CN114069177 A CN 114069177A
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China
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metal ground
wave
transmission line
integrated waveguide
millimeter wave
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CN202111534453.9A
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Chinese (zh)
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易浩
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Autel Intelligent Automobile Corp Ltd
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Autel Intelligent Automobile Corp Ltd
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Priority to CN202111534453.9A priority Critical patent/CN114069177A/en
Publication of CN114069177A publication Critical patent/CN114069177A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/24Terminating devices
    • H01P1/26Dissipative terminations
    • H01P1/264Waveguide terminations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88Radar or analogous systems specially adapted for specific applications
    • G01S13/93Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles

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  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

The invention discloses a millimeter wave matching load of a substrate integrated waveguide transmission line and a millimeter wave radar, and relates to the field of millimeter wave radars. The millimeter wave matching load comprises a lower-layer metal ground, a medium substrate, an upper-layer metal ground, a wave absorbing module and a plurality of metalized through holes; wherein: the dielectric substrate is arranged between the lower layer metal ground and the upper layer metal ground; the metallized through hole is connected with the upper layer metal ground and the lower layer metal ground to form a substrate integrated waveguide transmission line; the wave absorbing module is fixedly arranged on the upper metal ground, is arranged above the substrate integrated waveguide transmission line, is in contact with the substrate integrated waveguide transmission line, absorbs energy transmitted from the substrate integrated waveguide transmission line, and interacts with the substrate integrated waveguide transmission line to perform impedance matching. Therefore, the millimeter wave matching load is miniaturized and integrated, and is easy to integrate with a microstrip antenna or a millimeter wave microstrip circuit.

Description

Millimeter wave matching load of substrate integrated waveguide transmission line and millimeter wave radar
Technical Field
The invention relates to the technical field of millimeter wave radars, in particular to a millimeter wave matching load of a substrate integrated waveguide transmission line and a millimeter wave radar.
Background
The matching load is a termination device which absorbs all incident wave power, and is equivalent to a characteristic impedance line connected with the termination, and the frequency band is wide enough.
The matched load is a device commonly used in design and test of a microstrip antenna or a millimeter wave microstrip circuit. At present, vehicle-mounted millimeter wave radars work at 76-81GHz, and the sizes of antennas and circuits are small, so that millimeter wave matched loads are required to be miniaturized and integrated.
The traditional matched load is waveguide matched load, the matching performance of the traditional matched load is superior, but the waveguide matched load is large in size and weight, difficult to integrate, incapable of realizing miniaturization and integration, limited by the manufacturing process, high in cost and incapable of meeting the requirements of millimeter wave vehicle-mounted radars.
Disclosure of Invention
The embodiment of the invention aims to provide a millimeter wave matching load of a substrate integrated waveguide transmission line and a millimeter wave radar, wherein the millimeter wave matching load is formed by a grounding coplanar waveguide transmission line and a wave absorbing module, so that the millimeter wave matching load can realize miniaturization and integration, is easy to integrate with a microstrip antenna or a millimeter wave microstrip circuit, has low manufacturing cost, and is very suitable for a vehicle-mounted millimeter wave radar with the working frequency of 76-81 GHz.
In order to solve the above technical problems, embodiments of the present invention provide the following technical solutions: a millimeter wave matching load of a substrate integrated waveguide transmission line comprises a lower layer metal ground, a dielectric substrate, an upper layer metal ground, a wave-absorbing module and a plurality of metalized through holes; wherein:
the dielectric substrate is arranged between the lower layer metal ground and the upper layer metal ground;
the metallized through hole is connected with the upper layer metal ground and the lower layer metal ground to form a substrate integrated waveguide transmission line;
the wave absorbing module is fixedly arranged on the upper metal ground, is arranged above the substrate integrated waveguide transmission line, is in contact with the substrate integrated waveguide transmission line, absorbs energy transmitted from the substrate integrated waveguide transmission line, and interacts with the substrate integrated waveguide transmission line to perform impedance matching.
Optionally, the dielectric substrate is disposed between the lower metal ground and the upper metal ground, and includes: the dielectric substrate completely covers the lower metal ground, and the upper metal ground is arranged above the dielectric substrate.
Optionally, the millimeter wave matched load further comprises an input port; one end of the substrate integrated waveguide transmission line is connected with the input port, and the other end of the substrate integrated waveguide transmission line is short-circuited by the metalized through hole.
Optionally, a first coupling gap and a second coupling gap are arranged on the upper metal ground, and the first coupling gap and the second coupling gap are symmetrical with respect to a central line of the substrate integrated waveguide transmission line.
Optionally, the first coupling gap and the second coupling gap are all located below the wave-absorbing module.
Optionally, a number of the metalized vias are distributed around the outside of the first coupling slot and the second coupling slot.
Optionally, the first coupling slit and the second coupling slit couple power fed from the input port to the wave-absorbing module and are absorbed by the wave-absorbing module.
Optionally, the wave absorbing module is fixedly installed on the upper metal ground, and specifically includes: the wave-absorbing module is fixed on the upper metal ground through glue.
Optionally, the wave absorbing module is fixedly installed on the upper metal ground, and specifically includes: the wave absorbing module is fixed on the upper metal ground through a mounting fixture.
In order to solve the above technical problems, embodiments of the present invention further provide the following technical solutions: a millimeter wave radar comprises a microstrip antenna or a millimeter wave microstrip circuit, wherein the microstrip antenna or the millimeter wave microstrip circuit comprises a millimeter wave matching load in any embodiment of the invention.
Compared with the prior art, the millimeter wave matching load and the millimeter wave radar of the substrate integrated waveguide transmission line provided by the embodiment of the invention provide the millimeter wave matching load of the substrate integrated waveguide, and the millimeter wave matching load comprises a lower layer metal ground, a medium substrate, an upper layer metal ground, a wave absorbing module and a metalized through hole; wherein: the dielectric substrate is arranged between the lower layer metal ground and the upper layer metal ground; the metallized through hole is connected with the upper layer metal ground and the lower layer metal ground to form a substrate integrated waveguide transmission line; the wave absorbing module is fixedly arranged on the upper metal ground, is arranged above the substrate integrated waveguide transmission line, is in contact with the substrate integrated waveguide transmission line, absorbs energy transmitted from the substrate integrated waveguide transmission line, and interacts with the substrate integrated waveguide transmission line to perform impedance matching. Therefore, the millimeter wave matching load is formed by the substrate integrated waveguide transmission line and the wave absorbing module, the structure is simple, the size is small, the miniaturization and the integration can be realized, the millimeter wave matching load is easy to integrate with a microstrip antenna or a millimeter wave microstrip circuit, the manufacturing cost is low, the millimeter wave matching load works at 76-81GHz with low reflectivity which is less than-25 dB, and the millimeter wave matching load is very suitable for a vehicle-mounted millimeter wave radar with the working frequency of 76-81 GHz.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
FIG. 1 is a schematic structural diagram of a millimeter wave matched load of a substrate integrated waveguide transmission line according to the present invention;
FIG. 2 is a schematic diagram of a specific structure of a millimeter wave matching load of a substrate integrated waveguide transmission line according to the present invention;
fig. 3 is a schematic perspective view of a millimeter wave matching load of a substrate integrated waveguide transmission line according to the present invention;
FIG. 4 is a schematic diagram of the effect of the millimeter wave matching load of the substrate integrated waveguide transmission line on impedance matching at 76-81 GHz;
FIG. 5 is a schematic diagram of the effect of different lengths lA of the millimeter wave matching loaded wave-absorbing module of the substrate integrated waveguide transmission line on impedance matching according to the present invention;
FIG. 6 is a schematic diagram of the effect of different widths wA of the millimeter wave matching load wave-absorbing module of the substrate integrated waveguide transmission line on impedance matching according to the present invention;
FIG. 7 is a schematic diagram of the effect of different thicknesses tA of the millimeter wave matching load wave-absorbing module of the substrate integrated waveguide transmission line on impedance matching according to the present invention;
fig. 8 is a schematic structural diagram of a millimeter wave radar provided by the present invention.
Reference numerals:
lower metal ground 11 of millimeter wave matched load 1
A metal ground 13 on the upper layer of the dielectric substrate 12
Metallized via hole 15 of wave-absorbing module 14
Substrate integrated waveguide transmission line 16 input port 18
First coupling slot 131 and second coupling slot 132
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. As used in this specification, the terms "upper," "lower," "inner," "outer," "bottom," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The vehicle-mounted millimeter wave radar comprises a microstrip antenna or a millimeter wave microstrip circuit, and the millimeter wave matching load is a common device used in the design and test of the microstrip antenna or the millimeter wave microstrip circuit. At present, the vehicle-mounted millimeter wave radar works at 76-81GHz, and the sizes of an antenna and a circuit are small, so that the millimeter wave matching load is required to realize miniaturization and integration.
Because the traditional matched load is generally a waveguide matched load, the matching performance of the traditional matched load is superior, but the waveguide matched load is large in size and weight, difficult to integrate, incapable of realizing miniaturization and integration, limited by the manufacturing process, very high in cost and incapable of meeting the requirements of millimeter wave vehicle-mounted radars.
In view of the above, the millimeter wave matching load of the substrate integrated waveguide transmission line and the vehicle-mounted millimeter wave radar are provided, the millimeter wave matching load is formed by the substrate integrated waveguide transmission line and the wave absorption module, so that the millimeter wave matching load is simple in structure, small in size, capable of realizing miniaturization and integration, easy to integrate with a microstrip antenna or a millimeter wave microstrip circuit, low in manufacturing cost, low in reflectivity when the millimeter wave matching load works at 76-81GHz, and less than-25 dB in reflectivity, and very suitable for the vehicle-mounted millimeter wave radar with the working frequency of 76-81 GHz.
For the purpose of promoting an understanding of the principles of the invention, reference will now be made in detail to the embodiments illustrated in the drawings.
In one embodiment, as shown in fig. 1 and 2, the present invention provides a millimeter wave matched load of a substrate integrated waveguide transmission line, the millimeter wave matched load 1 comprising: the wave absorbing device comprises a lower metal ground 11, a medium substrate 12, an upper metal ground 13, a wave absorbing module 14 and a plurality of metalized through holes 15; wherein:
the dielectric substrate 12 is arranged between the lower metal ground 11 and the upper metal ground 13;
the metallized through hole 15 is connected with the upper layer metal ground 13 and the lower layer metal ground 11 to form a substrate integrated waveguide transmission line 16;
the wave absorbing module 14 is fixedly installed on the upper metal ground 13, is installed above the substrate integrated waveguide transmission line 16, is in contact with the substrate integrated waveguide transmission line 16, absorbs energy transmitted from the substrate integrated waveguide transmission line 16, and interacts with the substrate integrated waveguide transmission line 16 to perform impedance matching.
In this embodiment, a millimeter wave matching load of a substrate integrated waveguide transmission line is provided, which includes a lower metal ground, a dielectric substrate, an upper metal ground, a wave-absorbing module and a metalized via hole; wherein: the dielectric substrate is arranged between the lower layer metal ground and the upper layer metal ground; the metallized through hole is connected with the upper layer metal ground and the lower layer metal ground to form a substrate integrated waveguide transmission line; the wave absorbing module is fixedly arranged on the upper metal ground, is arranged above the substrate integrated waveguide transmission line, is in contact with the substrate integrated waveguide transmission line, absorbs energy transmitted from the substrate integrated waveguide transmission line, and interacts with the substrate integrated waveguide transmission line to perform impedance matching. Therefore, the millimeter wave matching load is formed by the substrate integrated waveguide transmission line and the wave absorbing module, the structure is simple, the size is small, the miniaturization and the integration can be realized, the millimeter wave matching load is easy to integrate with a microstrip antenna or a millimeter wave microstrip circuit, the manufacturing cost is low, the millimeter wave matching load works at 76-81GHz with low reflectivity which is less than-25 dB, and the millimeter wave matching load is very suitable for a vehicle-mounted millimeter wave radar with the working frequency of 76-81 GHz.
In one embodiment, the dielectric substrate 12 is disposed between the lower metal ground 11 and the upper metal ground 13, specifically, the dielectric substrate 12 completely covers the lower metal ground 11, and the upper metal ground 13 is disposed above the dielectric substrate 12.
The metalized via 15 penetrates through the upper metal ground 13, the dielectric substrate 12 and the lower metal ground 11, so that the upper metal ground 13 and the lower metal ground 11 are electrically connected through the metalized via 15.
Preferably, the length and width of the dielectric substrate 12 are equal to those of the lower metal ground 11 and the upper metal ground 13.
In one embodiment, as shown in fig. 2, the millimeter wave matched load 1 further comprises an input port 18; one end of the substrate integrated waveguide transmission line 16 is connected to the input port 18, and the other end is short-circuited by the metalized via 15.
In one embodiment, as shown in fig. 2 and 3, a first coupling slot 131 and a second coupling slot 132 are disposed on the upper metal ground 13 on which the substrate-integrated waveguide transmission line 16 is located, the first coupling slot 131 and the second coupling slot 132 have the same shape, and the first coupling slot 131 and the second coupling slot 132 are symmetrical with respect to a center line of the substrate-integrated waveguide transmission line 16.
The lengths and widths of the coupling slots of the first coupling slot 131 and the second coupling slot 132 are lS and wS, respectively, the distance between the first coupling slot 131 and the second coupling slot 132 is dS, and the distance between the centers of the first coupling slot 131 and the second coupling slot 132 and the metalized via 15 is lG.
A number of said metallized vias 15 are distributed around the outside of said first coupling slot 131 and said second coupling slot 132.
The first coupling slits 131 and the second coupling slits 132 are all located below the wave-absorbing module 14.
The center of the wave-absorbing module 14 is aligned with the centers of the first coupling gap 131 and the second coupling gap 132, and the length, the width and the height of the wave-absorbing module 14 are lA, wA and tA, respectively.
The first coupling slits 131 and the second coupling slits 132 couple the power fed from the input port 18 to the wave-absorbing module 14 and are absorbed by the wave-absorbing module 14. The length lS, the width wS, the distance dS of the first coupling slot 131 and the second coupling slot 132, and the distance lG from the first coupling slot 131 and the second coupling slot 132 to the metalized via 15 may affect the impedance matching effect.
In one embodiment, the wave absorbing module 14 performs impedance matching based on gradual absorption of energy transmitted from the substrate integrated waveguide transmission line 16.
Specifically, after the wave-absorbing module 14 gradually absorbs the energy coupled to the wave-absorbing module 14 through the first coupling gap 131 and the second coupling gap 132, the characteristic impedance of the substrate integrated waveguide transmission line 16 is affected, so as to achieve the purpose of impedance matching.
The size and shape of the wave-absorbing module 14 can be adjusted accordingly according to actual conditions, and the wave-absorbing effect is only affected within a certain range, but the characteristic impedance of the substrate integrated waveguide transmission line 16 can still be affected, so as to achieve the purpose of impedance matching.
Preferably, the wave absorbing module 14 is an injection-molded wave absorbing plate. The wave-absorbing module 14 can also be replaced by other wave-absorbing materials.
Specifically, taking the wave-absorbing module 14 as an injection-molded wave-absorbing plate as an example, the technical scheme of the millimeter wave matching load of the substrate integrated waveguide transmission line provided by the invention is further described in detail.
In this embodiment, the dielectric substrate 12 is Rogers Ro3003G2, the thickness of the dielectric substrate 12 is 0.127mm, and the copper-clad thickness is 0.5 oz; the width of the substrate integrated waveguide transmission line 16 is 2mm, the diameter of the metalized via hole 15 is 0.2mm, and the via hole spacing is 0.3 mm; a length lS of the coupling slot between the first coupling slot 131 and the second coupling slot 132 is 1.27mm, a width wS is 0.55mm, and a distance dS is 0.78 mm; the distance lG from the first coupling slot 131 and the second coupling slot 132 to the metalized via 15 is 2.12 mm; the material of the injection-molded wave-absorbing plate 14 is DX04490R from SABIC, with dimensions wA 3mm, lA mm 3mm and tA 2 mm.
Fig. 4 is a schematic diagram illustrating the effect of the millimeter wave matching load of the substrate integrated waveguide transmission line operating at 76-81GHz for impedance matching according to the above embodiment of the present invention.
As can be seen from FIG. 4, the millimeter wave matching load has low reflectivity when working at 76-81GHz, the reflectivity is less than-25 dB, the millimeter wave matching load is easy to integrate with a microstrip antenna or a millimeter wave microstrip circuit, and the millimeter wave matching load is very suitable for a vehicle-mounted millimeter wave radar with the working frequency of 76-81 GHz.
As shown in fig. 5 to 7, the effect of different lengths lA, different widths wA, and different thicknesses tA of the wave-absorbing module on impedance matching are respectively shown in schematic diagrams.
As can be seen from fig. 5 to 7, the wave-absorbing module affects the wave-absorbing effect in a certain range at different lengths lA, different widths wA and different thicknesses tA, has a certain effect on impedance matching, can affect the characteristic impedance of the substrate integrated waveguide transmission line 16, but still can achieve the purpose of impedance matching, and has low reflectivity at 76-81GHz, and the reflectivity is less than-25 dB.
As shown in fig. 5, when the width wA and the thickness tA of the wave-absorbing module are not changed, the optimal impedance matching effect can be obtained when the length lA of the wave-absorbing module is 3 mm.
As shown in fig. 6, when the length lA and the thickness tA of the wave-absorbing module are not changed, the optimal impedance matching effect can be obtained when the width wA of the wave-absorbing module is 3 mm.
As shown in fig. 7, when the length lA and the width wA of the wave-absorbing module are not changed, an optimal impedance matching effect can be obtained when the thickness tA of the wave-absorbing module is 2 mm.
In one embodiment, as shown in fig. 2 and 3, the wave-absorbing module 14 is fixedly mounted on the upper metal ground 13, specifically: the wave-absorbing module 14 can be fixed on the upper metal ground 13 by gluing or mounting a clamp.
Based on the same concept, in one embodiment, as shown in fig. 8, the present invention provides a millimeter wave radar, which includes a microstrip antenna or a millimeter wave microstrip circuit, where the microstrip antenna or the millimeter wave microstrip circuit includes the millimeter wave matching load 1 described in any of the above embodiments.
In this embodiment, the millimeter wave matching load 1 is the same as the millimeter wave matching load 1 described in any embodiment, and the specific structure and function may refer to the millimeter wave matching load 1 described in any embodiment, which is not described herein again.
In this embodiment, the millimeter wave radar includes a microstrip antenna or a millimeter wave microstrip circuit, the microstrip antenna or the millimeter wave microstrip circuit includes a millimeter wave matching load, and the millimeter wave matching load includes a lower metal ground, a dielectric substrate, an upper metal ground, a wave-absorbing module, and a metalized via hole; wherein: the dielectric substrate is arranged between the lower layer metal ground and the upper layer metal ground; the metallized through hole is connected with the upper layer metal ground and the lower layer metal ground to form a substrate integrated waveguide transmission line; the wave absorbing module is fixedly arranged on the upper metal ground, is arranged above the substrate integrated waveguide transmission line, is in contact with the substrate integrated waveguide transmission line, absorbs energy transmitted from the substrate integrated waveguide transmission line, and interacts with the substrate integrated waveguide transmission line to perform impedance matching. Therefore, the millimeter wave matching load is formed by the substrate integrated waveguide transmission line and the wave absorbing module, the structure is simple, the size is small, the miniaturization and the integration can be realized, the millimeter wave matching load is easy to integrate with a microstrip antenna or a millimeter wave microstrip circuit, the manufacturing cost is low, the millimeter wave matching load works at 76-81GHz with low reflectivity which is less than-25 dB, and the millimeter wave matching load is very suitable for a vehicle-mounted millimeter wave radar with the working frequency of 76-81 GHz.
It should be noted that the millimeter wave radar embodiment and the millimeter wave matching load embodiment belong to the same concept, and the specific implementation process is described in the millimeter wave matching load embodiment, and the technical features in the millimeter wave matching load embodiment are all applicable in the millimeter wave radar embodiment, which is not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. The millimeter wave matching load of the substrate integrated waveguide transmission line is characterized by comprising a lower layer metal ground, a dielectric substrate, an upper layer metal ground, a wave-absorbing module and a plurality of metalized through holes; wherein:
the dielectric substrate is arranged between the lower layer metal ground and the upper layer metal ground;
the metallized through hole is connected with the upper layer metal ground and the lower layer metal ground to form a substrate integrated waveguide transmission line;
the wave absorbing module is fixedly arranged on the upper metal ground, is arranged above the substrate integrated waveguide transmission line, is in contact with the substrate integrated waveguide transmission line, absorbs energy transmitted from the substrate integrated waveguide transmission line, and interacts with the substrate integrated waveguide transmission line to perform impedance matching.
2. The millimeter-wave matched load of claim 1, wherein the dielectric substrate is disposed between the lower metal ground and the upper metal ground, comprising: the dielectric substrate completely covers the lower metal ground, and the upper metal ground is arranged above the dielectric substrate.
3. The millimeter-wave matched load of claim 1, further comprising an input port; one end of the substrate integrated waveguide transmission line is connected with the input port, and the other end of the substrate integrated waveguide transmission line is short-circuited by the metalized through hole.
4. The millimeter-wave matched load of claim 3, wherein the upper metal ground is provided with a first coupling gap and a second coupling gap, and the first coupling gap and the second coupling gap are symmetrical with respect to a center line of the substrate-integrated waveguide transmission line.
5. The millimeter-wave matched load of claim 4, wherein the first coupling slot and the second coupling slot are all located below the wave-absorbing module.
6. The millimeter-wave matched load of claim 4, wherein a number of said metallized vias are distributed around the outside of said first coupling slot and said second coupling slot.
7. The millimeter wave matched load of claim 4, wherein the first coupling slot and the second coupling slot couple power fed from the input port to and are absorbed by the wave absorbing module.
8. The millimeter wave matched load according to claim 1, wherein the wave absorbing module is fixedly mounted on the upper metal ground, and specifically comprises: the wave-absorbing module is fixed on the upper metal ground through glue.
9. The millimeter wave matched load according to claim 1, wherein the wave absorbing module is fixedly mounted on the upper metal ground, and specifically comprises: the wave absorbing module is fixed on the upper metal ground through a mounting fixture.
10. A millimeter-wave radar comprising a microstrip antenna or a millimeter-wave microstrip circuit comprising a millimeter-wave matched load according to any one of claims 1 to 9.
CN202111534453.9A 2021-12-15 2021-12-15 Millimeter wave matching load of substrate integrated waveguide transmission line and millimeter wave radar Pending CN114069177A (en)

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